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Murata Electronics Oy SCA10H Doc.No. 1322
www.murata.com Rev. 1
PRODUCT DATASHEET
SCA10H
Doc. No. 1322 Rev. 1
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Murata Electronics Oy SCA10H Doc.No. 1322
www.murata.com Rev. 1
Table of Contents
1Features and benefits ................................................................................................................. 3
2Target Applications .................................................................................................................... 3
3Product code ............................................................................................................................... 3
4Block diagram ............................................................................................................................. 3
5Dimensions, Measurement Direction, Terminal Configurations and Land Pattern ................ 4
5.1 Dimensions ............................................................................................................................ 4
5.2 Measurement Direction .......................................................................................................... 5
5.3 Terminal Configurations ......................................................................................................... 5
5.4 Recommended Land Pattern ................................................................................................. 7
6Maximum absolute ratings ......................................................................................................... 7
7Electrical specification ............................................................................................................... 8
8Serial port configuration ............................................................................................................ 8
9Functional specification ............................................................................................................. 8
10 Application schematic ................................................................................................................ 9
11 Communication ........................................................................................................................... 9
12 Firmware update ......................................................................................................................... 9
13 Reliability ................................................................................................................................... 10
14 Storage ...................................................................................................................................... 10
15 Handling .................................................................................................................................... 11
16 Standard PCB Design (Land Pattern and Dimensions) .......................................................... 11
17 Notice for Chip Placer .............................................................................................................. 11
18 Soldering Conditions ................................................................................................................ 11
19 Cleaning .................................................................................................................................... 12
20 Potting ....................................................................................................................................... 12
21 Operational Environment Conditions ...................................................................................... 12
22 Packaging .................................................................................................................................. 13
22.1 Tray ..................................................................................................................................... 13
22.2 Inner Box ............................................................................................................................. 13
22.3 Outer Box ............................................................................................................................ 14
23 Note ........................................................................................................................................... 14
