Specification Number : SP-ZV1CD-J
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
WiFi Module Data Sheet
Cypress BCM43362 WiFi + ST Micro STM32F405 MCU
Electric Imp P/N : imp003
MURATA P/N : LBWA1ZV1CD-716
Specification Number : SP-ZV1CD-J
1 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
Revision history
Issued
Date
Revision
Code
Revision
Page
Changed Items
Change
Reason
Apr.11.2014
First issued
May.23.2014
A
P4
3. Block Diagram, 2MBit -> 4MBi
Jun.3.2014
B
P10
P17
7. Absolute Maximum Rating
8. Operating Condition
9. Electric characteristics
14. Recommended Components
Jul.1.2014
C
P9
P11
P12
P18
5. LED Drive
6. Phototransistor
Corrected reference paragraph
10. External clock source
characteristics add
11. Power Up Sequence
Changed "NRST" to "RESET_L"
15.4. Low Power Schematic
-ABS07-120-32.768kHz-T add
-Changed "ST3215SB32768B0HPWB1"
to "ST3215SB32768B0HPWB3"
Jul.31.2014
D
P10
P18
7. SPI Flash Requirements
Added SPI Flash Requirements
16. Recommended Components
Added SPI Flash
Oct.14.2014
E
P18
16. Recommended Components
-Changed APT2012P3BT with KDT00030TR
-Changed S24FLxxx with S25FLxxx
Jun.8.2015
F
P18
16.5. Low Power Schematic
-Changed "AP2281" to " AP2281-1/AP2281-3"
-Changed "ABS25-32.768KHZ-T"
to "ABS25-32.768KHZ-6-T "
Jan.21.2016
G
P5
P11
P13,14
4.1. Dimensions
-add marking information
11. Electric characteristics
-updated
13. RF Characteristics
-updated current consumption
Apr.26.2016
H
P16
15. Reference Circuit
-Corrected
Oct.13.2016
I
P9, 10,
11, 18
5. LED
- add failure codes
6. Phototransistor
- add RF coupling capacitor recommendation
7. SPI flash
- add more detail on compatible flash types
15.1. Low Cost schematic
- connected OSC32_IN to GND
16.2. Phototransistor
Oct.20.2016
J
Remove RF characteristics section, add typical
specs. Update cloud description
Specification Number : SP-ZV1CD-J
2 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
TABLE OF CONTENTS
1. Scope .................................................................................................................................................... 3!
2. Part Number .......................................................................................................................................... 3!
3. Block Diagram ....................................................................................................................................... 4!
4. Dimensions, Marking and Terminal Configurations ............................................................................... 5!
4.1. Dimensions ..................................................................................................................................... 5!
4.2. Ter m ina l C on f ig ura t i ons .................................................................................................................. 6!
4.3. Pin Mux Table ................................................................................................................................. 8!
5. LED Drive .............................................................................................................................................. 9!
6. Phototransistor .................................................................................................................................... 10!
7. SPI Flash Requirements ..................................................................................................................... 11!
8. Absolute Maximum Ratings ................................................................................................................. 11!
9. Operating Conditions ........................................................................................................................... 11!
10. Electrical characteristics .................................................................................................................... 12!
11. External clock source characteristics ................................................................................................. 12!
11.1. Low-speed external user clock characteristics ............................................................................ 12!
12. Power Up Sequence ......................................................................................................................... 13!
12.1. Without RESET_L control ........................................................................................................... 13!
12.2. With RESET_L control ................................................................................................................ 13!
12.2.1. RESET_L Circuit .................................................................................................................. 13!
13. Land Pattern (Top View) .................................................................................................................... 14!
14. Reference Circuit ............................................................................................................................... 15!
14.1. Low Cost Schematic ................................................................................................................... 15!
14.2. Low Power Schematic ................................................................................................................ 16!
15. Recommended Components ............................................................................................................. 17!
15.1. Bi-color LED ................................................................................................................................ 17!
