To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclose d by Renesa s Electronics such as that disclosed through our website.
2. Renesas Electronics does not assum e any liability for inf ringement of patents, co pyrights, or other int ellectual property rights
of third parties by or arising from the use of Renesas Elec tronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, m odify, copy, or otherw ise misappropriate an y Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsi bility for any losse s incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technol ogy described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such law s and regulations. You should not use Renesas
Electronics products or the technology described in this docum ent for any purpose rela ting to military applications or use by
the military, including but not limited to the developm ent of weapons of ma ss destruction. Renesas Electronics products and
technology may not be used for or incor porated into any products or system s whose manufac ture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in prepa ring the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recom mended applicatio ns for each Renesas Electronics prod uct depends on the produc t’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Elec tronics product for any application cate gorized as “Spec ific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any applic ation for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intende d where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appli ances; mac hine tools; personal electronic equipm ent; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the m aximum rating , opera ting supply voltag e range, movement power voltage ra nge, heat radiation
characteristics, installation and other product characteristic s. Re nesas Electronics shall have no liabil ity for malfunctions or
damages arising out of the use of Re nesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliabili ty of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation res istance design. Pleas e be sure to implement saf ety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substa nces, including without lim itation, the EU R oHS
Directive. Renesas Electronics assum es no liability for damage s or losses occurring as a result of your noncom pliance with
applicable laws and regulatio ns.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions re garding the information conta ined in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Re nesas Electronics produc t(s)” means any product develope d or manufactured by or for Re nesas Electronics.
H8/3644 Group, H8/3644R Group
H8/3644 F-ZTATTM, H8/3643 F-ZTATTM,
H8/3642A F-ZTATTM
Hardware Manual
8
User’s Manual
Rev.6.00 2006.09
Renesas 8-Bit Single-Chip Microcomputer
H8 Family/H8/300L Series
H8/3644 HD6473644 H8/3644R HD6473644R
HD6433644 HD6433644R
HD64F3644
H8/3643 HD6433643 H8/3643R HD6433643R
HD64F3643
H8/3642 HD6433642 H8/3642R HD6433642R
HD64F3642A
H8/3641 HD6433641 H8/3641R HD6433641R
H8/3640 HD6433640 H8/3640R HD6433640R
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
Rev. 6.00 Sep 12, 2006 page ii of xx
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Keep safety first in your circuit designs!
Notes regarding these materials
Rev. 6.00 Sep 12, 2006 page iii of xx
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 6.00 Sep 12, 2006 page iv of xx
Rev. 6.00 Sep 12, 2006 page v of xx
Preface
The H8/300L Series of single-chip microcomputers has the high-speed H8/300L CPU at its core,
with many necessary peripheral functions on-chip. The H8/300L CPU instruction set is compatible
with the H8/300 CPU.
The H8/3644 Group has a system-on-a-chip architecture that includes such peripheral functions as
a D/A converter, five timers, a 14-bit PWM, a two-channel serial communication interface, and an
A/D converter. This makes it ideal for use in advanced control systems.
This manual describes the hardware of the H8/3644 Group. For details on the H8/3644 Group
instruction set, refer to the H8/300L Series Programming Manual.
Rev. 6.00 Sep 12, 2006 page vi of xx
Rev. 6.00 Sep 12, 2006 page vii of xx
Main Revisions in This Edition
Item Page Revision (See Manual for Details)
All — • Notification of change in company name amended
(Before) Hitachi, Ltd. → (After) Renesas Technology Corp.
• Product naming convention amended
(Before) H8/3644 Series → (After) H8/3644 Group
(Before) H8/3644R Series → (After) H8/3644R Group
3.3.2 Interrupt Control
Registers
Interrupt Edge Select
Register 2 (IEGR2)
64 Description amended
IEGR2 is an 8-bit read/write register, used to designate whether pins INT
7
to INT
0
, and TMIB are
set to rising edge sensing or falling edge sensing. Upon reset, IEGR2 is initialized to H'00.
Bit 7
INT
7
Edge Select (INTEG7): Bit 7 selects the input sensing o f the INT
7
pin.
Bit 7: INTEG7 Description
0 Falling edge of INT
7
pin input is detected (initial value)
1 Rising edge of INT
7
pin input is detected
6.2.2 Memory Map
Table 6.2 Socket
Adapter
Figure 6.2 Socket
Adapter Pin
Correspondence
(ZTAT)
102, 103 Description of socket adapter deleted
6.8.2 Memory Map
Table 6.14 Socket
Adapter Product
Codes
Figure 6.19 Socket
Adapter Pin
Correspondence
(F-ZTAT)
149, 151 Description of socket adapter deleted
6.9 Flash Memory
Programming and
Erasing Precautions
Table 6.18 Flash
Memory AC
Characteristics
165 Table amended
Item Symbol Min Typ Max Unit Test Conditions
Flash memory read setup time*
4
t
FRS
50 µs V
CC
≥ 4.5 V
100 V
CC
< 4.5 V
8.4.2 Register
Configuration and
Description
Port Mode Register 7
(PMR7)
182 Bit table amended
Bit 76543210
TXD POF1
Initial value 1 1 1 1 1 0 0 0
Read/Write R/W R/W
Rev. 6.00 Sep 12, 2006 page viii of xx
Item Page Revision (See Manual for Details)
10.2.2 Register
Descriptions
Serial Control/Status
Register 1 (SCSR1)
281 Description amended
SCSR1 is an 8-bit register indicating operation status and
error status.
10.3.1 Overview
Figure 10.6 SCI3
Block Diagram
291 Figure amended
Clock
TXD
RXD
SCK
3
BRR
SMR
SCR3
SSR
TDR
RDR
TSR
RSR
Transmit/receive
control circuit
Internal data bus
Interrupt request
(TEI, TXI, RXI, ERI)
Internal clock (φ/64, φ/16, φ/4, φ)
External
clock
BRC
Baud rate generator
10.3.7 Interrupts
Table 10.16 SCI3
Interrupt Requests
336 Table amended
Vector Address
H'002A
Rev. 6.00 Sep 12, 2006 page ix of xx
Item Page Revision (See Manual for Details)
13.2.4 DC
Characteristics
(HD6433644,
HD6433643,
HD6433642,
HD6433641,
HD6433640)
Table 13.6 DC
Characteristics
374 Table amended
Values
Item Symbol Applicable
Pins Min Typ Max Unit Test Condition Notes
Active
mode
current
dissipation
I
OPE1
V
CC
10 15 mA Active (high-
speed) mode
V
CC
= 5 V,
f
OSC
= 10 MHz
1, 2
5V
CC
= 2.5 V,
f
OSC
= 10 MHz 1, 2
Reference
value
I
OPE2
V
CC
2 3 mA Active (medium-
speed) mode
V
CC
= 5 V,
f
OSC
= 10 MHz
1, 2
1V
CC
= 2.5 V,
f
OSC
= 10 MHz 1, 2
Reference
value
Sleep
mode
current
dissipation
I
SLEEP1
V
CC
5 7 mA Sleep (high-
speed) mode
V
CC
= 5 V,
f
OSC
= 10 MHz
1, 2
2V
CC
= 2.5 V,
f
OSC
= 10 MHz 1, 2
Reference
value
I
SLEEP2
V
CC
2 3 mA Sleep (medium-
speed) mode
V
CC
= 5 V,
f
OSC
= 10 MHz
1, 2
1V
CC
= 2.5 V,
f
OSC
= 10 MHz 1, 2
Reference
value
13.2.5 AC
Characteristics
(HD6433644,
HD6433643,
HD6433642,
HD6433641,
HD6433640)
Table 13.9 Serial
Interface (SCI3)
Timing
380 Table amended
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta =
–20°C to +75°C, unless otherwise specified.
13.3.5 AC
Characteristics
(HD6433644R,
HD6433643R,
HD6433642R,
HD6433641R,
HD6433640R)
Table 13.18 Serial
Interface (SCI3)
Timing
404 Table amended
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta =
–20°C to +75°C, unless otherwise specified.
Rev. 6.00 Sep 12, 2006 page x of xx
Item Page Revision (See Manual for Details)
A.1 Instructions
Table A.1 Instruction
Set
427 Table amended
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
↔
PUSH Rs
ADD.B #xx:8, Rd
SP–2 → SP
Rs16 → @SP
Rd8+#xx:8 → Rd8
W
B
2 —— 0—6
2
2—
↔
↔
↔
↔
↔
B.2 Functions
IEGR2—Interrupt edge
select register 2
485 Bit table amended
INT7 edge select
0 Falling edge of INT7 pin input is detected
Rising edge of INT7 pin input is detected
1
Rev. 6.00 Sep 12, 2006 page xi of xx
Contents
Section 1 Overview............................................................................................................. 1
1.1 Overview........................................................................................................................... 1
1.2 Internal Block Diagram..................................................................................................... 6
1.3 Pin Arrangement and Functions ........................................................................................ 7
1.3.1 Pin Arrangement .................................................................................................. 7
1.3.2 Pin Functions ....................................................................................................... 10
Section 2 CPU ...................................................................................................................... 15
2.1 Overview........................................................................................................................... 15
2.1.1 Features................................................................................................................ 15
2.1.2 Address Space...................................................................................................... 16
2.1.3 Register Configuration ......................................................................................... 16
2.2 Register Descriptions ........................................................................................................ 18
2.2.1 General Registers ................................................................................................. 18
2.2.2 Control Registers.................................................................................................. 18
2.2.3 Initial Register Values.......................................................................................... 20
2.3 Data Formats..................................................................................................................... 20
2.3.1 Data Formats in General Registers....................................................................... 21
2.3.2 Memory Data Formats ......................................................................................... 22
2.4 Addressing Modes............................................................................................................. 23
2.4.1 Addressing Modes................................................................................................ 23
2.4.2 Effective Address Calculation.............................................................................. 25
2.5 Instruction Set ................................................................................................................... 29
2.5.1 Data Transfer Instructions.................................................................................... 31
2.5.2 Arithmetic Operations.......................................................................................... 33
2.5.3 Logic Operations.................................................................................................. 34
2.5.4 Shift Operations ................................................................................................... 34
2.5.5 Bit Manipulations................................................................................................. 36
2.5.6 Branching Instructions ......................................................................................... 40
2.5.7 System Control Instructions ................................................................................. 42
2.5.8 Block Data Transfer Instruction........................................................................... 43
2.6 Basic Operational Timing ................................................................................................. 44
2.6.1 Access to On-Chip Memory (RAM, ROM) ......................................................... 44
2.6.2 Access to On-Chip Peripheral Modules ............................................................... 45
2.7 CPU States ........................................................................................................................ 46
2.7.1 Overview.............................................................................................................. 46
2.7.2 Program Execution State...................................................................................... 48
2.7.3 Program Halt State............................................................................................... 48
Rev. 6.00 Sep 12, 2006 page xii of xx
2.7.4 Exception-Handling State .................................................................................... 48
2.8 Memory Map..................................................................................................................... 49
2.9 Application Notes ............................................................................................................. 50
2.9.1 Notes on Data Access .......................................................................................... 50
2.9.2 Notes on Bit Manipulation................................................................................... 52
2.9.3 Notes on Use of the EEPMOV Instruction .......................................................... 58
Section 3 Exception Handling ......................................................................................... 59
3.1 Overview........................................................................................................................... 59
3.2 Reset 59
3.2.1 Overview.............................................................................................................. 59
3.2.2 Reset Sequence .................................................................................................... 59
3.2.3 Interrupt Immediately after Reset......................................................................... 61
3.3 Interrupts........................................................................................................................... 61
3.3.1 Overview.............................................................................................................. 61
3.3.2 Interrupt Control Registers................................................................................... 63
3.3.3 External Interrupts................................................................................................ 71
3.3.4 Internal Interrupts................................................................................................. 72
3.3.5 Interrupt Operations............................................................................................. 72
3.3.6 Interrupt Response Time ...................................................................................... 77
3.4 Application Notes ............................................................................................................. 78
3.4.1 Notes on Stack Area Use...................................................................................... 78
3.4.2 Notes on Rewriting Port Mode Registers............................................................. 79
Section 4 Clock Pulse Generators................................................................................... 81
4.1 Overview........................................................................................................................... 81
4.1.1 Block Diagram..................................................................................................... 81
4.1.2 System Clock and Subclock................................................................................. 81
4.2 System Clock Generator.................................................................................................... 82
4.3 Subclock Generator........................................................................................................... 84
4.4 Prescalers .......................................................................................................................... 85
4.5 Note on Oscillators............................................................................................................ 86
Section 5 Power-Down Modes ........................................................................................ 87
5.1 Overview........................................................................................................................... 87
5.1.1 System Control Registers..................................................................................... 90
5.2 Sleep Mode ....................................................................................................................... 94
5.2.1 Transition to Sleep Mode..................................................................................... 94
5.2.2 Clearing Sleep Mode............................................................................................ 94
5.2.3 Clock Frequency in Sleep (Medium-Speed) Mode .............................................. 95
5.3 Standby Mode ................................................................................................................... 95
Rev. 6.00 Sep 12, 2006 page xiii of xx
5.3.1 Transition to Standby Mode................................................................................. 95
5.3.2 Clearing Standby Mode........................................................................................ 95
5.3.3 Oscillator Settling Time after Standby Mode Is Cleared ..................................... 96
5.4 Watch Mode...................................................................................................................... 96
5.4.1 Transition to Watch Mode ................................................................................... 96
5.4.2 Clearing Watch Mode .......................................................................................... 97
5.4.3 Oscillator Settling Time after Watch Mode Is Cleared........................................ 97
5.5 Subsleep Mode.................................................................................................................. 97
5.5.1 Transition to Subsleep Mode ............................................................................... 97
5.5.2 Clearing Subsleep Mode ...................................................................................... 98
5.6 Subactive Mode................................................................................................................. 98
5.6.1 Transition to Subactive Mode.............................................................................. 98
5.6.2 Clearing Subactive Mode..................................................................................... 98
5.6.3 Operating Frequency in Subactive Mode............................................................. 99
5.7 Active (Medium-Speed) Mode.......................................................................................... 99
5.7.1 Transition to Active (Medium-Speed) Mode ....................................................... 99
5.7.2 Clearing Active (Medium-Speed) Mode.............................................................. 99
5.7.3 Operating Frequency in Active (Medium-Speed) Mode...................................... 99
5.8 Direct Transfer .................................................................................................................. 100
Section 6 ROM..................................................................................................................... 103
6.1 Overview........................................................................................................................... 103
6.1.1 Block Diagram..................................................................................................... 103
6.2 PROM Mode..................................................................................................................... 104
6.2.1 Setting to PROM Mode........................................................................................ 104
6.2.2 Memory Map ....................................................................................................... 104
6.3 Programming..................................................................................................................... 105
6.3.1 Writing and Verifying .......................................................................................... 106
6.3.2 Programming Precautions .................................................................................... 109
6.3.3 Reliability of Programmed Data........................................................................... 110
6.4 Flash Memory Overview................................................................................................... 111
6.4.1 Principle of Flash Memory Operation.................................................................. 111
6.4.2 Mode Pin Settings and ROM Space..................................................................... 112
6.4.3 Features................................................................................................................ 112
6.4.4 Block Diagram..................................................................................................... 113
6.4.5 Pin Configuration................................................................................................. 114
6.4.6 Register Configuration ......................................................................................... 114
6.5 Flash Memory Register Descriptions ................................................................................ 115
6.5.1 Flash Memory Control Register (FLMCR).......................................................... 115
6.5.2 Erase Block Register 1 (EBR1) ........................................................................... 117
6.5.3 Erase Block Register 2 (EBR2) ........................................................................... 118
Rev. 6.00 Sep 12, 2006 page xiv of xx
6.6 On-Board Programming Modes ........................................................................................ 120
6.6.1 Boot Mode ........................................................................................................... 120
6.6.2 User Program Mode............................................................................................. 125
6.7 Programming and Erasing Flash Memory......................................................................... 127
6.7.1 Program Mode ..................................................................................................... 127
6.7.2 Program-Verify Mode.......................................................................................... 128
6.7.3 Programming Flowchart and Sample Program..................................................... 129
6.7.4 Erase Mode .......................................................................................................... 132
6.7.5 Erase-Verify Mode............................................................................................... 132
6.7.6 Erase Flowcharts and Sample Programs .............................................................. 133
6.7.7 Prewrite-Verify Mode .......................................................................................... 147
6.7.8 Protect Modes ...................................................................................................... 148
6.7.9 Interrupt Handling during Flash Memory Programming/Erasing......................... 149
6.8 Flash Memory PROM Mode (H8/3644F, H8/3643F, and H8/3642AF) ........................... 150
6.8.1 PROM Mode Setting............................................................................................ 150
6.8.2 Memory Map ....................................................................................................... 150
6.8.3 Operation in PROM Mode................................................................................... 151
6.9 Flash Memory Programming and Erasing Precautions ..................................................... 160
Section 7 RAM..................................................................................................................... 167
7.1 Overview........................................................................................................................... 167
7.1.1 Block Diagram..................................................................................................... 167
Section 8 I/O Ports .............................................................................................................. 169
8.1 Overview........................................................................................................................... 169
8.2 Port 1................................................................................................................................. 171
8.2.1 Overview.............................................................................................................. 171
8.2.2 Register Configuration and Description............................................................... 171
8.2.3 Pin Functions ....................................................................................................... 175
8.2.4 Pin States.............................................................................................................. 176
8.2.5 MOS Input Pull-Up.............................................................................................. 176
8.3 Port 2................................................................................................................................. 177
8.3.1 Overview.............................................................................................................. 177
8.3.2 Register Configuration and Description............................................................... 177
8.3.3 Pin Functions ....................................................................................................... 179
8.3.4 Pin States.............................................................................................................. 179
8.4 Port 3................................................................................................................................. 180
8.4.1 Overview.............................................................................................................. 180
8.4.2 Register Configuration and Description............................................................... 180
8.4.3 Pin Functions ....................................................................................................... 184
8.4.4 Pin States.............................................................................................................. 185
Rev. 6.00 Sep 12, 2006 page xv of xx
8.4.5 MOS Input Pull-Up.............................................................................................. 185
8.5 Port 5................................................................................................................................. 186
8.5.1 Overview.............................................................................................................. 186
8.5.2 Register Configuration and Description............................................................... 186
8.5.3 Pin Functions ....................................................................................................... 188
8.5.4 Pin States.............................................................................................................. 189
8.5.5 MOS Input Pull-Up.............................................................................................. 189
8.6 Port 6................................................................................................................................. 190
8.6.1 Overview.............................................................................................................. 190
8.6.2 Register Configuration and Description............................................................... 190
8.6.3 Pin Functions ....................................................................................................... 191
8.6.4 Pin States.............................................................................................................. 192
8.7 Port 7................................................................................................................................. 192
8.7.1 Overview.............................................................................................................. 192
8.7.2 Register Configuration and Description............................................................... 192
8.7.3 Pin Functions ....................................................................................................... 194
8.7.4 Pin States.............................................................................................................. 195
8.8 Port 8................................................................................................................................. 195
8.8.1 Overview.............................................................................................................. 195
8.8.2 Register Configuration and Description............................................................... 196
8.8.3 Pin Functions ....................................................................................................... 197
8.8.4 Pin States.............................................................................................................. 198
8.9 Port 9................................................................................................................................. 199
8.9.1 Overview.............................................................................................................. 199
8.9.2 Register Configuration and Description............................................................... 199
8.9.3 Pin Functions ....................................................................................................... 200
8.9.4 Pin States.............................................................................................................. 201
8.10 Port B ................................................................................................................................ 201
8.10.1 Overview.............................................................................................................. 201
8.10.2 Register Configuration and Description............................................................... 201
8.10.3 Pin Functions ....................................................................................................... 202
8.10.4 Pin States.............................................................................................................. 202
Section 9 Timers .................................................................................................................. 203
9.1 Overview........................................................................................................................... 203
9.2 Timer A............................................................................................................................. 204
9.2.1 Overview.............................................................................................................. 204
9.2.2 Register Descriptions ........................................................................................... 206
9.2.3 Timer Operation................................................................................................... 208
9.2.4 Timer A Operation States..................................................................................... 209
9.3 Timer B1 ........................................................................................................................... 209
Rev. 6.00 Sep 12, 2006 page xvi of xx
9.3.1 Overview.............................................................................................................. 209
9.3.2 Register Descriptions ........................................................................................... 211
9.3.3 Timer Operation................................................................................................... 213
9.3.4 Timer B1 Operation States................................................................................... 214
9.4 Timer V............................................................................................................................. 215
9.4.1 Overview.............................................................................................................. 215
9.4.2 Register Descriptions ........................................................................................... 218
9.4.3 Timer Operation................................................................................................... 224
9.4.4 Timer V Operation Modes ................................................................................... 229
9.4.5 Interrupt Sources.................................................................................................. 229
9.4.6 Application Examples .......................................................................................... 229
9.4.7 Application Notes ................................................................................................ 232
9.5 Timer X............................................................................................................................. 238
9.5.1 Overview.............................................................................................................. 238
9.5.2 Register Descriptions ........................................................................................... 242
9.5.3 CPU Interface....................................................................................................... 253
9.5.4 Timer Operation................................................................................................... 256
9.5.5 Timer X Operation Modes ................................................................................... 263
9.5.6 Interrupt Sources.................................................................................................. 263
9.5.7 Timer X Application Example ............................................................................. 264
9.5.8 Application Notes ................................................................................................ 265
9.6 Watchdog Timer ............................................................................................................... 270
9.6.1 Overview.............................................................................................................. 270
9.6.2 Register Descriptions ........................................................................................... 271
9.6.3 Timer Operation................................................................................................... 274
9.6.4 Watchdog Timer Operation States ....................................................................... 275
Section 10 Serial Communication Interface ................................................................ 277
10.1 Overview........................................................................................................................... 277
10.2 SCI1 ................................................................................................................................. 277
10.2.1 Overview.............................................................................................................. 277
10.2.2 Register Descriptions ........................................................................................... 279
10.2.3 Operation in Synchronous Mode.......................................................................... 284
10.2.4 Operation in SSB Mode ....................................................................................... 287
10.2.5 Interrupts.............................................................................................................. 289
10.3 SCI3 ................................................................................................................................. 289
10.3.1 Overview.............................................................................................................. 289
10.3.2 Register Descriptions ........................................................................................... 292
10.3.3 Operation ............................................................................................................. 309
10.3.4 Operation in Asynchronous Mode ....................................................................... 313
10.3.5 Operation in Synchronous Mode.......................................................................... 322
Rev. 6.00 Sep 12, 2006 page xvii of xx
10.3.6 Multiprocessor Communication Function............................................................ 329
10.3.7 Interrupts.............................................................................................................. 336
10.3.8 Application Notes ................................................................................................ 337
Section 11 14-Bit PWM..................................................................................................... 341
11.1 Overview........................................................................................................................... 341
11.1.1 Features................................................................................................................ 341
11.1.2 Block Diagram..................................................................................................... 341
11.1.3 Pin Configuration................................................................................................. 342
11.1.4 Register Configuration ......................................................................................... 342
11.2 Register Descriptions ........................................................................................................ 342
11.2.1 PWM Control Register (PWCR).......................................................................... 342
11.2.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................ 343
11.3 Operation........................................................................................................................... 344
Section 12 A/D Converter................................................................................................. 345
12.1 Overview........................................................................................................................... 345
12.1.1 Features................................................................................................................ 345
12.1.2 Block Diagram..................................................................................................... 346
12.1.3 Pin Configuration................................................................................................. 347
12.1.4 Register Configuration ......................................................................................... 347
12.2 Register Descriptions ........................................................................................................ 348
12.2.1 A/D Result Register (ADRR)............................................................................... 348
12.2.2 A/D Mode Register (AMR) ................................................................................. 348
12.2.3 A/D Start Register (ADSR).................................................................................. 350
12.3 Operation........................................................................................................................... 351
12.3.1 A/D Conversion Operation .................................................................................. 351
12.3.2 Start of A/D Conversion by External Trigger Input............................................. 351
12.4 Interrupts........................................................................................................................... 352
12.5 Typical Use ....................................................................................................................... 352
12.6 Application Notes ............................................................................................................. 355
Section 13 Electrical Characteristics.............................................................................. 357
13.1 Absolute Maximum Ratings.............................................................................................. 357
13.2 Electrical Characteristics (ZTAT™, Mask ROM Version)............................................... 358
13.2.1 Power Supply Voltage and Operating Range....................................................... 358
13.2.2 DC Characteristics (HD6473644)........................................................................ 361
13.2.3 AC Characteristics (HD6473644) ........................................................................ 367
13.2.4 DC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640) ........................................................................................................ 371
Rev. 6.00 Sep 12, 2006 page xviii of xx
13.2.5 AC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640) ........................................................................................................ 376
13.2.6 A/D Converter Characteristics ............................................................................. 381
13.3 Electrical Characteristics (ZTAT and R of the Mask ROM Version) ............................... 382
13.3.1 Power Supply Voltage and Operating Range....................................................... 382
13.3.2 DC Characteristics (HD6473644R) ..................................................................... 385
13.3.3 AC Characteristics (HD6473644R) ..................................................................... 391
13.3.4 DC Characteristics (HD6433644R, HD6433643R, HD6433642R, HD6433641R,
HD6433640R)...................................................................................................... 395
13.3.5 AC Characteristics (HD6433644R, HD6433643R, HD6433642R,
HD6433641R, HD6433640R) ............................................................................. 400
13.3.6 A/D Converter Characteristics ............................................................................. 405
13.4 Electrical Characteristics (F-ZTAT version) ................................................................. 406
13.4.1 Power Supply Voltage and Operating Range....................................................... 406
13.4.2 DC Characteristics (HD64F3644, HD64F3643, HD64F3642A) ......................... 409
13.4.3 AC Characteristics (HD64F3644, HD64F3643, HD64F3642A) ......................... 415
13.4.4 A/D Converter Characteristics ............................................................................. 419
13.5 Operation Timing.............................................................................................................. 420
13.6 Output Load Circuit .......................................................................................................... 423
Appendix A CPU Instruction Set.................................................................................... 425
A.1 Instructions........................................................................................................................ 425
A.2 Operation Code Map......................................................................................................... 433
A.3 Number of Execution States.............................................................................................. 435
Appendix B Internal I/O Registers ................................................................................. 442
B.1 Addresses .......................................................................................................................... 442
B.2 Functions........................................................................................................................... 446
Appendix C I/O Port Block Diagrams........................................................................... 493
C.1 Block Diagrams of Port 1.................................................................................................. 493
C.2 Block Diagrams of Port 2.................................................................................................. 497
C.3 Block Diagrams of Port 3.................................................................................................. 500
C.4 Block Diagrams of Port 5.................................................................................................. 503
C.5 Block Diagram of Port 6 ................................................................................................... 506
C.6 Block Diagrams of Port 7.................................................................................................. 507
C.7 Block Diagrams of Port 8.................................................................................................. 511
C.8 Block Diagram of Port 9 ................................................................................................... 519
C.9 Block Diagram of Port B................................................................................................... 520
Appendix D Port States in the Different Processing States..................................... 521
Rev. 6.00 Sep 12, 2006 page xix of xx
Appendix E Product Code Lineup.................................................................................. 522
Appendix F Package Dimensions ................................................................................... 524
Rev. 6.00 Sep 12, 2006 page xx of xx
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 1 of 526
REJ09B0326-0600
Section 1 Overview
1.1 Overview
The H8/300L Series is a series of single-chip microcomputers (MCU: microcomputer unit), built
around the high-speed H8/300L CPU and equipped with peripheral system functions on-chip.
Within the H8/300L Series, the H8/3644 Group of microcomputers are equipped with a UART
(Universal Asynchronous Receiver/Transmitter). Other on-chip peripheral functions include five
timers, a 14-bit pulse width modulator (PWM), two serial communication interface channels, and
an A/D converter, providing an ideal configuration as a microcomputer for embedding in high-
level control systems. In addition to the mask ROM version, the H8/3644 is also available in a
ZTAT™*1 version with on-chip user-programmable PROM, and an F-ZTAT™*2 version with on-
chip flash memory that can be programmed on-board. Table 1 summarizes the features of the
H8/3644 Group.
Notes: 1. ZTAT is a trademark of Renesas Technology Corp.
2. F-ZTAT is a trademark of Renesas Technology Corp.
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 2 of 526
REJ09B0326-0600
Table 1.1 Features
Item Description
CPU High-speed H8/300L CPU
• General-register architecture
General registers: Sixteen 8-bit registers (can be used as eight 16-bit
registers)
• Operating speed
Max. operation speed: 5 MHz (mask ROM and ZTAT versions)
8 MHz (Applies only to F-ZTAT, R of the ZTAT,
and R of the mask ROM version)
Add/subtract: 0.4 µs (operating at φ = 5 MHz)
0.25 µs (operating at φ = 8 MHz)*1
Multiply/divide: 2.8 µs (operating at φ = 5 MHz)
1.75 µs (operating at φ = 8 MHz)*1
Can run on 32.768 kHz subclock
• Instruction set compatible with H8/300 CPU
Instruction length of 2 bytes or 4 bytes
Basic arithmetic operations between registers
MOV instruction for data transfer between memory and registers
• Typical instructions
Multiply (8 bits × 8 bits)
Divide (16 bits ÷ 8 bits)
Bit accumulator
Register-indirect designation of bit position
Interrupts 33 interrupt sources
• 12 external interrupt sources (IRQ3 to IRQ0, INT7 to INT0)
• 21 internal interrupt sources
Clock pulse
generators
Two on-chip clock pulse generators
• System clock pulse generator: 1 to 10 MHz (1 to 16 MHz*1)
Crystal or ceramic resonator: 2 to 10 MHz (2 to 16 MHz*1)
External clock input: 1 to 10 MHz (1 to 16 MHz*1)
• Subclock pulse generator: 32.768 kHz
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 3 of 526
REJ09B0326-0600
Item Description
Power-down
modes
Seven power-down modes
• Sleep (high-speed) mode
• Sleep (medium-speed) mode
• Standby mode
• Watch mode
• Subsleep mode
• Subactive mode
• Active (medium-speed) mode
Memory Large on-chip memory
• H8/3644: 32-kbyte ROM, 1-kbyte RAM
• H8/3643: 24-kbyte ROM, 1-kbyte RAM
• H8/3642: 16-kbyte ROM, 512 byte RAM (1-kbyte RAM F-ZTAT version)
• H8/3641: 12-kbyte ROM, 512 byte RAM
• H8/3640: 8-kbyte ROM, 512 byte RAM
I/O ports 53 pins
• 45 I/O pins
• 8 input pins
Timers Five on-chip timers
• Timer A: 8-bit timer
Count-up timer with selection of eight internal clock signals divided from the
system clock (φ)*2 and four clock signals divided from the watch clock
(φ w)*2
• Timer B1: 8-bit timer
Count-up timer with selection of seven internal clock signals or event
input from external pin
Auto-reloading
• Timer V: 8-bit timer
Count-up timer with selection of six internal clock signals or event input
from external pin
Compare-match waveform output
Externally triggerable
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 4 of 526
REJ09B0326-0600
Item Description
Timers • Timer X: 16-bit timer
Count-up timer with selection of three internal clock signals or event input
from external pin
Output compare (2 output pins)
Input capture (4 input pins)
• Watchdog timer
Reset signal generated by 8-bit counter overflow
Serial
communication
interface
Two on-chip serial communication interface channels
• SCI1: synchronous serial interface
Choice of 8-bit or 16-bit data transfer
• SCI3: 8-bit synchronous/asynchronous serial interface
Incorporates multiprocessor communication function
14-bit PWM Pulse-division PWM output for reduced ripple
• Can be used as a 14-bit D/A converter by connecting to an external low-pass
filter.
A/D converter Successive approximations using a resistance ladder
• 8-channel analog input pins
• Conversion time: 31/ φ or 62/ φ per channel
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 5 of 526
REJ09B0326-0600
Item Description
Product lineup Product Code
Mask ROM
Version
ZTAT™
Version
F-ZTAT™
Version
Package
ROM/RAM Size
HD6433644H
HD6433644RH
HD6473644H
HD6473644RH
HD64F3644H 64-pin QFP
(FP-64A)
ROM: 32 kbytes
RAM: 1 kbyte
HD6433644P
HD6433644RP
HD6473644P
HD6473644RP
HD64F3644P 64-pin SDIP
(DP-64S)
HD6433644W
HD6433644RW
HD6473644W
HD6473644RW
HD64F3644W 80-pin TQFP
(TFP-80C)
HD6433643H
HD6433643RH
HD64F3643H 64-pin QFP
(FP-64A)
ROM: 24 kbytes
RAM: 1 kbyte
HD6433643P
HD6433643RP
HD64F3643P 64-pin SDIP
(DP-64S)
HD6433643W
HD6433643RW
HD64F3643W 80-pin TQFP
(TFP-80C)
HD6433642H
HD6433642RH
HD64F3642AH 64-pin QFP
(FP-64A)
ROM: 16 kbytes
RAM: 512 kbytes
HD6433642P
HD6433642RP
HD64F3642AP 64-pin SDIP
(DP-64S)
RAM: 1 kbyte
(F-ZTAT version)
HD6433642W
HD6433642RW
HD64F3642AW 80-pin TQFP
(TFP-80C)
HD6433641H
HD6433641RH
64-pin QFP
(FP-64A)
ROM: 12 kbytes
RAM: 512 bytes
HD6433641P
HD6433641RP
64-pin SDIP
(DP-64S)
HD6433641W
HD6433641RW
80-pin TQFP
(TFP-80C)
HD6433640H
HD6433640RH
64-pin QFP
(FP-64A)
ROM: 8 kbytes
RAM: 512 bytes
HD6433640P
HD6433640RP
64-pin SDIP
(DP-64S)
HD6433640W
HD6433640RW
80-pin TQFP
(TFP-80C)
Notes: 1. Applies only to F-ZTAT, R of the ZTAT, and R of the mask ROM version.
2. As for the definition of φ and φ W, see section 4, Clock Pulse Generators.
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 6 of 526
REJ09B0326-0600
1.2 Internal Block Diagram
Figure 1.1 shows a block diagram of the H8/3644 Group.
Port 8
P8
7
P8
6
/FTID
P8
5
/FTIC
P8
4
/FTIB
P8
3
/FTIA
P8
2
/FTOB
P8
1
/FTOA
P8
0
/FTCI
ROM
Port 7
P7
7
P7
6
/TMOV
P7
5
/TMCIV
P7
4
/TMRIV
P7
3
Port 6
P6
7
P6
6
P6
5
P6
4
P6
3
P6
2
P6
1
P6
0
CMOS large-
current port
I
OL
= 10 mA
@V
OL
= 1V
P5
7
/INT
7
P5
6
/INT
6
/TMIB
P5
5
/INT
5
/ADTRG
P5
4
/INT
4
P5
3
/INT
3
P5
2
/INT
2
P5
1
/INT
1
P5
0
/INT
0
Port 1
P1
0
/TMOW
P1
4
/PWM
P1
5
/IRQ
1
P1
6
/IRQ
2
P1
7
/IRQ
3
/TRGV
Port 2
P2
0
/SCK
3
P2
1
/RXD
P2
2
/TXD
Port 3
P3
0
/SCK
1
P3
1
/SI
1
P3
2
/SO
1
P9
0
/FV
PP
*
P9
1
P9
2
P9
3
P9
4
Port 9
PB
0
/AN
0
PB
1
/AN
1
PB
2
/AN
2
PB
3
/AN
3
PB
4
/AN
4
PB
5
/AN
5
PB
6
/AN
6
PB
7
/AN
7
V
SS
V
CC
RES
IRQ
0
TEST
OSC
1
OSC
2
X
1
X
2
CPU
H8/300L
Data bus (lower)
System clock
generator
Subclock
generator
RAM
Timer A SCI1
Timer B1
Watchdog
timer
A/D converter
SCI3
Timer X
Timer V
14-bit PWM
AV
CC
AV
SS
Port 5
Port B
Data bus (upper)
Address bus
Note: * There is no P9
0
function in the flash memory version.
Figure 1.1 Block Diagram
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 7 of 526
REJ09B0326-0600
1.3 Pin Arrangement and Functions
1.3.1 Pin Arrangement
The H8/3644 Group pin arrangement is shown in figures 1.2 (FP-64A), 1.3 (DP-64S), and 1.4
(TFP-80C).
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
P57/INT7
P56/INT6/TMIB
P55/INT5/ADTRG
P54/INT4
P53/INT3
P52/INT2
P51/INT1
P50/INT0
P67
P66
P65
P64
P63
P62
P61
P60
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
P21/RXD
P20/SCK3
P87
P86/FTID
P85/FTIC
P84/FTIB
P83/FTIA
P82/FTOB
P81/FTOA
P80/FTCI
P77
P76/TMOV
P75/TMCIV
P74/TMRIV
P73
VCC
PB1/AN1
PB0/AN0
AVSS
TEST
X2
X1
VSS
OSC1
OSC2
RES
P90/FVPP*
P91
P92
P93
P94
IRQ0
P22/TXD
P32/SO1
P31/SI1
P30/SCK1
P10/TMOW
P14/PWM
P15/IRQ1
P16/IRQ2
P17/IRQ3/TRGV
AVCC
PB7/AN7
PB6/AN6
PB5/AN5
PB4/AN4
PB3/AN3
PB2/AN2
Note: * There is no P90 function in the flash memory version.
Figure 1.2 Pin Arrangement (FP-64A: Top View)
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 8 of 526
REJ09B0326-0600
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P1
6
/IRQ
2
P1
5
/IRQ
1
P1
4
/PWM
P1
0
/TMOW
P3
0
/SCK
1
P3
1
/SI
1
P3
2
/SO
1
P2
2
/TXD
P2
1
/RXD
P2
0
/SCK
3
P8
7
P8
6
/FTID
P8
5
/FTIC
P8
4
/FTIB
P8
3
/FTIA
P8
2
/FTOB
P8
1
/FTOA
P8
0
/FTCI
P7
7
P7
6
/TMOV
P7
5
/TMCIV
P7
4
/TMRIV
P7
3
V
CC
P5
7
/INT
7
P5
6
/INT
6
/TMIB
P5
5
/INT
5
/ADTRG
P5
4
/INT
4
P5
3
/INT
3
P5
2
/INT
2
P5
1
/INT
1
P5
0
/INT
0
P1
7
/IRQ
3
/TRGV
AV
CC
PB
7
/AN
7
PB
6
/AN
6
PB
5
/AN
5
PB
4
/AN
4
PB
3
/AN
3
PB
2
/AN
2
PB
1
/AN
1
PB
0
/AN
0
AV
SS
TEST
X
2
X
1
V
SS
OSC
1
OSC
2
RES
P9
0
/FV
PP
*
P9
1
P9
2
P9
3
P9
4
IRQ
0
P6
0
P6
1
P6
2
P6
3
P6
4
P6
5
P6
6
P6
7
Note: * There is no P90 function in the flash memory version.
Figure 1.3 Pin Arrangement (DP-64S: Top View)
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 9 of 526
REJ09B0326-0600
NC
PB
1
/AN
1
PB
0
/AN
0
AV
SS
TEST
X
2
X
1
V
SS1
OSC
1
OSC
2
V
SS2
RES
P9
0
/FV
PP
*
P9
1
P9
2
NC
P9
3
P9
4
IRQ
0
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
NC
P2
1
/RXD
P2
0
/SCK
3
P8
7
P8
6
/FTID
P8
5
/FTIC
P8
4
/FTIB
NC
P8
3
/FTIA
P8
2
/FTOB
P8
1
/FTOA
P8
0
/FTCI
NC
P7
7
P7
6
/TMOV
P7
5
/TMCIV
P7
4
/TMRIV
P7
3
V
CC
NC
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
NC
NC
P2
2
/TXD
P3
2
/SO
1
P3
1
/SI
1
P3
0
/SCK
1
P1
0
/TMOW
P1
4
/PWM
P1
5
/IRQ
1
P1
6
/IRQ
2
P1
7
/IRQ
3
/TRGV
AV
CC
PB
7
/AN
7
PB
6
/AN
6
PB
5
/AN
5
PB
4
/AN
4
PB
3
/AN
3
PB
2
/AN
2
NC
NC
NC
NC
P5
7
/INT
7
P5
6
/INT
6
/TMIB
P5
5
/INT
5
/ADTRG
P5
4
/INT
4
P5
3
/INT
3
P5
2
/INT
2
P5
1
/INT
1
P5
0
/INT
0
NC
P6
7
P6
6
P6
5
P6
4
P6
3
P6
2
P6
1
P6
0
NC
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
Note: * There is no P9
0
function in the flash memory version.
Figure 1.4 Pin Arrangement (TFP-80C: Top View)
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 10 of 526
REJ09B0326-0600
1.3.2 Pin Functions
Table 1.2 outlines the pin functions of the H8/3644 Group.
Table 1.2 Pin Functions
Pin No.
Type Symbol FP-64A DP-64S TFP-80C I/O Name and Functions
Power
source pins
VCC 33 41 42 Input Power supply: All VCC pins
should be connected to the user
system VCC.
V
SS 7 15 8, 11 Input Ground: All VSS pins should be
connected to the user system
GND.
AVCC 58 2 72 Input Analog power supply: This is
the power supply pin for the A/D
converter. When the A/D
converter is not used, connect
this pin to the user system VCC.
AVSS 3 11 4 Input Analog ground: This is the A/D
converter ground pin. It should be
connected to the user system
GND.
Clock pins OSC1 8 16 9 Input System clock: These pins
connect to a crystal or ceramic
resonator, or can be used to input
an external clock.
OSC2 9 17 10 Output
See section 4, Clock Pulse
Generators, for a typical
connection diagram.
X
1 6 14 7 Input Subclock: These pins connect to
a 32.768-kHz crystal resonator.
X
2 5 13 6 Output
See section 4, Clock Pulse
Generators, for a typical
connection diagram.
System
control
RES 10 18 12 Input Reset: When this pin is driven
low, the chip is reset
TEST 4 12 5 Input Test: This is a test pin, not for
use in application systems. It
should be connected to VSS.
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 11 of 526
REJ09B0326-0600
Pin No.
Type Symbol FP-64A DP-64S TFP-80C I/O Name and Functions
Interrupt
pins
IRQ0
IRQ1
IRQ2
IRQ3
16
55
56
57
24
63
64
1
19
69
70
71
Input IRQ interrupt request 0 to 3:
These are input pins for edge-
sensitive external interrupts, with
a selection of rising or falling
edge
INT7 to
INT0
32 to 25 40 to 33 38 to 31 Input INT interrupt request 0 to 7:
These are input pins for edge-
sensitive external interrupts, with
a selection of rising or falling
edge
Timer pins TMOW 53 61 67 Output Clock output: This is an output
pin for waveforms generated by
the timer A output circuit
TMIB 31 39 37 Input Timer B1 event counter input:
This is an event input pin for input
to the timer B1 counter
TMOV 37 45 46 Output Timer V output: This is an
output pin for waveforms
generated by the timer V output
compare function
TMCIV 36 44 45 Input Timer V event input: This is an
event input pin for input to the
timer V counter
TMRIV 35 43 44 Input Timer V counter reset: This is a
counter reset input pin for timer V
TRGV 57 1 71 Input Timer V counter trigger input:
This is a trigger input pin for the
timer V counter and realtime
output port
FTCI 39 47 49 Input Timer X clock input: This is an
external clock input pin for input
to the timer X counter
FTOA 40 48 50 Output Timer X output compare A
output: This is an output pin for
timer X output compare A
FTOB 41 49 51 Output Timer X output compare B
output: This is an output pin for
timer X output compare B
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 12 of 526
REJ09B0326-0600
Pin No.
Type Symbol FP-64A DP-64S TFP-80C I/O Name and Functions
Timer pins FTIA 42 50 52 Input Timer X input capture A input:
This is an input pin for timer X
input capture A
FTIB 43 51 54 Input Timer X input capture B input:
This is an input pin for timer X
input capture B
FTIC 44 52 55 Input Timer X input capture C input:
This is an input pin for timer X
input capture C
FTID 45 53 56 Input Timer X input capture D input:
This is an input pin for timer X
input capture D
14-bit
PWM pin
PWM 54 62 68 Output 14-bit PWM output: This is an
output pin for waveforms
generated by the 14-bit PWM
I/O ports PB7 to
PB0
59 to 64,
1, 2
3 to 10 73 to 78
2, 3
Input Port B: This is an 8-bit input port
P17 to
P14,
P10
57 to 53 1,
64 to 61
71 to 67 I/O Port 1: This is a 5-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 1 (PCR1)
P22 to
P20
49 to 47 57 to 55 63, 59
58
I/O Port 2: This is a 3-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 2 (PCR2)
P32 to
P30
50 to 52 58 to 60 64 to 66 I/O Port 3: This is a 3-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 3 (PCR3)
P57 to
P50
32 to 25 40 to 33 38 to 31 I/O Port 5: This is an 8-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 5 (PCR5)
P67 to
P60
24 to 17 32 to 25 29 to 22 I/O Port 6: This is an 8-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 6 (PCR6)
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 13 of 526
REJ09B0326-0600
Pin No.
Type Symbol FP-64A DP-64S TFP-80C I/O Name and Functions
I/O ports P77 to
P73
38 to 34 46 to 42 47 to 43 I/O Port 7: This is a 5-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 7 (PCR7)
P87 to
P80
46 to 39 54 to 47 57 to 54,
52 to 49
I/O Port 8: This is an 8-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 8 (PCR8)
P94 to
P90
15 to 11 23 to 19 18, 17
15 to 13
I/O Port 9: This is a 5-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 9 (PCR9)
Note: There is no P90 function
in the flash memory
version since P90 is used
as the FVPP pin.
Serial com-
munication
SI1 51 59 65 Input SCI1 receive data input:
This is the SCI1 data input pin
interface
(SCI)
SO1 50 58 64 Output SCI1 transmit data output:
This is the SCI1 data output pin
SCK1 52 60 66 I/O SCI1 clock I/O:
This is the SCI1 clock I/O pin
RXD 48 56 59 Input SCI3 receive data input:
This is the SCI3 data input pin
TXD 49 57 63 Output SCI3 transmit data output:
This is the SCI3 data output pin
SCK3 47 55 58 I/O SCI3 clock I/O:
This is the SCI3 clock I/O pin
A/D
converter
AN7 to
AN0
59 to 64,
1, 2
3 to 10 73 to 78
2, 3
Input Analog input channels 11 to 0:
These are analog data input
channels to the A/D converter
ADTRG 30 38 36 Input A/D converter trigger input:
This is the external trigger input
pin to the A/D converter
Section 1 Overview
Rev. 6.00 Sep 12, 2006 page 14 of 526
REJ09B0326-0600
Pin No.
Type Symbol FP-64A DP-64S TFP-80C I/O Name and Functions
Flash
memory
FVPP 11 19 13 Input On-board-programmable flash
memory power supply:
Connected to the flash memory
programming power supply
(+12 V). When the flash memory
is not being programmed,
connect to the user system VCC.
In versions other than the on-chip
flash memory version, this pin is
P90
Other NC 1, 16,
20, 21,
30, 39,
40, 41,
48, 53,
60 to 62,
79, 80
Non-connected pins: These
pins must be left unconnected
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 15 of 526
REJ09B0326-0600
Section 2 CPU
2.1 Overview
The H8/300L CPU has sixteen 8-bit general registers, which can also be paired as eight 16-bit
registers. Its concise instruction set is designed for high-speed operation.
2.1.1 Features
Features of the H8/300L CPU are listed below.
• General-register architecture
Sixteen 8-bit general registers, also usable as eight 16-bit general registers
• Instruction set with 55 basic instructions, including:
Multiply and divide instructions
Powerful bit-manipulation instructions
• Eight addressing modes
Register direct
Register indirect
Register indirect with displacement
Register indirect with post-increment or pre-decrement
Absolute address
Immediate
Program-counter relative
Memory indirect
• 64-kbyte address space
• High-speed operation
All frequently used instructions are executed in two to four states
High-speed arithmetic and logic operations
8- or 16-bit register-register add or subtract: 0.4 µs (operating at φ = 5 MHz)
0.25 µs (operating at φ = 8 MHz)*
8 × 8-bit multiply: 2.8 µs (operating at φ = 5 MHz)
1.75 µs (operating at φ = 8 MHz)*
16 ÷ 8-bit divide: 2.8 µs (operating at φ = 5 MHz)
1.75 µs (operating at φ = 8 MHz)*
Note: * Applies only to F-ZTAT, R of the ZTAT, and R of the mask ROM version.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 16 of 526
REJ09B0326-0600
• Low-power operation modes
SLEEP instruction for transfer to low-power operation
2.1.2 Address Space
The H8/300L CPU supports an address space of up to 64 kbytes for storing program code and
data.
See section 2.8, Memory Map, for details of the memory map.
2.1.3 Register Configuration
Figure 2.1 shows the register structure of the H8/300L CPU. There are two groups of registers: the
general registers and control registers.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 17 of 526
REJ09B0326-0600
7070
15 0
PC
R0H
R1H
R2H
R3H
R4H
R5H
R6H
R7H
R0L
R1L
R2L
R3L
R4L
R5L
R6L
R7L
(SP) SP: Stack pointer
PC: Program counter
CCR: Condition code register
Carry flag
Overflow flag
Zero flag
Negative flag
Half-carry flag
Interrupt mask bit
User bit
User bit
CCR I U H U N Z V C
General registers (Rn)
Control registers (CR)
75321064
Figure 2.1 CPU Registers
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 18 of 526
REJ09B0326-0600
2.2 Register Descriptions
2.2.1 General Registers
All the general registers can be used as both data registers and address registers.
When used as data registers, they can be accessed as 16-bit registers (R0 to R7), or the high bytes
(R0H to R7H) and low bytes (R0L to R7L) can be accessed separately as 8-bit registers.
When used as address registers, the general registers are accessed as 16-bit registers (R0 to R7).
R7 also functions as the stack pointer (SP), used implicitly by hardware in exception processing
and subroutine calls. When it functions as the stack pointer, as indicated in figure 2.2, SP (R7)
points to the top of the stack.
Lower address side [H'0000]
Upper address side [H'FFFF]
Unused area
Stack area
SP (R7)
Figure 2.2 Stack Pointer
2.2.2 Control Registers
The CPU control registers include a 16-bit program counter (PC) and an 8-bit condition code
register (CCR).
Program Counter (PC): This 16-bit register indicates the address of the next instruction the CPU
will execute. All instructions are fetched 16 bits (1 word) at a time, so the least significant bit of
the PC is ignored (always regarded as 0).
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 19 of 526
REJ09B0326-0600
Condition Code Register (CCR): This 8-bit register contains internal status information,
including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and
carry (C) flags. These bits can be read and written by software (using the LDC, STC, ANDC,
ORC, and XORC instructions). The N, Z, V, and C flags are used as branching conditions for
conditional branching (Bcc) instructions.
Bit 7Interrupt Mask Bit (I): When this bit is set to 1, interrupts are masked. This bit is set to 1
automatically at the start of exception handling. The interrupt mask bit may be read and written by
software. For further details, see section 3.3, Interrupts.
Bit 6User Bit (U): Can be used freely by the user.
Bit 5Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and is cleared to 0
otherwise.
The H flag is used implicitly by the DAA and DAS instructions.
When the ADD.W, SUB.W, or CMP.W instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 11, and is cleared to 0 otherwise.
Bit 4User Bit (U): Can be used freely by the user.
Bit 3VNegative Flag (N): Indicates the most significant bit (sign bit) of the result of an
instruction.
Bit 2Zero Flag (Z): Set to 1 to indicate a zero result, and cleared to 0 to indicate a non-zero
result.
Bit 1Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other
times.
Bit 0Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift/rotate carry
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave some or all of the flag bits unchanged.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 20 of 526
REJ09B0326-0600
Refer to the H8/300L Series Programming Manual for the action of each instruction on the flag
bits.
2.2.3 Initial Register Values
In reset exception handling, the program counter (PC) is initialized by a vector address (H'0000)
load, and the I bit in the CCR is set to 1. The other CCR bits and the general registers are not
initialized. In particular, the stack pointer (R7) is not initialized. The stack pointer should be
initialized by software, by the first instruction executed after a reset.
2.3 Data Formats
The H8/300L CPU can process 1-bit data, 4-bit (BCD) data, 8-bit (byte) data, and 16-bit (word)
data.
The H8/300L CPU can process 1-bit, 4-bit BCD, 8-bit (byte), and 16-bit (word) data. 1-bit data is
handled by bit manipulation instructions, and is accessed by being specified as bit n (n = 0, 1, 2, ...
7) in the operand data (byte).
Byte data is handled by all arithmetic and logic instructions except ADDS and SUBS. Word data
is handled by the MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (b bits × 8 bits),
and DIVXU (16 bits ÷ 8 bits) instructions.
With the DAA and DAS decimal adjustment instructions, byte data is handled as two 4-bit BCD
data units.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 21 of 526
REJ09B0326-0600
2.3.1 Data Formats in General Registers
Data of all the sizes above can be stored in general registers as shown in figure 2.3.
7 6 5 4 3 2 1 0 don’t care
Data Type Register No. Data Format
70
1-bit data RnH
76543210don’t care
70
1-bit data RnL
MSB LSB don’t care
70
Byte data RnH
Byte data RnL
Word data Rn
4-bit BCD data RnH
4-bit BCD data RnL
Legend:
RnH:
RnL:
MSB:
LSB:
Upper byte of general register
Lower byte of general register
Most significant bit
Least significant bit
MSB LSBdon’t care
70
MSB LSB
15 0
Upper digit Lower digit don’t care
7034
don’t care Upper digit Lower digit
70
34
Figure 2.3 General Register Data Formats
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 22 of 526
REJ09B0326-0600
2.3.2 Memory Data Formats
Figure 2.4 indicates the data formats in memory. For access by the H8/300L CPU, word data
stored in memory must always begin at an even address. When word data beginning at an odd
address is accessed, the least significant bit is regarded as 0, and the word data beginning at the
preceding address is accessed. The same applies to instruction codes.
Data Format
76543210
AddressData Type
70
Address n
MSB LSB
MSB
LSB
Upper 8 bits
Lower 8 bits
MSB LSBCCR
CCR*
MSB
LSB
MSB LSB
Address n
Even address
Odd address
Even address
Odd address
Even address
Odd address
1-bit data
Byte data
Word data
Byte data (CCR) on stack
Word data on stack
Legend:
CCR: Condition code register
Note: * Ignored on return
Figure 2.4 Memory Data Formats
When the stack is accessed using R7 as an address register, word access should always be
performed. The CCR is stored as word data with the same value in the upper 8 bits and the lower 8
bits. On return, the lower 8 bits are ignored.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 23 of 526
REJ09B0326-0600
2.4 Addressing Modes
2.4.1 Addressing Modes
The H8/300L CPU supports the eight addressing modes listed in table 2.1. Each instruction uses a
subset of these addressing modes.
Table 2.1 Addressing Modes
No. Address Modes Symbol
1 Register direct Rn
2 Register indirect @Rn
3 Register indirect with displacement @(d:16, Rn)
4 Register indirect with post-increment
Register indirect with pre-decrement
@Rn+
@–Rn
5 Absolute address @aa:8 or @aa:16
6 Immediate #xx:8 or #xx:16
7 Program-counter relative @(d:8, PC)
8 Memory indirect @@aa:8
1. Register DirectRn: The register field of the instruction specifies an 8- or 16-bit general
register containing the operand.
Only the MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (8 bits × 8 bits), and
DIVXU (16 bits ÷ 8 bits) instructions have 16-bit operands.
