DML3009LDC Description and Applications Features and Benefits The DML3009LDC load switch provides a component and areareducing solution for efficient power domain switching with inrush current limit via soft-start. In addition to integrated control functionality with ultra-low on-resistance, this device offers system safeguards and monitoring via fault protection and power good signaling. This costeffective solution is ideal for power management and hot-swap applications requiring low power consumption in a small footprint. * Applications * Portable Electronics and Systems * Notebook and Tablet Computers * Telecom, Networking, Medical, and Industrial Equipment * Set-Top Boxes, Servers, and Gateways * Hot-Swap Devices and Peripheral Ports Advanced Controller with Charge Pump * Integrated N-Channel MOSFET with Ultra-Low RON * * Input Voltage Range 0.5V to 13.5V Soft-Start via Controlled Slew Rate * Adjustable Slew Rate Control * Power Good Signal * Thermal Shutdown * VIN Undervoltage Lockout * Short-Circuit Protection * Extremely Low Standby Current * Load Bleed (Quick Discharge) * Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) * Halogen and Antimony Free. "Green" Device (Note 3) V-DFN3030-12 (Type B) Pin1 Top View Bottom View Top View Ordering Information (Note 4) Part Number DML3009LDC-7 Notes: Case V-DFN3030-12 (Type B) Packaging 3000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information V-DFN3030-12 (Type B) YY WW NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION SINGLE CHANNEL SMART LOAD SWITCH LS39 = Product Type Marking Code YYWW = Date Code Marking YY = Last Two Digits of Year (ex: 18 = 2018) WW = Week Code (01 to 53) LS39 DML3009LDC Document number: DS39184 Rev. 3 - 2 1 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Typical Application Circuit VVIN NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION 1 2 OFF ON 3 VVCc 4 5 RPG 100k VTERM 6 13 VIN VIN VOUT EN VOUT VCC VOUT GND DML3009 VOUT SR NC PG BLEED 12 VVOUT 11 10 9 8 RBLEED 100 7 CVOUT CVIN 1uF CVCC 1uF 0.1uF CSR 1nF Pin Description Pin Number Pin Name 1, 13 2 3 4 5 VIN EN VCC GND SR 6 PG 7 8 to 12 BLEED VOUT Pin Function Drain of MOSFET (0.5V to 13.5V). Pin 1 must be connected to Pin 13. Active-high digital input used to turn on the MOSFET, pin has an internal pull down resistor to GND Supply voltage to controller (3.0V to 5.5V). Controller ground. Slew rate adjustment; Please refer CSR vs. VOUT rising time table. Active-high, open-drain output that indicates when the gate of the MOSFET is fully charged, external pull up resistor 1k to an external voltage source required; tie to GND if not used. Load bleed connection, must be tied to VOUT either directly or through a resistor 1k. Source of MOSFET connected to load. Function Block Diagram VOUT DML3009LDC Document number: DS39184 Rev. 3 - 2 2 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Absolute Maximum Rating Recommended Operating Ranges NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION Parameter Rating Parameter Rating VIN, BLEED, VOUT to GND -0.3V to 18V Supply Voltage (VVCC) 3V to 5.5V EN, VCC, SR, PG to GND -0.3V to 6V Input Voltage (VVIN) 0.5V to 13.5V IMAX 20A Ambient Temperature (TA) -40C to +85C Junction Temperature (TJ) +150C Package Thermal Resistance (JC) 3.5C/W -65C to +150C Package Thermal Resistance (JA) 30C/W Storage Temperature (TS) Electrical Characeristics (TA = +25C, VVCC=3.3V, VVIN=5V=VTERM, CVIN=1F, CVOUT=0.1F, CVCC=1F, CSR=1nF, unless otherwise specified.) Symbol Parameter VVIN Input Voltage VVCC Supply Voltage IDYN VCC Dynamic Supply Current Min Typ Max Unit -- Conditions 0.5 -- 13.5 V -- 3.0 -- 5.5 V VEN =VVCC= 3V, VVIN = 12V -- 310 400 A VEN =VVCC= 5.5V, VVIN = 1.8V -- 510 750 A VVCC = 3V, VEN = 0V -- 0.1 1 A VVCC = 5.5V, VEN = 0V -- 0.1 2 A ISTBY VCC Shutdown Supply Current VENH EN High Level Voltage VVCC = 3V to 5.5V 2.0 -- -- V VENL EN Low Level Voltage VVCC = 3V to 5.5V -- -- 0.8 V VVCC = 3V, VEN = 0V 86 108 130 VVCC = 5.5V, VEN = 0V 64 80 100 VVCC = VEN = 3V, VVIN = 1.8V -- 20 45 A VVCC = VEN = 3V, VVIN = 12V -- 50 70 A VVCC = 3V; ISINK = 5mA -- -- 0.2 V VVCC = 3V; VTERM = 3.3V -- -- 100 nA VVCC = 3.3V, VVIN = 1.8V VVCC = 3.3V, VVIN = 5V VVCC = 3.3V, VVIN = 12V 6.1 5.9 5.8 9 8 8 VVCC = 5V, VVIN = 1.8V -- -- -- -- 4.8 7 m m m m VVCC = 5V, VVIN = 5V -- 4.8 7 m VVCC = 5V, VVIN = 12V -- 4.8 7 m VEN = 0V, VVIN = 13.5V -- -- 1 A -- 76 100 124 k RBLEED Bleed Resistance IBLEED Bleed Pin Leakage Current VPGL PG Output Low Voltage PG Output Leakage Current IPG Switching Device RON ILEAK Switch On-State Resistance Input Shutdown Supply Current EN Pull Down Resistance RPDEN Fault Protection OTP Thermal Shutdown Threshold VVCC = 3V to 5.5V -- 145 -- C OTPHYS Thermal Shutdown Hysteresis VVCC = 3V to 5.5V -- 20 -- C UVLO VIN Lockout Threshold VVCC = 3V 0.25 0.35 0.45 V UVLOHYS VIN Lockout Hysteresis VVCC = 3V 20 40 70 mV Short-Circuit Protection Threshold VVCC = 3.3V; VVIN = 0.5V 180 265 350 mV VVCC = 3.3V; VVIN = 13.5V 100 285 500 mV SCP DML3009LDC Document number: DS39184 Rev. 3 - 2 3 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Switching Characeristics (TA = +25C, VTERM = VVCC = 5V, RPG = 100k, RVOUT = 10, CVIN = 1F, CVOUT = 0.1F, CVCC = 1F, CSR = 1nF, unless otherwise specified.) NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION Symbol VVIN = 1.8V Parameter tON Output Turn-On Delay Time tOFF Output Turn-Off Delay Time tPGON Power Good Turn-on Time tPGOFF Power Good Turn-off Time SR Condition Output Slew Rate Min Typ Max VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V -- -- -- -- -- -- -- -- -- -- 375 370 0.5 0.5 1.4 1.3 10 6 9 9 -- -- -- -- -- -- -- -- -- -- VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V VVCC = 3.3V VVCC = 5V -- -- -- -- -- -- -- -- -- -- 340 330 0.5 0.4 1.6 1.5 10 8 30 31 -- -- -- -- -- -- -- -- -- -- Unit s ms ns kV/s VVIN = 12V tON Output Turn-On Delay Time tOFF Output Turn-Off Delay Time tPGON Power Good Turn-on Time tPGOFF Power Good Turn-off Time SR Output Slew Rate tON s ms ns kV/s tOFF tPG,ON tPG,OFF Figure 1 Timing Diagram DML3009LDC Document number: DS39184 Rev. 3 - 2 4 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Performance Characteristics (@TA = +25C, unless otherwise specified.) SupplyDynamic DynamicCurrent Currentvs. vs.Input InputVotlage Voltage Supply Supply Dynamic Current vs. Supply Voltage Supply Dynamic Current vs. Supply Votlage 800 800 VCC = 5.5V 600 500 400 300 VIN = 12V IOUT = 0A Supply Dynamic Current (A) Supply Dynamic Current (A) VCC = 3V 200 700 VIN = 1.8V 600 500 400 300 200 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 3 3.5 4 Input Voltage (V) 5 5.5 BleedLeakage LeakageCurrent Currentvs. vs.Input InputVotlage Voltage Bleed Bleed Resistance Supply Voltage Bleed Resistance vs.vs. Supply Votlage 70 VEN = 0V VCC = 5.5V Bleed Leakage Current (A) 150 140 Bleed Resistance () 4.5 Supply Voltage (V) 160 130 120 110 100 90 80 60 VCC = 3V 50 40 30 20 10 70 60 0 3 3.5 4 4.5 5 5.5 0 Supply Voltage (V) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Input Voltage (V) ONON Resistance vs.vs. Input Votlage Resistance Input Voltage 8.0 7.8 7.6 ON Resistance (m) NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION IOUT = 0A 700 7.4 VCC = 3V 7.2 VCC = 5.5V 7.0 IOUT = 0.5A 6.8 6.6 6.4 6.2 6.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Input Voltage (V) DML3009LDC Document number: DS39184 Rev. 3 - 2 5 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Performance Characteristics (@TA = +25C, unless otherwise specified. cont.) NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION Turn ON Response VVIN = 1.8V, VVCC = 3.3V, VEN = 0V to 3.3V, RL = 10 Turn OFF Response VVIN = 1.8V, VVCC = 3.3V, VEN = 3.3V to 0V, RL = 10 VEN 2V/div VEN 2V/div VPG 5V/div VPG 5V/div VOUT 1V/div VOUT 1V/div IOUT 200mA/div IOUT 200mA/div 200s/div 500ns/div Turn ON Response VVIN = 5.0V, VVCC = 3.3V, VEN = 0V to 3.3V, RL = 10 Turn OFF Response VVIN = 5.0V, VVCC = 3.3V, VEN = 3.3V to 0V, RL = 10 VEN 2V/div VEN 2V/div VPG 5V/div VPG 5V/div VOUT 2V/div VOUT 2V/div IOUT 500mA/div IOUT 500mA/div 200s/div 500ns/div Turn ON Response VVIN = 12V, VVCC = 3.3V, VEN = 0V to 3.3V, RL = 10 Turn OFF Response VVIN = 12V, VVCC = 3.3V, VEN = 3.3V to 0V, RL = 10 VEN 2V/div VEN 2V/div VPG 5V/div VPG 5V/div VOUT 5V/div VOUT 5V/div IOUT 1A/div IOUT 1A/div 500ns/div 200s/div DML3009LDC Document number: DS39184 Rev. 3 - 2 6 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Performance Characteristics (@TA = +25C, unless otherwise specified. cont.) NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION Turn ON Response VVIN = 1.8V, VVCC = 5.0V, VEN = 0V to 3.3V, RL = 10 Turn OFF Response VVIN = 1.8V, VVCC = 5.0V, VEN = 3.3V to 0V, RL = 10 VEN 2V/div VEN 2V/div VPG 5V/div VPG 5V/div VOUT 1V/div VOUT 1V/div IOUT 200mA/div IOUT 200mA/div 200s/div 500ns/div Turn ON Response VVIN = 5.0V, VVCC = 5.0V, VEN = 0V to 3.3V, RL = 10 Turn OFF Response VVIN = 5.0V, VVCC = 5.0V, VEN = 3.3V to 0V, RL = 10 VEN 2V/div VEN 2V/div VPG 5V/div VPG 5V/div VOUT 2V/div VOUT 2V/div IOUT 500mA/div IOUT 500mA/div 200s/div 500ns/div Turn ON Response VVIN = 12V, VVCC = 5.0V, VEN = 0V to 3.3V, RL = 10 Turn OFF Response VVIN = 12V, VVCC = 5.0V, VEN = 3.3V to 0V, RL = 10 VEN 2V/div VEN 2V/div VPG 5V/div VPG 5V/div VOUT 5V/div VOUT 5V/div IOUT 1A/div IOUT 1A/div 500ns/div 200s/div DML3009LDC Document number: DS39184 Rev. 3 - 2 7 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Application Information NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION General Description The DML3009LDC is a single-channel load switch with a controlled adjustable turn-on and integrated PG indicator in a 12-pin DFN30x30 package. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.5V to 12V and can support a maximum continuous current of 10A. The wide-input voltage range and high-current capability enable the device to be used across multiple designs and end equipment. 6m on-resistance minimizes the voltage drop across the load switch and power loss from the load switch. The controlled rise time for the device greatly reduces inrush current by large bulk load capacitances thereby reducing or eliminating power supply droop. The adjustable slew rate through SR provides the design flexibility to trade off the inrush current and power up timing requirements. Integrated PG indicator notifies the system about the status of the load switch to facilitate seamless power sequencing. During shutdown, the device has very low leakage current thereby reducing unnecessary leakages for downstream modules during standby. The DML3009LDC also has an embedded 100 on-chip resistor on BLEED pin for quick discharge of the output when switch is disabled. Enable Control The DML3009LDC device allows for enabling the MOSFET in an active-high configuration. When the VCC supply pin has an adequate voltage applied, and the EN pin is at logic high level, the MOSFET is enabled. Similarly, when the EN pin is at logic low level, the MOSFET is disabled. An internal pull-down resistor to ground on the EN pin ensures that the MOSFET disables when not being driven. Power Sequencing The DML3009LDC device functions with any power sequence, but the output turn-on delay performance can vary from what is specified. To archive the specified performance, there are two recommended power sequences: 1.) 