15.2. Phototransistor ............................................................................................................................ 17!
15.3. SPI Flash .................................................................................................................................... 17!
15.4. Low Cost Schematic ................................................................................................................... 17!
15.5. Low Power Schematic ................................................................................................................ 17!
16. Tap e a n d R e el P a cki n g ...................................................................................................................... 18!
17. NOTICE ............................................................................................................................................. 21!
17.1. Storage Conditions: .................................................................................................................... 21!
17.2. Handling Conditions: ................................................................................................................... 21!
17.3. Standard PCB Design (Land Pattern and Dimensions): ............................................................. 21!
17.4. Notice for Chip Placer: ................................................................................................................ 21!
17.5. Soldering Conditions: .................................................................................................................. 22!
17.6. Cleaning: ..................................................................................................................................... 22!
17.7. Operational Environment Conditions: ......................................................................................... 22!
17.8. Input Power Capacity: ................................................................................................................. 22!
18. PRECONDITION TO USE OUR PRODUCTS .................................................................................. 23!
Please be aware that an important notice concerning availability, standard warranty and use in critical
applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
Specification Number : SP-ZV1CD-J
3 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
1. Scope
This specification is for the LBWA1ZV1CD (imp003) module that provides connectivity to the internet
via WiFi. The fully maintained, secure OS that is part of the Electric Imp cloud service comes
pre-loaded.
• 802.11 b/g/n 1x1 WiFi
802.11b 17.0dBm +/-2.0dBm
802.11g 13.0dBm +/-2.0dBm
802.11n 12.0dBm +/-2.0dBm (20MHz channels)
RX Sensitivity -94dBm typical (@1Mbps)
Diversity antenna switch outputs
Supports WEP, WPA, WPA2, WPS
• 32-bit Cortex M4 processor
- Robust embedded operating system with fail-safe firmware updates
- Virtual machine for customer firmware
- 256kB of application bytecode flash
- Around 130kB of dedicated application RAM
• Electric Imp OS & service
- Robust embedded operating system with fail-safe, secure OS & application updates
- Pre-provisioned MAC address & per-device secrets
- TLS1.2-RSA-ECDHE (forward secrecy) connection to cloud
- Elliptic curve challenge-response to prevent device impersonation
- Fully featured cloud VM for every device for easy integration with RESTful APIs
- Open source integrations with AWS, Azure, etc services
• LED drive for red/green status LEDs
• Phototransistor input for Electric imp’s patented BlinkUpTM technology for easy configuration
from any smartphone, tablet, or web browser
• 23 user selectable I/Os
- GPIO, PWM, Analog input & output, SPI, UART, I2C
- Dedicated SPI bus for local storage
• Low power 4uA sleep mode (with external load switch)
- Option for coin cell RTC battery backup
• Compliant with the RoHS directive
2. Part Number
Sample Part Number
LBWA1ZV1CD-TEMP
Production Part Number
LBWA1ZV1CD-716
Specification Number : SP-ZV1CD-J
4 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
3. Block Diagram
STM32F405
BCM43362
SPDT LPF
32.768KHz
xtal
26MHz
xtal
26MHz
xtal
DC/DC
inductor
opto
23
I/Os
4Mbit or higher density
SPI Flash
3.3V switch power supply
Load switch
antenna
LBWA1ZV1CD-716
<Low Power Block Diagram>
STM32F405
BCM43362
SPDT LPF
26MHz
xtal
26MHz
xtal
DC/DC
inductor
opto
23
I/Os
4Mbit SPI
Flash 3.3V LDO
antenna
LBWA1ZV1CD-716
<Low Cost Block Diagram>
Specification Number : SP-ZV1CD-J
5 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
4. Dimensions, Marking and Terminal Configurations
4.1. Dimensions
12
3456789
1011121314
15
16
17
18
19
20
21
22
23 24 25 26 27 28 29 30 31 32 33 34 35 36
37
38
39
40
41
42
43
44
45464748495051525354
55 56 57 58 59 60 61 62 63 64
656667686970
71 72 73 74 75 76
b1a1e1a2
e2
e3a3e4c1
b2
c2
e5
a4
e6
a5 e8
c3
e9
c4
e10
c5
m1
m2
T
W
Le7
Mark
Dimensions
Mark
Dimensions
Mark
Dimensions
L
10.0 +/- 0.2
W
7.9 +/- 0.2
T
1.25 max.
