PC929 Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC929)
2. Approved by VDE (VDE0884) (as an option) file No.
94626 (as model No. PC929)
3. Package resin : UL flammability grade (94V-0)
■ Features
■ Agency approvals/Compliance
1. Inverter
■ Applications
High Speed, Built-in Short
Protection Circuit, Gate Drive
SMD 14 pin ∗OPIC Photocoulper
1. 14 pin Half pitch type (Lead pitch : 1.27 mm)
2. Double transfer mold package
(Ideal for Flow Soldering)
3. Built-in IGBT shortcircuit protector circuit
4. Built-in direct drive circuit for IGBT drive
(Peak output current : IO1P, IO2P : MAX. 0.4 A)
5. High speed responce (tPLH, tPHL : MAX. 0.5 µs)
6. High isolation voltage (Viso(rms) : 4.0 kV)
■ Description
PC929 Series contains an IRED optically coupled to
an OPIC chip.
It is packaged in a Mini-flat, Half pitch type (14 pin).
Input-output isolation voltage(rms) is 4.0kV. High
speed responce (tPLH, tPHL : MAX. 0.5 µs).
1Sheet No.: D2-A06301EN
Date Nov. 28. 2003
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC929 Series
∗
"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
■ Internal Connection Diagram
■ Truth table
2
Sheet No.: D2-A06301EN
■ Outline Dimensions (Unit : mm)
PC929 Series
Input
ON
OFF
C input-output
Low level
Low level
High level
High level
O2 output
High level
Low level
Low level
Low level
FS output
High level
Low level
High level
At operating protection function
High level
1
2
3
4
5
6
7
Cathode
Cathode
Anode
NC∗
NC∗
NC∗
NC∗
8
9
10
11
12
13
14
FS
C
GND
O2
GND ∗ No. to pin shall be shorted in the device.
O1
VCC
Amp.
Voltage regulator
IGBT protection
circuit
Interface
1 2 3 4 5 6 7
89
1011
12
13
14
4 7
1. SMT Gullwing Lead-Form [ex. PC929P] 2. SMT Gullwing Lead-Form (VDE0884 option)
[ex. PC929PY]
Product mass : approx. 0.47g
1.27±0.25
PC929
6.5±0.5
Date code
9.22±0.5
0.6±0.1
3.5±0.5
7.62±0.3
Epoxy resin
0.35±0.25
0.26±0.1
8
71
14
Primary side mark
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
1.27±0.25
PC929
6.5±0.5
SHARP
mark "S"
Date code
9.22±0.5
0.6±0.1
3.5±0.5
7.62±0.3
Epoxy resin
0.35±0.25
0.26±0.1
8
71
V
DE
4
14
VDE0884 Identification mark
Primary side mark
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A06301EN
PC929 Series
Country of origin
Japan
Sheet No.: D2-A06301EN
■ Electro-optical Characteristics
Parameter Symbol MIN. TYP. MAX. Unit
Input
Forward voltage Ta=25˚C, IF=0.2mA
Reverse current
Terminal capacitance Ta=25˚C, V=0, f=1kHz
Output
Supply voltage Ta=−10 to +60˚C
−
O1 Low level output voltage
O2 High level output voltage
O2 Low level output voltage
O1 leak current
High level supply current
Low level supply current Ta=25˚C, VCC=VO1=24V, IF=0
VCC=VO1=24V, IF=0
V
V
µA
pF
V
V
V
V
µA
mA
mA
mA
mA
Ta=25˚C, IF=10mA
Ta=25˚C, VR=5V
Ta=25˚C, VCC=VO1=24V, IF=5mA
VCC=VO1=24V, IF=5mA
−
−
−
15
15
−
20
−
−
−
−
−
−
1.2 −
10
250
30
24
0.4
2.0
500
17
19
18
20
1.75
Conditions
VF1
VF2
IR
Ct
VCC
VO1L
VO2H
VO2L
IO1L
ICCH
ICCL
V
CC1
=12V, V
CC2
=−12V, I
O1
=0.1A, I
F
=5mA
V
CC
=V
O1
=24V, I
O2
=−0.1A, I
F
=5mA
VCC=24V, IO2=0.1A, IF=0
Ta=25˚C, VCC=VO1=35V, IF=0
*8
*9
*9
*9
*9
*9
*9
*9
*9
−
30
−
−
22
V
V−
0.2
1.2
−
10
−
11
−
1.6
1.5
(unless otherwise specified Ta=Topr)
*8 It shall connect a by-pass capacitor of 0.01 µF or more between VCC (pin 13 ) and GND (pin, 10 , 14) near the device, when it measures the transfer characteristics and the
output side characteristics.