2.) VVCC VVIN VEN VVIN VVCC VEN Load Bleed (Quick Discharge) The DML3009LDC device has an internal bleed discharge device, which is used to bleed the charge off of the load to ground after the MOSFET is disabled. The bleed discharge device is enabled whenever the MOSFET is disabled. The MOSFET and the bleed device are never concurrently active. The BLEED pin must be connected to VOUT either directly or through an external resistor, REXT. REXT must not exceed 1K and can be used to increase the total bleed resistance. Care must be taken to ensure that the power dissipated across RBLEED is kept at safe level. The maximum continuous power that dissipates across RBLEED is 0.4W. REXT can be used to decrease the amount of power dissipated across RBLEED. Adjustable Rise Time (Slew Rate Control) The DML3009LDC device has controlled rise time for inrush current control. A capacitor to ground on the SR pin adjusts the rise time. Without a capacitor on SR, the rise time is at its minimum for fastest timing. Equation 1 approximately shows the relationship between CSR, VIN, and rise time, tR. Where tR is the rise time (s) * VIN is the input voltage (V) * * = + + + - K2, K3, K4, and K5 is constant where K2 = 0.067, K3 = 137, K4 = 6.7, K5 = 67 CSR is the capacitance value on the SR pin (pF) DML3009LDC Document number: DS39184 Rev. 3 - 2 8 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Application Information (continued) Table 1 contains rise time values measured on a typical device. Rise times shown below are only valid for the power-up sequence 1. NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION CSR 0 (floating) 0.22nF 0.47nF 1nF 2.2nF 4.7nF Table1. Rise Times vs SR Capacitor Rise Time VCC = 5V, CL = 0.1F, RL = 10, 25C; Measure VOUT rising time from 10% to 90% VVIN VVIN = 13.5V VVIN = 12V VVIN = 5V VVIN = 1.8V 371s 346s 233s 142s 448s 430s 318s 232s 646s 615s 452s 262s 902s 880s 750s 393s 1408s 1370s 1028s 585s 2040s 1935s 1466s 958s Note: An SR Capacitor less than 4.7nF for system success startup is recommended. Power Good The DML3009LDC device has a power good output (PG) that can be used to indicate when the gate of the MOSFET is driven high and the switch is on with the on-resistance close to its final value (full load ready). The PG pin is an active-high, open-drain output that requires an external pullup resistor, RPG, greater than or equal to 1K to an external voltage source, VTERM, compatible with input levels of those devices connected to this pin. Equation 2 approximately shows the relationship between CSR, VIN, and PG turn-on time, tPG_ON. Where * * _ = + tPG_ON is the PG turn-on time (s) K1 is constant, which is K1 = 800 Table 2 contains PG turn-on time values measured on a typical device. PG turn-on times shown below are valid for the power-up sequence 1. Table 2. PG Turn-On Times vs SR Capacitor PG turn-on time VCC = 5V, CL = 0.1F, RL = 10, RPG = 10K, 25C CSR VVIN = 13.5V VVIN = 12V VVIN = 5V VVIN = 1.8V 0 (floating) 1171s 1098s 863s 935s 0.22nF 1338s 1260s 1148s 982s 0.47nF 1464s 1455s 1292s 1102s 1nF 1702s 1630s 1530s 1293s 2.2nF 2248s 2210s 1868s 1425s 4.7nF 2840s 2685s 2467us 1758s The power good output can be used as the enable signal for other active-high devices in the system. This allows for guaranteed by design power sequencing and reduces the number of enable signals required from the system controller. If the power good feature is not used in the application, the PG pin must be tied to GND. Short-Circuit Protection The DML3009LDC device is equipped with short-circuit protection that is used to help protect the part and the system from a sudden high-current event, such as the output, VOUT, being shorted to ground. This circuitry is only active when the gate of MOSFET is fully charged. Once active, the circuitry monitors the difference in the voltage on the VIN pin and the voltage on the BLEED pin. In order for the VOUT voltage to be monitored through the BLEED pin, it is required that BLEED pin be connected to VOUT either directly or through a resistor, REXT, which should not exceed 1K. With the BLEED pin connected to VOUT, the short-circuit protection is able to monitor the voltage