ISO-CMOS MT8806 8 x 4 Analog Switch Array Features * * * * * * * * * * ISSUE3 Internal control latches and address decoder Short set-up and hold times Wide operating voltage: 4.5V to 13.2V 12Vpp analog signal capability RON 65 max. @ VDD=12V, 25C RON 10 @ VDD=12V, 25C Full CMOS switch for low distortion Minimum feedthrough and crosstalk Separate analog and digital reference supplies Low power consumption ISO-CMOS technology Applications * * * * * * Key systems PBX systems Mobile radio Test equipment/instrumentation Analog/digital multiplexers Audio/Video switching CS STROBE Ordering Information MT8806AE 24 Pin Plastic DIP MT8806AP 28 Pin PLCC -40 to 85C Description The Zarlink MT8806 is fabricated in Zarlink's ISOCMOS technology providing low power dissipation and high reliability. The device contains a 8 x 4 array of crosspoint switches along with a 5 to 32 line decoder and latch circuits. Any one of the 32 switches can be addressed by selecting the appropriate five address bits. The selected switch can be turned on or off by applying a logical one or zero to the DATA input. VSS is the ground reference of the digital inputs. The range of the analog signal is from VDD to VEE. Chip Select (CS) allows the crosspoint array to be cascaded for matrix expansion. DATA RESET 1 March 1997 VDD VEE VSS 1 AX0 AY0 5 to 32 Decoder 8 x 4 Switch Array Latches AY1 AY2 32 **************** AX1 Xi I/O (i=0-3) 32 ******************* Yi I/O (i=0-7) Figure 1 - Functional Block Diagram 3-9 ISO-CMOS VDD Y3 Y4 Y5 Y6 Y7 RESET STROBE AY2 AY1 AY0 VEE NC DATA X0 AX0 X1 AX1 X2 5 6 7 8 9 10 11 * 12 13 14 15 16 17 18 24 23 22 21 20 19 18 17 16 15 14 13 25 24 23 22 21 20 19 Y5 Y6 Y7 RESET STROBE AY2 NC CS X3 VSS VEE AY0 AY1 NC 1 2 3 4 5 6 7 8 9 10 11 12 Y2 Y1 Y0 DATA X0 AX0 X1 AX1 X2 CS X3 VSS 4 3 2 1 28 27 26 NC Y0 Y1 Y2 VDD Y3 Y4 MT8806 28 PIN PLCC 24 PIN PLASTIC DIP Figure 2 - Pin Connections Pin Description Pin # Name Description PDIP PLCC 1-3 1-3 Y2-Y0 Y2-Y0 Analog (Inputs/Outputs): these are connected to the Y2-Y0 columns of the switch array. 4 6 DATA DATA (Input): a logic high input will turn on the selected switch and a logic low will turn off the selected switch. Active High. 5 7 X0 6 8 AX0 7 9 X1 8 10 AX1 9 11 X2 X2 Analog (Input/Output): this is connected to the X2 row of the switch array. 10 12 CS Chip Select (Input): this is used to select the device. Active High. 11 13 X3 X3 Analog (Input/Output): this is connected to the X3 row of the switch array. 12 14 VSS Digital Ground Reference. 13 15 VEE Negative Power Supply. 14-16 X0 Analog (Input/Output): this is connected to the X0 row of the switch array. X0 Address Line (Input). X1 Analog (Input/Output): this is connected to the X1 row of the switch array. X1 Address Line (Input). 16,17, AY0-AY2 Y0 -Y2 Address Lines (Inputs). 20 17 21 18 22 RESET Master RESET (Input): this is used to turn off all switches regardless of the condition of CS. Active High. 19-23 23-27 Y7-Y3 Y7-Y3 Analog (Inputs/Outputs): these are connected to the Y7-Y3 columns of the switch array. 24 28 VDD 4, 5, 18, 19 NC 3-10 STROBE STROBE (Input): enables function selected by address and data. Address must be stable before STROBE goes high and DATA must be stable on the falling edge of the STROBE. Active High. Positive Power Supply. No Connect. ISO-CMOS MT8806 Functional Description Address Decode The MT8806 is an analog switch matrix with an array size of 8 x 4. The switch array is arranged such that there are 8 columns by 4 rows. The columns are referred to as the Y inputs/outputs and the rows are the X inputs/outputs. The crosspoint analog switch array will interconnect any X I/O with any Y I/O when turned on and provide a high degree of isolation when turned off. The control memory consists of a 32 bit