FN2857 Rev 10.00 Page 1 of 11
August 11, 2015
FN2857
Rev 10.00
August 11, 2015
HA-5320
1 Microsecond Precision Sample and Hold Amplifier
DATASHEET
The HA-5320 was designed for use in precision, high speed
data acquisition systems.
The circuit consists of an input transconductance amplifier
capable of providing large amounts of charging current, a
low leakage analog switch, and an output integrating
amplifier. The analog switch sees virtual ground as its load;
therefore, charge injection on the hold capacitor is constant
over the entire input/output voltage range. The pedestal
voltage resulting from this charge injection can be adjusted
to zero by use of the offset adjust inputs. The device
includes a hold capacitor. However, if improved droop rate is
required at the expense of acquisition time, additional hold
capacitance may be added externally.
This monolithic device is manufactured using the Intersil
Dielectric Isolation Process, minimizing stray capacitance
and eliminating SCRs. This allows higher speed and latch-
free operation. For further information, please see
Application Note AN538.
Pinouts
HA-5320
(CERDIP)
TOP VIEW
HA-5320
(SOIC)
TOP VIEW
Features
Gain, DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 x 106 V/V
Acquisition Time. . . . . . . . . . . . . . . . . . . . . .1.0µs (0.01%)
Droop Rate. . . . . . . . . . . . . . . . . . . . . 0.08µV/µs (+25°C)
17µV/µs (Full Temperature)
Aperture Time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns
Hold Step Error (See Glossary) . . . . . . . . . . . . . . . . . 5mV
Internal Hold Capacitor
Fully Differential Input
TTL Compatible
Pb-Free Available (RoHS Compliant)
Applications
Precision Data Acquisition Systems
Digital to Analog Converter Deglitcher
Auto Zero Circuits
Peak Detector
-INPUT
+INPUT
OFFSET ADJUST
OFFSET ADJUST
V-
SIG. GND
OUTPUT
S/H CONTROL
SUPPLY GND
NC
NC
V+
INTEGRATOR
1
2
3
4
5
6
7
14
13
12
11
10
9
8BANDWIDTH
CEXT
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
-INPUT
+INPUT
OFFSET ADJUST
OFFSET ADJUST
V-
SIG. GND
NC
OUTPUT
S/H CONTROL
NC
NC
V+
INTEGRATOR
NC
SUPPLY GND
BANDWIDTH
CEXT
Ordering Information
PART
NUMBER
(Note 2)
PART
MARKING
TEMP.
RANGE
(°C) PACKAGE
PKG.
DWG. #
HA1-5320-2 HA1-5320-2 -55 to +125 14 Ld CERDIP F14.3
HA9P5320-5Z
(Note 1)
HA9P5320-5Z 0 to +75 16 Ld SOIC
(Pb-free)
M16.3
NOTES:
1. Add X96 for Tape and Reel.
2. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and
100% matte tin plate termination finish, which are RoHS
compliant and compatible with both SnPb and Pb-free soldering
operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the
Pb-free requirements of IPC/JEDEC J STD-020.
HA-5320
FN2857 Rev 10.00 Page 2 of 11
August 11, 2015
Functional Diagram
+
9
100pF
OFFSET
ADJUST
3 4
V+
OUTPUT
HA-5320
-INPUT
+INPUT
1
2
CONTROL
S/H
SUPPLY
GND
V-
CEXT
SIG.
GND
INTEGRATOR
BANDWIDTH
14
-
13 5 6 8
11
7
HA-5320
FN2857 Rev 10.00 Page 3 of 11
August 11, 2015
Absolute Maximum Ratings Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24V
Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8V, -15V
Output Current, Continuous (Note 1) . . . . . . . . . . . . . . . . . . . 20mA
Operating Conditions
Temperature Range
HA-5320-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to 125°C
HA-5320-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 75°C
Supply Voltage Range (Typical, Note 2) . . . . . . . . . 13.5V to 20V
Thermal Resistance (Typical, Note 5) JA (°C/W) JC (°C/W)
CERDIP Package. . . . . . . . . . . . . . . . . 70 18
SOIC Package . . . . . . . . . . . . . . . . . . . 90 N/A
Maximum Junction Temperature (Ceramic Package) . . . . . . . . . 175°C
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Pb-Free Reflow Profilesee link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operat i onal sections of this specification is not implied.