a1
0.65 +/- 0.1
a2
0.35 +/- 0.1
a3
0.35 +/- 0.1
a4
0.35 +/- 0.1
a5
0.80 +/- 0.1
b1
0.30 +/- 0.2
b2
0.30 +/- 0.2
c1
0.80 +/- 0.1
c2
0.80 +/- 0.1
c3
0.80 +/- 0.1
c4
0.80 +/- 0.1
c5
0.80 +/- 0.1
e1
0.30 +/- 0.1
e2
0.30 +/- 0.1
e3
0.30 +/- 0.1
e4
0.80 +/- 0.1
e5
0.40 +/- 0.1
e6
0.30 +/- 0.1
e7
0.75 +/- 0.1
e8
0.30 +/- 0.1
e9
0.50 +/- 0.1
e10
0.60 +/- 0.1
m1
0.40 +/- 0.1
m2
0.40 +/- 0.1
(unit : mm)
Marking
Marking
Meaning
(A)
Pin 1 Marking
(B)
Murata Logo
(C)
Inspection Number
(D)
Module Type
(E)
Electric Imp Logo
(F)
2D code
< Side View >
< Bottom View >
< Top View >
xxxxxxxxx
1CD
electricimp
(D)
(C)
(A)
(E)
(B)
(F)
Specification Number : SP-ZV1CD-J
6 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
4.2. Terminal Configurations
No.
Terminal Name
Type
Description
1
GND
-
Ground
2
OPTO_BIAS
O
Phototransistor bias voltage
3
OPTO_IN
I
Phototransistor input
4
PinW
I/O
I/O, please refer to Pin mux table
5
OSC32_IN
I
MCU sleep clock input
6
OSC32_OUT
O
MCU sleep clock output
7
PinN
I/O
I/O, please refer to Pin mux table
8
PSU_EN
O
External power supply enable
9
WLAN_POWER_EN
O
External power gate enable
10
GND
-
Ground
11
GND
-
Ground
12
ANT
-
Antenna
13
GND
-
Ground
14
GND
-
Ground
15
VDD
PI
Power supply for MCU VDD and WLAN Digital IO
16
WLAN_ANT_CTL2
O
Antenna switch control. Default is low.
NC if not in use.
17
WLAN_ANT_CTL1
O
Antenna switch control. Default is high.
NC if not in use.
18
VDD_PA
PI
Power supply for Internal Power Amplifier.
19
VDD_PA
PI
20
VDD_WLAN
PI
Power supply for WLAN IC
21
VDD_WLAN
PI
22
VDD_DCDC_IN
PI
Voltage input for core LDO, low noise LDO1 and
VCO/LDO
23
GND
-
Ground
24
VDD_DCDC_OUT
PO
Voltage output for core LDO.
