Surface Mount Solutions Attenuators Resistors Terminations Surface Mount Solutions SERIES ANT, ANR RESISTORS & TERMINATIONS High Power, Aluminum Nitride, Thin Film, Drop-in - 10-600 Watts, DC-4 GHz GENERAL INFORMATION NOTES 1. Input power ratings are based on flange temperature of 100 C maximum. 2. 50 and 100 Ohms standard. Other values from 10-500 Ohms available on special order. Contact factory for details. Standard tolerance 5%. Specify resistance value when ordering. 3. VSWR applies to termination style only. These high power devices are designed to dissipate power in RF circuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in "Wilkinson" type power divider networks, or to terminate 3 dB stripline or microstrip hybrids. Aluminum nitride is used for those applications where the use and disposal of beryllium oxide is a concern. % OF RATED POWER AVERAGE POWER DERATING CURVE GENERAL SPECIFICATIONS Resistive Element Substrate Cover Mounting Flange Tab Thin Film Aluminum Nitride Alumina Ceramic Copper, Nickel Plated per QQ-N-290 Beryllium Copper, Gold Plated per MIL-G-4520 4 POWER DERATING 100 75 50 25 0 25 100 125 75 50 FLANGE TEMPERATURE -- C 150 PERFORMANCE SPECIFICATIONS Model ANT & ANR 300-10 ANT & ANR 515-40 ANT & ANR 515-80 ANT & ANR 800-100 ANT & ANR 870-150 ANT & ANR 975-200 ANT & ANR 1250-400 ANT & ANR 1900-600 Frequency Range DC-4.0 GHz DC-2.5 GHz DC-1.0 GHz DC-2.0 GHz DC-2.0 GHz DC-1.0 GHz DC-500 MHz DC-500 MHz Input Power (Watts Avg.) 10 40 80 100 150 200 400 600 VSWR (Typical) (Note 3) 1.25:1 1.15:1 1.25:1 1.25:1 1.25:1 1.25:1 1.50:1 1.50:1 Capacitance (pF) (Typ.) 1.0 1.0 1.6 1.4 4.5 4.5 7.0 15.0 Figure No. 1 2 2 3 4 5 6 7 PHYSICAL DIMENSIONS TERMINATIONS (ANT) SERIES RESISTORS (ANR) SERIES ANT 300-10 -- 10 WATTS Flange Mounted ANR 300-10 -- 10 WATTS Flange Mounted FIGURES FIG. 1 .005.001 [0.130.03] .110 [2.79] .030 [0.76] .125 [3.17] MIN .040 [1.02] .100 [2.54] .300 [7.62] .062 [1.57] .200 [5.08] .100 [2.54] .116 [ 2.95] .160 [4.06] MAX .200 [5.08] ANT 515-40 -- 40 WATTS ANT 515-80 -- 80 WATTS Flange Mounted ANR 515-40 -- 40 WATTS ANR 515-80 -- 80 WATTS Flange Mounted FIG. 2 .095 [2.41] .125 [3.18] .250 [6.35] .125 [3.18] .250 [6.35] MIN .116 [2.95] ANT 800-100 -- 100 WATTS Flange Mounted ANR 800-100 -- 100 WATTS Flange Mounted .160 MAX .062 [1.57] .060 [1.52] TYP FIG. 3 .250 [6.35] MIN .130 [3.3] .003.001 [0.080.03] .515 (13.08) .800 [20.32] .560 [14.22] .130 [3.30] THRU 2 PLS .115 [2.92] .120 [3.05] .230 [5.84] .150 [3.81] MIN .040 [1.02] .005.001 [0.130.03] TAB THICKNESS .400 [10.16] .150 [3.81] MAX .108 [2.74] .060 [1.52] KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] REV 04/11 SERIES ANT, ANR RESISTORS & TERMINATIONS PHYSICAL DIMENSIONS TERMINATIONS (ANT) SERIES RESISTORS (ANR) SERIES FIGURES ANT 870-150 -- 150 WATTS Flange Mounted ANR 870-150 -- 150 WATTS Flange Mounted FIG. 4 .870 [22.10] .560 [14.22] .161 [4.09] THRU 2 PLS .155 [3.94] .375 [9.52] .125 [3.18] MIN .120 [3.05] .187 [4.76] .108 [2.74] .250 [6.35] .003.001 [0.080.03] .160 [4.06] MAX .062 [1.57] ANT 975-200 -- 200 WATTS Flange Mounted ANR 975-200 -- 200 WATTS Flange Mounted FIG. 5 .975 [24.77] .725 [18.41] .300 [7.62] .125 [3.17] .188 [4.76] .375 [9.52] .125 [3.18] MIN .120 [3.05] .003.001 [0.080.03] .375 [9.53] .200 [5.08] MAX .125 [3.17] THRU 2 PLS .110 [2.79] .171 [4.34] ANT 1250-400 -- 400 WATTS Flange Mounted ANR 1250-400 -- 400 WATTS Flange Mounted FIG. 6 1.250[31.8] .171[4.34] .003.001 [0.080.03] .500 [12.7] .120[3.05] TYP. .160[4.06] DIA TYP. .125 [3.18] MIN. 500[12.7] .250[6.4] .125[3.18] .875 [22.23] ANT 1900-600 -- 600 WATTS Flange Mounted ANR 1900-600 -- 600 WATTS Flange Mounted FIG. 7 .210[5.33] MAX. 1.900 [48.26] 1.550 [39.37] 1.000 [25.40] .175 [4.45] .125 [3.18] .270 [6.86] 1.040 [26.42] .500 [12.70] .125 [3.18] MIN C L .250 [6.35] .166 [4.22] THRU 4 PLS KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com .005.001 [0.130.03] .195 [4.95] .250 [6.35] MAX A3RS91.1 High Power Chip Termination 