*9 FS=OPEN, VC=0
■ Absolute Maximum Ratings
Parameter Symbol Rating Unit
Input
Forward current mA
Reverse voltage V
Output
Supply voltage V
O1 output current A
A
O2 output current A
A
O1 output voltage V
Power dissipation
Overcurrent detection voltage
Overcurrent detection current
Error signal output voltage
Error signal output current
mW
V
mA
V
mA
Total power dissipation mW
Operating temperature ˚C
Storage temperature ˚C
IF
VR
VCC
IO1
IO1P
IO2
IO2P
VO1
PO
VC
IC
VFS
IFS
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*2
*1
O
1
peak output current
*3
*3
*4
O
2
peak output current
*5
*6Isolation voltage
Soldering temperature
*1 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.15
*2 Ta =25˚C
*3 Pulse width≤0.15µs, Duty ratio : 0.01
*4.5 The derating factors of a absolute maximum ratings due to ambient temperature
are shown in Fig.16
*6 AC for 1minute, 40 to 60 %RH, Ta =25˚C, f=60Hz
*7 For 10s
20
6
35
0.1
0.4
0.1
0.4
35
500
VCC
30
VCC
20
550
4.0
−25 to +80
−55 to +125
260
kV
*7
(unless otherwise specified Ta=Topr)
4
PC929 Series
Sheet No.: D2-A06301EN
5
PC929 Series
Parameter Symbol MIN. TYP. MAX. Unit
Transfer characteristicsProtection outputError signal output Overcurrent
detection
T
a
=25˚C,V
CC
=
V
O1
=
24V, FS=OPEN, V
C
=0
VCC=VO1=24V, FS=OPEN, VC=0
Isolation resistance
Rise time
Fall time
Overcurrent detection voltage
Overcurrent detection
voltage hysteresis width
O2 "High→Low" propagation delay
time at overcurrent protection
O2 "High→Low" output voltage
at overcurrent protection
Error signal output pulse width
O2
Fall time at
o
vercurrent protection
Low level error signal voltage
High level error signal voltage
Instantaneous common mode
rejection voltage
(High level output)
Instantaneous common mode
rejection voltage
(Low level output)
mA
mA
Ω
µs
µs
µs
µs
kV/µs
kV/µs
V
V
µs
µs
V
V
µA
µs
µs
"
Low
→
High
"
input threshold current
Ta=25˚C,
VCC=VO1=24V, IF=5mA,
RG=47Ω, CG=3 000pF
FS=OPEN, VC=0
Ta=25˚C, VCM=600V(p-p)
IF=5mA, VCC=VO1=24V,
∆VO2H=2.0V, FS=OPEN, VC=0
Ta=25˚C, VCM=600V(p-p)
IF=0, VCC=VO1=24V,
∆VO2L=2.0V, FS=OPEN, VC=0
Ta=25˚C
VCC=VO1=24V
IF=5mA, RG=47Ω
CG=3 000pF, FS=OPEN
Ta=25˚C, IF=5mA
VCC=VO1=24V
IFS=10mA, RG=47Ω
CG=3 000pF, C=OPEN
Ta=25˚C
VCC=VO1=24V, IF=5mA
VFS=24V, RG=47Ω
CG=3 000pF, VC=0
Ta=25˚C, VCC=VO1=24V
IF=5mA, RFS=1.8kΩ
RG=47Ω, RC=1kΩ
CG=3 000pF, CP=1 000pF
Ta=25˚C
VCC=VO1=24V
IF=5mA,
RG=47Ω, CG=3 000pF,
RC=1kΩ, CP=3 000pF
FS=OPEN
5×1010
−
−
−
−
−1.5
1.5
VCC−6.5
1
2
−
−
−
−
20
−
0.3
0.2
−
0.5
0.5
−
−
VCC−5.5
3
10
−
2
0.4
100
5
−
3.0
5.0
0.5
0.5
Conditions
"Low→High" propagation delay time
"High→Low" propagation delay time
Response time
IFLH
RISO
tPLH
tPHL
tr
tf
CML
VCTH
VCHIS
tPCOHL
tPCOtf
VOE
VFSL
IFSH
tPCFHL
∆tFS
CMH
Ta=25˚C, DC=500V, 40 to 60%RH
−
1011
0.2
0.2
1.5
0.3
0.3
−
−
VCC−6
2
4
5
−
0.2
−
1
35
*11
*12
(unless otherwise specified Ta=Topr)
*10
Error signal "High→Low"
propagation delay time
*10
It shall connect a by-pass capacitor of 0.01 µF or more between V
CC
(pin
13 )
and GND (pin
10
,
14
) near the device, when it measures the device, when it measures the
overcurrent characteristics, Protection output characteristics, and Error signal output characteristics.
