1 (15) PRODUCT DATASHEET SCA10H Doc. No. 1322 Rev. 1 Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 2 (15) Table of Contents 1 Features and benefits .................................................................................................................3 2 Target Applications ....................................................................................................................3 3 Product code ............................................................................................................................... 3 4 Block diagram .............................................................................................................................3 5 Dimensions, Measurement Direction, Terminal Configurations and Land Pattern ................4 5.1 Dimensions ............................................................................................................................4 5.2 Measurement Direction ..........................................................................................................5 5.3 Terminal Configurations .........................................................................................................5 5.4 Recommended Land Pattern .................................................................................................7 6 Maximum absolute ratings .........................................................................................................7 7 Electrical specification ...............................................................................................................8 8 Serial port configuration ............................................................................................................ 8 9 Functional specification ............................................................................................................. 8 10 Application schematic ................................................................................................................9 11 Communication ........................................................................................................................... 9 12 Firmware update ......................................................................................................................... 9 13 Reliability ................................................................................................................................... 10 14 Storage ......................................................................................................................................10 15 Handling .................................................................................................................................... 11 16 Standard PCB Design (Land Pattern and Dimensions) ..........................................................11 17 Notice for Chip Placer ..............................................................................................................11 18 Soldering Conditions ................................................................................................................ 11 19 Cleaning ....................................................................................................................................12 20 Potting ....................................................................................................................................... 12 21 Operational Environment Conditions ......................................................................................12 22 Packaging.................................................................................................................................. 13 22.1 Tray .....................................................................................................................................13 22.2 Inner Box .............................................................................................................................13 22.3 Outer Box ............................................................................................................................14 23 Note ...........................................................................................................................................14 24 Change control ......................................................................................................................... 