100 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power capabilities to meet the demands of today's CDMA and WCDMA system requirements. Aluminum Nitride is featured for those applications where the use and disposal of Beryllium oxide is a concern. * Environmentally friendly AlN substrate * High performance, thin film element * Power 100 Watts * New adhesion process results in improved terminal strength * On-chip matching network improves frequency performance over the DC-3 GHz frequency range PHYSICAL DIMENSIONS SPECIFICATIONS Parameters Specifications Frequency Range DC to 3 GHz Power 100 Watts* VSWR 1.10:1 max Resistance 50 Ohms +/- 5% Operating Temperature -55 C to 150 C Substrate Aluminum Nitride .225 REF [5,72] REF .045 [1,14] .350REF [8,89]REF * Refer to average power derating curve chart. TYPICAL PERFORMANCE .050 [1,27] .040 REF [1,02] A3RS91.1 WRAP AROUND AVERAGE POWER DERATING CURVE % OF RATED POWER 100 75 50 25 0 25 50 75 100 125 150 CHIP BASE TEMP C KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES ANC RESISTORS, TERMINATIONS High Power Chip, Aluminum Nitride - 50 & 100 Ohms GENERAL INFORMATION When mounted on an appropriate heat sink, these chip devices provide high power dissipation in terminations and as balancing resistors in Wilkinson power divider networks. Laser trimming provides maximum RF power capability. Aluminum nitride is used for those applications where the use and disposal of beryllium oxide is a concern. ORDERING INFORMATION EXAMPLE: Typical Model No. ANC NPC T 250-250 X 50R0 (See Note 1 Below) or 1000 J Prefix PHYSICAL DIMENSIONS Tinning (See Note 2) H = Sn96 T = Sn63 Tolerance Key F = 1% G = 2% J = 5% (Standard) Size Terminal type (X or G) (NARROW FILM) (FULL FILM) TOP VIEW Ohmic Value (Note 1) W A NOTES 1. Resistance value is expressed using military 4-digit call-out. 50R0 = 50 Ohms 1000 = 100 Ohms B Other values from 10-500 Ohms may be available as special order. Contact factory for availability. B TYPE X (RESISTOR) 2. Tinning with Sn96 "Lead Free" high temperature solder will maintain RoHS compliance. 50 Ohms or 100 Ohms T L B TYPE G (TERMINATION) GENERAL SPECIFICATIONS Solderable Terminals Electroplated Silver over Nickel Substrate Aluminum Nitride Resistive Element Thin Film 50 Ohms ONLY T L 0.005 [0.13] MAX PERFORMANCE SPECIFICATIONS W Model Prefix in L [mm] in T [mm] in A [mm] in B [mm] in Capacitance Termination (pF) VSWR [mm] Typical Typical Power CW FREQ. GHz ANC 50-50 0.050 [1,27] 0.050 [1,27] 0.010 [0,25] N/A 0.010 [0,25] 0.5 1.25 5 DC-4.0 ANC 50-100 0.050 [1,27] 0.100 [2,5] 0.010 [0,25] N/A 0.020 [0,51] 1.0 1.25 10 DC-2.0 N/A DC-4.0 ANC 100-200 0.100 [2,5] 0.200 [5,1] 0.040 [1,02] 0.030 [0,76] 1.0 1.25 10 ANC 200-200 0.200 [5,1] 0.200 [5,1] 0.040 [1,02] 0.085 [2,2] 0.040 [1,02] 1.2 1.25 30 DC-4.0 ANC 250-250-40 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] 0.085 [2,2] 0.050 [1,27] 1.0 1.15 40 DC-2.5 ANC 250-250-80 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] N/A 0.050 [1,27] 1.6 1.25 80 DC-1.0 ANC 250-375 0.250 [6,4] 0.375 [9,5] 0.040 [1,02] N/A 0.050 [1,27] 4.5 1.25 125 DC-1.0 ANC 350-225 0.350 [8,9] 0.225 [5,7] 0.040 [1,02] 0.045 [1,14] 0.050 [1,27] 1.4 1.25 100 DC-2.0 ANC 375-375 0.375 [9,5] 0.375 [9,5] 0.040 [1,02] 0.250 [6,4] 0.050 [1,27] 4.5 1.25 200 DC-1.0 KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES KAC Surface Mount Terminations (SMT) High Power, Aluminum Nitride (AlN), 10 - 150 Watts GENERAL INFORMATION Aeroflex / Inmet's series of High PowerSurface MountTerminations are ideal for high frequency applications where small size and low costs are an important design criteria. The ability of these chips to be directly mounted to the PC Board eliminates the need for expensive mounting flanges and input tabs. Large solderable surface areas on the bottom of the chips allows for higher power dissipation in smaller sizes. All KAC series chips are manufactured using environmentally friendly Aluminum Nitride ceramic