D2516EC4BXGGB - KINGSTON TECHNOLOGY

Kingston DDR3/3L

Kingston on-board DRAM is designed to meet the needs of embedded applications and oers a

low-voltage option for lower power consumption.

DDR3/3L Part Numbers and Specifications

30nm DDR3/3L

Part Number Capacity Description Package

Size

Conguration

(words x bits) Speed VDD,

VDDQ

Operating

Temperature

D2516EC4BXGGB 4Gb 96 ball FBGA

DDR3/3L 9.0x13.5x1.2 256Mx16 1600

Mbps 1.35V* 0°C ~ +95°C

D5128EETBPGGBU 4Gb 78 ball FBGA

DDR3/3L 9.0x10.6x1.2 512Mx8 1600

Mbps 1.35V* 0°C ~ +95°C

D2516ECMDXGJD 4Gb 96 ball FBGA

DDR3L 7.5x13.5x1.2 256Mx16 1866

Mbps 1.35V* 0°C ~ +95°C

D5128ECMDPGJD 4Gb 78 ball FBGA

DDR3L 7.5x10.6x1.2 512Mx8 1866

Mbps 1.35V* 0°C ~ +95°C

D2516ECMDXGME 4Gb 96 ball FBGA

DDR3L 7.5x13.5x1.2 256Mx16 2133

Mbps 1.35V* 0°C ~ +95°C

*Backward compatible to 1.5V VDD, VDDQ

Key Features

• Double-data-rate architecture: two data transfers per clock cycle

• The high-speed data transfer is realized by the 8 bits prefetch pipelined architecture

• Bi-directional dierential data strobe (DOS and /DQS) is transmitted/received with data for

capturing data at the receiver

• DOS is edge-aligned with data for READS; center-aligned with data for WRITES

• Dierential clock inputs (CK and !CK)

• DLL aligns DQ and DOS transitions with CK transitions

• Commands entered on each positive CK edge; data and data mask referenced to both

edges of DQS

• Data mask (DM) for write data

• Posted /CAS by programmable additive latency for better command and data bus eciency

• On-Die Termination (ODD for better signal quality

— Synchronous ODT

— Dynamic CDT

— Asynchronous ODT

• Multi Purpose Register (MPR) for pre-dened pattern read out

• ZQ calibration for DO drive and ODT

• Programmable Partial Array Self-Refresh (PASR)

• RESET pin for Power-up sequence and reset function

• SRT range: Normal/extended

• Programmable Output driver impedance control

KINGSTON.COM

Kingston DDR3/3L DRAM

for embedded applications

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