15 Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 3 (15) 1 Features and benefits 2 Target Applications 3 Contactless measurement enables continuous monitoring without disturbing the patient. Ultra low noise and narrow noise bandwidth SCA61T 3D MEMS accelerometer and analog signal conditioning. Embedded heart and respiration rate signal processing with 1 Hz output rate. Low power and only tens of bytes per second communication bandwidth requirement. Easy to use UART-interface Solderable PCB-module Hospitals, elderly care, assisted living Heart and respiration rate detection Cardiac output estimation Bed occupancy Stress and relaxation index Sleep quality monitoring Product code Product code SCA10H-D01-Sample SCA10H-D01-112 4 Quantity 1 112 SW version 1 1 Block diagram Block diagram SCA61T Accelerometer Power management Analog i/f MSP430G2744 UART Figure 1 Functional block diagram Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 4 (15) 5 Dimensions, Measurement Direction, Terminal Configurations and Land Pattern 5.1 Dimensions <Top View> <Slide View> Figure 2 Module dimensions Table 1 Dimensions (unit: mm) Mark L a1 b1 b4 b7 b10 c1 e1 e4 e7 e10 Dimension 27.60.25 1.00.1 0.550.15 6.90.15 0.550.15 2.50.15 1.00.1 0.550.1 1.150.1 1.00.1 1.50.1 Murata Electronics Oy www.murata.com Mark W a2 b2 b5 b8 b11 c2 e2 e5 e8 e11 Dimension 25.60.25 1.00.1 1.550.15 6.60.15 2.150.15 8.20.15 1.00.1 0.60.1 0.60.1 1.00.1 1.50.1 SCA10H Mark T a3 b3 b6 b9 b12 c3 e3 e6 e9 e12 Dimension 6.6max 1.00.1 2.90.15 7.550.15 3.20.15 7.450.15 1.00.1 0.550.1 1.150.1 1.50.1 1.50.1 Doc.No. 1322 Rev. 1 5 (15) 5.2 Measurement Direction Figure 3 Measurement direction 5.3 Terminal Configurations Table 2 Pin names and descriptions Pin no 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Name P1.2/TA1 P1.3/TA2 P1.4/SMCLK/TCK P1.5/TA0/TMS P1.6/TA1/TDI/TCLK P1.7/TA2/TDO/TDI GND GND TEST/SBWTCK JTAG_TCK INT_IN MCU_VDD GND GND GND GND RST_n/SBWTDIO VIN GND BSL_RX P3.0/CS_n P3.1/SDA/MOSI P3.2/SCL/MISO P3.3/CLK GND GND GND GND GND GND GND GND Murata Electronics Oy www.murata.com Description P1.2/TA1 P1.3/TA2 JTAG Interface JTAG Interface JTAG Interface JTAG Interface Ground Ground TEST/SBWTCK NC Interrupt from host to module NC Ground Ground Ground Ground Reset Power Supply voltage Ground BSL_RX SPI Chip Select I2C data / SPI MOSI I2C clk / SPI MISO SPI CLK Ground Ground Ground Ground Ground Ground Ground Ground SCA10H MSP430G2744 pin (1 P1.2/TA1 P1.3/TA2 P1.4/SMCLK/TCK P1.5/TA0/TMS P1.6/TA1/TDI/TCLK P1.7/TA2/TDO/TDI TEST/SBWTCK P2.5/ROSC DVCC RST/NMI/SBWTDIO GND P2.2/TA0/A2 P3.0/UCB0STE/UCA0CLK/A5 P3.1/UCB0SIMO/UCB0SDA P3.2/UCB0SOMI/UCB0SCL P3.3/UCB0CLK/UCA0STE Doc.No. 1322 Rev. 1 6 (15) Pin no Name Description MSP430G2744 pin (1 33 GND Ground 34 SPI_SCK_SCA61T NC 35 GND Ground 36 SPI_MISO_SCA61T NC 37 SPI_MOSI_SCA61T NC 38 SPI_MOSI_SCA10X NC 39 P4.0/TB0 P4.0/TB0 P4.0/TB0 40 P4.1/TB1 P4.1/TB1 P4.1/TB1 41 P4.2/TB2 P4.2/TB2 P4.2/TB2 42 GND 43 GND 44 GND 45 GND 46 SPI_CSB_SCA61T NC 47 SPI_CSB_SCA10X NC 48 ST1 NC 49 ST2 NC 50 INT_OUT Interrupt from module to host P4.6/TBOUTH/A15 51 UART_TX UART_TX P3.4/UCA0TXD/UCA0SIMO 52 UART_RX UART_RX P3.5/UCA0RXD/UCA0SOMI 53 XTRA1 NC P3.6/A6 54 XTRA2 NC P3.7/A7 55 P1.0 P1.0/TACLK/ADC10CLK P1.0/TACLK/ADC10CLK 56 BSL_TX BSL_TX P1.1/TA0 57~80 GND Ground 1) Please refer to TI's MSP430G2744 datasheet for digital I/O DC and timing parameters. The used processor's supply voltage is 3.3V +/- 5%. Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 7 (15) 5.4 Recommended Land Pattern <Top View> Unit: mm Figure 4 Recommended Land Pattern Note: The recommended stencil mask thickness for above land pattern is 120um. The stencil mask area is 0.9mm x 0.9mm, and the position is on the center of each land. 6 Maximum absolute ratings Table 3 Maximum ratings Parameter Storage temperature Vin Voltage on any IO-pin, Vin=9 V Voltage on any IO-pin, Vin=0 V ESD (Human Body Model) Mechanical shock(** Min -40 -0.1 -0.1 -0.1 Max 85 20 3.4 0.1 3 1000 Unit C V V V kV g * When the supply voltage Vin is 9V ** 1 m drop on concrete may cause >> 1000 g shock. Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 8 (15) 7 Electrical specification Table 4 Electrical specification parameters Parameter Module's supply voltage Vin Temperature range Current consumption Acceleration raw data noise level (1 Acceleration sensor sensitivity (2 Acceleration sensor's step response gain (3 Min 8 0 Typ Max 10 80 8 1.3 427 Unit V C mA LSB RMS LSB/g 1 (1 RMS-noise within the application bandwidth measured on stone table in raw data mode without any external vibration or noise. (2 Sensitivity measurement by tilting the module in test mode (3 BCG- and inclination channel gain ratio G=BCG-channel step response gain/inclination channel step response gain when sensor's self-test is activated 8 Serial port configuration Table 5 Serial port configuration Parameter Baud rate Data bits Parity Stop bits Flow control 9 230400 baud 8 None 1 None Functional specification Table 6 Functional specification parameters Parameter Min Typ Max Unit Pulse detection range 40 120 BPM Steady state pulse rate for test input (1 48 52 BPM (1 Accelerometer is disconnected from the circuit. Pre-defined test signal is injected to the output node of the accelerometer Vout. With default BCG-parameters steady state output HR is 502 BPM. Test setup is according to Figure 5 below and example measurement and simulation is in Figure 6. Figure 5 Functional test setup Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 9 (15) Figure 6 Injected vs simulated output with test signal using default BCG-parameters 10 Application schematic Figure 7 Application schematic 11 Communication Communication protocol is discussed in Product Specification 1327 SCA10H binary protocol specification. 