*11 IFLH represents forward current when output goes from "Low" to "High"
*12 VCTH is the of C(pin 9 ) voltage when output becomes from "High" to "Low"
Sheet No.: D2-A06301EN
■ Model Line-up
PC929 PC929Y
−−−−−− Approved
Lead Form
Package
Model No.
VDE0884
PC929P PC929PY
−−−−−− Approved
Taping
SMT Gullwing
1 000pcs/reel
Sleeve
50pcs/sleeve
6
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
PC929 Series
Sheet No.: D2-A06301EN
Fig.6 Test Circuit for High Level / Low Level
Supply Current
Fig.5 Test Circuit for "Low→High" Input
Threshold Current
7
PC929 Series
Fig.1 Test Circuit for O1 Low Level Output
Voltage
Fig.2 Test Circuit for O2 High Level Output
Voltage
Fig.3 Test Circuit for O2 Low Level Output
Voltage
Fig.4 Test Circuit for O1 Leak Current
3
2
1
13
12
11
10
9
8
14
V
PC929
IF
VO1L
VCC1
VCC2
IO1
13
12
11
10
9
8
14
V
PC929
IFVO2L
VCC
IO2
3
2
1
13
12
11
10
9
8
14
V
PC929
IF
variable
VO2
VCC
3
2
1
13
12
11
10
9
8
14
V
PC929
IFV02H
VCC
IO2
3
2
1
13
12
11
10
9
8
14
PC929
IF
VCC
IO1L
A
3
2
1
13
12
11
10
9
8
14
PC929
IF
VCC
ICC
A
3
2
1
Sheet No.: D2-A06301EN
8
PC929 Series
Fig.7
Test Circuit for Instantaneous Common
Mode Rejection Voltage
Fig.8 Test Circuit for Response Time
Fig.9
Test Circuit for Overcurrent Detection Voltage,
Overcurrent Detection Voltage Hysteresis
Fig.10 Test Circuit for O2 Output Voltage at
Overcurrent Protection
13
12
11
10
9
8
14
V
PC929 VO2
VCC
SW
B
GND
GND
+−
∆VO2L
VO2L
∆VO2H
VO2H
A
VCM
VCM waveform
VCM
(peak)
CMH, VO2 waveform
SW at A, IF=5mA
CML, VO2 waveform
SW at B, IF=0mA
3
2
1
13
12
11
10
9
8
14
PC929
RG
CG
VCC
VIN
tr=tf=0.01µs
Pulse width 5µs
Duty ratio 50%
tPLH tPHL
tf
tr
10%
90%
VOUT waveform
50%
50%
VIN waveform
3
2
1
VVOUT
1 2
3
13
12
11
10
9
8
14
PC929
RG
CG
VCC
IFVVO2
VVCTH
13
12
11
10
9
8
14
PC929
RG
RC
CG
VCC
IFVVO2
VC
CP
1 2
3
Sheet No.: D2-A06301EN
Fig.12 Test Circuit for High Level Error
Signal Current
Fig.11 Test Circuit for O1 Low Level
Error Signal Voltage
9
PC929 Series
Fig.14
Error Signal "High
→
Low" propagation Delay
Time, Error Signal Output Pulse Width
Fig.13
Test Circuit for O
2
"High→Low" Propagation
Delay Time at Overcurrent Protection, O
2
Fall
Time at Overcurrent Protection
13
12
11
10
9
8
14
PC929
RG
CG
VCC
IF
IFS
V
VFSL
3
2
1
13
12
11
10
9
8
14
PC929
RG
CG
VCC
IF
A
VFS
IFSH
3
2
1
V
13
12
11
10
9
8
14
PC929 VOUT
RG
RC
CG
CP
VCC
VIN
tr=tf=0.01µs
Pulse width 25µs
Duty ratio 25%
3
2
1V
13
12
11
10
9
8
14
PC929
RG
RFS
CG
VCC
VIN
tr=tf=0.01µs
Pulse width 25µs
Duty ratio 25%
RC
3
21
VOUT
IF
(Input current)