drop across the MOSFET. If the voltage drop across the MOSFET is greater than or equal to the short-circuit protection threshold voltage, the MOSFET is immediately turned off, and the load bleed is activated. The part remains latched in this off state until EN is toggled or VCC supply voltage is cycled at which point the MOSFET turns on delay and slew rate. The current through the MOSFET that causes a short-circuit event can be calculated by dividing the short-circuit protection threshold by expected on-resistance of the MOSFET DML3009LDC Document number: DS39184 Rev. 3 - 2 9 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Application Information (continued) Thermal Shutdown NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION The DML3009LDC device has equipped thermal shutdown protection for internally or externally generated excessive temperatures. This circuitry is disabled when EN is not active to reduce standby current. When an overtemperature condition is detected, the MOSFET immediately turns off, and the load bleed is active. The part comes out of thermal shutdown when the junction temperature decreases to a safe operating temperature as dictated by the thermal hysteresis. Upon exiting a thermal shutdown state and if EN remains active, the MOSFET turns on in a controlled fashion with the normal output turn-on delay and slew rate. Undervoltage Lockout The DML3009LDC device has equipped undervoltage lockout protection. DML3009LDC turns the MOSFET off and activates the load bleed when the input voltage. VIN, is less than or equal to the undervoltage lockout threshold. This circuitry is disabled when EN is not active to reduce standby current. If the VIN voltage rise above the undervoltage lockout threshold and EN remains active, the MOSFET turns on in a controlled fashion with the normal output turn-on delay and slew rate. PCB Layout Consideration 1. 2. 3. Place the input/output capacitors CVIN and CVOUT as close as possible to the VIN and VOUT pins. The power traces, which are VIN trace, VOUT trace, and GND trace, should be short, wide, and direct for minimize parasitic inductance. Place feedback resistance RBLEED as close as possible to BLEED pin. 4. 5. The SR trace must be as short as possible to reduce parasitic capacitance. Place CVCC capacitor near the device pin. 6. Connect the signal ground to the GND pin, and keep a single connection from GND pin to the power ground behind the input or output capacitors. For better power dissipation, via holes are recommended to connect the exposed pad's landing area to a large copper polygon on the other side of the PCB. The copper polygons and exposed pad shall connect to VIN pin on the printed circuit board. 7. GND (Power) CVIN CVOUT VIN CVCC GND (Signal) VIN 1 12 VOUT EN 2 11 VOUT Vcc 3 10 VOUT VOUT VIN CSR GND 4 9 VOUT SR 5 8 VOUT PG 6 7 BLEED RPG RBLEED VTERM DML3009LDC Document number: DS39184 Rev. 3 - 2 10 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION V-DFN3030-12 (Type B) A1 A3 A Seating Plane V-DFN3030-12 Type B Dim Min Max Typ A 0.77 0.85 0.80 A1 0.00 0.05 0.02 A3 --0.203 b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.60 2.80 2.70 E 2.95 3.05 3.00 E2 1.90 2.10 2.00 e 0.50BSC k --0.20 L 0.25 0.35 0.30 z --0.125 All Dimensions in mm D ( Pin #1 ID) e L E2 E k D2 b z Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. V-DFN3030-12 (Type B) X3 Y Dimensions C X X1 X2 X3 Y Y1 Y2 X2 Y1 Y2 1 Value (in mm) 0.50 0.32 0.45 2.86 2.82 0.48 2.10 3.30 X X1 C DML3009LDC Document number: DS39184 Rev. 3 - 2 11 of 12 www.diodes.com December 2018 (c) Diodes Incorporated DML3009LDC NEW PRODUCT ADVANCE INFORMATION NEW PRODUCT ADVANCED INFORMATION IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2018, Diodes Incorporated www.diodes.com DML3009LDC Document number: DS39184 Rev. 3 - 2 12 of 12 www.diodes.com December 2018 (c) Diodes Incorporated