25
SPIFLASH_NCS
O
SPI flash nCS
26
SPIFLASH_MISO
I
SPI flash MISO
Specification Number : SP-ZV1CD-J
7 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
27
SPIFLASH_MOSI
O
SPI flash MOSI
28
SPIFLASH_SCK
O
SPI flash CLK
29
LED_RED
O
Must be connected to the Red terminal of the indicator
LED
30
LED_GREEN
O
Must be connected to the Green terminal of the indicator
LED
31
PinM
I/O
I/O, please refer to Pin mux table
32
PinL
I/O
I/O, please refer to Pin mux table
33
PinK
I/O
I/O, please refer to Pin mux table
34
PinJ
I/O
I/O, please refer to Pin mux table
35
PinH
I/O
I/O, please refer to Pin mux table
36
GND
-
Ground
37
PinG
I/O
I/O, please refer to Pin mux table
38
PinF
I/O
I/O, please refer to Pin mux table
39
PinE
I/O
I/O, please refer to Pin mux table
40
PinD
I/O
I/O, please refer to Pin mux table
41
PinC
I/O
I/O, please refer to Pin mux table
42
PinB
I/O
I/O, please refer to Pin mux table
43
PinA
I/O
I/O, please refer to Pin mux table
44
VDDA
PI
MCU analog power and reference, must be connected to
VDD
45
VBAT
PI
MCU retention RAM and RTC backup supply
46
PinY
I/O
I/O, please refer to Pin mux table
47
GND
-
Ground
48
PinV
I/O
I/O, please refer to Pin mux table
49
GND
-
Ground
50
DNC
-
Do not connect
51
GND
-
Ground
52
RESET_L
I
MCU reset, internally pulled up
53
GND
-
Ground
54
GND
-
Ground
Specification Number : SP-ZV1CD-J
8 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
55
GND
-
Ground
56
GND
-
Ground
57
GND
-
Ground
58
PinQ
I/O
I/O, please refer to Pin mux table
59
PinR
I/O
I/O, please refer to Pin mux table
60
PinT
I/O
I/O, please refer to Pin mux table
61
PinP
I/O
I/O, please refer to Pin mux table
62
PinS
I/O
I/O, please refer to Pin mux table
63
PinU
I/O
I/O, please refer to Pin mux table
64
PinX
I/O
I/O, please refer to Pin mux table
65
VSSA
-
MCU analog ground, must be connected to GND
66-
76
GND
-
Ground
4.3. Pin Mux Table
Pin uartFG uartQRPW uartUVGD uartWJ uartDM i2cFG i2cAB spiEBCA spiLGDK ADC DAC PWM
Wake from
sleep
State
change
callback
Pin trig
pulse gen
Pin A SCL nSS yes yes yes
Pin B SDA MISO yes yes yes
Pin C SCLK yes yes yes yes
Pin D CTS TX SCLK yes
Pin E MOSI yes yes yes for C
Pin F TX SCL yes yes for K,X
Pin G RX RTS SDA MISO yes
Pin H yes
Pin J RX yes
Pin K nSS yes yes
Pin L MOSI yes for G
Pin M RX yes yes for D
Pin N yes
Pin P RTS yes
Pin Q TX yes
Pin R RX yes
Pin S
Pin T yes
Pin U TX yes
Pin V RX yes
Pin W CTS TX yes yes yes
Pin X yes
Pin Y
Specification Number : SP-ZV1CD-J
9 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
5. LED Drive
The indicator LED should be bicolor, because red, green and amber (red+green) are used to indicate
status.
The LED drive pins will auto-detect common anode or common cathode parts. The detection is done by
looking to see which way up the LED_RED pin is idling at boot; to ensure this works correctly, please
place a 10k resistor in parallel with the red LED.
The current drive on these pins is 20mA maximum.
Please refer to section 15 for the recommended LEDs.
<Common anode diagram> <Common cathode diagram>
Two specific LED codes indicate errors when talking to the SPI flash:
SPI flash not found
SPI flash error
If you encounter either of these codes, then this indicates an electrical connection issue or an
incompatible flash part.
Specification Number : SP-ZV1CD-J
10 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
6. Phototransistor
The phototransistor is used to receive BlinkUp configuration data. The bias resistor connected between
OPTO_IN and GND may need to be adjusted to ensure adequate sensitivity and response time - in
general you need at least 500mV swing on the OPTO_IN pin between black and white states, with the
worst (dimmest) BlinkUp sender you can find. More information and sample code to tune blinkup is
available on the Electric Imp dev center website.
End-user BlinkUp send data at between 30 and 60 bits per second, depending on the user’s device. For
factory configuration, data is typically sent at 142 bits per second using red LED(s) in a test fixture. If
your application does not require optical configuration, config can be sent electrically at 142 bits per
second from another micro using the OPTO_IN pin. Please contact us for more details.
It is also recommended to place 0402, 13pF capacitor footprints (Murata GRM1555C1H130JA01) close
to the imp003 between OPTO_BIAS and GND, and OPTO_IN and GND. If issues are seen with RF
coupling onto the blinkup circuit, then these components will address the issue by presenting a low
impedance in the 2.4GHz band.
Please refer to paragraph 15 for the recommended phototransistors.
Specification Number : SP-ZV1CD-J
11 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
7. SPI Flash Requirements
An external SPI Flash part is required for operation.
The minimum size of the SPI Flash is 4Mbit (512kB), and the maximum size is 128Mbit (16MB). The area
below address 0x70000 (448kB) is reserved for use by the OS. The remainder of the flash device is made
available to user code programmatically, and may optionally be pre-programmed for user applications
before assembly.
The imp003’s SPI flash chip must support both 4KB and 64KB erases (command 0x20 and 0xD8) and
Page Program (command 0x02). You must also ensure that the SPI flash you use is able to run down to
the minimum operational voltage of your product to ensure that the SPI flash is operational at all times
that the imp is operational. This is critical during upgrades in low battery states. If you are running from a
single LiMnO2 cell (eg. CR123), you should use a wide voltage range SPI flash that is operational from
1.7-3.6V such as the Macronix MX25R8035FM2IH0.
Minimum Size
4 Mbit (512 kByte)
Reserved for OS (do not pre-program)
0x000000 to 0x70000 (448 kByte)
8. Absolute Maximum Ratings
min.
max.
unit
Storage Temperature
-40
+85
deg.C
Supply Voltage
VDD
-0.3
4
V
VDD_PA
-0.3
6
V
VDD_WLAN
-0.3
6
V
Caution! The absolute maximum ratings indicate levels where permanent damage to the device can occur, even if
these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions.
Opertation at absolute maximum conditions for extended periods can adversely affect long-term reliabilty of the
device.
9. Operating Conditions
min.
typ.
max.
unit
Operating Temperature Range(*1)
-40
+85
deg.C
Specification Temperature Range
-20
+70
deg.C
Supply Voltage
VDD
1.8
3.3
3.6
V
VDD_PA
2.3(*2)
3.3
4.8(*2) (*3)
V
VDD_WLAN
2.3(*2)
3.3
4.8(*2) (*3)
V
Backup operating Voltage
VBAT
1.65
3.3
3.6
V
[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range
(*1) Functionality is guaranteed but specifications require derating at extreme temperatures.
(*2) The BCM43362 is functional across this range of voltage. RF performance is guaranteed only 3.0V < VDD_PA/WLAN < 4.8V
(*3) The maximum continuous voltage is 4.8V. Voltages up to 5.5V for up to 10 seconds, cumulative duration, over the lifetime of the
device are allowed voltages as high 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
Specification Number : SP-ZV1CD-J
12 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
10. Electrical characteristics
Parameter
Description
Min
Typ
Max
Unit
IDDA
Current input on VDDA
70
500
uA
VIH
I/O input high level voltage
0.7Vdd
3.6
V
VIL
I/O input low level voltage
Vss-0.3
0.3Vdd
V
IOUT
Output current on any single I/O pin
-8
8
mA
Output current on LED_RED pin
-20
20
mA
Output current on LED_GREEN pin
-20
20
mA
Total o u t p u t c ur r e nt o n a ll I / O p i n s
including LED_RED & LED_GREEN
-80
-80
mA
I/O input
leakage
current
VSS ≦ VIN ≦ VDD
6
uA
Load
capacitance
Pins A to Y
15
pF
11. External clock source characteristics
11.1. Low-speed external user clock characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fLSE_ext
User External clock source frequency(*1)
-
32.768
1,000
kHz
VLSEH
OSC32_IN input pin high level voltage
0.7VDD
-
VDD
V
VLSEL
OSC32_IN input pin low level voltage
VSS
-
0.3VDD
tW(LSE)
tf(LSE)
OSC32_IN high or low time(*1)
450
-
-
ns
tr(LSE)
tr(LSE)
OSC32_IN rise or fall time(*1)
-
-
50
Cin(LSE)
OSC32_IN input capacitance(*1)
-
5
-
pF
DuCy(LSE)
Duty cycle
30
-
70
%
IL
OSC32_IN Input leakage current
VSS ≤ VIN ≤ VDD
-
-
±1
uA
ESR
Equivalent Series Resistance
-
-
60
kΩ
CL
Load Capacitance
6
pF
C0
Shunt Capacitance
1.5
pF
(*1) Guaranteed by design, not tested in production
Specification Number : SP-ZV1CD-J
13 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
12. Power Up Sequence
12.1. Without RESET_L control
*Power down sequence is opposite sequence of power up.
