MIC5327
300mA Low Quiescent Current LDO
MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
September 2008 M9999-093008-A
General Description
The MIC5327 is a low quiescent current, low dropout
regulator designed for optimal performance in a small
space. The MIC5327 is capable of sourcing 300mA of
output current while only consuming 24µA of operating
current. This high performance LDO offers Low dropout,
fast transient response, good PSRR, and low output
voltage noise.
The MIC5327 is an ideal solution for battery operated
applications due to ultra low quiescent current and
extremely low dropout voltage of 180mV at 300mA.
Equipped with a TTL logic compatible enable pin, the
MIC5327 can be put into a zero-off-mode current state,
drawing virtually no current when disabled.
Board space and component cost is minimized because
the MIC5327 operates with very small 1μF ceramic
capacitors, provides fixed output voltages, and is available
in the tiny 1.2mm x 1.6mm Thin MLF® package.
MIC5327 also features thermal shutdown and current limit
protection.
Data sheets and support documentation can be found on
Micrel’s web site at www.micrel.com.
Features
300mA output current
Input voltage range: 2.3V to 5.5V
Low 24µA operating current
Low dropout voltage of 180mV @ 300mA
Fixed output voltages
Stable with 1μF ceramic capacitors
Thermal shutdown and current limit protection
Tiny 4-pin 1.2mm x 1.6mm Thin MLF® package
Applications
Mobile Phones
GPS and Navigation Devices
Portable Media Players
Digital still and video cameras
PDAs
Portable Electronics
___________________________________________________________________________________________________________
Typical Application MIC5327-xxYMT
VIN
VEN
VOUT
GND
1µF1µF
VBAT
VOUT
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Ordering Information
Part Number Marking(1) Voltage(2) Temperature Range Package(3)
MIC5327-2.8YMT 2O8 2.8V –40° to +125°C 4-Pin 1.2mm x 1.6mm Thin MLF®
MIC5327-1.8YMT 1Q8 1.8V –40° to +125°C 4-Pin 1.2mm x 1.6mm Thin MLF®
Note:
1. Pin 1 identifier = “”.
2. For other voltage options contact Micrel Marketing.
3. MLF is a GREEN RoHS compliant package. Lead finish is NiPdAu, Mold compound is Halogen Free.
Pin Configur ation
1VIN
GND
4 VOUT
EN32
4-Pin 1.2mm x 1.6mm Thin MLF® (MT)
Pin Description
Pin Number Pin Name Pin Function
1 VIN Supply Input.
2 GND Ground.
3 EN
Enable Input: Active High Input. Logic High = On; Logic Low = Off. Do not leave
floating.
4 VOUT Output Voltage.
HSPAD EPAD Exposed heatsink pad connected to ground internally.
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Absolute Maximum Ratings(1)
Supply Voltage (VIN)........................................ –0.3V to +6V
Enable Voltage (VEN)......................................... –0.3V to VIN
Power Dissipation (PD)........................... Internally Limited(3)
Lead Temperature (soldering, 5 sec.)........................ 260°C
Junction Temperature (TJ ).........................-40°C to +125°C
Storage Temperature (TS)..........................-65°C to +150°C
ESD Rating(4).................................................................. 2kV
Operating Ratings(2)
Supply Voltage (VIN)....................................... +2.3V to 5.5V
Enable Voltage (VEN).............................................. 0V to VIN
Junction Temperature (TJ) ........................ –40°C to +125°C
Junction Thermal Resistance
1.2mm x 1.6mm Thin MLF-4 (θJA) ............................173°C/W
Electrical Characteristics(5)
VIN = VEN = VOUT + 1V; COUT = CIN = 1µF; IOUT = 100µA; TJ = 25°C, bold values indicate –40°C to +125°C unless noted.