2. Register Indirect@Rn: The register field of the instruction specifies a 16-bit general
register containing the address of the operand in memory.
3. Register Indirect with Displacement@(d:16, Rn): The instruction has a second word
(bytes 3 and 4) containing a displacement which is added to the contents of the specified
general register to obtain the operand address in memory.
This mode is used only in MOV instructions. For the MOV.W instruction, the resulting
address must be even.
4. Register Indirect with Post-Increment or Pre-Decrement@Rn+ or @–Rn:
Register indirect with post-increment@Rn+
The @Rn+ mode is used with MOV instructions that load registers from memory.
The register field of the instruction specifies a 16-bit general register containing the address
of the operand. After the operand is accessed, the register is incremented by 1 for MOV.B
or 2 for MOV.W, and the result of the addition is stored in the register. For MOV.W, the
original contents of the 16-bit general register must be even.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 24 of 526
REJ09B0326-0600
Register indirect with pre-decrement@–Rn
The @–Rn mode is used with MOV instructions that store register contents to memory.
The register field of the instruction specifies a 16-bit general register which is decremented
by 1 or 2 to obtain the address of the operand in memory. The register retains the
decremented value. The size of the decrement is 1 for MOV.B or 2 for MOV.W. For
MOV.W, the original contents of the register must be even.
5. Absolute Address@aa:8 or @aa:16: The instruction specifies the absolute address of the
operand in memory.
The absolute address may be 8 bits long (@aa:8) or 16 bits long (@aa:16). The MOV.B and bit
manipulation instructions can use 8-bit absolute addresses. The MOV.B, MOV.W, JMP, and
JSR instructions can use 16-bit absolute addresses.
For an 8-bit absolute address, the upper 8 bits are assumed to be 1 (H'FF). The address range is
H'FF00 to H'FFFF (65280 to 65535).
6. Immediate#xx:8 or #xx:16: The second byte (#xx:8) or the third and fourth bytes (#xx:16)
of the instruction code are used directly as the operand. Only MOV.W instructions can be used
with #xx:16.
The ADDS and SUBS instructions implicitly contain the value 1 or 2 as immediate data. Some
bit manipulation instructions contain 3-bit immediate data in the second or fourth byte of the
instruction, specifying a bit number.
7. Program-Counter Relative@(d:8, PC): This mode is used in the Bcc and BSR
instructions. An 8-bit displacement in byte 2 of the instruction code is sign-extended to 16 bits
and added to the program counter contents to generate a branch destination address, and the PC
contents to be added are the start address of the next instruction, so that the possible branching
range is –126 to +128 bytes (–63 to +64 words) from the branch instruction. The displacement
should be an even number.
8. Memory Indirect@@aa:8: This mode can be used by the JMP and JSR instructions. The
second byte of the instruction code specifies an 8-bit absolute address. This specifies an
operand in memory, and a branch is performed with the contents of this operand as the branch
address.
The upper 8 bits of the absolute address are assumed to be 0 (H'00), so the address range is
from H'0000 to H'00FF (0 to 255). Note that with the H8/300L Series, the lower end of the
address area is also used as a vector area. See section 3.3, Interrupts, for details on the vector
area.
If an odd address is specified as a branch destination or as the operand address of a MOV.W
instruction, the least significant bit is regarded as 0, causing word access to be performed at the
address preceding the specified address. See section 2.3.2, Memory Data Formats, for further
information.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 25 of 526
REJ09B0326-0600
2.4.2 Effective Address Calculation
Table 2.2 shows how effective addresses are calculated in each of the addressing modes.
Arithmetic and logic instructions use register direct addressing (1). The ADD.B, ADDX, SUBX,
CMP.B, AND, OR, and XOR instructions can also use immediate addressing (6).
Data transfer instructions can use all addressing modes except program-counter relative (7) and
memory indirect (8).
Bit manipulation instructions use register direct (1), register indirect (2), or 8-bit absolute
addressing (5) to specify a byte operand, and 3-bit immediate addressing (6) to specify a bit
position in that byte. The BSET, BCLR, BNOT, and BTST instructions can also use register direct
addressing (1) to specify the bit position.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 26 of 526
REJ09B0326-0600
Table 2.2 Effective Address Calculation
No.
Addressing Mode and
Instruction Format
Effective Address
Calculation Method
Effective Address (EA)
1
Register indirect, Rn
Operand is contents of
registers indicated by rm/rn
op rm rn
87 34015 rm
30 rn
30
2
op rm
76 34015
Register indirect, @Rn
Contents (16 bits) of
register indicated by rm
015
015
3
Register indirect with
displacement, @(d:16, Rn)
op rm
76 34015
disp
015
disp
015
Contents (16 bits) of
register indicated by rm
4
op rm
76 34015
Register indirect with
post-increment, @Rn+
op rm
76 34015
Register indirect with
pre-decrement, @–Rn
Incremented or
decremented by 1 if
operand is byte size,
and by 2 if word size
015
1 or 2
015
015
1 or 2
015
Contents (16 bits) of
register indicated by rm
Contents (16 bits) of
register indicated by rm
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 27 of 526
REJ09B0326-0600
No.
Addressing Mode and
Instruction Format
Effective Address
Calculation Method
Effective Address (EA)
5
Absolute address
@aa:8
@aa:16
op
87 015
015
abs
H'FF
87 015
015
abs
op
6
op 015
IMM
#xx:16
op 87 015 IMM
Immediate
#xx:8 Operand is 1- or 2-byte
immediate data
7
op disp
7015
Program-counter relative
@(d:8, PC) PC contents
015
015
8
Sign
extension disp
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 28 of 526
REJ09B0326-0600
No.
Addressing Mode and
Instruction Format
Effective Address
Calculation Method
Effective Address (EA)
8
Memory indirect, @@aa:8
op
87 015
Memory contents
(16 bits)
015
abs
H'00
87 015
abs
Legend:
rm, rn: Register field
op: Operation field
disp: Displacement
IMM: Immediate data
abs: Absolute address
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 29 of 526
REJ09B0326-0600
2.5 Instruction Set
The H8/300L Series can use a total of 55 instructions, which are grouped by function in table 2.3.
Table 2.3 Instruction Set
Function Instructions Number
Data transfer MOV, PUSH*1, POP*1 1
Arithmetic operations ADD, SUB, ADDX, SUBX, INC, DEC, ADDS,
SUBS, DAA, DAS, MULXU, DIVXU, CMP, NEG
14
Logic operations AND, OR, XOR, NOT 4
Shift SHAL, SHAR, SHLL, SHLR, ROTL, ROTR,
ROTXL, ROTXR
8
Bit manipulation BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR,
BIOR, BXOR, BIXOR, BLD, BILD, BST, BIST
14
Branch Bcc*2, JMP, BSR, JSR, RTS 5
System control RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP 8
Block data transfer EEPMOV 1
Total: 55
Notes: 1. PUSH Rn is equivalent to MOV.W Rn, @–SP.
POP Rn is equivalent to MOV.W @SP+, Rn.
2. Bcc is a conditional branch instruction. The same applies to machine language.
Tables 2.4 to 2.11 show the function of each instruction. The notation used is defined next.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 30 of 526
REJ09B0326-0600
Notation
Rd General register (destination)
Rs General register (source)
Rn General register
(EAd), <Ead> Destination operand
(EAs), <Eas> Source operand
CCR Condition code register
N N (negative) flag of CCR
Z Z (zero) flag of CCR
V V (overflow) flag of CCR
C C (carry) flag of CCR
PC Program counter
SP Stack pointer
#IMM Immediate data
disp Displacement
+ Addition
– Subtraction
× Multiplication
÷ Division
∧ AND logical
∨ OR logical
⊕ Exclusive OR logical
→ Move
~ Logical negation (logical complement)
:3 3-bit length
:8 8-bit length
:16 16-bit length
( ), < > Contents of operand indicated by effective address
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 31 of 526
REJ09B0326-0600
2.5.1 Data Transfer Instructions
Table 2.4 describes the data transfer instructions. Figure 2.5 shows their object code formats.
Table 2.4 Data Transfer Instructions
Instruction Size* Function
MOV B/W (EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general
register and memory, or moves immediate data to a general register.
The Rn, @Rn, @(d:16, Rn), @aa:16, #xx:16, @–Rn, and @Rn+
addressing modes are available for word data. The @aa:8 addressing
mode is available for byte data only.
The @–R7 and @R7+ modes require a word-size specification.
POP W
@SP+ → Rn
Pops a general register from the stack. Equivalent to MOV.W @SP+,
Rn.
PUSH W Rn → @–SP
Pushes general register onto the stack. Equivalent to MOV.W Rn,
@–SP.
Notes: * Size: Operand size
B: Byte
W: Word
Certain precautions are required in data access. See section 2.9.1, Notes on Data Access, for
details.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 32 of 526
REJ09B0326-0600
15 087
op rm rn MOV
Rm→Rn
15 087
op rm rn @Rm←→Rn
15 087
op rm rn @(d:16, Rm)←→Rn
disp
15 087
op rm rn @Rm+→Rn, or
Rn →@–Rm
15 087
op rn abs @aa:8←→Rn
15 087
op rn @aa:16←→Rn
abs
15 087
op rn IMM #xx:8→Rn
15 087
op rn #xx:16→Rn
IMM
15 087
op rn PUSH, POP
Legend:
op:
rm, rn:
disp:
abs:
IMM:
Operation field
Register field
Displacement
Absolute address
Immediate data
@SP+ Rn, or
Rn @–SP
→
→
111
Figure 2.5 Data Transfer Instruction Codes
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 33 of 526
REJ09B0326-0600
2.5.2 Arithmetic Operations
Table 2.5 describes the arithmetic instructions.
Table 2.5 Arithmetic Instructions
Instruction Size* Function
ADD
SUB
B/W Rd ± Rs → Rd, Rd + #IMM → Rd
Performs addition or subtraction on data in two general registers, or
addition on immediate data and data in a general register. Immediate
data cannot be subtracted from data in a general register. Word data
can be added or subtracted only when both words are in general
registers.
ADDX
SUBX
B Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on data in two general
registers, or addition or subtraction with carry on immediate data and
data in a general register.
INC
DEC
B Rd ± 1 → Rd
Increments or decrements a general register
ADDS
SUBS
W Rd ± 1 → Rd, Rd ± 2 → Rd
Adds or subtracts 1 or 2 to or from a general register
DAA
DAS
B Rd decimal adjust → Rd
Decimal-adjusts (adjusts to packed BCD) an addition or subtraction
result in a general register by referring to the CCR
MULXU B Rd × Rs → Rd
Performs 8-bit × 8-bit unsigned multiplication on data in two general
registers, providing a 16-bit result
DIVXU B Rd ÷ Rs → Rd
Performs 16-bit ÷ 8-bit unsigned division on data in two general
registers, providing an 8-bit quotient and 8-bit remainder
CMP B/W Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general
register or with immediate data, and indicates the result in the CCR.
Word data can be compared only between two general registers.
NEG B 0 – Rd → Rd
Obtains the two’s complement (arithmetic complement) of data in a
general register
Notes: * Size: Operand size
B: Byte
W: Word
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 34 of 526
REJ09B0326-0600
2.5.3 Logic Operations
Table 2.6 describes the four instructions that perform logic operations.
Table 2.6 Logic Operation Instructions
Instruction Size* Function
AND B Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data
OR B Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data
XOR B Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data
NOT B ~ Rd → Rd
Obtains the one’s complement (logical complement) of general
register contents
Notes: * Size: Operand size
B: Byte
2.5.4 Shift Operations
Table 2.7 describes the eight shift instructions.
Table 2.7 Shift Instructions
Instruction Size* Function
SHAL
SHAR
B Rd shift → Rd
Performs an arithmetic shift operation on general register contents
SHLL
SHLR
B Rd shift → Rd
Performs a logical shift operation on general register contents
ROTL
ROTR
B Rd rotate → Rd
Rotates general register contents
ROTXL
ROTXR
B Rd rotate → Rd
Rotates general register contents through the C (carry) bit
Notes: * Size: Operand size
B: Byte
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 35 of 526
REJ09B0326-0600
Figure 2.6 shows the instruction code format of arithmetic, logic, and shift instructions.
15 087
op rm rn ADD, SUB, CMP,
ADDX, SUBX (Rm)
Legend:
op:
rm, rn:
IMM:
Operation field
Register field
Immediate data
15 087
op rn ADDS, SUBS, INC, DEC,
DAA, DAS, NEG, NOT
15 087
op rn MULXU, DIVXU
rm
15 087
rn IMM ADD, ADDX, SUBX,
CMP (#XX:8)
op
15 087
op rn AND, OR, XOR (Rm)
rm
15 087
rn IMM AND, OR, XOR (#xx:8)
op
15 087 rn SHAL, SHAR, SHLL, SHLR,
ROTL, ROTR, ROTXL, ROTXR
op
Figure 2.6 Arithmetic, Logic, and Shift Instruction Codes
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 36 of 526
REJ09B0326-0600
2.5.5 Bit Manipulations
Table 2.8 describes the bit-manipulation instructions. Figure 2.7 shows their object code formats.
Table 2.8 Bit-Manipulation Instructions
Instruction Size* Function
BSET B 1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of
a general register.
BCLR B 0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory to 0. The bit
number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT B ~ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory. The bit number
is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST B ~ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND B C ∧ (<bit-No.> of <EAd>) → C
ANDs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIAND B C ∧ [~ (<bit-No.> of <EAd>)] → C
ANDs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BOR B C ∨ (<bit-No.> of <EAd>) → C
ORs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIOR B C ∨ [~ (<bit-No.> of <EAd>)] → C
ORs the C flag with the inverse of a specified bit in a general register
or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
Notes: * Size: Operand size
B: Byte
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 37 of 526
REJ09B0326-0600
Instruction Size* Function
BXOR B C ⊕ (<bit-No.> of <EAd>) → C
XORs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIXOR B C ⊕ [~(<bit-No.> of <EAd>)] → C
XORs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BLD B (<bit-No.> of <EAd>) → C
Copies a specified bit in a general register or memory to the C flag.
BILD B ~ (<bit-No.> of <EAd>) → C
Copies the inverse of a specified bit in a general register or memory
to the C flag.
The bit number is specified by 3-bit immediate data.
BST B C → (<bit-No.> of <EAd>)
Copies the C flag to a specified bit in a general register or memory.
BIST B ~ C → (<bit-No.> of <EAd>)
Copies the inverse of the C flag to a specified bit in a general register
or memory.
The bit number is specified by 3-bit immediate data.
Notes: * Size: Operand size
B: Byte
Certain precautions are required in bit manipulation. See section 2.9.2, Notes on Bit Manipulation,
for details.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 38 of 526
REJ09B0326-0600
15 087
op IMM rn Operand:
Bit No.:
Legend:
op:
rm, rn:
abs:
IMM:
Operation field
Register field
Absolute address
Immediate data
15 087
op rn
BSET, BCLR, BNOT, BTST
register direct (Rn)
immediate (#xx:3)
Operand:
Bit No.: register direct (Rn)
register direct (Rm)
rm
15 087
op 0 Operand:
Bit No.:
register indirect (@Rn)
immediate (#xx:3)
rn
0
0
0
0
0
0
0IMM
15 087
op 0 Operand:
Bit No.:
register indirect (@Rn)
register direct (Rm)
rn
0
0
0
0
0
0
0rmop
15 087
op Operand:
Bit No.:
absolute (@aa:8)
immediate (#xx:3)
abs
0000IMM
op
op
15 087
op Operand:
Bit No.:
absolute (@aa:8)
register direct (Rm)
abs
0000rmop
15 087
op IMM rn Operand:
Bit No.: register direct (Rn)
immediate (#xx:3)
BAND, BOR, BXOR, BLD, BST
15 087
op 0 Operand:
Bit No.:
register indirect (@Rn)
immediate (#xx:3)
rn
0
0
0
0
0
0
0IMMop
15 087
op Operand:
Bit No.:
absolute (@aa:8)
immediate (#xx:3)
abs
0000IMMop
Figure 2.7 Bit Manipulation Instruction Codes
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 39 of 526
REJ09B0326-0600
Legend:
op:
rm, rn:
abs:
IMM:
Operation field
Register field
Absolute address
Immediate data
15 087
op IMM rn Operand:
Bit No.: register direct (Rn)
immediate (#xx:3)
BIAND, BIOR, BIXOR, BILD, BIST
15 087
op 0 Operand:
Bit No.:
register indirect (@Rn)
immediate (#xx:3)
rn
0
0
0
0
0
0
0IMMop
15 087
op Operand:
Bit No.:
absolute (@aa:8)
immediate (#xx:3)
abs
0000IMMop
Figure 2.7 Bit Manipulation Instruction Codes (cont)
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 40 of 526
REJ09B0326-0600
2.5.6 Branching Instructions
Table 2.9 describes the branching instructions. Figure 2.8 shows their object code formats.
Table 2.9 Branching Instructions
Instruction Size* Function
Bcc Branches to the designated address if condition cc is true. The
branching conditions are given below.
Mnemonic Description Condition
BRA (BT) Always (true) Always
BRN (BF) Never (false) Never
BHI High C ∨ Z = 0
BLS Low or same C ∨ Z = 1
BCC (BHS) Carry clear (high or same) C = 0
BCS (BLO) Carry set (low) C = 1
BNE Not equal Z = 0
BEQ Equal Z = 1
BVC Overflow clear V = 0
BVS Overflow set V = 1
BPL Plus N = 0
BMI Minus N = 1
BGE Greater or equal N ⊕ V = 0
BLT Less than N ⊕ V = 1
BGT Greater than Z ∨ (N ⊕ V) = 0
BLE Less or equal Z ∨ (N ⊕ V) = 1
JMP Branches unconditionally to a specified address
BSR Branches to a subroutine at a specified address
JSR Branches to a subroutine at a specified address
RTS Returns from a subroutine
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 41 of 526
REJ09B0326-0600
Legend:
op:
cc:
rm:
disp:
abs:
Operation field
Condition field
Register field
Displacement
Absolute address
15 087
op cc disp Bcc
15 087
op rm 0 JMP (@Rm)
000
15 087
op JMP (@aa:16)
abs
15 087
op abs JMP (@@aa:8)
15 087
op disp BSR
15 087
op rm 0 JSR (@Rm)
000
15 087
op JSR (@aa:16)
abs
15 087
op abs JSR (@@aa:8)
15 087
op RTS
Figure 2.8 Branching Instruction Codes
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 42 of 526
REJ09B0326-0600
2.5.7 System Control Instructions
Table 2.10 describes the system control instructions. Figure 2.9 shows their object code formats.
Table 2.10 System Control Instructions
Instruction Size* Function
RTE Returns from an exception-handling routine
SLEEP Causes a transition from active mode to a power-down mode. See
section 5, Power-Down Modes, for details.
LDC B Rs → CCR, #IMM → CCR
Moves immediate data or general register contents to the condition
code register
STC B CCR → Rd
Copies the condition code register to a specified general register
ANDC B CCR ∧ #IMM → CCR
Logically ANDs the condition code register with immediate data
ORC B CCR ∨ #IMM → CCR
Logically ORs the condition code register with immediate data
XORC B CCR ⊕ #IMM → CCR
Logically exclusive-ORs the condition code register with immediate
data
NOP PC + 2 → PC
Only increments the program counter
Notes: * Size: Operand size
B: Byte
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 43 of 526
REJ09B0326-0600
Legend:
op:
rn:
IMM:
Operation field
Register field
Immediate data
15 087
op RTE, SLEEP, NOP
15 087
op rn LDC, STC (Rn)
15 087
op IMM ANDC, ORC,
XORC, LDC (#xx:8)
Figure 2.9 System Control Instruction Codes
2.5.8 Block Data Transfer Instruction
Table 2.11 describes the block data transfer instruction. Figure 2.10 shows its object code format.
Table 2.11 Block Data Transfer Instruction
Instruction Size Function
EEPMOV If R4L ≠ 0 then
repeat @R5+ → @R6+
R4L – 1 → R4L
until R4L = 0
else next;
Block transfer instruction. Transfers the number of data bytes
specified by R4L from locations starting at the address indicated by
R5 to locations starting at the address indicated by R6. After the
transfer, the next instruction is executed.
Certain precautions are required in using the EEPMOV instruction. See section 2.9.3, Notes on
Use of the EEPMOV Instruction, for details.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 44 of 526
REJ09B0326-0600
Legend:
op: Operation field
15 087
op
op
Figure 2.10 Block Data Transfer Instruction Code
2.6 Basic Operational Timing
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). For details on these
clock signals see section 4, Clock Pulse Generators. The period from a rising edge of φ or φSUB to
the next rising edge is called one state. A bus cycle consists of two states or three states. The cycle
differs depending on whether access is to on-chip memory or to on-chip peripheral modules.
2.6.1 Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.11 shows the on-chip memory access cycle.
T
1
state
Bus cycle
T
2
state
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Read data
Address
Write data
Internal data bus
(write access)
SUB
φ or φ
Figure 2.11 On-Chip Memory Access Cycle
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 45 of 526
REJ09B0326-0600
2.6.2 Access to On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits,
so access is by byte size only. This means that for accessing word data, two instructions must be
used.
Two-State Access to On-Chip Peripheral Modules: Figure 2.12 shows the operation timing in
the case of two-state access to an on-chip peripheral module.
T
1
state
Bus cycle
T
2
state
φ or φ
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Read data
Address
Write data
Internal data bus
(write access)
SUB
Figure 2.12 On-Chip Peripheral Module Access Cycle (2-State Access)
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 46 of 526
REJ09B0326-0600
Three-State Access to On-Chip Peripheral Modules: Figure 2.13 shows the operation timing in
the case of three-state access to an on-chip peripheral module.
T
1
state
Bus cycle
Internal
address bus
Internal
read signal
Internal
data bus
(read access)
Internal
write signal
Read data
Address
Internal
data bus
(write access)
T
2
state T
3
state
Write data
SUB
φ or φ
Figure 2.13 On-Chip Peripheral Module Access Cycle (3-State Access)
2.7 CPU States
2.7.1 Overview
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active (high-speed or medium-
speed) mode and subactive mode. In the program halt state there are a sleep (high-speed or
medium-speed) mode, standby mode, watch mode, and sub-sleep mode. These states are shown in
figure 2.14. Figure 2.15 shows the state transitions.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 47 of 526
REJ09B0326-0600
CPU state Reset state
Program
execution state
Program halt state
Exception-
handling state
Active
(high speed) mode
Active
(medium speed) mode
Subactive mode
Sleep (high-speed)
mode
Standby mode
Watch mode
Subsleep mode
Low-power
modes
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
The CPU executes successive
program instructions at
reduced speed, synchronized
by the system clock
The CPU executes
successive program
instructions at reduced
speed, synchronized
by the subclock
A state in which some
or all of the chip
functions are stopped
to conserve power
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
The CPU is initialized
Note: See section 5, Power-Down Modes, for details on the modes and their transitions.
Sleep (medium-speed)
mode
Figure 2.14 CPU Operation States
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 48 of 526
REJ09B0326-0600
Reset state
Program halt state
Exception-handling state
Program execution state
Reset cleared
SLEEP instruction executed
Reset
occurs Interrupt
source
Reset
occurs Exception-
handling
request
Exception-
handling
complete
Reset occurs
Figure 2.15 State Transitions
2.7.2 Program Execution State
In the program execution state the CPU executes program instructions in sequence.
There are three modes in this state, two active modes (high speed and medium speed) and one
subactive mode. Operation is synchronized with the system clock in active mode (high speed and
medium speed), and with the subclock in subactive mode. See section 5, Power-Down Modes for
details on these modes.
2.7.3 Program Halt State
In the program halt state there are five modes: two sleep modes (high speed and medium speed),
standby mode, watch mode, and subsleep mode. See section 5, Power-Down Modes for details on
these modes.
2.7.4 Exception-Handling State
The exception-handling state is a transient state occurring when exception handling is started by a
reset or interrupt and the CPU changes its normal processing flow. In exception handling caused
by an interrupt, SP (R7) is referenced and the PC and CCR values are saved on the stack.
For details on interrupt handling, see section 3.3, Interrupts.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 49 of 526
REJ09B0326-0600
2.8 Memory Map
Figure 2.16 shows a memory map of the H8/3644 Group.
Interrupt vectors
On-chip ROM
Reserved
Reserved
On-chip RAM
Reserved
Internal I/O registers
(16 bytes)
Internal I/O registers
(128 bytes)
H'0000
H'002F
H'0030
H'1FFF
H'3FFF
H'5FFF
H'7FFF
H'F770
H'F77F
H'FB80
H'FF9F
H'FFA0
H'FFFF
H'2FFF
8 kbytes
H8/3640
H'FF7F
H'FF80
H'FF7F
H'FF80
12 kbytes
H8/3641
12 kbytes
H8/3642
24 kbytes
H8/3643
32 kbytes
H8/3644
512 bytes 512 bytes 512 bytes 1 kbyte 1 kbyte
Figure 2.16 H8/3644 Group Memory Map
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 50 of 526
REJ09B0326-0600
2.9 Application Notes
2.9.1 Notes on Data Access
1. Access to empty areas
The address space of the H8/300L CPU includes empty areas in addition to the RAM,
registers, and ROM areas available to the user. If these empty areas are mistakenly accessed by
an application program, the following results will occur.
Data transfer from CPU to empty area:
The transferred data will be lost. This action may also cause the CPU to misoperate.
Data transfer from empty area to CPU:
Unpredictable data is transferred.
2. Access to internal I/O registers
Internal data transfer to or from on-chip modules other than the ROM and RAM areas makes
use of an 8-bit data width. If word access is attempted to these areas, the following results will
occur.
Word access from CPU to I/O register area:
Upper byte: Will be written to I/O register.
Lower byte: Transferred data will be lost.
Word access from I/O register to CPU:
Upper byte: Will be written to upper part of CPU register.
Lower byte: Unpredictable data will be written to lower part of CPU register.
Byte size instructions should therefore be used when transferring data to or from I/O registers
other than the on-chip ROM and RAM areas. Figure 2.17 shows the data size and number of states
in which on-chip peripheral modules can be accessed.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 51 of 526
REJ09B0326-0600
Interrupt vector area
(48 bytes)
On-chip ROM
On-chip RAM
Internal I/O registers
(96 bytes)
Internal I/O registers
(16 bytes)
Reserved
1,024 bytes
H'0000
H'002F
H'0030
H'7FFF
H'F770
H'F77F
H'FB80
H'FF7F
H'FF80
H'FF9F
H'FFA0
H'FFFF
Word Byte
Access States
2 or 3*
2
———
——
3*
2
———
×
—
Reserved
Reserved
Notes: The H8/3644 is shown as an example.
* Internal I/O registers in areas assigned to timer X (H'F770 to H'F77F),
SCI3 (H'FFA8 to H'FFAD), and timer V (H'FFB8 to H'FFBD) are accessed in three
states.
×
Figure 2.17 Data Size and Number of States for Access to and from
On-Chip Peripheral Modules
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 52 of 526
REJ09B0326-0600
2.9.2 Notes on Bit Manipulation
The BSET, BCLR, BNOT, BST, and BIST instructions read one byte of data, modify the data,
then write the data byte again. Special care is required when using these instructions in cases
where two registers are assigned to the same address, in the case of registers that include write-
only bits, and when the instruction accesses an I/O port.
Order of Operation Operation
1 Read Read byte data at the designated address
2 Modify Modify a designated bit in the read data
3 Write Write the altered byte data to the designated address
Bit Manipulation in Two Registers Assigned to the Same Address
Example 1: timer load register and timer counter
Figure 2.18 shows an example in which two timer registers share the same address. When a bit
manipulation instruction accesses the timer load register and timer counter of a reloadable timer,
since these two registers share the same address, the following operations take place.
Order of Operation Operation
1 Read Timer counter data is read (one byte)
2 Modify The CPU modifies (sets or resets) the bit designated in the instruction
3 Write The altered byte data is written to the timer load register
The timer counter is counting, so the value read is not necessarily the same as the value in the
timer load register. As a result, bits other than the intended bit in the timer load register may be
modified to the timer counter value.
R
W
R:
W: Read
Write
Count clock Timer counter
Timer load register
Reload
Internal bus
Figure 2.18 Timer Configuration Example
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 53 of 526
REJ09B0326-0600
Example 2: BSET instruction executed designating port 3
P37 and P36 are designated as input pins, with a low-level signal input at P37 and a high-level
signal at P36. The remaining pins, P35 to P30, are output pins and output low-level signals. In this
example, the BSET instruction is used to change pin P30 to high-level output.
[A: Prior to executing BSET]
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3 0 0 1 1 1 1 1 1
PDR3 1 0 0 0 0 0 0 0
[B: BSET instruction executed]
BSET #0 , @PDR3 The BSET instruction is executed designating port 3.
[C: After executing BSET]
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3 0 0 1 1 1 1 1 1
PDR3 0 1 0 0 0 0 0 1
[D: Explanation of how BSET operates]
When the BSET instruction is executed, first the CPU reads port 3.
Since P37 and P36 are input pins, the CPU reads the pin states (low-level and high-level input).
P35 to P30 are output pins, so the CPU reads the value in PDR3. In this example PDR3 has a value
of H'80, but the value read by the CPU is H'40.
Next, the CPU sets bit 0 of the read data to 1, changing the PDR3 data to H'41. Finally, the CPU
writes this value (H'41) to PDR3, completing execution of BSET.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 54 of 526
REJ09B0326-0600
As a result of this operation, bit 0 in PDR3 becomes 1, and P30 outputs a high-level signal.
However, bits 7 and 6 of PDR3 end up with different values.
To avoid this problem, store a copy of the PDR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PDR3.
[A: Prior to executing BSET]
MOV. B #80, R0L
MOV. B R0L, @RAM0
MOV. B R0L, @PDR3
The PDR3 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR3.
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3 0 0 1 1 1 1 1 1
PDR3 1 0 0 0 0 0 0 0
RAM0 1 0 0 0 0 0 0 0
[B: BSET instruction executed]
BSET #0 , @RAM0 The BSET instruction is executed designating the PDR3
work area (RAM0).
[C: After executing BSET]
MOV. B @RAM0, R0L
MOV. B R0L, @PDR3 The work area (RAM0) value is written to PDR3.
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3 0 0 1 1 1 1 1 1
PDR3 1 0 0 0 0 0 0 1
RAM0 1 0 0 0 0 0 0 1
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 55 of 526
REJ09B0326-0600
Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 3 control register PCR3
As in the examples above, P37 and P36 are input pins, with a low-level signal input at P37 and a
high-level signal at P36. The remaining pins, P35 to P30, are output pins that output low-level
signals. In this example, the BCLR instruction is used to change pin P30 to an input port. It is
assumed that a high-level signal will be input to this input pin.
[A: Prior to executing BCLR]
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3 0 0 1 1 1 1 1 1
PDR3 1 0 0 0 0 0 0 0
[B: BCLR instruction executed]
BCLR #0 , @PCR3 The BCLR instruction is executed designating PCR3.
[C: After executing BCLR]
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Output Output Output Output Output Output Output Input
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3 1 1 1 1 1 1 1 0
PDR3 1 0 0 0 0 0 0 0
[D: Explanation of how BCLR operates]
When the BCLR instruction is executed, first the CPU reads PCR3. Since PCR3 is a write-only
register, the CPU reads a value of H'FF, even though the PCR3 value is actually H'3F.
Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE. Finally, this value
(H'FE) is written to PCR3 and BCLR instruction execution ends.
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 56 of 526
REJ09B0326-0600
As a result of this operation, bit 0 in PCR3 becomes 0, making P30 an input port. However, bits 7
and 6 in PCR3 change to 1, so that P37 and P36 change from input pins to output pins.
To avoid this problem, store a copy of the PCR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PCR3.
[A: Prior to executing BCLR]
MOV. B #3F, R0L
MOV. B R0L, @RAM0
MOV. B R0L, @PCR3
The PCR3 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR3.
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3 0 0 1 1 1 1 1 1
PDR3 1 0 0 0 0 0 0 0
RAM0 0 0 1 1 1 1 1 1
[B: BCLR instruction executed]
BCLR #0 , @RAM0 The BCLR instruction is executed designating the PCR3
work area (RAM0).
[C: After executing BCLR]
MOV. B @RAM0, R0L
MOV. B R0L, @PCR3 The work area (RAM0) value is written to PCR3.
P37 P36 P35 P34 P33 P32 P31 P30
Input/output Input Input Output Output Output Output Output Output
Pin state Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3 0 0 1 1 1 1 1 0
PDR3 1 0 0 0 0 0 0 0
RAM0 0 0 1 1 1 1 1 0
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 57 of 526
REJ09B0326-0600
Table 2.12 lists the pairs of registers that share identical addresses. Table 2.13 lists the registers
that contain write-only bits.
Table 2.12 Registers with Shared Addresses
Register Name Abbreviation Address
Output compare register AH and output compare register BH (timer X) OCRAH/OCRBH H'F774
Output compare register AL and output compare register BL (timer X) OCRAL/OCRBL H'F775
Timer counter B1 and timer load register B1 (timer B1) TCB1/TLB1 H'FFB3
Port data register 1* PDR1 H'FFD4
Port data register 2* PDR2 H'FFD5
Port data register 3* PDR3 H'FFD6
Port data register 5* PDR5 H'FFD8
Port data register 6* PDR6 H'FFD9
Port data register 7* PDR7 H'FFDA
Port data register 8* PDR8 H'FFDB
Port data register 9* PDR9 H'FFDC
Note: * Port data registers have the same addresses as input pins.
Table 2.13 Registers with Write-Only Bits
Register Name Abbreviation Address
Port control register 1 PCR1 H'FFE4
Port control register 2 PCR2 H'FFE5
Port control register 3 PCR3 H'FFE6
Port control register 5 PCR5 H'FFE8
Port control register 6 PCR6 H'FFE9
Port control register 7 PCR7 H'FFEA
Port control register 8 PCR8 H'FFEB
Port control register 9 PCR9 H'FFEC
PWM control register PWCR H'FFD0
PWM data register U PWDRU H'FFD1
PWM data register L PWDRL H'FFD2
Section 2 CPU
Rev. 6.00 Sep 12, 2006 page 58 of 526
REJ09B0326-0600
2.9.3 Notes on Use of the EEPMOV Instruction
• The EEPMOV instruction is a block data transfer instruction. It moves the number of bytes
specified by R4L from the address specified by R5 to the address specified by R6.
←R6
←R6 + R4L
R5 →
R5 + R4L →
• When setting R4L and R6, make sure that the final destination address (R6 + R4L) does not
exceed H'FFFF. The value in R6 must not change from H'FFFF to H'0000 during execution of
the instruction.
H'FFFF
Not allowed
←R6
←R6 + R4L
R5 →
R5 + R4L →
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 59 of 526
REJ09B0326-0600
Section 3 Exception Handling
3.1 Overview
Exception handling is performed in the H8/3644 Group when a reset or interrupt occurs. Table 3.1
shows the priorities of these two types of exception handling.
Table 3.1 Exception Handling Types and Priorities
Priority Exception Source Time of Start of Exception Handling
High Reset Exception handling starts as soon as the reset state is cleared
Low
Interrupt When an interrupt is requested, exception handling starts after
execution of the present instruction or the exception handling
in progress is completed
3.2 Reset
3.2.1 Overview
A reset is the highest-priority exception. The internal state of the CPU and the registers of the on-
chip peripheral modules are initialized.
3.2.2 Reset Sequence
Reset by RES
RESRES
RES Pin: As soon as the RES pin goes low, all processing is stopped and the chip enters
the reset state.
To make sure the chip is reset properly, observe the following precautions.
• At power on: Hold the RES pin low until the clock pulse generator output stabilizes.
• Resetting during operation: Hold the RES pin low for at least 10 system clock cycles.
Reset exception handling begins when the RES pin is held low for a given period, then returned to
the high level.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 60 of 526
REJ09B0326-0600
Reset exception handling takes place as follows.
• The CPU internal state and the registers of on-chip peripheral modules are initialized, with the
I bit of the condition code register (CCR) set to 1.
• The PC is loaded from the reset exception handling vector address (H'0000 to H'0001), after
which the program starts executing from the address indicated in PC.
When system power is turned on or off, the RES pin should be held low.
Figure 3.1 shows the reset sequence starting from RES input.
Vector fetch
φ
Internal
address bus
Internal read
signal
Internal write
signal
Internal data
bus (16-bit)
RES
Internal
processing
Program initial
instruction prefetch
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) First instruction of program
(2) (3)
(2)
(1)
Reset cleared
Figure 3.1 Reset Sequence
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 61 of 526
REJ09B0326-0600
Reset by Watchdog Timer: The watchdog timer counter (TCW) starts counting up when the
WDON bit is set to 1 in the watchdog timer control/status register (TCSRW). If TCW overflows,
the WRST bit is set to 1 in TCSRW and the chip enters the reset state. While the WRST bit is set
to 1 in TCSRW, when TCW overflows the reset state is cleared and reset exception handling
begins. The same reset exception handling is carried out as for input at the RES pin. For details on
the watchdog timer, see section 9.6, Watchdog Timer.
3.2.3 Interrupt Immediately after Reset
After a reset, if an interrupt were to be accepted before the stack pointer (SP: R7) was initialized,
PC and CCR would not be pushed onto the stack correctly, resulting in program runaway. To
prevent this, immediately after reset exception handling all interrupts are masked. For this reason,
the initial program instruction is always executed immediately after a reset. This instruction should
initialize the stack pointer (e.g. MOV.W #xx: 16, SP).
3.3 Interrupts
3.3.1 Overview
The interrupt sources include 12 external interrupts (IRQ3 to IRQ0, INT7 to INT0) and 21 internal
interrupts from on-chip peripheral modules. Table 3.2 shows the interrupt sources, their priorities,
and their vector addresses. When more than one interrupt is requested, the interrupt with the
highest priority is processed.
The interrupts have the following features:
• Internal and external interrupts can be masked by the I bit in CCR. When the I bit is set to 1,
interrupt request flags can be set but the interrupts are not accepted.
• IRQ3 to IRQ0 and INT7 to INT0 can be set independently to either rising edge sensing or falling
edge sensing.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 62 of 526
REJ09B0326-0600
Table 3.2 Interrupt Sources and Their Priorities
Interrupt Source Interrupt Vector Number Vector Address Priority
RES Reset 0 H'0000 to H'0001 High
IRQ0 IRQ0 4 H'0008 to H'0009
IRQ1 IRQ1 5 H'000A to H'000B
IRQ2 IRQ2 6 H'000C to H'000D
IRQ3 IRQ3 7 H'000E to H'000F
INT0 INT0 8 H'0010 to H'0011
INT1 INT1
INT2 INT2
INT3 INT3
INT4 INT4
INT5 INT5
INT6 INT6
INT7 INT7
Timer A Timer A overflow 10 H'0014 to H'0015
Timer B1 Timer B1 overflow 11 H'0016 to H'0017
Timer X Timer X input capture A 16 H'0020 to H'0021
Timer X input capture B
Timer X input capture C
Timer X input capture D
Timer X compare match A
Timer X compare match B
Timer X overflow
Timer V Timer V compare match A 17 H'0022 to H'0023
Timer V compare match B
Timer V overflow
SCI1 SCI1 transfer complete 19 H'0026 to H'0027
SCI3 SCI3 transmit end 21 H'002A to H'002B
SCI3 transmit data empty
SCI3 receive data full
SCI3 overrun error
SCI3 framing error
SCI3 parity error
A/D A/D conversion end 22 H'002C to H'002D
(SLEEP instruction
executed)
Direct transfer 23 H'002E to H'002F Low
Note: Vector addresses H'0002 to H'0007, H'0012 to H'0013, H'0018 to H'001F, H'0024 to
H'0025, H'0028 to H'0029 are reserved and cannot be used.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 63 of 526
REJ09B0326-0600
3.3.2 Interrupt Control Registers
Table 3.3 lists the registers that control interrupts.
Table 3.3 Interrupt Control Registers
Name Abbreviation R/W Initial Value Address
Interrupt edge select register 1 IEGR1 R/W H'70 H'FFF2
Interrupt edge select register 2 IEGR2 R/W H'00 H'FFF3
Interrupt enable register 1 IENR1 R/W H'10 H'FFF4
Interrupt enable register 2 IENR2 R/W H'00 H'FFF5
Interrupt enable register 3 IENR3 R/W H'00 H'FFF6
Interrupt request register 1 IRR1 R/W* H'10 H'FFF7
Interrupt request register 2 IRR2 R/W* H'00 H'FFF8
Interrupt request register 3 IRR3 R/W* H'00 H'FFF9
Note: * Write is enabled only for writing of 0 to clear a flag.
Interrupt Edge Select Register 1 (IEGR1)
Bit 7 6 5 4 3 2 1 0
IEG3 IEG2 IEG1 IEG0
Initial value 0 1 1 1 0 0 0 0
Read/Write R/W R/W R/W R/W
IEGR1 is an 8-bit read/write register used to designate whether pins IRQ3 to IRQ0 are set to rising
edge sensing or falling edge sensing. Upon reset, IEGR1 is initialized to H'70.
Bit 7
Reserved Bit: Bit 7 is reserved: it is always read as 0 and cannot be modified.
Bits 6 to 4
Reserved Bits: Bits 6 to 4 are reserved; they are always read as 1, and cannot be
modified.
Bit 3
IRQ3 Edge Select (IEG3): Bit 3 selects the input sensing of pin IRQ3.
Bit 3: IEG3 Description
0 Falling edge of IRQ3 pin input is detected (initial value)
1 Rising edge of IRQ3 pin input is detected
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 64 of 526
REJ09B0326-0600
Bit 2IRQ2 Edge Select (IEG2): Bit 2 selects the input sensing of pin IRQ2.
Bit 2: IEG2 Description
0 Falling edge of IRQ2 pin input is detected (initial value)
1 Rising edge of IRQ2 pin input is detected
Bit 1
IRQ1 Edge Select (IEG1): Bit 1 selects the input sensing of pin IRQ1.
Bit 1: IEG1 Description
0 Falling edge of IRQ1 pin input is detected (initial value)
1 Rising edge of IRQ1 pin input is detected
Bit 0
IRQ0 Edge Select (IEG0): Bit 0 selects the input sensing of pin IRQ0.
Bit 0: IEG0 Description
0 Falling edge of IRQ0 pin input is detected (initial value)
1 Rising edge of IRQ0 pin input is detected
Interrupt Edge Select Register 2 (IEGR2)
Bit 7 6 5 4 3 2 1 0
INTEG7 INTEG6 INTEG5 INTEG4 INTEG3 INTEG2 INTEG1 INTEG0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
IEGR2 is an 8-bit read/write register, used to designate whether pins INT7 to INT0, and TMIB are
set to rising edge sensing or falling edge sensing. Upon reset, IEGR2 is initialized to H'00.
Bit 7
INT7 Edge Select (INTEG7): Bit 7 selects the input sensing of the INT7 pin.
Bit 7: INTEG7 Description
0 Falling edge of INT7 pin input is detected (initial value)
1 Rising edge of INT7 pin input is detected
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 65 of 526
REJ09B0326-0600
Bit 6
INT6 Edge Select (INTEG6): Bit 6 selects the input sensing of the INT6 pin and TMIB
pin.
Bit 6: INTEG6 Description
0 Falling edge of INT6 and TMIB pin input is detected (initial value)
1 Rising edge of INT6 and TMIB pin input is detected
Bit 5
INT5 Edge Select (INTEG5): Bit 5 selects the input sensing of the INT5 pin and ADTRG
pin.
Bit 5: INTEG5 Description
0 Falling edge of INT5 and ADTRG pin input is detected (initial value)
1 Rising edge of INT5 and ADTRG pin input is detected
Bits 4 to 0
INT4 to INT0 Edge Select (INTEG4 to INTEG0): Bits 4 to 0 select the input
sensing of pins INT4 to INT0.
Bit n: INTEGn Description
0 Falling edge of INTn pin input is detected (initial value)
1 Rising edge of INTn pin input is detected
(n = 4 to 0)
Interrupt Enable Register 1 (IENR1)
Bit 7 6 5 4 3 2 1 0
IENTB1 IENTA IEN3 IEN2 IEN1 IEN0
Initial value 0 0 0 1 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W
IENR1 is an 8-bit read/write register that enables or disables interrupt requests. Upon reset, IENR1
is initialized to H'10.
Bit 7
Timer B1 Interrupt Enable (IENTB1): Bit 7 enables or disables timer B1 overflow
interrupt requests.
Bit 7: IENTB1 Description
0 Disables timer B1 interrupt requests (initial value)
1 Enables timer B1 interrupt requests
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 66 of 526
REJ09B0326-0600
Bit 6
Timer A Interrupt Enable (IENTA): Bit 6 enables or disables timer A overflow interrupt
requests.
Bit 6: IENTA Description
0 Disables timer A interrupt requests (initial value)
1 Enables timer A interrupt requests
Bit 5
Reserved Bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Bits 3 to 0
IRQ3 to IRQ0 Interrupt Enable (IEN3 to IEN0): Bits 3 to 0 enable or disable IRQ3
to IRQ0 interrupt requests.
Bit n: IENn Description
0 Disables interrupt requests from pin IRQn (initial value)
1 Enables interrupt requests from pin IRQn
(n = 3 to 0)
Interrupt Enable Register 2 (IENR2)
Bit 7 6 5 4 3 2 1 0
IENDT IENAD IENS1
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W
IENR2 is an 8-bit read/write register that enables or disables interrupt requests. Upon reset, IENR2
is initialized to H'00.
Bit 7
Direct Transfer Interrupt Enable (IENDT): Bit 7 enables or disables direct transfer
interrupt requests.
Bit 7: IENDT Description
0 Disables direct transfer interrupt requests (initial value)
1 Enables direct transfer interrupt requests
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 67 of 526
REJ09B0326-0600
Bit 6
A/D Converter Interrupt Enable (IENAD): Bit 6 enables or disables A/D converter
interrupt requests.
Bit 6: IENAD Description
0 Disables A/D converter interrupt requests (initial value)
1 Enables A/D converter interrupt requests
Bit 5
Reserved Bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4
SCI1 Interrupt Enable (IENS1): Bit 4 enables or disables SCI1 transfer complete
interrupt requests.
Bit 4: IENS1 Description
0 Disables SCI1 interrupt requests (initial value)
1 Enables SCI1 interrupt requests
Bits 3 to 0
Reserved Bits: Bits 3 to 0 are reserved: they are always read as 0 and cannot be
modified.
Interrupt Enable Register 3 (IENR3)
Bit 7 6 5 4 3 2 1 0
INTEN7 INTEN6 INTEN5 INTEN4 INTEN3 INTEN2 INTEN1 INTEN0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
IENR3 is an 8-bit read/write register that enables or disables INT7 to INT0 interrupt requests.
Upon reset, IENR3 is initialized to H'00.
Bits 7 to 0
INT7 to INT0 Interrupt Enable (INTEN7 to INTEN0): Bits 7 to 0 enable or
disable INT7 to INT0 interrupt requests.
Bit n: INTENn Description
0 Disables interrupt requests from pin INTn (initial value)
1 Enables interrupt requests from pin INTn
(n = 7 to 0)
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 68 of 526
REJ09B0326-0600
Interrupt Request Register 1 (IRR1)
Bit 7 6 5 4 3 2 1 0
IRRTB1 IRRTA IRRI3 IRRI2 IRRI1 IRRI0
Initial value 0 0 0 1 0 0 0 0
Read/Write R/W* R/W* R/W* R/W* R/W* R/W*
Note: * Only a write of 0 for flag clearing is possible.
IRR1 is an 8-bit read/write register, in which a corresponding flag is set to 1 when a timer B1,
timer A, or IRQ3 to IRQ0 interrupt is requested. The flags are not cleared automatically when an
interrupt is accepted. It is necessary to write 0 to clear each flag. Upon reset, IRR1 is initialized to
H'10.
Bit 7
Timer B1 Interrupt Request Flag (IRRTB1)
Bit 7: IRRTB1 Description
0 Clearing condition: (initial value)
When IRRTB1 = 1, it is cleared by writing 0
1 Setting condition:
When the timer B1 counter value overflows from H'FF to H'00
Bit 6
Timer A Interrupt Request Flag (IRRTA)
Bit 6: IRRTA Description
0 Clearing condition: (initial value)
When IRRTA = 1, it is cleared by writing 0
1 Setting condition:
When the timer A counter value overflows from H'FF to H'00
Bit 5
Reserved Bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 69 of 526
REJ09B0326-0600
Bits 3 to 0
IRQ3 to IRQ0 Interrupt Request Flags (IRRI3 to IRRI0)
Bit n: IRRIn Description
0 Clearing condition: (initial value)
When IRRIn = 1, it is cleared by writing 0
1 Setting condition:
When pin IRQnis designated for interrupt input and the designated signal edge
is input
(n = 3 to 0)
Interrupt Request Register 2 (IRR2)
Bit 7 6 5 4 3 2 1 0
IRRDT IRRAD IRRS1
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W* R/W* R/W*
Note: * Only a write of 0 for flag clearing is possible.
IRR2 is an 8-bit read/write register, in which a corresponding flag is set to 1 when a direct
transfer, A/D converter, or SCI1 interrupt is requested. The flags are not cleared automatically
when an interrupt is accepted. It is necessary to write 0 to clear each flag. Upon reset, IRR2 is
initialized to H'00.
Bit 7Direct Transfer Interrupt Request Flag (IRRDT)
Bit 7: IRRDT Description
0 Clearing condition: (initial value)
When IRRDT = 1, it is cleared by writing 0
1 Setting condition:
When a direct transfer is made by executing a SLEEP instruction while DTON
= 1 in SYSCR2
Bit 6A/D Converter Interrupt Request Flag (IRRAD)
Bit 6: IRRAD Description
0 Clearing condition: (initial value)
When IRRAD = 1, it is cleared by writing 0
1 Setting condition:
When A/D conversion is completed and ADSF is cleared to 0 in ADSR
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 70 of 526
REJ09B0326-0600
Bit 5Reserved bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4SCI1 Interrupt Request Flag (IRRS1)
Bit 4: IRRS1 Description
0 Clearing condition: (initial value)
When IRRS1 = 1, it is cleared by writing 0
1 Setting condition:
When an SCI1 transfer is completed
Bits 3 to 0Reserved Bits: Bits 3 to 0 are reserved: they are always read as 0 and cannot be
modified.
Interrupt Request Register 3 (IRR3)
Bit 7 6 5 4 3 2 1 0
INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 INTF0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W* R/W* R/W* R/W* R/W* R/W* R/W* R/W*
Note: * Only a write of 0 for flag clearing is possible.
IRR3 is an 8-bit read/write register, in which a corresponding flag is set to 1 by a transition at pin
INT7 to INT0. The flags are not cleared automatically when an interrupt is accepted. It is necessary
to write 0 to clear each flag. Upon reset, IRR3 is initialized to H'00.
Bits 7 to 0INT7 to INT0 Interrupt Request Flags (INTF7 to INTF0)
Bit n: INTFn Description
0 Clearing condition: (initial value)
When INTFn = 1, it is cleared by writing 0
1 Setting condition:
When the designated signal edge is input at pin INTn
(n = 7 to 0)
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 71 of 526
REJ09B0326-0600
3.3.3 External Interrupts
There are 12 external interrupts: IRQ3 to IRQ0 and INT7 to INT0.
Interrupts IRQ3 to IRQ0: Interrupts IRQ3 to IRQ0 are requested by input signals to pins IRQ3 to
IRQ0. These interrupts are detected by either rising edge sensing or falling edge sensing,
depending on the settings of bits IEG3 to IEG0 in IEGR1.
When these pins are designated as pins IRQ3 to IRQ0 in port mode register 1 and the designated
edge is input, the corresponding bit in IRR1 is set to 1, requesting an interrupt. Recognition of
these interrupt requests can be disabled individually by clearing bits IEN3 to IEN0 to 0 in IENR1.
These interrupts can all be masked by setting the I bit to 1 in CCR.
When IRQ3 to IRQ0 interrupt exception handling is initiated, the I bit is set to 1 in CCR. Vector
numbers 7 to 4 are assigned to interrupts IRQ3 to IRQ0. The order of priority is from IRQ0 (high)
to IRQ3 (low). Table 3.2 gives details.
INT Interrupts: INT interrupts are requested by input signals to pins INT7 to INT0. These
interrupts are detected by either rising edge sensing or falling edge sensing, depending on the
settings of bits INTEG7 to INTEG0 in IEGR2.
When the designated edge is input at pins INT7 to INT0, the corresponding bit in IRR3 is set to 1,
requesting an interrupt. Recognition of these interrupt requests can be disabled individually by
clearing bits INTEN7 to INTEN0 to 0 in IENR3. These interrupts can all be masked by setting the
I bit to 1 in CCR.
When INT interrupt exception handling is initiated, the I bit is set to 1 in CCR. Vector number 8 is
assigned to the INT interrupts. All eight interrupts have the same vector number, so the interrupt-
handling routine must discriminate the interrupt source.
Note: Pins INT7 to INT0 are multiplexed with port 5. Even in port usage of these pins, whenever
the designated edge is input or output, the corresponding bit INTFn is set to 1.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 72 of 526
REJ09B0326-0600
3.3.4 Internal Interrupts
There are 21 internal interrupts that can be requested by the on-chip peripheral modules. When a
peripheral module requests an interrupt, the corresponding bit in IRR1 or IRR2 is set to 1.
Recognition of individual interrupt requests can be disabled by clearing the corresponding bit in
IENR1 or IENR2 to 0. All these interrupts can be masked by setting the I bit to 1 in CCR. When
internal interrupt handling is initiated, the I bit is set to 1 in CCR. Vector numbers from 23 to 9 are
assigned to these interrupts. Table 3.2 shows the order of priority of interrupts from on-chip
peripheral modules.
3.3.5 Interrupt Operations
Interrupts are controlled by an interrupt controller. Figure 3.2 shows a block diagram of the
interrupt controller. Figure 3.3 shows the flow up to interrupt acceptance.
Interrupt controller
Priority decision logic
Interrupt
request
CCR (CPU)I
External or
internal
interrupts
External
interrupts or
internal
interrupt
enable
signals
Figure 3.2 Block Diagram of Interrupt Controller
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 73 of 526
REJ09B0326-0600
Interrupt operation is described as follows.
• If an interrupt occurs while the interrupt enable register bit is set to 1, an interrupt request
signal is sent to the interrupt controller.
• When the interrupt controller receives an interrupt request, it sets the interrupt request flag.
• From among the interrupts with interrupt request flags set to 1, the interrupt controller selects
the interrupt request with the highest priority and holds the others pending. (Refer to
table 3.2 for a list of interrupt priorities.)
• The interrupt controller checks the I bit of CCR. If the I bit is 0, the selected interrupt request
is accepted; if the I bit is 1, the interrupt request is held pending.
• If the interrupt is accepted, after processing of the current instruction is completed, both PC
and CCR are pushed onto the stack. The state of the stack at this time is shown in figure 3.4.
The PC value pushed onto the stack is the address of the first instruction to be executed upon
return from interrupt handling.
• The I bit of CCR is set to 1, masking further interrupts.
• The vector address corresponding to the accepted interrupt is generated, and the interrupt
handling routine located at the address indicated by the contents of the vector address is
executed.
Notes: 1. When disabling interrupts by clearing bits in an interrupt enable register, or when
clearing bits in an interrupt request register, always do so while interrupts are masked
(I = 1).
