Surface Mount Solutions
Surface Mount
Solutions
Attenuators
Resistors
Terminations
GENERAL INFORMATION
These high power devices are designed to dissipate power in RF
circuits when mounted to an appropriate heat sink. The termina-
tions provide a low VSWR under maximum power conditions. The
resistor configurations are typically used in “Wilkinson” type power
divider networks, or to terminate 3 dB stripline or microstrip hybrids.
Aluminum nitride is used for those applications where the use and
disposal of beryllium oxide is a concern.
SERIES ANT, ANR
RESISTORS & TERMINATIONS
High Power, Aluminum Nitride, Thin Film, Drop-in 10-600 Watts, DC-4 GHz
NOTES
1. Input power ratings are based on flange
temperature of 100° C maximum.
2. 50 and 100 Ohms standard. Other values
from 10-500 Ohms available on special order.
Contact factory for details. Standard tolerance ±5%.
Specify resistance value when ordering.
3. VSWR applies to termination style only.
GENERAL SPECIFICATIONS
Resistive Element Thin Film
Substrate Aluminum Nitride
Cover Alumina Ceramic
Mounting Flange Copper, Nickel Plated per QQ-N-290
Tab Beryllium Copper, Gold Plated per MIL-G-4520 4
AVERAGE POWER DERATING CURVE
FLANGE TEMPERATURE °C
POWER DERATING
% OF RATED POWER
100
100 125 150
75
75
50
50
25
25
0
Frequency Input Power VSWR (Typical) Capacitance Figure
Model Range (Watts Avg.) (Note 3) (pF) (Typ.) No.
ANT & ANR 300-10 DC-4.0 GHz 10 1.25:1 1.0 1
ANT & ANR 515-40 DC-2.5 GHz 40 1.15:1 1.0 2
ANT & ANR 515-80 DC-1.0 GHz 80 1.25:1 1.6 2
ANT & ANR 800-100 DC-2.0 GHz 100 1.25:1 1.4 3
ANT & ANR 870-150 DC-2.0 GHz 150 1.25:1 4.5 4
ANT & ANR 975-200 DC-1.0 GHz 200 1.25:1 4.5 5
ANT & ANR 1250-400 DC-500 MHz 400 1.50:1 7.0 6
ANT & ANR 1900-600 DC-500 MHz 600 1.50:1 15.0 7
PERFORMANCE SPECIFICATIONS
.003 .001±
[0.08 0.03]±
.130 [3.3]
.062 [1.57]
.160
MAX
.250 [6.35]
.125 [3.18]
.125 [3.18]
.060 [1.52] TYP
.095 [2.41]
.250 [6.35]
MIN
.515
(13.08)
.250 [6.35]
MIN
.116 [2.95]
PHYSICAL DIMENSIONS
ANT 300-10 10 WATTS
Flange Mounted
ANR 300-10 10 WATTS
Flange Mounted
ANT 515-40 40 WATTS
ANT 515-80 80 WATTS
Flange Mounted
ANR 515-40 40 WATTS
ANR 515-80 80 WATTS
Flange Mounted
FIG. 2
.062 [1.57]
.100 [2.54]
.100 [2.54]
.200 [5.08]
.300 [7.62]
.200 [5.08]
.005 .001 [0.13 0.03]±±
.110 [2.79]
.030 [0.76]
.040 [1.02]
.125 [3.17] MIN
.160 [4.06]
MAX
.116 [ 2.95]
FIG. 1
.005 .001 [0.13 0.03]±±
TAB THICKNESS
.040 [1.02]
.560 [14.22]
.800 [20.32]
.108 [2.74]
.060 [1.52]
.150 [3.81] MAX
.150 [3.81] MIN
.400 [10.16]
.120 [3.05]
.115 [2.92]
.230 [5.84]
.130 [3.30]
THRU 2 PLS
ANT 800-100 100 WATTS
Flange Mounted
ANR 800-100 100 WATTS
Flange Mounted
FIG. 3
REV 04/11
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
TERMINATIONS (ANT) SERIES RESISTORS (ANR) SERIES FIGURES
ANT 870-150 150 WATTS
Flange Mounted
ANR 870-150 150 WATTS
Flange Mounted
ANT 975-200 200 WATTS
Flange Mounted
ANR 975-200 200 WATTS
Flange Mounted
ANT 1900-600 600 WATTS
Flange Mounted
FIG. 4
FIG. 5
FIG. 7ANR 1900-600 600 WATTS
Flange Mounted
.125 [3.18] MIN
.250 [6.35]
1.550 [39.37]
1.000 [25.40]
1.900 [48.26]
1.040
[26.42]
.175 [4.45]
.500 [12.70]
.270 [6.86]
L
C
.195 [4.95]
.125 [3.18]
.166 [4.22]
THRU 4 PLS
.005 .001 [0.13 0.03]±±
.250 [6.35]
MAX
ANT 1250-400 400 WATTS
Flange Mounted
ANR 1250-400 400 WATTS
Flange Mounted
FIG. 6
.200 [5.08] MAX
.375 [9.53]
.110 [2.79]
.300 [7.62]
.125 [3.18] MIN
.975 [24.77]
.375 [9.52]
.725 [18.41]
.120 [3.05]
.125 [3.17]
.171 [4.34]
.125 [3.17]
THRU 2 PLS
.188 [4.76]
.003 .001 [0.08 0.03]±±
.003 .001 [0.08 0.03]±±
.062 [1.57]
.155 [3.94]
.160 [4.06] MAX
.187 [4.76]
.375 [9.52]
.120 [3.05]
.250 [6.35]
.560 [14.22]
.870 [22.10]
.125 [3.18] MIN
.108 [2.74]
.161 [4.09]
THRU 2 PLS
.500
[12.7]
1.250[31.8]
.125
[3.18]
MIN.