12.2. With RESET_L control
*Power down sequence is opposite sequence of power up.
12.2.1. RESET_L Circuit
(1) The reset network protects the device against parasitic resets.
(2) The use must ensure that the level on the RESET_L pin can go below the 0.8V. Oth erwise the reset is not taken into acc ount by th e
device.
(3) Vdd=3.3V(for the 1.8≦Vdd≦3.6 voltage range)
(4) RPU=40k ohm (for the 30≦RPU≦50kohm range)
Filter
Internal
Reset
V
DD (3)
R
PU (4)
RESET_L
(2
)
External
Reset circuit
(1)
Murata
Module
0.1uF
VDD_3P3
Ramp time 90% > 40µs
VDD_PA
VDD_WLAN
Timing same as VDD_3P3
VDD_3P3
Ramp time 90% > 40µs
VDD_PA
> 2 Sleep Clock cycles ( > 61 µs )
RESET_L
VDD_WLAN
Timing same as VDD_3P3
Specification Number : SP-ZV1CD-J
14 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
13. Land Pattern (Top View)
Schematic symbols and CAD footprints are available on the Electric Imp dev center website.
0.15
0.50
0.80
1.15
1.45
1.80
2.10
2.45
2.75
3.10
3.40
3.75
4.05
4.70
5.00
0.15
0.50
0.80
1.15
1.45
1.80
2.10
2.45
2.85
3.65
3.95
0.50
0.80
1.15
1.45
1.80
2.10
2.45
2.75
3.10
3.90
0.15
0.95
1.25
2.05
2.35
3.15
5.00
0.15
0.95
1.55
2.35
3.95
4.70
5.00
Unit : mm
Specification Number : SP-ZV1CD-J
15 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
14. Reference Circuit
14.1. Low Cost Schematic
Please refer to paragraph 16 for the low cost recommended components.
Specification Number : SP-ZV1CD-J
16 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
14.2. Low Power Schematic
Please refer to paragraph 16 for the low power recommended components.