NOTES:
3. Internal Power Dissipation may limit Output Current below 20mA.
4. Specification based on a one time characterization. This parameter is not guaranteed.
5. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications VSUPPLY = 15.0V; CH = Internal; Digital Input: VIL = +0.8V (Sample), VIH = +2.0V (Hold),
Unity Gain Configuration (Output tied to -Input), Unless Otherwise Specified
PARAMETER
TEST
CONDITIONS
TEMP.
(°C)
HA-5320-2 HA-5320-5
UNITSMIN TYP MAX MIN TYP MAX
INPUT CHARACTERISTICS
Input Voltage Range Full 10 - - 10 - - V
Input Resistance 25 1 5 - 1 5 - M
Input Capacitance 25 - - 5 - - 5 pF
Offset Voltage 25 - 0.2 - - 0.5 - mV
Full - - 2.0 - - 1.5 mV
Bias Current 25 - 70 200 - 100 300 nA
Full - - 200 - - 300 nA
Offset Current 25 - 30 100 - 30 300 nA
Full - - 100 - - 300 nA
Common Mode Range Full 10 - - 10 - - V
CMRR VCM = 5V 25 80 90 - 72 90 - dB
Offset Voltage Temperature Coefficient Full - 5 15 - 5 20 µV/°C
TRANSFER CHARACTERISTICS
Gain DC, (Note 14) 25 1062 x 106- 3 x 1052 x 106-V/V
Gain Bandwidth Product
(AV = +1, Note 7)
CH = 100pF 25 - 2.0 - - 2.0 - MHz
CH = 1000pF 25 - 0.18 - - 0.18 - MHz
OUTPUT CHARACTERISTICS
Output Voltage Full 10 - - 10 - - V
Output Current 25 10 - - 10 - - mA
Full Power Bandwidth Note 6 25 - 600 - - 600 - kHz
Output Resistance Hold Mode 25 - 1.0 - - 1.0 -
Total Output Noise (DC to 10MHz) Sample 25 - 125 200 - 125 200 µVRMS
Hold 25 - 125 200 - 125 200 µVRMS
HA-5320
FN2857 Rev 10.00 Page 4 of 11
August 11, 2015
TRANSIENT RESPONSE
Rise Time Note 7 25 - 100 - - 100 - ns
Overshoot Note 7 25 - 15 - - 15 - %
Slew Rate Note 8 25 - 45 - - 45 - V/µs
DIGITAL INPUT CHARACTERISTICS
Input Voltage VIH Full 2.0 - - 2.0 - - V
VIL Full - - 0.8 - - 0.8 V
Input Current VIL = 0V 25 - - 4 - - 4 µA
Full--10--10µA
VIH = +5V Full - - 0.1 - - 0.1 µA
SAMPLE AND HOLD CHARACTERISTICS
Acquisition Time (Note 9) To 0.1% 25 - 0.8 1.2 - 0.8 1.2 µs
To 0.01% 25 - 1.0 1.5 - 1.0 1.5 µs
Aperture Time (Note 10) 25 - 25 - - 25 - ns
Effective Aperture Delay Time 25 -50 -25 0 -50 -25 0 ns
Aperture Uncertainty 25 - 0.3 - - 0.3 - ns
Droop Rate 25 - 0.08 0.5 - 0.08 0.5 µV/µs
Full - 17 100 - 1.2 100 µV/µs
Drift Current Note 11 25 - 8 50 - 8 50 pA
Full - 1.7 10 - 0.12 10 nA
Charge Transfer Note 11 25 - 0.5 1.1 - 0.5 1.1 pC
Hold Step Error Note 11 25 - 5 11 - 5 11 mV
Hold Mode Settling Time To 0.01% Full - 165 350 - 165 350 ns
Hold Mode Feedthrough 10VP-P, 100kHz Full - 2 - - 2 - mV
POWER SUPPLY CHARACTERISTICS
Positive Supply Current Note 12 25 - 11 13 - 11 13 mA
Negative Supply Current Note 12 25 - -11 -13 - -11 -13 mA
Supply Voltage Range Note 4 13.5 20 13.5 - 20 V
Power Supply Rejection V+, Note 13 Full 80 - - 80 - - dB
V-, Note 13 Full 65 - - 65 - - dB
NOTES:
6. VO = 20VP-P; RL = 2k; CL = 50pF; unattenuated output.
7. VO = 200mVP-P; RL = 2k; CL = 50pF.
8. VO = 20V Step; RL = 2k; CL = 50pF.
9. VO = 10V Step; RL = 2k; CL = 50pF.
10. Derived from computer simulation only; not tested.
11. VIN = 0V, VIH = +3.5V, tR < 20ns (VIL to VIH).
12. Specified for a zero differential input voltage between +IN and -IN. Supply current will increase with differential input (as may occur in the Hold
mode) to approximately 46mA at 20V.
13. Based on a 1V delta in each supply, i.e. 15V 0.5VDC.
14. RL = 1k, CL = 30pF.
Electrical Specifications VSUPPLY = 15.0V; CH = Internal; Digital Input: VIL = +0.8V (Sample), VIH = +2.0V (Hold),
Unity Gain Configuration (Output tied to -Input), Unless Otherwise Specified (Continued)
PARAMETER
TEST
CONDITIONS
TEMP.
(°C)
HA-5320-2 HA-5320-5
UNITSMIN TYP MAX MIN TYP MAX
HA-5320
FN2857 Rev 10.00 Page 5 of 11
August 11, 2015
Application Information
The HA-5320 has the uncommitted differential inputs of an
op amp, allowing the Sample and Hold function to be
combined with many conventional op amp circuits. See the
Intersil Application Note AN517 for a collection of circuit
ideas.
Layout
A printed circuit board with ground plane is recommended
for best performance. Bypass capacitors (0.01F to 0.1F,
ceramic) should be provided from each power supply
terminal to the Supply Ground terminal on pin 13.
The ideal ground connections are pin 6 (SIG. Ground)
directly to the system Signal Ground, and pin 13 (Supply
Ground) directly to the system Supply Common.
Hold Capacitor
The HA-5320 includes a 100pF MOS hold capacitor,
sufficient for most high speed applications (the Electrical
Specifications section is based on this internal capacitor).
Additional capacitance may be added between pins 7 and
11. This external hold capacitance will reduce droop rate at
the expense of acquisition time, and provide other trade-offs
as shown in the Performance Curves.
If an external hold capacitor CEXT is used, then a noise
bandwidth capacitor of value 0.1CEXT should be connected
from pin 8 to ground. Exact value and type are not critical.
The hold capacitor CEXT should have high insulation
resistance and low dielectric absorption, to minimize droop
errors. Polystyrene dielectric is a good choice for operating
temperatures up to +85°C. Teflon® and glass dielectrics
offer good performance to +125°C and above.
Test Circuits and Waveforms
FIGURE 1. CHARGE TRANSFER AND DRIFT CURRENT
FIGURE 2. CHARGE TRANSFER TEST FIGURE 3. DRIFT CURRENT TEST
FIGURE 4. HOLD MODE FEEDTHROUGH ATTENUATION
14
2
17
8
11
NC
NC
-INPUT
+INPUT
S/H CONTROL
CONTROL
INPUT
S/H
OUTPUT VO
(CH = 100pF)
HA-5320
S/H CONTROL
VO
VP
HOLD (+3.5V)
SAMPLE (0V)
NOTES:
15. Observe the “hold step” voltage VP.
16. Compute charge transfer: Q = VPCH.
S/H CONTROL
VOVO
t
NOTES:
17. Observe the voltage “droop”, VO/t.
18. Measure the slope of the output during hold, VO/t, and
compute drift current: ID = CH VO/t.
HOLD (+3.5V)
SAMPLE (0V)
VIN
ANALOG
MUX OR
SWITCH
AIN S/H CONTROL
+IN
-IN
OUT
VOUT
7
1
2
14
V-V+
S/H CONTROL
INPUT
95
100kHz
SINE WAVE
10VP-P
CEXT
TO
SIGNAL
GND
TO
SUPPLY
COMMON
NC
13 11 6
NC
8
INT.
COMP.
REF
COM
SUPPLY
GND
HA-5320
NOTE:
Feedthrough in
where:
VOUT = VP-P, Hold Mode, VIN = VP-P.
dB 20 VOUT
VIN
---------------
log=
HA-5320
FN2857 Rev 10.00 Page 6 of 11
August 11, 2015
The hold capacitor terminal (pin 11) remains at virtual ground
potential. Any PC connection to this terminal should be kept
short and “guarded” by the ground plane, since nearby
signal lines or power supply voltages will introduce errors
due to drift current.
Typical Application
Figure 5 shows the HA-5320 connected as a unity gain
noninverting amplifier - its most widely used configuration.
As an input device for a fast successive - approximation A/D
converter, it offers very high throughput rate for a monolithic
IC sample/hold amplifier. Also, the HA-5320’s hold step error
is adjustable to zero using the Offset Adjust potentiometer, to
deliver a 12-bit accurate output from the converter.
The application may call for an external hold capacitor CEXT as
shown. As mentioned earlier, 0.1CEXT is then recommended at
pin 8 to reduce output noise in the Hold mode.
The HA-5320 output circuit does not include short circuit
protection, and consequently its output impedance remains
low at high frequencies. Thus, the step changes in load
current which occur during an A/D conversion are absorbed
at the S/H output with minimum voltage error. A momentary
short circuit to ground is permissible, but the output is not
designed to tolerate a short of indefinite duration.
Glossary of Terms
Acquisition Time
The time required following a “sample” command, for the
output to reach its final value within 0.1% or 0.01%. This is
the minimum sample time required to obtain a given accuracy,
and includes switch delay time, slewing time and settling time.
Charge Transfer
The small charge transferred to the holding capacitor from
the inter-electrode capacitance of the switch when the unit is
switched to the HOLD mode. Charge transfer is directly
proportional to sample-to-hold offset pedestal error, where:
Charge Transfer (pC) = CH (pF) x Hold Step Error (V)
Aperture Time
The time required for the sample-and-hold switch to open,
independent of delays through the switch driver and input
amplifier circuitry. The switch opening time is the interval
between the conditions of 10% open and 90% open.
Hold Step Error
Hold Step Error is the output error due to Charge Transfer (see
above). It may be calculated from the specified parameter,
Charge Transfer, using the following relationship:
See Performance Curves.
Effective Aperture Delay Time (EADT)
The difference between the digital delay time from the Hold
command to the opening of the S/H switch, and the
propagation time from the analog input to the switch.
EADT may be positive, negative or zero. If zero, the S/H
amplifier will output a voltage equal to VIN at the instant the
Hold command was received. For negative EADT, the output in
Hold (exclusive of pedestal and droop errors) will correspond to
a value of VIN that occurred before the Hold command.
Aperture Uncertainty
The range of variation in Effective Aperture Delay Time.
Aperture Uncertainty (also called Aperture Delay Uncertainty,
Aperture Time Jitter, etc.) sets a limit on the accuracy with
which a waveform can be reconstructed from sample data.
Drift Current
The net leakage current from the hold capacitor during the
hold mode. Drift current can be calculated from the droop
rate using the formula:
Hold Step (V) Charge Transfer (pC)
Hold Capacitance (pF)
------------------------------------------------------------
=
ID(pA) CHpF
V
t
--------(V/s)=
NOTE: Pin Numbers Refer to
DIP Package Only.
+
-
3459
10k
OFFSET
ADJUST
15mV
1
2
HA-5320
H
S
S/H CONTROL
VIN
14
-15V +15V
+
-
11
100pF
7
0.1CEXT
SYSTEM POWER
GROUND
SYSTEM SIGNAL
GROUND
68
13
5
9ANALOG
COMMON
R/C
INPUT
HI-574A
DIGITAL
OUTPUT
CONVERT
CEXT
13
FIGURE 5. TYPICAL HA-5320 CONNECTIONS; NONINVERTING UNITY GAIN MODE
HA-5320
FN2857 Rev 10.00 Page 7 of 11
August 11, 2015
Typical Performance Curves
FIGURE 6. TYPICAL SAMPLE AND HOLD PERFORMANCE
AS A FUNCTION OF HOLD CAPACITOR
FIGURE 7. DRIFT CURRENT vs TEMPERATURE
FIGURE 8. OPEN LOOP GAIN AND PHASE RESPONSE
FIGURE 9A. HOLD STEP vs INPUT VOLTAGE FIGURE 9B. HOLD STEP vs LOGIC (VIH) VOLTAGE
FIGURE 9. TYPICAL SAMPLE-TO-HOLD OFFSET (HOLD STEP) ERROR
ACQUISITION TIME FOR
10V STEP TO +0.01% (µs)
VOLTAGE DROOP DURING
HOLD MODE, (mV/100ms)
SAMPLE-TO-HOLD OFFSET
(HOLD STEP) ERROR, (mV)
10
5
1.0
0.5
0.1
0.05
0.01
100 1000 10k 100k
CHVALUE (pF)
CH = 100pF, INTERNAL
1000
100
10
1
0
IDRIFT (pA)
-25 0 25 50 75 100 125
TEMPERATURE (°C)
10 100 1k 10k 100k 1M 10M
0
45
90
135
180
PHASE (°)
GAIN (dB)
FREQUENCY (Hz)
120
100
80
60
40
20
00
(CH = 100pF)
GAIN
GAIN
(CH = 1100pF)
PHASE
CH = 100pF
CH = 1000pF
CH = 0.01µF
5.0
0.5
0.05
-10-8-6-4-2 2 4 6 810
TA = +25°C
HOLD STEP VOLTAGE (mV)
DC INPUT (V)
2345
+75°C
+25°C
HOLD STEP VOLTAGE
LOGIC LEVEL HIGH (V)
CH = 100pF
HA-5320
FN2857 Rev 10.00 Page 8 of 11
August 11, 2015
Die Characteristics
DIE DIMENSIONS:
92 mils x 152 mils x 19 mils
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ 2kÅ
PASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos)
Silox Thickness: 12kÅ 2kÅ
Nitride Thickness: 3.5kÅ 1.5kÅ
TRANSISTOR COUNT:
184
SUBSTRATE POTENTIAL:
V-
Metallization Mask Layout
HA-5320
CEXT V+
(8) INT BW
(7) OUTPUT
(6) SIG GND
V-
VIO ADJVIO ADJ
+INPUT (2)
-INPUT (1)
S/H CTRL (14)
SUPPLY GND
(9)(11)(13)
(5)
(4)
(3)
HA-5320
FN2857 Rev 10.00 Page 9 of 11
August 11, 2015
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE REVISION CHANGE
August 11, 2015 FN2857.10 Added Rev History beginning with Rev 10.
Added About Intersil Verbiage.
Updated Ordering Information on page 1
HA-5320
FN2857 Rev 10.00 Page 10 of 11
August 11, 2015
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
bbb C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
PLANE
-D-
-A-
-C-
-B-
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
eA/2
A
M
SS
ccc C A - B
MD
SSaaa CA - B
MD
SS
eA
F14.3 MIL-STD-1835 GDIP1-T14 (D-1, CONFIGURATION A)
14 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.200 - 5.08 -
b 0.014 0.026 0.36 0.66 2
b1 0.014 0.023 0.36 0.58 3
b2 0.045 0.065 1.14 1.65 -
b3 0.023 0.045 0.58 1.14 4
c 0.008 0.018 0.20 0.46 2
c1 0.008 0.015 0.20 0.38 3
D - 0.785 - 19.94 5
E 0.220 0.310 5.59 7.87 5
e 0.100 BSC 2.54 BSC -
eA 0.300 BSC 7.62 BSC -
eA/2 0.150 BSC 3.81 BSC -
L 0.125 0.200 3.18 5.08 -
Q 0.015 0.060 0.38 1.52 6
S1 0.005 - 0.13 - 7
90o105o90o105o-
aaa - 0.015 - 0.38 -
bbb - 0.030 - 0.76 -
ccc - 0.010 - 0.25 -
M - 0.0015 - 0.038 2, 3
N14 148
Rev. 0 4/94
FN2857 Rev 10.00 Page 11 of 11
August 11, 2015
HA-5320
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
© Copyright Intersil Americas LLC 2003-2015. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) BM M
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.3977 0.4133 10.10 10.50 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N16 167
-
Rev. 1 6/05