and are classified as RoHS compliant. ORDERING INFORMATION EXAMPLE: Typical Model No. KAC NPC T 100-200A X Z 50R0 G Prefix Tinning (Optional) H = Sn96 T = Sn63 PHYSICAL DIMENSIONS Size Terminal type Ohmic Value Tolerance, G = 2% (Standard) NOTE Tinning with Sn96 "Lead Free" high temperature solder will maintain RoHS compliance. GENERAL SPECIFICATIONS Substrate Aluminum Nitride Solderable Terminals Electroplated Silver over Nickel Resistive Element Proprietary Thick Film Operating Temperature -55 to +150C Impedance (Nominal) 50 Ohms PERFORMANCE SPECIFICATIONS W Model Prefix KAC 60 - 120A in L (mm) in T (mm) in A (mm) in B (mm) in C (mm) in (mm) 0.060 (1,52) 0.120 (3,05) 0.025 (0,64) 0.054 (1,37) 0.026 (0,66) 0.013 (0,33) KAC 100 - 200A 0.100 Power CW Frequency GHz 1.25 10 DC - 4.0 1.25 20 DC - 2.5 VSWR (2,5) 0.200 (5,1) 0.040 (1,02) 0.050 (1.27) 0.025 (0,64) 0.035 (0,89) KAC 250 - 250A 0.250 (6,4) 0.250 (6,4) 0.040 (1,02) 0.040 (1,02) 0.043 (1,09) 0.020 (0,51) 1.25 75 DC - 4.0 KAC 250 - 375A 0.250 (6,4) 0.375 (9,5) 0.040 (1,02) 0.135 (3,43) 0.058 (1,47) 0.060 (1,52) 1.25 100 DC - 3.0 KAC 375 - 375A 0.375 (9,5) 0.375 (9,5) 0.040 (1,02) 0.125 (3,18) 0.057 (1,48) 0.030 (0,76) 1.25 150 DC - 3.0 KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES PCX HIGH POWER COAXIALTERMINATIONS DC to 6 GHz GENERAL INFORMATION The PCX Series High Power Terminations are designed to dissipate RF power when mounted to a heat sink or chill plate. Power levels up to 500 watts in 50 ohm impedance are available in units with SMA or Type N, male or female connectors. High stability thin film resistive elements on beryllium oxide substrates are used to insure stable VSWR performance over temperature and environmental conditions. NOTES 1. Input power ratings based on case temperature of 85C maximum. 2. Connectors: SMA - Stainless Steel Passivated per MIL-C-39012, Type N - Nickel Plated Brass per MIL-C-39012 3. Housing: Copper, Nickel Plated per QQ-N-290 PERFORMANCE SPECIFICATIONS Part Number Input Power (Watts) (Note 1) Frequency Range Connector Type (Note 2) VSWR (Typical) Outline PCX050-F-50 PCX050-M-50 50 DC - 6 GHz SMA Female SMA Male DC-3 GHz: 3 - 6 GHz: 1.25:1 1.35:1 A PCX050-F-100 PCX050-M-100 100 DC - 3 GHz SMA Female SMA Male DC- 3 GHz: 1.25:1 A PCX050-F-150 PCX050-M-150 PCX100-F-150 PCX100-M-150 150 DC - 2 GHz SMA Female SMA Male N Female N Male DC - 1 GHz: 1 - 2 GHz: 1.15:1 1.40:1 B PCX050-F-250 PCX050-M-250 PCX100-F-250 PCX100-M-250 250 DC -800 MHz SMA Female SMA Male N Female N Male DC - 200 MHz: 1.15:1 200 - 400 MHz: 1.40:1 400-800 MHz: 1.30:1 B PCX100-M-500 500 DC - 200 MHz N Male DC - 200 MHz: B 1.15:1 PHYSICAL DIMENSIONS .960[24.38] .625 [15.88] "Y" .090 [2.29] "X" 1.25 [31.8] 1.375 1.25 [34.93] [31.8] MODEL "X" "Y" "Z" PCX050-F-50 .375 [9.53] .560 [14.22] .260 [6.60] PCX050-M-50 .507 [12.88] .560 [14.22] .260 [6.60] PCX050-F-100 .375 [9.53] .560 [14.22] .260 [6.60] PCX050-M-100 .507 [12.88] .560 [14.22] .260 [6.60] .120 [3.05] DIA. 4 HOLES "Z" .125 [3.18] SMA 50 & 100 WATTS OUTLINE A (Shown with SMA) 1.625 [41.28] .875 [22.23] 2.000 [50.8] 1.625 [41.28] 1.060 [26.92] .180 [4.57] "X" .375 [9.53] 1.250 [31.8] .187 [4.75] .215 [5.46] DIA. 4 HOLES "Y" MODEL "X" "Y" PCX050-F-150, 250 [9.53] [13.08] .375 .515 PCX050-M-150, 250 [9.53] [13.08] .375 .515 PCX100-F-150, 250, 500 [18.69] [12.9] .736 .508 PCX100-M-150, 250, 500 [20.8] [12.9] .819 .508 SMA OR N CONNECTORS 150, 250 & 500 WATTS OUTLINE B (Shown with TYPE N) KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES PPC, NPC RESISTORS, TERMINATIONS High Power Chip - 50 & 100 Ohms GENERAL INFORMATION When mounted on an appropriate heat sink, these chip devices provide high power dissipation in terminations and as balancing resistors in Wilkinson power divider networks. Laser trimming provides maximum peak and average RF power capability. ORDERING INFORMATION EXAMPLE: Typical Model No. PPC or NPC T 25-50 X X 50R0 (See Note A Below) or 1000 J Physical Dimensions Prefix Tinning (see Note 4) H = Sn96 T = Sn63 Size TOP VIEW Tolerance Key W F = 1% G = 2% J = 5% (Standard) Terminal type (X, W or G) Ohmic Value (Note A) B B NOTE A Resistance value is expressed using military 4-digit call-out. 50R0 = 50 Ohms 1000 = 100 Ohms TYPE X Other values from 10-500 Ohms may be available as special order. Contact factory for availability. L GENERAL SPECIFICATIONS Solderable Terminals 50 Ohms or 100 Ohms T B B Electroplated Silver over Nickel (PPC) Gold over Nickel alloy (NPC) Substrate Beryllium Oxide Ceramic Resistive Element Thin Film and Thick Film* TYPE G T 50 Ohms ONLY L NOTES 0.005[0.13] MAX 1. The "L" and "T" dimensions are for the substrate only and do not include terminal thickness or optional tinning thickness. B B 2. Thermal Resistance (R) is measured in C/W between resistive film and mounting surface. 3. The CW power rating is based on maximum film temperature of +150C and with maximum heatsink temperature of +100C. Power is based on infinite and ideal heatsink. Type "W" termination style does not have full back plane metallization and typically handles 1/10 the rated power. TYPE W (Note 3) 50 Ohms or 100 Ohms T L 4. Tinnning with Sn96 "Lead Free" high temperature solder will maintain RoHS compliance. PERFORMANCE SPECIFICATIONS W Model Prefix in [mm] L (Note 1) in [mm] T (Note 1) in [mm] B in [mm] Capacitance (pF) Typical RO C/W Max. (Note 2) C/W Power Freq. GHz (**) DC-4.0 *PPC 100-200A 0.100 [2,5] 0.200 [5,1] 0.040 [1,02] 0.030 [0,76] 0.8 0.80 20W *PPC 250-250A 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] 0.050 [1,27] 1.2 0.30 40W DC-2.5 *PPC 250-375A 0.250 [6,4] 0.375 [9,53] 0.040 [1,02] 0.050 [1,27] 3.5 0.15 150W DC-1.0 NPC 25-50 0.025 [0,64] 0.050 [1,27] 0.010 [0,25] 0.012 [0,305] 0.3 3.90 3W *NPC 50-50 0.050 [1,27] 0.050 [1,27] 0.010 [0,25] 0.012 [0,305] 0.5 1.90 5W DC-10 *NPC 50-100 0.050 [1,27] 0.100 [2,5] 0.010 [0,25] 0.017 [0,43] 1.0 0.72 10W DC-4.0 NPC 75-150 0.075 [1,91] 0.150 [3,8] 0.010 [0,25] 0.020 [0,51] 1.8 0.29 15W DC-4.0 DC-12.4 * Low cost thick film models available on these sizes. Consult factory for specifications. ** Typical VSWR for all terminations is 1.25:1 KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES PPA ATTENUATORS High Power - DC-4 GHz The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 Watts of RF power. The PPA series must be thermally bonded to a heat sink, using the mounting holes provided, in order to operate within the temperature rating indicated. The flange temperatures must not exceed 100C under rated power conditions. GENERAL SPECIFICATIONS ORDERING INFORMATION The Power Attenuators listed are available in 1 dB increments from 1 thru 20 dB. Specify by selecting any of the series listed and add the attenuation value desired to the basic series designation. (See Note 3) Desired dB Value Power 50 Ohms Operating Temp. -55 C to +150C Attenuation Stability 0.0001 dB/dB/C PPA 20-10 Basic Series PPA Impedance Substrate Beryllium Oxide Ceramic Resistive Element Proprietary Thin Film Flange Copper, Nickel Plated per QQ-N-290 Tabs Beryllium Copper, Gold Plated per MIL-G-45204 Cover Alumina Ceramic PERFORMANCE SPECIFICATIONS Attenuation(1) 1 dB Increments (dB) Frequency(1) Range PPA 10 11-20 1-20 DC-4 GHz 10 1-10 0.5 1.0 0.5 2.0 1.0 3.0 PPA 20 6-9 10-15 16-20 1-20 DC-4 GHz 20 1-5 0.5 0.5 0.75 1.0 0.5 0.5 1.0 2.0 0.5 1.0 1.5 3.0 PPA 50 1-20 DC-1 GHz 50 0.3 DC-500 MHz 0.5 500 MHz-1 GHz PPA 100 1-20 DC-500 MHz 100 0.5 Model Input Power (Watts) Attenuation Accuracy (1) (dB) DC-1 GHz 1-2.5 GHz dB VSWR (Typical)2 2.5-4 GHz 1.3:1 1.15:1 - DC-1.0 GHz 1.35:1 - 1.0-2.5 GHz 1.50:1 - 2.5-4.0 GHz 1.25:1 - DC-500 MHz 1.50:1 - 500 MHz-1 GHz 1.25:1 - DC-200 MHz 1.50:1 - 200-500 MHz PHYSICAL DIMENSIONS .040 [1.02] x .005.001 THK [0.130.03] NOTES 1. Custom products .116 [2.95] DIA. are available at higher MIN. frequencies .125 [3.18] TYP with optimized VSWR and attenuation accuracy over narrow frequency .100 [2.54] bandwidths. 