90%
50%
10%
tpCOHL
VOE
tpCOTF
90% Error detection threshold voltage (VCTH)
10%
∆tFS
50% 50%
C
(Detecting terminal)
FS
(Error signal output)
tpCFHL
VO2
(O2 output voltage)
Sheet No.: D2-A06301EN
10
PC929 Series
Fig.15 Forward Current vs. Ambient
Temperature
Fig.17 Forward Current vs. Forward
Voltage
Fig.16 Power Dissipation vs. Ambient
Temperature
Fig.19
"Low→High" Relative Input Threshold
Current vs. Ambient Temperature
Ambient temperature Ta (˚C)
Power dissipation Po, Ptot (mW)
−25 0 25 50 75 100 125
0
100
200
300
400
500
550
600
80
Ptot
PO
1.0
0.01
0.1
1
10
100
1.2 1.4 1.6 1.8 2.0 2.2
Forward voltage VF (V)
Forward current IF (mA)
50˚C
25˚C
70˚C
Ta=0˚C
0.4
0.0
0.2
0.6
0.8
1.6
1.0
1.2
1.4
−25 0 25 50 75 100
Relative input threshold current IFLH
VCC=24V
Ambient temperature Ta (°C)
IFLH = 1 at Ta=25°C
60
50
40
30
20
10
0
025507580100 125−25
Forward current IF (mA)
Ambient temperature Ta (°C)
Fig.20 O1 Low Level Output Voltage vs.
O1 Output Current
1
0.1
0.01
0.001
0.01 0.1 1
Ta=25°C
VCC1=12V
VCC2=−12V
IF=5mA
O1 low level output voltage VO1L (V)
O1 output current IO1 (A)
Fig.18 "Low
→
High" Relative Input Threshold
Current vs. Supply Voltage
1.6
1.4
1.2
1.0
0.6
15 18 21 24 27 30
0.8
Ta=25°C
Relative input threshold current IFLH
Supply voltage VCC (V)
Value of V
CC
=24V assumes 1.
Sheet No.: D2-A06301EN
11
PC929 Series
Fig.26 O2 Low Level Output Voltage vs.
Ambient Temperature
Fig.24 O2 High Level Output Voltage vs.
Ambient Temperature
Fig.23 O2 High Level Output Voltage vs.
Supply Voltage
24
23
22
21
20
19
−25 0 25 50 75 100
Ambient temperature Ta (°C)
O2 high level output voltage VO2H (V)
IO2=0A
VCC=24V
IF=5mA
IO2=−0.1A
0.8
0.9
1
1.1
1.2
1.3
−25 0 25 50 75 100
Ambient temperature Ta (°C)
O2 low level output voltage VO2L (V)
VCC=24V
IF=5mA
IO2=−0.1A
35
30
25
20
15
10
5
15 18 21 24 27 30
O2 high level output voltage VO2H (V)
Supply voltage VCC (V)
Ta=25°C
IF=5mA
IO2=−0.1A
Fig.22 O1 Leak Current vs. Ambient
Temperature
−25
10−6
10−7
10−8
10−9
10−10
0255075100
Ambient temperature Ta (°C)
O1 leak current IO1L (A)
VCC=VO1=35V
IF=0mA
Fig.21 O1 Low Level Output Voltage vs.
Ambient Temperature
−25 0 25 50 75 100
0.20
0.15
0.10
0.05
0.00
Ambient temperature Ta (°C)
O1 low level output voltage VO1L (V)
VCC1=12V
VCC2=−12V
IF=5mA
IO1=0.1A
Fig.25 O2 Low Level Output Voltage vs.
O2 Output Current
10
1
0.1
0.01
0.01 0.1 1
O2 low level output voltage VO2L (V)
O2 output current IO2 (A)
VCC=24V
Ta=25°C
Sheet No.: D2-A06301EN
12
PC929 Series
Fig.30 Propagation Delay Time vs.