12 Firmware update Programming IF includes pins #17 RST_n/SBWTDIO #20 BSL_RX #56 BSL_TX GND With FW version 1.5.0.1 and later, modules FW can be updated according to the Product Specification 1326 SCA10H FW upgrade specification. Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 10 (15) 13 Reliability SCA10H-D01 has been verified against the following test conditions: Table 7 Test items and conditions Test item 1. Temperature humidity bake (THB) 2. Low temperature storage life (LTSL) 3. Temperature cycling test (TCY) 4, Mixed gas test 5. Vibration test 6. Drop test 7. ESD (HBM) 8. ESD (MM) 9. ESD (CDM) 14 Test condition - 85RH/85C - 9V biased - 500h - N=12 - -40C - 500 h - N=12 - -40C...+85C - 30 min dwell time - 200 cycles (c) - N=12 - IEC60068-2-60 method 2 - 14 days - N=5 - 10<f<2000Hz, log sweep, A=20 G - 10 cycles/1 ax, 15min/cycle - 2.5hrs/axis, total 7.5hrs - 2 directional drops on each 6 sides (=12 drops) on concrete - Module attached to a jig - Drop height 1 m - N=6 - 3 kV - N=5 - 200 V - N=5 - 600 V - N=5 Storage Please use this product within 6 months after receipt. The product shall be stored without opening the packing under the ambient temperature from 5 to 35 C and humidity from 20 to 70 %RH. (Packing materials, in particular, may be deformed at the temperature over 40 C) The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, NOx, etc.). Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition : 125 +5/-0deg.C, 24hours, 1time Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 11 (15) The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 15 Handling Be careful in handling or transporting products because excessive stress or mechanical shock may break products due to the nature of PWB structure. Handle with care. If products have cracks or damages on their terminals, the characteristics of products may change. Ensure cleanliness when handling. Pad contamination may affect solderability. 16 Standard PCB Design (Land Pattern and Dimensions) All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard land pattern, please contact Murata beforehand. 17 Notice for Chip Placer When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. 18 Soldering Conditions Carefully perform preheating so that the temperature difference (T) between the solder and products surface should be in the following range. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Table 8 Soldering methods Soldering Method Soldering iron method Reflow method Temperature T < 130 C/s Soldering iron method conditions are indicated below. Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 12 (15) Table 9 Soldering iron conditions Soldering iron conditions Soldering iron power Temperature of iron tip Iron contact time 18W 350 C within 3s Diameter of iron-tip: max 3.0 mm. Do not allow the iron-tip to directly touch the ceramic element. Figure 8 Example reflow soldering standard conditions 19 Cleaning Any cleaning of this product is not permitted. 20 Potting Potting the product is not recommended. Potting material may get between the sensor and circuit board resulting in mechanical damages due to thermal expansion. 21 Operational Environment Conditions Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.) In an atmosphere containing combustible and volatile gases Dusty place Direct sunlight place Water splashing place Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 13 (15) Humid place where water condenses Freezing place If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 22 Packaging 22.1 Tray Figure 9 Product tray 28 pcs 22.2 Inner Box Figure 10 Inner box 112 pcs Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 14 (15) 22.3 Outer Box Figure 11 Outer box 448 pcs 23 Outer box contains 4 inner boxes. One or more inner boxes can be dummies depending on the actual delivery quantity. Please don't stack more than 5 shipping boxes. Note Please make sure that our product SCA10H has been evaluated and confirmed against your specifications. Please also note that our product SCA10H has not been qualified for medical or similar use where it might directly or indirectly cause damage to the third party's life, body or property. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. We consider it is not appropriate to include other terms and conditions for transaction warranty in your product specifications, drawings or other technical documents. Therefore, even if your original part of this product specification includes such terms and conditions as warranty clause, product liability clause, or intellectual property infringement liability clause, we are not able to accept such terms and conditions in our product specification unless they are based on the governmental regulation and we have agreed in a separate contract. We would like you to discuss them when negotiating the contract. Murata Electronics Oy www.murata.com SCA10H Doc.No. 1322 Rev. 1 15 (15) 24 Change control Rev. Date 1 09-Sep-15 Murata Electronics Oy www.murata.com Change Description Document moved to new control system and template, section 8 added, document references in section 11 and 12 updated. SCA10H Doc.No. 1322 Rev. 1