500[12.7]
.250[6.4]
.875
[22.23]
.120[3.05]
TYP. .160[4.06]
DIA TYP.
.125[3.18]
.210[5.33]
MAX.
.171[4.34]
.003 .001±
[0.08 0.03]±
PHYSICAL DIMENSIONS
TERMINATIONS (ANT) SERIES RESISTORS (ANR) SERIES FIGURES
SERIES ANT, ANR
RESISTORS & TERMINATIONS
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
When properly mounted on an appropriate heat sink, this chip
device provides high power dissipation capabilities. Ideal
for ferrite isolator applications, the improved thin film design
technology and laser trimming provide proven RF power
capabilities to meet the demands of today's CDMA and
WCDMA system requirements. Aluminum Nitride is featured
for those applications where the use and disposal of Beryllium
oxide is a concern.
Environmentally friendly AlN substrate
High performance, thin film element
Power 100 Watts
New adhesion process results in improved
terminal strength
On-chip matching network improves frequency
performance over the DC-3 GHz frequency range
SPECIFICATIONS
Parameters Specifications
Frequency Range DC to 3 GHz
Power 100 Watts*
VSWR 1.10:1 max
Resistance 50 Ohms +/- 5%
Operating Temperature -55 C to 150 C°°
Substrate Aluminum Nitride
* Refer to average power derating curve chart.
.225 REF
[5,72] REF
.350REF
[8,89]REF
.040 REF
[1,02]
WRAP AROUND
.045
[1,14]
.050
[1,27]
PHYSICAL DIMENSIONS
CHIP BASE TEMP ºC
% OF RATED POWER
25
25
0
50
50
75 100
75
100
125 150
AVERAGE POWER DERATING CURVE
TYPICAL PERFORMANCE
A3RS91.1
High Power Chip Termination
100 Watts
A3RS91.1
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
REV 04/11
GENERAL INFORMATION
When mounted on an appropriate heat sink, these chip devices
provide high power dissipation in terminations and as balancing
resistors in Wilkinson power divider networks. Laser trimming
provides maximum RF power capability. Aluminum nitride
is used for those applications where the use and disposal of
beryllium oxide is a concern.
ORDERING INFORMATION
SERIES ANC
RESISTORS, TERMINATIONS
High Power Chip, Aluminum Nitride 50 & 100 Ohms
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
NOTES
1. Resistance value is expressed using military 4-digit call-out.
50R0 = 50 Ohms
1000 = 100 Ohms
Other values from 10–500 Ohms may be available as special order.
Contact factory for availability.
2. Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS
compliance.
GENERAL SPECIFICATIONS
Solderable Terminals Electroplated Silver over Nickel
Substrate Aluminum Nitride
Resistive Element Thin Film
PHYSICAL DIMENSIONS
TOP
VIEW W
B
T
L
B
TYPE X
(RESISTOR)
T
L
B
TYPE G
(TERMINATION)
50 Ohms
or
100 Ohms
50 Ohms
ONLY
0.005
[0.13]
MAX
A
(FULL FILM) (NARROW FILM)
EXAMPLE: Typical Model No.
NPC T 250-250 XJ
Prefix
Tinning (See Note 2)
Size
Terminal type (X or G)
Ohmic Value (Note 1)
50R0
or
1000
ANC X
Tolerance Key
F= 1%
G = 2%
J = 5% (Standard)
(See Note 1 Below)
H = Sn96
T = Sn63
Capacitance Termination
W L T A B (pF) VSWR Power FREQ.
Model Prefix in [mm] in [mm] in [mm] in [mm] in [mm] Typical Typical CW GHz
ANC 50-50 0.050 [1,27] 0.050 [1,27] 0.010 [0,25] N/A 0.010 [0,25] 0.5 1.25 5 DC-4.0
ANC 50-100 0.050 [1,27] 0.100 [2,5] 0.010 [0,25] N/A 0.020 [0,51] 1.0 1.25 10 DC-2.0
ANC 100-200 0.100 [2,5] 0.200 [5,1] 0.040 [1,02] N/A 0.030 [0,76] 1.0 1.25 10 DC-4.0
ANC 200-200 0.200 [5,1] 0.200 [5,1] 0.040 [1,02] 0.085 [2,2] 0.040 [1,02] 1.2 1.25 30 DC-4.0
ANC 250-250-40 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] 0.085 [2,2] 0.050 [1,27] 1.0 1.15 40 DC-2.5
ANC 250-250-80 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] N/A 0.050 [1,27] 1.6 1.25 80 DC-1.0
ANC 250-375 0.250 [6,4] 0.375 [9,5] 0.040 [1,02] N/A 0.050 [1,27] 4.5 1.25 125 DC-1.0
ANC 350-225 0.350 [8,9] 0.225 [5,7] 0.040 [1,02] 0.045 [1,14] 0.050 [1,27] 1.4 1.25 100 DC-2.0
ANC 375-375 0.375 [9,5] 0.375 [9,5] 0.040 [1,02] 0.250 [6,4] 0.050 [1,27] 4.5 1.25 200 DC-1.0
PERFORMANCE SPECIFICATIONS
REV 04/11
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
GENERAL INFORMATION
Aeroflex / Inmet’s series of High PowerSurface MountTerminations
are ideal for high frequency applications where small size and
low costs are an important design criteria. The ability of these
chips to be directly mounted to the PC Board eliminates the need
for expensive mounting flanges and input tabs. Large solderable
surface areas on the bottom of the chips allows for higher power
dissipation in smaller sizes. All KAC series chips are manufac-
tured using environmentally friendly Aluminum Nitride ceramic
and are classified as RoHS compliant.
ORDERING INFORMATION
SERIES KAC
Surface Mount Terminations (SMT)
High Power, Aluminum Nitride (AlN), 10 - 150 Watts
NOTE
Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS
compliance.
GENERAL SPECIFICATIONS
Substrate Aluminum Nitride
Solderable Terminals Electroplated Silver over Nickel
Resistive Element Proprietary Thick Film
Operating Temperature -55 to +150ºC
Impedance (Nominal) 50 Ohms
PHYSICAL DIMENSIONS
EXAMPLE: Typical Model No.
NPC T 100-200A XG
Prefix
Tinning (Optional)
Size
Terminal type
Ohmic Value
50R0
KAC Z
H = Sn96
T = Sn63
Tolerance, G = 2% (Standard)
PERFORMANCE SPECIFICATIONS
W L T A B C Power Frequency
Model Prefix in (mm) in (mm) in (mm) in (mm) in (mm) in (mm) VSWR CW GHz
KAC 60 – 120A 0.060 (1,52) 0.120 (3,05) 0.025 (0,64) 0.054 (1,37) 0.026 (0,66) 0.013 (0,33) 1.25 10 DC – 4.0
KAC 100 – 200A 0.100 (2,5) 0.200 (5,1) 0.040 (1,02) 0.050 (1.27) 0.025 (0,64) 0.035 (0,89) 1.25 20 DC – 2.5
KAC 250 – 250A 0.250 (6,4) 0.250 (6,4) 0.040 (1,02) 0.040 (1,02) 0.043 (1,09) 0.020 (0,51) 1.25 75 DC 4.0
KAC 250 375A 0.250 (6,4) 0.375 (9,5) 0.040 (1,02) 0.135 (3,43) 0.058
KAC 375 375A 0.375 (9,5) 0.375 (9,5) 0.040 (1,02) 0.125 (3,18) 0.057
(1,47) 0.060 (1,52) 1.25 100 DC – 3.0
(1,48) 0.030 (0,76) 1.25 150 DC – 3.0
REV 04/11
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
GENERAL INFORMATION
The PCX Series High Power Terminations are designed to
dissipate RF power when mounted to a heat sink or chill plate.
Power levels up to 500 watts in 50 ohm impedance are avail-
able in units with SMA or Type N, male or female connectors.
High stability thin film resistive elements on beryllium oxide
substrates are used to insure stable VSWR performance over
temperature and environmental conditions.
SERIES PCX
HIGH POWER COAXIALTERMINATIONS
DC to 6 GHz
NOTES
1. Input power ratings based on case temperature of 85°C maximum.
2. Connectors: SMA - Stainless Steel Passivated per MIL-C-39012,
Type N - Nickel Plated Brass per MIL-C-39012
3. Housing: Copper, Nickel Plated per QQ-N-290
PHYSICAL DIMENSIONS
1.375
[34.93]
.120 [3.05] DIA.
4 HOLES
.125 [3.18]
.960[24.38]
.625
[15.88]
"X"
1.25
[31.8]
"Y"
.090
[2.29]
"Z"
1.25
[31.8]
1.625
[41.28]
2.000
[50.8]
1.250
[31.8]
.215 [5.46] DIA.
4 HOLES
.187 [4.75]
1.625
[41.28]
.875
[22.23]
"X"
.375
[9.53]
1.060
[26.92]
.180
[4.57]
"Y"
OUTLINE A (Shown with SMA)
OUTLINE B (Shown with TYPE N)
MODEL "X" "Y" "Z"
PCX050-F-50 .375 .560 .260
[9.53] [14.22] [6.60]
PCX050-M-50 .507 .560 .260
[12.88] [14.22] [6.60]
PCX050-F-100 .375 .560 .260
[9.53] [14.22] [6.60]
PCX050-M-100 .507 .560 .260
[12.88] [14.22] [6.60]
MODEL "X" "Y"
PCX050-F-150, 250 .375 .515
[9.53] [13.08]
PCX050-M-150, 250 .375 .515
[9.53] [13.08]
PCX100-F-150, 250, 500 .736 .508
[18.69] [12.9]
PCX100-M-150, 250, 500 .819 .508
[20.8] [12.9]
Part Number Input Power (Watts) Frequency Connector Type VSWR Outline
(Note 1) Range (Note 2) (Typical)
PCX050-F-50 50 DC - 6 GHz SMA Female DC-3 GHz: 1.25:1 A
PCX050-M-50 SMA Male 3 - 6 GHz: 1.35:1
PCX050-F-100 100 DC - 3 GHz SMA Female DC- 3 GHz: 1.25:1 A
PCX050-M-100
PCX050-F-150 150 DC - 2 GHz SMA Female DC - 1 GHz: 1.15:1 B
PCX050-M-150 SMA Male
SMA Male
1 - 2 GHz: 1.40:1
PCX100-F-150
PCX100-M-150
PCX050-F-250 250 DC -800 MHz SMA Female DC - 200 MHz: 1.15:1 B
PCX050-M-250 SMA Male 200 - 400 MHz: 1.40:1
PCX100-F-250 N Female
N Female
N Male
N Male
400-800 MHz: 1.30:1
PCX100-M-250
PCX100-M-500 500 DC - 200 MHz N Male DC - 200 MHz: 1.15:1 B
PERFORMANCE SPECIFICATIONS
SMA 50 & 100 WATTS
SMA OR N CONNECTORS
150, 250 & 500 WATTS
REV 04/11
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
GENERAL INFORMATION
When mounted on an appropriate heat sink, these chip devices
provide high power dissipation in terminations and as balancing
resistors in Wilkinson power divider networks. Laser trimming
provides maximum peak and average RF power capability.