Ambient Temperature
Fig.29 Propagation Delay Time vs. Forward
Current
Fig.31 Overcurrent Detecting Voltage vs.
Ambient Temperature
0.1
0.2
0.3
0.4
0.5
0
Propagation delay time tPHL, tPLH (µs)
tPLH
tPHL
VCC=24V
RG=47Ω
CG=3 000pF
IF=5mA
−25 0 25 50 75 100
Ambient temperature Ta (°C)
30
25
15
10
5
0
20
Overcurrent detecting voltage VCTH (V)
VCC=24V
RG=47Ω
CG=3 000pF
IF=5mA
−25 0 25 50 75 100
Ambient temperature Ta (°C)
1.0
0.6
0.7
0.8
0.9
0.5
0.4
0.3
0.2
0.1
0
051015 20 25
Forward current IF (mA)
Propagation delay time tPHL, tPLH (µs)
tPLH
tPHL
Ta=25°C
IF=5mA
RG=47Ω
CG=3 000pF
Fig.27 High Level Supply Current vs. Supply
Voltage
Fig.28 Low Level Supply Current vs.
Supply Voltage
18
16
14
12
10
8
6
Low level supply current ICCL (mA)
15 18 21 24 27 30
Supply voltage VCC (V)
Ta=25˚C
Ta=80˚C
IF=0mA
Ta=−25˚C
16
14
12
10
8
6
4
Ta=25˚C
Ta=80˚C
High level supply current ICCH (mA)
15 18 21 24 27 30
Supply voltage VCC (V)
IF=5mA
Ta=−25˚C
0
10
8
6
4
2
tPCOHL
tPCOtf
O
2
output fall time at protection from overcurrent t
PCOtf
/
O
2
"H-L" delay time at protection from overcurrent t
PCOHL
(µs)
VCC=24V
IF=5mA
RG=47Ω
CG=3 000pF
RC=1kΩ
CP=1 000pF
−25 0 25 50 75 100
Ambient temperature Ta (°C)
Fig.32 O2 Output Fall Time at Protection from Overcurrent/O2 "High-Low"
Propagation Delay Time at Protection from Overcurrent vs. Ambient Temperature
Sheet No.: D2-A06301EN
13
PC929 Series
VCC=24V
IF=5mA
RG=47Ω
CG=3 000pF
RC=1kΩ
CP=1 000pF
2.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
−25 0 25 50 75 100
Ambient temperature Ta (°C)
O2 output voltage at protection from
overcurrent primary side mark VOE (V)
0
0.1
0.2
0.3
0.4
0.5
Low level error signal voltage VFSL (V)
VCC=24V
IF=5mA
IFS=10mA
RG=47Ω
CG=3 000pF
C=OPEN
−25 0 25 50 75 100
Ambient temperature Ta (°C)
10−6
10−7
10−8
10−9
High level error signal current IFSH (A)
VCC=24V
IF=5mA
RG=47Ω
CG=3 000pF
VC=0
−25 0 25 50 75 100
Ambient temperature Ta (˚C)
Fig.34
O
2
Output Voltage at Protection from
Overcurrent vs. Ambient Temperature
Fig.36 High Level Error Signal Current vs.
Ambient Temperature
Fig.35 Low Level Error Signal Voltage vs.
Ambient Temperature
0
1.5
1.2
0.9
0.6
0.3
Error signal "H-L" propagation delay time tPCFHL (µs)
VCC=24V
IF=5mA
RFS=1.8kΩ
RG=47Ω
CG=3 000pF
RC=1kΩ
CP=1 000pF
−25 0 25 50 75 100
Ambient temperature Ta (˚C)
Fig.33
Error Signal "High-Low" Propagation
Delay Time vs. Ambient Temperature
Fig.37 Error signal output pulse width vs.
Ambient Temperature
0
50
40
30
20
10
Error signal output pulse width ∆tFS (µs)
VCC=24V
IF=5mA
RFS=1.8kΩ
RG=47Ω
CG=3 000pF
RC=1kΩ
CP=1 000pF
−25 0 25 50 75 100
Ambient temperature Ta (°C)
Fig.38 Overcurrent Detecting Voltage vs.