2. VSWR as measured in a 0.125" ground plane stripline circuit. 3. Standard values 1, 2, 3, 4, 5, 6, 10, 20 dB. Non-std values available as special order. .160 [4.06] MAX. .003.001 [0.080.03] .375 [9.52] .060 [1.52] TYP .175 [4.45] .171 [4.34] .125 [3.18] THRU 2 PLS .300 [7.62] .100 [2.54] .200 [5.08] .062 [1.58] .375 [9.53] .250 [6.35] MIN TYP .725 [18.42] .110 [2.79] .125 [3.18] .105 [2.67] .200 [5.08] MAX .975 [24.77] PPA10 OUTLINE .003.001 [0.080.03] 1.250 [31.75] .875 [22.23] .060 [1.52] x .003.001 THK [0.080.03] .150 [3.81] MAX. .250 [6.35] MIN. TYP PPA50 OUTLINE .171 [4.34] .405 [10.29] .188 [4.76] .116 [2.95] DIA. .515 [13.08] .250 [6.35] MIN .125 [3.18] .250 [6.35] .125 [3.18] .500 [12.70] .250 [6.35] .250 [6.35] MIN TYP .062 [1.58] .125 [3.18] .060 [1.52] TYP .500 [12.70] .160 [4.06] THRU PLS .105 [2.67] PPA20 OUTLINE .210 [5.33] MAX PPA100 OUTLINE KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES PCA, PCAA ATTENUATORS, CHIP Low Power - DC-18 GHz FEATURES * Laser Trimmed * Temperature Stable GENERAL INFORMATION The PCA and PCAA Series consists of a laser trimmed distributed thin film element on an alumina ceramic substrate with solderable terminals. Two sizes are available. The PCA size operates to 12.4 GHz and the PCAA size operates to 18.0 GHz. Both sizes are available with leads and wrap around conductors for ease of installation. The PCAF and PCAAF options are designed for "flip-chip" application in lower frequency circuits. PCA & PCAA SERIES DATA * Substrate: 96% Alumina * Solderable Terminals: Electroplated Silver over Nickel * Resistive Element: Proprietary Thin Film * Wrap around Ground Terminal available, "W" option * Wrap around-all terminals--"F" option * Standard values 1, 2, 3, 4, 5, 6, 10, 20 dB * Non-std. values available as special order GENERAL SPECIFICATIONS ORDERING INFORMATION The attenuators listed are available in 1 dB increments from 1 through 20 dB. When ordering, to specify the correct part number for the desired attenuation value, select any of the series listed and add the attenuation value desired to the basic series designation. Basic Option(s) Series L W F EXAMPLES: 0.0001 dB/dB/C POWER DERATING (x) (x) Attenuation Stability % OF RATED POWER PCA or PCAA 50 Ohms -55C to +150C AVERAGE POWER DERATING CURVE Options (Note 4) L = Lead/Tab (Gold Plated BeCu) W = Wrap around ground only F = Wrap around all terminals (flip-chip) T = Tinned terminals (any terminal type) Sn63 H = Tinned terminals (any terminal type) Sn96 G = Gold plated terminals EXAMPLE: Impedance Operating Temperature 25 0 85 25 150C NOTES dB Value Option(s) T H G 100 75 50 1. Performance of other dB values vary dependent on attenuation. Contact factory for specifications for fractional dB values. 2. Performance is based on device mounted in matched 50 Ohm line. 3. Rated power 1.5 Watts input PCA, 100 mw PCAA. PCAW-T3 PCAAF-G3 4. Tinning with Sn96 "Lead Free" high temperature solder will maintain RoHS compliance. PERFORMANCE SPECIFICATIONS Increments (dB) Note 1 DC - 4 GHz PCA, PCAA Series Attenuation Accuracy (dB) Note 2 4 - 8 GHz 8 - 12.4 GHz 12.4 - 18 GHz PCA, PCAA PCA, PCAA PCAA Series Series Series Only DC - 4 GHz PCA, PCAA Series VSWR (Typical) Note 2 4 - 8 GHz 8 - 12.4 GHz 12.4 - 18 GHz PCA, PCAA PCA, PCAA PCAA Series Series Series Only 1-3 0.5 0.5 0.5 0.5 1.25 1.35 1.50 4-6 0.5 0.5 0.5 0.75 1.25 1.35 1.50 1.50 7 - 10 0.5 0.5 0.75 1.0 1.25 1.35 1.50 1.50 11 - 15 0.75 +0.5 -3.0 +0.5 -4.0 -- 1.25 1.35 1.50 -- 16 - 20 1.0 +0.5 -4.0 -- -- 1.25 1.35 -- -- KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 1.50 SERIES PCA, PCAA ATTENUATORS, CHIP Low Power - DC-18 GHz PHYSICAL DIMENSIONS PCAW (WRAP AROUND GROUND TERMINAL ONLY) PCA .025[0.64] MIN .025[0.64] MIN .010 [0.25] .060 [1.52] TYP. .125 [3.18] .060[1.52] TYP. .125 [3.18] .150 [3.8] GROUND .150 [3.8] .015[0.38] MIN WRAP AROUND GROUND .015[0.38] MIN PCAF (WRAP AROUND ALL TERMINALS) PCAL (LEAD/COVER) .150 [3.8] .010 [0.25] .250 [6.4] MIN .040 [1.02] MAX