ORDERING INFORMATION
SERIES PPC, NPC
RESISTORS, TERMINATIONS
High Power Chip 50 & 100 Ohms
NOTES
1. The “L and “T” dimensions are for the substrate only and do not include
terminal thickness or optional tinning thickness.
2. Thermal Resistance (R°) is measured in °C/W between resistive film and
mounting surface.
3. The CW power rating is based on maximum film temperature of +150°C and with
maximum heatsink temperature of +100°C. Power is based on infinite and ideal
heatsink. Type W” termination style does not have full back plane metallization
and typically handles 1/10 the rated power.
4. Tinnning with Sn96 “Lead Free” high temperature solder will maintain RoHS
compliance.
GENERAL SPECIFICATIONS
Solderable Terminals Electroplated Silver over Nickel (PPC)
Gold over Nickel alloy (NPC)
Substrate Beryllium Oxide Ceramic
Resistive Element Thin Film and Thick Film*
EXAMPLE: Typical Model No.
NPC T 25-50 XJ
Prefix
Tinning (see Note 4)
H = Sn96
T = Sn63
Size
Terminal type (X, W or G)
Ohmic Value (Note A)
50R0
or
1000
PPC
or
NPC X
Tolerance Key
F= 1%
G = 2%
J = 5% (Standard)
(See Note A Below)
WL TB RØ
Model (Note 1) (Note 1) Capacitance C/W Max. C/W Freq.
Prefix in [mm] in [mm] in [mm] in [mm] (pF) Typical (Note 2) Power GHz (**)
*PPC 100-200A 0.100 [2,5] 0.200 [5,1] 0.040 [1,02] 0.030 [0,76] 0.8 0.80 20W DC-4.0
*PPC 250-250A 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] 0.050 [1,27] 1.2 0.30 40W DC-2.5
*PPC 250-375A 0.250 [6,4] 0.375 [9,53] 0.040 [1,02] 0.050 [1,27] 3.5 0.15 150W DC-1.0
NPC 25-50 0.025 [0,64] 0.050 [1,27] 0.010 [0,25] 0.012 [0,305] 0.3 3.90 3W DC-12.4
*NPC 50-50 0.050 [1,27] 0.050 [1,27] 0.010 [0,25] 0.012 [0,305] 0.5 1.90 5W DC-10
*NPC 50-100 0.050 [1,27] 0.100 [2,5] 0.010 [0,25] 0.017 [0,43] 1.0 0.72 10W DC-4.0
NPC 75-150 0.075 [1,91] 0.150 [3,8] 0.010 [0,25] 0.020 [0,51] 1.8 0.29 15W DC-4.0
PERFORMANCE SPECIFICATIONS
NOTE A
Resistance value is expressed using military 4-digit call-out.
50R0 = 50 Ohms
1000 = 100 Ohms
Other values from 10–500 Ohms may be available as special order.
Contact factory for availability.
Physical Dimensions
TOP
VIEW W
B
T
L
B
TYPE X
B
T
L
B
TYPE G
50 Ohms
or
100 Ohms
50 Ohms
ONLY
50 Ohms
or
100 Ohms
B
T
L
B
TYPE W
(Note 3)
0.005[0.13] MAX
* Low cost thick film models available on these sizes. Consult factory for specifications.
** Typical VSWR for all terminations is 1.25:1
REV 04/11
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
°
The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium
Oxide chip and thin film technology to provide devices which
can dissipate up to 100 Watts of RF power. The PPA series
must be thermally bonded to a heat sink, using the mounting
holes provided, in order to operate within the temperature
rating indicated. The flange temperatures must not exceed
100°C under rated power conditions.
ORDERING INFORMATION
The Power Attenuators listed are available in 1 dB increments
from 1 thru 20 dB. Specify by selecting any of the series listed
and add the attenuation value desired to the basic series
designation. (See Note 3)
SERIES PPA
ATTENUATORS
High Power DC-4 GHz
GENERAL SPECIFICATIONS
Impedance 50 Ohms
Operating Temp. –55 °C to +150°C
Attenuation Stability 0.0001 dB/dB/°C
Substrate Beryllium Oxide Ceramic
Resistive Element Proprietary Thin Film
Flange Copper, Nickel Plated per QQ-N-290
Tabs Beryllium Copper, Gold Plated per MIL-G-45204
Cover Alumina Ceramic
.062 [1.58]
.040 [1.02] x
.005 .001 THK±
[0.13 0.03]±
.300 [7.62]
.160 [4.06] MAX.
.105 [2.67]
.100 [2.54] .100 [2.54]
.200 [5.08]
.125 [3.18] MIN.
TYP
PPA10 OUTLINE
.116 [2.95] DIA.
.062 [1.58]
.060 [1.52] x
.003 .001 THK±
[0.08 0.03]±
.515 [13.08]
.150 [3.81] MAX.
.105 [2.67]
.250 [6.35]
.125 [3.18] .125 [3.18]
.250 [6.35] MIN.
TYP
PPA20 OUTLINE
.250 [6.35]
MIN
.116 [2.95] DIA.
