Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product information in this catalog is as of October 2015. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-
porating such products, which are caused under the conditions other than those specified in this catalog or indi-
vidual specification.
Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification
is available.
Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-
vance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s ofcial sales channel.
Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may
occur in connection with a third party's intellectual property rights and other related rights arising from your usage
of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.
Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
16
sawfilter_e-E04R01
SAW/FBAR DEVICES for MOBILE COMMUNICATIONS
REFLOW
PARTS NUMBER
(A) Previous Rule (applied products registered on March 31, 2010 or before.)
F A R - D 6 N F - 1 G 9 6 0 0 - P 1 B Z - Z
①Family
②Common sign
③Series name
Code Product Frequency Range[MHz]
D5 Duplexer 700 - 1000
D6 Duplexer 1000 - 5000
J5 Dual Duplexers 700 - 1000
F5 Device 700 - 1000
F6 Device 1000 - 5000
G5 Dual Devices 700 - 1000
G6 Dual Devices 1000 - 5000
④Package code
⑤Product code
⑥Common sign
⑦Frequency
⑧Common sign
⑨Internal code
⑩Internal code
⑪Custom code
⑫Packaging
(B) New Rule (applied to products registered on April 1, 2010 or later.)
D 6 N F 1 G 9 6 0 0 P 1 B Z - Z
①Series name
Code Product Frequency Range[MHz]
D5 Duplexer 700 - 1000
D6 Duplexer 1000 - 5000
J5 Dual Duplexers 700 - 1000
F5 Device 700 - 1000
F6 Device 1000 - 5000
G5 Dual Devices 700 - 1000
G6 Dual Devices 1000 - 5000
*For further details, please contact to TAIYO YUDEN CO., LTD.
②Package code
③Product code
④Frequency
⑤Internal code
⑥Internal code
⑦Custom code
⑧Packaging
EXTERNAL DIMENSIONS
2.5×2.0×0.6 (9pin) 2.0×1.6×0.5 1.4×1.0×0.5
1.1×0.9×0.5 1.8×1.4×0.5 1.5×1.1×0.5
HIGH FREQUENCY PRODUCTS
Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
SAW/FBAR DEVICES for MOBILE COMMUNICATIONS
REFLOW
151
16
PARTS NUMBER
Duplexers
System Part number Package Size[mm] Insertion Loss[dB] Isolation[dB] Remarks
W-CDMA Band 1 D6PE2G140P3AW 2.0×1.6×0.5 1.5/1.6 59/47 9 Pin, B Type Rx : Bal.100ohm
D6DA2G140K2A4 1.8×1.4×0.5 1.8/1.8 56/51 8 Pin, B Type Rx : Bal.100ohm
D6RB2G140E1AJ 1.8×1.4×0.5 1.7/1.8 57/48 8 Pin, B Type Rx : Bal.100ohm
D6RB2G140E1AL 1.8×1.4×0.44 1.7/1.8 57/51 8 Pin, B Type Rx : Bal.100ohm
PCS/W-CDMA Band 2 D6PF1G960M3B6 2.0×1.6×0.57 2.2/2.7 55/52 9 Pin, B Type