MAXIMUM FREQUENCY 4 GHz .010 [0.25] .025 MIN [0.64] .125 [3.18] .060 [1.52] TYP. .125 [3.18] WRAP AROUND TERM TYP (SIDE WRAP OPTIONAL) .150 [3.8] .060.003 [1.520.08] TYP. WRAP AROUND GROUND (SIDE WRAP OPTIONAL) .003.001 [0.080.03] .015 [0.38] MIN PCAAW (WRAP AROUND GROUND TERMINAL ONLY) PCAA .025 [0.64] TYP. .025 [0.64] TYP. .010 [0.25] .020 [0.5] TYP. .060 [1.52] .010 [0.25] .020[0.5] TYP. .060 [1.52] .075 [1.9] .075 [1.9] GROUND .015[0.38] MIN WRAP AROUND GROUND .015 [0.38] MIN PCAAF (WRAP AROUND ALL TERMINALS) PCAAL (LEAD/COVER) .075 .250 [6.4] [1.9] MIN .040 [1.02] MAX .060 [1.52] .025 [0.64] TYP. .010 [0.25] .020 [0.5] TYP. .060 [1.52] .020.003 [0.50.08] TYP. .003.001 [0.080.03] MAXIMUM FREQUENCY 8 GHz WRAP AROUND TERM TYP (SIDE WRAP OPTIONAL) .075 [1.9] WRAP AROUND GROUND (SIDE WRAP OPTIONAL) .015 [0.38] MIN KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 04/11 SERIES PPR, PPT RESISTORS & TERMINATIONS High Power, Thin Film, Drop-in - 10-650 Watts, DC-4 GHz GENERAL INFORMATION These high power devices are designed to dissipate power in RFcircuits when mounted to an appropriate heat sink. The terminations provide a low VSWR under maximum power conditions. The resistor configurations are typically used in "Wilkinson" type power divider networks, or to terminate 3 dB stripline or microstrip hybrids. NOTES 1. Input power ratings are based on flange temperature of 100 C maximum. 2. 50 and 100 Ohms standard. Other values from 10-500 Ohms available on special order. Contact factory for details. Standard tolerance 5%. Specify resistance value when ordering. 3. VSWR applies to termination style only. % OF RATED POWER AVERAGE POWER DERATING CURVE GENERAL SPECIFICATIONS Resistive Element Substrate Cover Mounting Flange Tab Thin Film and Thick Film* Beryllium Oxide Ceramic Alumina Ceramic Copper,Nickel Plated per QQ-N-290 Beryllium Copper,Gold Plated per MIL-G-45204 POWER DERATING 100 75 50 25 0 25 100 125 75 50 FLANGE TEMPERATURE -- C 150 * Low cost thick film models available on some sizes.Consult Factory for specifications. PERFORMANCE SPECIFICATIONS Model PPR & PPT 300-10-3* PPR & PPT 515-20-3* Frequency Range DC-4.0 GHz DC-2.0 GHz Input Power (Watts Avg.) 10 20 PPT 515-30-4 PPR & PPT 515-30* DC-4.0 GHz DC-2.0 GHz 30 30 PPR & PPT 800-40-3 PPT 800-100A PPR & PPT 870-150-3* DC-4.0 GHz DC-2.0 GHz DC-1.0 GHz 40 100 150 PPR & PPT 975-250-3 DC-1.0 GHz 250 PPR & PPT 1250-400 PPR &PPT 1900-800 DC-500 MHz DC-500 MHz 400 VSWR (Typical) (Note 3) 1.35:1 --DC-4.0 GHz 1.10:1 --DC-1.0 GHz 1.25:1 --1.0-2.0 GHz 1.20:1 --DC-40 GHz 1.10:1 --DC-1.0 GHz 1.25:1 --1.0-2.0 GHz 1.25:1 --DC-4.0 GHz 1.25:1 --DC-2.0 GHz 1.20:1 --DC-500 MHz 1.35:1 --500-1000 MHz 1.25:1 --DC-500 MHz 1.35:1 --500-1000 MHz 1.50:1 --DC-500 MHz 1.25:1 --DC-200 MHz 1.50:1 --200-500 MHz 650 Capacitance (pF) (Typ.) 0.8 0.8 Figure No. 1 2 1.2 0.8 3 4 1.4 1.4 5 6 3.5 7 5.0 8 7.0 10.2 9 10 PHYSICAL DIMENSIONS TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES PPT 300-10-3 -- 10 WATTS Flange Mounted PPR 300-10-3 -- 10 WATTS Flange Mounted FIG. 1 .030 [0.76] .125 [3.17] MIN .005.001 [0.130.03] .110 [2.79] .040 [1.02] .100 [2.54] .300 [7.62] .062 [1.57] .200 [5.08] .116 [ 2.95] .160 [4.06] MAX .100 [2.54] .200 [5.08] KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] REV 4/11 SERIES PPR, PPT RESISTORS & TERMINATIONS PHYSICAL DIMENSIONS TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES PPT 515-20-3 -- 20 WATTS Flange Mounted PPR 515-20-3 -- 20 WATTS Flange Mounted FIG. 2 .095 [2.41] .160 [4.06] MAX .062 [1.57] .060 [1.52] TYP .125 [3.18] .250 [6.35] .125 [3.18] .250 [6.35] MIN .116 [2.95] PPT 515-30-4 -- 30 WATTS Flange Mounted .250 [6.35] MIN .130 [3.30] .003.001 [0.080.03] .515 [13.08] FIG. 3 .515 [13.08] .150 [3.81] MAX .062 [1.57] .116 [2.95] .250 [6.35] MIN Offered as a Termination Only! .250 [6.35] .125 [3.18] .250 [6.35] MIN .125 [3.18] .110 [2.79] .003.001 [0.080.03] .060 [1.52] TYP .095 [2.41] PPT 515-30 -- 30 WATTS Flange Mounted