SDA
SCL
A0
A1
INT
IN7 (+)
I2C Interface and Control
Interrupt
Masking
and
Interrupt
Control
ADC128D818
12-bit
Delta-Sigma
ADC
Internal
VREF = +2.56V
Temperature
Sensor
Interrupt
Status
Registers
GND
VREF
V+
Single-Ended
Positive Voltage
LM94022
Shutdown DC-DC
10VIN VOUT
Margining
Voltage
IN0
IN1
IN2
IN3
Pseudo-Differential
Positive Voltage
IN4 (+)
IN5 (-)
IN6 (-)
RTRACE
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
ADC128D818
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ADC128D818 12-Bit, 8-Channel, ADC System Monitor With Temperature Sensor,
Internal External Reference, and I
2
C Interface
1 Features Temperature Accuracy (–25°C to 100°C) ±2°C
1 12-Bit Resolution Delta-Sigma ADC 2 Applications
Local Temperature Sensing Communications Infrastructure
Configurable Single-Ended and/or Pseudo-Diff. Thermal and Hardware Server Monitors
Inputs System Monitors
2.56-V Internal VREF or Variable External VREF Industrial and Medical Systems
WATCHDOG Window Comparators with Status Electronic Test Equipment and Instrumentation
and Mask Registers of All Measured Values Power Supply Monitoring and Supervision
Independent Registers for Storing Measured
Values 3 Description
INT Output Notifies Microprocessor of Error Event The ADC128D818 I2C system monitor is designed for
I2C Serial Bus Interface Compatibility maximum flexibility. The system monitor can be
9 Selectable Addresses configured for single-ended and/or pseudo-differential
TIME-OUT Reset Function to Prevent I2C Bus inputs. An onboard temperature sensor, combined
Lock-Up with WATCHDOG window comparators, and an
interrupt output pin, INT, allow easy monitoring and
Individual Channel Shutdown to Limit Power out-of-range alarms for every channel. A high
Consumption performance internal reference is also available to
Deep Shutdown Mode to Minimize Power provide for a complete solution in the most difficult
Consumption operating conditions.
TSSOP 16-Lead Package The ADC128D818’s 12-bit delta-sigma ADC supports
Key Specifications Standard Mode (Sm, 100 kbps) and Fast Mode (Fm,
400 kbps) I2C interfaces. The ADC128D818 includes
ADC Resolution 12-Bit a sequencer to control channel conversions and
Supply Voltage Range 3 V to 5.5 V stores all converted results in independent registers
Total Unadjusted Error –0.45%/+0.2% for easy microprocessor retrieval. Unused channels
can be shut down independently to conserve power.
Integral Non-Linearity ±1 LSb
Differential Non-Linearity ±1 LSb Device Information(1)
Operating Current 0.56 mA PART NUMBER PACKAGE BODY SIZE (NOM)
Deep Shutdown Current 10 µA ADC128D818 TSSOP (16) 5.00 mm × 4.40 mm
Temperature Resolution °C/LSb (1) For all available packages, see the orderable addendum at
Temperature Accuracy (–40°C to 125°C) ±3°C the end of the data sheet.
Typical Application Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADC128D818
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Table of Contents
8.4 Device Functional Modes........................................ 16
1 Features.................................................................. 18.5 Programming........................................................... 16
2 Applications ........................................................... 18.6 Register Maps......................................................... 19
3 Description............................................................. 19 Application and Implementation ........................ 28
4 Revision History..................................................... 29.1 Application Information............................................ 28
5 Description (continued)......................................... 39.2 Typical Application ................................................. 31
6 Pin Configuration and Functions......................... 49.3 System Examples ................................................... 35
7 Specifications......................................................... 510 Power Supply Recommendations ..................... 38
7.1 Absolute Maximum Ratings ...................................... 511 Layout................................................................... 39
7.2 ESD Ratings.............................................................. 511.1 Layout Guidelines ................................................. 39
7.3 Recommended Operating Conditions....................... 611.2 Layout Example .................................................... 39
7.4 Thermal Information.................................................. 612 Device and Documentation Support................. 40
7.5 DC Electrical Characteristics .................................... 612.1 Documentation Support ........................................ 40
7.6 AC Electrical Characteristics..................................... 912.2 Community Resources.......................................... 40
7.7 Typical Characteristics............................................ 10 12.3 Trademarks........................................................... 40
8 Detailed Description............................................ 14 12.4 Electrostatic Discharge Caution............................ 40
8.1 Overview................................................................. 14 12.5 Glossary................................................................ 40
8.2 Functional Block Diagram....................................... 14 13 Mechanical, Packaging, and Orderable
8.3 Feature Description................................................. 15 Information ........................................................... 40
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2013) to Revision F Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Removed Product Highlights ................................................................................................................................................. 1
Changes from Revision D (January 2011) to Revision E Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 27
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5 Description (continued)
The ADC can use either an internal 2.56-V reference or a variable external reference. An analog filter is included
on the I2C digital control lines to provide improved noise immunity. The device also includes a TIME-OUT reset
function on SDA and SCL to prevent I2C bus lock-up.
The ADC128D818 operates from 3-V to 5.5-V power supply voltage range, –40°C to 125°C temperature range,
and the device is available in a 16-pin TSSOP package.
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ESD
Clamp
1
2
SDA
3
SCL
4
GND
5
6
7
A1 8
V+
16
15
14
13
12
11
10
9
ADC128D818
16-pin TSSOP
IN7
VREF
IN6
IN5
IN4
IN3
IN2
IN1
IN0
A0
INT
ADC128D818
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6 Pin Configuration and Functions
PW Package
16-Pin TSSOP
Top View
Pin Functions
PIN TYPE DESCRIPTION
NO. NAME ESD STRUCTURE
ADC external reference.
ADC128D818 allows two choices for sourcing VREF:
internal or external. If the 2.56-V internal VREF is used,
leave this pin unconnected. If the external VREF is used,
1 VREF Analog Input source this pin with a voltage between 1.25 V and V+. At
Power-On-Reset (POR), the default setting is the internal
VREF.
Bypass with the parallel combination of 1-μF (electrolytic or
tantalum) and 0.1-μF (ceramic) capacitors.
Serial Bus Bidirectional Data. NMOS open-drain output.
2 SDA Digital I/O Requires external pullup resistor to function properly.
Serial Bus Clock. Requires external pullup resistor to
3 SCL Digital Input function properly.
4 GND GROUND Internally connected to all of the circuitry.
3.0-V to 5.5-V power. Bypass with the parallel combination
5 V+POWER of 1-μF (electrolytic or tantalum) and 0.1-μF (ceramic)
bypass capacitors.
Interrupt Request. Active Low, NMOS, open-drain.
6 INT Digital Output Requires external pullup resistor to function properly.
7 A0 Tri-Level Serial Address pins that allow 9 devices on a
Tri-Level Inputs single I2C bus.
8 A1
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Pin Functions (continued)
PIN TYPE DESCRIPTION
NO. NAME ESD STRUCTURE
9 IN7
10 IN6
11 IN5 The full scale range will be controlled by the internal or
12 IN4 Analog Inputs external VREF. These inputs can be assigned as single-
13 IN3 ended and/or pseudo-differential inputs.
14 IN2
15 IN1
16 IN0
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)Æ(4)
MIN MAX UNIT
Supply Voltage (V+) 6.0 6 V
Voltage on SCL, SDA, A0, A1, INT –0.3 6 V
Voltage on IN0-IN7, VREF –0.3 (V++ 0.3) V
Input Current at Any Pin(5) ±5 mA
Package Input Current(5) ±30 mA
Maximum Junction Temperature (TJMAX)(6) 150 °C
Storage Temperature, Tstg –65 150 °C
(1) All voltages are measured with respect to GND, unless otherwise specified.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(4) For soldering specifications, SNOA549
(5) If the input voltage at any pin exceeds the power supply ( that is, VIN < GND or VIN > V +) but is less than the absolute maximum
ratings, then the current at that pin must be limited to 5 mA. The 30 mA maximum package input current rating limits the number of pins
that can safely exceed the power supply with an input current of 5 mA to six pins. Parasitic components and/or ESD protection circuitry
are shown in the Pin Descriptions table.
(6) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, RθJA and the ambient temperature,
TA. The maximum allowable power dissipation at any temperature is PD= (TJMAX TA) / RθJA.
7.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000
Charged-device model (CDM), per JEDEC specification JESD22- ±1000
V(ESD) Electrostatic discharge V
C101(2)
Machine model ±300
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted(1)
MIN MAX UNIT
Supply Voltage (V+) 3 5.5 V
Voltage on SCL, SDA, A0, A1, INT –0.05 5.5 V
Voltage on IN0-IN7, VREF –0.05 (V++ 0.05) V
Temperature Range for Electrical Characteristics –40 125 °C
Operating Temperature –40 125 °C
(1) All voltages are measured with respect to GND, unless otherwise specified.
7.4 Thermal Information ADC128D818
THERMAL METRIC(1) PW (TSSOP) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance 130 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 DC Electrical Characteristics
The following specifications apply for 3 VDC V+5.5 VDC , External VREF = 2.56 V, unless otherwise specified. All limits TA
= TJ= 25°C unless otherwise specified(1).
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
POWER SUPPLY CHARACTERISTICS
3.3 or 5 V
V+Supply Voltage TA= TJ= TMIN to TMAX 3 5.5
2.56 V
External Reference Voltage TA= TJ= TMIN to TMAX 1.25 V+
VREF 2.56 V
Internal Reference Voltage 23 ppm/°C
Interface Inactive, V+ = 5.5 TA= TJ= TMIN to TMAX 0.74 mA
V, Mode 2
Interface Inactive, V+ = 3.6 TA= TJ= TMIN to TMAX 0.56 mA
V, Mode 2
Supply Current (see Power
I+Shutdown Mode, V+ = 5.5
Management). TA= TJ= TMIN to TMAX 0.65 mA
V
Shutdown Mode, V+ = 3.6 TA= TJ= TMIN to TMAX 0.48 mA
V
Deep Shutdown Mode(4). TA= TJ= TMIN to TMAX 10 µA
TEMPERATURE-to-DIGITAL CONVERTER CHARACTERISTICS
–40°C TA+125°C TA= TJ= TMIN to TMAX ±3 °C
Temperature Error –25°C TA+100°C TA= TJ= TMIN to TMAX ±2 °C
Resolution 0.5 °C
ANALOG-to-DIGITAL CONVERTER CHARACTERISTICS
n Resolution 12-bit with full-scale at VREF = 2.56 V. 0.625 mV
(1) Each input and output is protected by an ESD structure to GND, as shown in the . Input voltage magnitude up to 0.3 V above V+or 0.3
V below GND will not damage the ADC128D818. There are diodes that exist between some inputs and the power supply rails. Errors in
the ADC conversion can occur if these diodes are forward biased by more than 50 mV. As an example, if V+is 4.5 VDC, INx (where 0
x7) must be 4.55 VDC to ensure accurate conversions.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).
(3) Typicals are at TJ= TA= 25°C and represent most likely parametric normal.
(4) Limit is specified by characterization.
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DC Electrical Characteristics (continued)
The following specifications apply for 3 VDC V+5.5 VDC , External VREF = 2.56 V, unless otherwise specified. All limits TA
= TJ= 25°C unless otherwise specified(1).
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
External VREF = 1.25 V, 0.36
Pseudo-Differential, V+ = 3 LSb
TA= TJ= TMIN to TMAX –1 1
V to 3.3 V.(4)
External VREF = 2.56 V, 1.58
INL Integral Non-Linearity Pseudo-Differential LSb
External VREF = 5 V, TA= TJ= TMIN to TMAX –2 4
Pseudo-Differential, V+ = 5
V to 5.5 V. ±0.25
DNL Differential Non-Linearity See (5) LSb
TA= TJ= TMIN to TMAX –1 1
Internal VREF, Single-
Ended, V+ = 3 V to 3.6 V. TA= TJ= TMIN to TMAX –0.5 0.5 % of FS
Internal VREF, Single-
Ended, V+ = 4.5 V to 5.5
V(7).
Internal VREF, Pseudo-
Differential, V+ = 3 V to 3.6 TA= TJ= TMIN to TMAX 0.3 0.5 % of FS
V or V+ = 4.5 V to 5.5 V(7).
External VREF = 1.25 V,
Single-Ended, V+ = 3 V to TA= TJ= TMIN to TMAX
TUE Total Unadjusted Error(6) 3.6 V. –0.6 0.1 % of FS
External VREF = 2.56 V,
Single-Ended, V+ = 3 V to TA= TJ= TMIN to TMAX
5.5 V.
External VREF = 1.25 V,
Pseudo-Differential, V+ = 3 TA= TJ= TMIN to TMAX
V to 3.6 V. –0.45 0.2 % of FS
External VREF = 2.56 V,
Pseudo-Differential, V+ = 3 TA= TJ= TMIN to TMAX
V to 5.5 V.
Internal VREF, V+ = 3 V to
3.6 V. TA= TJ= TMIN to TMAX –0.25 0.45 % of FS
Internal VREF, V+ = 4.5 V
to 5.5 V(7)
GE Gain Error External VREF = 1.25 V or
2.56 V, V+ = 3 V to 3.6 V. TA= TJ= TMIN to TMAX –0.45 0.2 % of FS
External VREF = 2.56 V or
5 V, V+ = 4.5 V to 5.5 V.
Internal VREF, Pseudo-
Differential,V+ = 4.5 V to TA= TJ= TMIN to TMAX –0.15 0.2 % of FS
5.5 V(7).
External VREF = 1.25 V or
2.56 V, Single-Ended, V+ =
3 V to 3.6 V. TA= TJ= TMIN to TMAX –0.5 0.1 % of FS
External VREF = 2.56 V or
OE Offset Error 5 V, Single-Ended, V+ =
4.5 V to 5.5 V
External VREF = 1.25 V or
2.56 V, Pseudo-Differential,
V+ = 3 V to 3.6 V. TA= TJ= TMIN to TMAX –0.2 0.15 % of FS
External VREF = 2.56 V or
5 V, Pseudo-Differential,
V+ = 4.5 V to 5.5 V
(5) Limit is specified by design.
(6) TUE (Total Unadjusted Error) includes Offset, Gain and Linearity errors of the ADC.
(7) The range is up to 7/8 of full scale.
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DC Electrical Characteristics (continued)
The following specifications apply for 3 VDC V+5.5 VDC , External VREF = 2.56 V, unless otherwise specified. All limits TA
= TJ= 25°C unless otherwise specified(1).
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
Each Enabled Voltage Channel 12 ms
Continuous Conversion Mode Internal Temperature Sensor 3.6 ms
tCEnabled Voltage Channel(s) and Internal
Low Power Conversion Mode 728 ms
Temperature Sensor
MULTIPLEXER / ADC INPUT CHARACTERISTICS
2
RON ON-Resistance kΩ
TA= TJ= TMIN to TMAX 10
Input Current (On Channel
ION ±0.005 μA
Leakage Current)
IOFF Off Channel Leakage Current ±0.005 μA
DIGITAL OUTPUTS: INT
IOUT = 5.0 mA at V+= 4.5
VOUT(0) Logical 0 Output Voltage V, IOUT = +3 mA at V+= +3 TA= TJ= TMIN to TMAX 0.4 V
V
OPEN DRAIN SERIAL BUS OUTPUT: SDA
IOUT = 3.0 mA at V+= 4.5
VOUT(0) Logical 0 Output Voltage TA= TJ= TMIN to TMAX 0.4 V
V, 0.005
IOH High Level Output Current VOUT = V+μA
TA= TJ= TMIN to TMAX 1
DIGITAL INPUTS: A0 and A1
VIN(1) Logical 1 Input Voltage TA= TJ= TMIN to TMAX 0.9 × V+ 5.5 V
VIM Logical Middle Input Voltage TA= TJ= TMIN to TMAX 0.43 × 0.57 ×
V+ V+
VIN(0) Logical 0 Input Voltage TA= TJ= TMIN to TMAX GND 0.1 × V+ V
0.05
SERIAL BUS INPUTS: SCL and SDA
VIN(1) Logical 1 Input Voltage TA= TJ= TMIN to TMAX 0.7 × V+5.5 v
GND
VIN(0) Logical 0 Input Voltage TA= TJ= TMIN to TMAX 0.3 × V+V
0.05
V+= 3.3 V 0.67 V
VHYST Hysteresis Voltage V+= 5.5 V 1.45 V
ALL DIGITAL INPUTS: SCL, SDA, A0, A1
0.005
IIN(1) Logical 1 Input Current VIN = V+µA
TA= TJ= TMIN to TMAX 10.005
IIN(0) Logical 0 Input Current VIN = 0 VDC µA
TA= TJ= TMIN to TMAX 1
CIN Digital Input Capacitance 20 pF
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7.6 AC Electrical Characteristics
The following specifications apply for +3.0 VDC V++5.5 VDC , unless otherwise specified. All limits TA= TJ= 25°C unless
otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SERIAL BUS TIMING CHARACTERISTICS
t1SCL (Clock) Period TA= TJ= TMIN to TMAX 2.5 100 µs
t2Data In Set-up Time to SCL High TA= TJ= TMIN to TMAX 100 ns
t3Data Out Stable After SCL Low TA= TJ= TMIN to TMAX 0 ns
t4SDA Low Set-up Time to SCL Low TA= TJ= TMIN to TMAX 100 ns
(start)
t5SDA High Hold Time After SCL High TA= TJ= TMIN to TMAX 100 ns
(stop)
SCL or SDA time low for I2C bus TA= TJ= TMIN to TMAX 25 35 ms
tTIME-OUT reset
(1) Limits are ensured to AOQL (Average Outgoing Quality Level).
(2) Typicals are at TJ= TA= 25°C and represent most likely parametric normal.
Figure 1. Serial Bus Timing Diagram
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500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE
TUE (%)
-0.020
-0.060
-0.100
-0.140
-0.180
-0.220
500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE
TUE (%)
-0.020
-0.064
-0.108
-0.152
-0.196
-0.240
500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE
TUE (%)
0.023
0.014
0.004
-0.005
-0.015
-0.024
500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE
TUE (%)
-0.010
-0.074
-0.138
-0.202
-0.266
-0.330
ADC128D818
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7.7 Typical Characteristics
The following typical performance plots apply for the internal VREF = 2.56 V, V+ = 3.3 V, Pseudo-Differential connection,
unless otherwise specified. All limits TA= TJ= 25°C unless otherwise specified.
Figure 2. TUE vs. Code Figure 3. TUE vs. Code (External VREF = 1.25 V)
Figure 4. TUE vs. Code (External VREF = 2.56 V) Figure 5. TUE vs. Code (External VREF = 5 V, V+ = 5 V)
Figure 6. INL vs. Code (External VREF = 1.25 V for 1 Unit) Figure 7. INL vs. Code (External VREF = 1.25 V for 28 Units)
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Typical Characteristics (continued)
The following typical performance plots apply for the internal VREF = 2.56 V, V+ = 3.3 V, Pseudo-Differential connection,
unless otherwise specified. All limits TA= TJ= 25°C unless otherwise specified.
Figure 8. INL vs. Code (External VREF = 2.56 V for 1 Unit) Figure 9. INL vs. Code (External VREF = 2.56 V for 28 Units)
Figure 10. INL vs. Code (External VREF = 5 V, V+ = 5 V for 1 Figure 11. INL vs. Code (External VREF = 5 V, V+ = 5 V for
Unit) 28 Units)
Figure 12. DNL vs. Code (External VREF = 2.56 V for 1 Unit) Figure 13. DNL vs. Code (External VREF = 2.56 V for 28
Units)
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3.0 3.5 4.0 4.5 5.0 5.5
V+ (V)
GAIN ERROR (%)
0.100
0.075
0.050
0.025
-6.939E-18
-0.025
-0.050
-0.075
-0.100
-50.0 -14.0 22.0 58.0 94.0 130.0
TEMPERATURE (°C)
GAIN ERROR (%)
0.230
0.188
0.146
0.104
0.062
0.020
3.2 3.7 4.1 4.6 5.0 5.5
V+ (V)
OFFSET ERROR (%)
0.040
0.030
0.020
0.010
0.000
-50.0 -14.0 22.0 58.0 94.0 130.0
TEMPERATURE (°C)
OFFSET ERROR (%)
0.025
0.024
0.023
0.022
0.021
0.020
0.019
0.018
0.017
0.016
0.015
ADC128D818
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Typical Characteristics (continued)
The following typical performance plots apply for the internal VREF = 2.56 V, V+ = 3.3 V, Pseudo-Differential connection,
unless otherwise specified. All limits TA= TJ= 25°C unless otherwise specified.
Figure 14. Offset Error vs. V+ Figure 15. Offset Error vs. Temperature
Figure 16. Gain Error vs. V+ Figure 17. Gain Error vs. Temperature
Figure 18. I+ vs. Temperature Figure 19. I+ vs. V+ Typical
A. Timing specifications are tested at the Serial Bus Input logic levels: V IN(0) = 0.3 × V + for a falling edge and V IN(1)
= 0.7 × V + for a rising edge if the SCL and SDA edge rates are similar
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2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
V+ (V)
I+ (mA)
1.340
1.298
1.256
1.214
1.172
1.130
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
V+ (V)
1.70
1.60
1.50
1.40
1.30
I+ (mA)
ADC128D818
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Typical Characteristics (continued)
The following typical performance plots apply for the internal VREF = 2.56 V, V+ = 3.3 V, Pseudo-Differential connection,
unless otherwise specified. All limits TA= TJ= 25°C unless otherwise specified.
Figure 21. I+ vs. V+ for Temperature Conversion
Figure 20. I+ vs. V+ for Voltage Conversion
Figure 22. I+ vs. V+ in Shutdown Mode Figure 23. I+ vs. V+ in Deep Shutdown Mode
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12-bit
Delta-
Sigma
ADC and
MUX
Interrupt
Masking
and
Interrupt
Control
Interface and Control
IN0
IN1
IN2
IN3
IN4
IN5
Upper Limit
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Lower Limit
Upper Limit
Lower Limit
IN0
IN1
IN2
IN3
IN4
IN5
IN6
16
15
14
13
12
11
10 Interrupt
Status
Registers
Serial Bus Interface
SDA
SCL A0
Watchdog
327
IN6
IN7
Upper Limit
Lower Limit
Upper Limit
Lower Limit
IN7 9
V+
GND
VREF 1
4
5
6
A1
8
INT
Internal
VREF =
2.56V
Tempe-
rature
Temperature Thot
Thot_hyst
ADC128D818
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8 Detailed Description
8.1 Overview
The ADC128D818 provides 8 analog inputs, a temperature sensor, a delta-sigma ADC, an external or internal
VREF option, and WATCHDOG registers on a single chip. An I2C Serial Bus interface is also provided. The
ADC128D818 can perform voltage and temperature monitoring for a variety of systems.
The ADC128D818 continuously converts the voltage input to 12-bit resolution with an internal VREF of 0.625-mV
LSb (Least Significant bit) weighting, yielding input range of 0 V to 2.56 V. There is also an external VREF option
that ranges from 1.25 V to V+. The analog inputs are intended to be connected to several power supplies
present in a variety of systems. Eight inputs can be configured for single-ended and/or pseudo-differential
channels. Temperature can be converted to a 9-bit two's complement word with resolutions of 0.5°C per LSb.
The ADC128D818 provides a number of internal registers. These registers are summarized in Table 19.
The ADC128D818 supports Standard Mode (Sm, 100 kbps) and Fast Mode (Fm, 400 kbps) I2C interface modes
of operation. ADC128D818 includes an analog filter on the I2C digital control lines that allows improved noise
immunity. The device also supports TIME-OUT reset function on SDA and SCL to prevent I2C bus lock-up. Two
tri-level address pins allow up to 9 devices on a single I2C bus.
At start-up, ADC128D818 cycles through each measurement in sequence and continuously loops through the
sequence based on the Conversion Rate Register (address 07h) setting. Each measured value is compared to
values stored in the Limit Registers (addresses 2Ah - 39h). When the measured value violates the programmed
limit, the ADC128D818 will set a corresponding interrupt bit in the Interrupt Status Registers (address 01h). An
interrupt output pin, INT, is also available and fully programmable.
8.2 Functional Block Diagram
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SRC
-+
IN0
ADC128D818
IN1
IN2
IN3
IN6
IN7
IN4
IN5
GND
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8.3 Feature Description
8.3.1 Supply Voltage (V+)
The ADC128D818 operates with a supply voltage, V+, that has a range between 3 V to 5.5 V. Take care to
bypass this pin with a parallel combination of 1-µF (electrolytic or tantalum) capacitor and 0.1-µF (ceramic)
bypass capacitor.
8.3.2 Voltage References (VREF)
The reference voltage (VREF) sets the analog input range. The ADC128D818 has two options for setting VREF.
The first option is to use the internal VREF, which is equal to 2.56 V. The second option is to source VREF
externally through pin 1 of ADC128D818. In this case, the external VREF will operate in the range of 1.25 V to
V+. The default VREF selection is the internal VREF. If the external VREF is preferred, use the Advanced
Configuration Register Address 0Bh to change this setting.
VREF source must have a low output impedance and needs to be bypassed with a minimum capacitor value of
0.1 µF. A larger capacitor value of 1 µF placed in parallel with the 0.1 µF is preferred. VREF of the
ADC128D818, like all ADC converters, does not reject noise or voltage variations. Keep this in mind if VREF is
derived from the power supply. Any noise and/or ripple from the supply that is not rejected by the external
reference circuitry will appear in the digital results. The use of a reference source is recommended. The LM4040
and LM4050 shunt reference families as well as the LM4120 and LM4140 series reference families are excellent
choices for a reference source.
8.3.3 Analog Inputs (IN0 - IN7)
The ADC128D818 allows up to 8 single-ended inputs or 4 pseudo-differential inputs as selected by the modes of
operation. The input types are described in the next subsections.
8.3.3.1 Single-Ended Input
ADC128D818 allows a maximum of 8 single-ended inputs, where the source's voltage is connected to INx (0 x
7). The source’s ground must be connected to ADC128D818’s GND pin. In theory, INx can be of any value
between 0V and (VREF-3LSb/2), where LSb = VREF/212.
To use the device single-endedly, refer to the Modes of Operation section and to bits [2:1] of the Advanced
Configuration Register Address 0Bh.Figure 24 shows the appropriate configuration for a single-ended
connection.
Figure 24. Single-Ended Configuration
8.3.3.2 Pseudo-Differential Input
Pseudo-differential mode is defined as the positive input voltage applied differentially to the ADC128D818, as
shown in Figure 25. The input that is digitized is (ΔVIN = IN+ - IN–), where (IN+ - IN–) is (IN0-IN1), (IN3-IN2),
(IN4-IN5), or (IN7-IN6). Be aware of this input configuration because the order is swapped. In theory, ΔVIN can
be of any value between 0 V and (VREF 3LSb/2), where LSb = VREF/212.
By using this pseudo-differential input, small signals common to both inputs are rejected. Thus, operation with a
pseudo-differential input signal will provide better performance than with a single-ended input. See Modes of
Operation for more information.
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SRC
-+
IN0 (+)
ADC128D818
IN1 (-)
IN3 (+)
IN2 (-)
IN7 (+)
IN6 (-)
IN4 (+)
IN5 (-)
ADC128D818
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Feature Description (continued)
Figure 25. Pseudo-Differential Configuration
8.4 Device Functional Modes
8.4.1 Modes of Operation
ADC128D818 allows 4 modes of operation, as summarized in the following table. Set the desired mode of
operation using the Advanced Configuration Register Address 0Bh, bits [2:1]).
Table 1. Modes of Operation
CH. MODE 0 MODE 1 MODE 2 MODE 3
IN0 (+) and
1 IN0 IN0 IN1 (-) IN0
IN3 (+) and
2 IN1 IN1 IN2 (-) IN1
IN4 (+) and
3 IN2 IN2 IN5 (-) IN2
IN7 (+) and
4 IN3 IN3 IN6 (-) IN3
IN4 (+) and
5 IN4 IN4 IN5 (-)
IN7 (+) and
6 IN5 IN5 IN6 (-)
7 IN6 IN6
8 nc(1) IN7
Local
Temp Yes No Yes Yes
(1) nc = No Connect
8.5 Programming
8.5.1 Interface
The Serial Bus control lines include the SDA (serial data), SCL (serial clock), and A0-A1 (Serial Bus Address)
pins. The ADC128D818 can only operate as a slave. The SCL line only controls the serial interface, and all of
other clock functions within ADC128D818 are done with a separate asynchronous internal clock.
When the Serial Bus Interface is used, a write will always consists of the ADC128D818 Serial Bus Address byte,
followed by the Register Address byte, then the Data byte. Figure 26 and Figure 27 are two examples showing
how to write to the ADC128D818.
There are two cases for a read:
1. If the Register Address is known to be at the desired address, simply read the ADC128D818 with the Serial
Bus Address byte, followed by the Data byte read from the ADC128D818. Examples of this type of read can
be seen in Figure 28 and Figure 29.
2. If the Register Address value is unknown, write to the ADC128D818 with the Serial Bus Address byte,
followed by the desired Register Address byte. Then restart the Serial Communication with a Read
consisting of the Serial Bus Address byte, followed by the Data byte read from the ADC128D818. See
Figure 30 and Figure 31 for examples of this type of read.
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D7 D6 D5 D4 D3 D2 D1 D0
1 9 1 9
Ack by
ADC128D818
Start by
Master
R/W
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Register Address
Byte from Master
A2 A0A1
A3A4A5A6
SCL
SDA Stop by
Master
Ack by
ADC128D818
ADC128D818
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Programming (continued)
The Serial Bus Address can be found in the next section, and the Register Address can be found in Register
Maps. For more information on the I2C Interface, refer to NXP's "I2C-Bus Specification and User Manual", rev.
03.
8.5.1.1 Serial Bus Address
There are nine different configurations for the ADC128D818 Serial Bus Address, thus nine devices are allowed
on a single I2C bus. Examples to set each address bit low, high, or to midscale can be found in System
Examples. The Serial Bus Address can be set as follows:
Table 2. Serial Bus Address Table
SERIAL BUS ADDRESS
A1 A0 SERIAL BUS ADDRESS (HEX)
[A6][A5][A4]...[A0]
LOW LOW 001_1101b 1Dh
LOW MID 001_1110b 1Eh
LOW HIGH 001_1111b 1Fh
MID LOW 010_1101b 2Dh
MID MID 010_1110b 2Eh
MID HIGH 010_1111b 2Fh
HIGH LOW 011_0101b 35h
HIGH MID 011_0110b 36h
HIGH HIGH 011_0111b 37h
8.5.1.2 Time-out
The ADC128D818 I2C state machine resets to its idle state if either SCL or SDA is held low for longer than 35
ms. This feature also ensures that ADC128D818 will automatically release SDA after driving it low continuously
for 25 to 35 ms, hence preventing I2C bus lock-up. The TIME-OUT feature should not be used when the device
is operating in deep shutdown mode.
8.5.1.2.1 Example Writes and Reads
Figure 26. Serial Bus Interface Write Example 1 - Internal Address Register Set Only
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D7 D6 D5 D4 D3 D2 D1 D0
1 9 1 9
Ack by
ADC128D818
Start by
Master
R/W Ack by
ADC128D818
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Register Address
Byte from Master
D7 D6 D5 D4 D3 D2 D1 D0
1 9
Ack by
ADC128D818
No Ack
by
Master
Stop
by
Master
1 9
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Data Byte
from ADC128D818
R/W
A2 A0A1
A3A4A5A6
Repeat
Start by
Master
A2 A0A1A3A4A5A6
SCL
SDA
SCL
(continued)
SDA
(continued)
D7 D6 D5 D4 D3 D2 D1 D0
1 9 1 9
Ack by
ADC128D818
Start by
Master No Ack
by
Master
SCL
SDA Stop
by
Master
1 9
D15 D14 D13 D12 D11 D10 D9 D8 Ack
by
Master
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Data Byte
from ADC128D818
Frame 3
Data Byte
from ADC128D818
R/W
A2 A0A1
A3A4A5A6
D7 D6 D5 D4 D3 D2 D1 D0
1 9
Start by
Master No Ack
by
Master
SCL
SDA
Stop
by
Master
1 9
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Data Byte
from ADC128D818
R/W
A2 A0A1
A3A4A5A6
Ack by
ADC128D818
D7 D6 D5 D4 D3 D2 D1 D0
1 9 1 9
Start by
Master
R/W
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Register Address
Byte from Master
1 9
Frame 3
Data Byte
D3 D1D2
D4D5D6D7
A2 A0A1A3A4A5A6
SCL
SDA
SCL
(continued)
SDA
(continued) Stop by
Master
D0
Ack by
ADC128D818 Ack by
ADC128D818
Ack by
ADC128D818
ADC128D818
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Figure 27. Serial Bus Interface Write Example 2 - Internal Address Register Set With Data Byte Write
Figure 28. Serial Bus Interface Read Example 1 - Single Byte Read With Preset Internal Address Register
Figure 29. Serial Bus Interface Read Example 2 - Double Byte Read With Preset Internal Address
Register
Figure 30. Serial Bus Interface Read Example 3 - Single Byte Read With Internal Address Set Using a
Repeat Start
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D7 D6 D5 D4 D3 D2 D1 D0
1 9 1 9
Ack by
ADC128D818
Start by
Master
R/W
Ack by
ADC128D818
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Register Address
Byte from Master
D7 D6 D5 D4 D3 D2 D1 D0
1 9 1 9
Ack by
ADC128D818 No Ack by
Master
Stop
by
Master
1 9
D15 D14 D13 D12 D11 D10 D9 D8
Ack by
Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Data Byte
from ADC128D818
Frame 5
Data Byte from
ADC128D818
R/W
A2 A0A1
A3A4A5A6
Repeat
Start by
Master
A2 A0A1A3A4A5A6
SCL
SDA
SCL
(continued)
SDA
(continued)
ADC128D818
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Figure 31. Serial Bus Interface Read Example 4 - Double Byte Read With Internal Address Set Using a
Repeat Start
8.6 Register Maps
8.6.1 ADC128D818 Internal Registers
Table 3. ADC128D818 Internal Registers
REGISTER
READ/ DEFAULT REGISTER
REGISTER NAME ADDRESS REGISTER DESCRIPTION
WRITE VALUE [7:0] FORMAT
(HEX)
Configuration Register R/W 00h 0000_1000 Provides control and configuration 8-bit
Provides status of each WATCHDOG limit or
Interrupt Status Register R 01h 0000_0000 8-bit
interrupt event
Masks the interrupt status from propagating
Interrupt Mask Register R/W 03h 0000_0000 8-bit
to INT
Conversion Rate Register R/W 07h 0000_0000 Controls the conversion rate 8-bit
Disables conversion for each voltage or
Channel Disable Register R/W 08h 0000_0000 8-bit
temperature channel
Initiates a single conversion of all enabled
One-Shot Register W 09h 0000_0000 8-bit
channels
Deep Shutdown Register R/W 0Ah 0000_0000 Enables deep shutdown mode 8-bit
Selects internal or external VREF and modes
Advanced Configuration Register R/W 0Bh 0000_0000 8-bit
of operation
Reflects ADC128D818 'Busy' and 'Not Ready'
Busy Status Register R 0Ch 0000_0010 8-bit
statuses
Report the channels (voltage or temperature)
Channel Readings Registers R 20h - 27h - - - 16-bit
readings
Set the limits for the voltage and temperature
Limit Registers R/W 2Ah - 39h - - - 8-bit
channels
Manufacturer ID Register R 3Eh 0000_0001 Reports the manufacturer's ID 8-bit
Revision ID Register R 3Fh 0000_1001 Reports the revision's ID 8-bit
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8.6.2 Configuration Register Address 00h
Default Value [7:0] = 0000_1000 binary
Table 4. Address 00h
BIT BIT NAME READ/WRITE BIT DESCRIPTION
ALL MODES
0: ADC128D818 in shutdown mode
0 Start Read/Write 1: Enable startup of monitoring operations
1 INT_Enable Read/Write 1: Enable the interrupt output pin, INT
2 Reserved Read Only 1: Clear the interrupt output pin, INT, without affecting the contents of Interrupt Status
3 INT_Clear Read/Write Registers. When this bit is set high, the device stops the round-robin monitoring loop.
4 Reserved Read Only
5 Reserved Read Only
6 Reserved Read Only 1: Restore default values to the following registers: Configuration, Interrupt Status, Interrupt
Mask, Conversion Rate, Channel Disable, One-Shot, Deep Shutdown, Advanced
7 Initialization Read/Write Configuration, Busy Status, Channel Readings, Limit, Manufacturer ID, Revision ID. This bit
clears itself
8.6.3 Interrupt Status Register Address 01h
Default Value [7:0] = 0000_0000 binary
Table 5. Address 01h
BIT BIT NAME READ/WRITE BIT DESCRIPTION
MODE 0
0 IN0 Error Read Only 1: A High or Low limit has been exceeded
1 IN1 Error Read Only 1: A High or Low limit has been exceeded
2 IN2 Error Read Only 1: A High or Low limit has been exceeded
3 IN3 Error Read Only 1: A High or Low limit has been exceeded
4 IN4 Error Read Only 1: A High or Low limit has been exceeded
5 IN5 Error Read Only 1: A High or Low limit has been exceeded
6 IN6 Error Read Only 1: A High or Low limit has been exceeded
7 Hot Temperature Error Read Only 1: A High limit has been exceeded
MODE 1
0 IN0 Error Read Only 1: A High or Low limit has been exceeded
1 IN1 Error Read Only 1: A High or Low limit has been exceeded
2 IN2 Error Read Only 1: A High or Low limit has been exceeded
3 IN3 Error Read Only 1: A High or Low limit has been exceeded
4 IN4 Error Read Only 1: A High or Low limit has been exceeded
5 IN5 Error Read Only 1: A High or Low limit has been exceeded
6 IN6 Error Read Only 1: A High or Low limit has been exceeded
7 IN7 Error Read Only 1: A High or Low limit has been exceeded
MODE 2
0 IN0(+) and IN1(-) Error Read Only 1: A High or Low limit has been exceeded
1 IN3(+) and IN2(-) Error Read Only 1: A High or Low limit has been exceeded
2 IN4(+) and IN5(-) Error Read Only 1: A High or Low limit has been exceeded
3 IN7(+) and IN6(-) Error Read Only 1: A High or Low limit has been exceeded
4 Reserved Read Only
5 Reserved Read Only
6 Reserved Read Only
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Table 5. Address 01h (continued)
BIT BIT NAME READ/WRITE BIT DESCRIPTION
7 Hot Temperature Error Read Only 1: A High limit has been exceeded
MODE 3
0 IN0 Error Read Only 1: A High or Low limit has been exceeded
1 IN1 Error Read Only 1: A High or Low limit has been exceeded
2 IN2 Error Read Only 1: A High or Low limit has been exceeded
3 IN3 Error Read Only 1: A High or Low limit has been exceeded
4 IN4(+) and IN5(-) Error Read Only 1: A High or Low limit has been exceeded
5 IN7(+) and IN6(-) Error Read Only 1: A High or Low limit has been exceeded
6 Reserved Read Only
7 Hot Temperature Error Read Only 1: A High limit has been exceeded
8.6.4 Interrupt Mask Register Address 03h
Default Value [7:0] = 0000_0000 binary
Table 6. Address 03h
BIT BIT NAME READ/WRITE BIT DESCRIPTION
MODE 0
1: Mask the corresponding interrupt status from propagating to the interrupt
0 IN0 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
1 IN1 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
2 IN2 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
3 IN3 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
4 IN4 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
5 IN5 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
6 IN6 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
7 Temperature Mask Read/Write output pin, INT
MODE 1
1: Mask the corresponding interrupt status from propagating to the interrupt
0 IN0 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
1 IN1 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
2 IN2 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
3 IN3 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
4 IN4 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
5 IN5 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
6 IN6 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
7 IN7 Mask Read/Write output pin, INT
MODE 2
1: Mask the corresponding interrupt status from propagating to the interrupt
0 IN0(+) and IN1(-) Mask Read/Write output pin, INT
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Table 6. Address 03h (continued)
BIT BIT NAME READ/WRITE BIT DESCRIPTION
1: Mask the corresponding interrupt status from propagating to the interrupt
1 IN3(+) and IN2(-) Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
2 IN4(+) and IN5(-) Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
3 IN7(+) and IN6(-) Mask Read/Write output pin, INT
4 Reserved Read Only
5 Reserved Read Only
6 Reserved Read Only 1: Mask the corresponding interrupt status from propagating to the interrupt
7 Temperature Mask Read/Write output pin, INT
MODE 3
1: Mask the corresponding interrupt status from propagating to the interrupt
0 IN0 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
1 IN1 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
2 IN2 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
3 IN3 Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
4 IN4(+) and IN5(-) Mask Read/Write output pin, INT
1: Mask the corresponding interrupt status from propagating to the interrupt
5 IN7(+) and IN6(-) Mask Read/Write output pin, INT
6 Reserved Read Only 1: Mask the corresponding interrupt status from propagating to the interrupt
7 Temperature Mask Read/Write output pin, INT
8.6.5 Conversion Rate Register Address 07h
Default Value [7:0] = 0000_0000 binary
Table 7. Address 07h
BIT BIT NAME READ/WRITE BIT DESCRIPTION
Controls the conversion rate:
0: Low Power Conversion Mode
1: Continuous Conversion Mode
0 Conversion Rate Read/Write Note: This register must only be programmed when the device is in shutdown
mode, that is, when the 'START' bit of the 'Configuration Register' (address 00h)
= 0
1–7 Reserved Read Only
8.6.6 Channel Disable Register Address 08h
Default Value [7:0] = 0000_0000 binary
This register must only be programmed when the device is in shutdown mode, that is, when the ‘START’ bit
of the “Configuration Register’ (address 00h) = 0.
Whenever this register is programmed, all of the values in the Channel Reading Registers and Interrupt
Status Registers will return to their default values.
Table 8. Address 08h
BIT BIT NAME READ/WRITE BIT DESCRIPTION
MODE 0
1: Conversions are skipped and disabled, value register reading will be 0, and
0 IN0 Disable Read/Write error events will be suppressed.
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Table 8. Address 08h (continued)
BIT BIT NAME READ/WRITE BIT DESCRIPTION
1: Conversions are skipped and disabled, value register reading will be 0, and
1 IN1 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
2 IN2 Disable Read/Write error events will be suppressed
1: Conversions are skipped and disabled, value register reading will be 0, and
3 IN3 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
4 IN4 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
5 IN5 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
6 IN6 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
7 Temperature Disable Read/Write error events will be suppressed.
MODE 1
1: Conversions are skipped and disabled, value register reading will be 0, and
0 IN0 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
1 IN1 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
2 IN2 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
3 IN3 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
4 IN4 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
5 IN5 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
6 IN6 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
7 IN7 Disable Read/Write error events will be suppressed.
MODE 2
1: Conversions are skipped and disabled, value register reading will be 0, and
0 IN0(+) and IN1(-) Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
1 IN3(+) and IN2(-) Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
2 IN4(+) and IN5(-) Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
3 IN7(+) and IN6(-) Disable Read/Write error events will be suppressed.
4 Reserved Read Only
5 Reserved Read Only
6 Reserved Read Only 1: Conversions are skipped and disabled, value register reading will be 0, and
7 Temperature Disable Read/Write error events will be suppressed.
MODE 3
1: Conversions are skipped and disabled, value register reading will be 0, and
0 IN0 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
1 IN1 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
2 IN2 Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
3 IN3 Disable Read/Write error events will be suppressed.
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Table 8. Address 08h (continued)
BIT BIT NAME READ/WRITE BIT DESCRIPTION
1: Conversions are skipped and disabled, value register reading will be 0, and
4 IN4(+) and IN5(-) Disable Read/Write error events will be suppressed.
1: Conversions are skipped and disabled, value register reading will be 0, and
5 IN7(+) and IN6(-) Disable Read/Write error events will be suppressed.
6 Reserved Read Only 1: Conversions are skipped and disabled, value register reading will be 0, and
7 Temperature Disable Read/Write error events will be suppressed.
8.6.7 One-Shot Register Address 09h
Default Value [7:0] = 0000_0000 binary
Table 9. Address 09h
BIT BIT NAME READ/WRITE BIT DESCRIPTION
1: Initiate a single conversion and comparison cycle when the device is in
0 One-Shot Write Only shutdown mode or deep shutdown mode, after which the device returns to the
respective mode that it was in
1–7 Reserved Read Only
8.6.8 Deep Shutdown Register Address 0Ah
Default Value [7:0] = 0000_0000 binary
Table 10. Address 0Ah
BIT BIT NAME READ/WRITE BIT DESCRIPTION
1: When 'START' = 0 (address 00h, bit 0), setting this bit high will place the
0 Deep Shutdown Enable Read/Write device in deep shutdown mode
1–7 Reserved Read Only
8.6.9 Advanced Configuration Register Address 0Bh
Default Value [7:0] = 0000_0000 binary
Note: Whenever the Advanced Configuration Register is programmed, all of the values in the Channel Reading
Registers and Interrupt Status Registers will return to their default values.
Table 11. Address 0Bh
BIT BIT NAME READ/WRITE BIT DESCRIPTION
0: Selects the 2.56V internal VREF
0 External Reference Enable Read/Write 1: Selects the variable external VREF
Mode Select [1] Mode Select [0] Mode
0 0 Mode 0
1 Mode Select [0] Read/Write 0 1 Mode 1
1 0 Mode 2
2 Mode Select [1] 1 1 Mode 3
3–7 Reserved Read Only
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8.6.10 Busy Status Register Address 0Ch
Default Value [7:0] = 0000_0010 binary
Table 12. Address 0Ch
BIT BIT NAME READ/WRITE BIT DESCRIPTION
0 Busy Read Only 1: ADC128D818 is converting
1 Not Ready Read Only 1: Waiting for the power-up sequence to end
2–7 Reserved Read Only
8.6.11 Channel Readings Registers Addresses 20h 27h
ADDRESS REGISTER NAME READ/WRITE REGISTER DESCRIPTION
MODE 0
20h IN0 Reading Read Only Reading for this perspective channel
21h IN1 Reading Read Only Reading for this perspective channel
22h IN2 Reading Read Only Reading for this perspective channel
23h IN3 Reading Read Only Reading for this perspective channel
24h IN4 Reading Read Only Reading for this perspective channel
25h IN5 Reading Read Only Reading for this perspective channel
26h IN6 Reading Read Only Reading for this perspective channel
27h Temperature Reading Read Only Reading for this perspective channel
MODE 1
20h IN0 Reading Read Only Reading for this perspective channel
21h IN1 Reading Read Only Reading for this perspective channel
22h IN2 Reading Read Only Reading for this perspective channel
23h IN3 Reading Read Only Reading for this perspective channel
24h IN4 Reading Read Only Reading for this perspective channel
25h IN5 Reading Read Only Reading for this perspective channel
26h IN6 Reading Read Only Reading for this perspective channel
27h IN7 Reading Read Only Reading for this perspective channel
MODE 2
20h IN0(+) and IN1(-) Reading Read Only Reading for this perspective channel
21h IN3(+) and IN2(-) Reading Read Only Reading for this perspective channel
22h IN4(+) and IN5(-) Reading Read Only Reading for this perspective channel
23h IN7(+) and IN6(-) Reading Read Only Reading for this perspective channel
24h Reserved Read Only
25h Reserved Read Only
26h Reserved Read Only
27h Temperature Reading Read Only Reading for this perspective channel
MODE 3
20h IN0 Reading Read Only Reading for this perspective channel
21h IN1 Reading Read Only Reading for this perspective channel
22h IN2 Reading Read Only Reading for this perspective channel
23h IN3 Reading Read Only Reading for this perspective channel
24h IN4(+) and IN5(-) Reading Read Only Reading for this perspective channel
25h IN7(+) and IN6(-) Reading Read Only Reading for this perspective channel
26h Reserved Read Only
27h Temperature Reading Read Only Reading for this perspective channel
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8.6.12 Limit Registers Addresses 2Ah 39h
Table 13. Addresses 2Ah 39h
ADDRESS REGISTER NAME READ/WRITE REGISTER DESCRIPTION
MODE 0
2Ah IN0 High Limit Read/Write High Limit
2Bh IN0 Low Limit Read/Write Low Limit
2Ch IN1 High Limit Read/Write High Limit
2Dh IN1 Low Limit Read/Write Low Limit
2Eh IN2 High Limit Read/Write High Limit
2Fh IN2 Low Limit Read/Write Low Limit
30h IN3 High Limit Read/Write High Limit
31h IN3 Low Limit Read/Write Low Limit
32h IN4 High Limit Read/Write High Limit
33h IN4 Low Limit Read/Write Low Limit
34h IN5 High Limit Read/Write High Limit
35h IN5 Low Limit Read/Write Low Limit
36h IN6 High Limit Read/Write High Limit
37h IN6 Low Limit Read/Write Low Limit
38h Temperature High Limit Read/Write High Limit
39h Temperature Hysteresis Limit Read/Write Hysteresis Limit
MODE 1
2Ah IN0 High Limit Read/Write High Limit
2Bh IN0 Low Limit Read/Write Low Limit
2Ch IN1 High Limit Read/Write High Limit
2Dh IN1 Low Limit Read/Write Low Limit
2Eh IN2 High Limit Read/Write High Limit
2Fh IN2 Low Limit Read/Write Low Limit
30h IN3 High Limit Read/Write High Limit
31h IN3 Low Limit Read/Write Low Limit
32h IN4 High Limit Read/Write High Limit
33h IN4 Low Limit Read/Write Low Limit
34h IN5 High Limit Read/Write High Limit
35h IN5 Low Limit Read/Write Low Limit
36h IN6 High Limit Read/Write High Limit
37h IN6 Low Limit Read/Write Low Limit
38h IN7 High Limit Read/Write High Limit
39h IN7 Low Limit Read/Write Low Limit
MODE 2
2Ah IN0(+) and IN1(-) High Limit Read/Write High Limit
2Bh IN0(+) and IN1(-) Low Limit Read/Write Low Limit
2Ch IN3(+) and IN2(-) High Limit Read/Write High Limit
2Dh IN3(+) and IN2(-) Low Limit Read/Write Low Limit
2Eh IN4(+) and IN5(-) High Limit Read/Write High Limit
2Fh IN4(+) and IN5(-) Low Limit Read/Write Low Limit
30h IN7(+) and IN6(-) High Limit Read/Write High Limit
31h IN7(+) and IN6(-) Low Limit Read/Write Low Limit
32h Reserved Read Only
33h Reserved Read Only
34h Reserved Read Only
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Table 13. Addresses 2Ah 39h (continued)
ADDRESS REGISTER NAME READ/WRITE REGISTER DESCRIPTION
35h Reserved Read Only
36h Reserved Read Only
37h Reserved Read Only
38h Temperature High Limit Read/Write High Limit
39h Temperature Hysteresis Limit Read/Write Hysteresis Limit
MODE 3
2Ah IN0 High Limit Read/Write High Limit
2Bh IN0 Low Limit Read/Write Low Limit
2Ch IN1 High Limit Read/Write High Limit
2Dh IN1 Low Limit Read/Write Low Limit
2Eh IN2 High Limit Read/Write High Limit
2Fh IN2 Low Limit Read/Write Low Limit
30h IN3 High Limit Read/Write High Limit
31h IN3 Low Limit Read/Write Low Limit
32h IN4(+) and IN5(-) High Limit Read/Write High Limit
33h IN4(+) and IN5(-) Low Limit Read/Write Low Limit
34h IN7(+) and IN6(-) High Limit Read/Write High Limit
35h IN7(+) and IN6(-) Low Limit Read/Write Low Limit
36h Reserved Read Only
37h Reserved Read Only
38h Temperature High Limit Read/Write High Limit
39h Temperature Hysteresis Limit Read/Write Hysteresis Limit
8.6.13 Manufacturer ID Register Address 3Eh
Default Value [7:0] = 0000_0001 binary
Table 14. Address 3Eh
ADDRESS REGISTER NAME READ/WRITE REGISTER DESCRIPTION
3Eh Manufacturer ID Read Only Manufacturer's ID always defaults to 0000_0001.
8.6.14 Revision ID Register Addresses 3Fh
Default Value [7:0] = 0000_1001 binary
Table 15. Addresses 3Fh
ADDRESS REGISTER NAME READ/WRITE REGISTER DESCRIPTION
3Fh Revision ID Read Only Revision's ID always defaults to 0000_1001.
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|
4095d
|
DOUT
'VIN
(VREF - 3VREF)
1V 2V
3200d
|
|
|
|
1600d
2(212)
|
|
|
ADC128D818
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Digital Output (DOUT)
The digital output code for a 12-bit ADC can be calculated as:
DOUT = [ΔVIN / VREF] × 212 (1)
For Equation 1,ΔVIN = INx GND, where 0 x7, for the single-ended configuration, and ΔVIN = (IN+ - IN–)
for the pseudo-differential configuration. In theory, ΔVIN can be of any value between 0 V and (VREF-3LSb/2).
Any ΔVIN value outside of this range will produce a digital output code of 0 or 4095. Figure 32 shows a
theoretical plot of DOUT vs. ΔVIN and some sample DOUT calculation using Equation 1.
Figure 32. DOUT vs ΔVIN for a 12-Bit ADC Assuming VREF = 2.56 V.
9.1.2 Temperature Measurement System
The ADC128D818 delta-VBE type temperature sensor and delta-sigma ADC perform 9-bit two's-complement
conversions of the temperature. This temperature reading can be obtained at the Temperature Reading Register
(address 27h). This register is 16-bit wide, and thus, all 9 bits of the temperature reading can be read using a
double byte read (Figure 29 or Figure 31). The following Figure 33 and Figure 33 show the theoretical output
code (DOUT) vs. temperature and some typical temperature-to-code conversions.
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Application Information (continued)
(Non-Linear Scale for Clarity)
Figure 33. 9-Bit Temperature-to-Digital Transfer Function
Table 16. Temperature Registers Sample Temperatures
DIGITAL OUTPUT (DOUT)
TEMP BINARY [MSb...LSb] DECIMAL HEX
+125°C 0 _1111_1010 250 0_FA
+25°C 0_0011_0010 50 0_32
+0.5°C 0_0000_0001 1 0_01
+0°C 0_0000_0000 0 0_00
0.5°C 1_1111_1111 511 1_FF
25°C 1_1100_1110 462 1_CE
40°C 1_1011_0000 432 1_B0
In general, the easiest way to calculate the temperature (°C) is to use the following formulas:
If DOUT[MSb] = 0: + Temp(°C) = DOUT(dec) / 2 (2)
If DOUT[MSb] = 1: Temp(°C) = [29 DOUT(dec)] / 2 (3)
9.1.2.1 Temperature Limits
One of the ADC128D818 features is monitoring the temperature reading. This monitoring is accomplished by
setting a temperature limit to the Temperature High Limit Register (Thot , address 38h) and Temperature
Hysteresis Limit Register (Thot_hyst, address 39h). When the temperature reading > Thot, an interrupt occurs. How
this interrupt occurs will be explained in Temperature Interrupt.
Each temperature limit is represented by an 8-bit, two's complement word with a least significant bit (LSb) equal
to 1°C. Table 17 shows some sample temperatures that can be programmed to the Temperature Limit Registers.
In general, use the following equations to calculate the digital code that represents the desired temperature limit:
If Temp Limit (°C) 0: Digital Code (dec) = Temp Limit(°C) (4)
If Temp Limit (°C) < 0: Digital Code (dec) = 28 |Temp Limit(°C)| (5)
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IN0 Watchdog
Interrupt
Status
Registers
Interrupt
Mask
Registers
IN1 Watchdog
IN2 Watchdog
IN3 Watchdog
IN4 Watchdog
IN5 Watchdog
IN6 Watchdog
IN7 Watchdog
TEMP Watchdog
INT_Clear
(00h[3])
INT
Enable
(00h[1])
INT
ADC128D818
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Table 17. Temperature Limit Registers Sample Temperatures
DIGITAL CODE
TEMP LIMIT BINARY [MSb...LSb] DECIMAL HEX
+125°C 0111_1101 125 7D
+25°C 0001_1001 25 19
+1.0°C 0000_0001 1 01
+0°C 0000_0000 0 00
1.0°C 1111_1111 255 FF
25°C 1110_1111 231 E7
40°C 1101_1000 216 D8
9.1.3 Interrupt Structure
Figure 34. Interrupt Structure
Figure 34 shows the ADC128D818's Interrupt Structure.
NOTE
The number next to each bit name represents its register address and bit number. For
example, 'INT_Clear' (00h[3]) refers to bit 3 of register address 00h.
9.1.3.1 Interrupt Output (INT)
ADC128D818 generates an interrupt as a result of each of its internal WATCHDOG registers on the voltage and
temperature channels. In general, INT becomes active when all three scenarios, as depicted in Figure 34, occur:
1. 'INT_Clear' (00h[3]) = 0.
2. 'INT_Enable' (00h[1]) = 1 to enable interrupt output.
3. The voltage reading > the voltage high limit or the voltage low limit, or the temperature reading > Thot.
9.1.3.2 Interrupt Clearing
Reading the Interrupt Status Register (addresses 01h) will output the contents of the register and clear the
register. When the Interrupt Status Register clears, the interrupt output pin, INT, also clears until this register is
updated by the round-robin monitoring loop.
Another method to clear the interrupt output pin, INT, is setting 'INT_Clear' bit (address 00h, bit 3) = 1. When this
bit is high, the ADC128D818 round-robin monitoring loop will stop.
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SDA
SCL
A0
A1
INT
IN7 (+)
I2C Interface and Control
Interrupt
Masking
and
Interrupt
Control
ADC128D818
12-bit
Delta-Sigma
ADC
Internal
VREF = +2.56V
Temperature
Sensor
Interrupt
Status
Registers
GND
VREF
V+
Single-Ended
Positive Voltage
LM94022
Shutdown DC-DC
10VIN VOUT
Margining
Voltage
IN0
IN1
IN2
IN3
Pseudo-Differential
Positive Voltage
IN4 (+)
IN5 (-)
IN6 (-)
RTRACE
ADC128D818
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9.1.3.3 Temperature Interrupt
One of the ADC128D818 features is monitoring the temperature reading. This monitoring is accomplished by
setting a temperature limit to the Temperature High Limit Register (Thot , address 38h) and Temperature
Hysteresis Limit Register (Thot_hyst, address 39h). These limit registers have an interrupt mode, shown in
Figure 35, that operates in the following way: if the temperature reading > Thot, an interrupt will occur and will
remain active indefinitely until reset by reading the Interrupt Status Register (address 01h) or cleared by the
'INT_Clear' bit.
Once an interrupt event has occurred by crossing Thot, then reset, an interrupt will occur again once the next
temperature conversion has completed. The interrupts will continue to occur in this manner until the temperature
reading is Thot_hyst and a read of the Interrupt Status Register has occurred.
Figure 35. Temperature Response Structure
(Assuming the Interrupt Output Pin, INT, is Reset Before the Next Temperature Reading)
9.2 Typical Application
Figure 36. Hardware Monitor Application
9.2.1 Design Requirements
In this typical hardware monitor application, several different sources are being monitored by the ADC128D818.
First, an external temperature sensor (LM94022) is being monitored. An external temperature sensor is
frequently used to monitor ambient temperature of the system.
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I+ = [(0.0168)(b)(I+_VOLTAGE)] + [(4.932)(10-3)(a)(I+_TEMP)]
+ [1 ± (4.932)(10-3)(a) ± 0.0168(b)](I+_SHUTDOWN)
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Typical Application (continued)
9.2.2 Detailed Design Procedure
9.2.2.1 Power Management
To understand the average supply current (I+), the conversion rates must be introduced. ADC128D818 has three
types of conversion rates: Continuous Conversion Mode, Low Power Conversion Mode, and One Shot Mode. In
the Low Power Conversion Mode, the device converts all of the enabled channels then enters shutdown mode;
this process takes approximately 728 ms to complete. (More information on the conversion rate will be discussed
in the Conversion Rate Register Address 07h and One-Shot Register Address 09h sections).
Each type of conversion produces a different average supply current. The supply current for a voltage conversion
will be referred to as I+_VOLTAGE, a temperature conversion as I+_TEMP, and the shutdown mode as
I+_SHUTDOWN. These values can be obtained from Typical Performance Characteristics plots.
In general, I+ is the average supply current while ADC128D818 is operating in the Low Power Conversion Mode
with all of the available channels enabled. Its plot can be seen in Typical Characteristics and its equation,
Equation 6.
where
a is the number of local temperature available.
b is the number of ENABLED voltage channel. (6)
Each mode of operation has a different "a" and "b" values. The following table shows the value for "a" and the
maximum value for "b" for each mode.
Table 18. "A" and "B" Values
a b (MAX)
Mode 0 1 7
Mode 1 0 8
Mode 2 1 4
Mode 3 1 6
9.2.2.2 Using the ADC128D818
Table 19. ADC128D818 Internal Registers
REGISTER
READ/ DEFAULT REGISTER
REGISTER NAME ADDRESS REGISTER DESCRIPTION
WRITE VALUE [7:0] FORMAT
(HEX)
Configuration Register R/W 00h 0000_1000 Provides control and configuration 8-bit
Provides status of each WATCHDOG limit or interrupt
Interrupt Status Register R 01h 0000_0000 8-bit
event
Interrupt Mask Register R/W 03h 0000_0000 Masks the interrupt status from propagating to INT 8-bit
Conversion Rate Register R/W 07h 0000_0000 Controls the conversion rate 8-bit
Disables conversion for each voltage or temperature
Channel Disable Register R/W 08h 0000_0000 8-bit
channel
One-Shot Register W 09h 0000_0000 Initiates a single conversion of all enabled channels 8-bit
Deep Shutdown Register R/W 0Ah 0000_0000 Enables deep shutdown mode 8-bit
Advanced Configuration Selects internal or external VREF and modes of
R/W 0Bh 0000_0000 8-bit
Register operation
Reflects the ADC128D818 'Busy' and 'Not Ready'
Busy Status Register R 0Ch 0000_0010 8-bit
statuses
Channel Readings R 20h - 27h - - - Report channels (voltage or temperature) readings 16-bit
Registers
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Table 19. ADC128D818 Internal Registers (continued)
REGISTER
READ/ DEFAULT REGISTER
REGISTER NAME ADDRESS REGISTER DESCRIPTION
WRITE VALUE [7:0] FORMAT
(HEX)
Set the limits for the voltage and temperature
Limit Registers R/W 2Ah - 39h - - - 8-bit
channels
Manufacturer ID Register R 3Eh 0000_0001 Reports the manufacturer's ID 8-bit
Revision ID Register R 3Fh 0000_1001 Reports the revision's ID 8-bit
9.2.2.2.1 Quick Start
1. Power on the device, then wait for at least 33ms.
2. Read the Busy Status Register (address 0Ch). If the 'Not Ready' bit = 1, then increase the wait time until 'Not
Ready' bit = 0 before proceeding to the next step.
3. Program the Advanced Configuration Register Address 0Bh:
a. Choose to use the internal or external VREF (bit 0).
b. Choose the mode of operation (bits [2:1]).
4. Program the Conversion Rate Register (address 07h).
5. Choose to enable or disable the channels using the Channel Disable Register (address 08h).
6. Using the Interrupt Mask Register (address 03h), choose to mask or not to mask the interrupt status from
propagating to the interrupt output pin, INT.
7. Program the Limit Registers (addresses 2Ah 39h).
8. Set the ‘START’ bit of the Configuration Register (address 00h, bit 0) to 1.
9. Set the 'INT_Clear' bit (address 00h, bit 3) to 0. If needed, program the 'INT_Enable' bit (address 00h, bit 1)
to 1 to enable the INT output.
The ADC128D818 then performs a round-robin monitoring of enabled voltage and temperature channels. The
sequence of items being monitored corresponds to locations in the Channel Readings Registers (except for the
temperature reading). Detailed descriptions of the register map can be found at the end of this data sheet.
9.2.2.2.2 Poweron Reset (POR)
When power is first applied, the ADC128D818 performs a power on reset (POR) on several of its registers, which
sets the registers to their default values. These default values are shown in Table 19 or in Register Maps.
Registers whose default values are not shown have power on conditions that are indeterminate.
9.2.2.2.3 Configuration Register (address 00h)
The Configuration Register (address 00h) provides all control to the ADC128D818. After POR, the 'START' bit
(bit 0) is set low and the 'INT_Clear' bit (bit 3) is set high.
The Configuration Register has the ability to start and stop the ADC128D818, enable and disable the INT output,
and set the registers to their default values.
Bit 0, ‘START’, controls the monitoring loop of the ADC128D818. After POR, set this bit high to start
conversion. Setting this bit low stops the ADC128D818 monitoring loop and puts the ADC128D818 in
shutdown mode; thus, reducing power consumption. Even though this bit is set low, serial bus communication
is possible with any register in the ADC128D818.
After an interrupt occurs, the INT pin will not be cleared if the user sets this bit low.
Bit 1, 'INT_Enable', enables the interrupt output pin, INT, when this bit is set high.
Bit 3, 'INT_Clear', clears the interrupt output pin, INT, when this bit is set high. When this bit is set high, the
ADC128D818 monitoring function will stop. The content of the Interrupt Status Register (address 01h) will not
be affected.
Bit 7, ‘INITIALIZATION’, accomplishes the same function as POR, that is, it initializes some of the registers to
their default values. This bit automatically clears after being set high. Setting this bit high, however, does not
reset the Channel Readings Registers (addresses 20h - 27h) and the Limit Registers (addresses 2Ah - 39h).
These registers will be indeterminate immediately after power on. If the Channel Readings Registers contain
valid conversion results and/or the Limit Registers have been previously set, they will not be affected by this
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bit.
9.2.2.2.4 Interrupt Status Register (address 01h)
Each bit in this read-only register indicates whether the voltage reading > the voltage high limit or the voltage
low limit, or the temperature reading > the temperature high limit. For example, if "IN0 High Limit" register
(address 2Ah) were set to 2 V and if IN0 reading (address 20h) were 2.56 V, then bit 'IN0 Error' would be 1,
indicating that the voltage high limit has been exceeded.
9.2.2.2.5 Interrupt Mask Register (address 03h)
This register masks the interrupt status from propagating to the interrupt output pin, INT. For example, if bit 'IN0
Mask' = 1, then the interrupt output pin, INT, would not be pulled low even if an error event occurs at IN0.
9.2.2.2.6 Conversion Rate Register (address 07h)
There are three options for controlling the conversion rate. The first option is called the Low Power Conversion
Mode, where the device converts all of the enabled channels then enters shutdown mode. This process takes
approximately 728 ms to complete.
The second option is the Continuous Conversion Mode, where the device continuously converts the enabled
channels, thus never entering shutdown mode. A voltage conversion takes 12.2 ms, and a temperature
conversion takes 3.6 ms. For example, if operating in mode 2 and three voltage channels were enabled, then
each round-robin monitor would take 40.2 ms (3 x 12.2ms + 3.6ms) to complete. Use the "Channel Disable
Register" (address 08h) to disable the desired channel(s).
The third option is called the ON-Shot mode, which will be discussed in the next subsection.
9.2.2.2.7 One-Shot Register (address 09h)
The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in
shutdown mode or deep shutdown mode, after which the device returns to the respective mode it was in. The
obvious advantage of using this mode is lower power consumption because the device is operating in shutdown
or deep shutdown mode.
This register is not a data register, and it is the write operation that causes the one-shot conversion. The data
written to this address is irrelevant and is not stored. A zero will always be read from this register.
9.2.2.2.8 Deep Shutdown Register (address 0Ah)
The ADC128D818 can be placed in deep shutdown mode, thus reducing more power consumption. The
procedures for deep shutdown entrance are:
1. Enter shutdown by setting the ‘START’ bit of the “Configuration Register’ (address 00h, bit 0) to 0.
2. Enter deep shutdown by setting the ‘DEEP SHUTDOWN’ bit (address 0Ah, bit 0) to 1.
3. A one-shot conversion can be triggered by writing any values to register address 09h.
Deep Shutdown Exit Procedure:
1. Set the ‘DEEP SHUTDOWN’ bit to 0.
9.2.2.2.9 Channel Readings Registers (addresses 20h - 27h)
The channel conversion readings are available in registers 20h to 27h. Each register is 16-bit wide to
accommodate the 12-bit voltage reading or 9-bit temperature reading. Conversions can be read at any time and
will provide the result of the last conversion. If a conversion is in progress while a communication is started, that
conversion will be completed, and the Channel Reading Registers will not be updated until the communication is
complete.
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SDA
SCL
A0
A1
IN0
ADC128D818
GND
V+
IN1
VREF
IN5-
LM4140 +
+0.1 PF
(optional)
Positive
Pseudo-
Differential
Input Voltage
Positive
Single-Ended
Input Voltage
R1
R2
VS1 INT
Microcontroller
R
GPO1
GPO2
GPO3
GPO4
RA_top
RA_bottom
R R
1 PF
1 PF
0.1 PF
IN4+
R3
R4
VS2
VIN2 IN2
IN3
IN7+
IN6-
RTRACE
RA_top
RA_bottom
500.0 1.2k 1.9k 2.7k 3.4k 4.1k
CODE
TUE (%)
-0.020
-0.060
-0.100
-0.140
-0.180
-0.220
ADC128D818
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9.2.3 Application Curve
Figure 37. Total Unadjusted Error
9.3 System Examples
9.3.1 General Voltage Monitoring
Figure 38. Typical Analog Input Application
A typical application for ADC128D818 is voltage monitoring. In this application, the inputs would most often be
connected to linear power supplies of 2.5-V, 3.3-V, ±5-V and ±12-V inputs. These inputs must be attenuated with
external resistors to any desired value within the input range. The attenuation is done with resistors R1 and R2
for the positive single-ended voltage, and R3 and R4 for the positive pseudo-differential voltage.
A typical single-ended application might select the input voltage divider to provide 1.9 V at the analog input of the
ADC128D818. This is sufficiently high for good resolution of the voltage, yet leaves headroom for upward
excursions from the supply of about 25%. To simplify the process of resistor selection, set the value of R2 first.
Select a value for R2 between 10 kΩand 100 kΩ. This is low enough to avoid errors due to input leakage
currents yet high enough to protect both the inputs under and overdrive conditions as well as minimize loading of
the source. Finally, calculate R1 to provide a 1.9-V input using simple voltage divider derived formula:
R1 = [(VS1 - VIN2) / VIN2 ] × R2 (7)
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Microcontroller
SDA
SCL
A0
A1
INT
IN0
ADC128D818
GND
V+
IN1
IN2
IN3
IN4+
VREF
IN5-
IN6
IN7
RB_top
LM4140 +
(optional)
+0.1 PF
SHUTDOWN DC-DC
10VIN
rgining Voltage V+
V+
RTRACE
RRR
RB_bottom
1 PF
1 PF0.1 PF
RB_top
RB_bottom
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System Examples (continued)
Take care to bypass V+ with decoupling 0.1-µF ceramic capacitor and 1-µF tantalum capacitor. If using the
external reference option, VREF must be connected to a voltage reference, such as the LM4140, and must also
be decoupled to the ground plane by a 0.1-µF ceramic capacitor and a 1-µF tantalum capacitor. For both
supplies, the 0.1-µF capacitor must be located as close as possible to the ADC128D818.
Since SDA, SCL, and INT are open-drain pins, they must have external pullup resistors to ensure that the bus is
pulled high until a master device or slave device sinks enough current to pull the bus low. A typical pullup
resistor, R, ranges from 1.1 kΩto 10 kΩ. Refer to NXP's "I2C-Bus Specification and User Manual" for more
information on sizing R.
Because there are two tri-level address pins (A0 and A1), up to 9 devices can share the same I2C bus. A trick to
set these serial addresses uses four GPO (general purpose output) pins from the master device as shown in the
example diagram. Table 20 shows how to program these GPO pins.
Table 20. Setting Serial Bus Address Using GPO
A1 A0 GPO1 GPO2 GPO3 GPO4
LOW LOW Z LOW Z LOW
LOW MID Z LOW HIGH LOW
LOW HIGH Z LOW HIGH Z
MID LOW HIGH LOW Z LOW
MID MID HIGH LOW HIGH LOW
MID HIGH HIGH LOW HIGH Z
HIGH LOW HIGH Z Z LOW
HIGH MID HIGH Z HIGH LOW
HIGH HIGH HIGH Z HIGH Z
9.3.2 Voltage Monitoring for Power Supplies
Figure 39. Power Supply Application
Figure 39 shows a more complete systems application using a DC–DC converter. Such configuration can be
used in a power supply application. The point to make with this example diagram is the Serial Bus Address
connections. The previous example shows A0 and A1 connected to four GPOs, but this example shows a
simpler A0 and A1 connection using two resistor dividers. This connection accomplishes the same goal as the
GPO connection, that is, it can set A0 and A1 high, low, or to midscale.
36 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: ADC128D818
SDA
SCL
A0
A1
INT
IN0
ADC128D818
GND
V+
IN1
IN2
IN3
IN4
VREF
IN5
IN6
IN7
LM4140 +
(optional)
OUT
VDD
GND
LM94022
GS1
GS0
+0.1 PF
Microcontroller
RA_top GPO1
GPO2
GPO3
GPO4
RR R
RA_bottom
1 PF
1 PF0.1 PF
RA_top
RA_bottom
ADC128D818
www.ti.com
SNAS483F FEBRUARY 2010REVISED AUGUST 2015
For example, to set A0 high, don't populate RB_bottom; to set A0 low, don't populate RB_top; and to set A0 to
midscale, leave RB_top and RB_bottom as is and set them equal to each other. A typical RB value ranges from
1 kOhm to 10 kOhm.
9.3.3 Temperature Sensors
Figure 40. Temperature Sensor Applications
An external temperature sensor can be connected to any of ADC128D818's eight single-ended input for
additional temperature sensing. One such temperature sensor can be TI's LM94022, a precision analog
temperature sensor with selectable gains. The application diagram shows LM94022's gains (GS1 and GS0) both
grounded indicating the lowest gain setting. Four possible gains can be set using these GS1 and GS0 pins.
According to the LM94022 data sheet (SNIS140), the voltage-to-temperature output plot can be determined using
the method of linear approximation as follows:
V V1 = (V2 V1) / (T2 T1) × (T T1)
where
V is in mV
T is in °C
V1 and T1 are the coordinates of the lowest temperature
and T2 and V2 are the coordinates of the highest temperature. (8)
For example, to determine the equation of a line over a temperature range of 20°C to 50°C, first find V1 and V2
relative to those temperatures, then use Equation 8 to find the transfer function.
V 925 mV = (760 mV 925 mV) / (50°C 20°C) × (T 20°C) (9)
V = (–5.50 mV /°C) × T + 1035 mV (10)
For more information and explanation of this example, refer to the LM94022 (SNIS140) data sheet.
Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 37
Product Folder Links: ADC128D818
SDA
SCL
A0
A1
INT
IN0
ADC128D818
GND
V+
IN1
IN2
IN3
IN4
VREF
IN5
IN6
IN7
LM4140 +
+0.1 PF
1
2
1
1
Bridge Sensor
R2
+
-
Instrumentation
Op-Amp
Microcontroller
V+
V+
RB_top
RRR
RB_bottom
R2
R2 R2
1 PF
0.1 PF
1 PF
RB_top
RB_bottom
ADC128D818
SNAS483F FEBRUARY 2010REVISED AUGUST 2015
www.ti.com
9.3.4 Bridge Sensors
Figure 41. Bridge Sensor Application
ADC128D818 is perfect for transducer applications such as pressure sensors. These sensors measure pressure
of gases or liquids and produce a pressure-equivalent voltage at their outputs. Figure 41 shows a typical
connection of a pressure sensor, represented by the bridge sensor.
Most pressure sensor has a low sensitivity characteristic, which means its output is typically in the millivolts
range. Because of that reason, an op-amp, such as an instrumentation amplifier, can be used for the gain stage.
The positive aspect of this configuration is its ratiometric connection. A ratiometric connection is when the ADC’s
VREF and GND are connected to the bridge sensor’s voltage references. With a ratiometric configuration,
external VREF accuracy can be ignored.
10 Power Supply Recommendations
The ADC128D818 operates with a supply voltage, V+, that has a range between 3 V to 5.5 V. Take care to
bypass this pin with a parallel combination of 1-µF (electrolytic or tantalum) capacitor and 0.1-µF (ceramic)
bypass capacitor.
The reference voltage (VREF) sets the analog input range. The ADC128D818 has two options for setting VREF.
The first option is to use the internal VREF, which is equal to 2.56 V. The second option is to source VREF
externally through pin 1 of ADC128D818. In this case, the external VREF will operate in the range of 1.25 V to
V+. The default VREF selection is the internal VREF. If the external VREF is preferred, use the Advanced
Configuration Register Address 0Bh to change this setting.
VREF source must have a low output impedance and needs to be bypassed with a minimum capacitor value of
0.1 µF. A larger capacitor value of 1 µF placed in parallel with the 0.1 µF is preferred. VREF of the
ADC128D818, like all ADC converters, does not reject noise or voltage variations. Keep this in mind if VREF is
derived from the power supply. Any noise and/or ripple from the supply that is not rejected by the external
reference circuitry will appear in the digital results. The use of a reference source is recommended. The LM4040
(SLOS746) and LM4050 (SNOS455) shunt reference families as well as the LM4120 (SNVS049) and LM4140
(SNVS053) series reference families are excellent choices for a reference source.
38 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: ADC128D818
16-Pin
TSSOP
C1
GND
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7A1
A0
INTB
VREF
+V
C2
R1 R2
SCL
SDA
GND
ADC128D818
www.ti.com
SNAS483F FEBRUARY 2010REVISED AUGUST 2015
11 Layout
11.1 Layout Guidelines
Analog inputs will provide best accuracy when referred to the GND pin or a supply with low noise. A separate,
low-impedance ground plane for analog ground, which provides a ground point for the voltage dividers and
analog components, will provide best performance but is not mandatory. Analog components such as voltage
dividers must be located physically as close as possible to the ADC128D818.
11.2 Layout Example
Figure 42. Sample Layout
Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 39
Product Folder Links: ADC128D818
ADC128D818
SNAS483F FEBRUARY 2010REVISED AUGUST 2015
www.ti.com
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
LM94022/22Q 1.5V, SC70, Multi-Gain Analog Temp Sensor w/Class-AB Output,SNIS140
LM4040-EP Precision Micropower Shunt Voltage Reference,SLOS746
LM4050-N/LM4050-N-Q1 Precision Micropower Shunt Voltage Reference,SNOS455
LM4120 Precision Micropower Low Dropout Voltage Reference,SNVS049
LM4140 High Precision Low Noise Low Dropout Voltage Reference,SNVS053
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
40 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: ADC128D818
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ADC128D818CIMT/NOPB ACTIVE TSSOP PW 16 92 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 128D818
CIMT
ADC128D818CIMTX/NOPB ACTIVE TSSOP PW 16 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 128D818
CIMT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ADC128D818CIMTX/NOP
BTSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADC128D818CIMTX/NOP
BTSSOP PW 16 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2018
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
BNOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
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