write only RAM in which the bits are selected by the address inputs (AY0-AY2, AX0 & AX1). Data is presented to the memory on the DATA input. Data is asynchronously written into memory whenever both the CS (Chip Select) and the STROBE inputs are high and is latched on the falling edge of STROBE. A logical "1" written into a memory cell turns the corresponding crosspoint switch on and a logical "0" turns the crosspoint off. Only the crosspoint switches corresponding to the addressed memory location are altered when data is written into memory. The remaining switches retain their previous states. Any combination of X and Y inputs/ outputs can be interconnected by establishing appropriate patterns in the control memory. A logical "1" on the RESET input will asynchronously return all memory locations to logical "0" turning off all crosspoint switches regardless of whether CS is high or low. Two voltage reference pins (VSS and VEE) are provided for the MT8806 to enable switching of negative analog signals. The range for digital signals is from VDD to VSS while the range for analog signals is from VDD to VEE. VSS and VEE pins can be tied together if a single voltage reference is needed. The five address inputs along with the STROBE and CS (Chip Select) inputs are logically ANDed to form an enable signal for the resettable transparent latches. The DATA input is buffered and is used as the input to all latches. To write to a location, RESET must be low and CS must go high while the address and data are set up. Then the STROBE input is set high and then low causing the data to be latched. The data can be changed while STROBE is high, however, the corresponding switch will turn on and off in accordance with the DATA input. DATA must be stable on the falling edge of STROBE in order for correct data to be written to the latch. 3-11 MT8806 ISO-CMOS Absolute Maximum Ratings*- Voltages are with respect to VEE unless otherwise stated. Parameter Symbol Min Max Units 1 Supply Voltage VDD VSS -0.3 -0.3 15.0 VDD+0.3 V V 2 Analog Input Voltage VINA -0.3 VDD+0.3 V 3 Digital Input Voltage VIN VSS-0.3 VDD+0.3 V 4 Current on any I/O Pin 15 mA 5 Storage Temperature +150 C 6 Package Power Dissipation 0.6 W I TS PLASTIC DIP -65 PD * Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Recommended Operating Conditions - Voltages are with respect to VEE unless otherwise stated. Characteristics Sym Min Typ Max Units TO -40 25 85 C 1 Operating Temperature 2 Supply Voltage VDD VSS 4.5 VEE 13.2 VDD-4.5 V V 3 Analog Input Voltage VINA VEE VDD V 4 Digital Input Voltage DC Electrical VIN VSS VDD V - Voltages are with respect to V =V =0V, V =12V unless otherwise stated. Characteristics EE SS DD Characteristics 1 Test Conditions Sym Quiescent Supply Current Min IDD 2 Off-state Leakage Current (See G.9 in Appendix) IOFF 3 Input Logic "0" level VIL Typ Max Units Test Conditions 1 100 A All digital inputs at VIN=VSS or VDD 0.4 1.5 mA All digital inputs at VIN=2.4 + VSS ; VSS =7.0V 5 15 mA All digital inputs at VIN=3.4V 1 500 nA IVXi - VYjI = VDD - VEE See Appendix, Fig. A.1 0.8+VS V VSS =7.5V; VEE=0V VSS =6.5V; VEE=0V S 4 Input Logic "1" level VIH 2.0+VSS V 5 Input Logic "1" level VIH 3.3 V 6 Input Leakage (digital pins) ILEAK 0.1 A 10 All digital inputs at VIN = VSS or VDD DC Electrical Characteristics are over recommended temperature range. Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing. DC Electrical Characteristics- Switch Resistance - VDC is the external DC offset applied at the analog I/O pins. Characteristics Sym 25C Typ Max 70C Typ Max 85C Typ Units Test Conditions Max 1 On-state VDD=12V Resistance VDD=10V VDD= 5V (See G.1, G.2, G.3 in Appendix) RON 45 55 120 65 75 185 75 85 215 80 90 225 VSS=VEE=0V,VDC=VDD/2, IVXi-VYjI = 0.4V See Appendix, Fig. A.2 2 Difference in on-state resistance between two switches (See G.4 in Appendix) RON 5 10 10 10 VDD=12V, VSS=VEE=0, VDC=VDD/2, IVXi-VYjI = 0.4V See Appendix, Fig. A.2 3-12 ISO-CMOS MT8806 AC Electrical Characteristics - Crosspoint Performance - Voltages are with respect to VDD=5V, VSS=0V, VEE=-7V, unless otherwise stated. Characteristics 1 2 3 4 5 6 Switch I/O Capacitance Feedthrough Capacitance Frequency Response Channel "ON" 20LOG(VOUT/VXi)=-3dB Total Harmonic Distortion (See G.5, G.6 in Appendix) Feedthrough Channel "OFF" Feed.=20LOG (VOUT/VXi) (See G.8 in Appendix) Crosstalk between any two channels for switches Xi-Yi and Xj-Yj. Sym Typ Min Max Units CS CF F3dB 20 0.2 45 pF pF MHz THD 0.01 % FDT -95 dB Xtalk -45 dB -90 dB -85 dB -80 dB Xtalk=20LOG (VYj/VXi). (See G.7 in Appendix). 7 Propagation delay through switch tPS 30 ns Test Conditions f=1 MHz f=1 MHz Switch is "ON"; VINA = 2Vpp sinewave; RL = 1k See Appendix, Fig. A.3 Switch is "ON"; VINA = 2Vpp sinewave f= 1kHz; RL=1k All Switches "OFF"; VINA= 2Vpp sinewave; f= 1kHz; RL= 1k. See Appendix, Fig. A.4 VINA=2Vpp sinewave f= 10MHz; RL = 75. VINA=2Vpp sinewave f= 10kHz; RL = 600. VINA=2Vpp sinewave f= 10kHz; RL = 1k. VINA=2Vpp sinewave f= 1kHz; RL = 10k. Refer to Appendix, Fig. A.5 for test circuit. RL=1k; CL=50pF Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details. Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing. Crosstalk measurements are for Plastic DIPS only, crosstalk values for PLCC packages are approximately 5dB better. AC Electrical Characteristics - Control and I/O Timings- Voltages are with respect to VDD=5V, VSS=0V, VEE=-7V, unless otherwise stated. Min Typ Characteristics Sym Max 1 Control Input crosstalk to switch (for CS, DATA, STROBE, Address) CXtalk 30 mVpp 2 3 4 5 6 7 8 9 10 11 12 13 14 Digital Input Capacitance Switching Frequency Setup Time DATA to STROBE Hold Time DATA to STROBE Setup Time Address to STROBE Hold Time Address to STROBE Setup Time CS to STROBE Hold Time CS to STROBE STROBE Pulse Width RESET Pulse Width STROBE to Switch Status Delay DATA to Switch Status Delay RESET to Switch Status Delay CDI FO tDS tDH tAS tAH tCSS tCSH tSPW tRPW tS tD tR 10 pF MHz ns ns ns ns ns ns ns ns ns ns ns 20 10 10 10 10 10 10 20 40 40 50 35 100 100 100 Units Test Conditions VIN=3V squarewave; RIN=1k, RL=10k. See Appendix, Fig. A.6 f=1MHz RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, RL= 1k, CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF CL=50pF Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details. Digital Input rise time (tr) and fall time (tf) = 5ns. Typical figures are at 25C and are for design aid only; not guaranteed and not subject to production testing. Refer to Appendix, Fig. A.7 for test circuit. 3-13 MT8806 ISO-CMOS tCSS tCSH 50% 50% tRPW CS 50% RESET 50% tSPW STROBE 50% 50% 50% tAS ADDRESS 50% 50% tAH DATA 50% 50% tDS tDH ON SWITCH* OFF tS tD tR tR Figure 3 - Control Memory Timing Diagram * See Appendix, Fig. A.7 for switching waveform AX0 AX1 AY0 AY1 AY2 Connection 0 0 0 0 0 X0-Y0 0 0 1 0 0 X0-Y1 0 0 0 1 0 X0-Y2 0 0 1 1 0 X0-Y3 0 0 0 0 1 X0-Y4 0 0 1 0 1 X0-Y5 0 0 0 1 1 X0-Y6 0 0 1 1 1 X0-Y7 1 1 0 0 0 1 0 1 0 1 X1-Y0 X1-Y7 0 0 1 1 0 1 0 1 0 1 X2-Y0 X2-Y7 1 1 1 1 0 1 0 1 0 1 X3-Y0 X3-Y7 Table 1. Address Decode Truth Table 3-14 Package Outlines 3 2 1 E1 E n-2 n-1 n D A2 A L C eA b2 e eC eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 8-Pin 16-Pin 18-Pin 20-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max Min 0.210 (5.33) Max 0.210 (5.33) A2 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) C 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014(0.356) 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014 (0.356) D 0.355 (9.02) 0.400 (10.16) 