2. If the above clear operations are performed while I = 0, and as a result a conflict arises
between the clear instruction and an interrupt request, exception processing for the
interrupt will be executed after the clear instruction has been executed.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 74 of 526
REJ09B0326-0600
PC contents saved
CCR contents saved
I← 1
I = 0
Program execution state
No
Yes
Yes
No
Legend:
PC:
CCR:
I:
Program counter
Condition code register
I bit of CCR
IEN0 = 1 No
Yes
IENDT = 1 No
Yes
IRRDT = 1 No
Yes
Branch to interrupt
handling routine
IRRI0 = 1
No
Yes
IEN1 = 1 No
Yes
IRRI1 = 1
No
Yes
IEN2 = 1 No
Yes
IRRI2 = 1
Figure 3.3 Flow up to Interrupt Acceptance
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 75 of 526
REJ09B0326-0600
PC and CCR
saved to stack
SP (R7)
SP – 1
SP – 2
SP – 3
SP – 4
Stack area SP + 4
SP + 3
SP + 2
SP + 1
SP (R7)
Even address
Prior to start of interrupt
exception handling After completion of interrupt
exception handling
Legend:
PCH:
PCL:
CCR:
SP:
Upper 8 bits of program counter (PC)
Lower 8 bits of program counter (PC)
Condition code register
Stack pointer
Notes:
CCR
CCR
PCH
PCL
1.
2.
PC shows the address of the first instruction to be executed upon return from the interrupt
handling routine.
Register contents must always be saved and restored by word access, starting from
an even-numbered address.
Figure 3.4 Stack State after Completion of Interrupt Exception Handling
Figure 3.5 shows a typical interrupt sequence where the program area is in the on-chip ROM and
the stack area is in the on-chip RAM.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 76 of 526
REJ09B0326-0600
Vector fetch
φ
Internal
address bus
Internal read
signal
Internal write
signal
(2)
Internal data bus
(16 bits)
Interrupt
request signal
(9)
(1)
Internal
processing
Prefetch instruction of
interrupt-handling routine
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(10) First instruction of interrupt-handling routine
(3) (9)(8)(6)(5)
(4) (1) (7) (10)
Stack access
Internal
processing
Instruction
prefetch
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
Figure 3.5 Interrupt Sequence
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 77 of 526
REJ09B0326-0600
3.3.6 Interrupt Response Time
Table 3.4 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handler is executed.
Table 3.4 Interrupt Wait States
Item States
Waiting time for completion of executing instruction* 1 to 13
Saving of PC and CCR to stack 4
Vector fetch 2
Instruction fetch 4
Internal processing 4
Total 15 to 27
Note: * Not including EEPMOV instruction.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 78 of 526
REJ09B0326-0600
3.4 Application Notes
3.4.1 Notes on Stack Area Use
When word data is accessed in the H8/3644 Group, the least significant bit of the address is
regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7)
should never indicate an odd address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W
@SP+, Rn) to save or restore register values.
Setting an odd address in SP may cause a program to crash. An example is shown in figure 3.6.
PC
PC R1L
PC
SP
SP
SP
H'FEFC
H'FEFD
H'FEFF
→
→
→
H
LL
MOV. B R1L, @–R7
SP set to H'FEFF Stack accessed beyond SP
BSR instruction
Contents of PC are lost
H
Legend:
PC
H
:
PC
L
:
R1L:
SP:
Upper byte of program counter
Lower byte of program counter
General register R1L
Stack pointer
Figure 3.6 Operation when Odd Address Is Set in SP
When CCR contents are saved to the stack during interrupt exception handling or restored when
RTE is executed, this also takes place in word size. Both the upper and lower bytes of word data
are saved to the stack; on return, the even address contents are restored to CCR while the odd
address contents are ignored.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 79 of 526
REJ09B0326-0600
3.4.2 Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, the
following points should be observed.
When an external interrupt pin function is switched by rewriting the port mode register that
controls pins IRQ3 to IRQ1, the interrupt request flag may be set to 1 at the time the pin function is
switched, even if no valid interrupt is input at the pin. Table 3.5 shows the conditions under which
interrupt request flags are set to 1 in this way.
Table 3.5 Conditions under which Interrupt Request Flag Is Set to 1
Interrupt Request
Flags Set to 1
Conditions
IRR1 IRRI3 When PMR1 bit IRQ3 is changed from 0 to 1 while pin IRQ3 is low and
IEGR bit IEG3 = 0.
When PMR1 bit IRQ3 is changed from 1 to 0 while pin IRQ3 is low and
IEGR bit IEG3 = 1.
IRRI2 When PMR1 bit IRQ2 is changed from 0 to 1 while pin IRQ2 is low and
IEGR bit IEG2 = 0.
When PMR1 bit IRQ2 is changed from 1 to 0 while pin IRQ2 is low and
IEGR bit IEG2 = 1.
IRRI1 When PMR1 bit IRQ1 is changed from 0 to 1 while pin IRQ1 is low and
IEGR bit IEG1 = 0.
When PMR1 bit IRQ1 is changed from 1 to 0 while pin IRQ1 is low and
IEGR bit IEG1 = 1.
Figure 3.7 shows the procedure for setting a bit in a port mode register and clearing the interrupt
request flag.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0. If the instruction to clear the flag is executed immediately after
the port mode register access without executing an intervening instruction, the flag will not be
cleared.
An alternative method is to avoid the setting of interrupt request flags when pin functions are
switched by keeping the pins at the high level so that the conditions in table 3.5 do not occur.
Section 3 Exception Handling
Rev. 6.00 Sep 12, 2006 page 80 of 526
REJ09B0326-0600
CCR I bit 1
Set port mode register bit
Execute NOP instruction
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0
Interrupt mask cleared
Clear interrupt request flag to 0
←
CCR I bit 0
←
Figure 3.7 Port Mode Register Setting and Interrupt Request Flag
Clearing Procedure
Section 4 Clock Pulse Generators
Rev. 6.00 Sep 12, 2006 page 81 of 526
REJ09B0326-0600
Section 4 Clock Pulse Generators
4.1 Overview
Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a
system clock pulse generator and a subclock pulse generator. The system clock pulse generator
consists of a system clock oscillator and system clock dividers. The subclock pulse generator
consists of a subclock oscillator circuit and a subclock divider.
4.1.1 Block Diagram
Figure 4.1 shows a block diagram of the clock pulse generators.
System clock
oscillator System clock
divider (1/2)
Subclock
oscillator
Subclock
divider
(1/2, 1/4, 1/8)
System clock
divider
(1/64, 1/32,
1/16, 1/8)
System clock pulse generator
Subclock pulse generator
Prescaler S
(13 bits)
Prescaler W
(5 bits)
OSC
OSC1
2
X
X1
2
φ
OSC
(f )
OSC
φ
W
(f )
W
φ /2
OSC
φ /2
W
φ /8
WφSUB
φ/2
to
φ/8192
φ /2
W
φ /4
W
φ /8
to
φ /128
W
W
φ
φ
OSC
/128
φ
OSC
/64
φ
OSC
/32
φ
OSC
/16
φ /4
W
Figure 4.1 Block Diagram of Clock Pulse Generators
4.1.2 System Clock and Subclock
The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φSUB. Four of
the clock signals have names: φ is the system clock, φSUB is the subclock, φOSC is the oscillator
clock, and φW is the watch clock.
The clock signals available for use by peripheral modules are φ/2, φ/4, φ/8, φ/16, φ/32, φ/64,
φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, φ/8192, φW/2, φW/4, φW/8, φW/16, φW/32, φW/64, and
φW/128. The clock requirements differ from one module to another.
Section 4 Clock Pulse Generators
Rev. 6.00 Sep 12, 2006 page 82 of 526
REJ09B0326-0600
4.2 System Clock Generator
Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic
resonator, or by providing external clock input.
Connecting a Crystal Resonator: Figure 4.2 shows a typical method of connecting a crystal
resonator.
1
2
C
1
C
2
OSC
OSC R = 1 M ±20%
C = C = 12 pF ±20%
f
12
Ω
R
f
Figure 4.2 Typical Connection to Crystal Resonator
Figure 4.3 shows the equivalent circuit of a crystal resonator. An oscillator having the
characteristics given in table 4.1 should be used.
CS
C0
RS
OSC1OSC2
LS
Figure 4.3 Equivalent Circuit of Crystal Resonator
Table 4.1 Crystal Resonator Parameters
Frequency 2 MHz 4 MHz 8 MHz 10 MHz
RS (max) 500 Ω 100 Ω 50 Ω 30 Ω
C0 (max) 7 pF 7 pF 7 pF 7 pF
Section 4 Clock Pulse Generators
Rev. 6.00 Sep 12, 2006 page 83 of 526
REJ09B0326-0600
Connecting a Ceramic Resonator: Figure 4.4 shows a typical method of connecting a ceramic
resonator.
1
2
C
1
C
2
OSC
OSC R = 1 M ±20%
C = 30 pF ±10%
C = 30 pF ±10%
Ceramic resonator: Murata
f
1
2
Ω
R
f
Figure 4.4 Typical Connection to Ceramic Resonator
Notes on Board Design: When generating clock pulses by connecting a crystal or ceramic
resonator, pay careful attention to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4.5.)
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC1 and OSC2.
OSC
OSC
C
2
C
1
Signal A Signal B
2
1
To be avoided
Figure 4.5 Board Design of Oscillator Circuit
Section 4 Clock Pulse Generators
Rev. 6.00 Sep 12, 2006 page 84 of 526
REJ09B0326-0600
External Clock Input Method: Connect an external clock signal to pin OSC1, and leave pin
OSC2 open. Figure 4.6 shows a typical connection.
1
2
OSC
OSC
External clock input
Open
Figure 4.6 External Clock Input (Example)
Frequency Oscillator Clock (φ
φφ
φOSC)
Duty cycle 45% to 55%
4.3 Subclock Generator
Connecting a 32.768-kHz Crystal Resonator: Clock pulses can be supplied to the subclock
divider by connecting a 32.768-kHz crystal resonator, as shown in figure 4.7. Follow the same
precautions as noted under section 4.2, Notes on Board Design.
X
X
C
1
C
2
1
2
C = C = 15 pF (typ.)
12
Figure 4.7 Typical Connection to 32.768-kHz Crystal Resonator
Section 4 Clock Pulse Generators
Rev. 6.00 Sep 12, 2006 page 85 of 526
REJ09B0326-0600
Figure 4.8 shows the equivalent circuit of the 32.768-kHz crystal resonator.
C
S
C
0
LR
S
X
1
X
2
C = 1.5 pF (typ.)
R = 14 k (typ.)
f = 32.768 kHz
Crystal resonator:
0
S
W
Ω
S
MX38T
(Nihon Denpa Kogyo)
Figure 4.8 Equivalent Circuit of 32.768-kHz Crystal Resonator
Pin Connection when Not Using Subclock: When the subclock is not used, connect pin X1 to
VCC and leave pin X2 open, as shown in figure 4.9.
X
X
1
2
VCC
Open
Figure 4.9 Pin Connection when not Using Subclock
4.4 Prescalers
The H8/3644 Group is equipped with two on-chip prescalers having different input clocks
(prescaler S and prescaler W). Prescaler S is a 13-bit counter using the system clock (φ) as its
input clock. Its prescaled outputs provide internal clock signals for on-chip peripheral modules.
Prescaler W is a 5-bit counter using a 32.768-kHz signal divided by 4 (φW/4) as its input clock. Its
prescaled outputs are used by timer A as a time base for timekeeping.
Prescaler S (PSS): Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. It
is incremented once per clock period.
Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from the reset state.
Section 4 Clock Pulse Generators
Rev. 6.00 Sep 12, 2006 page 86 of 526
REJ09B0326-0600
In standby mode, watch mode, subactive mode, and subsleep mode, the system clock pulse
generator stops. Prescaler S also stops and is initialized to H'0000.
The CPU cannot read or write prescaler S.
The output from prescaler S is shared by the on-chip peripheral modules. The divider ratio can be
set separately for each on-chip peripheral function.
In active (medium-speed) mode the clock input to prescaler S is determined by the division factor
designated by MA1 and MA0 in SYSCR1.
Prescaler W (PSW): Prescaler W is a 5-bit counter using a 32.768 kHz signal divided by 4 (φW/4)
as its input clock.
Prescaler W is initialized to H'00 by a reset, and starts counting on exit from the reset state.
Even in standby mode, watch mode, subactive mode, or subsleep mode, prescaler W continues
functioning so long as clock signals are supplied to pins X1 and X2.
Prescaler W can be reset by setting 1s in bits TMA3 and TMA2 of timer mode register A (TMA).
Output from prescaler W can be used to drive timer A, in which case timer A functions as a time
base for timekeeping.
4.5 Note on Oscillators
Oscillator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Oscillator circuit constants will differ
depending on the oscillator element, stray capacitance in its interconnecting circuit, and other
factors. Suitable constants should be determined in consultation with the oscillator element
manufacturer. Design the circuit so that the oscillator element never receives voltages exceeding
its maximum rating.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 87 of 526
REJ09B0326-0600
Section 5 Power-Down Modes
5.1 Overview
The H8/3644 Group has eight modes of operation after a reset. These include seven power-down
modes, in which power dissipation is significantly reduced. Table 5.1 gives a summary of the eight
operating modes.
Table 5.1 Operating Modes
Operating Mode Description
Active (high-speed) mode The CPU and all on-chip peripheral functions are operable on
the system clock
Active (medium-speed) mode The CPU and all on-chip peripheral functions are operable on
the system clock, but at 1/64, 1/32, 1/6, or 1/8* the speed in
active (high-speed) mode
Subactive mode The CPU, and the time-base function of timer A are operable
on the subclock
Sleep (high-speed) mode The CPU halts. On-chip peripheral functions except PWM are
operable on the system clock
Sleep (medium-speed) mode The CPU halts. On-chip peripheral functions except PWM are
operable on the system clock, but at 1/64, 1/32, 1/6, or 1/8* the
speed in active (high-speed) mode
Subsleep mode The CPU halts. The time-base function of timer A are operable
on the subclock
Watch mode The CPU halts. The time-base function of timer A is operable
on the subclock
Standby mode The CPU and all on-chip peripheral functions halt
Note: * Determined by the value set in bits MA1 and MA0 of system control register 1
(SYSCR1).
Of these eight operating modes, all but the active (high-speed) mode are power-down modes. In
this section the two active modes (high-speed and medium speed) will be referred to collectively
as active mode, and the two sleep modes (high-speed and medium speed) will be referred to
collectively as sleep mode.
Figure 5.1 shows the transitions among these operation modes. Table 5.2 indicates the internal
states in each mode.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 88 of 526
REJ09B0326-0600
Reset state
Program
halt state
SLEEP
instruction
*d
SLEEP
instruction
*e
SLEEP
instruction
*c
SLEEP
instruction
*h
SLEEP
instruction
*i
SLEEP
instruction
*g
SLEEP
instruction
*f
Program
execution state
SLEEP
instruction
*a
Program
halt state
SLEEP
instruction
*i
Power-down modes
A transition between different modes cannot be made to occur simply because an interrupt
request is generated. Make sure that interrupt handling is performed after the interrupt is
accepted.
Details on the mode transition conditions are given in the explanations of each mode,
in sections 5.2 through 5.8.
Notes: 1.
2.
Mode Transition Conditions (1)
a
b
c
d
e
f
g
h
i
J
LSON MSON SSBY DTON
0
0
1
0
*
0
0
0
1
0
0
1
*
*
*
0
1
1
*
0
0
0
0
1
1
0
0
1
1
1
0
0
0
0
0
1
1
1
1
1
*
Don’t care
Mode Transition Conditions (2)
1
Interrupt Sources
Timer A interrupt, IRQ
0
interrupt
Timer a interrupt, IRQ
3
to IRQ
0
interrupts,
INT interrupt
All interrupts
IRQ
1
or IRQ
0
interrupt
2
3
4
*3
*3
*2*1
*4
*4
*1
Standby
mode
Watch
mode Subactive
mode
Active
(medium-speed)
mode
Active
(high-speed)
mode
Sleep
(high-speed)
mode
Sleep
(medium-speed)
mode
Subsleep
mode
SLEEP
instruction*a
SLEEP
instruction
*e
SLEEP
instruction
*d
SLEEP
instruction
*b
SLEEP
instruction
*j
*1
SLEEP
instruction
*e
SLEEP
instruction
*b
TMA3
*
*
1
0
1
*
*
1
1
1
Figure 5.1 Mode Transition Diagram
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 89 of 526
REJ09B0326-0600
Table 5.2 Internal State in Each Operating Mode
Active Mode Sleep Mode
Function
High-
Speed
Medium-
Speed
High-
Speed
Medium-
Speed
Watch
Mode
Subactive
Mode
Subsleep
Mode
Standby
Mode
System clock oscillator Functions Functions Functions Functions Halted Halted Halted Halted
Subclock oscillator Functions Functions Functions Functions Functions Functions Functions Functions
CPU Instructions Functions Functions Halted Halted Halted Functions Halted Halted
operations Registers Retained Retained Retained Retained Retained
RAM
I/O ports Retained
*1
External IRQ0 Functions Functions Functions Functions Functions Functions Functions Functions
interrupts IRQ1 Retained
*2
IRQ2 Retained
*2
IRQ3
INT0 Functions Functions Functions Functions Retained*2 Functions Functions Retained*2
INT1
INT2
INT3
INT4
INT5
INT6
INT7
Peripheral Timer A Functions Functions Functions Functions Functions*3Functions*3 Functions*3 Retained
functions Timer B1 Retained Retained Retained
Timer V Reset Reset Reset Reset
Timer X
Watchdog
timer
Retained Retained Retained Retained
SCI1
SCI3 Reset Reset Reset Reset
PWM Retained Retained Retained Retained Retained Retained
A/D
converter
Functions Functions
Notes: 1. Register contents are retained, but output is high-impedance state.
2. External interrupt requests are ignored. Interrupt request register contents are not
altered.
3. Functions if timekeeping time-base function is selected.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 90 of 526
REJ09B0326-0600
5.1.1 System Control Registers
The operation mode is selected using the system control registers described in table 5.3.
Table 5.3 System Control Registers
Name Abbreviation R/W Initial Value Address
System control register 1 SYSCR1 R/W H'07 H'FFF0
System control register 2 SYSCR2 R/W H'E0 H'FFF1
System Control Register 1 (SYSCR1)
Bit 7 6 5 4 3 2 1 0
SSBY STS2 STS1 STS0 LSON MA1 MA0
Initial value 0 0 0 0 0 1 1 1
Read/Write R/W R/W R/W R/W R/W R/W R/W
SYSCR1 is an 8-bit read/write register for control of the power-down modes.
Upon reset, SYSCR1 is initialized to H'07.
Bit 7
Software Standby (SSBY): This bit designates transition to standby mode or watch mode.
Bit 7: SSBY Description
0 • When a SLEEP instruction is executed in active mode, a transition is made
to sleep mode
• When a SLEEP instruction is executed in subactive mode, a transition is
made to subsleep mode (initial value)
1 • When a SLEEP instruction is executed in active mode, a transition is made
to standby mode or watch mode
• When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 91 of 526
REJ09B0326-0600
Bits 6 to 4
Standby Timer Select 2 to 0 (STS2 to STS0): These bits designate the time the
CPU and peripheral modules wait for stable clock operation after exiting from standby mode or
watch mode to active mode due to an interrupt. The designation should be made according to the
clock frequency so that the waiting time is at least 10 ms.
Bit 6: STS2 Bit 5: STS1 Bit 4: STS0 Description
0 0 0 Wait time = 8,192 states (initial value)
1 Wait time = 16,384 states
1 0 Wait time = 32,768 states
1 Wait time = 65,536 states
1 * * Wait time = 131,072 states
Legend: * Don’t care
Bit 3
Low Speed on Flag (LSON): This bit chooses the system clock (φ) or subclock (φSUB) as
the CPU operating clock when watch mode is cleared. The resulting operation mode depends on
the combination of other control bits and interrupt input.
Bit 3: LSON Description
0 The CPU operates on the system clock (φ) (initial value)
1 The CPU operates on the subclock (φSUB)
Bits 2
Reserved Bits: Bit 2 is reserved: it is always read as 1 and cannot be modified.
Bits 1 and 0
Active (Medium-Speed) Mode Clock Select (MA1, MA0): Bits 1 and 0 choose
φosc/128, φosc/64, φosc/32, or φosc/16 as the operating clock in active (medium-speed) mode and
sleep (medium-speed) mode. MA1 and MA0 should be written in active (high-speed) mode or
subactive mode.
Bit 1: MA1 Bit 0: MA0 Description
0 0 φosc/16
1 φosc/32
1 0 φosc/64
1 φosc/128 (initial value)
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 92 of 526
REJ09B0326-0600
System Control Register 2 (SYSCR2)
Bit 7 6 5 4 3 2 1 0
NESEL DTON MSON SA1 SA0
Initial value 1 1 1 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W
SYSCR2 is an 8-bit read/write register for power-down mode control.
Upon reset, SYSCR2 is initialized to H'E0.
Bits 7 to 5
Reserved Bits: These bits are reserved; they are always read as 1, and cannot be
modified.
Bit 4
Noise Elimination Sampling Frequency Select (NESEL): This bit selects the frequency
at which the watch clock signal (φW) generated by the subclock pulse generator is sampled, in
relation to the oscillator clock (φOSC) generated by the system clock pulse generator. When φOSC =
2 to 10 MHz, clear NESEL to 0.
Bit 4: NESEL Description
0 Sampling rate is φOSC/16 (initial value)
1 Sampling rate is φOSC/4
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 93 of 526
REJ09B0326-0600
Bit 3
Direct Transfer on Flag (DTON): This bit designates whether or not to make direct
transitions among active (high-speed), active (medium-speed) and subactive mode when a SLEEP
instruction is executed. The mode to which the transition is made after the SLEEP instruction is
executed depends on a combination of this and other control bits.
Bit 3: DTON Description
0 • When a SLEEP instruction is executed in active mode, a transition is made
to standby mode, watch mode, or sleep mode
• When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode or subsleep mode (initial value)
1 • When a SLEEP instruction is executed in active (high-speed) mode, a
direct transition is made to active (medium-speed) mode if SSBY = 0,
MSON = 1, and LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1,
and LSON = 1
• When a SLEEP instruction is executed in active (medium-speed) mode, a
direct transition is made to active (high-speed) mode if SSBY = 0, MSON =
0, and LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON
= 1
• When a SLEEP instruction is executed in subactive mode, a direct
transition is made to active (high-speed) mode if SSBY = 1, TMA3 = 1,
LSON = 0, and MSON = 0, or to active (medium-speed) mode if SSBY = 1,
TMA3 = 1, LSON = 0, and MSON = 1
Bit 2
Medium Speed on Flag (MSON): After standby, watch, or sleep mode is cleared, this bit
selects active (high-speed), active (medium-speed), or sleep (medium-speed) mode.
Bit 2: MSON Description
0 • After standby, watch, or sleep mode is cleared, operation is in active (high-
speed) mode
• When a SLEEP instruction is executed in active mode, a transition is made
to sleep (high-speed) mode (initial value)
1 • After standby, watch, or sleep mode is cleared, operation is in active
(medium-speed) mode
• When a SLEEP instruction is executed in active mode, a transition is made
to sleep (medium-speed) mode
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 94 of 526
REJ09B0326-0600
Bits 1 and 0
Subactive Mode Clock Select (SA1 and SA0): These bits select the CPU clock
rate (φW/2, φW/4, or φW/8) in subactive mode. SA1 and SA0 cannot be modified in subactive mode.
Bit 1: SA1 Bit 0: SA0 Description
0 0 φW/8 (initial value)
1 φW/4
1 * φW/2
Legend: * Don’t care
5.2 Sleep Mode
5.2.1 Transition to Sleep Mode
Transition to Sleep (High-Speed) Mode: The system goes from active mode to sleep (high-
speed) mode when a SLEEP instruction is executed while the SSBY and LSON bits in SYSCR1
and the MSON and DTON bits in SYSCR2 are all cleared to 0. In sleep (high-speed) mode CPU
operation is halted but the on-chip peripheral functions other than PWM are operational. CPU
register contents are retained.
Transition to Sleep (Medium-Speed) Mode: The system goes from active mode to sleep
(medium-speed) mode when a SLEEP instruction is executed while the SSBY and LSON bits in
SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON bit in SYSCR2 is
cleared to 0. In sleep (medium-speed) mode, as in sleep (high-speed) mode, CPU operation is
halted but the on-chip peripheral functions other than PWM are operational. The clock frequency
in sleep (medium-speed) mode is determined by the MA1 and MA0 bits in SYSCR1. CPU register
contents are retained.
5.2.2 Clearing Sleep Mode
Sleep mode is cleared by any interrupt (timer A, timer B1, timer X, timer V, IRQ3 to IRQ0, INT7
to INT0, SCI3, SCI1, or A/D converter), or by input at the RES pin.
• Clearing by interrupt
When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts.
A transition is made from sleep (high-speed) mode to active (high-speed) mode, or from sleep
(medium-speed) mode to active (medium-speed) mode. Sleep mode is not cleared if the I bit of
the condition code register (CCR) is set to 1 or the particular interrupt is disabled in the
interrupt enable register.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 95 of 526
REJ09B0326-0600
• Clearing by RES input
When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared.
5.2.3 Clock Frequency in Sleep (Medium-Speed) Mode
Operation in sleep (medium-speed) mode is clocked at the frequency designated by the MA1 and
MA0 bits in SYSCR1.
5.3 Standby Mode
5.3.1 Transition to Standby Mode
The system goes from active mode to standby mode when a SLEEP instruction is executed while
the SSBY bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is cleared to 0, and bit TMA3 in
TMA is cleared to 0. In standby mode the clock pulse generator stops, so the CPU and on-chip
peripheral modules stop functioning, but as long as the rated voltage is supplied, the contents of
CPU registers, on-chip RAM, and some on-chip peripheral module registers are retained. On-chip
RAM contents will be further retained down to a minimum RAM data retention voltage. The I/O
ports go to the high-impedance state.
5.3.2 Clearing Standby Mode
Standby mode is cleared by an interrupt (IRQ1 or IRQ0) or by input at the RES pin.
• Clearing by interrupt
When an interrupt is requested, the system clock pulse generator starts. After the time set in
bits STS2–STS0 in SYSCR1 has elapsed, a stable system clock signal is supplied to the entire
chip, standby mode is cleared, and interrupt exception handling starts. Operation resumes in
active (high-speed) mode if MSON = 0 in SYSCR2, or active (medium-speed) mode if MSON
= 1. Standby mode is not cleared if the I bit of CCR is set to 1 or the particular interrupt is
disabled in the interrupt enable register.
• Clearing by RES input
When the RES pin goes low, the system clock pulse generator starts. After the pulse generator
output has stabilized, if the RES pin is driven high, the CPU starts reset exception handling.
Since system clock signals are supplied to the entire chip as soon as the system clock pulse
generator starts functioning, the RES pin should be kept at the low level until the pulse
generator output stabilizes.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 96 of 526
REJ09B0326-0600
5.3.3 Oscillator Settling Time after Standby Mode Is Cleared
Bits STS2 to STS0 in SYSCR1 should be set as follows.
• When a crystal oscillator is used
The table 5.4 gives settings for various operating frequencies. Set bits STS2 to STS0 for a
waiting time of at least 10 ms.
Table 5.4 Clock Frequency and Settling Time (times are in ms)
STS2 STS1 STS0 Waiting Time 5 MHz 4 MHz 2 MHz 1 MHz 0.5 MHz
0 0 0 8,192 states 1.6 2.0 4.1 8.2 16.4
0 0 1 16,384 states 3.2 4.1 8.2 16.4 32.8
0 1 0 32,768 states 6.6 8.2 16.4 32.8 65.5
0 1 1 65,536 states 13.1 16.4 32.8 65.5 131.1
1 * * 131,072 states 26.2 32.8 65.5 131.1 262.1
Legend: * Don’t care
• When an external clock is used
Any values may be set. Normally the minimum time (STS2 = STS1 = STS0 = 0) should be set.
5.4 Watch Mode
5.4.1 Transition to Watch Mode
The system goes from active or subactive mode to watch mode when a SLEEP instruction is
executed while the SSBY bit in SYSCR1 is set to 1 and bit TMA3 in TMA is set to 1.
In watch mode, operation of on-chip peripheral modules other than timer A is halted. As long as a
minimum required voltage is applied, the contents of CPU registers, the on-chip RAM and some
registers of the on-chip peripheral modules, are retained. I/O ports keep the same states as before
the transition.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 97 of 526
REJ09B0326-0600
5.4.2 Clearing Watch Mode
Watch mode is cleared by an interrupt (timer A or IRQ0) or by input at the RES pin.
• Clearing by interrupt
When watch mode is cleared by a timer A interrupt or IRQ0 interrupt, the mode to which a
transition is made depends on the settings of LSON in SYSCR1 and MSON in SYSCR2. If
both LSON and MSON are cleared to 0, transition is to active (high-speed) mode; if LSON = 0
and MSON = 1, transition is to active (medium-speed) mode; if LSON = 1, transition is to
subactive mode. When the transition is to active mode, after the time set in SYSCR1 bits STS2
to STS0 has elapsed, a stable clock signal is supplied to the entire chip, watch mode is cleared,
and interrupt exception handling starts. Watch mode is not cleared if the I bit of CCR is set to 1
or the particular interrupt is disabled in the interrupt enable register.
• Clearing by RES input
Clearing by RES pin is the same as for standby mode; see section 5.3.2, Clearing Standby
Mode.
5.4.3 Oscillator Settling Time after Watch Mode Is Cleared
The waiting time is the same as for standby mode; see section 5.3.3, Oscillator Settling Time after
Standby Mode Is Cleared.
5.5 Subsleep Mode
5.5.1 Transition to Subsleep Mode
The system goes from subactive mode to subsleep mode when a SLEEP instruction is executed
while the SSBY bit in SYSCR1 is cleared to 0, LSON bit in SYSCR1 is set to 1, and TMA3 bit in
TMA is set to 1. In subsleep mode, operation of on-chip peripheral modules other than timer A is
halted. As long as a minimum required voltage is applied, the contents of CPU registers, the on-
chip RAM and some registers of the on-chip peripheral modules are retained. I/O ports keep the
same states as before the transition.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 98 of 526
REJ09B0326-0600
5.5.2 Clearing Subsleep Mode
Subsleep mode is cleared by an interrupt (timer A, IRQ3 to IRQ0, INT7 to INT0) or by input at the
RES pin.
• Clearing by interrupt
When an interrupt is requested, subsleep mode is cleared and interrupt exception handling
starts. Subsleep mode is not cleared if the I bit of CCR is set to 1 or the particular interrupt is
disabled in the interrupt enable register.
• Clearing by RES input
Clearing by RES pin is the same as for standby mode; see section 5.3.2, Clearing Standby
Mode.
5.6 Subactive Mode
5.6.1 Transition to Subactive Mode
Subactive mode is entered from watch mode if a timer A or IRQ0 interrupt is requested while the
LSON bit in SYSCR1 is set to 1. From subsleep mode, subactive mode is entered if a timer A,
IRQ3 to IRQ0, or INT7 to INT0 interrupt is requested. A transition to subactive mode does not take
place if the I bit of CCR is set to 1 or the particular interrupt is disabled in the interrupt enable
register.
5.6.2 Clearing Subactive Mode
Subactive mode is cleared by a SLEEP instruction or by input at the RES pin.
• Clearing by SLEEP instruction
If a SLEEP instruction is executed while the SSBY bit in SYSCR1 is set to 1 and TMA3 bit in
TMA is set to 1, subactive mode is cleared and watch mode is entered. If a SLEEP instruction
is executed while SSBY = 0 and LSON = 1 in SYSCR1 and TMA3 = 1 in TMA, subsleep
mode is entered. Direct transfer to active mode is also possible; see section 5.8, Direct
Transfer, below.
• Clearing by RES pin
Clearing by RES pin is the same as for standby mode; see section 5.3.2, Clearing Standby
Mode.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 99 of 526
REJ09B0326-0600
5.6.3 Operating Frequency in Subactive Mode
The operating frequency in subactive mode is set in bits SA1 and SA0 in SYSCR2. The choices
are φW/2, φW/4, and φW/8.
5.7 Active (Medium-Speed) Mode
5.7.1 Transition to Active (Medium-Speed) Mode
If the MSON bit in SYSCR2 is set to 1 while the LSON bit in SYSCR1 is cleared to 0, a transition
to active (medium-speed) mode results from IRQ0 or IRQ1 interrupts in standby mode, timer A or
IRQ0 interrupts in watch mode, or any interrupt in sleep (medium-speed) mode. A transition to
active (medium-speed) mode does not take place if the I bit of CCR is set to 1 or the particular
interrupt is disabled in the interrupt enable register.
5.7.2 Clearing Active (Medium-Speed) Mode
Active (medium-speed) mode is cleared by a SLEEP instruction or by input at the RES pin.
• Clearing by SLEEP instruction
A transition to standby mode takes place if the SLEEP instruction is executed while the SSBY
bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is cleared to 0, and the TMA3 bit in TMA
is cleared to 0. The system goes to watch mode if the SSBY bit in SYSCR1 is set to 1 and bit
TMA3 in TMA is set to 1 when a SLEEP instruction is executed.
When both SSBY and LSON are cleared to 0 in SYSCR1 and a SLEEP instruction is executed,
sleep (high-speed) mode is entered if MSON is cleared to 0 in SYSCR2, and sleep (medium-
speed) mode is entered if MSON is set to 1. Direct transfer to active (high-speed) mode or to
subactive mode is also possible. See section 5.8, Direct Transfer, below for details.
• Clearing by RES pin
When the RES pin goes low, the CPU enters the reset state and active (medium-speed) mode is
cleared.
5.7.3 Operating Frequency in Active (Medium-Speed) Mode
Operation in active (medium-speed) mode is clocked at the frequency designated by the MA1 and
MA0 bits in SYSCR1.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 100 of 526
REJ09B0326-0600
5.8 Direct Transfer
The CPU can execute programs in three modes: active (high-speed) mode, active (medium-speed)
mode, and subactive mode. A direct transfer is a transition among these three modes without the
stopping of program execution. A direct transfer can be made by executing a SLEEP instruction
while the DTON bit in SYSCR2 is set to 1. After the mode transition, direct transfer interrupt
exception handling starts.
If the direct transfer interrupt is disabled in interrupt enable register 2, a transition is made instead
to sleep mode or watch mode. Note that if a direct transition is attempted while the I bit in CCR is
set to 1, sleep mode or watch mode will be entered, and it will be impossible to clear the resulting
mode by means of an interrupt.
• Direct transfer from active (high-speed) mode to active (medium-speed) mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON
bit in SYSCR2 is set to 1, a transition is made to active (medium-speed) mode via sleep mode.
• Direct transfer from active (medium-speed) mode to active (high-speed) mode
When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the
DTON bit in SYSCR2 is set to 1, a transition is made to active (high-speed) mode via sleep
mode.
• Direct transfer from active (high-speed) mode to subactive mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are set to 1, the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in
TMA is set to 1, a transition is made to subactive mode via watch mode.
• Direct transfer from subactive mode to active (high-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is
set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is cleared to 0,
the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA is set to 1, a transition is made
directly to active (high-speed) mode via watch mode after the waiting time set in SYSCR1 bits
STS2 to STS0 has elapsed.
• Direct transfer from active (medium-speed) mode to subactive mode
When a SLEEP instruction is executed in active (medium-speed) while the SSBY and LSON
bits in SYSCR1 are set to 1, the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA
is set to 1, a transition is made to subactive mode via watch mode.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 101 of 526
REJ09B0326-0600
• Direct transfer from subactive mode to active (medium-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is
set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is set to 1, the
DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA is set to 1, a transition is made
directly to active (medium-speed) mode via watch mode after the waiting time set in SYSCR1
bits STS2 to STS0 has elapsed.
Section 5 Power-Down Modes
Rev. 6.00 Sep 12, 2006 page 102 of 526
REJ09B0326-0600
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 103 of 526
REJ09B0326-0600
Section 6 ROM
6.1 Overview
The H8/3644 has 32 kbytes of on-chip mask ROM, PROM or flash memory. The H8/3643 has 24
kbytes of mask ROM or flash memory. The H8/3642 has 16 kbytes of mask ROM or flash
memory. The H8/3641 has 12 kbytes of on-chip ROM. H8/3640 has 8 kbytes of ROM. The ROM
is connected to the CPU by a 16-bit data bus, allowing high-speed two-state access for both byte
data and word data.
In the PROM version (H8/3644 ZTAT) and flash memory versions (H8/3644 F-ZTAT, H8/3643
F-ZTAT, H8/3642 AF-ZTAT), programs can be written and erased with a general-purpose PROM
programmer. In the on-chip flash memory versions, programs can be written and erased on-board.
6.1.1 Block Diagram
Figure 6.1 shows a block diagram of the on-chip ROM.
H'7FFE H'7FFF
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Even-numbered
address Odd-numbered
address
H'7FFE
H'0002
H'0000 H'0000
H'0002
H'0001
H'0003
On-chip ROM
Figure 6.1 ROM Block Diagram (H8/3644)
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 104 of 526
REJ09B0326-0600
6.2 PROM Mode
6.2.1 Setting to PROM Mode
If the on-chip ROM is PROM, setting the chip to PROM mode stops operation as a
microcontroller and allows the PROM to be programmed in the same way as the standard
HN27C256 EPROM. Table 6.1 shows how to set the chip to PROM mode.
Table 6.1 Setting to PROM Mode
Pin Name Setting
TEST High level
PB4/AN4 Low level
PB5/AN5
PB6/AN6 High level
6.2.2 Memory Map
Figure 6.2 shows a memory map.
On-chip PROM
H'0000
H'7FFF
H'0000
H'7FFF
Address in
MCU mode Address in
PROM mode
Figure 6.2 H8/3644 Memory Map in PROM Mode
When programming with a PROM programmer, be sure to specify addresses from H'0000 to
H'7FFF.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 105 of 526
REJ09B0326-0600
6.3 Programming
The H8/3644 write, verify, and other modes are selected as shown in table 6.2 in PROM mode.
Table 6.2 Mode Selection in PROM Mode (H8/3644)
Pin
Mode CE
CECE
CE
OE
OEOE
OE
VPP V
CC EO7 to EO0 EA14 to EA0
Write L H VPP V
CC Data input Address input
Verify H L VPP V
CC Data output Address input
Programming
disabled
H H VPP V
CC High impedance Address input
Legend:
L: Low level
H: High level
VPP: VPP level
VCC: VCC level
The specifications for writing and reading are identical to those for the standard HN27C256
EPROM.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 106 of 526
REJ09B0326-0600
6.3.1 Writing and Verifying
An efficient, high-speed, high-reliability method is available for writing and verifying the PROM
data. This method achieves high speed without voltage stress on the device and without lowering
the reliability of written data. Data in unused address areas has a value of H'FF. The basic flow of
this high-speed, high-reliability programming method is shown in figure 6.3.
Start
Set write/verify mode
V = 6.0 V ±0.25 V, V = 12.5 V ±0.3 V
CC PP
Address = 0
n = 0
n + 1 n
→
PW
Verify
Write time t = 3n ms
OPW
Last address?
Set read mode
V
CC
= 5.0 V ±0.5 V, V
PP
= V
CC
Read all
addresses?
End
Error
n 25<
Address + 1 address→
No Yes
NG
OK
Yes
No
NG
Yes
Write time t = 0.2 ms ±5%
Figure 6.3 High-Speed, High-Reliability Programming Flow Chart
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 107 of 526
REJ09B0326-0600
Table 6.3 and table 6.4 give the electrical characteristics in programming mode.
Table 6.3 DC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Condition
Input high-
level voltage
EO7 to EO0, EA14 to EA0
OE, CE
VIH 2.4 VCC +0.3 V
Input low-
level voltage
EO7 to EO0, EA14 to EA0
OE, CE
VIL –0.3 0.8 V
Output high-
level voltage
EO7 to EO0 V
OH 2.4 V IOH = –200 µA
Output low-
level voltage
EO7 to EO0 V
OL 0.45 V IOL = 0.8 mA
Input leakage
current
EO7 to EO0, EA14 to EA0
OE, CE
|ILI| 2 µA Vin = 5.25 V/
0.5 V
VCC current ICC 40 mA
VPP current IPP 40 mA
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 108 of 526
REJ09B0326-0600
Table 6.4 AC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, Ta = 25°C ±5°C)
Item Symbol Min Typ Max Unit Test Condition
Address setup time tAS 2 µs Figure 6.4*1
OE setup time tOES 2 µs
Data setup time tDS 2 µs
Address hold time tAH 0 µs
Data hold time tDH 2 µs
Data output disable time tDF*2 0 130 ns
VPP setup time tVPS 2 µs
Programming pulse width tPW 0.95 1.0 1.05 ms
CE pulse width for overwrite
programming
tOPW*3 2.85 78.7 ms
VCC setup time tVCS 2 µs
Data output delay time tOE 0 500 ns
Notes: 1. Input pulse level: 0.8 V to 2.2 V
Input rise time/fall time ≤ 20 ns
Timing reference levels: Input: 1.0 V, 2.0 V
Output: 0.8 V, 2.0 V
2. tDF is defined at the point at which the output is floating and the output level cannot be
read.
3. tOPW is defined by the value given in figure 6.3, High-Speed, High-Reliability
Programming Flow Chart.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 109 of 526
REJ09B0326-0600
Figure 6.4 shows a PROM write/verify timing diagram.
Address
Data
VPP
VCC
CE
OE
VPP
VCC
VCC
VCC
Write Verify
Input data Output data
tAS
tDS
tVPS
tVCS
tPW
tOPW*
tDH
tOES tOE
tDF
tAH
Note: * tOPW is defined by the value given in figure 6.3, High-Speed, High-Reliability Programming
Flow Chart.
+1
Figure 6.4 PROM Write/Verify Timing
6.3.2 Programming Precautions
• Use the specified programming voltage and timing.
The programming voltage in PROM mode (VPP) is 12.5 V. Use of a higher voltage can
permanently damage the chip. Be especially careful with respect to PROM programmer
overshoot.
Setting the PROM programmer to Renesas Technology specifications for the HN27C256 will
result in correct VPP of 12.5 V.
• Make sure the index marks on the PROM programmer socket, socket adapter, and chip are
properly aligned. If they are not, the chip may be destroyed by excessive current flow. Before
programming, be sure that the chip is properly mounted in the PROM programmer.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 110 of 526
REJ09B0326-0600
• Avoid touching the socket adapter or chip while programming, since this may cause contact
faults and write errors.
6.3.3 Reliability of Programmed Data
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 6.5 shows the recommended screening procedure.
Program chip and
verify programmed data
Bake chip for 24 to 48 hours
at 125 C to 150 C
with power off
Read and check program
Install
Figure 6.5 Recommended Screening Procedure
If a group of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects, using a
microcomputer with on-chip EPROM in a windowed package, etc. Please inform Renesas
Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 111 of 526
REJ09B0326-0600
6.4 Flash Memory Overview
6.4.1 Principle of Flash Memory Operation
Table 6.5 illustrates the principle of operation of the on-chip flash memory in the H8/3644F,
H8/3643F, and H8/3642AF.
Like EPROM, flash memory is programmed by applying a high gate-to-drain voltage that draws
hot electrons generated in the vicinity of the drain into a floating gate. The threshold voltage of a
programmed memory cell is therefore higher than that of an erased cell. Cells are erased by
grounding the gate and applying a high voltage to the source, causing the electrons stored in the
floating gate to tunnel out. After erasure, the threshold voltage drops. A memory cell is read like
an EPROM cell, by driving the gate to a high level and detecting the drain current, which depends
on the threshold voltage. Erasing must be done carefully, because if a memory cell is overerased,
its threshold voltage may become negative, causing the cell to operate incorrectly.
Section 6.7.6, Erase Flowcharts and Sample Programs, shows optimal erase control flowcharts and
sample programs.
Table 6.5 Principle of Memory Cell Operation
Program Erase Read
Memory
cell
Vg = V
PP
Vd
Vs = V
PP
Open
Vg = V
CC
Vd
Memory
array
VPP
Vd
0 V
0 V
0 V
0 V
Open
VPP
Open
0 V
VCC
Vd
0 V
0 V
0 V
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 112 of 526
REJ09B0326-0600
6.4.2 Mode Pin Settings and ROM Space
The H8/3644F has 32 kbytes of on-chip flash memory, the H8/3643F has 24 kbytes, and the
H8/3642AF has 16 kbytes. The ROM is connected to the CPU by a 16-bit data bus. The CPU
accesses flash memory in two states for both byte-size and word-size instructions.
The flash memory is allocated to addresses H'0000 to H'7FFF in the H8/3644F, to addresses
H'0000 to H'5FFF in the H8/3643F, and to addresses H'0000 to H'3FFF in the H8/3642AF.
6.4.3 Features
The features of the flash memory are summarized below.
• Five flash memory operating modes
There are five flash memory operating modes: program mode, program-verify mode, erase
mode, erase-verify mode, and prewrite-verify mode.
• Erase block specification
Blocks to be erased in the flash memory space can be specified by setting the corresponding
register bits. The address space includes a large block area (four blocks with sizes from 4
kbytes to 8 kbytes) and a small block area (eight blocks with sizes from 128 bytes to 1 kbyte).
• Programming/erase times
The flash memory programming time is 50 µs (typ.) per byte, and the erase time is 1 s (typ.).
• Erase-program cycles
Flash memory contents can be erased and reprogrammed up to 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed, erased, and verified on-
board: boot mode and user program mode.
• Automatic bit rate adjustment
For data transfer in boot mode, the chip’s bit rate can be automatically adjusted to match the
transfer bit rate of the host (max. 9600 bps).
• PROM mode
Flash memory can be programmed and erased in PROM mode, using a general-purpose PROM
programmer, as well as in on-board programming mode. The specifications for programming,
erasing, verifying, etc., are the same as for standard HN28F101 flash memory.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 113 of 526
REJ09B0326-0600
6.4.4 Block Diagram
Figure 6.6 shows a block diagram of the flash memory.
Internal data bus (lower)
Bus interface/control sectionFLMCR
EBR1
EBR2
8
Internal data bus (upper)
8
TEST
Operating
mode
Upper byte
(even address)
On-chip flash memory (32 kbytes)
H'0000
H'0002
H'0004
H'0001
H'0003
H'0005
H'7FFC
H'7FFE H'7FFD
H'7FFF
Lower byte
(odd address)
Legend:
FLMCR: Flash memory control register
EBR1: Erase block register 1
EBR2: Erase block register 2
Figure 6.6 Block Diagram of Flash Memory (Example of the H8/3644F)
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 114 of 526
REJ09B0326-0600
6.4.5 Pin Configuration
The flash memory is controlled by means of the pins shown in table 6.6.
Table 6.6 Flash Memory Pins
Pin Name Abbreviation Input/Output Function
Programming power FVPP Power supply Apply 12.0 V
Mode pin TEST Input Sets H8/3644F operating mode
Transmit data TXD Output SCI3 transmit data output
Receive data RXD Input SCI3 receive data input
The transmit data pin and receive data pin are used in boot mode.
6.4.6 Register Configuration
The registers used to control the on-chip flash memory are shown in table 6.7.
Table 6.7 Flash Memory Registers
Register Name Abbreviation R/W Initial Value Address
Flash memory control register FLMCR R/W H'00 H'FF80
Erase block register 1 EBR1 R/W H'F0 H'FF82
Erase block register 2 EBR2 R/W H'00 H'FF83
The FLMCR, EBR1, and EBR2 registers are valid only when programming and erasing flash
memory, and can only be accessed when 12 V is applied to the FVPP pin. When 12 V is not
applied to the FVPP pin, addresses H'FF80 to H'FF83 cannot be modified and are always read as
H'FF.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 115 of 526
REJ09B0326-0600
6.5 Flash Memory Register Descriptions
6.5.1 Flash Memory Control Register (FLMCR)
FLMCR is an 8-bit register used for flash memory operating mode control. Transitions to program
mode, erase mode, program-verify mode, and erase-verify mode are made by setting bits in this
register. FLMCR is initialized to H'00 upon reset, in sleep mode, subsleep mode, watch mode, and
standby mode, and when 12 V is not applied to FVPP. When 12 V is applied to FVPP, a reset
initializes FLMCR to H'80.
Bit 7 6 5 4 3 2 1 0
V
PP EV PV E P
Initial value 0 0 0 0 0 0 0 0
Read/Write R R/W* R/W* R/W* R/W*
Note: * For information on access to this register, see note 11 in section 6.9, Flash Memory
Programming and Erasing Precautions.
Bit 7
Programming Power (VPP): Bit 7 is a status flag that indicates that 12 V is applied to the
FVPP pin. For further information, see note 5 in section 6.9, Flash Memory Programming and
Erasing Precautions.
Bit 7: VPP Description
0 Clearing condition: (initial value)
When 12 V is not applied to the FVPP pin
1 Setting condition:
When 12 V is applied to the FVPP pin
Bit 3
Erase-Verify Mode (EV)*: Bit 3 selects transition to or exit from erase-verify mode.
Bit 3: EV Description
0 Exit from erase-verify mode (initial value)
1 Transition to erase-verify mode
Note: * Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 116 of 526
REJ09B0326-0600
Bit 2
Program-Verify Mode (PV)*: Bit 2 selects transition to or exit from program-verify
mode.
Bit 2: PV Description
0 Exit from program-verify mode (initial value)
1 Transition to program-verify mode
Note: * Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
Bit 1
Erase Mode (E)*1*2: Bit 1 selects transition to or exit from erase mode.
Bit 1: E Description
0 Exit from erase mode (initial value)
1 Transition to erase mode
Notes: 1. Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
2. P bit and E bit setting should be carried out in accordance with the program/erase
algorithms shown in section 6.7, Programming and Erasing Flash Memory.
A watchdog timer setting should be made beforehand to prevent the P or E bit from
being set for longer than the specified time.
See section 6.9, Flash Memory Programming and Erasing Precautions, for more
information on the use of these bits.
Bit 0
Program Mode (P)*1*2: Bit 0 selects transition to or exit from program mode.
Bit 0: P Description
0 Exit from program mode (initial value)
1 Transition to program mode
Notes: 1. Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
2. P bit and E bit setting should be carried out in accordance with the program/erase
algorithms shown in section 6.7, Programming and Erasing Flash Memory.
A watchdog timer setting should be made beforehand to prevent the P or E bit from
being set for longer than the specified time.
See section 6.9, Flash Memory Programming and Erasing Precautions, for more
information on the use of these bits.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 117 of 526
REJ09B0326-0600
6.5.2 Erase Block Register 1 (EBR1)
EBR1 is an 8-bit register that specifies large flash-memory blocks for programming or erasure.
EBR1 is initialized to H'F0 upon reset, in sleep mode, subsleep mode, watch mode, and standby
mode, and when 12 V is not applied to FVPP. When a bit in EBR1 is set to 1, the corresponding
block is selected and can be programmed and erased. The erase block map is shown in figure 6.7,
and the correspondence between bits and erase blocks is shown in table 6.8.
Bit 7 6 5 4 3 2 1 0
LB3 LB2 LB1 LB0
Initial value 1 1 1 1 0 0 0 0
Read/Write R/W* R/W* R/W* R/W*
Note: * Word access cannot be used on this register; byte access must be used. For
information on access to this register, see note 11 in section 6.9, Flash Memory
Programming and Erasing Precautions. LB3 is invalid in the H8/3643F, and LB3 and
LB2 are invalid in the H8/3642AF.
Bits 7 to 4
Reserved: Bits 7 to 4 are reserved; they are always read as 1, and cannot be
modified.
Bits 3 to 0
Large Block 3 to 0 (LB3 to LB0): These bits select large blocks (LB3 to LB0) to be
programmed and erased.
Bits 3 to 0:
LB3 to LB0
Description
0 Block LB3 to LB0 is not selected (initial value)
1 Block LB3 to LB0 is selected
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 118 of 526
REJ09B0326-0600
6.5.3 Erase Block Register 2 (EBR2)
EBR2 is an 8-bit register that specifies small flash-memory blocks for programming or erasure.
EBR2 is initialized to H'00 upon reset, in sleep mode, subsleep mode, watch mode, and standby
mode, and when 12 V is not applied to FVPP. When a bit in EBR2 is set to 1, the corresponding
block is selected and can be programmed and erased. The erase block map is shown in figure 6.7,
and the correspondence between bits and erase blocks is shown in table 6.8.
Bit 7 6 5 4 3 2 1 0
SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W* R/W* R/W* R/W* R/W* R/W* R/W* R/W*
Note: * Word access cannot be used on this register; byte access must be used. For
information on access to this register, see note 11 in section 6.9, Flash Memory
Programming and Erasing Precautions. LB3 is invalid in the H8/3643F, and LB3 and
LB2 are invalid in the H8/3642AF.
Bits 7 to 0
Small Block 7 to 0 (SB7 to SB0): These bits select small blocks (SB7 to SB0) to be
programmed and erased.
Bits 7 to 0:
SB7 to SB0
Description
0 Block SB7 to SB0 is not selected (initial value)
1 Block SB7 to SB0 is selected
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 119 of 526
REJ09B0326-0600
H'7FFF
H'5FFF
H'6000
LB2
(8 kbytes)
H'3FFF
H'4000
LB1
(8 kbytes)
H'1FFF
H'2000
LB0
(4 kbytes)
H'0FFF
H'1000
SB7 to SB0
(4 kbytes)
Small block
area
(4 kbytes)
Large block
area
(H8/3644F:
28 kbytes)
(H8/3643F:
20 kbytes)
(H8/3642AF:
12 kbytes)
H'0000
LB3
(8 kbytes)
H'0FFF
H'0BFF
H'0C00
SB6
(1 kbyte)
H'07FF
H'0800
SB5
(1 kbyte)
H'03FF
H'0400
SB4
(512 bytes)
H'01FF
H'0200
SB0 (128 bytes)
SB1 (128 bytes)
SB2 (128 bytes)
SB3 (128 bytes)
H'0000
SB7
(1 kbyte)
Figure 6.7 Erase Block Map
Table 6.8 Correspondence between Erase Blocks and EBR1/EBR2 Bits
Register Bit Block Addresses Size
EBR1 0 LB0 H'1000 to H'1FFF 4 kbytes
1 LB1 H'2000 to H'3FFF 8 kbytes
2 LB2 H'4000 to H'5FFF 8 kbytes
3 LB3 H'6000 to H'7FFF 8 kbytes
Register Bit Block Addresses Size
EBR2 0 SB0 H'0000 to H'007F 128 bytes
1 SB1 H'0080 to H'00FF 128 bytes
2 SB2 H'0100 to H'017F 128 bytes
3 SB3 H'0180 to H'01FF 128 bytes
4 SB4 H'0200 to H'03FF 512 bytes
5 SB5 H'0400 to H'07FF 1 kbyte
6 SB6 H'0800 to H'0BFF 1 kbyte
7 SB7 H'0C00 to H'0FFF 1 kbyte
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 120 of 526
REJ09B0326-0600
6.6 On-Board Programming Modes
When an on-board programming mode is selected, on-chip flash memory programming, erasing,
and verifying can be carried out. There are two on-board programming modesboot mode and
user program modeset by the mode pin (TEST) and the FVPP pin. Table 6.9 shows how to select
the on-board programming modes. For information on turning VPP on and off, see note 5 in section
6.9, Flash Memory Programming and Erasing Precautions.
Table 6.9 On-Board Programming Mode Selection
Mode Setting FVPP TEST Notes
Boot mode 12 V* 12 V*
User program mode VSS
Note: * See notes 6 to 8 in section 6.6.1, Notes on Use of Boot Mode, for the timing of 12 V
application.