.003 .001 [0.08 0.03±±]
.110 [2.79]
.125 [3.18]
.725 [18.42]
.975 [24.77]
.175 [4.45]
.060 [1.52] TYP
.375 [9.52]
.375 [9.53]
.250 [6.35]
MIN TYP
PPA50 OUTLINE
.171 [4.34]
.200 [5.08]
MAX
.125 [3.18]
THRU 2 PLS
.003 .001 [0.08 0.03±±]
.210 [5.33]
MAX
.125 [3.18]
.250 [6.35]
MIN TYP
.500 [12.70]
.060 [1.52] TYP
1.250 [31.75]
.875 [22.23]
.188 [4.76]
.405 [10.29]
.250 [6.35]
.500 [12.70]
PPA100 OUTLINE
.171 [4.34]
.160 [4.06]
THRU PLS
PHYSICAL DIMENSIONS
Attenuation(1) Input Attenuation Accuracy (1)
1 dB Increments Frequency(1) Power (dB) VSWR
Model (dB) Range (Watts) dB DC-1 GHz 1-2.5 GHz 2.5-4 GHz (Typical)
PPA 10 1-20 DC-4 GHz 10 1-10
2
±0.5 ±0.5 ±1.0 1.3:1
11 - 2 0 ±1.0 ±2.0 ±3.0
PPA 20 1-20 DC-4 GHz 20 1-5 ±0.5 ±0.5 ±0.5
6-9 ±0.5 ±0.5 ±1.0 1.15:1 – DC-1.0 GHz
10-15 ±0.75 ±1.0 ±1.5 1.35:1 – 1.0-2.5 GHz
16-20 ±1.0 ±2.0 ±3.0 1.50:1 – 2.5-4.0 GHz
PPA 50 1-20 DC-1 GHz 50 ±0.3 DC-500 MHz 1.25:1 – DC-500 MHz
±0.5 500 MHz-1 GHz 1.50:1 – 500 MHz–1 GHz
PPA 100 1-20 DC-500 MHz 100 ±0.5 1.25:1 – DC-200 MHz
1.50:1 – 200-500 MHz
PERFORMANCE SPECIFICATIONS
PPA 20-10
Desired dB
Value
Basic
Series PPA Power
NOTES
1. Custom products
are available
at higher
frequencies
with optimized
VSWR and
attenuation
accuracy over
narrow frequency
bandwidths.
2. VSWR as measured
in a 0.125” ground
plane stripline circuit.
3. Standard values
1, 2, 3, 4, 5, 6, 10, 20 dB.
Non-std values available
as special order.
REV 04/11
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
FEATURES
Laser Trimmed
Temperature Stable
GENERAL INFORMATION
The PCA and PCAA Series consists of a laser trimmed distrib-
uted thin film element on an alumina ceramic substrate with
solderable terminals. Two sizes are available. The PCA size
operates to 12.4 GHz and the PCAA size operates to 18.0 GHz.
Both sizes are available with leads and wrap around conduc-
tors for ease of installation. The PCAF and PCAAF options are
designed for “flip-chip” application in lower frequency circuits.
PCA & PCAA SERIES DATA
Substrate: 96% Alumina
Solderable Terminals: Electroplated Silver over Nickel
Resistive Element: Proprietary Thin Film
Wrap around Ground Terminal available, “W” option
Wrap around-all terminals—“F” option
Standard values 1, 2, 3, 4, 5, 6, 10, 20 dB
Non-std. values available as special order
ORDERING INFORMATION
The attenuators listed are available in 1 dB increments from 1
through 20 dB. When ordering, to specify the correct part num-
ber for the desired attenuation value, select any of the series
listed and add the attenuation value desired to the basic series
designation.
Options (Note 4)
L = Lead/Tab (Gold Plated BeCu)
W = Wrap around ground only
F = Wrap around all terminals (flip-chip)
T = Tinned terminals (any terminal type) Sn63
H = Tinned terminals (any terminal type) Sn96
G = Gold plated terminals
SERIES PCA, PCAA
ATTENUATORS, CHIP
Low Power DC-18 GHz
NOTES
1. Performance of other dB values vary dependent on attenuation.
Contact factory for specifications for fractional dB values.
2. Performance is based on device mounted in matched 50 Ohm line.
3. Rated power 1.5 Watts input PCA, 100 mw PCAA.
4. Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS
compliance.
GENERAL SPECIFICATIONS
Impedance 50 Ohms
Operating Temperature –55°C to +150°C
Attenuation Stability 0.0001 dB/dB/°C
EXAMPLE:
EXAMPLES:
PCA
or
PCAA (x)
Option(s)
L
W
F
Basic
Series
PCAW-T3
PCAAF-G3
(x)
Option(s)
T
H
G
dB
Value
AVERAGE POWER DERATING CURVE
25
100
75
50
25
0
85 150°C
POWER DERATING
% OF RATED POWER
Attenuation Accuracy (dB) Note 2 VSWR (Typical) Note 2
Increments DC - 4 GHz 4 - 8 GHz 8 - 12.4 GHz 12.4 - 18 GHz DC - 4 GHz 4 - 8 GHz 8 - 12.4 GHz 12.4 - 18 GHz
(dB) PCA, PCAA PCA, PCAA PCA, PCAA PCAA PCA, PCAA PCA, PCAA PCA, PCAA PCAA
Note 1 Series Series Series Series Only Series Series Series Series Only
1 - 3 0.5 0.5 0.5 0.5 1.25 1.35 1.50 1.50
4 - 6 0.5 0.5 0.5 0.75 1.25 1.35 1.50 1.50
7 - 10 0.5 0.5 0.75 1.0 1.25 1.35 1.50 1.50
11 - 15 0.75 +0.5 +0.5 1.25 1.35 1.50
-3.0 -4.0
16 - 20 1.0 +0.5 1.25 1.35
-4.0
PERFORMANCE SPECIFICATIONS
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
±
±
±
±
±
±
±
±
±
±
±
±
±
±
SERIES PCA, PCAA
ATTENUATORS, CHIP
Low Power DC-18 GHz
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
PHYSICAL DIMENSIONS
PCA
PCAA
PCAAL (LEAD/COVER)
PCAL (LEAD/COVER)
PCAW
(WRAP AROUND GROUND TERMINAL ONLY)
PCAF (WRAP AROUND ALL TERMINALS)
PCAAF (WRAP AROUND ALL TERMINALS)
PCAAW
(WRAP AROUND GROUND TERMINAL ONLY)
.025[0.64]
MIN
.060 [1.52]
TYP.