D6PF1G960M3B9 2.0×1.6×0.57 2.2/2.7 57/52 9 Pin, B Type
D6PE1G960P3BY 2.0×1.6×0.57 2.0/3.1 57/53 9 Pin, B Type Rx : Bal.100ohm
D6PE1G960P3BP 2.0×1.6×0.57 2.3/3.0 56/52 9 Pin, B Type Rx : Bal.100ohm
D6RB1G960E1HB 1.8×1.4×0.6 2.1/2.9 56/55 8 Pin, B Type Rx : Bal.100ohm
W-CDMA Band 4 D6DA2G132K2D4 1.8×1.4×0.5 1.5/1.7 57/55 8 Pin B Type
D6PE2G132P3DWB 2.0×1.6×0.5 1.8/1.8 55/50 9 Pin, B Type Rx : Bal.100ohm
D6RB2G132E1DF 1.8×1.4×0.5 1.6/1.8 62/54 8 Pin B Type Rx : Bal.100ohm
CDMA/W-CDMA Band 5 FAR-D5PF-881M50-M3E7 2.0×1.6×0.5 1.5/1.8 58/51 9 Pin, A Type
FAR-D5PF-881M50-M3E9 2.0×1.6×0.5 1.5/1.8 58/51 9 Pin, B Type
FAR-D5PE-881M50-P3EZ 2.0×1.6×0.5 1.4/1.7 59/52 9 Pin, B Type Rx : Bal.100ohm
FAR-D5PE-881M50-P3EY 2.0×1.6×0.5 1.4/1.7 59/52 9 Pin, A Type Rx : Bal.100ohm
D5DA881M5K2E4 1.8×1.4×0.5 1.4/1.7 58/59 8 Pin, B Type
D5RB881M5E1BH 1.8×1.4×0.47 1.4/1.7 58/52 8 Pin, B Type Rx : Bal.100ohm
LTE Band 7 D6HL2G655DL06 2.0×1.6×0.54 2.1/2.3 53/57 9 Pin, B Type FBAR
D6HN2G655BN54 2.0×1.6×0.54 1.8/2.6 55/42 9 Pin, B Type Bal.100ohm, FBAR WLAN coexistence Ver.
W-CDMA Band 8 D5PF942M5M3G6 2.0×1.6×0.5 2.1/2.1 57/55 9 Pin, B Type for LTE
D5PF942M5M3G9 2.0×1.6×0.5 1.9/2.2 60/52 9 Pin, B Type
D5DA942M5K2G6 1.8×1.4×0.5 1.7/1.8 58/59 8 Pin, B Type
D5PE942M5P3GT 2.0×1.6×0.5 1.7/2.2 58/54 9 Pin, B Type Rx : Bal.100ohm
D5RB942M5E1CF 1.8×1.4×0.5 1.5/1.9 56/51 8 Pin, B Type Rx : Bal.100ohm
LTE Band 12 D5DA737M5K2H2 1.8×1.4×0.5 1.65/1.65 63/58 8 Pin, B Type
LTE Band 13 D5PE782M0M3P9 2.0×1.6×0.5 1.6/2.0 53/64 9 Pin, B Type
D5DA782M0K2J6 1.8×1.4×0.5 1.65/1.65 63/58 8 Pin, B Type
LTE Band 13+17 Triplexer J5NA782M0P1H6 2.5×2.0×0.6 1.6/1.9 60/53 9 Pin, B Type
LTE Band 17 D5PF740M0M3R9 2.0×1.6×0.5 1.6/1.8 50/50 9 Pin, B Type
D5PE740M0P3NZ 2.0×1.6×0.5 1.9/2.0 63/60 9 Pin, B Type Rx : Bal.100ohm
LTE Band 21 D6PE1G503P3KW 2.0×1.6×0.5 1.6/2.0 55/56 9 Pin, B Type Rx : Bal.100ohm
LTE Band 25 D6HL1G962DL39 2.0×1.6×0.57 2.4/2.9 56/56 9 Pin, B Type FBAR
LTE Band 26 D5PF876M5M3U9 2.0×1.6×0.5 2.0/1.9 50/50 9 Pin, B Type
D5PE876M5P3UZ 2.0×1.6×0.5 2.2/2.6 60/49 9 Pin, B Type Rx : Bal.100ohm
LTE Band 28 D5PF773M0M3Y6 2.0×1.6×0.5 1.8/2.3 60/53 Block A 9Pin, B Type
D5PF788M0M3Y9 2.0×1.6×0.5 1.8/2.4 60/54 Block B 9Pin, B Type
CDMA BC0+BC10 D5PE878M0P3UT 2.0×1.6×0.5 1.9/2.2 59/51 9 Pin, B Type Rx : Bal.100ohm
CDMA/GSM850/Band 5
System Part number Package Size[mm] Insertion Loss[dB] Attenuation[dB] Remarks
CDMA Tx FAR-F5KB-836M50-B4ER 1.4×1.0×0.5 1.7 44 100ohm input
FAR-F5KB-836M50-B4EG 1.4×1.0×0.5 1.6 42 200ohm input
F5QA836M5M2AR 1.1×0.9×0.5 1.9 45 High Att.