24 Change control ......................................................................................................................... 15
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Murata Electronics Oy SCA10H Doc.No. 1322
www.murata.com Rev. 1
1Features and benefits
‒ Contactless measurement enables continuous monitoring without disturbing the
patient.
‒ Ultra low noise and narrow noise bandwidth SCA61T 3D MEMS accelerometer and
analog signal conditioning.
‒ Embedded heart and respiration rate signal processing with 1 Hz output rate.
‒ Low power and only tens of bytes per second communication bandwidth
requirement.
‒ Easy to use
‒ UART-interface
‒ Solderable PCB-module
2Target Applications
‒ Hospitals, elderly care, assisted living
‒ Heart and respiration rate detection
‒ Cardiac output estimation
‒ Bed occupancy
‒ Stress and relaxation index
‒ Sleep quality monitoring
3Product code
Product code
Quantity
SW version
SCA10H-D01-Sample 1 1
SCA10H-D01-112 112 1
4Block diagram
SCA61T
Accelerometer
Power
management
MSP430G2744
Analog
i/f UART
Block diagram
Figure 1 Functional block diagram
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Murata Electronics Oy SCA10H Doc.No. 1322
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5Dimensions, Measurement Direction, Terminal Configurations and Land
Pattern
5.1 Dimensions
<Top View>
<Slide View>
Figure 2 Module dimensions
Table 1 Dimensions (unit: mm)
Mark Dimension Mark Dimension Mark Dimension
L27.6±0.25 W 25.6±0.25 T 6.6max
a1 1.0±0.1 a2 1.0±0.1 a3 1.0±0.1
b1 0.55±0.15 b2 1.55±0.15 b3 2.9±0.15
b4 6.9±0.15 b5 6.6±0.15 b6 7.55±0.15
b7 0.55±0.15 b8 2.15±0.15 b9 3.2±0.15
b10 2.5±0.15 b11 8.2±0.15 b12 7.45±0.15
c1 1.0±0.1 c2 1.0±0.1 c3 1.0±0.1
e1 0.55±0.1 e2 0.6±0.1 e3 0.55±0.1
e4 1.15±0.1 e5 0.6±0.1 e6 1.15±0.1
e7 1.0±0.1 e8 1.0±0.1 e9 1.5±0.1
e10 1.5±0.1 e11 1.5±0.1 e12 1.5±0.1
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Murata Electronics Oy SCA10H Doc.No. 1322
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5.2 Measurement Direction
Figure 3 Measurement direction
5.3 Terminal Configurations
Table 2 Pin names and descriptions
Pin no Name Description MSP430G2744 pin
(1
1 P1.2/TA1 P1.2/TA1 P1.2/TA1
2 P1.3/TA2 P1.3/TA2 P1.3/TA2
3P1.4/SMCLK/TCK JTAG Interface P1.4/SMCLK/TCK
4P1.5/TA0/TMS JTAG Interface P1.5/TA0/TMS
5P1.6/TA1/TDI/TCLK JTAG Interface P1.6/TA1/TDI/TCLK
6 P1.7/TA2/TDO/TDI JTAG Interface P1.7/TA2/TDO/TDI
7GND Ground
8GND Ground
9TEST/SBWTCK TEST/SBWTCK TEST/SBWTCK
10 JTAG_TCK NC
11 INT_IN Interrupt from host to module P2.5/ROSC
12 MCU_VDD NC DVCC
13 GND Ground
14 GND Ground
15 GND Ground
16 GND Ground
17 RST_n/SBWTDIO Reset RST/NMI/SBWTDIO
18 VIN Power Supply voltage
19 GND Ground GND
20 BSL_RX BSL_RX P2.2/TA0/A2
21 P3.0/CS_n SPI Chip Select P3.0/UCB0STE/UCA0CLK/A5
22 P3.1/SDA/MOSI I2C data / SPI MOSI P3.1/UCB0SIMO/UCB0SDA
23 P3.2/SCL/MISO I2C clk / SPI MISO P3.2/UCB0SOMI/UCB0SCL
24 P3.3/CLK SPI CLK P3.3/UCB0CLK/UCA0STE
25 GND Ground
26 GND Ground
27 GND Ground
28 GND Ground
29 GND Ground
30 GND Ground
31 GND Ground
32 GND Ground
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Murata Electronics Oy SCA10H Doc.No. 1322
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Pin no Name Description MSP430G2744 pin
(1
33 GND Ground
34 SPI_SCK_SCA61T NC
35 GND Ground
36 SPI_MISO_SCA61T NC
37 SPI_MOSI_SCA61T NC
38 SPI_MOSI_SCA10X NC
39 P4.0/TB0 P4.0/TB0 P4.0/TB0
40 P4.1/TB1 P4.1/TB1 P4.1/TB1
41 P4.2/TB2 P4.2/TB2 P4.2/TB2
42 GND
43 GND
44 GND
45 GND
46 SPI_CSB_SCA61T NC
47 SPI_CSB_SCA10X NC
48 ST1 NC
49 ST2 NC
50 INT_OUT Interrupt from module to host P4.6/TBOUTH/A15
51 UART_TX UART_TX P3.4/UCA0TXD/UCA0SIMO
52 UART_RX UART_RX P3.5/UCA0RXD/UCA0SOMI
53 XTRA1 NC P3.6/A6
54 XTRA2 NC P3.7/A7
55 P1.0 P1.0/TACLK/ADC10CLK P1.0/TACLK/ADC10CLK
56 BSL_TX BSL_TX P1.1/TA0
57~80 GND Ground
1) Please refer to TI’s MSP430G2744 datasheet for digital I/O DC and timing parameters. The used
processor’s supply voltage is 3.3V +/- 5%.
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Murata Electronics Oy SCA10H Doc.No. 1322
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5.4 Recommended Land Pattern
<Top View>
Unit: mm
Figure 4 Recommended Land Pattern
Note: The recommended stencil mask thickness for above land pattern is 120um. The
stencil mask area is 0.9mm x 0.9mm, and the position is on the center of each land.