.015[0.38] MIN
.150
[3.8]
.010
[0.25]
GROUND
.125
[3.18]
.150
[3.8]
.125
[3.18]
.250 [6.4]
MIN
.060±.003
[1.52±0.08]
TYP.
.003±.001
[0.08±0.03]
.040 [1.02]
MAX
.060[1.52]
TYP.
.015[0.38]
MIN
.150
[3.8]
.125
[3.18]
.010
[0.25]
.025[0.64]
MIN
.125
[3.18]
.025 MIN
[0.64]
.060 [1.52]
TYP.
.015 [0.38]
MIN
.150
[3.8]
.010
[0.25]
WRAP AROUND GROUND
(SIDE WRAP OPTIONAL)
WRAP AROUND GROUND
MAXIMUM
FREQUENCY
4 GHz
MAXIMUM
FREQUENCY
8 GHz
.025 [0.64]
TYP.
.015[0.38] MIN
.075
[1.9]
.010
[0.25]
GROUND
.060
[1.52]
.020[0.5] TYP..020 [0.5] TYP.
.025 [0.64]
TYP.
.015 [0.38] MIN
.075
[1.9]
.010
[0.25]
WRAP AROUND GROUND
.060
[1.52]
.020 [0.5] TYP.
.025 [0.64]
TYP.
.015 [0.38] MIN
.075
[1.9]
.010
[0.25]
WRAP AROUND GROUND
(SIDE WRAP OPTIONAL)
.060
[1.52]
.075
[1.9]
.060
[1.52]
.250 [6.4]
MIN
.020±.003
[0.5±0.08]
TYP.
.003±.001
[0.08±0.03]
.040 [1.02]
MAX
WRAP
AROUND
TERM TYP
(SIDE WRAP
OPTIONAL)
WRAP AROUND TERM TYP
(SIDE WRAP OPTIONAL)
REV 04/11
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
PPT 300-10-3 10 WATTS
Flange Mounted
PPR 300-10-3 10 WATTS
Flange Mounted
FIG. 1
.062 [1.57]
.100 [2.54]
.100 [2.54]
.200 [5.08]
.300 [7.62]
.200 [5.08]
.005 .001 [0.13 0.03]±±
.110 [2.79]
.030 [0.76]
.040 [1.02]
.125 [3.17] MIN
.160 [4.06]
MAX
.116 [ 2.95]
REV 4/11
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
SERIES PPR, PPT
RESISTORS & TERMINATIONS
High Power, Thin Film, Drop-in 10-650 Watts, DC-4 GHz
NOTES
1. Input power ratings are based on flange temperature of 100° C maximum.
2. 50 and 100 Ohms standard. Other values from 10-500 Ohms available on
special order. Contact factory for details. Standard tolerance ±5%.
Specify resistance value when ordering.
3. VSWR applies to termination style only.
GENERAL SPECIFICATIONS
Resistive Element Thin Film and Thick Film*
Substrate Beryllium Oxide Ceramic
Cover Alumina Ceramic
Mounting Flange Copper,Nickel Plated per QQ-N-290
Tab Beryllium Copper,Gold Plated per MIL-G-45204
AVERAGE POWER DERATING CURVE
FLANGE TEMPERATURE °C
POWER DERATING
% OF RATED POWER
100
100 125 150
75
75
50
50
25
25
0
Frequency Input Power VSWR (Typical) Capacitance Figure
Model Range (Watts Avg.) (Note 3) (pF) (Typ.) No.
PPR & PPT 300-10-3* DC-4.0 GHz 10 1.35:1 —DC-4.0 GHz 0.8 1
PPR & PPT 515-20-3* DC-2.0 GHz 20 1.10:1 —DC-1.0 GHz 0.8 2
1.25:1 —1.0-2.0 GHz
PPT 515-30-4 DC-4.0 GHz 30 1.20:1 —DC-40 GHz 1.2 3
PPR & PPT 515-30* DC-2.0 GHz 30 1.10:1 —DC-1.0 GHz 0.8 4
1.25:1 —1.0-2.0 GHz
PPR & PPT 800-40-3 DC-4.0 GHz 40 1.25:1 —DC-4.0 GHz 1.4
5
PPT 800-100A DC-2.0 GHz 100 1.25:1 —DC-2.0 GHz 1.4 6
PPR & PPT 870-150-3* DC-1.0 GHz 15 0 1.20:1 —DC-500 MHz 3.5 7
1.35:1 —500-1000 MHz
PPR & PPT 975-250-3 DC-1.0 GHz 250 1.25:1 —DC-500 MHz 5.0 8
1.35:1 —500-1000 MHz
PPR & PPT 1250-400 DC-500 MHz 400 1.50:1 —DC-500 MHz 7.0 9
PPR &PPT 1900-800 DC-500 MHz 650 1.25:1 —DC-200 MHz 10.2 10
1.50:1 —200-500 MHz
PERFORMANCE SPECIFICATIONS
GENERAL INFORMATION
These high power devices are designed to dissipate power in
RF
circuits when mounted to an appropriate heat sink. The ter-
minations provide a low VSWR under maximum power condi-
tions. The resistor configurations are typically used in
“Wilkinson” type power divider networks, or to terminate 3 dB
stripline or microstrip hybrids.