6.6.1 Boot Mode
When boot mode is used, a user program for flash memory programming and erasing must be
prepared beforehand in the host machine (which may be a personal computer). SCI3 is used in
asynchronous mode (see figure 6.8). When the H8/3644F, H8/3643F, or H8/3642AF is set to boot
mode, after reset release a built-in boot program is activated, the low period of the data sent from
the host is first measured, and the bit rate register (BRR) value determined. The chip’s on-chip
serial communication interface (SCI3) can then be used to download the user program from the
host machine. The downloaded user program is written into RAM.
After the program has been stored, execution branches to the start address (H'FBE0) of the on-chip
RAM, the program stored in RAM is executed, and flash memory programming/erasing can be
carried out. Figure 6.9 shows the boot mode execution procedure.
HOST
Reception of programming data
H8/3644F,
H8/3643F, or
H8/3642AF
RXD
TXDSCI3
Transmission of verify data
Figure 6.8 Boot Mode System Configuration
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 121 of 526
REJ09B0326-0600
Boot Mode Execution Procedure: The boot mode execution procedure is shown below.
Set pins to boot mode for chip
and execute reset-start
Host transmits H'00 data continuously
at prescribed bit rate
Chip measures low period of H'00 data
transmitted by host
Chip calculates bit rate and sets value
in bit rate register
Chip transfers user program to RAM*2
Chip calculates remaining
bytes to be transferred (N = N – 1)*2
After receiving H'55, chip transfers part
of boot program to RAM
After bit rate adjustment, chip transmits
one H'00 data byte to host to indicate
end of adjustment
Host confirms normal reception of bit rate
adjustment end indication, and transmits
one H'55 data byte
After confirming that all flash memory
data is H'FF, chip transmits
one H'AA byte to host
Erase all flash
memory blocks*3
Chip receives, as 2 bytes, number
of program bytes (N) to be transferred
to on-chip RAM*1
Chip branches to RAM boot area
(H'FC00 to H'FF2F), then checks flash
memory user area data
Chip transfers user program to RAM,
then transmits one H'AA byte to host
Chip branches to RAM area
address H'FBE0 and executes user
program transferred to RAM
Start
No
Yes
YES
No
All data = H'FF?
10
8
3
9
7
6
5
4
1
2
1. Set the chip to boot mode and execute a reset-start.
2. Set the host to the prescribed bit rate (2400/4800/9600)
and have it transmit H'00 data continuously using a
transfer data format of 8-bit data plus 1 stop bit.
3. The chip repeatedly measures the low period at the
RXD pin and calculates the asynchronous
communication bit rate used by the host.
4. After SCI3 bit rate adjustment is completed, the chip
transmits one H'00 data byte to indicate the end of
adjustment.
5. On receiving the one-byte data indicating completion of
bit rate adjustment, the host should confirm normal
reception of this indication and transmit one H'55 data
byte.
6. After receiving H'55, the chip transfers part of the boot
program to RAM areas H'FB80 to H'FBDF and H'FC00
to H'FF2F.
7. The chip branches to the RAM boot program area
(H'FC00–H'FF2F) and checks for the presence of data
written in the flash memory. If data has been written in
the flash memory, the chip erases all blocks.
8. The chip transmits one H'AA byte. The host then
transmits the number of user program bytes to be
transferred to the chip. The number of bytes should be
sent as two bytes, upper byte followed by lower byte.
The host should then transmit sequentially the program
set by the user.
The chip transmits the received byte count and user
program sequentially to the host, one byte at a time, as
verify data (echo-back).
9. The chip writes the received user program sequentially
to on-chip RAM area H'FBE0 to H'FF6D (910 bytes).
10. The chip transmits one H'AA byte, then branches to on-
chip RAM address H'FBE0 and executes the user
program written in area H'FBE0 to H'FF6D.
Notes: 1. The size of the RAM area available to the user is
910 bytes. The number of bytes to be
transferred must not exceed 910 bytes. The
transfer byte count must be sent as two bytes,
upper byte followed by lower byte.
Example of transfer byte count: for 256 bytes
(H'0100), upper byte = H'01, lower byte = H'00
2. The part of the user program that controls the
flash memory should be set in the program in
accordance with the flash memory program/
erase algorithms described later in this section.
3. If a memory cell does not operate normally and
cannot be erased, the chip transmits one H'FF
byte as an erase error indication and halts the
erase operation and subsequent operations.
Transfer
end byte count
N = 0?
Figure 6.9 Boot Mode Operation Flowchart
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 122 of 526
REJ09B0326-0600
Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8/3644F, H8/3643F, or
H8/3642AF measures the low period of the asynchronous SCI communication data transmitted
continuously from the host (figure 6.10). The data format should be set as 8-bit data, 1 stop bit, no
parity. The chip calculates the bit rate of the transmission from the host from the measured low
period (9 bits), and transmits one H'00 byte to the host to indicate the end of bit rate adjustment.
The host should confirm that this adjustment end indication has been received normally, and
transmit one H'55 byte to the chip. If reception cannot be performed normally, initiate boot mode
again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and
the chip’s system clock oscillation frequency (fOSC), there will be a discrepancy between the bit
rates of the host and the chip. To insure correct SCI operation, the host’s transfer bit rate should be
set to 2400, 4800, or 9600 bps*1. Table 6.10 shows typical host transfer bit rates and system clock
oscillation frequency for which automatic adjustment of the chip’s bit rate is possible. Boot mode
should be used within this system clock oscillation frequency range*2.
Notes: 1. Only use a host bit rate setting of 2400, 4800, or 9600 bps. No other bit rate setting
should be used.
2. Although the chip may also perform automatic bit rate adjustment with bit rate and
system clock oscillation frequency combinations other than those shown in table 6.10,
a degree of error will arise between the bit rates of the host and the chip, and
subsequent transfer will not be performed normally. Therefore, only a combination of
bit rate and system clock oscillation frequency within one of the ranges shown in table
6.10 can be used for boot mode execution.
Start
bit D0 D1 D2 D3 D4 D5 D6 D7 Stop
bit
Low period (9 bits) measured (H'00 data)
High period
(1 or more
bits)
Figure 6.10 Measurement of Low Period in Transmit Data from Host
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 123 of 526
REJ09B0326-0600
Table 6.10 System Clock Oscillation Frequencies Permitting Automatic Adjustment of
Chip (H8/3644F, H8/3643F, H8/3642AF) Bit Rate
Host Bit Rate*
System Clock Oscillation Frequencies (fOSC) Permitting Automatic
Adjustment of Chip (H8/3644F, H8/3643F, H8/3642AF) Bit Rate
9600 bps 8 MHz to 16 MHz
4800 bps 4 MHz to 16 MHz
2400 bps 2 MHz to 16 MHz
Note: * Use a host bit rate setting of 2400, 4800, or 9600 bps only. No other setting should be
used.
RAM Area Allocation in Boot Mode: In boot mode, the 96-byte area from H'FB80 to H'FBDF
and the 18-byte area from H'FF6E to H'FF7F are reserved for boot program use, as shown in
figure 6.11. The area to which the user program is transferred is H'FBE0 to H'FF6D (910 bytes).
The boot program area becomes available when a transition is made to the execution state for the
user program transferred to RAM. A stack area should be set within the user program as required.
H'FF6E
H'FF7F
H'FB80 Boot program
area*
(96 bytes)
Boot program
area*
(18 bytes)
User program
transfer area
(910 bytes)
H'FBE0
These areas cannot be used until a transition is made to the execution state for the user
program transferred to RAM (i.e. a branch is made to RAM address H'FBE0). Note also
that the boot program remains in the boot program area in RAM (H'FB80 to H'FBDF,
H'FF6E to H'FF7F) even after control branches to the user program. When an interrupt
handling routine is executed in the boot program, the 16 bytes from H'FB80 to H'FB8F in
this area cannot be used. For details see section 6.7.9, Interrupt Handling during Flash
Memory Programming/Erasing.
Note: *
Figure 6.11 RAM Areas in Boot Mode
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 124 of 526
REJ09B0326-0600
Notes on Use of Boot Mode:
1. When the chip (H8/3644F, H8/3643F, or H8/3642AF) comes out of reset in boot mode, it
measures the low period of the input at the SCI3’s RXD pin. The reset should end with RXD
high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low
period of the RXD input.
2. In boot mode, if any data has been programmed into the flash memory (if all data is not H'FF),
all flash memory blocks are erased. Boot mode is for use when user program mode is
unavailable, such as the first time on-board programming is performed, or if the program
activated in user program mode is accidentally erased.
3. Interrupts cannot be used while the flash memory is being programmed or erased.
4. The RXD and TXD lines should be pulled up on the board.
5. Before branching to the user program (RAM address H'FBE0), the chip terminates transmit
and receive operations by its on-chip SCI3 (by clearing the RE and TE bits to 0 in the serial
control register (SCR)), but the adjusted bit rate value remains set in the bit rate register
(BRR). The transmit data output pin, TXD, goes to the high-level output state (PCR22 = 1 in
the port 2 control register, P22 = 1 in the port 2 data register).
The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized immediately after branching to the user program. In particular,
since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be
specified for use by the user program.
The initial values of other on-chip registers are not changed.
6. Boot mode can be entered by applying 12 V to the TEST pin and FVPP pin in accordance with
the mode setting conditions shown in table 6.9, and then executing a reset-start. Care must be
taken with turn-on of the VPP power supply at this time.
On reset release (a low-to-high transition), the chip determines whether 12 V is being applied
to the TEST pin and FVPP pin, and on detecting that boot mode has been set, retains that state
internally. As the applied voltage criterion level (threshold level) at this time is the range of
approximately VCC +2 V to 11.4 V, a transition will be made to boot mode even if a voltage
sufficient for executing programming and erasing (11.4 V to 12.6 V) is not being applied.
Therefore, when executing the boot program, the VPP power supply must be stabilized within
the range of 11.4 V to 12.6 V before a branch is made to the RAM area, as shown in figure
6.22.
Insure that the program voltage VPP does not exceed 12.6 V when a transition is made to boot
mode (when reset is released), and does not exceed the range 12 V ±0.6 V during boot mode
operation. If these values are exceeded, boot mode execution will not be performed correctly.
Also, do not release or cut VPP during boot mode execution or when programming or erasing
flash memory*.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 125 of 526
REJ09B0326-0600
Boot mode can be exited by driving the reset pin low, then releasing 12 V application to the
TEST pin and FVPP pin at least 10 system clock cycles later, and setting the TEST pin to VSS to
release the reset.
However, external pin settings must not be changed during boot mode execution.
Note that the boot mode state is not maintained if 12 V application to the TEST pin is released
while in boot mode.
Also, if a watchdog timer reset occurs in this boot mode state, the built-in boot program will be
restarted without clearing the MCU’s internal mode state.
7. If the TEST pin input level is changed (e.g. from 0 V to 5 V to 12 V) during a reset (while a
low level is being input at the RES pin), port states will change as a result of the change of
MCU operating mode. Therefore, care must be taken to make pin settings to prevent these pins
from becoming output signal pins during a reset, and to prevent collision with signals outside
the MCU.
8. Regarding 12 V application to the FVPP and TEST pins, insure that peak overshoot does not
exceed the maximum rating of 13 V.
Also, be sure to connect bypass capacitors to the FVPP and TEST pins.
Note: * For further information on VPP application, release, and cut-off, see note 5 in section
6.9, Flash Memory Programming and Erasing Precautions.
6.6.2 User Program Mode
When set to user program mode, the H8/3644F, H8/3643F, or H8/3642AF can program and erase
its flash memory by executing a user program. Therefore, on-board reprogramming of the on-chip
flash memory can be carried out by providing on-board means of supplying VPP and programming
data, and storing an on-board reprogramming program in part of the program area.
User program mode is selected by applying 12 V to the FVPP pin when flash memory is not being
accessed, during a reset or after confirming that a reset has been performed properly (after the
reset is released).
The flash memory cannot be read while being programmed or erased, so the on-board
reprogramming program or flash memory reprogramming routine should be transferred to the
RAM area, and on-board reprogramming executed in that area.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 126 of 526
REJ09B0326-0600
User Program Mode Execution Procedure*1: The procedure for user program execution in
RAM is shown below.
Reset-start (TEST = V
SS
)
Branch to flash memory on-board
reprogramming program
Transfer flash memory
reprogramming routine to RAM
Branch to flash memory
reprogramming routine in RAM area
FV
PP
= 12 V
(user program mode)
Execute flash memory
reprogramming routine in RAM area
(flash memory reprogramming)
Release FV
PP
(exit user program mode)
Branch to flash memory application
program
*2
1
2
3
4
5
6
7
8
Procedure:
An on-board reprogramming program must be written into
flash memory by the user beforehand.
1. Set the TEST pin to V
SS
and execute a reset-start.
2. Branch to the on-board reprogramming program written to
flash memory.
3. Transfer the flash memory reprogramming routine to the
RAM area.
4. Branch to the flash memory reprogramming routine
transferred to the RAM area.
5. Apply 12 V to the FV
PP
pin. (Transition to user program
mode)
6. Execute the flash memory reprogramming routine in the
RAM area, an perform on-board reprogramming of the
flash memory.
7. Switch the FV
PP
pin from 12 V to V
CC
, and exit user
program mode.
8. After on-board reprogramming of the flash memory ends,
branch to the flash memory application program.
Notes: 1. Do not apply 12 V to the FV
PP
pin during normal operation. To prevent inadvertent programming or
erasing due to program runaway, etc., apply 12 V to the FV
PP
pin only when the flash memory is
being programmed or erased . Memory cells may not operate normally if overprogrammed or
overerased due to program runaway, etc. Also, while 12 V is applied to the FV
PP
pin, the watchdog
timer should be activated to prevent overprogramming or overerasing due to program runaway, etc.
For further information on FV
PP
application, release, and cut-off, see note 5 in section 6.9, Flash
Memory Programming and Erasing Precautions.
2. When the application of 12 V to the FV
PP
pin is released after programming is completed, the flash
memory read setup time (t
FRS
) must elapse before executing a program in flash memory. This
specifies the setup time from the point at which the FV
PP
voltage reaches the V
CC
+ 2 V level after
12 V application is released until the flash memory is read.
Figure 6.12 Example of User Program Mode Operation
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 127 of 526
REJ09B0326-0600
6.7 Programming and Erasing Flash Memory
The on-chip flash memory of the H8/3644F, H8/3643F, and H8/3642AF is programmed and
erased by software, using the CPU. There are five flash memory operating modes: program mode,
erase mode, program-verify mode, erase-verify mode, and prewrite-verify mode. Transitions to
these modes can be made by setting the P, E, PV, and EV bits in the flash memory control register
(FLMCR).
The flash memory cannot be read while being programmed or erased. Therefore, the program that
controls flash memory programming and erasing should be located and executed in on-chip RAM
or external memory. A description of each mode is given below, with recommended flowcharts
and sample programs for programming and erasing.
See section 6.9, Flash Memory Programming and Erasing Precautions, for additional notes on
programming and erasing.
6.7.1 Program Mode
To write data into the flash memory, follow the programming algorithm shown in figure 6.13. This
programming algorithm enables data to be written without subjecting the device to voltage stress
or impairing the reliability of the programmed data.
To write data, first set the blocks to be programmed with erase block registers 1 and 2 (EBR1,
EBR2), and write the data to the address to be programmed, as in writing to RAM. The flash
memory latches the programming address and programming data in an address latch and data
latch. Next set the P bit in FLMCR, selecting program mode. The programming time is the time
during which the P bit is set. Make a setting so that the total programming time does not exceed 1
ms. Programming for too long a time, due to program runaway for example, can damage the
device. Before selecting program mode, set up the watchdog timer so as to prevent
overprogramming.
For details of the programming procedure, see section 6.7.3, Programming Flowchart and Sample
Program.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 128 of 526
REJ09B0326-0600
6.7.2 Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of the programming time, exit programming mode (clear the P bit to 0) and select
program-verify mode (set the PV bit to 1). In program-verify mode, a program-verify voltage is
applied to the memory cells at the latched address. If the flash memory is read in this state, the
data at the latched address will be read. After selecting program-verify mode, wait at least 4 µs
before reading, then compare the programmed data with the verify data. If they agree, exit
program-verify mode and program the next address. If they do not agree, select program mode
again and repeat the same program and program-verify sequence. Do not repeat the program and
program-verify sequence more than six times* for the same bit.
Note: * When a bit is programmed repeatedly, set a loop counter so that the total programming
time will not exceed 1 ms.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 129 of 526
REJ09B0326-0600
6.7.3 Programming Flowchart and Sample Program
Flowchart for Programming One Byte
Start
End (1-byte data programmed)
Programming error
Set erase block register
(set bit for block to be programmed to 1)
Select program mode
(P bit = 1 in FLMCR)
n = 1
Wait (x) µs *4
Clear P bit End of programming
End of verify
No
NG
OK
Yes
Enable watchdog timer *2
Disable watchdog timer
Select program-verify mode
(PV bit = 1 in FLMCR)
Wait (tvs1) µs *5
Clear PV bit Clear PV bit
n + 1 → n
Double the programming time
(x × 2 → x)
Clear erase block register
(clear bit for programmed block to 0)
Write data to flash memory
(flash memory latches write address
and data) *1
Verify *3
(read memory)
n ≥ N? *5
Notes: 1. Write the data to be programmed using a byte
transfer instruction.
2. For the timer overflow interval, set the timer
counter value (TCW) to H'FE.
3. Read the memory data to be verified using a
byte transfer instruction.
4. Programming time x is successively
incremented to initial set value × 2n–1 (n = 1 to
6). The initial value should therefore be set to
15.8 µs or less to make the total
programming time 1 ms or less.
5. tvs1: 4 µs or more
N: 6 (set N so that total programming time
does not exceed 1 ms)
Figure 6.13 Programming Flowchart
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 130 of 526
REJ09B0326-0600
Sample Program for Programming One Byte
This program uses the following registers:
R0H: Used for erase block specification.
R1H: Stores programming data.
R1L: Stores read data.
R3: Stores the programming address. Valid address specifications are H'0000 to H'EF7F.
R4: Used for program and program-verify loop counter value setting. Also stores register set
values.
R5: Used for program loop counter value setting.
R6L: Used for the program-verify fail count.
Arbitrary data can be programmed at an arbitrary address by setting the R3 (programming address)
and R1H (programming data) values.
The values of #a and #b depend on the operating frequency. They should be set as indicated in
table 6.11.
FLMCR: .EQU H'FF80
EBR1: .EQU H'FF82
EBR2: .EQU H'FF83
TCSRW: .EQU H'FFBE
TCW: .EQU H'FFBF
.ALIGN 2
PRGM: MOV.B #H'**, R0H ;
MOV.B R0H, @EBR*:8 ;Set EBR*
MOV.B #H'00, R6L ; Program-verify fail count
MOV.W #H'a, R5 ; Set program loop counter
MOV.B R1H, @R3 ; Dummy write
PRGMS: INC R6L ; Program-verify fail counter + 1 → R6L
MOV.W #H'FE5A, R4 ;
MOV.B R4L, @TCSRW:8 ;
MOV.B R4H, @TCW:8 ;
MOV.B #H'36, R4L ;
MOV.B R4L, @TCSRW:8 ; Start watchdog timer
MOV.W R5, R4 ; Set program loop counter
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 131 of 526
REJ09B0326-0600
BSET #0, @FLMCR:8 ; Set P bit
LOOP1: SUBS #1, R4 ;
MOV.W R4, R4 ;
BNE LOOP1 ; Wait loop
BCLR #0, @FLMCR:8 ; Clear P bit
MOV.B #H'50, R4L ;
MOV.B R4L, @TCSRW:8 ; Stop watchdog timer
MOV.B #H'b, R4H ;Set program-verify fail counter
BSET #2, @FLMCR:8 ; Set PV bit
LOOP2: DEC R4H ;
BNE LOOP2 ; Wait loop
MOV.B @R3, R1L ; Read programmed data
CMP.B R1H, R1L ; Compare programmed data with read data
BEQ PVOK ; Program-verify decision
BCLR #2, @FLMCR:8 ; Clear PV bit
CMP.B #H'06, R6L ; Program-verify executed 6 times?
BEQ NGEND ; If program-verify executed 6 times, branch to NGEND
ADD.W R5, R5 ; Double programming time
BRA PRGMS ; Program again
PVOK: BCLR #2, @FLMCR:8 ; Clear PV bit
MOV.B #H'00, R6L ;
MOV.B R6L, @EBR*:8 ; Clear EBR*
One byte programmed
NGEND: Programming error
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 132 of 526
REJ09B0326-0600
6.7.4 Erase Mode
To erase the flash memory, follow the erasing algorithm shown in figure 6.14. This erasing
algorithm enables data to be erased without subjecting the device to voltage stress or impairing the
reliability of the programmed data.
To erase flash memory, before starting to erase, first place all memory data in all blocks to be
erased in the programmed state (program all memory data to H'00). If all memory data is not in the
programmed state, follow the sequence described later to program the memory data to zero. Select
the flash memory areas to be programmed with erase block registers 1 and 2 (EBR1, EBR2). Next
set the E bit in FLMCR, selecting erase mode. The erase time is the time during which the E bit is
set. To prevent overerasing, use a software timer to divide the time for one erasure, and insure that
the total time does not exceed 30 s. See section 6.7.6, Erase Flowcharts and Sample Programs, for
the time for one erasure. Overerasing, due to program runaway for example, can give memory
cells a negative threshold voltage and cause them to operate incorrectly. Before selecting erase
mode, set up the watchdog timer so as to prevent overerasing.
6.7.5 Erase-Verify Mode
In erase-verify mode, after data has been erased, it is read to check that it has been erased
correctly. After the erase time has elapsed, exit erase mode (clear the E bit to 0), and select erase-
verify mode (set the EV bit to 1). Before reading data in erase-verify mode, write H'FF dummy
data to the address to be read. This dummy write applies an erase-verify voltage to the memory
cells at the latched address. If the flash memory is read in this state, the data at the latched address
will be read. After the dummy write, wait at least 2 µs before reading. Also, wait at least 4 µs
before performing the first dummy write after selecting erase-verify mode. If the read data has
been successfully erased, perform the erase-verify sequence (dummy write, wait of at least 2 µs,
read) on the next address. If the read data has not been erased, select erase mode again and repeat
the same erase and erase-verify sequence through the last address, until all memory data has been
erased to 1. Do not repeat the erase and erase-verify sequence more than 602 times, however.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 133 of 526
REJ09B0326-0600
6.7.6 Erase Flowcharts and Sample Programs
Flowchart for Erasing One Block
Start
End of erase Erase error
Set erase block register
(set bit for block to be erased to 1)
Write 0 data in all addresses to be erased
(prewrite)
*1
Select erase mode
(E bit = 1 in FLMCR)
n = 1
Wait (x) ms
*5
Clear E bit Erasing halts
End of erase-verify
No
No
NG
No
OK
Yes
Yes
Yes
Enable watchdog timer
*2
Disable watchdog timer
Select erase-verify mode
(EV bit = 1)
Dummy write to verify address
*3
(flash memory latches
address)
Set block start address as
verify address
Wait (t
vs1
) µs
*6
Wait (t
vs2
) µs
*6
Clear EV bit
Address + 1 → address Clear EV bit
n + 1 → n
Double the erase time
(x × 2 → x)
Clear erase block register
(clear bit for erased block to 0)
Verify
*4
(read data H'FF?)
Last address?
n ≥ N?
*6
n > 4?
Notes: 1. Program all addresses to be erased by
following the prewrite flowchart.
2. Set the watchdog timer overflow interval to
the initial value shown in table 6.12.
3. For the erase-verify dummy write, write H'FF
using a byte transfer instruction.
4. For the erase-verify operation, read the data
using a byte transfer instruction. When
erasing multiple blocks, clear the erase block
register bits for erased blocks and perform
additional erasing only for unerased blocks.
5. Erase time x is successively incremented to
initial set value x 2n-1 (n = 1 to 4), and is
fixed from the 4th time onward. An initial
value of 6.25 ms or less should be set, and
the time for one erasure should be 50 ms or
less.
6. t
vs1
: 4 µs or more
t
vs2
: 2 µs or more
N: 602 (set N so that the total erase time
does not exceed 30 s)
Figure 6.14 Erase Flowchart
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 134 of 526
REJ09B0326-0600
Prewrite Flowchart
Start
End of prewrite
Programming error
Set erase block register
(set bit for block to be programmed to 1)
Select program mode
(P bit = 1 in FLMCR)
Set start address
*6
n = 1
Wait (x) µs
*4
Clear P bit End of programming
No
No
NG
OK
Yes
Yes
Enable watchdog timer
*2
Disable watchdog timer
Wait (t
vs1
) µs
*5
n + 1 → n
Address + 1 → address
Double the programming time
(x × 2 → x)
Clear erase block register
(clear bit for programmed block to 0)
Write H'00 to flash memory
(flash memory latches programmed address
and data)
*1
Prewrite verify
*3
(read data H'00?)
n ≥ N?
*5
Last address?
Notes: 1. Write using a byte transfer instruction.
2. For the timer overflow interval, set the
timer counter value (TCW) to H'FE.
3. In prewrite-verify mode, P, E, PV, and EV
are all cleared to 0, and 12 V is applied to
the V
PP
pin. Read using a byte transfer
4. Programming time x is successively
incremented to initial set value × 2
n–1
(n = 1 to 6). The initial value should
therefore be set to 15.8 µs or less to make
the total programming time 1 ms or less.
5. t
vs1
: 4 µs or more
N: 6 (set N so that the total programming
time does not exceed 1 ms)
6. The start address and last address are the
start address and last address of the block
to be erased.
*6
Figure 6.15 Prewrite Flowchart
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 135 of 526
REJ09B0326-0600
Sample Program for Erasing One Block
This program uses the following registers:
R0: Used for erase block specification. Also stores address used in prewrite and erase-verify.
R1H: Stores read data. Also used in dummy write.
R2: Stores last address of block to be erased.
R3: Stores address used in prewrite and erase-verify.
R4: Used for prewrite, prewrite-verify, erase, and erase-verify loop counter value setting. Also
stores register set values.
R5: Used for prewrite and erase loop counter value setting.
R6L: Used for prewrite-verify and erase-verify fail count.
The values of #a, #b, #c, #d, and #e in the program depend on the operating frequency. They
should be set as indicated in tables 6.11 and 6.12. Erase block register (EBR1, EBR2) settings
should be made as indicated in sections 6.5.2 and 6.5.3 in section 6.5, Flash Memory Register
Descriptions. For #BLKSTR and #BLKEND, the start address and end address corresponding to
the set erase block register should be set as indicated in table 6.7.
FLMCR: .EQU H'FF80
EBR1: .EQU H'FF82
EBR2: .EQU H'FF83
TCSRW: .EQU H'FFBE
TCW: .EQU H'FFBF
.ALIGN 2
MOV.B #H'**, R0H ;
MOV.B R0H, @EBR*:8 ;Set EBR*
; #BLKSTR is start address of block to be erased
; #BLKEND is last address of block to be erased
MOV.W #BLKSTR, R0 ;Start address of block to be erased
MOV.W #BLKEND, R2 ;Last address of block to be erased
ADDS #1, R2 ;Last address of block to be erased + 1 → R2
; Execute prewrite
MOV.W R0, R3 ;Start address of block to be erased
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 136 of 526
REJ09B0326-0600
PREWRT: MOV.B #H'00, R6L ;Prewrite verify fail counter
MOV.W #H'a, R5 ;Set prewrite loop counter
PREWRS: INC R6L ;Prewrite-vector fail counter + 1 → R6L
MOV.B #H'00, R1H ;
MOV.B R1H, @R3 ;Write H'00
MOV.W #H'FE5A, R4 ;
MOV.B R4L, @TCSRW:8 ;
MOV.B R4H, @TCW:8 ;
MOV.B #H'36, R4L ;
MOV.B R4L, @TCSRW:8 ;Start watchdog timer
MOV.W R5, R4 ;Set prewrite loop counter
BSET #0, @FLMCR:8 ;Set P bit
LOOPR1: SUBS #1, R4 ;
MOV.W R4, R4 ;
BNE LOOPR1 ;Wait loop
BCLR #0, @FLMCR:8 ;Clear P bit
MOV.B #H'50, R4L ;
MOV.B R4L, @TCSRW:8 ;Stop watchdog timer
MOV.B #H'c, R4H ;Set prewrite-verify loop counter
LOOPR2: DEC R4H ;
BNE LOOPR2 ;Wait loop
MOV.B @R3, R1H ;Read data = H'00?
BEQ PWVFOK ;If read data = H'00, branch to PWVFOK
CMP.B #H'06, R6L ;Prewrite-verify executed 6 times?
BEQ ABEND1 ;If prewrite-verify executed 6 times, branch to ABEND1
ADD.W R5, R5 ;Double the programming time
BRA PREWRS ;Prewrite again
ABEND1: Write error
PWVFOK: ADDS #1, R3 ;Address + 1 → R3
CMP.W R2, R3 ;Last address?
BNE PREWRT ;If not last address, prewrite next address
; Execute erase
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 137 of 526
REJ09B0326-0600
ERASES: MOV.W #H'0000, R6 ;Erase-verify fail counter
MOV.W #H'd, R5 ;Set erase loop counter
ERASE: ADDS #1, R6 ;Erase-verify fail counter + 1 → R6
MOV.W #H'e5A, R4 ;
MOV.B R4L, @TCSRW:8 ;
MOV.B R4H, @TCW:8 ;
MOV.B #H'36, R4L ;
MOV.B R4L, @TCSRW:8 ;Start watchdog timer
MOV.W R5, R4 ;Set erase loop counter
BSET #1, @FLMCR:8 ;Set E bit
LOOPE: NOP
NOP
NOP
NOP
SUBS #1, R4 ;
MOV.W R4, R4 ;
BNE LOOPE ;Wait loop
BCLR #1, @FLMCR:8 ;Clear E bit
MOV.B #H'50, R4L ;
MOV.B R4L, @TCSRW:8 ;Stop watchdog timer
; Execute erase-verify
MOV.W R0, R3 ;Start address of block to be erased
MOV.B #H'b, R4H ;Set erase-verify loop counter
BSET #3, @FLMCR:8 ;Set EV bit
LOOPEV: DEC R4H ;
BNE LOOPEV ;Wait loop
EVR2: MOV.B #H'FF, R1H ;
MOV.B R1H, @R3 ;Dummy write
MOV.B #H'c, R4H ;Set erase-verify loop counter
LOOPDW: DEC R4H ;
BNE LOOPDW ;Wait loop
MOV.B @R3+, R1H ;Read
CMP.B #H'FF, R1H ;Read data = H'FF?
BNE RERASE ;If read data ≠ H'FF, branch to RERASE
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 138 of 526
REJ09B0326-0600
CMP.W R2, R3 ;Last address in block?
BNE EVR2 ;
BRA OKEND ;
RERASE: BCLR #3, @FLMCR:8 ;Clear EV bit
SUBS #1, R3 ;Erase-verify address – 1 → R3
MOV.W #H'0004, R4 ;
CMP.W R4, R6 ;Erase-verify fail count = 4?
BPL BRER ;If R6 ≥ 4. branch to BRER (branch until R6 = 4 – 602)
ADD.W R5, R5 ;If R6 < 4, double erase time (executed only for R6 = 1, 2, 3)
BRER: MOV.W #H'025A, R4 ;
CMP.W R4, R6 ;Erase-verify executed 602 times?
BNE ERASE ;If erase-verify not executed 602 times, erase again
BRA ABEND2 ;If erase-verify executed 602 times, branch to ABEND2
OKEND: BCLR #3, @FLMCR:8 ;Clear EV bit
MOV.B #H'00, R6L ;
MOV.B R6L, @EBR*:8 ;Clear EBR*
One block erased
ABEND2: Erase error
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 139 of 526
REJ09B0326-0600
Flowchart for Erasing Multiple Blocks
Start
End of erase Erase error
Set erase block register
(set bit for block to be erased to 1)
Write 0 data in all addresses to be
erased (prewrite)
*1
Select erase mode
(E bit = 1 in FLMCR)
n = 1
Wait (x) ms *5
Clear E bit Erasing halts
No No
No
NG
No
No
No
OK
Yes
Yes
Yes
Yes
Yes
Yes
Enable watchdog timer
*2
Disable watchdog timer
Wait (tvs1) µs *6
Dummy write to verify address
*3
(flash memory latches
address)
Set block start address as
verify address
Erase-verify
next block
Select erase-verify mode
(EV bit = 1 in FLMCR)
Wait (t
vs2
) µs
*6
Clear EBR bit for erase
block
Clear EV bit
Address + 1 → address
n + 1 → n
Erase-verify next block
Double the erase time
(x × 2 → x)
Verify
*4
(read data H'FF?)
Last address
of block?
Erase-verify
completed for all erase
blocks?
Erase-verify
completed for all erase
blocks?
All erase
blocks erased?
(EBR1 = EBR2 = 0?) n ≥ N?
*6
n ≥ 4?
Notes: 1. Program all addresses to be erased by
following the prewrite flowchart.
2. Set the timer overflow interval to the initial
value shown in table 6.13.
3. For the erase-verify dummy write, write
H'FF using a byte transfer instruction.
4. For the erase-verify operation, read the
data using a byte transfer instruction.
When erasing multiple blocks, clear the
erase block register bits for erased blocks
and perform additional erasing only for
unerased blocks.
5. Erase time x is successively incremented
to initial set value × 2
n–1
(n = 1 to 4), and
is fixed from the 4th time onward. An initial
value of 6.25 ms or less should be set,
and the time for one erasure should be 50
ms or less.
6. t
vs1
: 4 µs or more
t
vs2
: 2 µs or more
N: 602 (set N so that the total erase
time does not exceed 30 s)
Figure 6.16 Multiple-Block Erase Flowchart
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 140 of 526
REJ09B0326-0600
Sample Program for Erasing Multiple Blocks
This program uses the following registers:
R0: Used for erase block specification (set as explained below). Also stores address used in
prewrite and erase-verify.
R1H: Used to test bits 8 to 11 of R0. Stores read data; used in dummy write.
R1L: Used to test bits 0 to 11 of R0.
R2: Specifies address where address used in prewrite and erase-verify is stored.
R3: Stores address used in prewrite and erase-verify.
R4: Stores last address of block to be erased.
R5: Used for prewrite and erase loop counter value setting.
R6L: Used for prewrite-verify and erase-verify fail count.
Arbitrary blocks can be erased by setting bits in R0. R0 settings should be made by writing with a
word transfer instruction.
A bit map of R0 and a sample setting for erasing specific blocks are shown below.
Bit: 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R0 LB3 LB2 LB1 LB0 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
Corresponds to EBR1 Corresponds to EBR2
Note: Bits 15 to 12 should be cleared to 0.
Example: To erase blocks LB2, SB7, and SB0
Bit: 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R0 LB3 LB2 LB1 LB0 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
Corresponds to EBR1 Corresponds to EBR2
0 0 0 0 0 1 0 0 1 0 0 0 0 0 0 1
R0 is set as follows:
MOV.W #H'0481, R0
MOV.B R0H, @EBR1
MOV.B R0L, @EBR2
The values of #a, #b, #c, #d, and #e in the program depend on the operating frequency. They
should be set as indicated in tables 6.11 and 6.12.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 141 of 526
REJ09B0326-0600
Notes: 1. In this sample program, the stack pointer (SP) is set to address H'FF80. On-chip RAM
addresses H'FF7E and H'FF7F are used as a stack area. Therefore addresses H'FF7E
and H'FF7F should not be used when this program is executed, and on-chip RAM
should not be disabled.
2. It is assumed that this program, written in the ROM area, is transferred to the RAM
area and executed there. For #RAMSTR in the program, substitute the start address of
the RAM area to which the program is transferred. The value set for #RAMSTR must
be an even number.
FLMCR: .EQU H'FF80
EBR1: .EQU H'FF82
EBR2: .EQU H'FF83
TCSRW: .EQU H'FFBE
TCW: .EQU H'FFBF
STACK: .EQU H'FF80
.ALIGN 2
START: MOV.W #STACK, SP ;
Set stack pointer
; Set R0 value as explained on previous page. This sample program erases
; all blocks.
MOV.W #H'0FFF, R0 ;
Select blocks to be erased (R0: EBR1/EBR2)
MOV.B R0H, @EBR1 ; Set EBR1
MOV.B R0L, @EBR2 ;
Set EBR2
; #RAMSTR is start address of RAM area to which program is transferred
; Set #RAMSTR to even number
MOV.W #RAMSTR, R2 ;
Transfer destination start address (RAM)
MOV.W #ERVADR, R3 ;
ADD.W R3, R2 ;
#RAMSTR + #ERVADR → R2
MOV.W #START, R3 ;
SUB.W R3, R2 ; Address of data area used in RAM
MOV.B #H'00, R1L ; Used to test bit R1L in R0
PRETST: CMP.B #H'0C, R1L ;
R1L = H'0C?
BEQ ERASES ;
If finished checking all R0 bits, branch to ERASES
CMP.B #H'08, R1L ;
BMI EBR2PW ;
If R1L ≥ 8, EBR1 test; if R1L < 8, EBR2 test
MOV.B R1L, R1H ;
SUBX #H'08, R1H ;
R1L – 8 → R1H
BTST R1H, R0H ;
Test bit R1H in EBR1 (R0H)
BNE PREWRT ;
If bit R1H in EBR1 (R0H) is 1, branch to PREWRT
BRA PWADD1 ;
If bit R1H in EBR1 (R0H) is 0, branch to PWADD1
EBR2PW: BTST R1L, R0L ; Test bit R1L in EBR2 (R0L)
BNE PREWRT ;
If bit R1L in EBR2 (R0L) is 1, branch to PREWRT
PWADD1: INC R1L ; R1L + 1 → R1L
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 142 of 526
REJ09B0326-0600
MOV.W @R2+, R3 ; Dummy-increment R2
BRA PRETST ;
; Execute prewrite
PREWRT: MOV.W @R2+, R3 ; Prewrite start address
PREW: MOV.B #H'00, R6L ;
Prewrite-verify fail counter
MOV.W #H'a, R5 ;
Set prewrite loop counter
PREWRS: INC R6L ;
Prewrite-verify fail counter + 1 → R6H
MOV.B #H'00 R1H ;
MOV.B R1H, @R3 ;
Write H'00
MOV.W #H'FE5A, R4 ;
MOV.B R4L, @TCSRW:8 ;
MOV.B R4H, @TCW:8 ;
MOV.B #H'36, R4L ;
MOV.B R4L, @TCSRW:8 ;
Start watchdog timer
MOV.W R5, R4 ;
Set prewrite loop counter
BSET #0, @FLMCR:8 ;
Set P bit
LOOPR1: SUBS #1, R4 ;
MOV.W R4, R4 ;
BNE LOOPR1 ;
Wait loop
BCLR #0, @FLMCR:8 ;
Clear P bit
MOV.B #H'50, R4L ;
MOV.B R4L, @TCSRW:8 ; Stop watchdog timer
MOV.B #H'b, R4H ;
Set prewrite-verify loop counter
LOOPR2: DEC R4H ;
BNE LOOPR2 ;
Wait loop
MOV.B @R3, R1H ;
Read data = H'00?
BEQ PWVFOK ;
If read data = H'00, branch to PWVFOK
CMP.B #H'06, R6L ; Prewrite-verify executed 6 times?
BEQ ABEND1 ;
If prewrite-verify executed 6 times, branch to ABEND1
ADD.W R5, R5 ; Double the programming time
BRA PREWRS ;
Prewrite again
ABEND1: Write error
PWVFOK: ADDS #1, R3 ; Address + 1 → R3
MOV.W @R2, R4 ;
Start address of next block
CMP.W R4, R3 ;
Last address?
BNE PREW ;
If not last address, prewrite next address
PWADD2: INC R1L ; Used to test bit R1L +1 in R0
BRA PRETST ;
Branch to PRETST
; Execute erase
ERASES: MOV.W #H'0000, R6 ;
Erase-verify fail counter
MOV.W #H'd, R5 ;
Set erase loop counter
ERASE: ADDS #1, R6 ;
Erase-verify fail counter + 1 → R6
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 143 of 526
REJ09B0326-0600
MOV.W #H'e5A, R4 ;
MOV.B R4L, @TCSRW:8 ;
MOV.B R4H, @TCW:8 ;
MOV.B #H'36, R4L ;
MOV.B R4L, @TCSRW:8 ; Start watchdog timer
MOV.W R5, R4 ;
Set erase loop counter
BSET #1, @FLMCR:8 ;
Set E bit
LOOPE: NOP
NOP
NOP
NOP
SUBS #1, R4 ;
MOV.W R4, R4 ;
BNE LOOPE ;
Wait loop
BCLR #1, @FLMCR:8 ;
Clear E bit
MOV.B #H'50, R4L ;
MOV.B R4L, @TCSRW:8 ; Stop watchdog timer
; Execute erase-verify
EVR: MOV.W #RAMSTR, R2 ;
Transfer destination start address (RAM)
MOV.W #ERVADR, R3 ;
ADD.W R3, R2 ;
#RAMSTR + #ERVADR → R2
MOV.W #START, R3 ;
SUB.W R3, R2 ; Address of data area used in RAM
MOV.B #H'00, R1L ; Used to test bit R1L in R0
MOV.B #H'b, R4H ;
Set erase-verify loop counter
BSET #3, @FLMCR:8 ;
Set EV bit
LOOPEV: DEC R4H ;
BNE LOOPEV ; Wait loop
EBRTST: CMP.B #H'0C, R1L ;
R1L = H'0C?
BEQ HANTEI ;
If finished checking all R0 bits, branch to HANTEI
CMP.B #H'08, R1L ;
BMI EBR2EV ;
If R1L ≥ 8, EBR1 test; if R1L < 8, EBR2 test
MOV.B R1L, R1H ;
SUBX #H'08, R1H ;
R1L – 8 → R1H
BTST R1H, R0H ;
Test bit R1H in EBR1 (R0H)
BNE ERSEVF ;
If bit R1H in EBR1 (R0H) is 1, branch to ERSEVF
BRA ADD01 ; If bit R1H in EBR1 (R0H) is 0, branch to ADD01
EBR2EV: BTST R1L, R0L ; Test bit R1L in EBR2 (R0L)
BNE ERSEVF ;
If bit R1L in EBR2 (R0L) is 1, branch to ERSEVF
ADD01: INC R1L ; R1L + 1 → R1L
MOV.W @R2+, R3 ;
Dummy-increment R2
BRA EBRTST ;
ERASE1: BRA ERASE ;
Branch to ERASE via ERASE1
ERSEVF: MOV.W @R2+, R3 ;
Start address of block to be erase-verified
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 144 of 526
REJ09B0326-0600
EVR2: MOV.B #H'FF, R1H ;
MOV.B R1H, @R3 ;
Dummy write
MOV.B #H'c, R4H ;
Set erase-verify loop counter
LOOPEP: DEC R4H ;
BNE LOOPEP ; Wait loop
MOV.B @R3+, R1H ; Read
CMP.B #H'FF, R1H ;
Read data = H'FF?
BNE BLKAD ;
If read data ≠ H'FF, branch to BLKAD
MOV.W @R2, R4 ;
Start address of next block
CMP.W R4, R3 ;
Last address in block?
BNE EVR2 ;
CMP.B #H'08, R1L ;
BMI SBCLR ; If R1L ≥ 8, EBR1 test; if R1L < 8, EBR2 test
MOV.B R1L, R1H ;
SUBX #H'08, R1H ;
R1L – 8 → R1H
BCLR R1H, R0H ;
Clear bit R1H in EBR1 (R0H)
BRA BLKAD ;
SBCLR: BCLR R1L, R0L ;
Clear bit R1L in EBR2 (R0L)
BLKAD: INC R1L ;
R1L + 1 → R1L
BRA EBRTST ;
HANTEI: BCLR #3, @FLMCR:8 ;
Clear EV bit
MOV.B R0H, @EBR1:8 ;
MOV.B R0L, @EBR2:8 ;
MOV.W R0, R4 ;
BEQ EOWARI ;
If EBR1/EBR2 = all 0s, normal end of erase
MOV.W #H'0004, R4 ;
CMP.W R4, R6 ;
Erase-verify fail count = 4?
BPL BRER ;
If R6 ≥ 4. branch to BRER (branch until R6 = 4 – 602)
ADD.W R5, R5 ; If R6 < 4, double erase time (executed only for R6 = 1, 2, 3)
BRER: MOV.W #H'025A, R4 ;
CMP.W R4, R6 ;
Erase-verify executed 602 times?
BNE ERASE1 ; If erase-verify not executed 602 times, erase again
BRA ABEND2 ; If erase-verify executed 602 times, branch to ABEND2
;**** < Block address table used in erase-verify > ****
.ALIGN 2
ERVADR: .DATA.W H'0000 ; SB0
.DATA.W H'0080 ; SB1
.DATA.W H'0100 ; SB2
.DATA.W H'0180 ; SB3
.DATA.W H'0200 ; SB4
.DATA.W H'0400 ; SB5
.DATA.W H'0800 ; SB6
.DATA.W H'0C00 ; SB7
.DATA.W H'1000 ; LB0
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 145 of 526
REJ09B0326-0600
.DATA.W H'2000 ; LB1
.DATA.W H'4000 ; LB2
.DATA.W H'6000 ; LB3
.DATA.W H'8000 ; FLASH END
EOWARI: ;
End of erase
ABEND2: ;
Erase error
Loop Counter and Watchdog Timer Overflow Interval Settings in Programs: The settings of
#a, #b, #c, #d, and #e in the program examples depend on the clock frequency. Sample loop
counter settings for typical operating frequencies are shown in table 6.11. The value of #e should
be set as indicated in table 6.12.
As software loops are used, there is intrinsic error, and the calculated value and actual time may
not be the same. Therefore, initial values should be set so that the total write time does not exceed
1 ms, and the total erase time does not exceed 30 s.
The maximum number of writes in the program examples is set as N = 6.
Write and erase operations as shown in the flowcharts are achieved by setting the values of #a, #b,
#c, and #d in the program examples as indicated in table 6.11. Use the settings shown in table 6.12
for the value of #e.
In these sample programs, wait state insertion is disabled. If wait states are used, the setting should
be made after the end of the program.
The set value for the watchdog timer (WDT) overflow time is calculated on the basis of the
number of instructions including the write time and erase time from the time the watchdog timer is
started until it stops. Therefore, no other instructions should be added between starting and
stopping of the watchdog timer in these programs.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 146 of 526
REJ09B0326-0600
Table 6.11 Set Values of #a, #b, #c, and #d for Typical Operating Frequencies when
Sample Program Is Executed in On-Chip Memory (RAM)
Oscillation Frequency
f
OSC = 16 MHz fOSC = 10 MHz fOSC = 8 MHz fOSC = 2 MHz
Operating Frequency
φ
φφ
φ = 8 MHz φ
φφ
φ = 5 MHz φ
φφ
φ = 4 MHz φ
φφ
φ = 1 MHz
Meaning of Variable
Set Time
Counter Set
Value
Counter Set
Value
Counter Set
Value
Counter Set
Value
a (φ) Programming time
(initial set value)
15.8 µs H'000F H'0009 H'0007 H'0001
b (φ) tvs1 4 µs H'06 H'04 H'03 H'01
c (φ) tvs2 2 µs H'03 H'02 H'01 H'01
d (φ) Erase time (initial
set value)
6.25 ms H'0C34 H'07A1 H'061A H'0186
Formula:
If an operating frequency other than those shown in table 6.11 is used, the values can be calculated
using the formula shown below. The calculation is based on an operating frequency (φ) of 5 MHz.
For a (φ) and d (φ), after decimal calculation, round down the first decimal place and convert to
hexadecimal so that a (φ) and d (φ) are 15.8 µs or less and 6.25 ms or less, respectively.
For b (φ) and c (φ), after decimal calculation, round up the first decimal place and convert to
hexadecimal so that b (φ) and c (φ) are 4 µs or more and 2 µs or more, respectively.
Operating frequency φ [MHz]
5
a (φ) to d (φ) = × a (φ = 5) to d (φ = 5)
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 147 of 526
REJ09B0326-0600
Examples:
Sample calculations when executing a program in on-chip memory (RAM) at an operating
frequency of 6 MHz
a (φ) = × 9 = 10.8 ≈ 10 = H'000A
b (φ) = × 4 = 4.8 ≈ 5 = H'05
c (φ) = × 2 = 2.4 ≈ 3 = H'03
d (φ) = × 1953 = 2343.6 ≈ 2343 = H'0927
6
5
6
5
6
5
6
5
Table 6.12 Watchdog Timer Overflow Interval Settings (Set Value of #e for Operating
Frequencies)
Oscillation Frequency
f
OSC = 16 MHz fOSC = 10 MHz fOSC = 8 MHz fOSC = 2 MHz
Operating Frequency
Variable φ
φφ
φ = 8 MHz φ
φφ
φ = 5 MHz φ
φφ
φ = 4 MHz φ
φφ
φ = 1 MHz
e (φ) H'9B H'DF H'E5 H'F7
6.7.7 Prewrite-Verify Mode
Prewrite-verify mode is a verify mode used to all bits to equalize their threshold voltages before
erasure.
To program all bits, write H'00 in accordance with the prewrite algorithm shown in figure 6.15.
Use this procedure to set all data in the flash memory to H'00 after programming. After the
necessary programming time has elapsed, exit program mode (by clearing the P bit to 0) and select
prewrite-verify mode (leave the P, E, PV, and EV bits all cleared to 0). In prewrite-verify mode, a
prewrite-verify voltage is applied to the memory cells at the read address. If the flash memory is
read in this state, the data at the read address will be read. After selecting prewrite-verify mode,
wait at least 4 µs before reading.
Note: For a sample prewriting program, see the prewrite subroutine in the sample erasing
program.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 148 of 526
REJ09B0326-0600
6.7.8 Protect Modes
There are two modes for flash memory program/erase protection: hardware protection and
software protection. These two protection modes are described below.
Software Protection: With software protection, setting the P or E bit in the flash memory control
register (FLMCR) does not cause a transition to program mode or erase mode.
Details of software protection are given below.
Functions
Item Description Program Erase Verify*
Block
protect
Programming and erase protection can be
set for individual blocks by settings in the
erase block registers (EBR1 and EBR2).
Setting EBR1 to H'F0 and EBR2 to H'00
places all blocks in the program/erase-
protected state.
Disabled Disabled Enabled
Note: * Three modes: program-verify, erase-verify, and prewrite-verify.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 149 of 526
REJ09B0326-0600
Hardware Protection: Hardware protection refers to a state in which programming/erasing of
flash memory is forcibly suspended or disabled. At this time, the flash memory control register
(FLMCR) and erase block register (EBR1 and EBR2) settings are cleared.
Details of the hardware protection states are given below.
Functions
Item Description Program Erase Verify*1
Programming
voltage (FVPP)
protect
When 12 V is not being applied to the
FVPP pin, FLMCR, EBR1, and EBR2
are initialized, and the program/erase-
protected state is entered. To obtain
this protection, the VPP voltage should
not exceed the VCC power supply
voltage.*3
Disabled Disabled*2 Disabled
Reset/standby
protect
In a reset, (including a watchdog timer
reset), and in sleep, subsleep, watch,
and standby mode, FLMCR, EBR1,
and EBR2 are initialized, and the
program/erase-protected state is
entered. In a reset via the RES pin, the
reset state is not reliably entered
unless the RES pin is held low for at
least 20 ms (oscillation settling time)*4
after powering on. In the case of a
reset during operation, the RES pin
must be held low for a minimum of 10
system clock cycles (10φ).
Disabled Disabled*2 Disabled
Notes: 1. Three modes: program-verify, erase-verify, and prewrite-verify.
2. All blocks are erase-disabled, and individual block specification is not possible.
3. For details, see section 6.9, Flash Memory Programming and Erasing Precautions.
4. For details, see AC Characteristics in section 13, Electrical Characteristics.
6.7.9 Interrupt Handling during Flash Memory Programming/Erasing
If an interrupt is generated while the flash memory is being programmed or erased (while the P or
E bit is set in FLMCR), an operating state may be entered in which the vector will not be read
correctly in the exception handling sequence, resulting in program runaway. All interrupt sources
should therefore be masked to prevent interrupt generation while programming or erasing the flash
memory.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 150 of 526
REJ09B0326-0600
6.8 Flash Memory PROM Mode (H8/3644F, H8/3643F, and H8/3642AF)
6.8.1 PROM Mode Setting
The H8/3644F, H8/3643F, and H8/3642AF, in which the on-chip ROM is flash memory, have a
PROM mode as well as the on-board programming modes for programming and erasing flash
memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose
PROM programmer.
6.8.2 Memory Map
Figure 6.17 shows the memory map in PROM mode.
On-chip ROM area
H8/3644F PROM mode
H'0000
H'7FFF*
H'0000
H'7FFF*
H'1FFFF
MPU mode
Note: *This example applies to the H8/3644F. This address
is H'5FFF in the H8/3643F, and H'3FFF in the H8/3642AF.
“1” output
Figure 6.17 Memory Map in PROM Mode
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 151 of 526
REJ09B0326-0600
6.8.3 Operation in PROM Mode
The program/erase/verify specifications in PROM mode are the same as for the standard
HN28F101 flash memory. The H8/3644F, H8/3643F, and H8/3642AF do not have a device
recognition code, so the programmer cannot read the device name automatically. Table 6.13 shows
how the different operating modes are selected when using PROM mode.
Table 6.13 Operating Mode Selection in PROM Mode
Pins
Mode FVPP V
CC CE
CECE
CE
OE
OEOE
OE
WE
WEWE
WE
D7 to D0 A
16 to A0
Read Read VCC* V
CC L L H Data output Address input
Output disable VCC* V
CC L H H High impedance
Standby VCC* V
CC H X X High impedance
Command Read VPP V
CC L L H Data output
write Output disable VPP V
CC L H H High impedance
Standby VPP V
CC H X X High impedance
Write VPP V
CC L H L Data input
Legend:
L: Low level
H: High level
VPP: VPP level
VCC: VCC level
X: Don’t care
Note: * In these states, the FVPP pin must be set to VCC.
V
H: 11.5 V ≤ VH ≤ 12.5 V
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 152 of 526
REJ09B0326-0600
Table 6.14 PROM Mode Commands
1st Cycle 2nd Cycle
Command Cycles Mode Address Data Mode Address Data
Memory read 1 Write X H'00 Read RA Dout
Erase setup/erase 2 Write X H'20 Write X H'20
Erase-verify 2 Write EA H'A0 Read X EVD
Auto-erase setup/
auto-erase
2 Write X H'30 Write X H'30
Program setup/
program
2 Write X H'40 Write PA PD
Program-verify 2 Write X H'C0 Read X PVD
Reset 2 Write X H'FF Write X H'FF
Legend:
PA: Program address
EA: Erase-verify address
RA: Read address
PD: Program data
PVD: Program-verify output data
EVD: Erase-verify output data
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 153 of 526
REJ09B0326-0600
High-Speed, High-Reliability Programming: Unused areas of the flash memory in the
H8/3644F, H8/3643F, or H8/3642AF contain H'FF data (initial value). The flash memory uses a
high-speed, high-reliability programming procedure. This procedure provides higher programming
speed without subjecting the device to voltage stress and without sacrificing the reliability of the
programmed data.
Figure 6.18 shows the basic high-speed, high-reliability programming flowchart. Tables 6.15 and
6.16 list the electrical characteristics during programming.