0.780 (19.81) 0.800 (20.32) 0.880 (22.35) 0.920 (23.37) 0.980 (24.89) 1.060 (26.9) D1 0.005 (0.13) E 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) E1 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.005 (0.13) 0.005 (0.13) 0.005 (0.13) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) L 0.115 (2.92) eB eC 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) NOTE: Controlling dimensions in parenthesis ( ) are in millimeters. General-8 0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.430 (10.92) 0 0.060 (1.52) 0.150 (3.81) 0.430 (10.92) 0 0.060 (1.52) Package Outlines 3 2 1 E1 E n-2 n-1 n D A2 A L C eA b2 e eB b Notes: D1 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) Plastic Dual-In-Line Packages (PDIP) - E Suffix DIM 22-Pin 24-Pin 28-Pin 40-Pin Plastic Plastic Plastic Plastic Min A Max Min 0.210 (5.33) Max Min 0.250 (6.35) Max Min 0.250 (6.35) Max 0.250 (6.35) A2 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) b 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) b2 0.045 (1.15) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) C 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) D 1.050 (26.67) 1.120 (28.44) 1.150 (29.3) 1.290 (32.7) 1.380 (35.1) 1.565 (39.7) 1.980 (50.3) 2.095 (53.2) D1 0.005 (0.13) E 0.390 (9.91) 0.005 (0.13) 0.430 (10.92) E E1 0.330 (8.39) 0.380 (9.65) E1 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.290 (7.37) .330 (8.38) 0.485 (12.32) 0.580 (14.73) 0.246 (6.25) 0.254 (6.45) 0.005 (0.13) 0.600 (15.24) 0.670 (17.02) 0.600 (15.24) 0.670 (17.02) 0.485 (12.32) 0.580 (14.73) 0.485 (12.32) 0.580 (14.73) e 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) eA 0.400 BSC (10.16) 0.600 BSC (15.24) 0.600 BSC (15.24) 0.600 BSC (15.24) eA 0.300 BSC (7.62) eB L 0.430 (10.92) 0.115 (2.93) 0.160 (4.06) 0.115 (2.93) 0.200 (5.08) 15 Shaded areas for 300 Mil Body Width 24 PDIP only 15 0.115 (2.93) 0.200 (5.08) 15 0.115 (2.93) 0.200 (5.08) 15 Package Outlines F A G D1 D2 D H E E1 e: (lead coplanarity) A1 Notes: 1) Not to scale 2) Dimensions in inches 3) (Dimensions in millimeters) 4) For D & E add for allowable Mold Protrusion 0.010" I E2 20-Pin 28-Pin 44-Pin 68-Pin 84-Pin Dim Min Max Min Max Min Max Min Max Min Max A 0.165 (4.20) 0.180 (4.57) 0.165 (4.20) 0.180 (4.57) 0.165 (4.20) 0.180 (4.57) 0.165 (4.20) 0.200 (5.08) 0.165 (4.20) 0.200 (5.08) A1 0.090 (2.29) 0.120 (3.04) 0.090 (2.29) 0.120 (3.04) 0.090 (2.29) 0.120 (3.04) 0.090 (2.29) 0.130 (3.30) 0.090 (2.29) 0.130 (3.30) D/E 0.385 (9.78) 0.395 (10.03) 0.485 (12.32) 0.495 (12.57) 0.685 (17.40) 0.695 (17.65) 0.985 (25.02) 0.995 (25.27) 1.185 (30.10) 1.195 (30.35) D1/E1 0.350 (8.890) 0.356 0.450 0.456 0.650 0.656 0.950 0.958 1.150 1.158 (9.042) (11.430) (11.582) (16.510) (16.662) (24.130) (24.333) (29.210) (29.413) D2/E2 0.290 (7.37) 0.330 (8.38) 0.390 (9.91) 0.430 (10.92) 0.590 (14.99) 0.630 (16.00) 0.890 (22.61) 0.930 (23.62) 1.090 (27.69) 1.130 (28.70) e 0 0.004 0 0.004 0 0.004 0 0.004 0 0.004 F 0.026 (0.661) 0.032 (0.812) 0.026 (0.661) 0.032 (0.812) 0.026 (0.661) 0.032 (0.812) 0.026 (0.661) 0.032 (0.812) 0.026 (0.661) 0.032 (0.812) G 0.013 (0.331) 0.021 (0.533) 0.013 (0.331) 0.021 (0.533) 0.013 (0.331) 0.021 (0.533) 0.013 (0.331) 0.021 (0.533) 0.013 (0.331) 0.021 (0.533) H I 0.050 BSC (1.27 BSC) 0.020 (0.51) 0.050 BSC (1.27 BSC) 0.020 (0.51) 0.050 BSC (1.27 BSC) 0.020 (0.51) Plastic J-Lead Chip Carrier - P-Suffix General-10 0.050 BSC (1.27 BSC) 0.020 (0.51) 0.050 BSC (1.27 BSC) 0.020 (0.51) For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or its subsidiaries (collectively "Zarlink") is believed to be reliable. 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Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2001, Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE