2007-04-20
1
BAW78.../BAW79...
Silicon Switching Diodes
• Switching applications
• High breakdown voltage
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BAW78D BAW79D
!
!
Type Package Configuration Marking
BAW78D
BAW79D SOT89
SOT89 single
common cathode GD
GH
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR400 V
Peak reverse voltage VRM 400
Forward current IF1 A
Peak forward current IFM 1
Peak forward current IFM 1
Surge forward current, t = 1 µs IFS 10
Non-repetitive peak surge forward current IFSM -
Total power dissipation
BAW78D, TS ≤ 125°C
BAW79D, TS ≤ 115°C
Ptot
1
1
W
Junction temperature Tj150 °C
Storage temperature Tstg -65 ... 150
1Pb-containing package may be available upon special request
2007-04-20
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BAW78.../BAW79...
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BAW78D
BAW79D
RthJS
≤ 25
≤ 35
K/W
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage
I(BR) = 100 µA V(BR) 400 - - V
Reverse current
VR = 400 V
VR = 400 V, TA = 150 °C
IR-
--
-
1
50
µA
Forward voltage
IF = 1 A
IF = 2 A
VF
-
-
-
-
1.6
2
V
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz CT- 10 - pF
Reverse recovery time
IF = 200mA, IR = 200mA, measured at IR = 20mA ,
RL = 100Ω
trr - 1 - µs
Test circuit for reverse recovery time
EHN00019
Ι
F
D.U.T.
Oscillograph
Puls generator: tp = 10µs, D = 0.05,
tr = 0.6ns, Ri = 50Ω
Oscillograp: R = 50Ω, tr = 0.35ns
C ≤ 1pF
1For calculation of RthJA please refer to Application Note Thermal Resistance
2007-04-20
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BAW78.../BAW79...
Reverse current IR = ƒ (TA)
VR = 400V
BAW 78A...D EHB00097
max
typ.
5
10
1
10
2
Ι
10
5
3
10
R
4
5
10
5
nA
500 ˚C
T
A
100 150
Forward current IF = ƒ (VF)
TA = 25°C
0
EHB00095BAW 78A...D
Ι
V
F
F
1V2
10
-2
-3
10
-1
10
0
10
1
10
A
Peak forward current IFM = ƒ (tp)
EHB00100
-6
10
BAW 79A...D
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
s
10
10
-2
-1
FM
A
10
10
0
1
10
Ι
2
t
= 0.005D 0.01
0.2
0.1
0.02
0.05
T
t
p
T
=Dt
p
Forward current IF = ƒ (TS)
BAW78D
0 15 30 45 60 75 90 105 120 °C 150
TS
0
100
200
300
400
500
600
700
800
900
1000
mA
1200
IF
2007-04-20
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BAW78.../BAW79...
Forward current IF = ƒ (TS)
BAW79D
0 15 30 45 60 75 90 105 120 °C 150
TS
0
100
200
300
400
500
600
700
800
900
1000
mA
1200
IF
2007-04-20
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BAW78.../BAW79...
Package SOT89
Reel ø180 mm = 1.000 Pieces/Reel
Reel ø330 mm = 4.000 Pieces/Reel
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
0.8
0.8
2.0
1.01.2 2.5
0.7
0.45 +0.2
1) Ejector pin markings possible
1.5
30.2
-0.1
B
0.25
1)
±0.05 45˚
0.15
2.5
±0.1
4
±0.25
MB
B
0.15
±0.1
0.35
±0.2
1MAX.
10˚
1.5±0.1
±0.2
1.6
-0.15
+0.1
2.75
±0.1
4.5
±0.1
1
x3
0.2 MAX.1)
123
80.2
4.3 1.6
4.6
12
Pin 1
2005, June
Date code (YM)
BAW78D
Type code
Pin 1
Manufacturer
2007-04-20
6
BAW78.../BAW79...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.