Start
End Error
Set V
PP
= 12.0 V ±0.6 V
Address = 0
n = 0
n + 1 → n
Program setup command
NG
No
No Yes
OK
Yes
Program command
Wait (25 µs)
Program-verify command
Wait (6 µs)
Address + 1 → address
Set V
PP
= V
CC
Verify?
n = 20?
Last address?
Figure 6.18 High-Speed, High-Reliability Programming
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 154 of 526
REJ09B0326-0600
High-Speed, High-Reliability Erasing: The flash memory in the H8/3644F, H8/3643F, and
H8/3642AF uses a high-speed, high-reliability erasing procedure. This procedure provides higher
erasing speed without subjecting the device to voltage stress and without sacrificing the reliability
of data reliability.
Figure 6.19 shows the basic high-speed, high-reliability erasing flowchart. Tables 6.15 and 6.16
list the electrical characteristics during erasing.
Start
End Error
Program all bits to 0*
Address = 0
n = 0
n + 1 → n
Erase setup/erase command
Erase-verify command
NG
No
No Yes
OK
Yes
Wait (10 ms)
Wait (6 µs)
Address + 1 → address
Verify?
n = 3000?
Last address?
Note: * Follow the high-speed, high-reliability programming flowchart in programming all bits.
If 0 has already been written, perform programming for unprogrammed bits.
Figure 6.19 High-Speed, High-Reliability Erasing
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 155 of 526
REJ09B0326-0600
Table 6.15 DC Characteristics in PROM Mode
(Conditions: VCC = 5.0 V ±10%, VPP = 12.0 V ±0.6 V, VSS = 0 V, Ta = 25°C ±5°C)
Item Symbol Min Typ Max Unit Test Conditions
Input high
voltage
FO7 to FO0, FA16 to FA0,
OE, CE, WE
VIH 2.2 V
CC + 0.3 V
Input low
voltage
FO7 to FO0, FA16 to FA0,
OE, CE, WE
VIL –0.3 0.8 V
Output high
voltage
FO7 to FO0 V
OH 2.4 V IOH = –200 µA
Output low
voltage
FO7 to FO0 V
OL 0.45 V IOL = 1.6 mA
Input
leakage
current
FO7 to FO0, FA16 to FA0,
OE, CE, WE
| ILI | 2 µA Vin = 0 to VCC
VCC Read ICC 40 80 mA
current Program ICC 40 80 mA
Erase ICC 40 80 mA
FVPP Read IPP 10 µA VPP = 2.7 to 5.5 V
current 10 20 mA VPP = 12.6 V
Program IPP 20 40 mA VPP = 12.6 V
Erase IPP 20 40 mA VPP = 12.6 V
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 156 of 526
REJ09B0326-0600
Table 6.16 AC Characteristics in PROM Mode
(Conditions: VCC = 5.0 V ±10%, VPP = 12.0 V ±0.6 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Command write cycle tCWC 120 ns Figure 6.20
Address setup time tAS 0 ns Figure 6.21*
Address hold time tAH 60 ns Figure 6.22
Data setup time tDS 50 ns
Data hold time tDH 10 ns
CE setup time tCES 0 ns
CE hold time tCEH 0 ns
VPP setup time tVPS 100 ns
VPP hold time tVPH 100 ns
WE programming pulse width tWEP 70 ns
WE programming pulse high time tWEH 40 ns
OE setup time before command write tOEWS 0 ns
OE setup time before verify tOERS 6 µs
Verify access time tVA 500 ns
OE setup time before status polling tOEPS 120 ns
Status polling access time tSPA 120 ns
Program wait time tPPW 25 µs
Erase wait time tET 9 11 ms
Output disable time tDF 0 40 ns
Total auto-erase time tAET 0.5 30 s
Notes: The CE, OE, and WE pins should be driven high during transitions of VPP from 5 V to 12 V
and from 12 V to 5 V.
* Input pulse level: 0.45 V to 2.4 V
Input rise time and fall time ≤ 10 ns
Timing reference levels: 0.8 V and 2.0 V for input; 0.8 V and 2.0 V for output
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 157 of 526
REJ09B0326-0600
5.0 V
12 V
VCC
VPP 5.0 V tVPS
tCEH
tOEPS
Status polling
tCEH
tOEWS tWEP
tCES
tCES tCWC
tCES
tWEH
tDS tDS
tDH tDH tSPA
tDF
tWEP tAET
tVPH
Auto-erase setup Auto-erase
and status polling
I/O7
I/O0 to I/O6
Address
OE
WE
CE
Command
input
Command
input
Command
input
Command
input
Figure 6.20 Auto-Erase Timing
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 158 of 526
REJ09B0326-0600
5.0 V
12 V
V
CC
V
PP
5.0 V
Program setup Program Program-verify
I/O7
I/O0 to I/O6
Address
OE
WE
CE
Command
input Command
input Command
input
Valid data
output
Command
input Command
input Command
input
t
VPS
t
AH
t
VPH
t
AS
t
CWC
t
CES
t
WEP
t
PPW
t
WEP
t
DS
t
DH
t
CEH
t
OEWS
t
CEH
t
WEH
t
CES
t
CEH
t
WEP
t
OERS
t
VA
t
CES
t
DS
t
DH
t
DF
t
DS
t
DH
Valid address
Valid data
output
Note: Program-verify data output values maybe intermediate between 1 and 0 if programming is
insufficient.
Figure 6.21 High-Speed, High-Reliability Programming Timing
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 159 of 526
REJ09B0326-0600
5.0 V
12 V
V
CC
V
PP
5.0 V
Erase setup Erase Erase -verify
I/O0 to I/O7
Address
OE
WE
CE
Command
input
t
VPS
t
AS
t
AH
t
VPH
Valid data
output
Valid address
t
CES
t
CES
t
WEP
t
WEP
t
WEP
t
OERS
t
ET
t
WEH
t
VA
t
DF
t
CEH
t
DH
t
DS
t
OEWS
t
CWC
t
CEH
t
CES
t
CEH
t
DH
t
DS
t
DH
t
DS
Command
input Command
input
Note: Erase -verify data output values maybe intermediate between 1 and 0 if erasing is insufficient.
Figure 6.22 Erase Timing
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 160 of 526
REJ09B0326-0600
6.9 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming modes and PROM mode are
summarized below.
1. Program with the specified voltages and timing.
The rated programming voltage (VPP) of the flash memory is 12.0 V.
If the PROM programmer is set to Renesas HN28F101 specifications, VPP will be 12.0 V.
Applied voltages in excess of the rating can permanently damage the device. In particular,
insure that the peak overshoot of the PROM programmer does not exceed the maximum rating
of 13 V.
2. Before programming, check that the chip is correctly mounted in the PROM programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
3. Do not touch the socket adapter or chip while programming. Touching either of these can
cause contact faults and write errors.
4. Set H'FF as the PROM programmer buffer data for the following addresses:
H8/3644F: H'8000 to H'1FFFF
H8/3643F: H'6000 to H'1FFFF
H8/3642AF: H'4000 to H'1FFFF
The size of the PROM area is 32 kbytes in the H8/3644F, 24 kbytes in the H8/3643F, and 16
kbytes in the H8/3642AF. The addresses shown above always read H'FF, so if H'FF is not
specified as programmer data, a block error will occur.
5. Precautions in applying, releasing, and cutting*1 the programming voltage (VPP)
a. Apply the programming voltage (VPP) after VCC has stabilized, and release VPP before
cutting VCC.
To avoid programming or erasing flash memory by mistake, VPP should only be applied,
released, and cut when the MCU is in a “stable operating condition” as described below.
MCU stable operating condition
• The VCC voltage must be within the rated voltage range (VCC = 2.7 V to 5.5 V).
If the VPP voltage is applied, released, or cut while VCC is not within its rated voltage
range (VCC = 2.7 V to 5.5 V), since the MCU is unstable, the flash memory may be
programmed or erased by mistake. This can occur even if VCC = 0 V. Adequate power
supply measures should be taken, such as the insertion of a bypass capacitor, to prevent
fluctuation of the VCC power supply when VPP is applied.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 161 of 526
REJ09B0326-0600
• Oscillation must have stabilized (following the elapse of the oscillation settling time) or
be stopped.
When the VCC power is turned on, hold the RES pin low for the duration of the
oscillation settling time*2 (trc = 20 ms) before applying VPP.
• The MCU must be in the reset state, or in a state in which reset has ended normally
(reset has been released) and flash memory is not being accessed.
Apply or release VPP either in the reset state, or when the CPU is not accessing flash
memory (when a program in on-chip RAM or external memory is executing). Flash
memory data cannot be read normally at the instant when VPP is applied or released, so
do not read flash memory while VPP is being applied or released.
For a reset during operation, apply or release VPP only after the RES pin has been held
low for at least 10 system clock cycles (10φ).
• The P and E bits must be cleared in the flash memory control register (FLMCR).
When applying or releasing VPP, make sure that the P or E bit is not set by mistake.
• There must be no program runaway.
When VPP is applied, program execution must be supervised, e.g. by the watchdog
timer.
These power-on and power-off timing requirements for VCC and VPP should also be
satisfied in the event of a power failure and in recovery from a power failure. If these
requirements are not satisfied, overprogramming or overerasing may occur due to program
runaway, etc., which could cause memory cells to malfunction.
b. The VPP flag is set and cleared by a threshold decision on the voltage applied to the FVPP
pin. The threshold level is approximately in the range from VCC +2 V to 11.4 V.
When this flag is set, it becomes possible to write to the flash memory control register
(FLMCR) and the erase block registers (EBR1 and EBR2), even though the VPP voltage
may not yet have reached the programming voltage range of 12.0 V ±0.6 V.
Do not actually program or erase the flash memory until VPP has reached the programming
voltage range.
The programming voltage range for programming and erasing flash memory is 12.0 V ±0.6
V (11.4 V to 12.6 V). Programming and erasing cannot be performed correctly outside this
range. When not programming or erasing the flash memory, insure that the VPP voltage
does not exceed the VCC voltage. This will prevent unintentional programming and erasing.
Notes: 1. Definitions of VPP application, release, and cut-off are as follows:
Application: Raising the voltage from VCC to 12.0 V ±0.6 V
Release: Dropping the voltage from 12.0 V ±0.6 V to VCC
Cut-off: Halting voltage application (floating state)
2. The time depends on the resonator used; refer to the electrical characteristics.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 162 of 526
REJ09B0326-0600
tOSC1
3.0 to 5.5 V
12 ±0.6 V
12 ±0.6 V
VCC + 2 V to 11.4 V
VCCV
VCCV
φ
VCC
VPP
(boot mode)
Period during which flash memory access
is prohibited and VPP flag set/clear period
VPP
(user program
mode)
RES
0 µs min.
0 µs min.
Timing of boot
program branch
to RAM space
Min. 10 φ cycles
(When RES is low)
0 µs min.
0 to VCCV
0 to VCCV
Figure 6.23 VPP Power-On and Cut-Off Timing
6. Do not apply 12 V to the FVPP pin during normal operation.
To prevent erroneous programming or erasing due to program runaway, etc., apply 12 V to the
FVPP pin only when programming or erasing flash memory. If overprogramming or
overerasing occurs due to program runaway, etc., the memory cells may not operate normally.
A system configuration in which a high level is constantly applied to the FVPP pin should be
avoided. Also, while a high level is applied to the FVPP pin, the watchdog timer should be
activated to prevent overprogramming or overerasing due to program runaway, etc.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 163 of 526
REJ09B0326-0600
7. Design a current margin into the programming voltage (VPP) power supply.
Insure that VPP remains within the range 12.0 V ±0.6 V (11.4 V to 12.6 V) during
programming and erasing. Programming and erasing may become impossible outside this
range.
8. Insure that peak overshoot at the FVPP and TEST pins does not exceed the maximum rating.
Connect bypass capacitors as close as possible to the FVPP and TEST pins.
In boot mode start-up, also, bypass capacitors should be connected to the TEST pin in the same
way.
0.01 µF
FVPP
H8/3644F
1.0 µF
12 V
Figure 6.24 Example of VPP Power Supply Circuit Design
9. Use the recommended algorithms when programming and erasing flash memory.
The recommended algorithms enable programming and erasing to be carried out without
subjecting the device to voltage stress or sacrificing program data reliability. When setting the
program (P) or erase (E) bit in the flash memory control register (FLMCR), the watchdog
timer should be set beforehand to prevent the specified time from being exceeded.
10. For comments on interrupt handling while flash memory is being programmed or erased, see
section 6.7.9, Interrupt Handling during Flash Memory Programming/Erasing.
11. Notes on accessing flash memory control registers
a. Flash memory control register access state in each operating mode
The H8/3644F, H8/3643F, and H8/3642AF have flash memory control registers located at
addresses H'FF80 (FLMCR), H'FF82 (EBR1), and H'FF83 (EBR2). These registers can
only be accessed when 12 V is applied to the flash memory programming power supply
pin, FVPP.
b. To check for 12 V application/non-application in user mode
When address H'FF80 is accessed in user mode, if 12 V is being applied to FVPP, FLMCR
is read/written to, and its initial value after reset is H'80. When 12 V is not being applied to
FVPP, FLMCR is a reserved area that cannot be modified and always reads H'FF. Since bit
7 (corresponding to the VPP bit) is set to 1 at this time regardless of whether or not 12 V is
applied to FVPP, application or release of 12 V to FVPP cannot be determined simply from
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 164 of 526
REJ09B0326-0600
the 0 or 1 status of this bit. A byte data comparison is necessary to check whether 12V is
being applied. The relevant coding is shown below.
.
.
LABEL1: MOV.B @H'FF80, R1L
CMP.B #H'FF, R1L
BEQ LABEL1
.
.
.
Sample program for detection of 12 V application to FVPP (user
mode)
Table 6.17 Flash Memory DC Characteristics
VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
VPP = 12.0 V ±0.6 V
Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Typ Max Unit Test Conditions
High voltage (12 V)
application criterion
level*
FVPP, TEST VH V
CC + 2 11.4 V
FVPP current Read IPP 10 µA VPP = 2.7 to 5.5 V
10 20 mA VPP = 12.6 V
Program 20 40 mA
Erase 20 40 mA
Note: * The high voltage application criterion level is as shown in the table above, but a setting
of 12.0 V ±0.6 V should be made in boot mode and when programming and erasing
flash memory.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 165 of 526
REJ09B0326-0600
Table 6.18 Flash Memory AC Characteristics
VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
VPP = 12.0 V ±0.6 V
Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item Symbol Min Typ Max Unit Test Conditions
Programming time*1*2 t
P 50 1000 µs
Erase time*1*3 t
E 1 30 s
Reprogramming capability NWEC 100 Times
Verify setup time 1*1 t
VS1 4 µs
Verify setup time 2*1 t
VS2 2 µs
Flash memory read setup time*4 t
FRS 50 µs VCC ≥ 4.5 V
100 V
CC < 4.5 V
Notes: 1. Follow the program/erase algorithms shown in section 6 when making the settings.
2. Indicates the programming time per byte (the time during which the P bit is set in the
flash memory control register (FLMCR)). Does not include the program-verify time.
3. Indicates the time to erase all blocks (32 kB) (the time during which the E bit is set in
FLMCR). Does not include the prewrite time before erasing of the erase-verify time.
4. After powering on when using an external clock, when the programming voltage (VPP) is
switched from 12 V to VCC, an interval at least equal to the read setup time must be
allowed to elapse before reading the flash memory.
When VPP is released, this specifies the setup time from the point at which the VPP
voltage reaches the VCC + 2 V level until the flash memory is read.
Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 166 of 526
REJ09B0326-0600
Section 7 RAM
Rev. 6.00 Sep 12, 2006 page 167 of 526
REJ09B0326-0600
Section 7 RAM
7.1 Overview
The H8/3644 Group has 1 kbyte and 512 byte of high-speed static RAM on-chip. The RAM is
connected to the CPU by a 16-bit data bus, allowing high-speed 2-state access for both byte data
and word data.
7.1.1 Block Diagram
Figure 7.1 shows a block diagram of the on-chip RAM.
H'FF7E H'FF7F
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Even-numbered
address Odd-numbered
address
H'FF7E
H'FB82
H'FB80 H'FB80
H'FB82
H'FB81
H'FB83
On-chip RAM
Figure 7.1 RAM Block Diagram
Section 7 RAM
Rev. 6.00 Sep 12, 2006 page 168 of 526
REJ09B0326-0600
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 169 of 526
REJ09B0326-0600
Section 8 I/O Ports
8.1 Overview
The H8/3644 Group is provided with three 8-bit I/O ports, three 5-bit I/O ports, two 3-bit I/O
ports, and one 8-bit input-only port. Table 8.1 indicates the functions of each port.
Each port has of a port control register (PCR) that controls input and output, and a port data
register (PDR) for storing output data. Input or output can be assigned to individual bits.
See section 2.9.2, Notes on Bit Manipulation, for information on executing bit-manipulation
instructions to write data in PCR or PDR.
Block diagrams of each port are given in appendix C, I/O Port Block Diagrams.
Table 8.1 Port Functions
Port
Description
Pins
Other Functions
Function Switching
Register
Port 1 • 5-bit I/O port
• Input pull-up
MOS selectable
P17/IRQ3/TRGV
P16 to P15/
IRQ2 to IRQ1
External interrupt 3, timer
V trigger input
External interrupts 2 and 1
PMR1
P14/PWM 14-bit PWM output PMR1
P10/TMOW Timer A clock output PMR1
Port 2 • 3-bit I/O port P22/TxD SCI3 data output PMR7
P21/RxD SCI3 data input SCR3
P20/SCK1 SCI3 clock input/output SCR3, SMR
Port 3 • 3-bit I/O port
• Input pull-up
MOS selectable
P32/SO1
P31/SI1
P30/SCK1
SCI1 data output (SO1),
data input (SI1), clock
input/output (SCK1)
PMR3
Port 5 • 8-bit I/O port P57 /INT7 INT interrupt 7
• Input pull-up
MOS
P56 /INT6/
TMIB
INT interrupt 6
Timer B1 event input
P55/INT5/
ADTRG
INT interrupt 5
A/D converter external
trigger input
P54 to P50/
INT4 to INT0
INT interrupts 4 to 0
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 170 of 526
REJ09B0326-0600
Port
Description
Pins
Other Functions
Function Switching
Register
Port 6 • 8-bit I/O port
• High-current
port
P67 to P60
Port 7 • 5-bit I/O port P77
P76/TMOV Timer V compare-match
output
TCSRV
P75/TMCIV Timer V clock input
P74/TMRIV Timer V reset input
P73
Port 8 • 8-bit I/O port P87
P86/FTID Timer X input capture D
input
P85/FTIC Timer X input capture C
input
P84/FTIB Timer X input capture B
input
P83/FTIA Timer X input capture A
input
P82/FTOB Timer X output compare B
output
TOCR
P81/FTOA Timer X output compare A
output
TOCR
P80/FTCI Timer X clock input
Port 9 • 5-bit I/O port P90* to P94
Port B • 8-bit input port PB7 to PB0/
AN7 to AN0
A/D converter analog input
(AN7 to AN0)
Note: * There is no P90 function in the flash memory version since P90 is used as the FVPP pin.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 171 of 526
REJ09B0326-0600
8.2 Port 1
8.2.1 Overview
Port 1 is a 5-bit I/O port. Figure 8.1 shows its pin configuration.
P1 /IRQ /TRGV
P1 /IRQ
P1 /IRQ
P1 /PWM
P1 /TMOW
7
6
5
4
0
3
2
1
Port 1
Figure 8.1 Port 1 Pin Configuration
8.2.2 Register Configuration and Description
Table 8.2 shows the port 1 register configuration.
Table 8.2 Port 1 Registers
Name Abbr. R/W Initial Value Address
Port data register 1 PDR1 R/W H'00 H'FFD4
Port control register 1 PCR1 W H'00 H'FFE4
Port pull-up control register 1 PUCR1 R/W H'00 H'FFED
Port mode register 1 PMR1 R/W H'04 H'FFFC
Port Data Register 1 (PDR1)
Bit 7 6 5 4 3 2 1 0
P17 P16 P15 P14 P10
Initial value 0 0 0 0 0* 0
* 0
* 0
Read/Write R/W R/W R/W R/W R/W
Note: * Bits 3 to 1 are reserved; they are always read as 0 and cannot be modified.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 172 of 526
REJ09B0326-0600
PDR1 is an 8-bit register that stores data for port 1 pins P17 through P14 and P10. If port 1 is read
while PCR1 bits are set to 1, the values stored in PDR1 are read, regardless of the actual pin states.
If port 1 is read while PCR1 bits are cleared to 0, the pin states are read.
Upon reset, PDR1 is initialized to H'00.
Port Control Register 1 (PCR1)
Bit 7 6 5 4 3 2 1 0
PCR17 PCR16 PCR15 PCR14 PCR10
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W
PCR1 is an 8-bit register for controlling whether each of the port 1 pins P17 through P14 and P10
functions as an input pin or output pin. Setting a PCR1 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR1 and in
PDR1 are valid only when the corresponding pin is designated in PMR1 as a general I/O pin.
Upon reset, PCR1 is initialized to H'00.
PCR1 is a write-only register, which is always read as all 1s.
Port Pull-Up Control Register 1 (PUCR1)
Bit 7 6 5 4 3 2 1 0
PUCR17 PUCR16PUCR15PUCR14 PUCR10
Initial value 0 0 0 0 0* 0
* 0
* 0
Read/Write R/W R/W R/W R/W R/W
Note: * Bits 3 to 1 are reserved; they are always read as 0 and cannot be modified.
PUCR1 controls whether the MOS pull-up of each of the port 1 pins P17 through P14 and P10 is on
or off. When a PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the
MOS pull-up for the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR1 is initialized to H'00.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 173 of 526
REJ09B0326-0600
Port Mode Register 1 (PMR1)
Bit 7 6 5 4 3 2 1 0
IRQ3 IRQ2 IRQ1 PWM TMOW
Initial value 0 0 0 0 0 1 0 0
Read/Write R/W R/W R/W R/W R/W
PMR1 is an 8-bit read/write register, controlling the selection of pin functions for port 1 pins.
Upon reset, PMR1 is initialized to H'04.
Bit 7
P17/IRQ
IRQIRQ
IRQ3/TRGV Pin Function Switch (IRQ3): This bit selects whether pin
P17/IRQ3/TRGV is used as P17 or as IRQ3/TRGV.
Bit 7: IRQ3 Description
0 Functions as P17 I/O pin (initial value)
1 Functions as IRQ3/TRGV input pin
Note: Rising or falling edge sensing can be designated for IRQ3. Rising, falling, or both edge
sensing can be designated for TRGV. For details on TRGV settings, see section 9.4.2,
Register Descriptions.
Bit 6
P16/IRQ
IRQIRQ
IRQ2 Pin Function Switch (IRQ2): This bit selects whether pin P16/IRQ2 is used as
P16 or as IRQ2.
Bit 6: IRQ2 Description
0 Functions as P16 I/O pin (initial value)
1 Functions as IRQ2 input pin
Note: Rising or falling edge sensing can be designated for IRQ2.
Bit 5
P15/IRQ
IRQIRQ
IRQ1 Pin Function Switch (IRQ1): This bit selects whether pin P15/IRQ1 is used as
P15 or as IRQ1.
Bit 5: IRQ1 Description
0 Functions as P15 I/O pin (initial value)
1 Functions as IRQ1 input pin
Note: Rising or falling edge sensing can be designated for IRQ1.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 174 of 526
REJ09B0326-0600
Bit 4
P14/PWM Pin Function Switch (PWM): This bit selects whether pin P14/PWM is used
as P14 or as PWM.
Bit 4: PWM Description
0 Functions as P14 I/O pin (initial value)
1 Functions as PWM output pin
Bit 3
Reserved Bit: Bit 3 is reserved: it is always read as 0 and cannot be modified.
Bit 2
Reserved Bit: Bit 2 is reserved: it is always read as 1 and cannot be modified.
Bit 1
Reserved Bit: Bit 1 is reserved: it is always read as 0 and cannot be modified.
Bit 0
P10/TMOW Pin Function Switch (TMOW): This bit selects whether pin P10/TMOW is
used as P10 or as TMOW.
Bit 0: TMOW Description
0 Functions as P10 I/O pin (initial value)
1 Functions as TMOW output pin
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 175 of 526
REJ09B0326-0600
8.2.3 Pin Functions
Table 8.3 shows the port 1 pin functions.
Table 8.3 Port 1 Pin Functions
Pin Pin Functions and Selection Method
P17/IRQ3/TRGV The pin function depends on bit IRQ3 in PMR1 and bit PCR17 in PCR1.
IRQ3 0 1
PCR17 0 1 *
Pin function P17 input pin P17 output pin IRQ3/TRGV input pin
P16/IRQ2
P15/IRQ1
The pin function depends on bits IRQ2 and IRQ1 in PMR1 and bit PCR1n in
PCR1.
(m = n – 4, n = 6, 5)
IRQm 0 1
PCR1n 0 1 *
Pin function P1n input pin P1n output pin IRQm input pin
P14/PWM The pin function depends on bit PWM in PMR1 and bit PCR14 in PCR1.
PWM 0 1
PCR14 0 1 *
Pin function P14 input pin P14 output pin PWM output pin
P10/TMOW The pin function depends on bit TMOW in PMR1 and bit PCR10 in PCR1.
TMOW 0 1
PCR10 0 1 *
Pin function P10 input pin P10 output pin TMOW output pin
Legend: * Don’t care
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 176 of 526
REJ09B0326-0600
8.2.4 Pin States
Table 8.4 shows the port 1 pin states in each operating mode.
Table 8.4 Port 1 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P17/IRQ3/TRGV
P16/IRQ2
P15/IRQ1
P14/PWM
P10/TMOW
High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance*
Retains
previous
state
Functional Functional
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.2.5 MOS Input Pull-Up
Port 1 has a built-in MOS input pull-up function that can be controlled by software. When a PCR1
bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the MOS input pull-up for
that pin. The MOS input pull-up function is in the off state after a reset.
PCR1n 0 1
PUCR1n 0 1 *
MOS input pull-up Off On Off
Legend: * Don’t care
Note: n = 7 to 4, 0
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 177 of 526
REJ09B0326-0600
8.3 Port 2
8.3.1 Overview
Port 2 is a 3-bit I/O port, configured as shown in figure 8.2.
P2 /TXD
P2 /RXD
P2 /SCK
2
1
0
Port 2
3
Figure 8.2 Port 2 Pin Configuration
8.3.2 Register Configuration and Description
Table 8.5 shows the port 2 register configuration.
Table 8.5 Port 2 Registers
Name Abbr. R/W Initial Value Address
Port data register 2 PDR2 R/W H'00 H'FFD5
Port control register 2 PCR2 W H'00 H'FFE5
Port Data Register 2 (PDR2)
Bit 7 6 5 4 3 2 1 0
P22 P21 P20
Initial value 0* 0
* 0
* 0
* 0
* 0 0 0
Read/Write R/W R/W R/W
Note: * Bits 7 to 3 are reserved; they are always read as 0 and cannot be modified.
PDR2 is an 8-bit register that stores data for port 2 pins P22 to P20. If port 2 is read while PCR2
bits are set to 1, the values stored in PDR2 are read, regardless of the actual pin states. If port 2 is
read while PCR2 bits are cleared to 0, the pin states are read.
Upon reset, PDR2 is initialized to H'00.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 178 of 526
REJ09B0326-0600
Port Control Register 2 (PCR2)
Bit 7 6 5 4 3 2 1 0
PCR22 PCR21 PCR20
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W
PCR2 is an 8-bit register for controlling whether each of the port 1 pins P22 to P20 functions as an
input pin or output pin. Setting a PCR2 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR2 and PDR2 are valid only
when the corresponding pin is designated in SCR3 as a general I/O pin.
Upon reset, PCR2 is initialized to H'00.
PCR2 is a write-only register, which is always read as all 1s.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 179 of 526
REJ09B0326-0600
8.3.3 Pin Functions
Table 8.6 shows the port 2 pin functions.
Table 8.6 Port 2 Pin Functions
Pin Pin Functions and Selection Method
P22/TXD The pin function depends on bit TXD in PMR7 and bit PCR22 in PCR2.
TXD 0 1
PCR22 0 1 *
Pin function P22 input pin P22 output pin TXD output pin
P21/RXD The pin function depends on bit RE in SCR3 and bit PCR21 in PCR2.
RE 0 1
PCR21 0 1 *
Pin function P21 input pin P21 output pin RXD input pin
P20/SCK3 The pin function depends on bits CKE1 and CKE0 in SCR3, bit COM in SMR,
and bit PCR20 in PCR2.
CKE1 0 1
CKE0 0 1 *
COM 0 1 * *
PCR20 0 1 * *
Pin function P20 input pin P20 output pin SCK3 output
pin
SCK3 input pin
Legend: * Don’t care
8.3.4 Pin States
Table 8.7 shows the port 2 pin states in each operating mode.
Table 8.7 Port 2 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P22/TXD
P21/RXD
P20/SCK3
High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance
Retains
previous
state
Functional Functional
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 180 of 526
REJ09B0326-0600
8.4 Port 3
8.4.1 Overview
Port 3 is a 8-bit I/O port, configured as shown in figure 8.3.
P3 /SO
P3 /SI
P3 /SCK
2
1
0
Port 3
1
1
1
Figure 8.3 Port 3 Pin Configuration
8.4.2 Register Configuration and Description
Table 8.8 shows the port 3 register configuration.
Table 8.8 Port 3 Registers
Name Abbr. R/W Initial Value Address
Port data register 3 PDR3 R/W H'00 H'FFD6
Port control register 3 PCR3 W H'00 H'FFE6
Port pull-up control register 3 PUCR3 R/W H'00 H'FFEE
Port mode register 3 PMR3 R/W H'00 H'FFFD
Port mode register 7 PMR7 R/W H'F8 H'FFFF
Port Data Register 3 (PDR3)
Bit 7 6 5 4 3 2 1 0
P32 P31 P30
Initial value 0* 0
* 0
* 0
* 0
* 0 0 0
Read/Write R/W R/W R/W
Note: * Bits 7 to 3 are reserved; they are always read as 0 and cannot be modified.
PDR3 is an 8-bit register that stores data for port 3 pins P32 to P30. If port 3 is read while PCR3
bits are set to 1, the values stored in PDR3 are read, regardless of the actual pin states. If port 3 is
read while PCR3 bits are cleared to 0, the pin states are read.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 181 of 526
REJ09B0326-0600
Upon reset, PDR3 is initialized to H'00.
Port Control Register 3 (PCR3)
Bit 7 6 5 4 3 2 1 0
PCR32 PCR31 PCR30
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W
PCR3 is an 8-bit register for controlling whether each of the port 3 pins P32 to P30 functions as an
input pin or output pin. Setting a PCR3 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR3 and in PDR3 are valid only
when the corresponding pin is designated in PMR3 as a general I/O pin.
Upon reset, PCR3 is initialized to H'00.
PCR3 is a write-only register, which is always read as all 1s.
Port Pull-Up Control Register 3 (PUCR3)
Bit 7 6 5 4 3 2 1 0
PUCR32PUCR31 PUCR30
Initial value 0* 0
* 0
* 0
* 0
* 0 0 0
Read/Write R/W R/W R/W
Note: * Bits 7 to 3 are reserved; they are always read as 0 and cannot be modified.
PUCR3 controls whether the MOS pull-up of each of the port 3 pins P32 to P30 is on or off. When
a PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for
the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR3 is initialized to H'00.
Port Mode Register 3 (PMR3)
Bit 7 6 5 4 3 2 1 0
SO1 SI1 SCK1
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 182 of 526
REJ09B0326-0600
PMR3 is an 8-bit read/write register, controlling the selection of pin functions for port 3 pins.
Upon reset, PMR3 is initialized to H'00.
Bits 7 to 3
Reserved Bits: Bits 7 to 3 are reserved: they are always read as 0 and cannot be
modified.
Bit 2
P32/SO1 Pin Function Switch (SO1): This bit selects whether pin P32/SO1 is used as P32
or as SO1.
Bit 2: SO1 Description
0 Functions as P32 I/O pin (initial value)
1 Functions as SO1 output pin
Bit 1
P31/SI1 Pin Function Switch (SI1): This bit selects whether pin P31/SI1 is used as P31 or
as SI1.
Bit 1: SI1 Description
0 Functions as P31 I/O pin (initial value)
1 Functions as SI1 input pin
Bit 0
P30/SCK1 Pin Function Switch (SCK1): This bit selects whether pin P30/SCK1 is used
as P30 or as SCK1.
Bit 0: SCK1 Description
0 Functions as P30 I/O pin (initial value)
1 Functions as SCK1 I/O pin
Port Mode Register 7 (PMR7)
Bit 7 6 5 4 3 2 1 0
TXD POF1
Initial value 1 1 1 1 1 0 0 0
Read/Write R/W R/W
PMR7 is an 8-bit read/write register that turns the PMOS transistors of pins and P32/SO1 on and
off.
Upon reset, PMR7 is initialized to H'F8.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 183 of 526
REJ09B0326-0600
Bits 7 to 3
Reserved Bits: Bits 7 to 3 are reserved; they are always read as 1, and cannot be
modified.
Bit 2
P22/TXD Pin Function Switch (TXD): Bit 2 selects whether pin P22/TXD is used as P22
or as TXD.
Bit 2: TXD Description
0 Functions as P22 I/O pin (initial value)
1 Functions as TXD output pin
Bit 1
Reserved Bit: Bit 1 is reserved: it is always read as 0 and cannot be modified.
Bit 0
P32/SO1 Pin PMOS Control (POF1): This bit controls the PMOS transistor in the
P32/SO1 pin output buffer.
Bit 0: POF1 Description
0 CMOS output (initial value)
1 NMOS open-drain output
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 184 of 526
REJ09B0326-0600
8.4.3 Pin Functions
Table 8.9 shows the port 3 pin functions.
Table 8.9 Port 3 Pin Functions
Pin Pin Functions and Selection Method
P32/SO1 The pin function depends on bit SO1 in PMR3 and bit PCR32 in PCR3.
SO1 0 1
PCR32 0 1 *
Pin function P32 input pin P32 output pin SO1 output pin
P31/SI1 The pin function depends on bit SI1 in PMR3 and bit PCR31 in PCR3.
SI1 0 1
PCR31 0 1 *
Pin function P31 input pin P31 output pin SI1 input pin
P30/SCK1 The pin function depends on bit SCK1 in PMR3, bit CKS3 in SCR1, and bit
PCR30 in PCR3.
SCK1 0 1
CKS3 * 0 1
PCR30 0 1 * *
Pin function P30 input pin P30 output pin SCK1 output
pin
SCK1 input pin
Legend: * Don’t care
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 185 of 526
REJ09B0326-0600
8.4.4 Pin States
Table 8.10 shows the port 3 pin states in each operating mode.
Table 8.10 Port 3 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P32/SO1
P31/SI1
P30/SCK1
High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance*
Retains
previous
state
Functional Functional
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.4.5 MOS Input Pull-Up
Port 3 has a built-in MOS input pull-up function that can be controlled by software. When a PCR3
bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR3n 0 1
PUCR3n 0 1 *
MOS input pull-up Off On Off
Legend: * Don’t care
Note: n = 2 to 0
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 186 of 526
REJ09B0326-0600
8.5 Port 5
8.5.1 Overview
Port 5 is an 8-bit I/O port, configured as shown in figure 8.4.
P5
7
/INT
7
P5
6
/INT
6
/TMIB
P5
5
/INT
5
/ADTR
G
P5
4
/INT
4
P5
3
/INT
3
P5
2
/INT
2
P5
1
/INT
1
P5
0
/INT
0
Port 5
Figure 8.4 Port 5 Pin Configuration
8.5.2 Register Configuration and Description
Table 8.11 shows the port 5 register configuration.
Table 8.11 Port 5 Registers
Name Abbr. R/W Initial Value Address
Port data register 5 PDR5 R/W H'00 H'FFD8
Port control register 5 PCR5 W H'00 H'FFE8
Port pull-up control register 5 PUCR5 R/W H'00 H'FFEF
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 187 of 526
REJ09B0326-0600
Port Data Register 5 (PDR5)
Bit 7 6 5 4 3 2 1 0
P57 P56 P55 P54 P53 P52 P51 P50
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
PDR5 is an 8-bit register that stores data for port 5 pins P57 to P50. If port 5 is read while PCR5
bits are set to 1, the values stored in PDR5 are read, regardless of the actual pin states. If port 5 is
read while PCR5 bits are cleared to 0, the pin states are read.
Upon reset, PDR5 is initialized to H'00.
Port Control Register 5 (PCR5)
Bit 7 6 5 4 3 2 1 0
PCR57 PCR56 PCR55 PCR54 PCR53 PCR52 PCR51 PCR50
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W W W W
PCR5 is an 8-bit register for controlling whether each of the port 5 pins P57 to P50 functions as an
input pin or output pin. Setting a PCR5 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin.
Upon reset, PCR5 is initialized to H'00.
PCR5 is a write-only register, which is always read as all 1s.
Port Pull-Up Control Register 5 (PUCR5)
Bit 7 6 5 4 3 2 1 0
PUCR57 PUCR56PUCR55PUCR54PUCR53PUCR52PUCR51 PUCR50
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
PUCR5 controls whether the MOS pull-up of each port 5 pin is on or off. When a PCR5 bit is
cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for the
corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR5 is initialized to H'00.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 188 of 526
REJ09B0326-0600
8.5.3 Pin Functions
Table 8.12 shows the port 5 pin functions.
Table 8.12 Port 5 Pin Functions
Pin Pin Functions and Selection Method
P57/INT7 The pin function depends on bit PCR57 in PCR5.
PCR57 0 1
Pin function P57 input pin P57 output pin
INT7 input pin
P56/INT6/TMIB The pin function depends on bit PCR56 in PCR5.
PCR56 0 1
Pin function P56 input pin P56 output pin
INT6 input pin and TMIB input pin
P55/INT5/ The pin function depends on bit PCR55 in PCR5.
ADTRG PCR55 0 1
Pin function P55 input pin P55 output pin
INT5 input pin and ADTRG input pin
P54/INT4 to
P50/INT0
The pin function depends on bit PCR5n in PCR5.
(n = 4 to 0)
PCR5n 0 1
Pin function P5n input pin P5n output pin
INTn input pin
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 189 of 526
REJ09B0326-0600
8.5.4 Pin States
Table 8.13 shows the port 5 pin states in each operating mode.
Table 8.13 Port 5 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P57/INT7 to
P50/INT0
High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance*
Retains
previous
state
Functional Functional
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.5.5 MOS Input Pull-Up
Port 5 has a built-in MOS input pull-up function that can be controlled by software. When a PCR5
bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR5n 0 1
PUCR5n 0 1 *
MOS input pull-up Off On Off
Legend: * Don’t care
Note: n = 7 to 0
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 190 of 526
REJ09B0326-0600
8.6 Port 6
8.6.1 Overview
Port 6 is an 8-bit large-current I/O port, with a maximum sink current of 10 mA. The port 6 pin
configuration is shown in figure 8.5.
P6
7
P6
6
P6
5
P6
4
P6
3
P6
2
P6
1
P6
0
Port 6
Figure 8.5 Port 6 Pin Configuration
8.6.2 Register Configuration and Description
Table 8.14 shows the port 6 register configuration.
Table 8.14 Port 6 Registers
Name Abbr. R/W Initial Value Address
Port data register 6 PDR6 R/W H'00 H'FFD9
Port control register 6 PCR6 W H'00 H'FFE9
Port Data Register 6 (PDR6)
Bit 7 6 5 4 3 2 1 0
P67 P66 P65 P64 P63 P62 P61 P60
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 191 of 526
REJ09B0326-0600
PDR6 is an 8-bit register that stores data for port 6 pins P67 to P60.
When a bit in PCR6 is set to 1, if port 6 is read the value of the corresponding PDR6 bit is
returned directly regardless of the pin state. When a bit in PCR6 is cleared to 0, if port 6 is read the
corresponding pin state is read.
Upon reset, PDR6 is initialized to H'00.
Port Control Register 6 (PCR6)
Bit 7 6 5 4 3 2 1 0
PCR67 PCR66 PCR65 PCR64 PCR63 PCR62 PCR61 PCR60
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W W W W
PCR6 is an 8-bit register for controlling whether each of the port 6 pins P67 to P60 functions as an
input pin or output pin.
When a bit in PCR6 is set to 1, the corresponding pin of P67 to P60 becomes an output pin.
Upon reset, PCR6 is initialized to H'00.
PCR6 is a write-only register, which always reads all 1s.
8.6.3 Pin Functions
Table 8.15 shows the port 6 pin functions.
Table 8.15 Port 6 Pin Functions
Pin Pin Functions and Selection Method
P67 to P60 The pin function depends on bit PCR6n in PCR6
(n = 7 to 0)
PCR6n 0 1
Pin function P6n input pin P6n output pin
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 192 of 526
REJ09B0326-0600
8.6.4 Pin States
Table 8.16 shows the port 6 pin states in each operating mode.
Table 8.16 Port 6 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P67 toP60 High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance*
Retains
previous
state
Functional Functional
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.7 Port 7
8.7.1 Overview
Port 7 is a 8-bit I/O port, configured as shown in figure 8.6.
P7
7
P7
6
/TMOV
P7
5
/TMCIV
P7
4
/TMRIV
P7
3
Port 7
Figure 8.6 Port 7 Pin Configuration
8.7.2 Register Configuration and Description
Table 8.17 shows the port 7 register configuration.
Table 8.17 Port 7 Registers
Name Abbr. R/W Initial Value Address
Port data register 7 PDR7 R/W H'00 H'FFDA
Port control register 7 PCR7 W H'00 H'FFEA
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 193 of 526
REJ09B0326-0600
Port Data Register 7 (PDR7)
Bit 7 6 5 4 3 2 1 0
P77 P76 P75 P74 P73
Initial value 0 0 0 0 0 0* 0
* 0
*
Read/Write R/W R/W R/W R/W R/W
Note: * Bits 2 to 0 are reserved; they are always read as 0 and cannot be modified.
PDR7 is an 8-bit register that stores data for port 7 pins P77 to P73. If port 7 is read while PCR7
bits are set to 1, the values stored in PDR7 are read, regardless of the actual pin states. If port 7 is
read while PCR7 bits are cleared to 0, the pin states are read.
Upon reset, PDR7 is initialized to H'00.
Port Control Register 7 (PCR7)
Bit 7 6 5 4 3 2 1 0
PCR77 PCR76 PCR75 PCR74 PCR73
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W
PCR7 is an 8-bit register for controlling whether each of the port 7 pins P77 to P73 functions as an
input pin or output pin. Setting a PCR7 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin.
Upon reset, PCR7 is initialized to H'00.
PCR7 is a write-only register, which always reads as all 1s.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 194 of 526
REJ09B0326-0600
8.7.3 Pin Functions
Table 8.18 shows the port 7 pin functions.
Table 8.18 Port 7 Pin Functions
Pin Pin Functions and Selection Method
P77, P73 The pin function depends on bit PCR7n in PCR7.
(n = 7 or 3)
PCR7n 0 1
Pin function P7n input pin P7n output pin
P76/TMOV The pin function depends on bit PCR76 in PCR7 and bits OS3 to OS0 in
TCSRV.
OS3 to OS0 0000 Not 0000
PCR76 0 1 *
Pin function P76 input pin P76 output pin TMOV output pin
P75/TMCIV The pin function depends on bit PCR75 in PCR7.
PCR75 0 1
Pin function P75 input pin P75 output pin
TMCIV input pin
P74/TMRIV The pin function depends on bit PCR74 in PCR7.
PCR74 0 1
Pin function P74 input pin P74 output pin
TMRIV input pin
Legend: * Don’t care
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 195 of 526
REJ09B0326-0600
8.7.4 Pin States
Table 8.19 shows the port 7 pin states in each operating mode.
Table 8.19 Port 7 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P77 to P73 High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance
Retains
previous
state
Functional Functional
8.8 Port 8
8.8.1 Overview
Port 8 is an 8-bit I/O port configured as shown in figure 8.7.
P8
7
P8
6
/FTID
P8
5
/FTIC
P8
4
/FTIB
P8
3
//FTIA
P8
2
/FTOB
P8
1
/FTOA
P8
0
/FTCI
Port 8
Figure 8.7 Port 8 Pin Configuration
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 196 of 526
REJ09B0326-0600
8.8.2 Register Configuration and Description
Table 8.20 shows the port 8 register configuration.
Table 8.20 Port 8 Registers
Name Abbr. R/W Initial Value Address
Port data register 8 PDR8 R/W H'00 H'FFDB
Port control register 8 PCR8 W H'00 H'FFEB
Port Data Register 8 (PDR8)
Bit 7 6 5 4 3 2 1 0
P87 P86 P85 P84 P83 P82 P81 P80
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
PDR8 is an 8-bit register that stores data for port 8 pins P87 to P80. If port 8 is read while PCR8
bits are set to 1, the values stored in PDR8 are read, regardless of the actual pin states. If port 8 is
read while PCR8 bits are cleared to 0, the pin states are read.
Upon reset, PDR8 is initialized to H'00.
Port Control Register 8 (PCR8)
Bit 7 6 5 4 3 2 1 0
PCR87 PCR86 PCR85 PCR84 PCR83 PCR82 PCR81 PCR80
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W W W W
PCR8 is an 8-bit register for controlling whether each of the port 8 pins P87 to P80 functions as an
input or output pin. Setting a PCR8 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin.
Upon reset, PCR8 is initialized to H'00.
PCR8 is a write-only register, which is always read as all 1s.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 197 of 526
REJ09B0326-0600
8.8.3 Pin Functions
Table 8.21 shows the port 8 pin functions.
Table 8.21 Port 8 Pin Functions
Pin Pin Functions and Selection Method
P87 The pin function depends on bit PCR87 in PCR8.
PCR87 0 1
Pin function P87 input pin P87 output pin
P86/FTID The pin function depends on bit PCR86 in PCR8.
PCR86 0 1
Pin function P86 input pin P86 output pin
FTID input pin
P85/FTIC The pin function depends on bit PCR85 in PCR8.
PCR85 0 1
Pin function P85 input pin P85 output pin
FTIC input pin
P84/FTIB The pin function depends on bit PCR84 in PCR8.
PCR84 0 1
Pin function P84 input pin P84 output pin
FTIB input pin
P83/FTIA The pin function depends on bit PCR83 in PCR8.
PCR83 0 1
Pin function P83 input pin P83 output pin
FTIA input pin
P82/FTOB The pin function depends on bit PCR82 in PCR8 and bit OEB in TOCR.
OEB 0 1
PCR82 0 1 *
Pin function P82 input pin P82 output pin FTOB output pin
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 198 of 526
REJ09B0326-0600
Pin Pin Functions and Selection Method
P81/FTOA The pin function depends on bit PCR81 in PCR8 and bit OEA in TOCR.
OEA 0 1
PCR81 0 1 *
Pin function P81 input pin P81 output pin FTOA output pin
P80/FTCI The pin function depends on bit PCR80 in PCR8.
PCR80 0 1
Pin function P80 input pin P80 output pin
FTCI input pin
Legend: * Don’t care
8.8.4 Pin States
Table 8.22 shows the port 8 pin states in each operating mode.
Table 8.22 Port 8 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P87 to P80/FTCI High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance
Retains
previous
state
Functional Functional
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 199 of 526
REJ09B0326-0600
8.9 Port 9
8.9.1 Overview
Port 9 is a 5-bit I/O port, configured as shown in figure 8.8.
P9
P9
P9
P9
P9 *
4
3
2
1
0
Port 9
Note: * There is no P9
0
function in the flash memory version since P9
0
is used as the FV
PP
pin.
Figure 8.8 Port 9 Pin Configuration
8.9.2 Register Configuration and Description
Table 8.23 shows the port 9 register configuration.
Table 8.23 Port 9 Registers
Name Abbr. R/W Initial Value Address
Port data register 9 PDR9 R/W H'C0 H'FFDC
Port control register 9 PCR9 W H'C0 H'FFEC
Port Data Register 9 (PDR9)
Bit 7 6 5 4 3 2 1 0
P94 P93 P92 P91 P90*3
Initial value 1*1 1
*1 0
*2 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W
Notes: 1. Bits 7 to 6 are reserved; they are always read as 1 and cannot be modified.
2. Bit 5 is reserved; it is always read as 0 and cannot be modified.
3. In the on-chip flash memory version, this bit is always read as 0 and cannot be
modified.
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 200 of 526
REJ09B0326-0600
PDR9 is an 8-bit register that stores data for port 9 pins P94 to P90. If port 9 is read while PCR9
bits are set to 1, the values stored in PDR9 are read, regardless of the actual pin states. If port 9 is
read while PCR9 bits are cleared to 0, the pin states are read.
Upon reset, PDR9 is initialized to H'C0.
Port Control Register 9 (PCR9)
Bit 7 6 5 4 3 2 1 0
PCR94 PCR93 PCR92 PCR91 PCR90
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W
PCR9 controls whether each of the port 9 pins P94 to P90 functions as an input pin or output pin.
Setting a PCR9 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0
makes the pin an input pin.
Upon reset, PCR9 is initialized to H'C0.
PCR9 is a write-only register, which is always reads as all 1.
8.9.3 Pin Functions
Table 8.24 shows the port 9 pin functions.
Table 8.24 Port 9 Pin Functions
Pin Pin Functions and Selection Method
P9n The pin function depends on bit PCR9n in PCR9.
(n = 4 to 0)
PCR9n 0 1
Pin function P9n input pin P9n output pin
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 201 of 526
REJ09B0326-0600
8.9.4 Pin States
Table 8.25 shows the port 9 pin states in each operating mode.
Table 8.25 Port 9 Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
P94 to P90 High-
impedance
Retains
previous
state
Retains
previous
state
High-
impedance
Retains
previous
state
Functional Functional
8.10 Port B
8.10.1 Overview
Port B is an 8-bit input-only port, configured as shown in figure 8.9.
PB /AN
PB /AN
PB /AN
PB /AN
PB /AN
PB /AN
PB /AN
PB /AN
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Port B
Figure 8.9 Port B Pin Configuration
8.10.2 Register Configuration and Description
Table 8.26 shows the port B register configuration.
Table 8.26 Port B Register
Name Abbr. R/W Address
Port data register B PDRB R H'FFDD
Section 8 I/O Ports
Rev. 6.00 Sep 12, 2006 page 202 of 526
REJ09B0326-0600
Port Data Register B (PDRB)
Bit 7 6 5 4 3 2 1 0
PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
Read/Write R R R R R R R R
Reading PDRB always gives the pin states. However, if a port B pin is selected as an analog input
channel for the A/D converter by AMR bits CH3 to CH0, that pin reads 0 regardless of the input
voltage.
8.10.3 Pin Functions
Table 8.27 shows the port B pin functions.
Table 8.27 Port B Pin Functions
Pin Pin Functions and Selection Method
PBn/ANn Always as below.
(n = 7 to 0)
Pin function PBn input pin or ANn input pin
8.10.4 Pin States
Table 8.28 shows the port B pin states in each operating mode.
Table 8.28 Port B Pin States
Pins Reset Sleep Subsleep Standby Watch Subactive Active
PBn/ANn High-
impedance
High-
impedance
High-
impedance
High-
impedance
High-
impedance
High-
impedance
High-
impedance
(n = 7 to 0)
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 203 of 526
REJ09B0326-0600
Section 9 Timers
9.1 Overview
The H8/3644 Group provides five timers: timers A, B1, V, X, and a watchdog timer. The
functions of these timers are outlined in table 9.1.
Table 9.1 Timer Functions
Name
Functions
Internal Clock
Event
Input Pin
Waveform
Output Pin
Remarks
Timer A 8-bit timer
• Interval function φ/8 to φ/8192
(8 choices)
• Time base φW/128
(choice of 4
overflow periods)
• Clock output φ/4 to φ/32
φW/4 to φW/32
(8 choices)
TMOW
Timer B1 • 8-bit timer
• Interval timer
• Event counter
φ/4 to φ/8192
(7 choices)
TMIB
Timer V • 8-bit timer
• Event counter
• Output control by dual
compare match
• Counter clearing option
• Count-up start by
external trigger input can
be specified
φ/4 to φ/128
(6 choices)
TMCIV TMOV
Timer X • 16-bit free-running timer
• 2 output compare
channels
• 4 input capture channels
• Counter clearing option
• Event counter
φ/2 to φ/32
(3 choices)
FTCI
FTIA
FTIB
FTIC
FTID
FTOA
FTOB
Watchdog
timer
• Reset signal generated
when 8-bit counter
overflows
φ/8192
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 204 of 526
REJ09B0326-0600
9.2 Timer A
9.2.1 Overview
Timer A is an 8-bit timer with interval timing and real-time clock time-base functions. The clock
time-base function is available when a 32.768-kHz crystal resonator is connected. A clock signal
divided from 32.768 kHz or from the system clock can be output at the TMOW pin.
Features
Features of timer A are given below.
• Choice of eight internal clock sources (φ/8192, φ/4096, φ/2048, φ/512, φ/256, φ/128, φ/32,
φ/8).
• Choice of four overflow periods (1 s, 0.5 s, 0.25 s, 31.25 ms) when timer A is used as a clock
time base (using a 32.768 kHz crystal resonator).
• An interrupt is requested when the counter overflows.
• Any of eight clock signals can be output from pin TMOW: 32.768 kHz divided by 32, 16, 8, or
4 (1 kHz, 2 kHz, 4 kHz, 8 kHz), or the system clock divided by 32, 16, 8, or 4.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 205 of 526
REJ09B0326-0600
Block Diagram
Figure 9.1 shows a block diagram of timer A.
φPSW
Internal data bus
PSS
Legend:
TMOW
1/4 TMA
TCA
φ /32
φ /16
φ /8
φ /4
W
W
W
W
φ/32
φ/16
φ/8
φ/4
φ /128
W
φ/8192, φ/4096, φ/2048,
φ/512, φ/256, φ/128,
φ/32, φ/8
IRRTA
÷8*
÷64*
÷128*
÷256*
φ /4
W
TMA:
TCA:
IRRTA:
PSW:
PSS:
Note: * Can be selected only when the prescaler W output (φ
W
/128) is used as the TCA input clock.
Timer mode register A
Timer counter A
Timer A overflow interrupt request flag
Prescaler W
Prescaler S
W
φ
Figure 9.1 Block Diagram of Timer A
Pin Configuration
Table 9.2 shows the timer A pin configuration.
Table 9.2 Pin Configuration
Name Abbr. I/O Function
Clock output TMOW Output Output of waveform generated by timer A output
circuit
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 206 of 526
REJ09B0326-0600
Register Configuration
Table 9.3 shows the register configuration of timer A.
Table 9.3 Timer A Registers
Name Abbr. R/W Initial Value Address
Timer mode register A TMA R/W H'10 H'FFB0
Timer counter A TCA R H'00 H'FFB1
9.2.2 Register Descriptions
Timer Mode Register A (TMA)
Bit 7 6 5 4 3 2 1 0
TMA7 TMA6 TMA5 TMA3 TMA2 TMA1 TMA0
Initial value 0 0 0 1 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W
TMA is an 8-bit read/write register for selecting the prescaler, input clock, and output clock.
Upon reset, TMA is initialized to H'10.
Bits 7 to 5
Clock Output Select (TMA7 to TMA5): Bits 7 to 5 choose which of eight clock
signals is output at the TMOW pin. The system clock divided by 32, 16, 8, or 4 can be output in
active mode and sleep mode. A 32.768 kHz signal divided by 32, 16, 8, or 4 can be output in
active mode, sleep mode, and subactive mode.