* Low cost thick film models available on some sizes.Consult Factory for specifications.
PHYSICAL DIMENSIONS
TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES
FIG. 2PPT 515-20-3 20 WATTS
Flange Mounted
PPR 515-20-3 20 WATTS
Flange Mounted
FIG. 4PPT 515-30 30 WATTS
Flange Mounted
PPR 515-30 30 WATTS
Flange Mounted
FIG. 3PPT 515-30-4 30 WATTS
Flange Mounted
Offered as a
Termination Only!
.005 .001 [0.13 0.03]±±
TAB THICKNESS
.040 [1.02]
.560 [14.22]
.800 [20.32]
.108 [2.74]
.060 [1.52]
.150 [3.81] MAX
.150 [3.81] MIN
.400 [10.16]
.120 [3.05]
.115 [2.92]
.230 [5.84]
.130 [3.30]
THRU 2 PLS
PPT 800-40-3 40 WATTS
Flange Mounted
PPR 800-40-3 40 WATTS
Flange Mounted
PHYSICAL DIMENSIONS
.003 .001±
[0.08 0.03]±
.130 [3.30]
.062 [1.57]
.160 [4.06]
MAX
.250 [6.35]
.125 [3.18]
.125 [3.18]
.060 [1.52] TYP
.095 [2.41]
.250 [6.35]
MIN
.515
[13.08]
.250 [6.35]
MIN
.116 [2.95]
.003 .001±
[0.08 0.03]±
.130 [3.30]
.062 [1.57]
.160 [4.06]
MAX
.250 [6.35]
.125 [3.18]
.125 [3.18]
.060 [1.52] TYP
.095 [2.41]
.250 [6.35]
MIN
.515
(13.08)
.250 [6.35]
MIN
.116 [2.95]
.003 .001±
[0.08 0.03]±
.110 [2.79]
.062 [1.57]
.150 [3.81]
MAX
.250 [6.35]
.125 [3.18]
.125 [3.18]
.060 [1.52] TYP
.095 [2.41]
.250 [6.35]
MIN
.515
[13.08]
.250 [6.35]
MIN
.116 [2.95]
SERIES PPR, PPT
RESISTORS & TERMINATIONS
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
FIG. 5
TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES
.003 .001 [0.08 0.03]±±
.062 [1.57]
.155 [3.94]
.160 [4.06] MAX
.187 [4.76]
.375 [9.52]
.120 [3.05]
.250 [6.35]
.560 [14.22]
.870 [22.10]
.125 [3.18] MIN
.108 [2.74]
.161 [4.09]
THRU 2 PLS
PHYSICAL DIMENSIONS
FIG. 7
FIG. 8
PPT 870-150-3 150 WATTS
Flange Mounted
PPR 870-150-3 150 WATTS
Flange Mounted
PPT 975-250-3 250 WATTS
Flange Mounted
PPR 975-250-3 250 WATTS
Flange Mounted
PPT 1250-400 400 WATTS
Flange Mounted
PPR 1250-400 400 WATTS
Flange Mounted
FIG. 9
.005 .001 [0.13 0.03]±±
TAB THICKNESS
.040 [1.02]
.560 [14.22]
.800 [20.32]
.108 [2.74]
.060 [1.52]
.150 [3.81] MAX
.150 [3.81] MIN
.400 [10.16]
.120 [3.05]
.115 [2.92]
.230 [5.84]
.130 [3.30]
THRU 2 PLS
FIG. 6
Offered as a
Termination Only!
PPT 800-100A 100 WATTS
Flange Mounted
.200 [5.08] MAX
.375 [9.53]
.110 [2.79]
.300 [7.62]
.125 [3.18] MIN
.975 [24.77]
.375 [9.52]
.725 [18.41]
.120 [3.05]
.125 [3.17]
.171 [4.34]
.125 [3.17]
THRU 2 PLS
.188 [4.76]
.003 .001 [0.08 0.03]±±
.500
[12.7]
1.250[31.8]
.125
[3.18]
MIN.
500[12.7]
.250[6.4]
.875
[22.23]
.120[3.05]
TYP. .160[4.06]
DIA TYP.
.125[3.18]
.210[5.33]
MAX.
.171[4.34]
.003 .001±
[0.08 0.03]±
SERIES PPR, PPT
RESISTORS & TERMINATIONS
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES
Flange Mounted Flange Mounted
.125 [3.18] MIN
.250 [6.35]
1.550 [39.37]
1.000 [25.40]
1.900 [48.26]
1.040
[26.42]
.175 [4.45]
.500 [12.70]
.270 [6.86]
L
C
.195 [4.95]
.125 [3.18]
.166 [4.22]
THRU 4 PLS
.005 .001 [0.13 0.03]±±
.250 [6.35]
MAX
PHYSICAL DIMENSIONS
SERIES PPR, PPT
RESISTORS & TERMINATIONS
KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
FIG. 10PPT 1900-800 650 WATTS PPR 1900-800 650 WATTS
TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES
When mounting High Power Flange Devices
in a circuit, there are several key issues that
should be taken into account.