PPR 515-30 -- 30 WATTS Flange Mounted FIG. 4 .095 [2.41] .160 [4.06] MAX .062 [1.57] .060 [1.52] TYP .125 [3.18] .250 [6.35] .125 [3.18] .250 [6.35] MIN .116 [2.95] PPT 800-40-3 -- 40 WATTS Flange Mounted PPR 800-40-3 -- 40 WATTS Flange Mounted FIG. 5 .250 [6.35] MIN .130 [3.30] .003.001 [0.080.03] .515 (13.08) .800 [20.32] .560 [14.22] .130 [3.30] THRU 2 PLS .115 [2.92] .120 [3.05] .230 [5.84] .150 [3.81] MIN .400 [10.16] .150 [3.81] MAX .060 [1.52] KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] .040 [1.02] .005.001 [0.130.03] TAB THICKNESS .108 [2.74] SERIES PPR, PPT RESISTORS & TERMINATIONS PHYSICAL DIMENSIONS TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES PPT 800-100A -- 100 WATTS Flange Mounted FIGURES FIG. 6 .130 [3.30] THRU 2 PLS .800 [20.32] .560 [14.22] .115 [2.92] .120 [3.05] .230 [5.84] Offered as a Termination Only! .150 [3.81] MIN .040 [1.02] .005.001 [0.130.03] TAB THICKNESS .400 [10.16] .150 [3.81] MAX .108 [2.74] .060 [1.52] PPT 870-150-3 -- 150 WATTS Flange Mounted PPR 870-150-3 -- 150 WATTS Flange Mounted FIG. 7 .870 [22.10] .560 [14.22] .161 [4.09] THRU 2 PLS .155 [3.94] .375 [9.52] .125 [3.18] MIN .120 [3.05] .187 [4.76] .108 [2.74] .250 [6.35] .003.001 [0.080.03] .160 [4.06] MAX .062 [1.57] PPT 975-250-3 -- 250 WATTS Flange Mounted PPR 975-250-3 -- 250 WATTS Flange Mounted FIG. 8 .975 [24.77] .725 [18.41] .300 [7.62] .125 [3.17] .188 [4.76] .375 [9.52] .125 [3.18] MIN .120 [3.05] .003.001 [0.080.03] .375 [9.53] .200 [5.08] MAX .125 [3.17] THRU 2 PLS .110 [2.79] .171 [4.34] PPT 1250-400 -- 400 WATTS Flange Mounted PPR 1250-400 -- 400 WATTS Flange Mounted FIG. 9 1.250[31.8] .171[4.34] .003.001 [0.080.03] .500 [12.7] .120[3.05] TYP. .160[4.06] DIA TYP. .125 [3.18] MIN. 500[12.7] .250[6.4] .125[3.18] .875 [22.23] KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] .210[5.33] MAX. SERIES PPR, PPT RESISTORS & TERMINATIONS PHYSICAL DIMENSIONS TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES PPT 1900-800 -- 650 WATTS Flange Mounted PPR 1900-800 -- 650 WATTS Flange Mounted FIG. 10 1.900 [48.26] 1.550 [39.37] 1.000 [25.40] .175 [4.45] .125 [3.18] .270 [6.86] 1.040 [26.42] .500 [12.70] .125 [3.18] MIN C L .250 [6.35] .166 [4.22] THRU 4 PLS KEY: Inches [Millimeters] .XX .03 .XXX .010 [.X 0.8 .XX 0.25] 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com .005.001 [0.130.03] .195 [4.95] .250 [6.35] MAX Mounting Application Notes Mounting of High Power Flange Devices When mounting High Power Flange Devices in a circuit, there are several key issues that should be taken into account. Heat Sink Design The heat sink the device is mounted to must be designed to maintain the temperature (design) while it is dissipating the power (heat) given it by the device. (The derating specifications are given in the applicable data sheets.) Flatness of mating surfaces Flatness of the heat sink and of the mounting area of the device (flange) should be 0.001" maximum. The idea is to have the best possible contact between the heat sink and the device. Thermal Compound To fill any microscopic voids or air gaps the use of thermal compound is recommended to a thickness of 0.002" maximum. Stress Relief on Tab Although it is not always possible in High Frequency applications a small loop for stress relief on the solder tab is recommended. This reduces any mechanical stress on the joints. Mounting of Chip Devices Apply a small amount of thermal compound to the mounting area of the flange of the device. Spread it completely on the flange using a razor blade or other smooth tool. When seating the device, align the tab/tabs over the corresponding area on the circuit board. Screw down the device using the recommended torque for the appropriate screw size in the table below. Aeroflex / Inmet recommends the use of a lock washer and a flat washer in the installation. See Figure 1 Thread Size Torque Setting 2-56 4 inch-pounds 4-40 6 inch pounds 6-32 8 inch pounds 8-32 12 inch pounds 10-32 18 inch