Bit 7: TMA7 Bit 6: TMA6 Bit 5: TMA5 Clock Output
0 0 0 φ/32 (initial value)
1 φ/16
1 0 φ/8
1 φ/4
1 0 0 φW/32
1 φW/16
1 0 φW/8
1 φW/4
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 207 of 526
REJ09B0326-0600
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Bits 3 to 0
Internal Clock Select (TMA3 to TMA0): Bits 3 to 0 select the clock input to TCA.
The selection is made as follows.
Description
Bit 3:
TMA3
Bit 2:
TMA2
Bit 1:
TMA1
Bit 0:
TMA0
Prescaler and Divider Ratio
or Overflow Period
Function
0 0 0 0 PSS, φ/8192 (initial value) Interval timer
1 PSS, φ/4096
1 0 PSS, φ/2048
1 PSS, φ/512
1 0 0 PSS, φ/256
1 PSS, φ/128
1 0 PSS, φ/32
1 PSS, φ/8
1 0 0 0 PSW, 1 s Clock time base
1 PSW, 0.5 s
1 0 PSW, 0.25 s
1 PSW, 0.03125 s
1 0 0 PSW and TCA are reset
1
1 0
1
Timer Counter A (TCA)
Bit 7 6 5 4 3 2 1 0
TCA7 TCA6 TCA5 TCA4 TCA3 TCA2 TCA1 TCA0
Initial value 0 0 0 0 0 0 0 0
Read/Write R R R R R R R R
TCA is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMA3 to TMA0 in timer mode register A
(TMA). TCA values can be read by the CPU in active mode, but cannot be read in subactive
mode. When TCA overflows, the IRRTA bit in interrupt request register 1 (IRR1) is set to 1.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 208 of 526
REJ09B0326-0600
TCA is cleared by setting bits TMA3 and TMA2 of TMA to 11.
Upon reset, TCA is initialized to H'00.
9.2.3 Timer Operation
Interval Timer Operation: When bit TMA3 in timer mode register A (TMA) is cleared to 0,
timer A functions as an 8-bit interval timer.
Upon reset, TCA is cleared to H'00 and bit TMA3 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer A is selected by bits TMA2 to TMA0 in
TMA; any of eight internal clock signals output by prescaler S can be selected.
After the count value in TCA reaches H'FF, the next clock signal input causes timer A to
overflow, setting bit IRRTA to 1 in interrupt request register 1 (IRR1). If IENTA = 1 in interrupt
enable register 1 (IENR1), a CPU interrupt is requested.*
At overflow, TCA returns to H'00 and starts counting up again. In this mode timer A functions as
an interval timer that generates an overflow output at intervals of 256 input clock pulses.
Note: * For details on interrupts, see section 3.3, Interrupts.
Real-Time Clock Time Base Operation: When bit TMA3 in TMA is set to 1, timer A functions
as a real-time clock time base by counting clock signals output by prescaler W. The overflow
period of timer A is set by bits TMA1 and TMA0 in TMA. A choice of four periods is available.
In time base operation (TMA3 = 1), setting bit TMA2 to 1 clears both TCA and prescaler W to
their initial values of H'00.
Clock Output: Setting bit TMOW in port mode register 1 (PMR1) to 1 causes a clock signal to be
output at pin TMOW. Eight different clock output signals can be selected by means of bits TMA7
to TMA5 in TMA. The system clock divided by 32, 16, 8, or 4 can be output in active mode and
sleep mode. A 32.768 kHz signal divided by 32, 16, 8, or 4 can be output in active mode, sleep
mode, and subactive mode.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 209 of 526
REJ09B0326-0600
9.2.4 Timer A Operation States
Table 9.4 summarizes the timer A operation states.
Table 9.4 Timer A Operation States
Operation Mode
Reset
Active
Sleep
Watch
Sub-
active
Sub-
sleep
Standby
TCA Interval Reset Functions Functions Halted Halted Halted Halted
Clock time base Reset Functions Functions Functions Functions Functions Halted
TMA Reset Functions Retained Retained Functions Retained Retained
Note: When the real-time clock time base function is selected as the internal clock of TCA in
active mode or sleep mode, the internal clock is not synchronous with the system clock, so
it is synchronized by a synchronizing circuit. This may result in a maximum error of 1/φ (s) in
the count cycle.
9.3 Timer B1
9.3.1 Overview
Timer B1 is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operation modes, interval and auto reload.
Features
Features of timer B1 are given below.
• Choice of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, φ/4) or an
external clock (can be used to count external events).
• An interrupt is requested when the counter overflows.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 210 of 526
REJ09B0326-0600
Block Diagram
Figure 9.2 shows a block diagram of timer B1.
PSS
TMB1
TCB1
TLB1
φ
TMIB
Legend:
IRRTB1
TMB1:
TCB1:
TLB1:
IRRTB1:
PSS:
Timer mode register B1
Timer counter B1
Timer load register B1
Timer B1 interrupt request flag
Prescaler S
Internal data bus
Figure 9.2 Block Diagram of Timer B1
Pin Configuration
Table 9.5 shows the timer B1 pin configuration.
Table 9.5 Pin Configuration
Name Abbr. I/O Function
Timer B1 event input TMIB Input Event input to TCB1
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 211 of 526
REJ09B0326-0600
Register Configuration
Table 9.6 shows the register configuration of timer B1.
Table 9.6 Timer B1 Registers
Name Abbr. R/W Initial Value Address
Timer mode register B1 TMB1 R/W H'78 H'FFB2
Timer counter B1 TCB1 R H'00 H'FFB3
Timer load register B1 TLB1 W H'00 H'FFB3
9.3.2 Register Descriptions
Timer Mode Register B1 (TMB1)
Bit 7 6 5 4 3 2 1 0
TMB17 TMB12 TMB11 TMB10
Initial value 0 1 1 1 1 0 0 0
Read/Write R/W R/W R/W R/W
TMB1 is an 8-bit read/write register for selecting the auto-reload function and input clock.
Upon reset, TMB1 is initialized to H'78.
Bit 7
Auto-Reload Function Select (TMB17): Bit 7 selects whether timer B1 is used as an
interval timer or auto-reload timer.
Bit 7: TMB17 Description
0 Interval timer function selected (initial value)
1 Auto-reload function selected
Bits 6 to 3
Reserved Bits: Bits 6 to 3 are reserved; they are always read as 1, and cannot be
modified.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 212 of 526
REJ09B0326-0600
Bits 2 to 0
Clock Select (TMB12 to TMB10): Bits 2 to 0 select the clock input to TCB1. For
external event counting, either the rising or falling edge can be selected.
Bit 2: TMB12 Bit 1: TMB11 Bit 0: TMB10 Description
0 0 0 Internal clock: φ/8192 (initial value)
1 Internal clock: φ/2048
1 0 Internal clock: φ/512
1 Internal clock: φ/256
1 0 0 Internal clock: φ/64
1 Internal clock: φ/16
1 0 Internal clock: φ/4
1 External event (TMIB): rising or falling edge*
Note: * The edge of the external event signal is selected by bit INTEG6 in interrupt edge select
register 2 (IEGR2). See section 3.3.2, Interrupt Control Registers, for details.
Timer Counter B1 (TCB1)
Bit 7 6 5 4 3 2 1 0
TCB17 TCB16 TCB15 TCB14 TCB13 TCB12 TCB11 TCB10
Initial value 0 0 0 0 0 0 0 0
Read/Write R R R R R R R R
TCB1 is an 8-bit read-only up-counter, which is incremented by internal clock or external event
input. The clock source for input to this counter is selected by bits TMB12 to TMB10 in timer
mode register B1 (TMB1). TCB1 values can be read by the CPU at any time.
When TCB1 overflows from H'FF to H'00 or to the value set in TLB1, the IRRTB1 bit in IRR1 is
set to 1.
TCB1 is allocated to the same address as TLB1.
Upon reset, TCB1 is initialized to H'00.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 213 of 526
REJ09B0326-0600
Timer Load Register B1 (TLB1)
Bit 7 6 5 4 3 2 1 0
TLB17 TLB16 TLB15 TLB14 TLB13 TLB12 TLB11 TLB10
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W W W W
TLB1 is an 8-bit write-only register for setting the reload value of timer counter B1 (TCB1).
When a reload value is set in TLB1, the same value is loaded into timer counter B1 (TCB1) as
well, and TCB1 starts counting up from that value. When TCB1 overflows during operation in
auto-reload mode, the TLB1 value is loaded into TCB1. Accordingly, overflow periods can be set
within the range of 1 to 256 input clocks.
The same address is allocated to TLB1 as to TCB1.
Upon reset, TLB1 is initialized to H'00.
9.3.3 Timer Operation
Interval Timer Operation: When bit TMB17 in timer mode register B1 (TMB1) is cleared to 0,
timer B1 functions as an 8-bit interval timer.
Upon reset, TCB1 is cleared to H'00 and bit TMB17 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer B1 is selected from seven internal clock
signals output by prescaler S, or an external clock input at pin TMIB. The selection is made by bits
TMB12 to TMB10 of TMB1.
After the count value in TCB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow, setting bit IRRTB1 to 1 in interrupt request register 1 (IRR1). If IENTB1 = 1 in
interrupt enable register 1 (IENR1), a CPU interrupt is requested.*
At overflow, TCB1 returns to H'00 and starts counting up again.
During interval timer operation (TMB17 = 0), when a value is set in timer load register B1
(TLB1), the same value is set in TCB1.
Note: * For details on interrupts, see section 3.3, Interrupts.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 214 of 526
REJ09B0326-0600
Auto-Reload Timer Operation: Setting bit TMB17 in TMB1 to 1 causes timer B1 to function as
an 8-bit auto-reload timer. When a reload value is set in TLB1, the same value is loaded into
TCB1, becoming the value from which TCB1 starts its count.
After the count value in TCB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow. The TLB1 value is then loaded into TCB1, and the count continues from that value. The
overflow period can be set within a range from 1 to 256 input clocks, depending on the TLB1
value.
The clock sources and interrupts in auto-reload mode are the same as in interval mode.
In auto-reload mode (TMB17 = 1), when a new value is set in TLB1, the TLB1 value is also set in
TCB1.
Event Counter Operation: Timer B1 can operate as an event counter, counting rising or falling
edges of an external event signal input at pin TMIB. External event counting is selected by setting
bits TMB12 to TMB10 in timer mode register B1 (TMB1) to all 1s (111).
When timer B1 is used to count external event input, bit INTEN6 in IENR3 should be cleared to 0
to disable INT6 interrupt requests.
9.3.4 Timer B1 Operation States
Table 9.7 summarizes the timer B1 operation states.
Table 9.7 Timer B1 Operation States
Operation Mode
Reset
Active
Sleep
Watch
Sub-
active
Sub-
sleep
Standby
TCB1 Interval Reset Functions Functions Halted Halted Halted Halted
Auto reload Reset Functions Functions Halted Halted Halted Halted
TMB1 Reset Functions Retained Retained Retained Retained Retained
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 215 of 526
REJ09B0326-0600
9.4 Timer V
9.4.1 Overview
Timer V is an 8-bit timer based on an 8-bit counter. Timer V counts external events. Also compare
match signals can be used to reset the counter, request an interrupt, or output a pulse signal with an
arbitrary duty cycle. Counting can be initiated by a trigger input at the TRGV pin, enabling pulse
output control to be synchronized to the trigger, with an arbitrary delay from the trigger input.
Features
Features of timer V are given below.
• Choice of six internal clock sources (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) or an external clock (can
be used as an external event counter).
• Counter can be cleared by compare match A or B, or by an external reset signal. If the count
stop function is selected, the counter can be halted when cleared.
• Timer output is controlled by two independent compare match signals, enabling pulse output
with an arbitrary duty cycle, PWM output, and other applications.
• Three interrupt sources: two compare match, one overflow
• Counting can be initiated by trigger input at the TRGV pin. The rising edge, falling edge, or
both edges of the TRGV input can be selected.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 216 of 526
REJ09B0326-0600
Block Diagram
Figure 9.3 shows a block diagram of timer V.
TRGV
TMCIV
φ
TMRIV
TMOV
CMIA
CMIB
OVI
Internal data bus
Trigger
control Comparator
Clock select
Comparator
Clear control
Interrupt
request
control
Output
control
Time constant register A
Time constant register B
Timer counter V
Timer control/status register V
Timer control register V0
Timer control register V1
Prescaler S
Compare-match interrupt A
Compare-match interrupt B
Overflow interrupt
Legend:
TCORA:
TCORB:
TCNTV:
TCSRV:
TCRV0:
TCRV1:
PSS:
CMIA:
CMIB:
OVI:
PSS
TCRV1
TCORB
TCNTV
TCORA
TCRV0
TCSRV
Figure 9.3 Block Diagram of Timer V
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 217 of 526
REJ09B0326-0600
Pin Configuration
Table 9.8 shows the timer V pin configuration.
Table 9.8 Pin Configuration
Name Abbr. I/O Function
Timer V output TMOV Output Timer V waveform output
Timer V clock input TMCIV Input Clock input to TCNTV
Timer V reset input TMRIV Input External input to reset TCNTV
Trigger input TRGV Input Trigger input to initiate counting
Register Configuration
Table 9.9 shows the register configuration of timer V.
Table 9.9 Timer V Registers
Name Abbr. R/W Initial Value Address
Timer control register V0 TCRV0 R/W H'00 H'FFB8
Timer control/status register V TCSRV R/(W)* H'10 H'FFB9
Time constant register A TCORA R/W H'FF H'FFBA
Time constant register B TCORB R/W H'FF H'FFBB
Timer counter V TCNTV R/W H'00 H'FFBC
Timer control register V1 TCRV1 R/W H'E2 H'FFBD
Note: * Bits 7 to 5 can only be written with 0, for flag clearing.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 218 of 526
REJ09B0326-0600
9.4.2 Register Descriptions
Timer Counter V (TCNTV)
Bit 7 6 5 4 3 2 1 0
TCNTV7 TCNTV6TCNTV5TCNTV4TCNTV3TCNTV2TCNTV1 TCNTV0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
TCNTV is an 8-bit read/write up-counter which is incremented by internal or external clock input.
The clock source is selected by bits CKS2 to CKS0 in TCRV0. The TCNTV value can be read and
written by the CPU at any time. TCNTV can be cleared by an external reset signal, or by compare
match A or B. The clearing signal is selected by bits CCLR1 and CCLR0 in TCRV0.
When TCNTV overflows from H'FF to H'00, OVF is set to 1 in TCSRV.
TCNTV is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Time Constant Registers A and B (TCORA, TCORB)
Bit 7 6 5 4 3 2 1 0
TCORn7 TCORn6TCORn5TCORn4TCORn3TCORn2TCORn1 TCORn0
Initial value 1 1 1 1 1 1 1 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
n = A or B
TCORA and TCORB are 8-bit read/write registers.
TCORA and TCNTV are compared at all times, except during the T3 state of a TCORA write
cycle. When the TCORA and TCNTV contents match, CMFA is set to 1 in TCSRV. If CMIEA is
also set to 1 in TCRV0, a CPU interrupt is requested.
Timer output from the TMOV pin can be controlled by a signal resulting from compare match,
according to the settings of bits OS3 to OS0 in TCSRV.
TCORA is initialized to H'FF upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
TCORB is similar to TCORA.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 219 of 526
REJ09B0326-0600
Timer Control Register V0 (TCRV0)
Bit 7 6 5 4 3 2 1 0
CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
TCRV0 is an 8-bit read/write register that selects the TCNTV input clock, controls the clearing of
TCNTV, and enables interrupts.
TCRV0 is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Compare Match Interrupt Enable B (CMIEB): Bit 7 enables or disables the interrupt
request (CMIB) generated from CMFB when CMFB is set to 1 in TCSRV.
Bit 7: CMIEB Description
0 Interrupt request (CMIB) from CMFB disabled (initial value)
1 Interrupt request (CMIB) from CMFB enabled
Bit 6
Compare Match Interrupt Enable A (CMIEA): Bit 6 enables or disables the interrupt
request (CMIA) generated from CMFA when CMFA is set to 1 in TCSRV.
Bit 6: CMIEA Description
0 Interrupt request (CMIA) from CMFA disabled (initial value)
1 Interrupt request (CMIA) from CMFA enabled
Bit 5
Timer Overflow Interrupt Enable (OVIE): Bit 5 enables or disables the interrupt
request (OVI) generated from OVF when OVF is set to 1 in TCSRV.
Bit 5: OVIE Description
0 Interrupt request (OVI) from OVF disabled (initial value)
1 Interrupt request (OVI) from OVF enabled
Bits 4 and 3
Counter Clear 1 and 0 (CCLR1, CCLR0): Bits 4 and 3 specify whether or not to
clear TCNTV, and select compare match A or B or an external reset input.
When clearing is specified, if TRGE is set to 1 in TCRV1, then when TCNTV is cleared it is also
halted. Counting resumes when a trigger edge is input at the TRGV pin.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 220 of 526
REJ09B0326-0600
If TRGE is cleared to 0, after TCNTV is cleared it continues counting up.
Bit 4: CCLR1 Bit 3: CCLR0 Description
0 0 Clearing is disabled (initial value)
1 Cleared by compare match A
1 0 Cleared by compare match B
1 Cleared by rising edge of external reset input
Bits 2 to 0
Clock Select 2 to 0 (CKS2 to CKS0): Bits 2 to 0 and bit ICKS0 in TCRV1 select
the clock input to TCNTV.
Six internal clock sources divided from the system clock (φ) can be selected. The counter
increments on the falling edge.
If the external clock is selected, there is a further selection of incrementing on the rising edge,
falling edge, or both edges.
If TRGE is cleared to 0, after TCNTV is cleared it continues counting up.
TCRV0 TCRV1
Bit 2:
CKS2
Bit 1:
CKS1
Bit 0:
CKS0
Bit 0:
ICKS0
Description
0 0 0 Clock input disabled (initial value)
1 0 Internal clock: φ/4, falling edge
1 Internal clock: φ/8, falling edge
1 0 0 Internal clock: φ/16, falling edge
1 Internal clock: φ/32, falling edge
1 0 Internal clock: φ/64, falling edge
1 Internal clock: φ/128, falling edge
1 0 0 Clock input disabled
1 External clock: rising edge
1 0 External clock: falling edge
1 External clock: rising and falling edges
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 221 of 526
REJ09B0326-0600
Timer Control/Status Register V (TCSRV)
Bit 7 6 5 4 3 2 1 0
CMFB CMFA OVF OS3 OS2 OS1 OS0
Initial value 0 0 0 1 0 0 0 0
Read/Write R/(W)* R/(W)* R/(W)* R/W R/W R/W R/W
Note: * Bits 7 to 5 can be only written with 0, for flag clearing.
TCSRV is an 8-bit register that sets compare match flags and the timer overflow flag, and controls
compare match output.
TCSRV is initialized to H'10 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Compare Match Flag B (CMFB): Bit 7 is a status flag indicating that TCNTV has
matched TCORB. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 7: CMFB Description
0 Clearing condition:
After reading CMFB = 1, cleared by writing 0 to CMFB (initial value)
1 Setting condition:
Set when the TCNTV value matches the TCORB value
Bit 6
Compare Match Flag A (CMFA): Bit 6 is a status flag indicating that TCNTV has
matched TCORA. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 6: CMFA Description
0 Clearing condition:
After reading CMFA = 1, cleared by writing 0 to CMFA (initial value)
1 Setting condition:
Set when the TCNTV value matches the TCORA value
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 222 of 526
REJ09B0326-0600
Bit 5
Timer Overflow Flag (OVF): Bit 5 is a status flag indicating that TCNTV has overflowed
from H'FF to H'00. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 5: OVF Description
0 Clearing condition:
After reading OVF = 1, cleared by writing 0 to OVF (initial value)
1 Setting condition:
Set when TCNTV overflows from H'FF to H'00
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Bits 3 to 0
Output Select 3 to 0 (OS3 to OS0): Bits 3 to 0 select the way in which the output
level at the TMOV pin changes in response to compare match between TCNTV and TCORA or
TCORB.
OS3 and OS2 select the output level for compare match B. OS1 and OS0 select the output level
for compare match A. The two levels can be controlled independently.
If two compare matches occur simultaneously, any conflict between the settings is resolved
according to the following priority order: toggle output > 1 output > 0 output.
When OS3 to OS0 are all cleared to 0, timer output is disabled.
After a reset, the timer output is 0 until the first compare match.
Bit 3: OS3 Bit 2: OS2 Description
0 0 No change at compare match B (initial value)
1 0 output at compare match B
1 0 1 output at compare match B
1 Output toggles at compare match B
Bit 1: OS1 Bit 0: OS0 Description
0 0 No change at compare match A (initial value)
1 0 output at compare match A
1 0 1 output at compare match A
1 Output toggles at compare match A
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 223 of 526
REJ09B0326-0600
Timer Control Register V1 (TCRV1)
Bit 7 6 5 4 3 2 1 0
TVEG1 TVEG0 TRGE ICKS0
Initial value 1 1 1 0 0 0 1 0
Read/Write R/W R/W R/W R/W
TCRV1 is an 8-bit read/write register that selects the valid edge at the TRGV pin, enables TRGV
input, and selects the clock input to TCNTV.
TCRV1 is initialized to H'E2 upon reset and in watch mode, subsleep mode, and subactive mode.
Bits 7 to 5
Reserved Bits: Bit 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bits 4 and 3
TRGV Input Edge Select (TVEG1, TVEG0): Bits 4 and 3 select the TRGV input
edge.
Bit 4: TVEG1 Bit 3: TVEG0 Description
0 0 TRGV trigger input is disabled (initial value)
1 Rising edge is selected
1 0 Falling edge is selected
1 Rising and falling edges are both selected
Bit 2
TRGV Input Enable (TRGE): Bit 2 enables TCNTV counting to be triggered by input at
the TRGV pin, and enables TCNTV counting to be halted when TCNTV is cleared by compare
match. TCNTV stops counting when TRGE is set to 1, then starts counting when the edge selected
by bits TVEG1 and TVEG0 is input at the TRGV pin.
Bit 2: TRGE Description
0 TCNTV counting is not triggered by input at the TRGV pin, and does not stop
when TCNTV is cleared by compare match (initial value)
1 TCNTV counting is triggered by input at the TRGV pin, and stops when TCNTV
is cleared by compare match
Bit 1
Reserved Bit: Bit 1 is reserved; it is always read as 1, and cannot be modified.
Bit 0
Internal Clock Select 0 (ICKS0): Bit 0 and bits CKS2 to CKS0 in TCRV0 select the
TCNTV clock source. For details see section 9.4.2, Register Descriptions.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 224 of 526
REJ09B0326-0600
9.4.3 Timer Operation
Timer V Operation: A reset initializes TCNTV to H'00, TCORA and TCORB to H'FF, TCRV0
to H'00, TCSRV to H'10, and TCRV1 to H'E2.
Timer V can be clocked by one of six internal clocks output from prescaler S, or an external clock,
as selected by bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1. The valid edge or edges
of the external clock can also be selected by CKS2 to CKS0. When the clock source is selected,
TCNTV starts counting the selected clock input.
The TCNTV contents are always compared with TCORA and TCORB. When a match occurs, the
CMFA or CMFB bit is set to 1 in TCSRV. If CMIEA or CMIEB is set to 1 in TCRV0, a CPU
interrupt is requested. At the same time, the output level selected by bits OS3 to OS0 in TCSRV is
output from the TMOV pin.
When TCNT overflows from H'FF to H'00, if OVIE is 1 in TCRV0, a CPU interrupt is requested.
If bits CCLR1 and CCLR0 in TCRV0 are set to 01 (clear by compare match A) or 10 (clear by
compare match B), TCNTV is cleared by the corresponding compare match. If these bits are set to
11, TCNTV is cleared by input of a rising edge at the TMRIV pin.
When the counter clear event selected by bits CCLR1 and CCLR0 in TCRV0 occurs, TCNTV is
cleared and the count-up is halted. TCNTV starts counting when the signal edge selected by bits
TVEG1 and TVEG0 in TCRV1 is input at the TRGV pin.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 225 of 526
REJ09B0326-0600
TCNTV Increment Timing: TCNTV is incremented by an input (internal or external) clock.
• Internal clock
One of six clocks (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) divided from the system clock (φ) can be
selected by bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1. Figure 9.4 shows the
timing.
N – 1
TCNTV
input
FRC
input
φ
TCNTV
Internal
clock
N N – 1
Figure 9.4 Increment Timing with Internal Clock
• External clock
Incrementation on the rising edge, falling edge, or both edges of the external clock can be
selected by bits CKS2 to CKS0 in TCRV0.
The external clock pulse width should be at least 1.5 system clocks (φ) when a single edge is
counted, and at least 2.5 system clocks when both edges are counted. Shorter pulses will not be
counted correctly.
Figure 9.5 shows the timing when both the rising and falling edges of the external clock are
selected.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 226 of 526
REJ09B0326-0600
N – 1 NN – 1
TCNTV
input clock
φ
TCNTV
TMCIV
(external clock
input pin)
Figure 9.5 Increment Timing with External Clock
Overflow flag Set Timing: The overflow flag (OVF) is set to 1 when TCNTV overflows from
H'FF to H'00. Figure 9.6 shows the timing.
H'FF H'00
Overflow
signal
φ
TCNTV
Figure 9.6 OVF Set Timing
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 227 of 526
REJ09B0326-0600
Compare Match Flag set Timing: Compare match flag A or B (CMFA or CMFB) is set to 1
when TCNTV matches TCORA or TCORB. The internal compare-match signal is generated in the
last state in which the values match (when TCNTV changes from the matching value to a new
value). Accordingly, when TCNTV matches TCORA or TCORB, the compare match signal is not
generated until the next clock input to TCNTV. Figure 9.7 shows the timing.
TCORA or
TCORB
φ
Compare
match signal
TCNTV N
N
N + 1
CMFA or
CMFB
Figure 9.7 CMFA and CMFB Set Timing
TMOV Output Timing: The TMOV output responds to compare match A or B by remaining
unchanged, changing to 0, changing to 1, or toggling, as selected by bits OS3 to OS0 in TCSRV.
Figure 9.8 shows the timing when the output is toggled by compare match A.
Timer V
output pin
φ
Compare
match A
signal
Figure 9.8 TMOV Output Timing
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 228 of 526
REJ09B0326-0600
TCNTV Clear Timing by Compare Match: TCNTV can be cleared by compare match A or B,
as selected by bits CCLR1 and CCLR0 in TCRV0. Figure 9.9 shows the timing.
TCNTV
φ
Compare
match A signal
N H'00
Figure 9.9 Clear Timing by Compare Match
TCNTV Clear Timing by TMRIV: TCNTV can be cleared by a rising edge at the TMRIV pin,
as selected by bits CCLR1 and CCLR0 in TCRV0. A TMRIV input pulse width of at least 1.5
system clocks is necessary. Figure 9.10 shows the timing.
Timer V
output pin
φ
TCNTV
Compare
match A signal
N – 1 N H'00
Figure 9.10 Clear Timing by TMRIV Input
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 229 of 526
REJ09B0326-0600
9.4.4 Timer V Operation Modes
Table 9.10 summarizes the timer V operation states.
Table 9.10 Timer V Operation States
Operation Mode
Reset
Active
Sleep
Watch
Sub-
active
Sub-
sleep
Standby
TCNTV Reset Functions Functions Reset Reset Reset Reset
TCRV0, TCRV1 Reset Functions Functions Reset Reset Reset Reset
TCORA, TCORB Reset Functions Functions Reset Reset Reset Reset
TCSRV Reset Functions Functions Reset Reset Reset Reset
9.4.5 Interrupt Sources
Timer V has three interrupt sources: CMIA, CMIB, and OVI. Table 9.11 lists the interrupt sources
and their vector address. Each interrupt source can be enabled or disabled by an interrupt enable
bit in TCRV0. Although all three interrupts share the same vector, they have individual interrupt
flags, so software can discriminate the interrupt source.
Table 9.11 Timer V Interrupt Sources
Interrupt Description Vector Address
CMIA Generated from CMFA H'0022
CMIB Generated from CMFB
OVI Generated from OVF
9.4.6 Application Examples
Pulse Output with Arbitrary Duty Cycle: Figure 9.11 shows an example of output of pulses
with an arbitrary duty cycle. To set up this output:
• Clear bit CCLR1 to 0 and set bit CCLR0 to 1 in TCRV0 so that TCNTV will be cleared by
compare match with TCORA.
• Set bits OS3 to OS0 to 0110 in TCSRV so that the output will go to 1 at compare match with
TCORA and to 0 at compare match with TCORB.
• Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 230 of 526
REJ09B0326-0600
With these settings, a waveform is output without further software intervention, with a period
determined by TCORA and a pulse width determined by TCORB.
TCNTV
Counter cleared
H'FF
TCORA
TCORB
H'00
TMOV
Figure 9.11 Pulse Output Example
Single-Shot Output with Arbitrary Pulse Width and Delay from TRGV Input: The trigger
function can be used to output a pulse with an arbitrary pulse width at an arbitrary delay from the
TRGV input, as shown in figure 9.12. To set up this output:
• Set bit CCLR1 to 1 and clear bit CCLR0 to 0 in TCRV0 so that TCNTV will be cleared by
compare match with TCORB.
• Set bits OS3 to OS0 to 0110 in TCSRV so that the output will go to 1 at compare match with
TCORA and to 0 at compare match with TCORB.
• Set bits TVEG1 and TVEG0 to 10 in TCRV1 and set TRGE to 1 to select the falling edge of
the TRGV input.
• Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 231 of 526
REJ09B0326-0600
After these settings, a pulse waveform will be output without further software intervention, with a
delay determined by TCORA from the TRGV input, and a pulse width determined by (TCORB –
TCORA).
Counter cleared
TCNTV
Compare match ACompare match B
clears TCNTV and
halts count-up
Compare match A
Compare match B
clears TCNTV and
halts count-up
H'FF
TCORB
TCORA
H'00
TRGV
TMOV
Figure 9.12 Pulse Output Synchronized to TRGV Input
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 232 of 526
REJ09B0326-0600
9.4.7 Application Notes
The following types of contention can occur in timer V operation.
Contention between TCNTV Write and Counter Clear: If a TCNTV clear signal is generated
in the T3 state of a TCNTV write cycle, clearing takes precedence and the write to the counter is
not carried out. Figure 9.13 shows the timing.
T
1
T
2
T
3
TCNTV write cycle by CPU
Address TCNTV address
Internal write
signal
φ
Counter clear
signal
TCNTV N H'00
Figure 9.13 Contention between TCNTV Write and Clear
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 233 of 526
REJ09B0326-0600
Contention between TCNTV Write and Increment: If a TCNTV increment clock signal is
generated in the T3 state of a TCNTV write cycle, the write takes precedence and the counter is
not incremented. Figure 9.14 shows the timing.
T1T2T3
TCNTV write cycle by CPU
Address
Internal write
signal
φ
TCNTV clock
TCNTV N M
TCNTV write data
TCNTV address
Figure 9.14 Contention between TCNTV Write and Increment
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 234 of 526
REJ09B0326-0600
Contention between TCOR Write and Compare Match: If a compare match is generated in the
T3 state of a TCORA or TCORB write cycle, the write to TCORA or TCORB takes precedence
and the compare match signal is inhibited. Figure 9.15 shows the timing.
T
1
T
2
T
3
TCORA write cycle by CPU
Address
Internal write
signal
φ
TCNTV
TCORA N M
TCORA write data
TCORA address
N N + 1
Compare match
signal
Inhibited
Figure 9.15 Contention between TCORA Write and Compare Match
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 235 of 526
REJ09B0326-0600
Contention between Compare Match A and B: If compare match A and B occur
simultaneously, any conflict between the output selections for compare match A and compare
match B is resolved by following the priority order in table 9.12.
Table 9.12 Timer Output Priority Order
Output Setting Priority
Toggle output High
1 output
0 output
No change Low
Internal Clock Switching and Counter Operation: Depending on the timing, TCNTV may be
incremented by a switch between different internal clock sources. Table 9.13 shows the relation
between internal clock switchover timing (by writing to bits CKS1 and CKS0) and TCNTV
operation.
When TCNTV is internally clocked, an increment pulse is generated from the falling edge of an
internal clock signal, which is divided from the system clock (φ). For this reason, in a case like
No. 3 in table 9.13 where the switch is from a high clock signal to a low clock signal, the
switchover is seen as a falling edge, causing TCNTV to increment.
TCNTV can also be incremented by a switch between internal and external clocks.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 236 of 526
REJ09B0326-0600
Table 9.13 Internal Clock Switching and TCNTV Operation
No.
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
TCNTV Operation
1 Goes from low level
to low level*1
N + 1
Clock before
switching
Clock after
switching
Count clock
TCNTV
Write to CKS1 and CKS0
N
2 Goes from low
to high*2
N + 1 N + 2
Clock before
switching
Clock after
switching
Count clock
TCNTV
Write to CKS1 and CKS0
N
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 237 of 526
REJ09B0326-0600
No.
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
TCNTV Operation
3 Goes from high level
to low level*3
N + 1N N + 2
*4
Clock before
switching
Clock after
switching
Count clock
TCNTV
Write to CKS1 and CKS0
4 Goes from high
to high
N + 1 N + 2N
Clock before
switching
Clock after
switching
Count clock
Write to CKS1 and CKS0
TCNTV
Notes: 1. Including a transition from the low level to the stopped state, or from the stopped state
to the low level.
2. Including a transition from the stopped state to the high level.
3. Including a transition from the high level to the stopped state.
4. The switchover is seen as a falling edge, and TCNTV is incremented.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 238 of 526
REJ09B0326-0600
9.5 Timer X
9.5.1 Overview
Timer X is based on a 16-bit free-running counter (FRC). It can output two independent
waveforms, or measure input pulse widths and external clock periods.
Features
Features of timer X are given below.
• Choice of three internal clock sources (φ/2, φ/8, φ/32) or an external clock (can be used as an
external event counter).
• Two independent output compare waveforms.
• Four independent input capture channels, with selection of rising or falling edge and buffering
option.
• Counter can be cleared by compare match A.
• Seven independent interrupt sources: two compare match, four input capture, one overflow
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 239 of 526
REJ09B0326-0600
Block Diagram
Figure 9.16 shows a block diagram of timer X.
FTOA
FTOB
Timer interrupt enable register
Timer control/status register X
Free-running counter
Output compare register A
Output compare register B
Timer control register X
Timer output compare control register
Input capture register A
Input capture register B
Input capture register C
Input capture register D
Prescaler S
Legend:
TIER:
TCSRX:
FRC:
OCRA:
OCRB:
TCRX:
TOCR:
ICRA:
ICRB:
ICRC:
ICRD:
PSS:
Interrupt
request
Input
capture
control
Internal data bus
Comparator
Comparator
ICRA
ICRC
ICRB
ICRD
TCRX
OCRB
OCRA
TOCR
FRC
TCSRX
TIER
PSS
FTIA
FTIB
FTIC
FTID
FTCI
φ
Figure 9.16 Block Diagram of Timer X
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 240 of 526
REJ09B0326-0600
Pin Configuration
Table 9.14 shows the timer X pin configuration.
Table 9.14 Pin Configuration
Name Abbr. I/O Function
Counter clock input FTCI Input Clock input to FRC
Output compare A FTOA Output Output pin for output compare A
Output compare B FTOB Output Output pin for output compare B
Input capture A FTIA Input Input pin for input capture A
Input capture B FTIB Input Input pin for input capture B
Input capture C FTIC Input Input pin for input capture C
Input capture D FTID Input Input pin for input capture D
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 241 of 526
REJ09B0326-0600
Register Configuration
Table 9.15 shows the register configuration of timer X.
Table 9.15 Timer X Registers
Name Abbr. R/W Initial Value Address
Timer interrupt enable register TIER R/W H'01 H'F770
Timer control/status register X TCSRX R/(W)*1 H'00 H'F771
Free-running counter H FRCH R/W H'00 H'F772
Free-running counter L FRCL R/W H'00 H'F773
Output compare register AH OCRAH R/W H'FF H'F774*2
Output compare register AL OCRAL R/W H'FF H'F775*2
Output compare register BH OCRBH R/W H'FF H'F774*2
Output compare register BL OCRBL R/W H'FF H'F775*2
Timer control register X TCRX R/W H'00 H'F776
Timer output compare control
register
TOCR R/W H'E0 H'F777
Input capture register AH ICRAH R H'00 H'F778
Input capture register AL ICRAL R H'00 H'F779
Input capture register BH ICRBH R H'00 H'F77A
Input capture register BL ICRBL R H'00 H'F77B
Input capture register CH ICRCH R H'00 H'F77C
Input capture register CL ICRCL R H'00 H'F77D
Input capture register DH ICRDH R H'00 H'F77E
Input capture register DL ICRDL R H'00 H'F77F
Notes: 1. Bits 7 to 1 can only be written with 0 for flag clearing. Bit 0 is a read/write bit.
2. OCRA and OCRB share the same address. They are selected by the OCRS bit in
TOCR.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 242 of 526
REJ09B0326-0600
9.5.2 Register Descriptions
Free-Running Counter (FRC)
Free-Running Counter H (FRCH)
Free-Running Counter L (FRCL)
FRC
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Read/Write R/WR/W R/W R/WR/WR/WR/WR/WR/WR/WR/WR/WR/W R/W R/W R/W
FRCH FRCL
FRC is a 16-bit read/write up-counter, which is incremented by internal or external clock input.
The clock source is selected by bits CKS1 and CKS0 in TCRX.
FRC can be cleared by compare match A, depending on the setting of CCLRA in TCSRX.
When FRC overflows from H'FFFF to H'0000, OVF is set to 1 in TCSRX. If OVIE = 1 in TIER, a
CPU interrupt is requested.
FRC can be written and read by the CPU. Since FRC has 16 bits, data is transferred between the
CPU and FRC via a temporary register (TEMP). For details see section 9.5.3, CPU Interface.
FRC is initialized to H'0000 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Output Compare Registers A and B (OCRA, OCRB)
Output Compare Registers AH and BH (OCRAH, OCRBH)
Output Compare Registers AL and BL (OCRAL, OCRBL)
OCRA, OCRB
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Read/Write R/WR/W R/W R/WR/WR/WR/WR/WR/WR/WR/WR/WR/W R/W R/W R/W
OCRAH, OCRBH OCRAL, OCRBL
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 243 of 526
REJ09B0326-0600
There are two 16-bit read/write output compare registers, OCRA and OCRB, the contents of
which are always compared with FRC. When the values match, OCFA or OCFB is set to 1 in
TCSRX. If OCIAE = 1 or OCIBE = 1 in TIER, a CPU interrupt is requested.
When a compare match with OCRA or OCRB occurs, if OEA = 1 or OEB = 1 in TOCR, the value
selected by OLVLA or OLVLB in TOCR is output at the FTOA or FTOB pin. After a reset, the
output from the FTOA or FTOB pin is 0 until the first compare match occurs.
OCRA and OCRB can be written and read by the CPU. Since they are 16-bit registers, data is
transferred between them and the CPU via a temporary register (TEMP). For details see section
9.5.3, CPU Interface.
OCRA and OCRB are initialized to H'FFFF upon reset and in standby mode, watch mode,
subsleep mode, and subactive mode.
Input Capture Registers A to D (ICRA to ICRD)
Input Capture Registers AH to DH (ICRAH to ICRDH)
Input Capture Registers AL to DL (ICRAL to ICRDL)
ICRA, ICRB, ICRC, ICRD
Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Read/Write R R R R R R R R R R R R R R R R
ICRAH, ICRBH, ICRCH, ICRDH ICRAL, ICRBL, ICRCL, ICRDL
There are four 16-bit read only input capture registers, ICRA to ICRD.
When the falling edge of an input capture signal is input, the FRC value is transferred to the
corresponding input capture register, and the corresponding input capture flag (ICFA to ICFD) is
set to 1 in TCSRX. If the corresponding input capture interrupt enable bit (ICIAE to ICIDE) is 1 in
TCRX, a CPU interrupt is requested. The valid edge of the input signal can be selected by bits
IEDGA to IEDGD in TCRX.
ICRC and ICRD can also be used as buffer registers for ICRA and ICRB. Buffering is enabled by
bits BUFEA and BUFEB in TCRX.
Figure 9.17 shows the interconnections when ICRC operates as a buffer register of ICRA (when
BUFEA = 1). When ICRC is used as the ICRA buffer, both the rising and falling edges of the
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 244 of 526
REJ09B0326-0600
external input signal can be selected simultaneously, by setting IEDGA ≠ IEDGC. If IEDGA =
IEDGC, then only one edge is selected (either the rising edge or falling edge). See table 9.16.
Note: The FRC value is transferred to the input capture register (ICR) regardless of the value of
the input capture flag (ICF).
Edge detector
and internal
capture signal
generator
ICRC ICRA FRC
FTIA
IEOGA BUFEA IEDGC
Figure 9.17 Buffer Operation (Example)
Table 9.16 Input Edge Selection during Buffer Operation
IEDGA IEDGC Input Edge Selection
0 0 Falling edge of input capture A input signal is captured (initial value)
1 Rising and falling edge of input capture A input signal are both captured
1 0
1 Rising edge of input capture A input signal is captured
ICRA to ICRD can be written and read by the CPU. Since they are 16-bit registers, data is
transferred from them to the CPU via a temporary register (TEMP). For details see section 9.5.3,
CPU Interface.
To assure input capture, the pulse width of the input capture input signal must be at least 1.5
system clocks (φ) when a single edge is selected, or at least 2.5 system clocks (φ) when both edges
are selected.
ICRA to ICRD are initialized to H'0000 upon reset and in standby mode, watch mode, subsleep
mode, and subactive mode.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 245 of 526
REJ09B0326-0600
Timer Interrupt Enable Register (TIER)
Bit 7 6 5 4 3 2 1 0
ICIAE ICIBE ICICE ICIDE OCIAE OCIBE OVIE
Initial value 0 0 0 0 0 0 0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W
TIER is an 8-bit read/write register that enables or disables interrupt requests.
TIER is initialized to H'01 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Input Capture Interrupt A Enable (ICIAE): Bit 7 enables or disables the ICIA interrupt
requested when ICFA is set to 1 in TCSRX.
Bit 7: ICIAE Description
0 Interrupt request by ICFA (ICIA) is disabled (initial value)
1 Interrupt request by ICFA (ICIA) is enabled
Bit 6
Input Capture Interrupt B Enable (ICIBE): Bit 6 enables or disables the ICIB interrupt
requested when ICFB is set to 1 in TCSRX.
Bit 6: ICIBE Description
0 Interrupt request by ICFB (ICIB) is disabled (initial value)
1 Interrupt request by ICFB (ICIB) is enabled
Bit 5
Input Capture Interrupt C Enable (ICICE): Bit 5 enables or disables the ICIC interrupt
requested when ICFC is set to 1 in TCSRX.
Bit 5: ICICE Description
0 Interrupt request by ICFC (ICIC) is disabled (initial value)
1 Interrupt request by ICFC (ICIC) is enabled
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 246 of 526
REJ09B0326-0600
Bit 4
Input Capture Interrupt D Enable (ICIDE): Bit 4 enables or disables the ICID interrupt
requested when ICFD is set to 1 in TCSRX.
Bit 4: ICIDE Description
0 Interrupt request by ICFD (ICID) is disabled (initial value)
1 Interrupt request by ICFD (ICID) is enabled
Bit 3
Output Compare Interrupt A Enable (OCIAE): Bit 3 enables or disables the OCIA
interrupt requested when OCFA is set to 1 in TCSRX.
Bit 3: OCIAE Description
0 Interrupt request by OCFA (OCIA) is disabled (initial value)
1 Interrupt request by OCFA (OCIA) is enabled
Bit 2
Output Compare Interrupt B Enable (OCIBE): Bit 2 enables or disables the OCIB
interrupt requested when OCFB is set to 1 in TCSRX.
Bit 2: OCIBE Description
0 Interrupt request by OCFB (OCIB) is disabled (initial value)
1 Interrupt request by OCFB (OCIB) is enabled
Bit 1
Timer Overflow Interrupt Enable (OVIE): Bit 1 enables or disables the FOVI interrupt
requested when OVF is set to 1 in TCSRX.
Bit 1: OVIE Description
0 Interrupt request by OVF (FOVI) is disabled (initial value)
1 Interrupt request by OVF (FOVI) is enabled
Bit 0
Reserved Bit: Bit 0 is reserved; it is always read as 1, and cannot be modified.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 247 of 526
REJ09B0326-0600
Timer Control/Status Register X (TCSRX)
Bit 7 6 5 4 3 2 1 0
ICFA ICFB ICFC ICFD OCFA OCFB OVF CCLRA
Initial value 0 0 0 0 0 0 0 0
Read/Write R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/W
Note: * Bits 7 to 1 can only be written with 0 for flag clearing.
TCSRX is an 8-bit register that selects clearing of the counter and controls interrupt request
signals.
TCSRX is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode. Other timing is described in section 9.6.3, Timer Operation.
Bit 7
Input Capture Flag A (ICFA): Bit 7 is a status flag that indicates that the FRC value has
been transferred to ICRA by an input capture signal. If BUFEA is set to 1 in TCRX, ICFA
indicates that the FRC value has been transferred to ICRA by an input capture signal and that the
ICRA value before this update has been transferred to ICRC.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 7: ICFA Description
0 Clearing condition:
After reading ICFA = 1, cleared by writing 0 to ICFA (initial value)
1 Setting condition:
Set when the FRC value is transferred to ICRA by an input capture signal
Bit 6
Input Capture Flag B (ICFB): Bit 6 is a status flag that indicates that the FRC value has
been transferred to ICRB by an input capture signal. If BUFEB is set to 1 in TCRX, ICFB
indicates that the FRC value has been transferred to ICRB by an input capture signal and that the
ICRB value before this update has been transferred to ICRC.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 6: ICFB Description
0 Clearing condition:
After reading ICFB = 1, cleared by writing 0 to ICFB (initial value)
1 Setting condition:
Set when the FRC value is transferred to ICRB by an input capture signal
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 248 of 526
REJ09B0326-0600
Bit 5
Input Capture Flag C (ICFC): Bit 5 is a status flag that indicates that the FRC value has
been transferred to ICRC by an input capture signal. If BUFEA is set to 1 in TCRX, ICFC is set
by the input capture signal even though the FRC value is not transferred to ICRC. In buffered
operation, ICFC can accordingly be used as an external interrupt, by setting the ICICE bit to 1.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 5: ICFC Description
0 Clearing condition:
After reading ICFC = 1, cleared by writing 0 to ICFC (initial value)
1 Setting condition:
Set by input capture signal
Bit 4
Input Capture Flag D (ICFD): Bit 4 is a status flag that indicates that the FRC value has
been transferred to ICRD by an input capture signal. If BUFEB is set to 1 in TCRX, ICFD is set
by the input capture signal even though the FRC value is not transferred to ICRD. In buffered
operation, ICFD can accordingly be used as an external interrupt, by setting the ICIDE bit to 1.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 4: ICFD Description
0 Clearing condition:
After reading ICFD = 1, cleared by writing 0 to ICFD (initial value)
1 Setting condition:
Set by input capture signal
Bit 3
Output Compare Flag A (OCFA): Bit 3 is a status flag that indicates that the FRC value
has matched OCRA. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 3: OCFA Description
0 Clearing condition:
After reading OCFA = 1, cleared by writing 0 to OCFA (initial value)
1 Setting condition:
Set when FRC matches OCRA
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 249 of 526
REJ09B0326-0600
Bit 2
Output Compare Flag B (OCFB): Bit 2 is a status flag that indicates that the FRC value
has matched OCRB. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 2: OCFB Description
0 Clearing condition:
After reading OCFB = 1, cleared by writing 0 to OCFB (initial value)
1 Setting condition:
Set when FRC matches OCRB
Bit 1
Timer Overflow Flag (OVF): Bit 1 is a status flag that indicates that FRC has overflowed
from H'FFFF to H'0000. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 1: OVF Description
0 Clearing condition:
After reading OVF = 1, cleared by writing 0 to OVF (initial value)
1 Setting condition:
Set when the FRC value overflows from H'FFFF to H'0000
Bit 0
Counter Clear A (CCLRA): Bit 0 selects whether or not to clear FRC by compare match
A (when FRC matches OCRA).
Bit 0: CCLRA Description
0 FRC is not cleared by compare match A (initial value)
1 FRC is cleared by compare match A
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 250 of 526
REJ09B0326-0600
Timer Control Register X (TCRX)
Bit 7 6 5 4 3 2 1 0
IEDGA IEDGB IEDGC IEDGD BUFEA BUFEB CKS1 CKS0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
TCRX is an 8-bit read/write register that selects the valid edges of the input capture signals,
enables buffering, and selects the FRC clock source.
TCRX is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Input Edge Select A (IEDGA): Bit 7 selects the rising or falling edge of the input capture
A input signal (FTIA).
Bit 7: IEDGA Description
0 Falling edge of input capture A is captured (initial value)
1 Rising edge of input capture A is captured
Bit 6
Input Edge Select B (IEDGB): Bit 6 selects the rising or falling edge of the input capture
B input signal (FTIB).
Bit 6: IEDGB Description
0 Falling edge of input capture B is captured (initial value)
1 Rising edge of input capture B is captured
Bit 5
Input Edge Select C (IEDGC): Bit 5 selects the rising or falling edge of the input capture
C input signal (FTIC).
Bit 5: IEDGC Description
0 Falling edge of input capture C is captured (initial value)
1 Rising edge of input capture C is captured
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 251 of 526
REJ09B0326-0600
Bit 4
Input Edge Select D (IEDGD): Bit 4 selects the rising or falling edge of the input
capture D input signal (FTID).
Bit 4: IEDGD Description
0 Falling edge of input capture D is captured (initial value)
1 Rising edge of input capture D is captured
Bit 3
Buffer Enable A (BUFEA): Bit 3 selects whether or not to use ICRC as a buffer register
for ICRA.
Bit 3: BUFEA Description
0 ICRC is not used as a buffer register for ICRA (initial value)
1 ICRC is used as a buffer register for ICRA
Bit 2
Buffer Enable B (BUFEB): Bit 2 selects whether or not to use ICRD as a buffer register
for ICRB.
Bit 2: BUFEB Description
0 ICRD is not used as a buffer register for ICRB (initial value)
1 ICRD is used as a buffer register for ICRB
Bits 1 and 0
Clock Select (CKS1, CKS0): Bits 1 and 0 select one of three internal clock
sources or an external clock for input to FRC. The external clock is counted on the rising edge.
Bit 1: CKS1 Bit 0: CKS0 Description
0 0 Internal clock: φ/2 (initial value)
1 Internal clock: φ/8
1 0 Internal clock: φ/32
1 External clock: rising edge
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 252 of 526
REJ09B0326-0600
Timer Output Compare Control Register (TOCR)
Bit 7 6 5 4 3 2 1 0
OCRS OEA OEB OLVLA OLVLB
Initial value 1 1 1 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W
TOCR is an 8-bit read/write register that selects the output compare output levels, enables output
compare output, and controls access to OCRA and OCRB.
TOCR is initialized to H'E0 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bits 7 to 5
Reserved Bits: Bit 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bit 4
Output Compare Register Select (OCRS): OCRA and OCRB share the same address.
OCRS selects which register is accessed when this address is written or read. It does not affect the
operation of OCRA and OCRB.
Bit 4: OCRS Description
0 OCRA is selected (initial value)
1 OCRB is selected
Bit 3
Output Enable A (OEA): Bit 3 enables or disables the timer output controlled by output
compare A.
Bit 3: OEA Description
0 Output compare A output is disabled (initial value)
1 Output compare A output is enabled
Bit 2
Output Enable B (OEB): Bit 2 enables or disables the timer output controlled by output
compare B.
Bit 2: OEB Description
0 Output compare B output is disabled (initial value)
1 Output compare B output is enabled
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 253 of 526
REJ09B0326-0600
Bit 1
Output Level A (OLVLA): Bit 1 selects the output level that is output at pin FTOA by
compare match A (when FRC matches OCRA).
Bit 1: OLVLA Description
0 Low level (initial value)
1 High level
Bit 0
Output Level B (OLVLB): Bit 0 selects the output level that is output at pin FTOB by
compare match B (when FRC matches OCRB).
Bit 0: OLVLB Description
0 Low level (initial value)
1 High level
9.5.3 CPU Interface
FRC, OCRA, OCRB, and ICRA to ICRD are 16-bit registers, but the CPU is connected to the on-
chip peripheral modules by an 8-bit data bus. When the CPU accesses these registers, it therefore
uses an 8-bit temporary register (TEMP).
These registers should always be accessed 16 bits at a time. If two consecutive byte-size MOV
instructions are used, the upper byte must be accessed first and the lower byte second. Data will
not be transferred correctly if only the upper byte or only the lower byte is accessed.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 254 of 526
REJ09B0326-0600
Write Access: Write access to the upper byte results in transfer of the upper-byte write data to
TEMP. Next, write access to the lower byte results in transfer of the data in TEMP to the upper
register byte, and direct transfer of the lower-byte write data to the lower register byte.
Figure 9.18 shows an example of the writing of H'AA55 to FRC.
CPU
(H'AA)
Write to upper byte
Write to lower byte
CPU
(H'55)
Bus
interface
Bus
interface
Module data bus
Module data bus
TEMP
(H'AA)
FRCH
( ) FRCL
( )
TEMP
(H'AA)
FRCH
(H'AA) FRCL
(H'55)
Figure 9.18 Write Access to FRC (CPU →
→→
→ FRC)
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 255 of 526
REJ09B0326-0600
Read Access: In access to FRC and ICRA to ICRD, when the upper byte is read the upper-byte
data is transferred directly to the CPU and the lower-byte data is transferred to TEMP. Next, when
the lower byte is read, the lower-byte data in TEMP is transferred to the CPU.
In access to OCRA or OCRB, when the upper byte is read the upper-byte data is transferred
directly to the CPU, and when the lower byte is read the lower-byte data is transferred directly to
the CPU.
Figure 9.19 shows an example of the reading of FRC when FRC contains H'AAFF.
CPU
(H'AA)
Read upper byte
Read lower byte
CPU
(H'FF)
Bus
interface
Bus
interface
Module data bus
Module data bus
TEMP
(H'FF)
FRCH
(H'AA) FRCL
(H'FF)
TEMP
(H'FF)
FRCH
( AB ) FRCL
( 00 )
Note: H'AB00 if counter has been updated once.
Figure 9.19 Read Access to FRC (FRC →
→→
→ CPU)
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 256 of 526
REJ09B0326-0600
9.5.4 Timer Operation
Timer X Operation
• Output compare operation
Following a reset, FRC is initialized to H'0000 and starts counting up. Bits CKS1 and CKS0 in
TCRX can select one of three internal clock sources or an external clock for input to FRC. The
FRC contents are compared constantly with OCRA and OCRB. When a match occurs, the
output at pin FTOA or FTOB goes to the level selected by OLVLA or OLVLB in TOCR.
Following a reset, the output at both FTOA and FTOB is 0 until the first compare match. If
CCLRA is set to 1 in TCSRX, compare match A clears FRC to H'0000.
• Input capture operation
Following a reset, FRC is initialized to H'0000 and starts counting up. Bits CKS1 and CKS0 in
TCRX can select one of three internal clock sources or an external clock for input to FRC.
When the edges selected by bits IEDGA to IEDGD in TCRX are input at pins FTIA to FTID,
the FRC value is transferred to ICRA to ICRD, and ICFA to ICFD are set to 1 in TCSRX. If
bits ICIAE to ICIDE are set to 1 in TIER, a CPU interrupt is requested.
