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FEATURES
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
GND
VCC
2OUT
2IN–
2IN+
DPACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
LM258A-EPDUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
•Controlled Baseline •Low Input Bias and Offset Parameters:– One Assembly/One Test Site, One – Input Offset Voltage . . . 2 mV TypFabrication Site
– Input Offset Current . . . 2 nA Typ•Extended Temperature Performance of –55 °C
– Input Bias Current . . . 15 nA Typto 125 °C
•Differential Input Voltage Range Equal to•Enhanced Diminishing Manufacturing
Maximum-Rated Supply Voltage . . . 32 VSources (DMS) Support
•Open-Loop Differential Voltage Amplification•Enhanced Product-Change Notification
. . . 100 V/mV Typ•Qualification Pedigree
(1)
•Internal Frequency Compensation•Wide Supply Range:– Single Supply . . . 3 V to 30 V– Dual Supplies . . . ±1.5 V to ±15 V•Low Supply-Current Drain, Independent ofSupply Voltage . . . 0.7 mA Typ•Common-Mode Input Voltage Range IncludesGround, Allowing Direct Sensing NearGround
(1) Component qualification in accordance with JEDEC andindustry standards to ensure reliable operation over anextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The LM258A consists of two independent, high-gain, frequency-compensated operational amplifiers designed tooperate from a single supply over a wide range of voltages. Operation from split supplies also is possible if thedifference between the two supplies is 3 V to 30 V, and V
CC
is at least 1.5 V more positive than the inputcommon-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifiercircuits that now can be implemented more easily in single-supply-voltage systems. For example, this device canbe operated directly from the standard 5-V supply used in digital systems and easily can provide the requiredinterface electronics without additional ±5-V supplies.
ORDERING INFORMATION
MAXV
IO
max ORDERABLET
A
TESTED PACKAGE
(1)
TOP-SIDE MARKINGAT 25 °C PART NUMBERV
CC
–55 °C to 125 °C 3mV 30V SOIC – D Reel of 2500 LM258AMDREP 258AM
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
IN+
IN-
OUT
+
-
VCC+
OUT
GND(orV )
CC-
ToOther Amplifier
IN–
IN+
Current
Regulator
» m6- A
Current
Regulator
Epi-FET
Diodes
Resistors
Transistors
Capacitors
COMPONENTCOUNT
1
2
7
51
2
Current
Regulator
» m100- A
» m6- A
Current
Regulator
» m50- A
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
SYMBOL (EACH AMPLIFIER)
SCHEMATIC (EACH AMPLIFIER)
2
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Absolute Maximum Ratings
(1)
LM258A-EPDUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
CC
Supply voltage
(2)
±16 or 32 VV
ID
Differential input voltage
(3)
±32 VV
I
Input voltage (either input) –0.3 to 32 VDuration of output short circuit (one amplifier) to ground
Unlimitedat (or below) 25 °C free-air temperature (V
CC
≤15 V)
(4)
θ
JA
Package thermal impedance
(5) (6)
97 °C/WT
A
Operating free-air temperature range –55 to 125 °CT
J
Operating virtual junction temperature 150 °CT
stg
Storage temperature range
(7)
–65 to 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential voltages and V
CC
specified for measurement of I
OS
, are with respect to the network groundterminal.
(3) Differential voltages are at IN+ with respect to IN–.(4) Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.(5) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(6) The package thermal impedance is calculated in accordance with JESD 51-7.(7) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction ofoverall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
3Submit Documentation Feedback
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Electrical Characteristics
aIIO
aIIO
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS
(1)
T
A
(2)
MIN TYP
(3)
MAX UNIT
V
CC
= 5 V to 30 V, 25 °C 2 3V
IO
Input offset voltage V
IC
= V
ICR(min)
, mVFull range 4V
O
= 1.4 VAverage temperature
coefficient of Full range 7 15 µV/ °Cinput offset voltage
25 °C 2 15I
IO
Input offset current V
O
= 1.4 V nAFull range 30Average temperature
coefficient of Full range 10 200 pA/ °Cinput offset current
25 °C –15 –80I
IB
Input bias current V
O
= 1.4 V nAFull range –10025 °C 0 to V
CC
– 1.5Common-mode
V
ICR
V
CC
= 5 V to Max Vinput voltage range
Full range 0 to V
CC
– 2R
L
≥2 k Ω25 °C V
CC
– 1.5High-levelV
OH
R
L
= 2 k ΩFull range 26 Voutput voltage
V
CC
= 30 V
R
L
≥10 k ΩFull range 27 28Low-levelV
OL
R
L
≤10 k ΩFull range 5 20 mVoutput voltageLarge-signal V
CC
= 15 V, 25 °C 50 100A
VD
differential V
O
= 1 V to 11 V, V/mVFull range 25voltage amplification R
L
≥2 k ΩCommon-mode V
CC
= 5 V to MaxCMRR 25 °C 70 80 dBrejection ratio V
IC
= V
ICR(min)
Supply-voltage
k
SVR
rejection ratio V
CC
= 5 V to Max 25 °C 65 100 dB(∆V
DD
/∆V
IO
)CrosstalkV
O1
/V
O2
f = 1 kHz to 20 kHz 25 °C 120 dBattenuation
V
CC
= 15 V, 25 °C –20 –30 –60V
ID
= 1 V, Source
Full range –10V
O
= 0
mAI
O
Output current V
CC
= 15 V, 25 °C 10 20V
ID
= –1 V, Sink
5Full rangeV
O
= 15 VV
ID
= –1 V, V
O
= 200 mV 25 °C 12 30 µAShort-circuit V
CC
at 5 V, GND at –5 V,I
OS
25 °C±40 ±60 mAoutput current V
O
= 0V
O
= 2.5 V, No load Full range 0.7 1.2Supply currentI
CC
mA(two amplifiers)
V
CC
= Max, V
O
= V
CC
/2, No load Full range 1 2
(1) All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. MAXV
CC
for testing purposes is 30 V.(2) Full range is –55 °C to 125 °C.(3) All typical values are at T
A
= 25 °C.
4
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Operating Characteristics
+
VO
–
RL
CL
VI
VCC+
VCC-
–
+
VO
100 W
VCC+
VCC-
RS
900 W
V =0V
I
LM258A-EPDUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
V
CC
=±15 V, T
A
= 25 °C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate at unity gain R
L
= 1 M Ω, C
L
= 30 pF, V
I
=±10 V, See Figure 1 0.3 V/ µsB
1
Unity-gain bandwidth R
L
= 1 M Ω, C
L
= 20 pF, See Figure 1 0.7 MHzV
n
Equivalent input noise voltage R
S
= 100 Ω, V
I
= 0 V, f = 1 kHz, See Figure 2 40 nV/ √Hz
Figure 1. Unity-Gain Amplifier
Figure 2. Noise-Test Circuit
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PACKAGE OPTION ADDENDUM
www.ti.com 31-May-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM258AMDREP ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 258AM
LM258AMDREPG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 258AM
V62/07605-01XE ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 258AM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 31-May-2014
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A-EP :
•Catalog: LM258A
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM258AMDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258AMDREP SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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