CDMA/GSM850 Tx FAR-F5KA-836M50-D4DF 1.4×1.0×0.5 1.9 44 High Att.
CDMA/W-CDMA Band 5 Rx FAR-F5KB-881M50-B4ED 1.4×1.0×0.5 1.5 61 100ohm output
FAR-F5KY-881M50-B4UZ 1.4×1.0×0.5 1.5 61 100ohm, High Att.
FAR-F5KB-881M50-B4EJ 1.4×1.0×0.5 1.4 64 200ohm output
FAR-F5QB-881M50-P2BG 1.1×0.9×0.5 1.5 60 100ohm output
F5QG881M5P2KG 1.1×0.9×0.5 1.5 56 100ohm, High Att., Low Loss
GSM850/CDMA Rx FAR-F5KA-881M50-D4DB 1.4×1.0×0.5 1.7 56 High Att.
FAR-F5QA-881M50-M2AF 1.1×0.9×0.5 1.6 46 -
F5QA881M5M2AU 1.1×0.9×0.5 1.3 51 Low Loss/high Att.
GSM850 Rx FAR-F5KB-881M50-B4EA 1.4×1.0×0.5 1.7 53 150ohm output
FAR-F5QB-881M50-P2BA 1.1×0.9×0.5 1.3 63 150ohm output
CDMA2000 BC0+BC10
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
CDMA2000 BC0+10 Tx F5KA833M0D4DU 1.4×1.0×0.5 2.3 43 High Att.
F5KA833M0D4MG 1.4×1.0×0.5 1.4 20 Low IL
CDMA2000 BC0+10 Rx F5KY878M0B4ND 1.4×1.0×0.5 2.1 53 100ohm output
GSM/EGSM/Band 8
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
EGSM Tx FAR-F5KA-897M50-D4DC 1.4×1.0×0.5 2.2 16 High Att.
FAR-F5KA-897M50-D4VW 1.4×1.0×0.5 2.6 38 High Att.
F5QA897M5M2AC 1.1×0.9×0.5 2.3 18 -
EGSM Rx FAR-F5KA-942M50-D4DD 1.4×1.0×0.5 2.0 34 High Att.
FAR-F5KB-942M50-B4EB 1.4×1.0×0.5 1.6 26 150ohm output
FAR-F5KB-942M50-B4ES 1.4×1.0×0.5 2.4 29 100ohm output
FAR-F5QB-942M50-P2BB 1.1×0.9×0.5 1.6 28 150ohm output
W-CDMA/LTE Band 8 F5KA942M5D4MYB 1.4×1.0×0.5 1.9 53 High Att.
FAR-F5KY-942M50-B4UW 1.4×1.0×0.5 2.0 57 100ohm, High Att.
F5QG942M5P2KB 1.1×0.9×0.5 2.2 56 100ohm, High Att.
F5QG942M5P2KF 1.1×0.9×0.5 2.2 60 100ohm output for LTE
sawfilter_e-E04R01
HIGH FREQUENCY PRODUCTS
Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
152
16
PARTS NUMBER
DCS/Band 3
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
DCS Tx FAR-F6KA-1G7475-D4CY 1.4×1.0×0.5 2.5 30
F6QA1G747M2QS 1.1×0.9×0.5 2.1 22
DCS Rx FAR-F6KA-1G8425-D4CK 1.4×1.0×0.5 2.1 20
FAR-F6KB-1G8425-B4GA 1.4×1.0×0.5 1.5 14 150ohm output
F6QB1G842P2BM 1.1×0.9×0.5 1.8 15 100ohm
F6QB1G842P2BF 1.1×0.9×0.5 1.6 17 150ohm
W-CDMA/LTE Band 3 F6QA1G842M2AN 1.1×0.9×0.5 2.0 38 Unbal.
