TinyLogic ULP-A Dual Buffer with Schmitt-Trigger Input NC7WV17 The NC7WV17 is a dual buffer with Schmitt-trigger input in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. www.onsemi.com MARKING DIAGRAMS Features * * * * * * * Designed for 0.9 V to 3.6 V VCC Operation 2.2 ns tPD at 3.3 V (Typ) Inputs/Outputs Over-Voltage Tolerant up to 3.6 V IOFF Supports Partial Power Down Protection Source/Sink 24 mA at 3.3 V Available in SC-88A and MicroPakTM Packages These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant SIP6 1.45X1.0 MicroPak CASE 127EB CCKK XYZ Pin 1 CC KK XY Z = Specific Device Code = 2-Digit Lot Run Traceability Code = 2-Digit Date Code = Assembly Plant Code 6 A1 1 6 Y1 GND 2 5 VCC A2 3 4 Y2 A1 1 GND 2 5 VCC A2 3 4 Y2 MicroPak SC-88A SC-88 DF SUFFIX CASE 419B-02 6 Y1 Figure 1. Pinout Diagrams (Top Views) XXXMG G 1 1 XXX = Specific Devic Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) A1 1 Y1 A2 1 Y2 *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering, marking and shipping information on page 7 of this data sheet. Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function Input Output 1 A1 L L 2 GND H H 3 A2 4 Y2 5 VCC 6 Y1 (c) Semiconductor Components Industries, LLC, 2004 February, 2021 - Rev. 2 1 Publication Order Number: NC7WV17/D NC7WV17 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +4.3 V VIN DC Input Voltage -0.5 to +4.3 V -0.5 to VCC + 0.5 -0.5 to +4.3 -0.5 to +4.3 V VIN < GND -50 mA VOUT < GND -50 mA VOUT Characteristics DC Output Voltage Active-Mode (High or Low State) Tri-State Mode (Note 1) Power-Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current 50 mA DC Supply Current per Supply Pin or Ground Pin 50 mA ICC or IGND TSTG -65 to +150 C TL Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds 260 C TJ Junction Temperature Under Bias +150 C qJA Thermal Resistance (Note 2) SC-88A MicroPak 377 154 C/W PD Power Dissipation in Still Air SC-88A MicroPak 332 812 mW Level 1 - Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in - Human Body Mode Charged Device Mode 2000 1000 mW 100 mA MSL Moisture Sensitivity FR Flammability Rating VESD ILatchup ESD Withstand Voltage (Note 3) Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri-stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow per JESD51-7. 3. HBM tested to EIA / JESD22-A114-A. CDM tested to JESD22-C101-A. JEDEC recommends that ESD qualification to EIA/JESD22-A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. www.onsemi.com 2 NC7WV17 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active-Mode (High or Low State) Tri-State Mode (Note 1) Power-Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise and Fall Time Min Max Unit 0.9 3.6 V 0 3.6 V 0 0 0 VCC 3.6 3.6 -40 +85 C 0 No Limit ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter VP Positive Threshold Voltage VN VH Negative Threshold Voltage Hysteresis Voltage Condition VCC (V) Min Typ 0.9 - 1.1 - 1.4 TA = -405C to +855C Max Min Max Unit 0.62 - - 1.0 - - V - 1.0 - - 1.25 - 1.25 1.65 - 2.3 - - 1.5 - 1.5 - 1.8 - 1.8 2.7 0.9 - - 2.2 - 2.2 - 0.34 - - - 1.1 0.15 - - 0.15 - 1.4 0.2 - - 0.2 - 1.65 0.25 - - 0.25 - 2.3 0.4 - - 0.4 - 2.7 0.6 - - 0.6 - 0.9 - 0.29 - - - 1.1 0.08 - 0.6 0.08 0.6 1.4 0.09 - 0.8 0.09 0.8 1.65 0.15 - 1.0 0.15 1.0 2.3 0.25 - 1.1 0.25 1.1 2.7 0.6 - 1.2 0.6 1.2 www.onsemi.com 3 V V NC7WV17 DC ELECTRICAL CHARACTERISTICS (continued) TA = -405C to +855C TA = 255C Symbol Parameter VOH High-Level Output Voltage Condition Low-Level Output Voltage Input Leakage Current Max Min Max - VCC - 0.1 - - - 1.1 to 1.3 VCC - 0.1 - - VCC - 0.1 - 1.4 to 1.6 VCC - 0.1 - - VCC - 0.1 - 1.65 to 1.95 VCC - 0.2 - - VCC - 0.2 - 2.3 to <2.7 VCC - 0.2 - - VCC - 0.2 - 2.7 to 3.6 VCC - 0.2 - - VCC - 0.2 - IOH = -2 mA 1.1 o 1.3 0.75 x VCC - - 0.75 x VCC - IOH = -4 mA 1.4 to 1.6 0.75 x VCC - - 0.75 x VCC - IOH = -6 mA 1.65 to 1.95 1.25 - - 1.25 - 2.3 to <2.7 2.0 - - 2.0 - IOH = -12 mA 2.3 to <2.7 1.8 - - 1.8 - 2.7 to 3.6 2.2 - - 2.2 - IOH = -18 mA 2.3 to <2.7 1.7 - - 1.7 - 2.7 to 3.6 2.4 - - 2.4 - 2.7 to 3.6 2.2 - - 2.2 - VIN = VIH or VIL IOL = 100 mA Unit V 0.9 IOH = -100 mA V 0.9 - 0.1 - - - 1.1 to 1.3 - - 0.1 - 0.1 1.4 to 1.6 - - 0.1 - 0.1 1.65 to 1.95 - - 0.2 - 0.2 2.3 to < 2.7 - - 0.2 - 0.2 2.7 to 3.6 - - 0.2 - 0.2 1.1 o 1.3 - - 0.25 x VCC - 0.25 x VCC IOL = 4 mA 1.4 to 1.6 - - 0.25 x VCC - 0.25 x VCC IOL = 6 mA 1.65 to 1.95 - - 0.3 - 0.3 IOL = 12 mA 2.3 to <2.7 - - 0.4 - 0.4 2.7 to 3.6 - - 0.4 - 0.4 IOL = 18 mA 2.3 to <2.7 - - 0.6 - 0.6 IOL = 2 mA IIN Typ VIN = VIH or VIL IOH = -24 mA VOL Min VCC (V) 2.7 to 3.6 - - 0.4 - 0.4 IOL = 24 mA 2.7 to 3.6 - - 0.55 - 0.55 VIN = 0 V to 3.6 V 0.9 to 3.6 - - 0.1 - 0.5 mA 0 - - 0.5 - 0.5 mA 0.9 to 3.6 - - 0.9 - 0.9 mA IOFF Power Off Leakage VIN = 0 V to 3.6 V Current or VOUT = 0 V to 3.6 V ICC Quiescent Supply Current VIN = VCC or GND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 NC7WV17 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIII IIIIIII IIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII AC ELECTRICAL CHARACTERISTICS TA = 25C VCC (V) Min Typ RL = 1 MW, CL = 15 pF 0.9 - RL = 2 kW, CL = 15 pF 1.1 to 1.3 - 1.4 to 1.6 Symbol Parameter Condition tPLH, tPHL Propagation Delay, A to Y (Figures 3 and 4) RL = 500 W, CL = 30 pF TA = -405C to +855C Max Min Max Unit 17.4 - 6.1 14.5 - - ns - 19.9 - 3.9 7.0 - 7.5 1.65 to 1.95 - 2.3 to 2.7 - 3.3 5.2 - 6.2 2.6 3.9 - 4.9 2.7 to 3.6 - 2.2 3.8 - 4.2 CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Test Condition Typical (TA = 25C) Unit 2.0 pF Input Capacitance VCC = 0 V COUT Output Capacitance VCC = 0 V 4.5 pF CPD Power Dissipation Capacitance (Note 5) f = 10 MHz, VCC = 0.9 to 3.6 V, VIN = 0 V or VCC 10.0 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD VCC2 fin + ICC VCC. www.onsemi.com 5 NC7WV17 OPEN 2 x VCC GND R1 INPUT OUTPUT DUT RL RT Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC tPHZ / tPZH GND CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH tPHL Vmo OUTPUT tPZH VOH Vmo ~VCC tPHZ VOH VOH - VY Vmo OUTPUT VOL ~0 V VCC, V Vmi, V Vmo, V VY, V 0.9 VCC / 2 VCC / 2 0.1 1.1 to 1.3 VCC / 2 VCC / 2 0.1 1.4 to 1.6 VCC / 2 VCC / 2 0.1 1.65 to 1.95 VCC / 2 VCC / 2 0.15 2.3 to 2.7 VCC / 2 VCC / 2 0.15 3.0 to 3.6 1.5 1.5 0.3 Figure 4. Switching Waveforms www.onsemi.com 6 NC7WV17 ORDERING INFORMATION Package Marking Pin 1 Orientation (See below) Shipping NC7WV17P6X SC-88 V17 Q4 3000 / Tape & Reel NC7WV17L6X MicroPak AX Q4 5000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Pin 1 Orientation in Tape and Reel MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 7 NC7WV17 PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O www.onsemi.com 8 NC7WV17 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-88/SC70-6/SOT-363 CASE 419B-02 ISSUE Y 1 SCALE 2:1 DATE 11 DEC 2012 2X aaa H D D H A D 6 5 GAGE PLANE 4 1 2 L L2 E1 E DETAIL A 3 aaa C 2X bbb H D 2X 3 TIPS e B 6X b ddd TOP VIEW C A-B D M A2 DETAIL A A 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. ccc C A1 SIDE VIEW C SEATING PLANE END VIEW c RECOMMENDED SOLDERING FOOTPRINT* 6X DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd MILLIMETERS MIN NOM MAX --- --- 1.10 0.00 --- 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 GENERIC MARKING DIAGRAM* 6 XXXMG G 6X 0.30 INCHES NOM MAX --- 0.043 --- 0.004 0.035 0.039 0.008 0.010 0.006 0.009 0.078 0.086 0.082 0.086 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 MIN --- 0.000 0.027 0.006 0.003 0.070 0.078 0.045 0.66 1 2.50 0.65 PITCH XXX = Specific Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "G", may or may not be present. Some products may not follow the Generic Marking. STYLES ON PAGE 2 DOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. 98ASB42985B SC-88/SC70-6/SOT-363 PAGE 1 OF 10 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. www.onsemi.com (c) Semiconductor Components Industries, LLC, 2019 9 www.onsemi.com NC7WV17 SC-88/SC70-6/SOT-363 CASE 419B-02 ISSUE Y DATE 11 DEC 2012 STYLE 1: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 STYLE 2: CANCELLED STYLE 3: CANCELLED STYLE 4: PIN 1. CATHODE 2. CATHODE 3. COLLECTOR 4. EMITTER 5. BASE 6. ANODE STYLE 5: PIN 1. ANODE 2. ANODE 3. COLLECTOR 4. EMITTER 5. BASE 6. CATHODE STYLE 6: PIN 1. ANODE 2 2. N/C 3. CATHODE 1 4. ANODE 1 5. N/C 6. CATHODE 2 STYLE 7: PIN 1. SOURCE 2 2. DRAIN 2 3. GATE 1 4. SOURCE 1 5. DRAIN 1 6. GATE 2 STYLE 8: CANCELLED STYLE 9: PIN 1. EMITTER 2 2. EMITTER 1 3. COLLECTOR 1 4. BASE 1 5. BASE 2 6. COLLECTOR 2 STYLE 10: PIN 1. SOURCE 2 2. SOURCE 1 3. GATE 1 4. DRAIN 1 5. DRAIN 2 6. GATE 2 STYLE 11: PIN 1. CATHODE 2 2. CATHODE 2 3. ANODE 1 4. CATHODE 1 5. CATHODE 1 6. ANODE 2 STYLE 12: PIN 1. ANODE 2 2. ANODE 2 3. CATHODE 1 4. ANODE 1 5. ANODE 1 6. CATHODE 2 STYLE 13: PIN 1. ANODE 2. N/C 3. COLLECTOR 4. EMITTER 5. BASE 6. CATHODE STYLE 14: PIN 1. VREF 2. GND 3. GND 4. IOUT 5. VEN 6. VCC STYLE 15: PIN 1. ANODE 1 2. ANODE 2 3. ANODE 3 4. CATHODE 3 5. CATHODE 2 6. CATHODE 1 STYLE 16: PIN 1. BASE 1 2. EMITTER 2 3. COLLECTOR 2 4. BASE 2 5. EMITTER 1 6. COLLECTOR 1 STYLE 17: PIN 1. BASE 1 2. EMITTER 1 3. COLLECTOR 2 4. BASE 2 5. EMITTER 2 6. COLLECTOR 1 STYLE 18: PIN 1. VIN1 2. VCC 3. VOUT2 4. VIN2 5. GND 6. VOUT1 STYLE 19: PIN 1. I OUT 2. GND 3. GND 4. V CC 5. V EN 6. V REF STYLE 20: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR STYLE 21: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. N/C 6. CATHODE 1 STYLE 22: PIN 1. D1 (i) 2. GND 3. D2 (i) 4. D2 (c) 5. VBUS 6. D1 (c) STYLE 23: PIN 1. Vn 2. CH1 3. Vp 4. N/C 5. CH2 6. N/C STYLE 24: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE STYLE 25: PIN 1. BASE 1 2. CATHODE 3. COLLECTOR 2 4. BASE 2 5. EMITTER 6. COLLECTOR 1 STYLE 26: PIN 1. SOURCE 1 2. GATE 1 3. DRAIN 2 4. SOURCE 2 5. GATE 2 6. DRAIN 1 STYLE 27: PIN 1. BASE 2 2. BASE 1 3. COLLECTOR 1 4. EMITTER 1 5. EMITTER 2 6. COLLECTOR 2 STYLE 28: PIN 1. DRAIN 2. DRAIN 3. GATE 4. SOURCE 5. DRAIN 6. DRAIN STYLE 29: PIN 1. ANODE 2. ANODE 3. COLLECTOR 4. EMITTER 5. BASE/ANODE 6. CATHODE STYLE 30: PIN 1. SOURCE 1 2. DRAIN 2 3. DRAIN 2 4. SOURCE 2 5. GATE 1 6. DRAIN 1 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. 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