pounds Solder the tab/tabs using SN63 (179 C eutectic) solder and a small amount of RMA flux. After all the solder is complete all of the flux must now be removed using a cleaning agent. Figure 1: High Power Flange Device Mounting TAB WITH STRESS RELIEF DEVICE THERMAL COMPOUND SUBSTRATE HEATSINK This application note covers the recommended mounting techniques for the proper conduction cooling and RF performance of a surface mounted (flangeless) chip attenuator, termination or resistor. Initial Considerations There are two primary considerations for a surface mounted power device; Power Dissipation and RF Performance. In order to remove the dissipated power from this type chip they must be provided with adequate conductive cooling. This will prevent excessive chip temperatures leading to damage and early failure of the device. RF performance is also dependent on proper mounting. Since these devices are being mounted to a circuit board, inductance to ground is introduced by the vias to the ground plane. To reduce this effect and lower the thermal resistance between the component and ground plane, the following items are recommended: 1. Maximize the use of thermally conductive vias around and under the device. 2. Use of heavy copper cladding (2 oz.) on the circuit board as a heat spreader. Solders Aeroflex / Inmet recommends the use of the solders in the chart below when installing a surface mount chip. Also listed are recommended platings for the heatsink/baseplate that a device might be mounted to instead of a circuit board. Mounting The first step when mounting a chip device to the circuit board is to determine the proper size and location of the solder pads. Aeroflex / Inmet recommends providing pads that are 0.010" to 0.020" over the device's termination size and are centered on the axis of the chip. This allows for selfcentering of the chip and a proper solder fillet formation. Skewing and "tombstoning" can occur if this is not followed. See Figure 2 Preparation 1. Before any solder attachment, parts and circuit boards must be free of any oils or dirt. Isopropyl alcohol can be used for this task. 2. Apply a small amount of RMA flux (MILF-14256) to the areas to be soldered. 3. SN63 solder is generally recommended for use. This may be a preform, solder paste or wire. If preforms are used, select a size that is 0.005"to 0.010" larger than the size of the pad. 4. When soldering is complete the circuit board must be cleaned to remove any flux residue. This can be done in an ultrasonic cleaner or vapor degreaser. Flux manufacturers have recommended solvents or cleaning solutions for their products. Solder Type Liquidous Temp. (degrees C.) Recommended Platings for Heatsink/Baseplates SN63 183 eutectic Nickel, Silver SN96 221 eutectic Nickel, Silver 80Au/20Sn 280 eutectic Gold over Nickel Figure 2: Proper Mounting Techniques DEVICE SURFACE MOUNT Pretinning Pretinning can be done with either a solder pot or by depositing and reflowing solder on the device. (Aeroflex-Inmet can supply pretinned devices, SN63 or SN96). PCB PADS Tabs When attaching tabs to a device we recommend using SN96 (221 C) to attach the tab to the chip. Then, solder the tab to the circuit board using SN63 (183 C). Wire Bonding Attach the device to the circuit board using solder as described above. Clean and remove any flux residues. Ultrasonically bond wire or ribbon to gold termination pads using a wedge or ball bonder. NOTE: Gold plated chips are required for this method. Tuning Maximum VSWR, as specified on the data sheet, can be achieved without additional tuning. Lower VSWR can be achieved with stub or lumped element tuning. However, this can result in a narrower useable bandwidth. OPENING IS APPROXIMATELY THE FILM AREA OF THE CHIP TAB WITH STRESS RELIEF SUBSTRATE DEVICE SUBSTRATE HEATSINK 300 Dino Drive, Ann Arbor, MI 48103 Tel: 888-244-6638 or 734-426-5553 * Fax: 734-426-5557 www.aeroflex.com/inmet * inmetsales@aeroflex.com REV 5/11