THICK FILM (LOW RESISTANCE) SR73 EU RoHS Low Resistance Flat Chip Resistors Construction L Current Detecting Chip Resistors c c W t d 1H 1E1J2A2B2EW2HW3A Coating colorBlack (1H) Indigo (1E, 1J, 2A, 2B, 2E, W2H, W3A) Features -6 0.5100x10 /K RoHS RoHS A 1H EC-Q200 C urrent detecting resistors for power supply, motor circuits, etc. H igh reliability and performance with resistance -6 tolerance 0.5, T.C.R. 100x10 /K S uitable for both reflow and flow solderings. P roducts with lead free termination meet EU-RoHS requirements. EU-RoHS regulation is not intended for Pb-glass contained in electrode, resistor element and glass. A EC-Q200 qualified (Exemption 1H). Type Inch Size Code 1H0201 1E0402 1 J0603 2A 0805 2B 1206 2E 1210 1 W2H2010 1 W3A2512 5.00.2 6.30.2 Product Code T Terminal Power Surface Material Rating 1H:0.1W T :Sn 1E:0.125W G:Au3 6 1J :0.2W L:Sn/Pb 2A:0.25W 2B:0.33W 2E:0.5W W2H:0.75W W3A:1.0W Resistance Value 24m91m 0.10.91 19.1 10 3 3digits 24L91L R10R91 1R09R1 100 TD R10 J 2 Nominal Resistance Resistance Tolerance TCM:2mm pitch D,F :4 digits D :0.5% F :1% G,J :3 digits press paper G :2% TPLTP: Ex. J :5% 2mm pitch 0.1:R100 punch paper 47m:47L TD:4mm pitch punch paper TE:4mm pitch plastic embossed BK:Bulk Resistance Value 0.10.976 19.76 10 4 4digits R100R976 1R009R76 10R0 Reference Standards IEC 60115-8 JIS C 5201-8 EIAJ RC-2134C 80 1E, 1J, 2A, 2B 2E, W2H, W3A 60 1H 40 20 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 125 150 -55 70 Ambient temperature Taping 3 2A0.110 3 Products with gold plated electrodes are also available only 2A type (0.110), so please consult with us. 6 1HW2HW3AT 6 With type 1H, W2H and W3A, only T is available as the terminal surface material. EU-RoHS APPENDIX C The terminal surface material lead free is standard. Contact us when you have control request for environmental hazardous material other than the substance specified by EU-RoHS. For further information on taping, please refer to APPENDIX C on the back pages. Derating Curve 100 Example 2 3.20.2 Type Designation 2B Ni plating Solder plating Ceramic substrate Dimensionsmm Weightg 1000pcs W c d t 0.30.03 0.10.05 0.150.05 0.230.03 0.14 0.5 0.1 0.250.1 0.250.1 0.350.05 0.68 -0.05. 0.8 0.15 0.350.1 0.350.1 0.450.1 2.14 -0.1 . 1.250.1 0.40.2 0.3 0.2 0.50.1 4.54 -0.1. 1.60.2 9.14 0.4 0.2 -0.1. 2.60.2 15.50 0.50.3 0.60.1 2.50.2 24.30 0.650.15 3.10.2 37.10 L 0.60.03. 1.0 0.1 -0.05. 1.60.2 2.00.2 Applications SR73 1 SR73 2H and SR73 3A "d" "d"0.40.2 -0.1 mm 1 SR73 2H and SR73 3A are also still available (different" d"dimensions=0.4 0.2 -0.1 mm) HDD C omputers, HDDs, Cellular-telephones, Power supplies, and Motor circuits, etc. Dimensions Percent rated power Protective coating Resistive film Inner electrode 70 For resistors operated at an ambient temperature of 70 or above, a power rating shall be derated in accordance with the above derating curve. Temperature Rise 180 Temperature rise 160 Measuring point W3A(1.0W) 140 W2H(0.75W) 2E(0.66W) 120 2B(0.50W) 2A(0.33W) 2E(0.50W) 2B(0.33W) 2A(0.25W) 1E(0.16W) 1J(0.20W) 1H(0.1W) 1E(0.125W) 100 80 60 40 20 0 0 10 20 30 40 50 60 70 80 Power Rating 90 100 Regarding the temperature rise, the value of the temperature varies per conditions and board for use since the temperature is measured under our measuring conditions. Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. Contact our sales representatives before you use our products for applications including automotives, medical equipment and aerospace equipment. Malfunction or failure of the products in such applications may cause loss of human life or serious damage. Oct. 2012 www.koanet.co.jp Ratings T.C.R. x10-6/K Type 1H 1E4 1J 2A 2B 2E W2H W3A 0.1W 0.125W 0.166W5 0.2W 0.25W 0.33W5 0.33W 0.5W5 0.5W 0.66W5 0.75W 1.0W Resistance Range F1 G2 E24E96 E24 -- -- 110. -- 0.5110.0 0.5110.0 0.220.47 0.220.47 0.10.2 0.10.2 0.110. 0.110. 0.110. -- -- 0.110. -- -- -- -- 0.110. -- -- 0.110. -- -- -- -- 0.110. -- -- 0.110. -- -- -- -- 0.110. -- -- 0.110. -- -- -- -- 0.110. -- -- 0.110. -- -- -- -- D0.5 E24E96 -- -- -- -- -- -- 0.1510 -- -- -- 0.1510 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- / Taping & Q' ty /Reel pcs TCM TPLTP TD J5 E24 0.180.24 TCM15,000 -- 0.2710 0.5110 TPL20,000 0.220.47. -- TP 10,000 0.10.2 0.110. -- TP 10,000 -- 0.110. -- TP 10,000 0.0510.091 0.0300.047 -- 0.110. -- -- 0.0560.091 0.0300.051 -- 0.04710.00 -- -- 0.0360.043 0.0240.033 -- 0.110. -- -- 0.0560.091 0.0330.051 -- 0.110. -- -- 0.0560.091 0.0390.051 TE -- -- -- -- 5,000 5,000 4,000 5,000 4,000 5,000 4,000 -- 4,000 -- 4,000 Rated Ambient Temperature70 Operating Temperature Range-551251H-551501E1J2A2B2EW2HW3A x Rated voltage Power RatingxResistance value. 4 SR73 1HSR73 1EF1E24 4 The nominal resistance value for SR73 1H, SR73 1EF1is in E24. 5 Please inquire of us if the component is used at 5 marked power. Performance Performance Requirements R 0.005 Test Items Limit Typical Test Methods Resistance Within specified tolerance -- 25 T.C.R. Within specified T.C.R -- 25 /-55 and 25 /125 Overload Short time 2 0.5 x2.55 Rated voltagex2.5 for 5s Resistance to soldering heat 31H 11EW3A 0.751H 0.31EW3A 2605, 10s1s Rapid change of temperature 1 0.3 -4030min./12530min.100 cycles Moisture resistance 31H 21EW3A 1 402, 90%95%RH, 1000h 1.5 ON/0.5 OFF 1.5h ON/0.5h OFF cycle 70 Endurance at 70 31H 21EW3A 1 702, 1000h 1.5 ON/0.5 OFF 1.5h ON/0.5h OFF cycle High temperature exposure 1 0.3 125, 1000h1H 150, 1000h1E, 1J, 2A, 2B, 2E, W2H, W3A Precautions for Use W2HW3A (FR-4)1H2E W2HW3A The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal expansion from a mounting board when heat stress like heat cycle, etc. are repeatedly given to them. Care should be taken to the occurrence of the cracks when the change in ambient temperature or ON / OFF of load is repeated, especially when large types of W2H/W3A which have large thermal expansion and also self heating. By general temperature cycle test using glassepoxy(FR-4) boards under the maximum/minimum temperatures of operating temperature range, the crack does not occur easily in the types of 1H2E, but the crack tends to occur in the types of W2H/W3A. The occurrence of the crack by heat stress may be influenced by the size of a pad, solder volume, heat radiation of mounting board etc., so please pay careful attention to designing when a big change in ambient temperature and conditions for use like ON/OFF of load can be assumed. The resistance value after soldering may change depending on the size of pad pattern or solder amount. Make sure the effect of decline/increase of resistance value before designing. Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. Contact our sales representatives before you use our products for applications including automotives, medical equipment and aerospace equipment. Malfunction or failure of the products in such applications may cause loss of human life or serious damage. Oct. 2012 www.koanet.co.jp Current Detecting Chip Resistors 05000 04000 2000 2500 3000 2000 1000 2000 5000 8000 1000 2000 5000 8000 1000 2000 5000 1000 1000 2000 5000 8000 1000 2000 5000 8000 4 Power Rating