© Semiconductor Components Industries, LLC, 2004
February, 2021 − Rev. 2
1Publication Order Number:
NC7WV17/D
TinyLogic ULP-A Dual
Buffer with Schmitt-Trigger
Input
NC7WV17
The NC7WV17 is a dual buffer with Schmitt−trigger input in tiny
footprint packages. The device is designed to operate for VCC = 0.9 V
to 3.6 V.
Features
•Designed for 0.9 V to 3.6 V VCC Operation
•2.2 ns tPD at 3.3 V (Typ)
•Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
•IOFF Supports Partial Power Down Protection
•Source/Sink 24 mA at 3.3 V
•Available in SC−88A and MicroPak™ Packages
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6Y1A1 1
GND 2
4Y2A2 3
5V
CC
Figure 1. Pinout Diagrams (Top Views)
SC−88A MicroPak
Figure 2. Logic Symbol
VCC
A1 Y1
GND
A2 Y2
1
2
3
6
5
4
A2 Y2
Y1A1
1
1
PIN ASSIGNMENT
Pin Function
1 A1
2 GND
3 A2
4 Y2
5 VCC
6 Y1
FUNCTION TABLE
Input Output
L L
H H
MARKING
DIAGRAMS
www.onsemi.com
SIP6 1.45X1.0
MicroPak
CASE 127EB
CC = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code
Z = Assembly Plant Code
CCKK
XYZ
Pin 1
See detailed ordering, marking and shipping information on
page 7 of this data sheet.
ORDERING INFORMATION
XXX = Specific Devic Code
M = Date Code
G= Pb−Free Package
1
SC−88
DF SUFFIX
CASE 419B−02
XXXMG
G
1
6
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
NC7WV17
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2
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage −0.5 to +4.3 V
VIN DC Input Voltage −0.5 to +4.3 V
VOUT DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +4.3
−0.5 to +4.3
V
IIK DC Input Diode Current VIN < GND −50 mA
IOK DC Output Diode Current VOUT < GND −50 mA
IOUT DC Output Source/Sink Current ±50 mA
ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±50 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias +150 °C
qJA Thermal Resistance (Note 2) SC−88A
MicroPak
377
154
°C/W
PDPower Dissipation in Still Air SC−88A
MicroPak
332
812
mW
MSL Moisture Sensitivity Level 1 −
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in −
VESD ESD Withstand Voltage (Note 3) Human Body Mode
Charged Device Mode
2000
1000
mW
ILatchup Latchup Performance (Note 4) ±100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
NC7WV17
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3
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 0.9 3.6 V
VIN DC Input Voltage 0 3.6 V
VOUT DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
0
0
0
VCC
3.6
3.6
TAOperating Temperature Range −40 +85 °C
tr , tfInput Transition Rise and Fall Time 0No Limit ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition VCC (V)
TA = 255C TA = −405C to +855C
Unit
Min Typ Max Min Max
VPPositive
Threshold Voltage
0.9 −0.62 − − − V
1.1 − − 1.0 −1.0
1.4 − − 1.25 −1.25
1.65 − − 1.5 −1.5
2.3 − − 1.8 −1.8
2.7 − − 2.2 −2.2
VNNegative
Threshold Voltage
0.9 −0.34 − − − V
1.1 0.15 − − 0.15 −
1.4 0.2 − − 0.2 −
1.65 0.25 − − 0.25 −
2.3 0.4 − − 0.4 −
2.7 0.6 − − 0.6 −
VHHysteresis
Voltage
0.9 −0.29 − − − V
1.1 0.08 −0.6 0.08 0.6
1.4 0.09 −0.8 0.09 0.8
1.65 0.15 −1.0 0.15 1.0
2.3 0.25 −1.1 0.25 1.1
2.7 0.6 −1.2 0.6 1.2
NC7WV17
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4
DC ELECTRICAL CHARACTERISTICS (continued)
TA = −405C to +855CTA = 255C
Symbol Unit
MaxMinMaxTypMin
VCC (V)ConditionParameter
VOH High−Level Output
Voltage
VIN = VIH or VIL V
IOH = −100 mA0.9 −VCC – 0.1 − − −
1.1 to 1.3 VCC – 0.1 − − VCC – 0.1 −
1.4 to 1.6 VCC – 0.1 − − VCC – 0.1 −
1.65 to 1.95 VCC – 0.2 − − VCC – 0.2 −
2.3 to <2.7 VCC – 0.2 − − VCC – 0.2 −
2.7 to 3.6 VCC – 0.2 − − VCC – 0.2 −
IOH = −2 mA 1.1 o 1.3 0.75 x VCC − − 0.75 x VCC −
IOH = −4 mA 1.4 to 1.6 0.75 x VCC − − 0.75 x VCC −
IOH = −6 mA 1.65 to 1.95 1.25 − − 1.25 −
2.3 to <2.7 2.0 − − 2.0 −
IOH = −12 mA 2.3 to <2.7 1.8 − − 1.8 −
2.7 to 3.6 2.2 − − 2.2 −
IOH = −18 mA 2.3 to <2.7 1.7 − − 1.7 −
2.7 to 3.6 2.4 − − 2.4 −
IOH = −24 mA 2.7 to 3.6 2.2 − − 2.2 −
VOL Low−Level
Output Voltage
VIN = VIH or VIL V
IOL = 100 mA0.9 −0.1 − − −
1.1 to 1.3 − − 0.1 −0.1
1.4 to 1.6 − − 0.1 −0.1
1.65 to 1.95 − − 0.2 −0.2
2.3 to < 2.7 − − 0.2 −0.2
2.7 to 3.6 − − 0.2 −0.2
