AYF32 FPC CONNECTORS FOR FPC CONNECTION FPC CONNECTORS Y3F (0.3 mm pitch) without FPC tabs (Former Name: YF32) FEATURES 3. Equipped with soldering terminals for higher mounting strength 4. Easy-to-handle front lock structure 5. Wiring patterns can be located underneath the connector. 6. Ni barrier with high resistance to solder creep 1. Low-profile, space-saving design (pitch: 0.3mm) The 0.9mm height, 3.0mm depth contributes to the miniaturization and thickness reduction of target products. * The total depth including the lever is 3.2mm. APPLICATIONS 17 (51 Compact mobile devices "Cellular phones, Digital cameras and DVC, etc" 0.9 .35 co nta cts ) 3.0 2. Compatible with FPC without tabs, allowing smooth FPC insertion Compatible with without FPC tabs, allowing smooth FPC insertion (Y3FT is compatible with FPC with tabs.) Compatible with FPC without tabs, allowing smooth FPC insertion Soldering terminals (Metal clips) resistant to twisting Compliance with RoHS Directive ORDERING INFORMATION AYF 3 2 1 5 32: FPC Connector 0.3 mm pitch (Front lock, ZIF type without FPC tabs) Number of contacts (2 digits) Contact direction 1: Bottom contact Surface treatment (Contact portion / Terminal portion) 5: Au plating/Au flash plating (Ni barrier) panasonic-electric-works.net/ac AYF32 PRODUCT TYPES Height Number of contacts Part number 0.9 mm 15 17 23 25 27 29 31 33 35 39 41 45 51 AYF321515 AYF321715 AYF322315 AYF322515 AYF322715 AYF322915 AYF323115 AYF323315 AYF323515 AYF323915 AYF324115 AYF324515 AYF325115 Packing Inner carton Outer carton 5,000 pieces 10,000 pieces Notes: 1. Order unit; For mass production: in 1-inner carton (1-reel) units Samples for mounting check: in 50-connector units. Please contact our sales office. 2. Please contact are sales office for connectors having a number of contacts other than those listed above. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Insulation resistance Specifications 0.2A/contact 50V AC/DC Min. 1,000M (initial) Breakdown voltage 150V AC for 1 min. Contact resistance Max. 80m FPC holding force Min. 0.13N/contacts x contacts (initial) Contact holding force Min. 0.2N/contacts Soldering terminal holding force Ambient temperature Storage temperature Thermal shock resistance (with FPC inserted) Environmental characteristics Humidity resistance (with FPC inserted) Saltwater spray resistance (with FPC inserted) H2S resistance (with FPC inserted) Soldering heat resistance Lifetime characteristics Unit weight Insertion and removal life Min. 0.2N/contacts Conditions Using 250V DC megger (applied for 1 min.) No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Based on the contact resistance measurement method specified by JIS C 5402. Measurement of the maximum force applied until the inserted compatible FPC is pulled out in the insertion axis direction while the connector lever is closed Measuring the maximum force. As the contact is axially pull out. Measuring the maximum force. As the soldering terminal is axially pull out. -55C to +85C -55C to +85C (product only) -40C to +50C (emboss packing) No freezing at low temperatures. No dew condensation. 5 cycles, insulation resistance min. 100M, contact resistance max. 80m Sequence 1. -55 -30 C, 30 minutes 2. ~ , Max. 5 minutes 3. 85 +30 C, 30 minutes 4. ~ , Max. 5 minutes 120 hours, insulation resistance min. 100M, contact resistance max. 80m 24 hours, insulation resistance min. 100M, contact resistance max. 80m 48 hours, contact resistance max. 80m Peak temperature: 260C or less 300C within 5 sec. 350C within 3 sec. 30 times Bath temperature 402C, humidity 90 to 95% R.H. Bath temperature 352C, saltwater concentration 51% Bath temperature 402C, gas concentration 31 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and removal: min. 10 sec./time 51-contact type: 0.09 g 2. Material and surface treatment Part name Molded portion Material Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) Contact Copper alloy Soldering terminal portion Copper alloy Surface treatment -- Contact portion; Base: Ni plating, Surface: Au plating Terminal portion; Base: Ni plating, Surface: Au plating Base: Ni plating, Surface: Au plating panasonic-electric-works.net/ac AYF32 DIMENSIONS (Unit: mm) A 0.600.10 (Terminal