F6KY1G842B4UM 1.4×1.0×0.5 3.0 50 100ohm, High Att.
F6QG1G842P2KD 1.1×0.9×0.5 3.2 45 100ohm output
PCS/GSM1900/Band 2
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
US-PCS Tx FAR-F6KA-1G8800-L4AF 1.4×1.0×0.5 2.4 35 High Att.
FAR-F6KB-1G8800-B4GS 1.4×1.0×0.5 2.3 28 100ohm input
F6QA1G880M2AQ 1.1×0.9×0.5 1.7 20
US-PCS Rx FAR-F6KA-1G9600-D4MT 1.4×1.0×0.5 3.4 43 High Att.
F6QA1G960M2AP 1.1×0.9×0.5 2.8 39 High Att.
FAR-F6KB-1G9600-B4GP 1.4×1.0×0.5 2.1 23 100ohm output
FAR-F6KY-1G9600-B4UU 1.4×1.0×0.5 2.9 49 100ohm, High Att.
F6KY1G960B4NF 1.4×1.0×0.5 2.8 50 100ohm output
F6QG1G960P2KT 1.1×0.9×0.5 2.8 44 100ohm output
GSM1900/US-PCS Rx FAR-F6KA-1G9600-D4CR 1.4×1.0×0.5 2.0 18
GSM1900 Rx FAR-F6KB-1G9600-B4GB 1.4×1.0×0.5 1.6 18 150ohm output
F6QB1G960P2BK 1.1×0.9×0.5 1.5 15 150ohm output
GSM Dual
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
GSM850+EGSM Rx FAR-G5QC-942M50-N2FB 1.5×1.1×0.5 1.5/1.8 50/29 GSM850 150ohm output EGSM 150ohm output
GSM850+EGSM Rx(Common Input) FAR-G5KT-942M50-Y4RW 1.8×1.4×0.5 1.9/2.2 50/25 GSM850 150ohm output EGSM 150ohm output
GSM850+EGSM Rx (Common Output FAR-G5KW-942M50-Y4YD 1.8×1.4×0.5 2.5/1.8 32/38 EGSM 150ohm output GSM850 150ohm output
EGSM+GSM850 Rx FAR-G5KC-942M50-Y4YW 1.8×1.4×0.5 1.8/1.4 31/54 EGSM 150ohm output GSM850 150ohm output
FAR-G5QC-942M50-N2CD 1.5×1.1×0.5 1.7/1.4 29/51 EGSM 150ohm output GSM850 150ohm output
EGSM+GSM850 Rx(Common Input) FAR-G5KT-942M50-Y4RZ 1.8×1.4×0.5 2.2/1.9 25/52 EGSM 150ohm output GSM850 150ohm output
FAR-G5QD-942M50-N2DB 1.5×1.1×0.5 2.5/2.0 25/55 EGSM 150ohm output GSM850 150ohm output
DCS+GSM1900 Rx FAR-G6QC-1G9600-N2FA 1.5×1.1×0.5 1.9/1.7 17/13 DCS 150ohm output GSM1900 150ohm output
G6QJ1G960M2MB 1.5×1.1×0.5 1.9/1.9 19/19 Rx Dual Unbal
DCS+GSM1900 Rx(Common Input) FAR-G6KT-1G9600-Y4RU 1.8×1.4×0.5 1.8/2.0 18/13 DCS 150ohm output GSM1900 150ohm output
DCS+GSM1900 Rx(Common Input) G6QD1G960N2DY 1.5×1.1×0.5 1.8/1.9 18/14 1 IN 4 OUT 150ohm output
GSM1900+DCS Rx FAR-G6KC-1G9600-Y4YY 1.8×1.4×0.5 1.9/1.8 14/16 GSM1900 150ohm output DCS 150ohm output