Parameter Condition Min Typ Max Units
Variation from nominal VOUT –1.5 +1.5 % Output Voltage Accuracy
Variation from nominal VOUT –2.0 +2.0 %
VIN = VOUT +1V to 5.5V, IOUT = 100µA 0.01 0.3 %/V Line Regulation
VIN = VOUT +1V to 5.5V, IOUT = 100µA 0.5 %/V
Load Regulation(6) I
OUT = 100µA to 300mA 0.05 1 %
Dropout Voltage(7) I
OUT = 50mA
IOUT = 100mA
IOUT = 150mA
IOUT = 300mA
30
55
85
180
150
300
mV
mV
mV
mV
Ground Pin Current(8) I
OUT = 100µA to 300mA 24 35 µA
Ground Pin Current in Shutdown VEN = 0V 0.01 1 µA
Ripple Rejection f = 1kHz; COUT = 1µF; IOUT = 300mA
f = 20kHz; COUT = 1µF; IOUT = 300mA
60
50
dB
dB
Current Limit VOUT = 0V 400 600 950 mA
Output Voltage Noise COUT = 1µF, 10Hz to 100kHz 90 µVRMS
Enable Voltage
Logic Low 0.2 V Enable Voltage
Logic High 1.2 V
VIL 0.2V 0.01 1 µA Enable Current
VIH 1.2V 0.01 1 µA
Turn-on Time COUT = 1µF; IOUT = 300mA 150 500 µs
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power
dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
4. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.
5. Specification for packaged product only.
6. Regulation is measured at constant junction temperature using low duty cycle pulse testing.
7. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal VOUT.
8. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin
current.
Micrel, Inc. MIC5327
September 2008 4 M9999-093008-A
Typical Characteristics
0
Power Supply
Rejection Ratio
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
VEN = 1.2V
VOUT = 2.8V
COUT = 1µF
150mA
100µA
50mA
100mA
300mA
16
20
24
28
32
0 50 100 150 200 250 300
OUTPUT CURRENT (mA)
Ground Current
vs. Output Curren t
VIN = VEN = 3.8V
VOUT = 2.8V
CIN = COUT = 1µF
16
20
24
28
32
3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Ground C urrent
vs. Input Voltage
300mA 150mA
100µA
VIN = VEN = 3.8V
VOUT = 2.8V
CIN = COUT = 1µF
16
20
24
28
32
Ground Current
vs. Temperature
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
VIN = VEN = 3.8V
VOUT = 2.8V
CIN = COUT = 1µF
300mA
100µA
150mA
2.0
2.5
3.0
3.5
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Output Voltage
vs. Input Voltag e
VEN = VIN
VOUT = 2.8V
CIN = COUT = 1µF
100µA
50mA
300mA
150mA
2.70
2.75
2.80
2.85
2.90
Output Voltage
vs. Temperature
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
VEN = VIN = 3.8V
CIN = COUT = 1µF
1.790
1.795
1.800
1.805
1.810
0 50 100 150 200 250 300
OUTPUT CURRENT (mA)
Output Voltage
vs. Output Curren t
VEN = VIN = 2.8V
CIN = COUT = 1µF
0
50
100
150
200
250
Dropout Voltage
vs. Temperature
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
VOUT = 2.8V
CIN = COUT = 1µF
ILOAD = 300mA
0
20
40
60
80
100
120
140
160
180
200
0 50 100 150 200 250 300
OUTPUT CURRENT (mA)
Dropout Voltage
vs. Output Current
VEN = VIN
CIN = COUT = 1µF
400
450
500
550
600
650
700
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Current Limit
vs. Input Voltag e
VOUT = 2.8V
VEN = 1.2V
CIN = COUT = 1µF
0.01
0.1
1
10
100
Output Noise
Spectral D ensity
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
VIN = 4.5V
VOUT = 2.8V
COUT = 1µF
ILOAD
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Functional Characteristics
Micrel, Inc. MIC5327
September 2008 6 M9999-093008-A
Functional Diagram
VIN
EN
GND
VOUT
LDO
REFERENCE
Micrel, Inc. MIC5327
September 2008 7 M9999-093008-A
Applications Information
The MIC5327 is a low quiescent current, low dropout
regulator designed for optimal performance in a small
space. The MIC5327 regulator is fully protected from
damage due to fault conditions, offering linear current
limiting and thermal shutdown.
Input Supply Voltage
VIN provides the supply to power the LDO. The minimum
input voltage is 2.3V allowing conversion from typical
lithium ion batteries and low voltage supplies.