pitch) 1.12 (Suction area) (1.50) ) (140 3.20 Terminal coplanarity 0.20 0.1 (Contact and soldering terminal) D0.20 C0.20 Number of contacts/ dimension 15 6.55 3.60 4.20 5.60 17 23 25 27 29 31 33 35 39 41 45 51 7.15 8.95 9.55 10.15 10.75 11.35 11.95 12.55 13.75 14.35 15.55 17.35 4.20 6.00 6.60 7.20 7.80 8.40 9.00 9.60 10.80 11.40 12.60 14.40 4.80 6.60 7.20 7.80 8.40 9.00 9.60 10.20 11.40 12.00 13.20 15.00 6.20 8.00 8.60 9.20 9.80 10.40 11.00 11.60 12.80 13.40 14.60 16.40 0.30 (2.07) 3.00 (FPC insertion depth) (0.12) 0.30 0.53 (0.15) (0.12) 0.900.10 When the lever is opened 0.300.10 (Terminal pitch) 0.600.10 (Terminal pitch) B0.20 A B C D RECOMMENDED FPC DIMENSIONS (Finished thickness: t = 0.20.03) The conductive parts should be based by Ni plating and then Au plating. A0.05 B0.03 1.700.15 1.600.15 1.500.15 1.050.15 0.850.15 20 0. 0.600.02 0.600.07 0.10 max. 0.200.02 0.200.02 0.30+0.04 -0.03 (Contact width) C0.03 Number of contacts/ dimension 15 4.80 4.20 3.60 17 23 25 27 29 31 33 35 39 41 45 51 5.40 7.20 7.80 8.40 9.00 9.60 10.20 10.80 12.00 12.60 13.80 15.60 4.80 6.60 7.20 7.80 8.40 9.00 9.60 10.20 11.40 12.00 13.20 15.00 4.20 6.00 6.60 7.20 7.80 8.40 9.00 9.60 10.80 11.40 12.60 14.40 0.200.03 3.50 min. (Reinforcing plate) 0.300.07 2.200.30 (Exposed part of the conductor) 0.30+0.04 -0.03 (Contact width) (0.10) R 0.20 max. 0.300.07 0.600.02 0.300.02 0.600.07 A B C EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type) * Specifications for taping (In accordance with JIS C 0806-1990. However, not applied to the mounting-hole pitch of some connectors.) di Taping reel 50 + 0 0. .1 0 (C1) Top cover tape (2.0) (4.0) Embossed carrier tape 380 dia. (2.0) (4.0) 1. 0 0. .1 0 50 + A0.30 1. A0.30 (B) 8.0 Embossed mounting-hole 8.0 Leading direction after packaging di a. Tape II a. Tape I * Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) (1.75) (B) (1.75) 28.40 * Dimension table (Unit: mm) Number of contacts 15 and 17 contacts 23 to 45 contacts 51 contacts Type of taping Tape I Tape I Tape II A 16.0 24.0 32.0 B 7.5 11.5 14.2 C 17.4 25.4 33.4 Quantity per reel 5,000 5,000 5,000 panasonic-electric-works.net/ac AYF32 * Connector orientation with respect to embossed tape feeding direction Type Y3F Direction of tape progress NOTES 1. Recommended PC board and metal mask patterns Appropriate control of solder amount is required to minimize solder bridges and other defects for connectors with 0.3 mm, 0.4 mm or 0.5 mm pitch terminals, which require high-density mounting. Refer to the recommended PC board pattern. Exposed metal clip area B0.05 0.600.03 0.300.03 Terminal 0.300.03 0.600.03 C0.05 D0.05 0.450.03 0.700.03 0.700.03 3.200.03 0.600.03 0.40 0.100.03 Connector outline 0.500.03 Recommended PC board pattern (Mount pad arrangement pattern) 2. Precautions for insertion/removal of FPC To open the lever, hold its center and turn it up. A load applied to the lever unevenly or on only one side may deform and break the lever. Do not apply an excessive load to the lever in the opening direction; otherwise, the terminals may be deformed. Don't further apply an excessive load to the fully opened lever; otherwise, the lever may be deformed. Fully open the lever to insert an FPC. Since this product connects at the bottom, please insert the FPC so that its electrode plane is facing the board to which it will be mounted. Do not insert the FPC in the reverse direction of the contact section; otherwise, operation failures or malfunctions may be caused. (140) Metal clip Number of contacts/ dimension 15 B C D 3.60 4.20 5.60 17 23 25 27 29 31 33 35 39 41 45 51 4.20 6.00 6.60 7.20 7.80 8.40 9.00 9.60 10.80 11.40 12.60 14.40 4.80 6.60 7.20 7.80 8.40 9.00 9.60 10.20 11.40 12.00 13.20 15.00 6.20 8.00 8.60 9.20 9.80 10.40 11.00 11.60 12.80 13.40 14.60 16.40 Completely insert the FPC horizontally. An FPC inserted at an excessive angle to the board may cause the deformation of metal parts, FPC insertion failures, and FPC circuit breakages. FPC Insert the FPC to the full depth of the connector without altering the angle. When closing the lever, use the ball(s) of your finger to push the entire lever or both sides of it. Be careful. If pressure to the lever is applied unevenly, such as to an edge