G6QC1G960N2CH 1.5×1.1×0.5 1.6/1.6 13/15 GSM1900 150ohm output DCS 150ohm output
GSM1900+DCS Rx(Common Input) G6QN1G960M2RE 1.5×1.1×0.5 2.0/2.3 22/25 Unbal 1in2out
FAR-G6KT-1G9600-Y4RY 1.8×1.4×0.5 1.9/1.8 13/18 GSM1900 150ohm output DCS 150ohm output
GSM1900+DCS Rx(Common Output FAR-G6KW-1G9600-Y4YC 1.8×1.4×0.5 2.2/3.1 13/15 170ohm output for IMC
G6QE1G960N2EC 1.5×1.1×0.5 2.5/2.5 18/13 GSM1900 150ohm output DCS 150ohm output
G6QE1G960N2EE 1.5×1.1×0.5 2.2/2.2 31/14 GSM1900/DCS 150ohm output Low Loss
GSM1900+850 Rx G6QF1G960N2GA 1.5×1.1×0.5 1.6/1.4 14/54 GSM1900 150ohm output GSM850 150ohm output
GPS
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
GPS FAR-F6KA-1G5754-L4AJ 1.4×1.0×0.5 0.9 - Low loss, High Att.
F6QA1G575H2JF 1.1×0.9×0.5 0.96 - Low loss, High Att.
FAR-F6KB-1G5754-B4GE 1.4×1.0×0.5 1.1 - 100ohm, Low loss
FAR-F6KB-1G5754-B4GU 1.4×1.0×0.5 1.2 - 100ohm, High Att.
GPS/GNSS FAR-F6KA-1G5859-D4MS 1.4×1.0×0.5 1.0/1.2 - -
F6QA1G585M2AT 1.1×0.9×0.5 1.1/1.4 - -
FAR-F6KB-1G5859-B4HR 1.4×1.0×0.5 1.1/1.4 - 100ohm output
F6QB1G585P2BQ 1.1×0.9×0.5 1.5/1.7 - 100ohm output
GPS+GLONASS+Galileo+Compass F6KA1G581D4JR 1.4×1.0×0.5 1.6 - -
F6QA1G581M2QZ 1.1×0.9×0.5 1.1/1.4 - -
F6QA1G582H2JM 1.1×0.9×0.5 1.2/1.8 - Ladder High Att.
F6BG1G582R6TT 1.1×0.9×0.44 1.7 - 100ohm output
sawfilter_e-E04R01
HIGH FREQUENCY PRODUCTS
Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
153
16
PARTS NUMBER
W-CDMA
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
W-CDMA Band 1 Tx FAR-F6KA-1G9500-D4DG 1.4×1.0×0.5 1.6 38 Low loss, High Att.
FAR-F6KB-1G9500-B4GJ 1.4×1.0×0.5 2.1 34 100ohm output
F6QA1G950M2AA 1.1×0.9×0.5 1.8 38 Low loss, High Att.
W-CDMA Band 1/4 Rx FAR-F6KA-2G1400-D4CG 1.4×1.0×0.5 1.9 39 Unbal.
FAR-F6KB-2G1400-B4GC 1.4×1.0×0.5 1.7 39 100ohm output
FAR-F6KA-2G1400-D4DW 1.4×1.0×0.5 1.9 48 High Att.
FAR-F6KY-2G1400-B4UY 1.4×1.0×0.5 1.8 64 100ohm, High Att.
F6QA2G140M2AM 1.1×0.9×0.5 1.9 46 Unbal.
F6QG2G140P2KA 1.1×0.9×0.5 1.7 55 100ohm, High Att.
W-CDMA Band 1+2 Rx G6QL2G140M2PA 1.5×1.1×0.5 1.9/3.0 48/41 Rx Div Unbal.