IOL = 2 mA 1.1 o 1.3 − − 0.25 x VCC −0.25 x VCC
IOL = 4 mA 1.4 to 1.6 − − 0.25 x VCC −0.25 x VCC
IOL = 6 mA 1.65 to 1.95 − − 0.3 −0.3
IOL = 12 mA 2.3 to <2.7 − − 0.4 −0.4
2.7 to 3.6 − − 0.4 −0.4
IOL = 18 mA 2.3 to <2.7 − − 0.6 −0.6
2.7 to 3.6 − − 0.4 −0.4
IOL = 24 mA 2.7 to 3.6 − − 0.55 −0.55
IIN Input Leakage
Current
VIN = 0 V to 3.6 V 0.9 to 3.6 − − ±0.1 −±0.5 mA
IOFF Power Off Leakage
Current
VIN = 0 V to 3.6 V
or
VOUT = 0 V to 3.6
V
0− − 0.5 −0.5 mA
ICC Quiescent Supply
Current
VIN = VCC or GND 0.9 to 3.6 − − 0.9 −0.9 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NC7WV17
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5
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Condition
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC (V)
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
TA = 25°C
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
TA = −405C to +855C
ÎÎÎ
ÎÎÎ
ÎÎÎ
Unit
ÎÎÎ
ÎÎÎ
Min
ÎÎÎ
ÎÎÎ
Typ
ÎÎÎ
ÎÎÎ
Max
ÎÎÎÎ
ÎÎÎÎ
Min
ÎÎÎ
ÎÎÎ
Max
tPLH,
tPHL
Propagation Delay,
A to Y (Figures 3 and 4)
RL = 1 MW, CL = 15 pF 0.9 −17.4 − − − ns
RL = 2 kW, CL = 15 pF 1.1 to 1.3 −6.1 14.5 −19.9
1.4 to 1.6 −3.9 7.0 −7.5
RL = 500 W, CL = 30 pF 1.65 to 1.95 −3.3 5.2 −6.2
2.3 to 2.7 −2.6 3.9 −4.9
2.7 to 3.6 −2.2 3.8 −4.2
CAPACITIVE CHARACTERISTICS
Symbol Parameter Test Condition Typical (TA = 25°C) Unit
CIN Input Capacitance VCC = 0 V 2.0 pF
COUT Output Capacitance VCC = 0 V 4.5 pF
CPD Power Dissipation Capacitance (Note 5) f = 10 MHz, VCC = 0.9 to 3.6 V, VIN = 0 V or VCC 10.0 pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption: PD = CPD VCC2 fin + ICC VCC.
NC7WV17
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CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
R1
OUTPUT
RT
2 x VCC
DUT
GND
OPEN
CL*
RL
INPUT
Test Switch Position
tPLH / tPHL Open
tPLZ / tPZL 2 x VCC
tPHZ / tPZH GND
Figure 3. Test Circuit
tr = 3 ns
tPZH tPHZ
tPZL tPLZ
Vmo
Vmo
Vmi
90%
10%
90%
10%
INPUT
OUTPUT
OUTPUT
~0 V
INPUT
OUTPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
VOH
VOL
Vmo
Vmo
Vmi
tPHL tPLH
tPLH tPHL
Vmo
Vmo
Vmi Vmi
VCC
GND
VOL
VOH
VOH − VY
VOL + VY
~VCC
VCC, V Vmi, V Vmo, V VY
, V
0.9 VCC / 2 VCC / 2 0.1
1.1 to 1.3 VCC / 2 VCC / 2 0.1
1.4 to 1.6 VCC / 2 VCC / 2 0.1
1.65 to 1.95 VCC / 2 VCC / 2 0.15
2.3 to 2.7 VCC / 2 VCC / 2 0.15
3.0 to 3.6 1.5 1.5 0.3
Figure 4. Switching Waveforms
NC7WV17
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7
ORDERING INFORMATION
Device Package Marking
Pin 1 Orientation
(See below) Shipping†
NC7WV17P6X SC−88 V17 Q4 3000 / Tape & Reel
NC7WV17L6X MicroPak AX Q4 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Pin 1 Orientation in Tape and Reel
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
NC7WV17
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9
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
Cddd M
123
A1
A
c
654
E
b
6X
XXXMG
G
XXX = Specific Device Code
M = Date Code*
G= Pb−Free Package
GENERIC
MARKING DIAGRAM*
1
6
STYLES ON PAGE 2
1
DIM MIN NOM MAX
MILLIMETERS
A−−− −−− 1.10
A1 0.00 −−− 0.10
ddd
b0.15 0.20 0.25
C0.08 0.15 0.22
D1.80 2.00 2.20
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.10 0.004
E1 1.15 1.25 1.35
e0.65 BSC
L0.26 0.36 0.46
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.078 0.082 0.086
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.66
6X
DIMENSIONS: MILLIMETERS
0.30
PITCH
2.50
6X
RECOMMENDED
TOP VIEW
SIDE VIEW END VIEW
bbb H
B
SEATING
PLANE
DETAIL A E
A2 0.70 0.90 1.00 0.027 0.035 0.039
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
A-B D
aaa C
2X 3 TIPS
D
E1
D
e
A
2X
aaa H D
2X
D
L
PLANE
DETAIL A
H
GAGE
L2
C
ccc C
A2
6X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42985B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 10
SC−88/SC70−6/SOT−363
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
NC7WV17
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10
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 3:
CANCELLED
STYLE 2:
CANCELLED
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 8:
CANCELLED
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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