If bits BUFEA and BUFEB are set to 1 in TCRX, ICRC and ICRD operate as buffer registers
for ICRA or ICRB. When the edges selected by bits IEDGA to IEDGD in TCRX are input at
pins FTIA and FTIB, the FRC value is transferred to ICRA or ICRB, and the previous value in
ICRA or ICRB is transferred to ICRC or ICRD. Simultaneously, ICFA or ICFB is set to 1. If
bit ICIAE or ICIBE is set to 1 in TIER, a CPU interrupt is requested.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 257 of 526
REJ09B0326-0600
FRC Count Timing: FRC is incremented by clock input. Bits CKS1 and CKS0 in TCRX can
select one of three internal clock sources (φ/2, φ/8, φ/32) or an external clock.
• Internal clock
Bits CKS1 and CKS0 in TCRX select one of three internal clock sources (φ/2, φ/8, φ/32)
created by dividing the system clock (φ). Figure 9.20 shows the increment timing.
N – 1
FRC input
clock
φ
FRC
Internal
clock
N N + 1
Figure 9.20 Increment Timing with Internal Clock
• External clock
External clock input is selected when bits CKS1 and CKS0 are both set to 1 in TCRX. FRC
increments on the rising edge of the external clock. An external pulse width of at least 1.5
system clocks (φ) is necessary. Shorter pulses will not be counted correctly. Figure 9.21 shows
the timing.
N – 1N
FRC input
clock
φ
FRC
FTCI
(external clock
input pin)
Figure 9.21 Increment Timing with External Clock
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 258 of 526
REJ09B0326-0600
Output Compare Timing: When a compare match occurs, the output level selected by the OLVL
bit in TOCR is output at pin FTOA or FTOB. Figure 9.22 shows the output timing for output
compare A.
N + 1NN + 1N
NN
OCRA
φ
Compare
match A
signal
FRC
OLVLA
FTOA
(output compare
A output pin)
Clear*
Note: * By execution of a software instruction.
Figure 9.22 Output Compare A Output Timing
FRC Clear Timing: FRC can be cleared by compare match A. Figure 9.23 shows the timing.
N H'0000
FRC
φ
Compare
match A signal
Figure 9.23 Clear Timing by Compare Match A
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 259 of 526
REJ09B0326-0600
Input Capture Timing
• Input capture timing
The rising or falling edge is selected for input capture by bits IEDGA to IEDGD in TCRX.
Figure 9.24 shows the timing when the rising edge is selected (IEDGA/B/C/D = 1).
Input capture
signal
φ
Input capture
pin
Figure 9.24 Input Capture Signal Timing (Normal Case)
If the input at the input capture pin occurs while the upper byte of the corresponding input
capture register (ICRA to ICRD) is being read, the internal input capture signal is delayed by
one system clock (φ). Figure 9.25 shows the timing.
Input capture
signal
φ
Input capture
pin
T
1
T
2
T
3
ICRA to ICRD upper byte read cycle
Figure 9.25 Input Capture Signal Timing (during ICRA to ICRD Read)
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 260 of 526
REJ09B0326-0600
• Buffered input capture timing
Input capture can be buffered by using ICRC or ICRD as a buffer for ICRA or ICRB.
Figure 9.26 shows the timing when ICRA is buffered by ICRC (BUFEA = 1) and both
the rising and falling edges are selected (IEDGA = 1 and IEDGC = 0, or IEDGA = 0 and
IEDGC = 1).
n n + 1 N N + 1
Mn nN
mM Mn
φ
FTIA
Input capture
signal
FRC
ICRA
ICRC
Figure 9.26 Buffered Input Capture Timing (Normal Case)
When ICRC or ICRD is used as a buffer register, the input capture flag is still set by the
selected edge of the input capture input signal. For example, if ICRC is used to buffer ICRA,
when the edge transition selected by the IEDGC bit occurs at the input capture pin, ICFC will
be set, and if the ICIEC bit is set, an interrupt will be requested. The FRC value will not be
transferred to ICRC, however.
In buffered operation, if the upper byte of one of the two registers that receives a data transfer
(ICRA and ICRC, or ICRB and ICRD) is being read when an input capture signal would
normally occur, the input capture signal will be delayed by one system clock (φ). Figure 9.27
shows the case when BUFEA = 1.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 261 of 526
REJ09B0326-0600
Input capture
signal
φ
FTIA
T
1
T
2
T
3
ICRA or ICRC upper byte read cycle by CPU
Figure 9.27 Buffered Input Capture Signal Timing (during ICRA or ICRD Read)
Input Capture Flag (ICFA to ICFD) Set Timing: Figure 9.28 shows the timing when an input
capture flag (ICFA to ICFD) is set to 1 and the FRC value is transferred to the corresponding input
capture register (ICRA to ICRD).
ICFA to ICFD
φ
FRC
Input capture
signal
N
N
ICRA to ICRD
Figure 9.28 ICFA to ICFD Set Timing
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 262 of 526
REJ09B0326-0600
Output Compare Flag (OCFA or OCFB) Set Timing: OCFA and OCFB are set to 1 by internal
compare match signals that are output when FRC matches OCRA or OCRB. The compare match
signal is generated in the last state during which the values match (when FRC is updated from the
matching value to a new value). When FRC matches OCRA or OCRB, the compare match signal
is not generated until the next counter clock. Figure 9.29 shows the OCFA and OCFB set timing.
OCRA, OCRB
φ
Compare match
signal
FRC N N + 1
N
OCFA, OCFB
Figure 9.29 OCFA and OCFB Set Timing
Overflow Flag (OVF) Set Timing: OVF is set to 1 when FRC overflows from H'FFFF to H'0000.
Figure 9.30 shows the timing.
H'FFFF H'0000
Overflow signal
φ
FRC
OVF
Figure 9.30 OVF Set Timing
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 263 of 526
REJ09B0326-0600
9.5.5 Timer X Operation Modes
Table 9.17 shows the timer X operation modes.
Table 9.17 Timer X Operation Modes
Operation Mode
Reset
Active
Sleep
Watch
Sub-
active
Sub-
sleep
Standby
FRC Reset Functions Functions Reset Reset Reset Reset
OCRA, OCRB Reset Functions Functions Reset Reset Reset Reset
ICRA to ICRD Reset Functions Functions Reset Reset Reset Reset
TIER Reset Functions Functions Reset Reset Reset Reset
TCRX Reset Functions Functions Reset Reset Reset Reset
TOCR Reset Functions Functions Reset Reset Reset Reset
TCSRX Reset Functions Functions Reset Reset Reset Reset
9.5.6 Interrupt Sources
Timer X has three types of interrupts and seven interrupt sources: ICIA to ICID, OCIA, OCIB,
and FOVI. Table 9.18 lists the sources of interrupt requests. Each interrupt source can be enabled
or disabled by an interrupt enable bit in TIER. Although all seven interrupts share the same vector,
they have individual interrupt flags, so software can discriminate the interrupt source.
Table 9.18 Timer X Interrupt Sources
Interrupt Description Vector Address
ICIA Interrupt requested by ICFA H'0020
ICIB Interrupt requested by ICFB
ICIC Interrupt requested by ICFC
ICID Interrupt requested by ICFD
OCIA Interrupt requested by OCFA
OCIB Interrupt requested by OCFB
FOVI Interrupt requested by OVF
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 264 of 526
REJ09B0326-0600
9.5.7 Timer X Application Example
Figure 9.31 shows an example of the output of pulse signals with a 50% duty cycle and arbitrary
phase offset. To set up this output:
• Set bit CCLRA to 1 in TCSRX.
• Have software invert the OLVLA and OLVLB bits at each corresponding compare match.
FRC
Counter cleared
H'FFFF
OCRA
OCRB
H'0000
FTOA
FTOB
Figure 9.31 Pulse Output Example
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 265 of 526
REJ09B0326-0600
9.5.8 Application Notes
The following types of contention can occur in timer X operation.
1. Contention between FRC write and counter clear
If an FRC clear signal is generated in the T3 state of a write cycle to the lower byte of FRC,
clearing takes precedence and the write to the counter is not carried out. Figure 9.32 shows the
timing.
T
1
T
2
T
3
FRC lower byte write cycle
Address FRC address
Internal write
signal
φ
Counter clear
signal
FRC N H'0000
Figure 9.32 Contention between FRC Write and Clear
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 266 of 526
REJ09B0326-0600
2. Contention between FRC write and increment
If an FRC increment clock signal is generated in the T3 state of a write cycle to the lower byte
of FRC, the write takes precedence and the counter is not incremented. Figure 9.33 shows the
timing.
T1T2T3
FRC lower byte write cycle
Address
Internal write
signal
φ
FRC input clock
FRC N M
FRC write data
FRC address
Figure 9.33 Contention between FRC Write and Increment
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 267 of 526
REJ09B0326-0600
3. Contention between OCR write and compare match
If a compare match is generated in the T3 state of a write cycle to the lower byte of OCRA or
OCRB, the write to OCRA or OCRB takes precedence and the compare match signal is
inhibited. Figure 9.34 shows the timing.
T1T2T3
OCR lower byte write cycle
Address
Internal write
signal
φ
FRC
OCR N M
Write data
OCR address
N N + 1
Compare match
signal
Inhibited
Figure 9.34 Contention between OCR Write and Compare Match
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 268 of 526
REJ09B0326-0600
4. Internal clock switching and counter operation
Depending on the timing, FRC may be incremented by a switch between different internal
clock sources. Table 9.19 shows the relation between internal clock switchover timing (by
writing to bits CKS1 and CKS0) and FRC operation.
When FRC is internally clocked, an increment pulse is generated from the falling edge of an
internal clock signal, which is divided from the system clock (φ). For this reason, in a case like
No. 3 in table 9.19 where the switch is from a high clock signal to a low clock signal, the
switchover is seen as a falling edge, causing FRC to increment.
FRC can also be incremented by a switch between internal and external clocks.
Table 9.19 Internal Clock Switching and FRC Operation
No.
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
FRC Operation
1 Goes from low level
to low level
N + 1
Clock before
switching
Clock after
switching
Count clock
FRC
Write to CKS1 and CKS0
N
2 Goes from low
to high
N + 1 N + 2
Clock before
switching
Clock after
switching
Count clock
FRC
Write to CKS1 and CKS0
N
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 269 of 526
REJ09B0326-0600
No.
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
FRC Operation
3 Goes from high level
to low level
N + 1N N + 2
*
Clock before
switching
Clock after
switching
Count clock
FRC
Write to CKS1 and CKS0
4 Goes from high to high
N + 1 N + 2N
Clock before
switching
Clock after
switching
Count clock
Write to CKS1 and CKS0
FRC
Note: * The switchover is seen as a falling edge, and FRC is incremented.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 270 of 526
REJ09B0326-0600
9.6 Watchdog Timer
9.6.1 Overview
The watchdog timer has an 8-bit counter that is incremented by an input clock. If a system
runaway allows the counter value to overflow before being rewritten, the watchdog timer can reset
the chip internally.
Features
Features of the watchdog timer are given below.
• Incremented by internal clock source (φ/8192).
• A reset signal is generated when the counter overflows. The overflow period can be set from 1
to 256 times 8192/φ (from approximately 2 ms to 500 ms when φ = 4.19 MHz).
Block Diagram
Figure 9.35 shows a block diagram of the watchdog timer.
PSS
TCSRW
TCW
φ/8192
Legend:
TCSRW:
TCW:
PSS:
Timer control/status register W
Timer counter W
Prescaler S
φ
Internal data bus
Internal reset
signal
Figure 9.35 Block Diagram of Watchdog Timer
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 271 of 526
REJ09B0326-0600
Register Configuration
Table 9.20 shows the register configuration of the watchdog timer.
Table 9.20 Watchdog Timer Registers
Name Abbr. R/W Initial Value Address
Timer control/status register W TCSRW R/W H'AA H'FFBE
Timer counter W TCW R/W H'00 H'FFBF
9.6.2 Register Descriptions
Timer Control/Status Register W (TCSRW)
Bit 7 6 5 4 3 2 1 0
B6WI TCWE B4WI TCSRWE B2WI WDON B0WI WRST
Initial value 1 0 1 0 1 0 1 0
Read/Write R R/(W)* R R/(W)* R R/(W)* R R/(W)*
Note: * Write is permitted only under certain conditions, which are given in the descriptions of
the individual bits.
TCSRW is an 8-bit read/write register that controls write access to TCW and TCSRW itself,
controls watchdog timer operations, and indicates operating status.
Bit 7
Bit 6 Write Inhibit (B6WI): Bit 7 controls the writing of data to bit 6 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 7: B6WI Description
0 Bit 6 is write-enabled
1 Bit 6 is write-protected (initial value)
Bit 6
Timer Counter W Write Enable (TCWE): Bit 6 controls the writing of data to bit 8 to
TCW.
Bit 6: TCWE Description
0 Data cannot be written to TCW (initial value)
1 Data can be written to TCW
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 272 of 526
REJ09B0326-0600
Bit 5
Bit 4 Write Inhibit (B4WI): Bit 5 controls the writing of data to bit 4 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 5: B4WI Description
0 Bit 4 is write-enabled
1 Bit 4 is write-protected (initial value)
Bit 4
Timer Control/Status Register W Write Enable (TCSRWE): Bit 4 controls the writing
of data to TCSRW bits 2 and 0.
Bit 4: TCSRWE Description
0 Data cannot be written to bits 2 and 0 (initial value)
1 Data can be written to bits 2 and 0
Bit 3
Bit 2 Write Inhibit (B2WI): Bit 3 controls the writing of data to bit 2 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 3: B2WI Description
0 Bit 2 is write-enabled
1 Bit 2 is write-protected (initial value)
Bit 2
Watchdog Timer On (WDON): Bit 2 enables watchdog timer operation.
Counting starts when this bit is set to 1, and stops when this bit is cleared to 0.
Bit 2: WDON Description
0 Watchdog timer operation is disabled (initial value)
Clearing condition:
Reset, or when TCSRWE = 1 and 0 is written in both B2WI and WDON
1 Watchdog timer operation is enabled
Setting condition:
When TCSRWE = 1 and 0 is written in B2WI and 1 is written in WDON
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 273 of 526
REJ09B0326-0600
Bit 1
Bit 0 Write Inhibit (B0WI): Bit 1 controls the writing of data to bit 0 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 1: B0WI Description
0 Bit 0 is write-enabled
1 Bit 0 is write-protected (initial value)
Bit 0
Watchdog Timer Reset (WRST): Bit 0 indicates that TCW has overflowed, generating
an internal reset signal. The internal reset signal generated by the overflow resets the entire chip.
WRST is cleared to 0 by a reset from the RES pin, or when software writes 0.
Bit 0: WRST Description
0 Clearing conditions: (initial value)
• Reset by RES pin
• When TCSRWE = 1, and 0 is written in both B0WI and WRST
1 Setting condition:
When TCW overflows and an internal reset signal is generated
Timer Counter W (TCW)
Bit 7 6 5 4 3 2 1 0
TCW7 TCW6 TCW5 TCW4 TCW3 TCW2 TCW1 TCW0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
TCW is an 8-bit read/write up-counter, which is incremented by internal clock input. The input
clock is φ/8192. The TCW value can always be written or read by the CPU.
When TCW overflows from H'FF to H'00, an internal reset signal is generated and WRST is set to
1 in TCSRW. Upon reset, TCW is initialized to H'00.
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 274 of 526
REJ09B0326-0600
9.6.3 Timer Operation
The watchdog timer has an 8-bit counter (TCW) that is incremented by clock input (φ/8192).
When TCSRWE = 1 in TCSRW, if 0 is written in B2WI and 1 is simultaneously written in
WDON, TCW starts counting up (two write accesses to TCSRW are necessary in order to operate
the watchdog timer). When the TCW count value reaches H'FF, the next clock input causes the
watchdog timer to overflow and generates an internal reset signal. The internal reset signal is
output for 512 clock cycles of the φOSC clock. It is possible to write to TCW, causing TCW to
count up from the written value. The overflow period can be set in the range from 1 to 256 input
clocks, depending on the value written in TCW.
Figure 9.36 shows an example of watchdog timer operations.
Example: φ = 4 MHz and the desired overflow period is 30 ms.
4 × 10
6
8192 × 30 × 10
–3
= 14.6
The value set in TCW should therefore be 256 – 15 = 241 (H'F1).
H'F1
TCW overflow
Start
H'F1 written
in TCW H'F1 written in TCW Reset
Internal reset
signal
512 φOSC clock cycles
H'FF
H'00
TCW count
value
Figure 9.36 Typical Watchdog Timer Operations (Example)
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 275 of 526
REJ09B0326-0600
9.6.4 Watchdog Timer Operation States
Table 9.21 summarizes the watchdog timer operation states.
Table 9.21 Watchdog Timer Operation States
Operation Mode
Reset
Active
Sleep
Watch
Sub-
active
Sub-
sleep
Standby
TCW Reset Functions Functions Halted Halted Halted Halted
TCSRW Reset Functions Functions Retained Retained Retained Retained
Section 9 Timers
Rev. 6.00 Sep 12, 2006 page 276 of 526
REJ09B0326-0600
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 277 of 526
REJ09B0326-0600
Section 10 Serial Communication Interface
10.1 Overview
The H8/3644 Group is provided with a two-channel serial communication interface (SCI). Table
10.1 summarizes the functions and features of the two SCI channels.
Table 10.1 Serial Communication Interface Functions
Channel Functions Features
SCI1 Synchronous serial transfer
• Choice of 8-bit or 16-bit data length
• Continuous clock output
• Choice of 8 internal clocks (φ/1024 to φ/2)
or external clock
• Open drain output possible
• Interrupt requested at completion of
transfer
SCI3 Synchronous serial transfer
• 8-bit data length
• Send, receive, or simultaneous
send/receive
Asynchronous serial transfer
• Multiprocessor communication
• Choice of 7-bit or 8-bit data length
• Choice of 1 or 2 stop bits
• Parity addition
• On-chip baud rate generator
• Receive error detection
• Break detection
• Interrupt requested at completion of
transfer or error
10.2 SCI1
10.2.1 Overview
Serial communication interface 1 (SCI1) performs synchronous serial transfer of 8-bit or 16-bit
data. SSB (Synchronized Serial Bus) communication is also provided, enabling multiple ICs to be
controlled.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 278 of 526
REJ09B0326-0600
Features
• Choice of 8-bit or 16-bit data length
• Choice of eight internal clock sources (φ/1024, φ/256, φ/64, φ/32, φ/16, φ/8, φ/4, φ/2) or an
external clock
• Interrupt requested at completion of transfer
• Choice of HOLD mode or LATCH mode in SSB mode.
Block Diagram
Figure 10.1 shows a block diagram of SCI1.
φ
SCK1
SI1
SO1
SCR1
SCSR1
SDRU
SDRL
PSS
Transfer bit counter
Transmit/receive
control circuit
Internal data bus
Legend:
SCR1:
SCSR1:
SDRU:
SDRL:
IRRS1:
PSS:
Serial control register 1
Serial control/status register 1
Serial data register U
Serial data register L
SCI1 interrupt request flag
Prescaler S
IRRS1
Figure 10.1 SCI1 Block Diagram
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 279 of 526
REJ09B0326-0600
Pin Configuration
Table 10.2 shows the SCI1 pin configuration.
Table 10.2 Pin Configuration
Name Abbr. I/O Function
SCI1 clock pin SCK1 I/O SCI1 clock input or output
SCI1 data input pin SI1 Input SCI1 receive data input
SCI1 data output pin SO1 Output SCI1 transmit data output
Register Configuration
Table 10.3 shows the SCI1 register configuration.
Table 10.3 SCI1 Registers
Name Abbr. R/W Initial Value Address
Serial control register 1 SCR1 R/W H'00 H'FFA0
Serial control status register 1 SCSR1 R/W H'9C H'FFA1
Serial data register U SDRU R/W Undefined H'FFA2
Serial data register L SDRL R/W Undefined H'FFA3
10.2.2 Register Descriptions
Serial Control Register 1 (SCR1)
Bit 7 6 5 4 3 2 1 0
SNC1 SNC0 MRKON LTCH CKS3 CKS2 CKS1 CKS0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
SCR1 is an 8-bit read/write register for selecting the operation mode, the transfer clock source,
and the prescaler division ratio.
Upon reset, SCR1 is initialized to H'00. Writing to this register during a transfer stops the transfer.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 280 of 526
REJ09B0326-0600
Bits 7 and 6
Operation Mode Select 1, 0 (SNC1, SNC0): Bits 7 and 6 select the operation
mode.
Bit 7: SNC1 Bit 6: SNC0 Description
0 0 8-bit synchronous transfer mode (initial value)
1 16-bit synchronous transfer mode
1 0 Continuous clock output mode*1
1 Reserved*2
Notes: 1. Pins SI1 and SO1 should be used as general input or output ports.
2. Don’t set bits SNC1 and SNC0 to 11.
Bits 5
TAIL MARK Control (MRKON): Bit 5 controls TAIL MARK output after an 8- or 16-
bit data transfer.
Bit 5: MRKON Description
0 TAIL MARK is not output (synchronous mode) (initial value)
1 TAIL MARK is output (SSB mode)
Bits 4
LATCH TAIL Select (LTCH): Bit 4 selects whether LATCH TAIL or HOLD TAIL is
output as TAIL MARK when bit MRKON is set to 1 (SSB mode).
Bit 4: LTCH Description
0 HOLD TAIL is output (initial value)
1 LATCH TAIL is output
Bit 3
Clock Source Select (CKS3): Bit 3 selects the clock source and sets pin SCK1 as an input
or output pin.
Bit 3: CKS3 Description
0 Clock source is prescaler S, and pin SCK1 is output pin (initial value)
1 Clock source is external clock, and pin SCK1 is input pin
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 281 of 526
REJ09B0326-0600
Bits 2 to 0
Clock Select (CKS2 to CKS 0): When CKS3 = 0, bits 2 to 0 select the prescaler
division ratio and the serial clock cycle.
Serial Clock Cycle
Bit 2: CKS2 Bit 1: CKS1 Bit 0: CKS0 Prescaler Division φ
φφ
φ = 5 MHz φ
φφ
φ = 2.5 MHz
0 0 0 φ/1024
(initial value) 204.8 µs 409.6 µs
1 φ/256 51.2 µs 102.4 µs
1 0 φ/64 12.8 µs 25.6 µs
1 φ/32 6.4 µs 12.8 µs
1 0 0 φ/16 3.2 µs 6.4 µs
1 φ/8 1.6 µs 3.2 µs
1 0 φ/4 0.8 µs 1.6 µs
1 φ/2 0.8 µs
Serial Control/Status Register 1 (SCSR1)
Bit 7 6 5 4 3 2 1 0
SOL ORER MTRF STF
Initial value 1 0 0 1 1 1 0 0
Read/Write R/W R/(W)* R R/W
Note: * Only a write of 0 for flag clearing is possible.
SCSR1 is an 8-bit register indicating operation status and error status.
Upon reset, SCSR1 is initialized to H'9C.
Bit 7
Reserved Bit: Bit 7 is reserved; it is always read as 1, and cannot be modified.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 282 of 526
REJ09B0326-0600
Bit 6
Extended Data Bit (SOL): Bit 6 sets the SO1 output level. When read, SOL returns the
output level at the SO1 pin. After completion of a transmission, SO1 continues to output the value
of the last bit of transmitted data. The SO1 output can be changed by writing to SOL before or
after a transmission. The SOL bit setting remains valid only until the start of the next transmission.
SSB mode settings also become invalid. To control the level of the SO1 pin after transmission
ends, it is necessary to write to the SOL bit at the end of each transmission. Do not write to this
register while transmission is in progress, because that may cause a malfunction.
Bit 6: SOL Description
0 Read: SO1 pin output level is low (initial value)
Write: SO1 pin output level changes to low
1 Read: SO1 pin output level is high
Write: SO1 pin output level changes to high
Bit 5
Overrun Error Flag (ORER): When an external clock is used, bit 5 indicates the
occurrence of an overrun error. If noise occurs during a transfer, causing an extraneous pulse to be
superimposed on the normal serial clock, incorrect data may be transferred. If a clock pulse is
input after transfer completion, this bit is set to 1 indicating an overrun.
Bit 5: ORER Description
0 Clearing condition:
After reading ORER = 1, cleared by writing 0 to ORER (initial value)
1 Setting condition:
Set if a clock pulse is input after transfer is complete, when an external clock is
used
Bits 4 to 2
Reserved Bits: Bits 4 to 2 are reserved. They are always read as 0, and cannot be
modified.
Bit 1
TAIL MARK Transmit Flag (MTRF): When bit MRKON is set to 1, bit 1 indicates that
TAIL MARK is being sent. Bit 1 is a read-only bit and cannot be modified.
Bit 1: MTRF Description
0 Idle state, or 8- or 16-bit data is being transferred (initial value)
1 TAIL MARK is being sent
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 283 of 526
REJ09B0326-0600
Bit 0
Start Flag (STF): Bit 0 controls the start of a transfer. Setting this bit to 1 causes SCI1 to
start transferring data.
During the transfer or while waiting for the first clock pulse, this bit remains set to 1. It is cleared
to 0 upon completion of the transfer. It can therefore be used as a busy flag.
Bit 0: STF Description
0 Read: Indicates that transfer is stopped (initial value)
Write: Invalid
1 Read: Indicates transfer in progress
Write: Starts a transfer operation
Serial Data Register U (SDRU)
Bit 7 6 5 4 3 2 1 0
SDRU7 SDRU6 SDRU5 SDRU4 SDRU3 SDRU2 SDRU1 SDRU0
Initial value Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
SDRU is an 8-bit read/write register. It is used as the data register for the upper 8 bits in 16-bit
transfer (SDRL is used for the lower 8 bits).
Data written to SDRU is output to SDRL starting from the least significant bit (LSB). This data is
then replaced by LSB-first data input at pin SI1, which is shifted in the direction from the most
significant bit (MSB) toward the LSB.
SDRU must be written or read only after data transmission or reception is complete. If this register
is written or read while a data transfer is in progress, the data contents are not guaranteed.
The SDRU value upon reset is undefined.
Serial Data Register L (SDRL)
Bit 7 6 5 4 3 2 1 0
SDRL7 SDRL6 SDRL5 SDRL4 SDRL3 SDRL2 SDRL1 SDRL0
Initial value Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 284 of 526
REJ09B0326-0600
SDRL is an 8-bit read/write register. It is used as the data register in 8-bit transfer, and as the data
register for the lower 8 bits in 16-bit transfer (SDRU is used for the upper 8 bits).
In 8-bit transfer, data written to SDRL is output from pin SO1 starting from the least significant bit
(LSB). This data is then replaced by LSB-first data input at pin SI1, which is shifted in the
direction from the most significant bit (MSB) toward the LSB.
In 16-bit transfer, operation is the same as for 8-bit transfer, except that input data is fed in via
SDRU.
SDRL must be written or read only after data transmission or reception is complete. If this register
is read or written while a data transfer is in progress, the data contents are not guaranteed.
The SDRL value upon reset is undefined.
10.2.3 Operation in Synchronous Mode
Data can be sent and received in an 8-bit or 16-bit format, with an internal or external clock
selected as the clock source. Overrun errors can be detected when an external clock is used.
Clock: The serial clock can be selected from a choice of eight internal clocks and an external
clock. When an internal clock source is selected, pin SCK1 becomes the clock output pin. When
continuous clock output mode is selected (SCR1 bits SNC1 and SNC0 are set to 10), the clock
signal (φ/1024 to φ/2) selected in bits CKS2 to CKS0 is output continuously from pin SCK1. When
an external clock is used, pin SCK1 is the clock input pin.
Data Transfer Format: Figure 10.2 shows the data transfer format. Data is sent and received
starting from the least significant bit, in LSB-first format. Transmit data is output from one falling
edge of the serial clock until the next rising edge. Receive data is latched at the rising edge of the
serial clock.
SCK
SO /SI
1
11 Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7
Figure 10.2 Transfer Format
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 285 of 526
REJ09B0326-0600
Data Transfer Operations
Transmitting: A transmit operation is carried out as follows.
1. Set bits SO1 and SCK1 to 1 in PMR3 to select the SO1 and SCK1 pin functions. If necessary,
set bit POF1 in PMR7 for NMOS open-drain output at pin SO1.
2. Clear bit SNC1 in SCR1 to 0, set bit SNC0 to 0 or 1, and clear bit MRKON to 0, designating
8- or 16-bit synchronous transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing
data to SCR1 when bit MRKON in SCR1 is cleared to 0 initializes the internal state of SCI1.
3. Write transmit data in SDRL and SDRU, as follows.
8-bit transfer mode: SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
4. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and outputs transmit data at pin SO1.
5. After data transmission is complete, bit IRRS1 in interrupt request register 2 (IRR2) is
set to 1.
When an internal clock is used, a serial clock is output from pin SCK1 in synchronization with the
transmit data. After data transmission is complete, the serial clock is not output until the next time
the start flag is set to 1. During this time, pin SO1 continues to output the value of the last bit
transmitted.
When an external clock is used, data is transmitted in synchronization with the serial clock input at
pin SCK1. After data transmission is complete, an overrun occurs if the serial clock continues to be
input; no data is transmitted and the SCSR1 overrun error flag (bit ORER) is set to 1.
While transmission is stopped, the output value of pin SO1 can be changed by rewriting bit SOL in
SCSR1.
Receiving: A receive operation is carried out as follows.
1. Set bits SI1 and SCK1 to 1 in PMR3 to select the SI1 and SCK1 pin functions.
2. Clear bit SNC1 in SCR1 to 0, set bit SNC0 to 0 or 1, and clear bit MRKON to 0, designating
8- or 16-bit synchronous transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing
data to SCR1 when bit MRKON in SCR1 is cleared to 0 initializes the internal state of SCI1.
3. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and receives data at pin SI1.
4. After data reception is complete, bit IRRS1 in interrupt request register 2 (IRR2) is set to 1.
5. Read the received data from SDRL and SDRU, as follows.
8-bit transfer mode: SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 286 of 526
REJ09B0326-0600
6. After data reception is complete, an overrun occurs if the serial clock continues to be input; no
data is received and the SCSR1 overrun error flag (bit ORER) is set to 1.
Simultaneous Transmit/Receive: A simultaneous transmit/receive operation is carried out as
follows.
1. Set bits SO1, SI1, and SCK1 to 1 in PMR3 to select the SO1, SI1, and SCK1 pin functions. If
necessary, set bit POF1 in PMR7 for NMOS open-drain output at pin SO1.
2. Clear bit SNC1 in SCR1 to 0, set bit SNC0 to 0 or 1, and clear bit MRKON to 0, designating
8- or 16-bit synchronous transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing
data to SCR1 when bit MRKON in SCR1 is cleared to 0 initializes the internal state of SCI1.
3. Write transmit data in SDRL and SDRU, as follows.
8-bit transfer mode: SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
4. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating. Transmit data is output at pin SO1.
Receive data is input at pin SI1.
5. After data transmission and reception are complete, bit IRRS1 in IRR2 is set to 1.
6. Read the received data from SDRL and SDRU, as follows.
8-bit transfer mode: SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
When an internal clock is used, a serial clock is output from pin SCK1 in synchronization with the
transmit data. After data transmission is complete, the serial clock is not output until the next time
the start flag is set to 1. During this time, pin SO1 continues to output the value of the last bit
transmitted.
When an external clock is used, data is transmitted and received in synchronization with the serial
clock input at pin SCK1. After data transmission and reception are complete, an overrun occurs if
the serial clock continues to be input; no data is transmitted or received and the SCSR1 overrun
error flag (bit ORER) is set to 1.
While transmission is stopped, the output value of pin SO1 can be changed by rewriting bit SOL in
SCSR1.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 287 of 526
REJ09B0326-0600
10.2.4 Operation in SSB Mode
SSB communication uses two lines, SCL (Serial Clock) and SDA (Serial Data), and enables
multiple ICs to be connected as shown in figure 10.3.
In SSB mode, TAIL MARK is sent after an 8- or 16-bit data transfer. HOLD TAIL or LATCH
TAIL can be selected as TAIL MARK.
H8/3644
Group SCK
SO
SCL
SDA
1
1
SCL
SDA
IC-A
SCL
SDA
IC-B
SCL
SDA
IC-C
Figure 10.3 Example of SSB Connection
Clock: The transfer clock can be selected from eight internal clocks or an external clock, but since
the H8/3644 Group uses clock output, an external clock should not be selected. The transfer rate
can be selected by bits CKS2 to CKS0 in SCR1. Since this is also the TAIL MARK transfer rate,
the setting should be made to give a transfer clock cycle of at least 2 µs.
Data Transfer Format: Figure 10.4 shows the SCI1 transfer format. Data is sent starting from the
least significant bit, in LSB-first format. TAIL MARK is sent after an 8- or 16-bit data transfer.
SCK
1
1
SO Bit 1Bit 0 Bit 2 Bit 3 Bit 4 Bit 14Bit 5 Bit 15
TAIL MARK
1 frame
Figure 10.4 Transfer Format (When SNC1 = 0, SNC0 = 1, MRKON = 1)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 288 of 526
REJ09B0326-0600
TAIL MARK: TAIL MARK can be either HOLD TAIL or LATCH TAIL. The output
waveforms of HOLD TAIL and LATCH TAIL are shown in figure 10.5. Time t in the figure is
determined by the transfer clock cycle set in bits CKS2 to CKS0 in SCR1.
SCK1
1
SO Bit 14
ttt t2t
Bit 15
< HOLD TAIL >
Bit 0
tt
SCK1
1
SO Bit 14
ttt t2t
Bit 15
< LATCH TAIL >
t
Figure 10.5 HOLD TAIL and LATCH TAIL Waveforms
Transmitting: A transmit operation is carried out as follows.
1. Set bit SOL in SCSR1 to 1.
2. Set bits SO1 and SCK1 to 1 in PMR3 to select the S01 and SCK1 pin functions. Set bit POF1 in
PMR7 to 1 for NMOS open-drain output at pin SO1.
3. Clear bit SNC1 in SCR1 to 0 and set bit SNC0 to 0 or 1, designating 8-bit mode or 16-bit
mode. Set bit MRKON in SCR1 to 1, selecting SSB mode.
4. Write transmit data in SDRL and SDRU as follows, and select TAIL MARK with bit LTCH in
SCR1.
8-bit mode: SDRL
16-bit mode: Upper byte in SDRU, lower byte in SDRL
5. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and outputs transmit data at pin S01.
6. After 8- or 16-bit data transmission is complete, bit STF in SCSR1 is cleared to 0 and bit
IRRS1 in interrupt request register 2 (IRRS2) is set to 1. The selected TAIL MARK is output
after the data transmission. During TAIL MARK output, bit MTRF in SCSR1 is set to 1.
Data can be sent continuously by repeating steps 4 to 6. Check that SCI1 is in the idle state before
rewriting bit MRKON in SCR1.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 289 of 526
REJ09B0326-0600
10.2.5 Interrupts
SCI1 can generate an interrupt at the end of a data transfer.
When an SCI1 transfer is complete, bit IRRS1 in interrupt request register 2 (IRR2) is set to 1.
SCI1 interrupt requests can be enabled or disabled by bit IENS1 of interrupt enable register 2
(IENR2).
For further details, see section 3.3, Interrupts.
10.3 SCI3
10.3.1 Overview
Serial communication interface 3 (SCI3) can carry out serial data communication in either
asynchronous or synchronous mode. It is also provided with a multiprocessor communication
function that enables serial data to be transferred among processors.
Features
Features of SCI3 are listed below.
• Choice of asynchronous or synchronous mode for serial data communication
Asynchronous mode
Serial data communication is performed asynchronously, with synchronization provided
character by character. In this mode, serial data can be exchanged with standard
asynchronous communication LSIs such as a Universal Asynchronous
Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter
(ACIA). A multiprocessor communication function is also provided, enabling serial data
communication among processors.
There is a choice of 12 data transfer formats.
Data length 7 or 8 bits
Stop bit length 1 or 2 bits
Parity Even, odd, or none
Multiprocessor bit “1” or “0”
Receive error detection Parity, overrun, and framing errors
Break detection Break detected by reading the RXD pin level directly when
a framing error occurs
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 290 of 526
REJ09B0326-0600
Synchronous mode
Serial data communication is synchronized with a clock. In his mode, serial data can be
exchanged with another LSI that has a synchronous communication function.
Data length 8 bits
Receive error detection Overrun errors
• Full-duplex communication
Separate transmission and reception units are provided, enabling transmission and reception to
be carried out simultaneously. The transmission and reception units are both double-buffered,
allowing continuous transmission and reception.
• On-chip baud rate generator, allowing any desired bit rate to be selected
• Choice of an internal or external clock as the transmit/receive clock source
• Six interrupt sources: transmit end, transmit data empty, receive data full, overrun error,
framing error, and parity error
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 291 of 526
REJ09B0326-0600
Block Diagram
Figure 10.6 shows a block diagram of SCI3.
Clock
TXD
RXD
SCK
3
BRR
SMR
SCR3
SSR
TDR
RDR
TSR
RSR
Transmit/receive
control circuit
Internal data bus
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR3:
SSR:
BRR:
BRC:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register 3
Serial status register
Bit rate register
Bit rate counter
Interrupt request
(TEI, TXI, RXI, ERI)
Internal clock (φ/64, φ/16, φ/4, φ)
External
clock
BRC
Baud rate generator
Figure 10.6 SCI3 Block Diagram
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 292 of 526
REJ09B0326-0600
Pin Configuration
Table 10.4 shows the SCI3 pin configuration.
Table 10.4 Pin Configuration
Name Abbr. I/O Function
SCI3 clock SCK3 I/O SCI3 clock input/output
SCI3 receive data input RXD Input SCI3 receive data input
SCI3 transmit data output TXD Output SCI3 transmit data output
Register Configuration
Table 10.5 shows the SCI3 register configuration.
Table 10.5 Registers
Name Abbr. R/W Initial Value Address
Serial mode register SMR R/W H'00 H'FFA8
Bit rate register BRR R/W H'FF H'FFA9
Serial control register 3 SCR3 R/W H'00 H'FFAA
Transmit data register TDR R/W H'FF H'FFAB
Serial status register SSR R/W H'84 H'FFAC
Receive data register RDR R H'00 H'FFAD
Transmit shift register TSR Protected
Receive shift register RSR Protected
Bit rate counter BRC Protected
10.3.2 Register Descriptions
Receive Shift Register (RSR)
Bit 7 6 5 4 3 2 1 0
Read/Write
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 293 of 526
REJ09B0326-0600
RSR is a register used to receive serial data. Serial data input to RSR from the RXD pin is set in
the order in which it is received, starting from the LSB (bit 0), and converted to parallel data.
When one byte of data is received, it is transferred to RDR automatically.
RSR cannot be read or written directly by the CPU.
Receive Data Register (RDR)
Bit 7 6 5 4 3 2 1 0
RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0
Initial value 0 0 0 0 0 0 0 0
Read/Write R R R R R R R R
RDR is an 8-bit register that stores received serial data.
When reception of one byte of data is finished, the received data is transferred from RSR to RDR,
and the receive operation is completed. RSR is then enabled for reception. RSR and RDR are
double-buffered, allowing consecutive receive operations.
RDR is a read-only register, and cannot be written by the CPU.
RDR is initialized to H'00 upon reset, and in standby, watch, subactive, or subsleep mode.
Transmit Shift Register (TSR)
Bit 7 6 5 4 3 2 1 0
Read/Write
TSR is a register used to transmit serial data. Transmit data is first transferred from TDR to TSR,
and serial data transmission is carried out by sending the data to the TXD pin in order, starting
from the LSB (bit 0). When one byte of data is transmitted, the next byte of transmit data is
transferred from TDR to TSR, and transmission started, automatically. Data transfer from TDR to
TSR is not performed if no data has been written to TDR (if bit TDRE is set to 1 in the serial
status register (SSR)).
TSR cannot be read or written directly by the CPU.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 294 of 526
REJ09B0326-0600
Transmit Data Register (TDR)
Bit 7 6 5 4 3 2 1 0
TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0
Initial value 1 1 1 1 1 1 1 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
TDR is an 8-bit register that stores transmit data. When TSR is found to be empty, the transmit
data written in TDR is transferred to TSR, and serial data transmission is started. Continuous
transmission is possible by writing the next transmit data to TDR during TSR serial data
transmission.
TDR can be read or written by the CPU at any time.
TDR is initialized to H'FF upon reset, and in standby, watch, subactive, or subsleep mode.
Serial Mode Register (SMR)
Bit 7 6 5 4 3 2 1 0
COM CHR PE PM STOP MP CKS1 CKS0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
SMR is an 8-bit register used to set the serial data transfer format and to select the clock source for
the baud rate generator.
SMR can be read or written by the CPU at any time.
SMR is initialized to H'00 upon reset, and in standby, watch, subactive, or subsleep mode.
Bit 7
Communication Mode (COM): Bit 7 selects whether SCI3 operates in asynchronous
mode or synchronous mode.
Bit 7: COM Description
0 Asynchronous mode (initial value)
1 Synchronous mode
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 295 of 526
REJ09B0326-0600
Bit 6
Character Length (CHR): Bit 6 selects either 7 or 8 bits as the data length to be used in
asynchronous mode. In synchronous mode the data length is always 8 bits, irrespective of the bit 6
setting.
Bit 6: CHR Description
0 8-bit data (initial value)
1 7-bit data*
Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted.
Bit 5
Parity Enable (PE): Bit 5 selects whether a parity bit is to be added during transmission
and checked during reception in asynchronous mode. In synchronous mode parity bit addition and
checking is not performed, irrespective of the bit 5 setting.
Bit 5: PE Description
0 Parity bit addition and checking disabled (initial value)
1 Parity bit addition and checking enabled*
Note: * When PE is set to 1, even or odd parity, as designated by bit PM, is added to transmit
data before it is sent, and the received parity bit is checked against the parity
designated by bit PM.
Bit 4
Parity Mode (PM): Bit 4 selects whether even or odd parity is to be used for parity
addition and checking. The PM bit setting is only valid in asynchronous mode when bit PE is set
to 1, enabling parity bit addition and checking. The PM bit setting is invalid in synchronous mode,
and in asynchronous mode if parity bit addition and checking is disabled.
Bit 4: PM Description
0 Even parity*1 (initial value)
1 Odd parity*2
Notes: 1. When even parity is selected, a parity bit is added in transmission so that the total
number of 1 bits in the transmit data plus the parity bit is an even number; in reception,
a check is carried out to confirm that the number of 1 bits in the receive data plus the
parity bit is an even number.
2. When odd parity is selected, a parity bit is added in transmission so that the total
number of 1 bits in the transmit data plus the parity bit is an odd number; in reception, a
check is carried out to confirm that the number of 1 bits in the receive data plus the
parity bit is an odd number.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 296 of 526
REJ09B0326-0600
Bit 3
Stop Bit Length (STOP): Bit 3 selects 1 bit or 2 bits as the stop bit length is asynchronous
mode. The STOP bit setting is only valid in asynchronous mode. When synchronous mode is
selected the STOP bit setting is invalid since stop bits are not added.
Bit 3: STOP Description
0 1 stop bit*1 (initial value)
1 2 stop bits*2
Notes: 1. In transmission, a single 1 bit (stop bit) is added at the end of a transmit character.
2. In transmission, two 1 bits (stop bits) are added at the end of a transmit character.
In reception, only the first of the received stop bits is checked, irrespective of the STOP bit setting.
If the second stop bit is 1 it is treated as a stop bit, but if 0, it is treated as the start bit of the next
transmit character.
Bit 2
Multiprocessor Mode (MP): Bit 2 enables or disables the multiprocessor communication
function. When the multiprocessor communication function is enabled, the parity settings in the
PE and PM bits are invalid. The MP bit setting is only valid in asynchronous mode. When
synchronous mode is selected the MP bit should be set to 0. For details on the multiprocessor
communication function, see section 10.3.6, Multiprocessor Communication Function.
Bit 2: MP Description
0 Multiprocessor communication function disabled (initial value)
1 Multiprocessor communication function enabled
Bits 1 and 0
Clock Select 1, 0 (CKS1, CKS0): Bits 1 and 0 choose φ/64, φ/16, φ/4, or φ as the
clock source for the baud rate generator.
For the relation between the clock source, bit rate register setting, and baud rate, see Bit Rate
Register (BRR).
Bit 1: CKS1 Bit 0: CKS0 Description
0 0 φ clock (initial value)
1 φ/4 clock
1 0 φ/16 clock
1 φ/64 clock
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 297 of 526
REJ09B0326-0600
Serial Control Register 3 (SCR3)
Bit 7 6 5 4 3 2 1 0
TIE RIE TE RE MPIE TEIE CKE1 CKE0
Initial value 0 0 0 0 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
SCR3 is an 8-bit register for selecting transmit or receive operation, the asynchronous mode clock
output, interrupt request enabling or disabling, and the transmit/receive clock source.
SCR3 can be read or written by the CPU at any time.
SCR3 is initialized to H'00 upon reset, and in standby, watch, subactive, or subsleep mode.
Bit 7
Transmit interrupt Enable (TIE): Bit 7 selects enabling or disabling of the transmit data
empty interrupt request (TXI) when transmit data is transferred from the transmit data register
(TDR) to the transmit shift register (TSR), and bit TDRE in the serial status register (SSR) is set to
1.
TXI can be released by clearing bit TDRE or bit TIE to 0.
Bit 7: TIE Description
0 Transmit data empty interrupt request (TXI) disabled (initial value)
1 Transmit data empty interrupt request (TXI) enabled
Bit 6
Receive Interrupt Enable (RIE): Bit 6 selects enabling or disabling of the receive data
full interrupt request (RXI) and the receive error interrupt request (ERI) when receive data is
transferred from the receive shift register (RSR) to the receive data register (RDR), and bit RDRF
in the serial status register (SSR) is set to 1. There are three kinds of receive error: overrun,
framing, and parity.
RXI and ERI can be released by clearing bit RDRF or the FER, PER, or OER error flag to 0, or by
clearing bit RIE to 0.
Bit 6: RIE Description
0 Receive data full interrupt request (RXI) and receive error interrupt request
(ERI) disabled (initial value)
1 Receive data full interrupt request (RXI) and receive error interrupt request
(ERI) enabled
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 298 of 526
REJ09B0326-0600
Bit 5
Transmit Enable (TE): Bit 5 selects enabling or disabling of the start of transmit
operation.
Bit 5: TE Description
0 Transmit operation disabled*1 (TXD pin is transmit data pin)*3 (initial value)
1 Transmit operation enabled*2 (TXD pin is transmit data pin)*3
Notes: 1. Bit TDRE in SSR is fixed at 1.
2. When transmit data is written to TDR in this state, bit TDR in SSR is cleared to 0 and
serial data transmission is started. Be sure to carry out serial mode register (SMR)
settings to decide the transmission format before setting bit TE to 1.
3. When bit TXD in PMR7 is set to 1. When bit TXD is cleared to 0, the TXD pin functions
as an I/O port regardless of the TE bit setting.
Bit 4
Receive Enable (RE): Bit 4 selects enabling or disabling of the start of receive operation.
Bit 4: RE Description
0 Receive operation disabled*1 (RXD pin is I/O port) (initial value)
1 Receive operation enabled*2 (RXD pin is receive data pin)
Notes: 1. Note that the RDRF, FER, PER, and OER flags in SSR are not affected when bit RE is
cleared to 0, and retain their previous state.
2. In this state, serial data reception is started when a start bit is detected in asynchronous
mode or serial clock input is detected in synchronous mode. Be sure to carry out serial
mode register (SMR) settings to decide the reception format before setting bit RE to 1.
Bit 3
Multiprocessor Interrupt Enable (MPIE): Bit 3 selects enabling or disabling of the
multiprocessor interrupt request. The MPIE bit setting is only valid when asynchronous mode is
selected and reception is carried out with bit MP in SMR set to 1. The MPIE bit setting is invalid
when bit COM is set to 1 or bit MP is cleared to 0.
Bit 3: MPIE Description
0 Multiprocessor interrupt request disabled (normal receive operation)
(initial value)
Clearing condition:
When data is received in which the multiprocessor bit is set to 1
1 Multiprocessor interrupt request enabled*
Note: * Receive data transfer from RSR to RDR, receive error detection, and setting of the
RDRF, FER, and OER status flags in SSR is not performed. RXI, ERI, and setting of
the RDRF, FER, and OER flags in SSR, are disabled until data with the multiprocessor
bit set to 1 is received. When a receive character with the multiprocessor bit set to 1 is
received, bit MPBR in SSR is set to 1, bit MPIE is automatically cleared to 0, and RXI
and ERI requests (when bits TIE and RIE in serial control register (SCR) are set to 1)
and setting of the RDRF, FER, and OER flags are enabled.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 299 of 526
REJ09B0326-0600
Bit 2
Transmit End Interrupt Enable (TEIE): Bit 2 selects enabling or disabling of the
transmit end interrupt request (TEI) if there is no valid transmit data in TDR when MSB data is to
be sent.
Bit 2: TEIE Description
0 Transmit end interrupt request (TEI) disabled (initial value)
1 Transmit end interrupt request (TEI) enabled*
Note: * TEI can be released by clearing bit TDRE to 0 and clearing bit TEND to 0 in SSR, or by
clearing bit TEIE to 0.
Bits 1 and 0
Clock Enable 1 and 0 (CKE1, CKE0): Bits 1 and 0 select the clock source and
enabling or disabling of clock output from the SCK3 pin. These bits determine whether the SCK3
pin functions as an I/O port, a clock output pin, or a clock input pin.
The CKE0 bit setting is only valid in case of internal clock operation (CKE1 = 0) in asynchronous
mode. In synchronous mode, or when external clock operation is used (CKE1 = 1), bit CKE0
should be cleared to 0.
After setting bits CKE1 and CKE0, set the operating mode in the serial mode register (SMR).
For details on clock source selection, see table 10.10 in 10.3.3, Operation.
Description
Bit 1: CKE1 Bit 0: CKE0 Communication Mode Clock Source SCK3 Pin Function
0 0 Asynchronous Internal clock I/O port*1
Synchronous Internal clock
Serial clock output*1
1 Asynchronous Internal clock
Clock output*2
Synchronous Reserved
1 0 Asynchronous External clock
Clock input*3
Synchronous External clock
Serial clock input
1 Asynchronous Reserved
Synchronous Reserved
Notes: 1. Initial value
2. A clock with the same frequency as the bit rate is output.
3. Input a clock with a frequency 16 times the bit rate.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 300 of 526
REJ09B0326-0600
Serial Status Register (SSR)
Bit 7 6 5 4 3 2 1 0
TDRE RDRF OER FER PER TEND MPBR MPBT
Initial value 1 0 0 0 0 1 0 0
Read/Write R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W
Note: * Only a write of 0 for flag clearing is possible.
SSR is an 8-bit register containing status flags that indicate the operational status of SCI3, and
multiprocessor bits.
SSR can be read or written by the CPU at any time, but only a write of 1 is possible to bits TDRE,
RDRF, OER, PER, and FER. In order to clear these bits by writing 0, 1 must first be read.
Bits TEND and MPBR are read-only bits, and cannot be modified.
SSR is initialized to H'84 upon reset, and in standby, watch, subactive, or subsleep mode.
Bit 7
Transmit Data Register Empty (TDRE): Bit 7 indicates that transmit data has been
transferred from TDR to TSR.
Bit 7: TDRE Description
0 Transmit data written in TDR has not been transferred to TSR
Clearing conditions:
• After reading TDRE = 1, cleared by writing 0 to TDRE
• When data is written to TDR by an instruction
1 Transmit data has not been written to TDR, or transmit data written in TDR has
been transferred to TSR
Setting conditions:
• When bit TE in SCR3 is cleared to 0
• When data is transferred from TDR to TSR (initial value)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 301 of 526
REJ09B0326-0600
Bit 6
Receive Data Register Full (RDRF): Bit 6 indicates that received data is stored in RDR.
Bit 6: RDRF Description
0 There is no receive data in RDR (initial value)
Clearing conditions:
• After reading RDRF = 1, cleared by writing 0 to RDRF
• When RDR data is read by an instruction
1 There is receive data in RDR
Setting condition:
When reception ends normally and receive data is transferred from RSR to
RDR
Note: If an error is detected in the receive data, or if the RE bit in SCR3 has been cleared to 0,
RDR and bit RDRF are not affected and retain their previous state.
Note that if data reception is completed while bit RDRF is still set to 1, an overrun error
(OER) will result and the receive data will be lost.
Bit 5
Overrun Error (OER): Bit 5 indicates that an overrun error has occurred during
reception.
Bit 5: OER Description
0 Reception in progress or completed*1 (initial value)
Clearing condition:
After reading OER = 1, cleared by writing 0 to OER
1 An overrun error has occurred during reception*2
Setting condition:
When reception is completed with RDRF set to 1
Notes: 1. When bit RE in SCR3 is cleared to 0, bit OER is not affected and retains its previous
state.
2. RDR retains the receive data it held before the overrun error occurred, and data
received after the error is lost. Reception cannot be continued with bit OER set to 1,
and in synchronous mode, transmission cannot be continued either.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 302 of 526
REJ09B0326-0600
Bit 4
Framing Error (FER): Bit 4 indicates that a framing error has occurred during reception
in asynchronous mode.
Bit 4: FER Description
0 Reception in progress or completed*1 (initial value)
Clearing condition:
After reading FER = 1, cleared by writing 0 to FER
1 A framing error has occurred during reception*2
Setting condition:
When the stop bit at the end of the receive data is checked for a value of 1 at
the end of reception, and the stop bit is 0*2
Notes: 1. When bit RE in SCR3 is cleared to 0, bit FER is not affected and retains its previous
state.
2. Note that, in 2-stop-bit mode, only the first stop bit is checked for a value of 1, and the
second stop bit is not checked. When a framing error occurs the receive data is
transferred to RDR but bit RDRF is not set. Reception cannot be continued with bit FER
set to 1. In synchronous mode, neither transmission nor reception is possible when bit
FER is set to 1.
Bit 3
Parity Error (PER): Bit 3 indicates that a parity error has occurred during reception with
parity added in asynchronous mode.
Bit 3: PER Description
0 Reception in progress or completed*1 (initial value)
Clearing condition:
After reading PER = 1, cleared by writing 0 to PER
1 A parity error has occurred during reception*2
Setting condition:
When the number of 1 bits in the receive data plus parity bit does not match the
parity designated by bit PM in the serial mode register (SMR)
Notes: 1. When bit RE in SCR3 is cleared to 0, bit PER is not affected and retains its previous
state.
2. Receive data in which it a parity error has occurred is still transferred to RDR, but bit
RDRF is not set. Reception cannot be continued with bit PER set to 1. In synchronous
mode, neither transmission nor reception is possible when bit PER is set to 1.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 303 of 526
REJ09B0326-0600
Bit 2
Transmit End (TEND): Bit 2 indicates that bit TDRE is set to 1 when the last bit of a
transmit character is sent.
Bit 2 is a read-only bit and cannot be modified.
Bit 2: TEND Description
0 Transmission in progress
Clearing conditions:
• After reading TDRE = 1, cleared by writing 0 to TDRE
• When data is written to TDR by an instruction
1 Transmission ended (initial value)
Setting conditions:
• When bit TE in SCR3 is cleared to 0
• When bit TDRE is set to 1 when the last bit of a transmit character is sent
Bit 1
Multiprocessor Bit Receive (MPBR): Bit 1 stores the multiprocessor bit in a receive
character during multiprocessor format reception in asynchronous mode.
Bit 1 is a read-only bit and cannot be modified.