W-CDMA Band 2+1 Rx G6QH2G140N2LP 1.5×1.1×0.5 3.2/2.3 53/54 2 (1.9G)100ohm out 1 (2G)100ohm out
W-CDMA Band 4 Tx FAR-F6KA-1G7400-D4DE 1.4×1.0×0.5 1.5 44
W-CDMA Band 5+8 Rx G5QH942M5N2LN 1.5×1.1×0.5 1.6/20 56/50 100ohm output
W-CDMA Band 8+5 Rx(Common Output) G5QT942M5N2VA 1.5×1.1×0.5 2.3/2.0 48/48 100ohm output
W-CDMA Band 7 Tx F6KA2G535L4AM 1.4×1.0×0.5 1.6 30 Unbal.
W-CDMA/LTE Band 7 Rx FAR-F6KY-2G6550-B4UN 1.4×1.0×0.5 2.8 54 100ohm. High Att.
F6QG2G655P2KE 1.1×0.9×0.5 2.5 52 100ohm. High Att.
W-CDMA Band 9 Tx FAR-F6KA-1G7675-D4CT 1.4×1.0×0.5 1.8 31 Unbal.
W-CDMA Band 9 Rx FAR-F6KB-1G8625-B4GT 1.4×1.0×0.5 2.1 40 100ohm output
LTE Band 12 Tx F5KA707M5D4JW 1.4×1.0×0.5 1.6 23 Unbal.
LTE Band 12 Rx F5KY737M0B4NN 1.4×1.0×0.5 1.4 57 100ohm output
LTE Band 13 Tx FAR-F5KA-782M00-D4VP 1.4×1.0×0.5 1.5 55 Unbal.
F5QA782M0M2AZ 1.1×0.9×0.5 1.5 56 Unbal.
LTE Band 13 Rx FAR-F5KY-751M00-B4UQ 1.4×1.0×0.5 1.6 50 100ohm output
F5QA751M0M2QM 1.1×0.9×0.5 1.9 50 Unbal.
LTE Band 17 Tx FAR-F5KA-710M00-D4VQ 1.4×1.0×0.5 1.2 32 Unbal.
F5QA710M0M2AY 1.1×0.9×0.5 1.3 33 Unbal.
LTE Band 17 Rx FAR-F5KY-740M00-B4UR 1.4×1.0×0.5 1.4 60 100ohm output
F5QG740M0P2KH 1.1×0.9×0.5 1.4 65 100ohm output
LTE Band 18 Tx F5KA822M5D4VR 1.1×0.9×0.5 1.6 40 Unbal.
LTE Band 18+5 (BC0) Tx F5KA832M0D4JS 1.4×1.0×0.5 1.5 19 Unbal.
LTE Band 20 Tx F5KA847M0D4ML 1.4×1.0×0.5 1.7 52 Unbal.
LTE Band 20 Rx F5KY806M0B4NE 1.4×1.0×0.5 2.5 45 100ohm output
F5QA806M0M2QE 1.1×0.9×0.5 2.7 41 Unbal.
LTE Band 21 Rx F6KY1G503B4NS 1.4×1.0×0.5 1.4 47 100ohm output Low loss
F6QA1G503M2QF 1.1×0.9×0.5 2.0 52 Unbal.
LTE Band 25 Tx F6QA1G882M2AS 1.1×0.9×0.5 1.8 23 Unbal.
LTE Band 26 Rx F5QG876M5P2KQ 1.1×0.9×0.5 2.2 59 100ohm output
LTE Band 28 Rx F5QA773M0M2QC 1.1×0.9×0.5 2.1 52 Block A
F5QA788M0M2QB 1.1×0.9×0.5 2.0 52 Block B
LTE Band 29 Rx F5BA722M5M6UW 1.1×0.9×0.44 1.6 38 Unbal.