6Maximum absolute ratings
Table 3 Maximum ratings
Parameter
Min
Max
Unit
Storage temperature -40 85 °C
Vin -0.1 20 V
Voltage on any IO-pin, Vin=9 V -0.1 3.4 V
Voltage on any IO-pin, Vin=0 V -0.1 0.1 V
ESD (Human Body Model) 3kV
Mechanical shock
(*
*
1000 g
* When the supply voltage Vin is 9V
** 1 m drop on concrete may cause >> 1000 g shock.
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Murata Electronics Oy SCA10H Doc.No. 1322
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7Electrical specification
Table 4 Electrical specification parameters
Min
Typ
Max
Unit
Module’s supply voltage Vin 8 10 V
Temperature range 0 80 °C
Current consumption 8 mA
Acceleration raw data noise level
(1
1.3 LSB RMS
Acceleration sensor sensitivity
(
2
427 LSB/g
Acceleration sensor's step response gain
(3
1
(1 RMS-noise within the application bandwidth measured on stone table in raw data
mode without any external vibration or noise.
(2 Sensitivity measurement by tilting the module in test mode
(3 BCG- and inclination channel gain ratio G=BCG-channel step response
gain/inclination channel step response gain when sensor's self-test is activated
8Serial port configuration
Table 5 Serial port configuration
Baud rate 230400 baud
Data bits 8
Parity None
Stop bits 1
Flow control None
9Functional specification
Table 6 Functional specification parameters
Min
Typ
Max
Unit
Pulse detection range 40 120 BPM
Steady state pulse rate for test input
(1
48 52 BPM
(1 Accelerometer is disconnected from the circuit. Pre-defined test signal is injected to
the output node of the accelerometer Vout. With default BCG-parameters steady state
output HR is 50±2 BPM. Test setup is according to Figure 5 below and example
measurement and simulation is in Figure 6.
Figure 5 Functional test setup
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Murata Electronics Oy SCA10H Doc.No. 1322
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Figure 6 Injected vs simulated output with test signal using default BCG-parameters
10 Application schematic
Figure 7 Application schematic
11 Communication
Communication protocol is discussed in Product Specification 1327 SCA10H binary
protocol specification.
12 Firmware update
Programming IF includes pins
#17 RST_n/SBWTDIO
#20 BSL_RX
#56 BSL_TX
GND
With FW version 1.5.0.1 and later, modules FW can be updated according to the
Product Specification 1326 SCA10H FW upgrade specification.
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Murata Electronics Oy SCA10H Doc.No. 1322
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13 Reliability
SCA10H-D01 has been verified against the following test conditions:
Table 7 Test items and conditions
Test item
Test condition
1. Temperature humidity bake (THB) - 85RH/85°C
- 9V biased
- 500h
- N=12
2. Low temperature storage life (LTSL) - -40°C
- 500 h
- N=12
3. Temperature cycling test (TCY) - -40°C...+85°C
- 30 min dwell time
- 200 cycles (c)
- N=12
4, Mixed gas test - IEC60068-2-60 method 2
- 14 days
- N=5
5. Vibration test - 10<f<2000Hz, log sweep, A=20 G
- 10 cycles/1 ax, 15min/cycle
- 2.5hrs/axis, total 7.5hrs
6. Drop test - 2 directional drops on each 6 sides (=12
drops) on concrete
- Module attached to a jig
- Drop height 1 m
- N=6
7. ESD (HBM) - 3 kV
- N=5
8. ESD (MM) - 200 V
- N=5
9. ESD (CDM) - 600 V
- N=5
14 Storage
Please use this product within 6 months after receipt.
‒ The product shall be stored without opening the packing under the ambient
temperature from 5 to 35 °C and humidity from 20 to 70 %RH. (Packing materials, in
particular, may be deformed at the temperature over 40 °C)
‒ The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, NOx, etc.).
‒ Any excess mechanical shock including, but not limited to, sticking the packing
materials by sharp object and dropping the product, shall not be applied in order not
to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
‒ After the packing opened, the product shall be stored at <30deg.C / <60%RH and
the product shall be used within 168hours.
‒ When the color of the indicator in the packing changed, the product shall be baked
before soldering.
‒ Baking condition : 125 +5/-0deg.C, 24hours, 1time
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Murata Electronics Oy SCA10H Doc.No. 1322
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The products shall be baked on the heat-resistant tray because the material (Base
Tape, Reel Tape and Cover Tape) are not heat-resistant.
15 Handling
Be careful in handling or transporting products because excessive stress or mechanical
shock may break products due to the nature of PWB structure.
Handle with care. If products have cracks or damages on their terminals, the
characteristics of products may change.
Ensure cleanliness when handling. Pad contamination may affect solderability.