Input Capacitor
The MIC5327 is a high performance, high bandwidth
device; therefore it requires a well bypassed input supply
for optimal performance. A 1µF capacitor is required
from the input to ground to provide stability. Low ESR
ceramic capacitors provide optimal performance with
minimum space required. Additional high frequency
capacitors, such as small value NPO dielectric type
capacitors, help filter out high frequency noise and are
good practice in any RF circuit.
Output Capacitor
The MIC5327 requires an output capacitor of 1µF or
greater to maintain stability. The design is optimized for
use with low ESR ceramic chip capacitors. High ESR
capacitors may cause high frequency oscillation. The
output capacitor can be increased, but performance has
been optimized for a 1µF ceramic output capacitor.
X7R/X5R dielectric type ceramic capacitors are
recommended because of their temperature
performance. X7R type capacitors change capacitance
by 15% over their operating temperature range. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60% respectively over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric the value must be much higher than
an X7R ceramic capacitor to ensure the same minimum
capacitance over the equivalent operating temperature
range.
Minimum Load Current
The MIC5327 does not require a minimum load to
maintain output voltage regulation.
Enable/Shutdown
The MIC5327 comes with an active high enable pin that
enables the regulator. Forcing the enable pin low
disables the regulator and sends it into a “zero” off mode
current state. In this state, current consumed by the
regulator goes nearly to zero. The active high enable pin
uses CMOS technology and cannot be left floating; a
floating enable pin may cause an unknown output state.
Thermal Considerations
The MIC5327 is designed to provide 300mA continuous
output current from a very small footprint package.
Maximum ambient operating temperature can be
calculated based on the output current and the voltage
drop across the part. For example: given that the input
voltage is 3.6V, the output voltage is 2.8V and the output
current is 300mA. The power dissipation of the regulator
circuit can be determined using the equation:
PD = (VIN – VOUT1) I OUT + VIN IGND
Because this device is CMOS and the ground current is
typically <100µA over the load range, the power
dissipation contributed by the ground current is < 1%
and can be ignored for this calculation.
P
D = (3.6V – 2.8V) × 300mA
P
D = 0.24W
To determine the maximum ambient operating
temperature use the junction to ambient thermal
resistance of the device and the following basic
equation:
=
JA
AJ(max)
D(max)
TT
P
θ
The maximum junction temperature of the die, TJ(max) =
125°C.The package thermal resistance, θJA = 173°C/W.
Substituting PD for PD(max) and solving for the ambient
operating temperature will give the maximum operating
conditions for the regulator circuit.
The maximum power dissipation must not be exceeded
for proper operation.
For example, when operating the MIC5327 at an input
voltage of 3.6V and 300mA load with a minimum
footprint layout, the maximum ambient operating
temperature TA can be determined as follows:
0.24W = (125°C – TA)/(173°C/W)
T
A = 83°C
Therefore a 2.8V 300mA application can accept an
ambient operating temperature of 83.0°C in a 1.2mm x
1.6mm Thin MLF® package. For a full discussion of heat
sinking and thermal effects on voltage regulators, refer
to the “Regulator Thermals” section of Micrel’s Designing
with Low Dropout Voltage Regulators handbook. This
information can be found on Micrel's website at:
http://www.micrel.com/_PDF/other/LDOBk_ds.pdf
Micrel, Inc. MIC5327
September 2008 8 M9999-093008-A
J3
VOUT
VIN
1
EN
3
VOUT 4
GND 2
U1
MIC5327-xxYMT
J4
GND
C2
1µF/6.3V
J1
VIN
J5
GND
C1
1µF/6.3V
J2
GND
Bill of Materials
Item Part Number Manufacturer Description Qty.
C1, C2 C1608X5R0J105K TDK(1) Capacitor, 1µF, 6.3V, X5R, Size 0603 2
U1 MIC5327-xxYMT Micrel, Inc.(3) 300mA Low operating current LDO 1
Notes:
1. TDK: www.tdk.com
2. Vishay Dale: Vishay.com
3. Micrel, Inc.: www.micrel.com
Micrel, Inc. MIC5327
September 2008 9 M9999-093008-A
PCB Layout Recommendations
Top Layer
Bottom Layer
Micrel, Inc. MIC5327
September 2008 10 M9999-093008-A
Package Information
4-Pin 1.2mm x 1.6mm Thin MLF® (MT)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2008 Micrel, Incorporated.