TD LTE Bnad 38 Tx F6KA2G595A4VL 1.4×1.0×0.5 1.5 - Input Power +29dBm
TD LTE Bnad 38 Rx F6QA2G595M2QK 1.1×0.9×0.5 1.9 -
F6KB2G595B4HS 1.4×1.0×0.5 2.6 - 150ohm output
F6QB2G595P2BS 1.1×0.9×0.5 2 - Balanced 100ohm
TD LTE Band 38+40(Common output) G6QE2G595N2EJ 1.5×1.1×0.5 2.9/2.8 - Balanced 100ohm
TD LTE Band 40 Tx F6HF2G350AF41 1.4×1.0×0.6 2.3 - Input Power +29dBm FBAR
TD LTE Band 40 Rx F6QA2G350M2QA 1.1×0.9×0.5 2.2 -
F6KB2G350B4HT 1.4×1.0×0.5 2.7 - 150ohm output
F6KB2G350B4HTB 1.4×1.0×0.5 2.5 - Balanced 100ohm
Band 41 F6KA2G605A4LA 1.4×1.0×0.5 2.4 - Unbal High power design 2555-2655MHz BW100MHz
F6HP2G593AP20 2.0×1.6×0.6 2.9 - Unbal High power design 2496-2690MHz BW194MHz
Other
System Part number Package Size[mm Insertion Loss[dB] Attenuation[dB] Remarks
ISM900(B.W.26MHz) FAR-F5QA-915M00-M2AK 1.1×0.9×0.5 1.8 -
TD-SCDMA/TD-LTE Band 34 FAR-F6KA-2G0175-D4DR 1.4×1.0×0.5 1.8 - High Att
TD-SCDMA/TD-LTE Band 39 FAR-F6KA-1G9000-D4DS 1.4×1.0×0.5 1.6 -
TD-SCDMA Band 34+39 G6QJ2G017M2MD 1.5×1.1×0.5 1.3/1.4 - 2 IN/2 OUT
G6QE2G017N2EU 1.5×1.1×0.5 1.8/1.8 - Balanced 100ohm
G6QN2G017M2RD 1.5×1.1×0.5 1.6/2.0 - 1 IN/2 OUT
G6QN2G017M2RF 1.5×1.1×0.5 1.5/1.8 - 1 IN/2 OUT Good Shape Factor
TD-SCDMA Band 39+34(Common input) G6QD2G017N2DU 1.5×1.1×0.5 1.7/2.0 - Balanced 100ohm
TD-SCDMA Band 34+39(Common input) G6QD2G017N2DC 1.5×1.1×0.5 2.2/1.8 - Balanced 200ohm
Wireless LAN FAR-F6KA-2G4418-D4CU 1.4×1.0×0.5 2.6 - +10dBm
FAR-F6KA-2G4418-A4VA 1.4×1.0×0.5 3.0 - +23dBm
FAR-F6KA-2G4500-A4VD 1.4×1.0×0.5 1.9 - Low IL,+19dBm
F6KA2G436A4VE 1.4×1.0×0.5 2.5 - BW=72MHz,+24dBm
F6KA2G466A4VJ 1.4×1.0×0.5 2.8 - BW=68MHz,+24dBm
F6HF2G441AF46 1.4×1.0×0.6 1.6 - 2402.5-2481.5MHz Input Power +28dBm FBAR
sawfilter_e-E04R01
HIGH FREQUENCY PRODUCTS
Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
154
16
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
emifilter_pack_e-E02R01
MULTILAYER EMI SUPPRESSION FILTERS
PACKAGING
①Minimum Quantity
Taped package
Type Thickness
mm(inch)
Standard Quantity [pcs]
Embossed tape
FK 2125(0805) 1.0(0.039) 3000
②Tape material
Embossed Tape
Top tape
Base tape
Sprocket hole
Chip cavity
Chip filled
Chip
③Taping dimensions
Embossed tape 8mm wide
Type Chip cavity Insertion pitch Tape thickness
A B F K T
FK 2125(0805) 1.5±0.2
(0.059±0.008)
2.3±0.2
(0.091±0.008)
4.0±0.1
(0.157±0.004)
2.0 max.
(0.079 max.)
0.3 max.
(0.012 max.)