16 Standard PCB Design (Land Pattern and Dimensions)
All the ground terminals should be connected to the ground patterns. Furthermore, the
ground pattern should be provided between IN and OUT terminals. Please refer to the
specifications for the standard land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The
characteristics of products may vary depending on the pattern drawing method,
grounding method, land dimensions, land forming method of the NC terminals and the
PCB material and thickness. Therefore, be sure to verify the characteristics in the actual
set. When using non-standard land pattern, please contact Murata beforehand.
17 Notice for Chip Placer
When placing products on the PCB, products may be stressed and broken by uneven
forces from a worn-out chucking locating claw or a suction nozzle. To prevent products
from damages, be sure to follow the specifications for the maintenance of the chip
placer being used. For the positioning of products on the PCB, be aware that
mechanical chucking may damage products.
18 Soldering Conditions
Carefully perform preheating so that the temperature difference (ΔT) between the solder
and products surface should be in the following range. When products are immersed in
solvent after mounting, pay special attention to maintain the temperature difference
within 100 °C.
Soldering must be carried out by the above mentioned conditions to prevent products
from damage. Contact Murata before use if concerning other soldering conditions.
Table 8 Soldering methods
Soldering Method Temperature
Soldering iron method Δ T < 130 °C/s
Reflow method
‒ Soldering iron method conditions are indicated below.
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Murata Electronics Oy SCA10H Doc.No. 1322
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Table 9 Soldering iron conditions
Soldering iron conditions
Soldering iron power ≤ 18W
Temperature of iron tip ≤ 350 °C
Iron contact time within 3s
‒ Diameter of iron-tip: max 3.0 mm.
‒ Do not allow the iron-tip to directly touch the ceramic element.
Figure 8 Example reflow soldering standard conditions
19 Cleaning
Any cleaning of this product is not permitted.
20 Potting
Potting the product is not recommended. Potting material may get between the sensor
and circuit board resulting in mechanical damages due to thermal expansion.
21 Operational Environment Conditions
Products are designed to work for electronic products under normal environmental
conditions (ambient temperature, humidity and pressure). Therefore, products have no
problems to be used under the similar conditions to the above-mentioned. However, if
products are used under the following circumstances, it may damage products and
leakage of electricity and abnormal temperature may occur.
‒ In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.)
‒ In an atmosphere containing combustible and volatile gases
‒ Dusty place
‒ Direct sunlight place
‒ Water splashing place
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Murata Electronics Oy SCA10H Doc.No. 1322
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‒ Humid place where water condenses
‒ Freezing place
If there are possibilities for products to be used under the preceding clause, consult with
Murata before actual use.
As it might be a cause of degradation or destruction to apply static electricity to
products, do not apply static electricity or excessive voltage while assembling and
measuring.
22 Packaging
22.1 Tray
Figure 9 Product tray 28 pcs
22.2 Inner Box
Figure 10 Inner box 112 pcs
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Murata Electronics Oy SCA10H Doc.No. 1322
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22.3 Outer Box
Figure 11 Outer box 448 pcs
‒ Outer box contains 4 inner boxes. One or more inner boxes can be dummies
depending on the actual delivery quantity.
‒ Please don’t stack more than 5 shipping boxes.
23 Note
Please make sure that our product SCA10H has been evaluated and confirmed against
your specifications. Please also note that our product SCA10H has not been qualified for
medical or similar use where it might directly or indirectly cause damage to the third
party's life, body or property.
All the items and parameters in this product specification have been prescribed on the
premise that our product is used for the purpose, under the condition and in the
environment agreed upon between you and us. You are requested not to use our
product deviating from such agreement.
We consider it is not appropriate to include other terms and conditions for transaction
warranty in your product specifications, drawings or other technical documents.
Therefore, even if your original part of this product specification includes such terms and
conditions as warranty clause, product liability clause, or intellectual property
infringement liability clause, we are not able to accept such terms and conditions in our
product specification unless they are based on the governmental regulation and we
have agreed in a separate contract. We would like you to discuss them when negotiating
the contract.
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Murata Electronics Oy SCA10H Doc.No. 1322
www.murata.com Rev. 1
24 Change control
Rev.
Date
Change Description
109-Sep-15 Document moved to new control system and template, section 8
added, document references in section 11 and 12 updated.