only, it may deform or break. Also, make sure that the lever is closed completely. Not doing so will cause a faulty connection. Avoid applying an excessive load to the top of the lever during or after closing the lever. Otherwise, the terminals may be deformed. Remove the FPC at parallel with the lever fully opened. If the lever is closed, or if the FPC is forcedly pulled, the molded part may break. After an FPC is inserted, carefully handle it so as not to apply excessive stress to the base of the FPC. For other details, please verify with the product specification sheets. panasonic-electric-works.net/ac FPC CONNECTORS COMMON CAUTIONS FOR USE COMMON CAUTIONS FOR USE PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal. FPC and equipment design Design the FPC based on the recommended dimensions to ensure the required connector performance. In addition, carefully check the equipment design and take required measures for the equipment to prevent the FPC from being removed subsequent to a fall, vibration, or other impact due to the FPC size, weight, or the reaction force of the routed FPC. Connector mounting In case the connector is picked up by chucking during mounting, an excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. Soldering 1) Manual soldering. * Due to the low profile, if an excessive amount of solder is applied to this product during manual soldering, the solder may creep up to near the contact points, or interference by solder may cause imperfect contact. * Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. * Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. * Be aware that a load applied to the connector terminals while soldering may displace the contact. * Thoroughly clean the iron tip. 2) Reflow soldering * Screen-printing is recommended for printing paste solder. Y3FT/Y3F/Y3B To determine the relationship between the screen opening area and the PC board foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks when setting. Note that excess solder on the terminals prevents complete insertion of the FPC, and that excess solder on the metal clips prevents the lever from rotating. Y5S Note that excess solder inhibits the slider lock operation. Terminal Paste solder PC board foot pattern * Screen thickness of 120m is recommended for paste solder printing. * Consult us when using a screen-printing thickness other than that recommended. * Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. * The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Y3FT/Y3F/Y3B Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Temperature Peak temperature 260C 230C 180C Preheating 220C 200C 25 sec. 150C 60 to 120 sec. 70 sec. Time Y5S * When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive. (Double reflow soldering on the same side is possible) 3) Reworking on a soldered portion * Finish reworking in one operation. * For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise, the flux may creep to the contact parts. * Use a soldering iron whose tip temperature is within the temperature range specified in the specifications. Do not drop the product or handle carelessly. Otherwise, the terminals may become deformed due to excessive force or the solderability during reflow soldering may degrade. Don't open/close the lever or insert/ remove an FPC until the connector is soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. In addition, do not insert an FPC into the connector before soldering the connector. When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive forces. Do not the soldered areas to be subjected to forces Temperature Peak temperature 250C 200C 180C Other Notes When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. 150C Preheating 60 to 120 sec. Min. 200C, 70 sec. Time Y5F Temperature Peak temperature 260C 200C 180C For other details, please verify with the product specification sheets. 150C Preheating 60 to 120 sec. Min. 200C, 70 sec. Time * The temperature is measured on the surface of the PC board near the connector terminal. * Some solder and flux types may cause serious solder creeping. Take the solder and flux characteristics into consideration when setting the reflow soldering conditions. panasonic-electric-works.net/ac