Unit : mm(inch)
④Leader and Blank portion
Blank portion Chip cavity Blank portion Leader
160mm or more
(6.3inches or more)
Direction of tape feed
100mm or more
(3.94inches or more)
400mm or more
(15.7inches or more)
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
emifilter_pack_e-E02R01
⑤Reel size
E
C
D
R B
t
A
W
A B C D E R t W
φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0 2.5max. 10±1.5
Unit:mm
⑥Top tape strength
The top tape requires a peel;-off force of 0.1~0.7N in the direction of the arrow as illustrated below.
0~15° Top tape
Base tape
Pull direction
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
sawfilter_reli_e-E02R01
Filter
RELIABILITY DATA
1. Terminal stregth
Specified Value No damage to be found.
Test Methods and
Remarks
Bending Test.
according to IEC60068-2-21(JISC60068-2-21)
2. Mechanical shock
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks
Apply 14700m/s2 for 0.5ms 5 times for each of 6 directions.
according to IEC68-2-27(JISC60068-2-27).
3. Vibration
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks
With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s2 of acceleration at 55 to 500Hz, apply a
vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)
4. Drop 1
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks Drop 3 times onto concrete floor from the height of 1.0m.
5. Drop 2
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.
6. Temperature cycling
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks Temp. range -40 to +100℃. 500cycle.
7. Static humidity
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks +85℃, 90% to 95%RH, apply DC5V, 1000hours.
8. High temperature storage life
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks +100℃, 1000hours.
9. Low temperature storage life
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks -40℃, 1000hours.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
sawfilter_reli_e-E02R01
10. Solderbility 1
Specified Value More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Test Methods and
Remarks Lead-free Solder paste, Reflow;Peak temperature 245℃
11. Solderbility 2
Specified Value More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Test Methods and
Remarks Sn-Pb Solder paste, Reflow;Peak temperature 235℃
12. Solder heat resistance
Specified Value After testing, meet the specified characteristics at a room temperature.
A change of the remarkable appearance do not have it.
Test Methods and
Remarks
◆Recommended temperature profile of reflow soldering
Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.
Suitable condition for solder heating is differed depending on composition and manufacturing method.
Please contact to solder manufacturer for the details.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
sawfilter_reli_e-E02R01
Duplexer
RELIABILITY DATA
1. Terminal stregth
Specified Value No damage to be found.
Test Methods and
Remarks
Bend width 4mm, hold for 5±1 sec.
according to IEC60068-2-21(JISC60068-2-21)
2. Mechanical shock
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks
Apply 14700m/s2 for 0.5ms 5 times for each of 6 directions.
according to IEC68-2-27(JISC60068-2-27).
3. Vibration
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks
With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s2 of acceleration at 55 to 500Hz, apply a
vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)
4. Drop 1
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks Drop 3 times onto concrete floor from the height of 1.0m.
5. Drop 2
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.
6. Temperature cycling
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks Temp. range -40 to +100℃. 500cycle.
7. Static humidity
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks +85℃, 90% to 95%RH, apply DC5V, 1000hours.
8. High temperature storage life
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks +100℃, 1000hours.
9. Low temperature storage life
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks -40℃, 1000hours.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
sawfilter_reli_e-E02R01
10. High Temperature Bias
Specified Value After testing, meet the specified characteristics at a room temperature.
Test Methods and
Remarks +50℃, +29dBm, 50000hours.
11. Solderbility 1
Specified Value More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Test Methods and
Remarks Lead-free Solder paste, Reflow;Peak temperature 245℃
12. Solderbility 2
Specified Value More than 90% of area of terminals to be covered with the solder.
A change of the remarkable appearance do not have it.
Test Methods and
Remarks Sn-Pb Solder paste, Reflow;Peak temperature 235℃
13. Solder heat resistance
Specified Value After testing, meet the specified characteristics at a room temperature.
A change of the remarkable appearance do not have it.
Test Methods and
Remarks
◆Recommended temperature profile of reflow soldering
Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.
Suitable condition for solder heating is differed depending on composition and manufacturing method.
Please contact to solder manufacturer for the details.