Supply Voltage
0
5
10
15
20
25
Added resistance=0Ω
0.5kΩ
1kΩ
1.5kΩ
Overcurrent detecting voltage VCTH (V)
15 18 21 24 27 30
Supply voltage VCC (V)
Ta=25˚C
IF=5mA
VCC=24V
RG=47Ω
CG=3 000pF
RC=1kΩ
FS=OPEN
CP=1 000pF
Sheet No.: D2-A06301EN
14
PC929 Series
Fig.40 Example of The Application Circuit (IGBT Drive for Inverter)
Fig.39 Overcurrent Detecting Voltage - Supply Voltage Characteristics Test Circuit
Anode
Cathode
PC929
VCC
O1
O2
C
FS
GND
RG
RC
VO2
CPCG
VCC
VC
Added resistance
IF
V
V
• In order to stabilize the power supply line, we recommend to locate a bypass capacitor CB (0.01µF or more)
between VCC and GND near photocoupler.
• In order to stabilize the detecting voltage of pin-C, we recommend to locate a capacitor CP (approximately
1 000pF) between pin-C and GND, and a resistor RC (approximately 1.0kΩ) between VCC and pin-C.
However, the rise time of the detection voltage at Pin-C varies along with the time constants of CP and RC.
So, please make sure the device works properly in actual conditions.
• For the diode D, which is located between pin-C and collector of IGBT, we recommend to use a diode that
has the withstand voltage characteristic equivalent to IGBT and also has little leak current.
• In order to prevent the failure mode or breakdown of pin-C from VCE variation of IGBT, we recommend to
locate a resistor R2 (approximately 10kΩ) and a diode D1 at near pin-C, and a resistor R3 (approximately
50kΩ) and a diode D2 at between pin-C and GND.
This application circuit shows the general example of a circuit, and is not a design guarantee
for right operation.
PC929
Anode
Cathode
TTL, microcomputer,
etc.
VCC
O1
O2
C
CB
Cp
FS
GND
RG
RC
R2
D2
D1
R3
R1
RFS
PC817X etc.
To microcomputer
+
CFS
(+)
(−)
Power supply
Cathode
+
VCC1=12V
VCC2=12V
Sheet No.: D2-A06301EN
15
PC929 Series
Fig.41 Operations of Shortcircuit Protector Circuit
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
1. Detection of increase in VCE(sat) of IGBT due to overcurrent by means of C terminal (pin )
2. Reduction of the IGBT gate voltage, and suppression of the collector current
3.
Simultaneous output of signals to indicate the shortcircuit condition (FS signal) from FS
(pin )
terminal to
the microcomputer
4. J
udgement and processing by the microcomputer In the case of instantaneous shortcircuit, run continues.
At fault, input to the photocoupler is cut off, and IGBT is
turned OFF.
9
8
Anode
TTL, microcomputer, etc. Amp.
Constant voltage circuit
PC929
IGBT protector
circuit
VCC
Tr. 1
Tr. 2
Typ. 150kΩ
O1
O2
C
VC
FS
GND
Feedback to primary side
Cathode
Cathode
VCC
RG
RC
CP
VEE
IGBT
3
2
8
9
1014
11
12
13
1
Interface
Sheet No.: D2-A06301EN
16
PC929 Series
■ Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
We recommed to use approximately 1 000pF of capacitor between C-pin and GND in order to prevent miss
opration by noise.
In the case that capacitor is used approximately 1kΩ of resistance shall be recommended to use between
VCC and C-pin However, the rise time of C-pin shall be changed by time constant of added CR, so that
please use this device after confirmation.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Design guide
Sheet No.: D2-A06301EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
17
PC929 Series
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5years)
into the design consideration.
Please decide the input current which become 2times of MAX. IFLH.
● Recommended Foot Print (reference)
1.8
1.27 1.27 1.27 1.27 1.27 1.27
0.8
9.0
(Unit : mm)
Sheet No.: D2-A06301EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
18
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC929 Series
Sheet No.: D2-A06301EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
● Presence of ODC
19
PC929 Series
Sheet No.: D2-A06301EN
■ Package specification
20
12.0
6.7
5.8
10.8
520
±2
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
PC929 Series
Sheet No.: D2-A06301EN
21
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
G
B
H
H
A
C
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
9.7±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
5˚
MAX.
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC929 Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
22
Sheet No.: D2-A06301EN
■ Important Notices
PC929 Series