Specification Number : SP-ZV1CD-J
17 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
15. Recommended Components
15.1. Bi-color LED
Manufacturer
Manufacturer’s part number
Surface mount
top-view
SunLED
XZMDKVG59W-1
Liteon
LTST-C195KGJRKT
side-view
SunLED
XZMDKVG88W
Bivar
SM1204BC
Through-hole
3mm
SunLED
XLMDKVG34M
Liteon
LTL1BEKVJNN
15.2. Phototransistor
Manufacturer
Manufacturer’s part number
Surface mount
top-view
Everlight
PT17-21C/L41/TR8
Fairchild
KDT00030TR
side-view
SunLED
XZRNI56W-1
Everlight
PT12-21C/TR8
Through-hole
3mm
SunLED
XRNI30W-1
LiteOn
LTR-4206
15.3. SPI Flash
Size
Manufacturer
Manufacturer’s part number
4 Mbit
Spansion
S25FL204K
4 Mbit
Macronix
MX25L4006E
32 Mbit
Spansion
S25FL132K
32 Mbit
Macronix
MX25L3206E
15.4. Low Cost Schematic
Size
Manufacturer
Manufacturer’s part number
Description
U2
please refer to section 16.3
SPI Flash
Q1
please refer to section 16.2
clear lens phototransistor
D1
please refer to section 16.1
red/green bicolor LED
L1
Murata
LQM21PN1R5MC0
1.5uH inductor
15.5. Low Power Schematic
Ref Des
Manufacturer
Manufacturer’s part number
Description
U2
please refer to section 16.3
SPI Flash
U3
Diodes Inc.
AP2281-1/AP2281-3
2A load switch
Q1
please refer to section 16.2
clear lens phototransistor
D1
please refer to section 16.1
red/green bicolor LED
L1
Murata
LQM21PN1R5MC0
1.5uH inductor
Y1
Kyocera
ST3215SB32768B0HPWB3
32.768kHz crystal
Abracon
ABS25-32.768KHZ-6-T
Abracon
ABS07-120-32.768kHz-T
Specification Number : SP-ZV1CD-J
18 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
16. Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
1) The corner and ridge radiuses (R) of inside cavity are 0.3mm max.
2) Cumulative tolerance of 10 pitches of the sprocket hole is +/-0.2mm
3) Measuring of cavity positioning is based on cavity center in accordance with JIS/IES standard.
(2) Dimensions of Reel
(unit : mm)
2.0±0.1
1.75±0.10
0.30±0.05
1.5 max.
(1.4±0.1)
16.0±0.1
11.5±0.1
f
1.5+0.1/-0.0
f
24.0±0.3/-0,1
feeding direction
4
.0±0.1
8.4±0.1
2.0±0.1/-0.0
10.5±0.1
30.5 max.
(
f
100)
f
13
±0.2
2.0
±
0.5
25.5±0.6
(
f
330)
Specification Number : SP-ZV1CD-J
19 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
(3) Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62μm in thickness
[4] Base tape : As specified in (1)
(4) Leader and Tail tape
[2]
[3]
[4]
[3]
[1]
Feeding Hole
Chip
Feeding Direction
Pin 1 Marking
Tail t ape
(No components)
40 to 200mm
Components
No components
150mm min.
Leader tape
(Cover tape alone)
250mm min.
Feeding direction
Specification Number : SP-ZV1CD-J
20 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit : 1000pcs./ reel
(9) material : Base tape : Plastic
Real : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
(10) Peeling of force : 0.7N max. in the direction of peeling as shown below.
(11) Packaging (Humidity proof Packing)
Tap e an d r eel m us t b e s e ale d w ith t he a nti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 °
0.7 N max.
Base tape
Cover tape
湿度
インジケ－タ
乾燥剤
表示ラべル
防湿梱包袋
表示ラベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag
Specification Number : SP-ZV1CD-J
21 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
17. NOTICE
17.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
17.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
17.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
17.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
Specification Number : SP-ZV1CD-J
22 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
17.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions(Example)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
17.6. Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not permitted.
17.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
17.8. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
Within 120s
Pre-heating
time(s)
220 deg.C
Within 60s
Cooling down
Slowly
180 deg.C
150 deg.C
240to 250 deg.C
Within 3s
Specification Number : SP-ZV1CD-J
23 / 24
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
18. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications
of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products,
which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention of
such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if
you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equipment.- Aerospace equipment- Undersea equipment.
- Power plant control equipment- Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment. - Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the
regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services are used. Information provided by us regarding third-party products or services does not constitute a
license from us to use such products or services or a warranty or endorsement thereof. Use of such information may
require a license from a third party under the patents or other intellectual property of the third party, or a license from us
under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