Heat Sink Design
The heat sink the device is mounted to must
be designed to maintain the temperature
(design) while it is dissipating the power
(heat) given it by the device. (The derating
specifications are given in the applicable
data sheets.)
Flatness of mating surfaces
Flatness of the heat sink and of the mount-
ing area of the device (flange) should be
0.001” maximum. The idea is to have the
best possible contact between the heat sink
and the device.
Thermal Compound
To fill any microscopic voids or air gaps the
use of thermal compound is recommended
to a thickness of 0.002” maximum.
Stress Relief on Tab
Although it is not always possible in High
Frequency applications a small loop for
stress relief on the solder tab is recom-
mended. This reduces any mechanical
stress on the joints.
Mounting Application Notes
This application note covers the recom-
mended mounting techniques for the proper
conduction cooling and RF performance
of a surface mounted (flangeless) chip
attenuator, termination or resistor.
Initial Considerations
There are two primary considerations for
a surface mounted power device; Power
Dissipation and RF Performance. In order
to remove the dissipated power from this
type chip they must be provided with
adequate conductive cooling. This will
prevent excessive chip temperatures
leading to damage and early failure of the
device. RF performance is also dependent
on proper mounting. Since these devices
are being mounted to a circuit board,
inductance to ground is introduced by the
vias to the ground plane. To reduce this
effect and lower the thermal resistance
between the component and ground plane,
the following items are recommended:
1. Maximize the use of thermally conduc-
tive vias around and under the device.
2. Use of heavy copper cladding (2 oz.) on
the circuit board as a heat spreader.
Solders
Aeroflex / Inmet recommends the use of the
solders in the chart below when installing a
surface mount chip. Also listed are recom-
mended platings for the heatsink/baseplate
that a device might be mounted to instead
of a circuit board.
Mounting
The first step when mounting a chip device
to the circuit board is to determine the
proper size and location of the solder
pads. Aeroflex / Inmet recommends providing
pads that are 0.010” to 0.020” over the
device’s termination size and are centered
on the axis of the chip. This allows for self-
centering of the chip and a proper solder
fillet formation. Skewing and “tombstoning”
can occur if this is not followed. See Figure 2
Apply a small amount of thermal
compound to the mounting area of
the flange of the device. Spread it
completely on the flange using a razor
blade or other smooth tool. When seating
the device, align the tab/tabs over the
corresponding area on the circuit board.
Screw down the device using the recom-
mended torque for the appropriate screw
size in the table below. Aeroflex / Inmet
recommends the use of a lock washer
and a flat washer in the installation.
See Figure 1
Solder the tab/tabs using SN63 (179° C
eutectic) solder and a small amount of
RMA flux. After all the solder is complete
all of the flux must now be removed using
a cleaning agent.
TAB WITH STRESS RELIEF
THERMAL COMPOUND
DEVICE
HEATSINK
SUBSTRATE
Figure 1: High Power Flange Device Mounting
Thread Size Torque Setting
2-56 4 inch-pounds
4-40 6 inch pounds
6-32 8 inch pounds
8-32 12 inch pounds
10-32 18 inch pounds
Mounting of High Power Flange Devices Mounting of Chip Devices
Preparation
1. Before any solder attachment, parts and
circuit boards must be free of any oils
or dirt. Isopropyl alcohol can be used
for this task.
2. Apply a small amount of RMA flux (MIL-
F-14256) to the areas to be soldered.
3. SN63 solder is generally recommended
for use. This may be a preform, solder
paste or wire. If preforms are used,
select a size that is 0.005”to 0.010
larger than the size of the pad.
4. When soldering is complete the circuit
board must be cleaned to remove any
flux residue. This can be done in an
ultrasonic cleaner or vapor degreaser.
Flux manufacturers have recommended
solvents or cleaning solutions for their
products.
Pretinning
Pretinning can be done with either a solder
pot or by depositing and reflowing solder
on the device. (Aeroflex-Inmet can supply
pretinned devices, SN63 or SN96).
Tabs
When attaching tabs to a device we
recommend using SN96 (22 C) to attach
the tab to the chip. Then, solder the tab to
the circuit board using SN63 (183 ° C).
Wire Bonding
Attach the device to the circuit board
using solder as described above. Clean
and remove any flux residues. Ultrasonically
bond wire or ribbon to gold termination
pads using a wedge or ball bonder.
NOTE: Gold plated chips are required
for this method.
Tuning
Maximum VSWR, as specified on the data
sheet, can be achieved without additional
tuning. Lower VSWR can be achieved
with stub or lumped element tuning.
However, this can result in a narrower
useable bandwidth.
TAB WITH STRESS RELIEF
DEVICE
DEVICE
PCB PADS
SURFACE MOUNT
OPENING IS
APPROXIMATELY
THE FILM AREA
OF THE CHIP
HEATSINK
SUBSTRATE
SUBSTRATE
Figure 2: Proper Mounting Techniques
Solder Type Liquidous Temp. (degrees C.) Recommended Platings for Heatsink/Baseplates
SN63 183 eutectic Nickel, Silver
SN96 221 eutectic Nickel, Silver
80Au/20Sn 280 eutectic Gold over Nickel
300 Dino Drive, Ann Arbor, MI 48103
Tel: 888-244-6638 or 734-426-5553 Fax: 734-426-5557
www.aeroflex.com/inmet inmetsales@aeroflex.com
REV 5/11