Bit 1: MPBR Description
0 Data in which the multiprocessor bit is 0 has been received* (initial value)
1 Data in which the multiprocessor bit is 1 has been received
Note: * When bit RE is cleared to 0 in SCR3 with the multiprocessor format, bit MPBR is not
affected and retains its previous state.
Bit 0
Multiprocessor Bit Transfer (MPBT): Bit 0 stores the multiprocessor bit added to
transmit data when transmitting in asynchronous mode. The bit MPBT setting is invalid when
synchronous mode is selected, when the multiprocessor communication function is disabled, and
when not transmitting.
Bit 0: MPBT Description
0 A 0 multiprocessor bit is transmitted (initial value)
1 A 1 multiprocessor bit is transmitted
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 304 of 526
REJ09B0326-0600
Bit Rate Register (BRR)
Bit 7 6 5 4 3 2 1 0
BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0
Initial value 1 1 1 1 1 1 1 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
BRR is an 8-bit register that designates the transmit/receive bit rate in accordance with the baud
rate generator operating clock selected by bits CKS1 and CKS0 of the serial mode register (SMR).
BRR can be read or written by the CPU at any time.
BRR is initialized to H'FF upon reset, and in standby, watch, subactive, or subsleep mode.
Table 10.6 shows examples of BRR settings in asynchronous mode. The values shown are for
active (high-speed) mode.
Table 10.6 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode)
OSC (MHz)
2 2.4576 4 4.194304
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110 1 70 +0.03 1 86 +0.31 1 141 +0.03 1 148 –0.04
150 0 207 +0.16 0 255 0 1 103 +0.16 1 108 +0.21
300 0 103 +0.16 0 127 0 0 207 +0.16 0 217 +0.21
600 0 51 +0.16 0 63 0 0 103 +0.16 0 108 +0.21
1200 0 25 +0.16 0 31 0 0 51 +0.16 0 54 –0.70
2400 0 12 +0.16 0 15 0 0 25 +0.16 0 26 +1.14
4800 0 7 0 0 12 +0.16 0 13 –2.48
9600 0 3 0 0 6 –2.48
19200 0 1 0
31250 0 0 0 0 1 0
38400 0 0 0
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 305 of 526
REJ09B0326-0600
OSC (MHz)
4.9152 6 7.3728 8
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110 1 174 –0.26 1 212 +0.03 2 64 +0.70 2 70 +0.03
150 1 127 0 1 155 +0.16 1 191 0 1 207 +0.16
300 0 255 0 1 77 +0.16 1 95 0 1 103 +0.16
600 0 127 0 0 155 +0.16 0 191 0 0 207 +0.16
1200 0 63 0 0 77 +0.16 0 95 0 0 103 +0.16
2400 0 31 0 0 38 +0.16 0 47 0 0 51 +0.16
4800 0 15 0 0 19 –2.34 0 23 0 0 25 +0.16
9600 0 7 0 0 9 –2.34 0 11 0 0 12 +0.16
19200 0 3 0 0 4 –2.34 0 5 0
31250 0 2 0 0 3 0
38400 0 1 0 0 2 0
OSC (MHz)
9.8304 10
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
110 2 86 +0.31 2 88 –0.25
150 1 255 0 2 64 +0.16
300 1 127 0 1 129 +0.16
600 0 255 0 1 64 +0.16
1200 0 127 0 0 129 +0.16
2400 0 63 0 0 64 +0.16
4800 0 31 0 0 32 –1.36
9600 0 15 0 0 15 +1.73
19200 0 7 0 0 7 +1.73
31250 0 4 –1.70 0 4 0
38400 0 3 0 0 3 +1.73
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 306 of 526
REJ09B0326-0600
Notes: 1. The setting should be made so that the error is not more than 1%.
2. The value set in BRR is given by the following equation:
N = × 10
6
– 1
OSC
(64 × 2
2n
× B)
where
B: Bit rate (bit/s)
N: Baud rate generator BRR setting (0 ≤ N ≤ 255)
OSC: Value of φOSC (MHz)
n: Baud rate generator input clock number (n = 0, 1, 2, or 3)
(The relation between n and the clock is shown in table 10.7.)
Table 10.7 Relation between n and Clock
SMR Setting
n Clock CKS1 CKS0
0 φ 0 0
1 φ/4 0 1
2 φ16 1 0
3 φ/64 1 1
3. The error in table 10.6 is the value obtained from the following equation, rounded to
two decimal places.
B (rate obtained from n, N, OSC) – R (bit rate in left-hand column in table 10.6)
R (bit rate in left-hand column in table 10.6)
Error (%) = × 100
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 307 of 526
REJ09B0326-0600
Table 10.8 shows the maximum bit rate for each frequency. The values shown are for active (high-
speed) mode.
Table 10.8 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
Setting
OSC (MHz) Maximum Bit Rate (bits/s) n N
2 31250 0 0
2.4576 38400 0 0
4 62500 0 0
4.194304 65536 0 0
4.9152 76800 0 0
6 93750 0 0
7.3728 115200 0 0
8 125000 0 0
9.8304 153600 0 0
10 156250 0 0
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 308 of 526
REJ09B0326-0600
Table 10.9 shows examples of BRR settings in synchronous mode. The values shown are for
active (high-speed) mode.
Table 10.9 Examples of BRR Settings for Various Bit Rates (Synchronous Mode)
OSC (MHz)
Bit Rate 2 4 8 10
(bits/s) n N n N n N n N
110
250 1 249 2 124 2 249
500 1 124 1 249 2 124
1 k 0 249 1 124 1 249
2.5 k 0 99 0 199 1 99 1 124
5 k 0 49 0 99 0 199 0 249
10 k 0 24 0 49 0 99 0 124
25 k 0 9 0 19 0 39 0 49
50 k 0 4 0 9 0 19 0 24
100 k 0 4 0 9
250 k 0 0* 0 1 0 3 0 4
500 k 0 0* 0 1
1 M 0 0*
2.5 M
Legend:
Blank: Cannot be set.
: A setting can be made, but an error will result.
*: Continuous transmission/reception is not possible.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 309 of 526
REJ09B0326-0600
Note: The value set in BRR is given by the following equation:
N = × 10
6
– 1
OSC
(8 × 2
2n
× B)
where
B: Bit rate (bit/s)
N: Baud rate generator BRR setting (0 ≤ N ≤ 255)
OSC: Value of φOSC (MHz)
n: Baud rate generator input clock number (n = 0, 1, 2, or 3)
(The relation between n and the clock is shown in table 10.10.)
Table 10.10 Relation between n and Clock
SMR Setting
n Clock CKS1 CKS0
0 φ 0 0
1 φ/4 0 1
2 φ16 1 0
3 φ/64 1 1
10.3.3 Operation
SCI3 can perform serial communication in two modes: asynchronous mode in which
synchronization is provided character by character, and synchronous mode in which
synchronization is provided by clock pulses. The serial mode register (SMR) is used to select
asynchronous or synchronous mode and the data transfer format, as shown in table 10.11.
The clock source for SCI3 is determined by bit COM in SMR and bits CKE1 and CKE0 in SCR3,
as shown in table 10.12.
Asynchronous Mode
• Choice of 7- or 8-bit data length
• Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits. (The
combination of these parameters determines the data transfer format and the character length.)
• Framing error (FER), parity error (PER), overrun error (OER), and break detection during
reception
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 310 of 526
REJ09B0326-0600
• Choice of internal or external clock as the clock source
When internal clock is selected: SCI3 operates on the baud rate generator clock, and a clock
with the same frequency as the bit rate can be output.
When external clock is selected: A clock with a frequency 16 times the bit rate must be input.
(The on-chip baud rate generator is not used.)
Synchronous Mode
• Data transfer format: Fixed 8-bit data length
• Overrun error (OER) detection during reception
• Choice of internal or external clock as the clock source
When internal clock is selected: SCI3 operates on the baud rate generator clock, and a serial
clock is output.
When external clock is selected: The on-chip baud rate generator is not used, and SCI3
operates on the input serial clock.
Table 10.11 SMR Settings and Corresponding Data Transfer Formats
SMR Setting Communication Format
Bit 7:
COM
Bit 6:
CHR
Bit 2:
MP
Bit 5:
PE
Bit 3:
STOP
Mode
Data Length
Multipro-
cessor Bit
Parity
Bit
Stop Bit
Length
0 0 0 0 0 Asynchronous 8-bit data No No 1 bit
1 mode 2 bits
1 0 Yes 1 bit
1 2 bits
1 0 0 7-bit data No 1 bit
1 2 bits
1 0 Yes 1 bit
1 2 bits
0 1 * 0 8-bit data Yes No 1 bit
* 1 2 bits
1 * 0 7-bit data 1 bit
* 1
Asynchronous
mode
(multiprocessor
format)
2 bits
1 * 0 * * Synchronous
mode
8-bit data No No No
Legend: * Don’t care
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 311 of 526
REJ09B0326-0600
Table 10.12 SMR and SCR3 Settings and Clock Source Selection
SMR SCR3 Transmit/Receive Clock
Bit 7:
COM
Bit 1:
CKE1
Bit 0:
CKE0
Mode
Clock
Source
SCK3 Pin Function
0 0 0 Asynchronous Internal I/O port (SCK3 pin not used)
1 mode
Outputs clock with same frequency as
bit rate
1 0
External
Inputs clock with frequency 16 times
bit rate
1 0 0 Synchronous
Internal Outputs serial clock
1 0 mode
External Inputs serial clock
0 1 1 Reserved (Do not specify these combinations)
1 0 1
1 1 1
Interrupts and Continuous Transmission/Reception: SCI3 can carry out continuous reception
using RXI and continuous transmission using TXI. These interrupts are shown in table 10.13.
Table 10.13 Transmit/Receive Interrupts
Interrupt Flags Interrupt Request Conditions Notes
RXI RDRF
RIE
When serial reception is performed
normally and receive data is transferred
from RSR to RDR, bit RDRF is set to 1,
and if bit RIE is set to 1 at this time, RXI
is enabled and an interrupt is requested.
(See figure 10.7 (a).)
The RXI interrupt routine reads the
receive data transferred to RDR
and clears bit RDRF to 0.
Continuous reception can be
performed by repeating the above
operations until reception of the
next RSR data is completed.
TXI TDRE
TIE
When TSR is found to be empty (on
completion of the previous transmission)
and the transmit data placed in TDR is
transferred to TSR, bit TDRE is set to 1. If
bit TIE is set to 1 at this time, TXI is
enabled and an interrupt is requested.
(See figure 10.7 (b).)
The TXI interrupt routine writes the
next transmit data to TDR and
clears bit TDRE to 0. Continuous
transmission can be performed by
repeating the above operations until
the data transferred to TSR has
been transmitted.
TEI TEND
TEIE
When the last bit of the character in TSR
is transmitted, if bit TDRE is set to 1, bit
TEND is set to 1. If bit TEIE is set to 1 at
this time, TEI is enabled and an interrupt
is requested. (See figure 10.7 (c).)
TEI indicates that the next transmit
data has not been written to TDR
when the last bit of the transmit
character in TSR is sent.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 312 of 526
REJ09B0326-0600
RDR
RSR (reception in progress)
RDRF = 0
RXD pin
RDR
RSR (reception completed, transfer)
RDRF ← 1
(RXI request when RIE = 1)
RXD pin
↑
Figure 10.7 (a) RDRF Setting and RXI Interrupt
TDR (next transmit data)
TSR (transmission in progress)
TDRE = 0
TXD pin
TDR
TSR (transmission completed, transfer)
TDRE ← 1
(TXI request when TIE = 1)
TXD pin
↓
Figure 10.7 (b) TDRE Setting and TXI Interrupt
TDR
TSR (transmission in progress)
TEND = 0
TXD pin
TDR
TSR (reception completed)
TEND ← 1
(TEI request when TEIE = 1)
TXD pin
↑
Figure 10.7 (c) TEND Setting and TEI Interrupt
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 313 of 526
REJ09B0326-0600
10.3.4 Operation in Asynchronous Mode
In asynchronous mode, serial communication is performed with synchronization provided
character by character. A start bit indicating the start of communication and one or two stop bits
indicating the end of communication are added to each character before it is sent.
SCI3 has separate transmission and reception units, allowing full-duplex communication. As the
transmission and reception units are both double-buffered, data can be written during transmission
and read during reception, making possible continuous transmission and reception.
Data Transfer Format: The general data transfer format in asynchronous communication is
shown in figure 10.8.
Serial
data Start
bit
1 bit
Transmit/receive data Parity
bit Stop
bit(s)
7 or 8 bits
One transfer data unit (character or frame)
1 bit
or none 1 or 2 bits
Mark
state
1(MSB)(LSB)
Figure 10.8 Data Format in Asynchronous Communication
In asynchronous communication, the communication line is normally in the mark state (high
level). SCI3 monitors the communication line and when it detects a space (low level), identifies
this as a start bit and begins serial data communication.
One transfer data character consists of a start bit (low level), followed by transmit/receive data
(LSB-first format, starting from the least significant bit), a parity bit (high or low level), and
finally one or two stop bits (high level).
In asynchronous mode, synchronization is performed by the falling edge of the start bit during
reception. The data is sampled on the 8th pulse of a clock with a frequency 16 times the bit period,
so that the transfer data is latched at the center of each bit.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 314 of 526
REJ09B0326-0600
Table 10.14 shows the 12 data transfer formats that can be set in asynchronous mode. The format
is selected by the settings in the serial mode register (SMR).
Table 10.14 Data Transfer Formats (Asynchronous Mode)
SMR Settings Serial Data Transfer Format and Frame Length
CHR PE MP STOP 1 2 3 4 5 6 7 8 9 10 11 12
0 0 0 0 S 8-bit data STOP
0 0 0 1 S 8-bit data STOP STOP
0 1 0 0 S 8-bit data P STOP
0 1 0 1 S 8-bit data P STOP STOP
1 0 0 0 S 7-bit data STOP
1 0 0 1 S 7-bit data STOP STOP
1 1 0 0 S 7-bit data P STOP
1 1 0 1 S 7-bit data P STOP STOP
0 * 1 0 S 8-bit data MPB STOP
0 * 1 1 S 8-bit data MPB STOP STOP
1 * 1 0 S 7-bit data MPB STOP
1 * 1 1 S 7-bit data MPB STOP STOP
Legend:
S: Start bit
STOP: Stop bit
P: Parity bit
MPB: Multiprocessor bit
*: Don’t care
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 315 of 526
REJ09B0326-0600
Clock: Either an internal clock generated by the baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3 transmit/receive clock. The selection is made by means
of bit COM in SMR and bits CKE1 and CKE0 in SCR3. See table 10.12 for details on clock
source selection.
When an external clock is input at the SCK3 pin, a clock with a frequency of 16 times the bit rate
used should be input.
When SCI3 operates on an internal clock, the clock can be output at the SCK3 pin. In this case the
frequency of the output clock is the same as the bit rate, and the phase is such that the clock rises
at the center of each bit of transmit/receive data, as shown in figure 10.9.
1 character (1 frame)
0 D0D1D2D3D4D5D6D70/1 1 1
Clock
Serial
data
Figure 10.9 Phase Relationship between Output Clock and Transfer Data
(Asynchronous Mode) (8-Bit Data, Parity, 2 Stop Bits)
Data Transfer Operations
SCI3 Initialization: Before data is transferred on SCI3, bits TE and RE in SCR3 must first be
cleared to 0, and then SCI3 must be initialized as follows.
Note: If the operation mode or data transfer format is changed, bits TE and RE must first be
cleared to 0.
When bit TE is cleared to 0, bit TDRE is set to 1.
Note that the RDRF, PER, FER, and OER flags and the contents of RDR are retained
when RE is cleared to 0.
When an external clock is used in asynchronous mode, the clock should not be stopped
during operation, including initialization. When an external clock is used in synchronous
mode, the clock should not be supplied during operation, including initialization.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 316 of 526
REJ09B0326-0600
Figure 10.10 shows an example of a flowchart for initializing SCI3.
Start
End
Clear bits TE and
RE to 0 in SCR3
1
2
3
Set bits CKE1
and CKE0
Set data transfer
format in SMR
Set value in BRR
No
Wait
Yes
4
Has 1-bit period
elapsed?
Set clock selection in SCR3. Be sure to
clear the other bits to 0. If clock output
is selected in asynchronous mode, the
clock is output immediately after setting
bits CKE1 and CKE0. If clock output is
selected for reception in synchronous
mode, the clock is output immediately
after bits CKE1, CKE0, and RE are
set to 1.
Set the data transfer format in the serial
mode register (SMR).
Write the value corresponding to the
transfer rate in BRR. This operation is
not necessary when an external clock
is selected.
1.
2.
3.
4. Wait for at least the interval required to
transmit or receive one bit, then set TE or
RE in the serial control register (SCR3).
Setting RE enables the RxD pin to be
used,
and when transmitting, setting bit TXD in
PMR7 enables the TXD output pin to be
used.
Also set the RIE, TIE, TEIE, and MPIE bits
as necessary to enable interrupts. The
initial states are the mark transmit state
and the idle receive state (waiting for a
start bit).
Set bit TE or RE to
1 in SCR3, set bits
RIE, TIE, TEIE, and
MPIE as necessary,
and when transmitting
(TE = 1), set bit TXD
to 1 in PMR7
Figure 10.10 Example of SCI3 Initialization Flowchart
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 317 of 526
REJ09B0326-0600
Transmitting: Figure 10.11 shows an example of a flowchart for data transmission. This
procedure should be followed for data transmission after initializing SCI3.
Start
End
Read bit TDRE
in SSR
1
2
3
Write transmit
data to TDR
Read bit TEND
in SSR
Set PDR = 0,
PCR = 1
Clear bit TE to 0
in SCR3
No
TDRE = 1?
Yes
Continue data
transmission?
No
TEND = 1?
No
Yes
Yes
Yes
No
Break output?
Read the serial status register (SSR)
and check that bit TDRE is set to 1,
then write transmit data to the transmit
data register (TDR). When data is
written to TDR, bit TDRE is cleared to 0
automatically.
When continuing data transmission,
be sure to read TDRE = 1 to confirm that
a write can be performed before writing
data to TDR. When data is written to
TDR, bit TDRE is cleared to 0
automatically.
If a break is to be output when data
transmission ends, set the port PCR to 1
and clear the port PDR to 0, then clear bit
TXD in PMR7 and bit TE in SCR3 to 0.
1.
2.
3.
Figure 10.11 Example of Data Transmission Flowchart (Asynchronous Mode)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 318 of 526
REJ09B0326-0600
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Serial data is transmitted from the TXD pin using the relevant data transfer format in table 10.14.
When the stop bit is sent, SCI3 checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and when the stop bit has been sent, starts transmission of the next frame. If bit
TDRE is set to 1, bit TEND in SSR is set to 1, and the mark state, in which 1s are transmitted, is
established after the stop bit has been sent. If bit TEIE in SCR3 is set to 1 at this time, a TEI
request is made.
Figure 10.12 shows an example of the operation when transmitting in asynchronous mode.
1 frame
Start
bit Start
bit
Transmit
data Transmit
data
Parity
bit Stop
bit Parity
bit Stop
bit Mar
k
state
1 frame
01 D0 D1 D7 0/1 1 1 10 D0 D1 D7 0/1
Serial
data
TDRE
TEND
LSI
operation TXI request TDRE
cleared to 0
User
processing Data written
to TDR
TXI request TEI request
Figure 10.12 Example of Operation when Transmitting in Asynchronous Mode
(8-Bit Data, Parity, 1 Stop Bit)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 319 of 526
REJ09B0326-0600
Receiving: Figure 10.13 shows an example of a flowchart for data reception. This procedure
should be followed for data reception after initializing SCI3.
Start
End
Read bits OER,
PER, FER in SSR
1
2
3
4
Read bit RDRF
in SSR
Read receive
data in RDR
Clear bit RE to
0 in SCR3
Yes
OER + PER
+ FER = 1?
No
RDRF = 1?
Yes
Continue data
reception?
No
No
Yes
Receive error
processing
(A)
Read bits OER, PER, and FER in the
serial status register (SSR) to determine
if there is an error. If a receive error has
occurred, execute receive error
processing.
Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data
in RDR. When the RDR data is read,
bit RDRF is cleared to 0 automatically.
When continuing data reception, finish
reading of bit RDRF and RDR before
receiving the stop bit of the current
frame. When the data in RDR is read,
bit RDRF is cleared to 0 automatically.
If a receive error has occurred, read bits
OER, PER, and FER in SSR to identify
the error, and after carrying out the
necessary error processing, ensure that
bits OER, PER, and FER are all cleared
to 0. Reception cannot be resumed if
any of these bits is set to 1. In the case
of a framing error, a break can be
detected by reading the value of the RXD
pin.4.
1.
2.
3.
4.
Figure 10.13 Example of Data Reception Flowchart (Asynchronous Mode)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 320 of 526
REJ09B0326-0600
Start receive
error processing
End of receive
error processing
4
Clear bits OER, PER,
FER to 0 in SSR
Yes
OER = 1?
Yes
Yes
FER = 1?
Break?
Yes
PER = 1?
No
No
No
No
Overrun error
processing
Framing error
processing
(A)
Parity error
processing
If a receive error has
occurred, read bits OER,
PER, and FER in SSR to
identify the error, and after
carrying out the necessary
error processing, ensure
that bits OER, PER, and
FER are all cleared to 0.
Reception cannot be
resumed if any of these
bits is set to 1. In the case
of a framing error, a break
can be detected by reading
the value of the RXD pin.
4.
Figure 10.13 Example of Data Reception Flowchart (Asynchronous Mode) (cont)
SCI3 operates as follows when receiving data.
SCI3 monitors the communication line, and when it detects a 0 start bit, performs internal
synchronization and begins reception. Reception is carried out in accordance with the relevant data
transfer format in table 10.14. The received data is first placed in RSR in LSB-to-MSB order, and
then the parity bit and stop bit(s) are received. SCI3 then carries out the following checks.
• Parity check
SCI3 checks that the number of 1 bits in the receive data conforms to the parity (odd or even)
set in bit PM in the serial mode register (SMR).
• Stop bit check
SCI3 checks that the stop bit is 1. If two stop bits are used, only the first is checked.
• Status check
SCI3 checks that bit RDRF is set to 1, indicating that the receive data can be transferred from
RSR to RDR.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 321 of 526
REJ09B0326-0600
If no receive error is found in the above checks, bit RDRF is set to 1, and the receive data is stored
in RDR. If bit RIE is set to 1 in SCR3, an RXI interrupt is requested. If the error checks identify a
receive error, bit OER, PER, or FER is set to 1 depending on the kind of error. Bit RDRF retains
its state prior to receiving the data. If bit RIE is set to 1 in SCR3, an ERI interrupt is requested.
Table 10.15 shows the conditions for detecting a receive error, and receive data processing.
Note: No further receive operations are possible while a receive error flag is set. Bits OER, FER,
PER, and RDRF must therefore be cleared to 0 before resuming reception.
Table 10.15 Receive Error Detection Conditions and Receive Data Processing
Receive Error Abbreviation Detection Conditions Received Data Processing
Overrun error OER When the next date receive
operation is completed while bit
RDRF is still set to 1 in SSR
Receive data is not transferred
from RSR to RDR
Framing error FER When the stop bit is 0 Receive data is transferred
from RSR to RDR
Parity error PER When the parity (odd or even)
set in SMR is different from that
of the received data
Receive data is transferred
from RSR to RDR
Figure 10.14 shows an example of the operation when receiving in asynchronous mode.
1 frame
Start
bit Start
bit
Receive
data Receive
data
Parity
bit Stop
bit Parity
bit Stop
bit Mark state
(idle state)
1 frame
01 D0 D1 D7 0/1 1 0 10 D0 D1 D7 0/1
Serial
data
RDRF
FER
LSI
operation
User
processing
RDRF
cleared to 0
RDR data read Framing error
processing
RXI request 0 start bit
detected ERI request in
response to
framing error
Figure 10.14 Example of Operation when Receiving in Asynchronous Mode
(8-Bit Data, Parity, 1 Stop Bit)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 322 of 526
REJ09B0326-0600
10.3.5 Operation in Synchronous Mode
In synchronous mode, SCI3 transmits and receives data in synchronization with clock pulses. This
mode is suitable for high-speed serial communication.
SCI3 has separate transmission and reception units, allowing full-duplex communication with a
shared clock.
As the transmission and reception units are both double-buffered, data can be written during
transmission and read during reception, making possible continuous transmission and reception.
Data Transfer Format: The general data transfer format in synchronous communication is shown
in figure 10.15.
Serial
clock
Serial
data
Note: * High level except in continuous transmission/reception
LSB MSB
* *
Bit 1Bit 0 Bit 2 Bit 3 Bit 4
8 bits
One transfer data unit (character or frame)
Bit 5 Bit 6 Bit 7
Don't
care
Don't
care
Figure 10.15 Data Format in Synchronous Communication
In synchronous communication, data on the communication line is output from one falling edge of
the serial clock until the next falling edge. Data confirmation is guaranteed at the rising edge of the
serial clock.
One transfer data character begins with the LSB and ends with the MSB. After output of the MSB,
the communication line retains the MSB state.
When receiving in synchronous mode, SCI3 latches receive data at the rising edge of the serial
clock.
The data transfer format uses a fixed 8-bit data length.
Parity and multiprocessor bits cannot be added.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 323 of 526
REJ09B0326-0600
Clock: Either an internal clock generated by the baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3 serial clock. The selection is made by means of bit COM
in SMR and bits CKE1 and CKE0 in SCR3. See table 10.12 for details on clock source selection.
When SCI3 operates on an internal clock, the serial clock is output at the SCK3 pin. Eight pulses
of the serial clock are output in transmission or reception of one character, and when SCI3 is not
transmitting or receiving, the clock is fixed at the high level.
Data Transfer Operations
SCI3 Initialization: Data transfer on SCI3 first of all requires that SCI3 be initialized as described
in 10.3.4, SCI3 Initialization, and shown in figure 10.10.
Transmitting: Figure 10.16 shows an example of a flowchart for data transmission. This
procedure should be followed for data transmission after initializing SCI3.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 324 of 526
REJ09B0326-0600
Start
End
Read bit TDRE
in SSR
1
2
Write transmit
data to TDR
Read bit TEND
in SSR
Clear bit TE to 0
in SCR3
No
TDRE = 1?
Yes
Continue data
transmission?
No
TEND = 1?
Yes
Yes
No
Read the serial status register (SSR) and
check that bit TDRE is set to 1, then write
transmit data to the transmit data register
(TDR). When data is written to TDR, bit
TDRE is cleared to 0 automatically, the
clock is output, and data transmission is
started.
When continuing data transmission, be
sure to read TDRE = 1 to confirm that
a write can be performed before writing
data to TDR. When data is written to
TDR, bit TDRE is cleared to 0 automatically.
1.
2.
Figure 10.16 Example of Data Transmission Flowchart (Synchronous Mode)
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 325 of 526
REJ09B0326-0600
When clock output mode is selected, SCI3 outputs 8 serial clock pulses. When an external clock is
selected, data is output in synchronization with the input clock.
Serial data is transmitted from the TXD pin in order from the LSB (bit 0) to the MSB (bit 7).
When the MSB (bit 7) is sent, checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and starts transmission of the next frame. If bit TDRE is set to 1, SCI3 sets bit
TEND to 1 in SSR, and after sending the MSB (bit 7), retains the MSB state. If bit TEIE in SCR3
is set to 1 at this time, a TEI request is made.
After transmission ends, the SCK3 pin is fixed at the high level.
Note: Transmission is not possible if an error flag (OER, FER, or PER) that indicates the data
reception status is set to 1. Check that these error flags (OER, FER, and PER) are all
cleared to 0 before a transmit operation.
Figure 10.17 shows an example of the operation when transmitting in synchronous mode.
Serial
clock
Serial
data Bit 1Bit 0 Bit 7 Bit 0
1 frame 1 frame
Bit 1 Bit 6 Bit 7
TDRE
TEND
LSI
operation
User
processing
TXI request
Data written
to TDR
TDRE cleared
to 0
TXI request TEI request
Figure 10.17 Example of Operation when Transmitting in Synchronous Mode
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 326 of 526
REJ09B0326-0600
Receiving: Figure 10.18 shows an example of a flowchart for data reception. This procedure
should be followed for data reception after initializing SCI3.
Start
End
Read bit OER
in SSR
1
2
3
4
Read bit RDRF
in SSR
Overrun error
processing
4
Clear bit OER to
0 in SSR
Read receive
data in RDR
Clear bit RE to
0 in SCR3
Yes
OER = 1?
No
RDRF = 1?
Yes
Continue data
reception?
No
No
Yes
Overrun error
processing
End of overrun
error processing
Start overrun
error processing
Read bit OER in the serial status register
(SSR) to determine if there is an error.
If an overrun error has occurred, execute
overrun error processing.
Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data in
RDR. When the RDR data is read, bit
RDRF is cleared to 0 automatically.
When continuing data reception, finish
reading of bit RDRF and RDR before
receiving the MSB (bit 7) of the current
frame. When the data in RDR is read,
bit RDRF is cleared to 0 automatically.
If an overrun error has occurred, read bit
OER in SSR, and after carrying out the
necessary error processing, clear bit OER
to 0. Reception cannot be resumed if bit
OER is set to 1.
1.
2.
3.
4.
Figure 10.18 Example of Data Reception Flowchart (Synchronous Mode)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 327 of 526
REJ09B0326-0600
SCI3 operates as follows when receiving data.
SCI3 performs internal synchronization and begins reception in synchronization with the serial
clock input or output.
The received data is placed in RSR in LSB-to-MSB order.
After the data has been received, SCI3 checks that bit RDRF is set to 0, indicating that the receive
data can be transferred from RSR to RDR.
If this check shows that there is no overrun error, bit RDRF is set to 1, and the receive data is
stored in RDR. If bit RIE is set to 1 in SCR3, an RXI interrupt is requested. If the check identifies
an overrun error, bit OER is set to 1.
Bit RDRF remains set to 1. If bit RIE is set to 1 in SCR3, an ERI interrupt is requested.
See table 10.15 for the conditions for detecting an overrun error, and receive data processing.
Note: No further receive operations are possible while a receive error flag is set. Bits OER, FER,
PER, and RDRF must therefore be cleared to 0 before resuming reception.
Figure 10.19 shows an example of the operation when receiving in synchronous mode.
Serial
clock
Serial
data Bit 0Bit 7 Bit 7 Bit 0
1 frame 1 frame
Bit 1 Bit 6 Bit 7
RDRF
OER
LSI
operation
User
processing
RXI request
RDR data read
RDRE cleared
to 0
RXI request ERI request in
response to
overrun error
Overrun error
processing
RDR data has
not been read
(RDRF = 1)
Figure 10.19 Example of Operation when Receiving in Synchronous Mode
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 328 of 526
REJ09B0326-0600
Simultaneous Transmit/Receive: Figure 10.20 shows an example of a flowchart for a
simultaneous transmit/receive operation. This procedure should be followed for simultaneous
transmission/reception after initializing SCI3.
Start
End
Read bit TDRE
in SSR
1
2
3
4
Write transmit
data to TDR
Read bit OER
in SSR
Read bit RDRF
in SSR
Clear bits TE and
RE to 0 in SCR
Yes
TDRE = 1? No
OER = 1?
No
RDRF = 1?
Yes
Continue data
transmission/reception?
No
Yes
No
Read receive data
in RDR
Yes
Overrun error
processing
Read the serial status register (SSR) and
check that bit TDRE is set to 1, then write
transmit data to the transmit data register
(TDR). When data is written to TDR, bit
TDRE is cleared to 0 automatically.
Read SSR and check that bit RDRF is set
to 1. If it is, read the receive data in RDR.
When the RDR data is read, bit RDRF is
cleared to 0 automatically.
When continuing data transmission/reception,
finish reading of bit RDRF and RDR before
receiving the MSB (bit 7) of the current frame.
Before transmitting the MSB (bit 7) of the current
frame, also read TDRE = 1 to confirm that a
write can be performed, then write data to TDR.
When data is written to TDR, bit TDRE is cleared
to 0 automatically, and when the data in RDR is
read, bit RDRF is cleared to 0 automatically.
If an overrun error has occurred, read bit OER
in SSR, and after carrying out the necessary
error processing, clear bit OER to 0. Transmission
and reception cannot be resumed if bit OER is
set to 1. See figure 10.18 for details on overrun
error processing.
1.
2.
3.
4.
Figure 10.20 Example of Simultaneous Data Transmission/Reception Flowchart
(Synchronous Mode)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 329 of 526
REJ09B0326-0600
Notes: 1. When switching from transmission to simultaneous transmission/reception, check that
SCI3 has finished transmitting and that bits TDRE and TEND are set to 1, clear bit TE
to 0, and then set bits TE and RE to 1 simultaneously with a single instruction.
2. When switching from reception to simultaneous transmission/reception, check that
SCI3 has finished receiving, clear bit RE to 0, then check that bit RDRF and the error
flags (OER, FER, and PER) are cleared to 0, and finally set bits TE and RE to 1
simultaneously with a single instruction.
10.3.6 Multiprocessor Communication Function
The multiprocessor communication function enables data to be exchanged among a number of
processors on a shared communication line. Serial data communication is performed in
asynchronous mode using the multiprocessor format (in which a multiprocessor bit is added to the
transfer data).
In multiprocessor communication, each receiver is assigned its own ID code. The serial
communication cycle consists of two cycles, an ID transmission cycle in which the receiver is
specified, and a data transmission cycle in which the transfer data is sent to the specified receiver.
These two cycles are differentiated by means of the multiprocessor bit, 1 indicating an ID
transmission cycle, and 0, a data transmission cycle.
The sender first sends transfer data with a 1 multiprocessor bit added to the ID code of the receiver
it wants to communicate with, and then sends transfer data with a 0 multiprocessor bit added to the
transmit data. When a receiver receives transfer data with the multiprocessor bit set to 1, it
compares the ID code with its own ID code, and if they are the same, receives the transfer data
sent next. If the ID codes do not match, it skips the transfer data until data with the multiprocessor
bit set to 1 is sent again.
In this way, a number of processors can exchange data among themselves.
Figure 10.21 shows an example of communication between processors using the multiprocessor
format.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 330 of 526
REJ09B0326-0600
Sender
Serial
data
Receiver A
(ID = 01) (ID = 02)
Receiver B
H'01
ID transmission cycle
(specifying the receiver) Data transmission cycle
(sending data to the receiver
specified buy the ID)
MPB: Multiprocessor bit
(MPB = 1) (MPB = 0)
H'AA
Communication line
(ID = 03)
Receiver C (ID = 04)
Receiver D
Figure 10.21 Example of Inter-Processor Communication Using Multiprocessor Format
(Sending Data H'AA to Receiver A)
There is a choice of four data transfer formats. If a multiprocessor format is specified, the parity
bit specification is invalid. See table 10.14 for details.
For details on the clock used in multiprocessor communication, see section 10.3.4, Operation in
Asynchronous Mode.
Multiprocessor Transmitting: Figure 10.22 shows an example of a flowchart for multiprocessor
data transmission. This procedure should be followed for multiprocessor data transmission after
initializing SCI3.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 331 of 526
REJ09B0326-0600
Start
End
Read bit TDRE
in SSR
1
3
2
Set bit MPBT
in SSR
Write transmit
data to TDR
Read bit TEND
in SSR
Clear bit TE to
0 in SCR3
Set PDR = 0,
PCR = 1
Yes
TDRE = 1? No
Continue data
transmission?
No
TEND = 1?
Break output? No
Yes
Yes
No
Yes
Read the serial status register (SSR)
and check that bit TDRE is set to 1,
then set bit MPBT in SSR to 0 or 1 and
write transmit data to the transmit data
register (TDR). When data is written to
TDR, bit TDRE is cleared to 0 automatically.
When continuing data transmission, be
sure to read TDRE = 1 to confirm that a
write can be performed before writing data
to TDR. When data is written to TDR, bit
TDRE is cleared to 0 automatically.
If a break is to be output when data
transmission ends, set the port PCR to 1
and clear the port PDR to 0, then clear bit
TE in SCR3 to 0.
1.
2.
3.
Figure 10.22 Example of Multiprocessor Data Transmission Flowchart
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 332 of 526
REJ09B0326-0600
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Serial data is transmitted from the TXD pin using the relevant data transfer format in table 10.14.
When the stop bit is sent, SCI3 checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and when the stop bit has been sent, starts transmission of the next frame. If bit
TDRE is set to 1, bit TEND in SSR is set to 1, and the mark state, in which 1s are transmitted, is
established after the stop bit has been sent. If bit TEIE in SCR3 is set to 1 at this time, a TEI
request is made.
Figure 10.23 shows an example of the operation when transmitting using the multiprocessor
format.
1 frame
Start
bit Start
bit
Transmit
data Transmit
data
MPB MPB
Stop
bit Stop
bit Mar
k
state
1 frame
01 D0 D1 D7 0/1 1 1 10 D0 D1 D7 0/1
Serial
data
TDRE
TEND
LSI
operation TXI request TDRE
cleared to 0
User
processing Data written
to TDR
TXI request TEI request
Figure 10.23 Example of Operation when Transmitting using Multiprocessor Format
(8-Bit Data, Multiprocessor Bit, 1 Stop Bit)
Multiprocessor Receiving: Figure 10.24 shows an example of a flowchart for multiprocessor data
reception. This procedure should be followed for multiprocessor data reception after initializing
SCI3.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 333 of 526
REJ09B0326-0600
Start
End
Read bits OER
and FER in SSR
2
Set bit MPIE to 1
in SCR3
1
3
4
5
4
Read bit RDRF
in SSR
Read receive
data in RDR
Clear bit RE to
0 in SCR3
Yes
OER + FER = 1?
No
No
RDRF = 1?
Yes
Continue data
reception?
No
Yes
Read bits OER
and FER in SSR
No
Own ID?
Yes
Read bit RDRF
in SSR
Yes
OER + FER = 1?
No
Read receive
data in RDR
No
RDRF = 1?
Yes
Receive error
processing
(A)
Set bit MPIE to 1 in SCR3.
Read bits OER and FER in the serial
status register (SSR) to determine if
there is an error. If a receive error has
occurred, execute receive error processing.
Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data in
RDR and compare it with this receiver's
own ID. If the ID is not this receiver's,
set bit MPIE to 1 again. When the RDR
data is read, bit RDRF is cleared to 0
automatically.
Read SSR and check that bit RDRF is
set to 1, then read the data in RDR.
If a receive error has occurred, read bits
OER and FER in SSR to identify the error,
and after carrying out the necessary error
processing, ensure that bits OER and FER
are both cleared to 0. Reception cannot be
resumed if either of these bits is set to 1.
In the case of a framing error, a break can
be detected by reading the value of the
RXD pin.
1.
2.
3.
4.
5.
Figure 10.24 Example of Multiprocessor Data Reception Flowchart
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 334 of 526
REJ09B0326-0600
Start receive
error processing
End of receive
error processing
Clear bits OER and
FER to 0 in SSR
Yes
OER = 1?
Yes
Yes
FER = 1?
Break?
No
No
No
Overrun error
processing
Framing error
processing
(A)
Figure 10.24 Example of Multiprocessor Data Reception Flowchart (cont)
Figure 10.25 shows an example of the operation when receiving using the multiprocessor format.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 335 of 526
REJ09B0326-0600
1 frame
Start
bit Start
bit
Receive
data (ID1) Receive data
(Data1)
MPB MPB
Stop
bit Stop
bit Mark state
(idle state)
1 frame
01D0D1D711 110D0D1 D7
ID1
0
Serial
data
MPIE
RDRF
RDR
value
RDR
value
LSI
operation RXI request
MPIE cleared
to 0
User
processing
RDRF cleared
to 0 No RXI request
RDR retains
previous state
RDR data read When data is not
this receiver's ID,
MPIE is set to 1
again
1 frame
Start
bit Start
bit
Receive
data (ID2) Receive data
(Data2)
MPB MPB
Stop
bit Stop
bit Mark state
(idle state)
1 frame
01D0D1D711 110
(a) When data does not match this receiver's ID
(b) When data matches this receiver's ID
D0 D1 D7
ID2 Data2ID1
0
Serial
data
MPIE
RDRF
LSI
operation RXI request
MPIE cleared
to 0
User
processing
RDRF cleared
to 0 RXI request RDRF cleared
to 0
RDR data read When data is
this receiver's
ID, reception
is continued
RDR data read
MPIE set to 1
again
Figure 10.25 Example of Operation when Receiving using Multiprocessor Format
(8-Bit Data, Multiprocessor Bit, 1 Stop Bit)
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 336 of 526
REJ09B0326-0600
10.3.7 Interrupts
SCI3 can generate six kinds of interrupts: transmit end, transmit data empty, receive data full, and
three receive error interrupts (overrun error, framing error, and parity error). These interrupts have
the same vector address.
The various interrupt requests are shown in table 10.16.
Table 10.16 SCI3 Interrupt Requests
Interrupt
Abbreviation
Interrupt Request
Vector Address
RXI Interrupt request initiated by receive data full flag (RDRF) H'002A
TXI Interrupt request initiated by transmit data empty flag (TDRE)
TEI Interrupt request initiated by transmit end flag (TEND)
ERI Interrupt request initiated by receive error flag (OER, FER,
PER)
Each interrupt request can be enabled or disabled by means of bits TIE and RIE in SCR3.
When bit TDRE is set to 1 in SSR, a TXI interrupt is requested. When bit TEND is set to 1 in
SSR, a TEI interrupt is requested. These two interrupts are generated during transmission.
The initial value of bit TDRE in SSR is 1. Therefore, if the transmit data empty interrupt request
(TXI) is enabled by setting bit TIE to 1 in SCR3 before transmit data is transferred to TDR, a TXI
interrupt will be requested even if the transmit data is not ready.
Also, the initial value of bit TEND in SSR is 1. Therefore, if the transmit end interrupt request
(TEI) is enabled by setting bit TEIE to 1 in SCR3 before transmit data is transferred to TDR, a TEI
interrupt will be requested even if the transmit data has not been sent.
Effective use of these interrupt requests can be made by having processing that transfers transmit
data to TDR carried out in the interrupt service routine.
To prevent the generation of these interrupt requests (TXI and TEI), on the other hand, the enable
bits for these interrupt requests (bits TIE and TEIE) should be set to 1 after transmit data has been
transferred to TDR.
When bit RDRF is set to 1 in SSR, an RXI interrupt is requested, and if any of bits OER, PER, and
FER is set to 1, an ERI interrupt is requested. These two interrupt requests are generated during
reception.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 337 of 526
REJ09B0326-0600
For further details, see section 3.3, Interrupts.
10.3.8 Application Notes
The following points should be noted when using SCI3.
1. Relation between writes to TDR and bit TDRE
Bit TDRE in the serial status register (SSR) is a status flag that indicates that data for serial
transmission has not been prepared in TDR. When data is written to TDR, bit TDRE is cleared
to 0 automatically. When SCI3 transfers data from TDR to TSR, bit TDRE is set to 1.
Data can be written to TDR irrespective of the state of bit TDRE, but if new data is written to
TDR while bit TDRE is cleared to 0, the data previously stored in TDR will be lost of it has
not yet been transferred to TSR. Accordingly, to ensure that serial transmission is performed
dependably, you should first check that bit TDRE is set to 1, then write the transmit data to
TDR once only (not two or more times).
2. Operation when a number of receive errors occur simultaneously
If a number of receive errors are detected simultaneously, the status flags in SSR will be set to
the states shown in table 10.17. If an overrun error is detected, data transfer from RSR to RDR
will not be performed, and the receive data will be lost.
Table 10.17 SSR Status Flag States and Receive Data Transfer
SSR Status Flags Receive Data Transfer
RDRF* OER FER PER (RSR →
→→
→ RDR)
Receive Error Status
1 1 0 0 × Overrun error
0 0 1 0 O Framing error
0 0 0 1 O Parity error
1 1 1 0 × Overrun error + framing error
1 1 0 1 × Overrun error + parity error
0 0 1 1 O Framing error + parity error
1 1 1 1 × Overrun error + framing error + parity error
Legend:
O: Receive data is transferred from RSR to RDR.
× : Receive data is not transferred from RSR to RDR.
Note: * Bit RDRF retains its state prior to data reception.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 338 of 526
REJ09B0326-0600
3. Break detection and processing
When a framing error is detected, a break can be detected by reading the value of the RXD pin
directly. In a break, the input from the RXD pin becomes all 0s, with the result that bit FER is
set and bit PER may also be set.
SCI3 continues the receive operation even after receiving a break. Note, therefore, that even
though bit FER is cleared to 0 it will be set to 1 again.
4. Mark state and break detection
When bit TE is cleared to 0, the TXD pin functions as an I/O port whose input/output direction
and level are determined by PDR and PCR. This fact can be used to set the TXD pin to the
mark state, or to detect a break during transmission.
To keep the communication line in the mark state (1 state) until bit TE is set to 1, set PCR = 1
and PDR = 1. Since bit TE is cleared to 0 at this time, the TXD pin functions as an I/O port
and 1 is output.
To detect a break during transmission, clear bit TE to 0 after setting PCR = 1 and PDR = 0.
When bit TE is cleared to 0, the transmission unit is initialized regardless of the current
transmission state, the TXD pin functions as an I/O port, and 0 is output from the TXD pin.
5. Receive error flags and transmit operation (synchronous mode only)
When a receive error flag (OER, PER, or FER) is set to 1, transmission cannot be started even
if bit TDRE is cleared to 0. The receive error flags must be cleared to 0 before starting
transmission.
Note also that receive error flags cannot be cleared to 0 even if bit RE is cleared to 0.
6. Receive data sampling timing and receive margin in asynchronous mode
In asynchronous mode, SCI3 operates on a basic clock with a frequency 16 times the transfer
rate. When receiving, SCI3 performs internal synchronization by sampling the falling edge of
the start bit with the basic clock. Receive data is latched internally at the 8th rising edge of the
basic clock. This is illustrated in figure 10.26.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 339 of 526
REJ09B0326-0600
0 7 15 0 7 15 0
Internal
basic clock
Receive data
(RXD) Start bit D0
16 clock pulses
8 clock pulses
D1
Synchronization
sampling timing
Data sampling
timing
Figure 10.26 Receive Data Sampling Timing in Asynchronous Mode
Consequently, the receive margin in asynchronous mode can be expressed as shown in
equation (1).
M = (0.5 – ) – – (L – 0.5) F × 100
1
2 N D – 0.5
N
. . . . . . . . . . . . . . . Equation (1)
where
M: Receive margin (%)
N: Ratio of bit rate to clock (N = 16)
D: Clock duty (D = 0.5 to 1.0)
L: Frame length (L = 9 to 12)
F: Absolute value of clock frequency deviation
Substituting 0 for F (absolute value of clock frequency deviation) and 0.5 for D (clock duty) in
equation (1), a receive margin of 46.875% is given by equation (2).
When D = 0.5 and F = 0,
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875% . . . . . . . . . . . . . . . . . . Equation (2)
However, this is only a computed value, and a margin of 20% to 30% should be allowed when
carrying out system design.
Section 10 Serial Communication Interface
Rev. 6.00 Sep 12, 2006 page 340 of 526
REJ09B0326-0600
7. Relation between RDR reads and bit RDRF
In a receive operation, SCI3 continually checks the RDRF flag. If bit RDRF is cleared to 0
when reception of one frame ends, normal data reception is completed. If bit RDRF is set to 1,
this indicates that an overrun error has occurred.
When the contents of RDR are read, bit RDRF is cleared to 0 automatically. Therefore, if bit
RDR is read more than once, the second and subsequent read operations will be performed
while bit RDRF is cleared to 0. Note that, when an RDR read is performed while bit RDRF is
cleared to 0, if the read operation coincides with completion of reception of a frame, the next
frame of data may be read. This is illustrated in figure 10.27.
Communication
line
RDRF
RDR
Frame 1 Frame 2 Frame 3
Data 1
Data 1
RDR read RDR read
Data 1 is read at point
(A)
Data 2 Data 3
Data 3
(A)
Data 2 is read at point
(B)
(B)
Figure 10.27 Relation between RDR Read Timing and Data
In this case, only a single RDR read operation (not two or more) should be performed after
first checking that bit RDRF is set to 1. If two or more reads are performed, the data read the
first time should be transferred to RAM, etc., and the RAM contents used. Also, ensure that
there is sufficient margin in an RDR read operation before reception of the next frame is
completed. To be precise in terms of timing, the RDR read should be completed before bit 7 is
transferred in synchronous mode, or before the STOP bit is transferred in asynchronous mode.
Section 11 14-Bit PWM
Rev. 6.00 Sep 12, 2006 page 341 of 526
REJ09B0326-0600
Section 11 14-Bit PWM
11.1 Overview
The H8/3644 Group is provided with a 14-bit PWM (pulse width modulator) on-chip, which can
be used as a D/A converter by connecting a low-pass filter.
11.1.1 Features
Features of the 14-bit PWM are as follows.
• Choice of two conversion periods
A conversion period of 32,768/φ, with a minimum modulation width of 2/φ or a conversion
period of 16,384/φ, with a minimum modulation width of 1/φ can be chosen.
• Pulse division method for less ripple
11.1.2 Block Diagram
Figure 11.1 shows a block diagram of the 14-bit PWM.
Internal data bus
PWDRL
PWDRU
PWCR
PWM
waveform
generator
φ/2
φ/4
Legend:
PWDRL:
PWDRU:
PWCR:
PWM data register L
PWM data register U
PWM control register
PWM
Figure 11.1 Block Diagram of the 14-Bit PWM
Section 11 14-Bit PWM
Rev. 6.00 Sep 12, 2006 page 342 of 526
REJ09B0326-0600
11.1.3 Pin Configuration
Table 11.1 shows the output pin assigned to the 14-bit PWM.
Table 11.1 Pin Configuration
Name Abbrev. I/O Function
PWM output pin PWM Output Pulse-division PWM waveform output
11.1.4 Register Configuration
Table 11.2 shows the register configuration of the 14-bit PWM.
Table 11.2 Register Configuration
Name Abbrev. R/W Initial Value Address
PWM control register PWCR W H'FE H'FFD0
PWM data register U PWDRU W H'C0 H'FFD1
PWM data register L PWDRL W H'00 H'FFD2
11.2 Register Descriptions
11.2.1 PWM Control Register (PWCR)
Bit 7 6 5 4 3 2 1 0
PWCR0
Initial value 1 1 1 1 1 1 1 0
Read/Write W
PWCR is an 8-bit write-only register for input clock selection.
Upon reset, PWCR is initialized to H'FE.
Bits 7 to 1
Reserved Bits: Bits 7 to 1 are reserved; they are always read as 1, and cannot be
modified.
Section 11 14-Bit PWM
Rev. 6.00 Sep 12, 2006 page 343 of 526
REJ09B0326-0600
Bit 0
Clock Select 0 (PWCR0): Bit 0 selects the clock supplied to the 14-bit PWM. This bit is a
write-only bit; it is always read as 1.
Bit 0: PWCR0 Description
0 The input clock is φ/2 (tφ* = 2/φ). The conversion period is 16,384/φ, with
a minimum modulation width of 1/φ (initial value)
1 The input clock is φ/4 (tφ* = 4/φ). The conversion period is 32,768/φ, with
a minimum modulation width of 2/φ.
Note: * tφ Period of PWM input clock
11.2.2 PWM Data Registers U and L (PWDRU, PWDRL)
PWDRU
Bit 7 6 5 4 3 2 1 0
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0
Initial value 1 1 0 0 0 0 0 0
Read/Write W W W W W W
PWDRL
Bit 7 6 5 4 3 2 1 0
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
Initial value 0 0 0 0 0 0 0 0
Read/Write W W W W W W W W
PWDRU and PWDRL form a 14-bit write-only register, with the upper 6 bits assigned to PWDRU
and the lower 8 bits to PWDRL. The value written to PWDRU and PWDRL gives the total high-
level width of one PWM waveform cycle.
When 14-bit data is written to PWDRU and PWDRL, the register contents are latched in the PWM
waveform generator, updating the PWM waveform generation data. The 14-bit data should always
be written in the following sequence:
1. Write the lower 8 bits to PWDRL.
2. Write the upper 6 bits to PWDRU.
PWDRU and PWDRL are write-only registers. If they are read, all bits are read as 1.
Section 11 14-Bit PWM
Rev. 6.00 Sep 12, 2006 page 344 of 526
REJ09B0326-0600
Upon reset, PWDRU and PWDRL are initialized to H'C000.
11.3 Operation
When using the 14-bit PWM, set the registers in the following sequence.
1. Set bit PWM in port mode register 1 (PMR1) to 1 so that pin P14/PWM is designated for PWM
output.
2. Set bit PWCR0 in the PWM control register (PWCR) to select a conversion period of either
32,768/φ (PWCR0 = 1) or 16,384/φ (PWCR0 = 0).
3. Set the output waveform data in PWM data registers U and L (PWDRU/L). Be sure to write in
the correct sequence, first PWDRL then PWDRU. When data is written to PWDRU, the data
in these registers will be latched in the PWM waveform generator, updating the PWM
waveform generation in synchronization with internal signals.
One conversion period consists of 64 pulses, as shown in figure 11.2. The total of the high-
level pulse widths during this period (TH) corresponds to the data in PWDRU and PWDRL.
This relation can be represented as follows.
TH = (data value in PWDRU and PWDRL + 64) × tφ/2
where tφ is the PWM input clock period, either 2/φ (bit PWCR0 = 0) or 4/φ (bit PWCR0 = 1).
Example: Settings in order to obtain a conversion period of 8,192 µs:
When bit PWCR0 = 0, the conversion period is 16,384/φ, so φ must be 2 MHz. In
this case tfn = 128 µs, with 1/φ (resolution) = 0.5 µs.
When bit PWCR0 = 1, the conversion period is 32,768/φ, so φ must be 4 MHz. In
this case tfn = 128 µs, with 2/φ (resolution) = 0.5 µs.
Accordingly, for a conversion period of 8,192 µs, the system clock frequency (φ)
must be 2 MHz or 4 MHz.
1 conversion period
t
f1
t
f2
t
f63
t
f64
t
H1
t
H2
t
H3
t
H63
t
H64
T = t + t + t +
t = t = t
HH1H2H3 H64
..... t
f1 f2 f3
..... = t
f64
Figure 11.2 PWM Output Waveform
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 345 of 526
REJ09B0326-0600
Section 12 A/D Converter
12.1 Overview
The H8/3644 Group includes on-chip a resistance-ladder-based successive-approximation analog-
to-digital converter, and can convert up to 8 channels of analog input.
12.1.1 Features
The A/D converter has the following features.
• 8-bit resolution
• Eight input channels
• Conversion time: approx. 12.4 µs per channel (at 5-MHz operation)
• Built-in sample-and-hold function
• Interrupt requested on completion of A/D conversion
• A/D conversion can be started by external trigger input
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 346 of 526
REJ09B0326-0600
12.1.2 Block Diagram
Figure 12.1 shows a block diagram of the A/D converter.
Internal data bus
AMR
ADSR
ADRR
Control logic
+
–
Com-
parator
AN
AN
AN
AN
AN
AN
AN
AN
ADTRG
AV
AV
CC
SS
Multiplexer
Reference
voltage
IRRAD
AV
CC
AV
SS
0
1
2
3
4
5
6
7
Legend:
AMR:
ADSR:
ADRR:
A/D mode register
A/D start register
A/D result register
Figure 12.1 Block Diagram of the A/D Converter
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 347 of 526
REJ09B0326-0600
12.1.3 Pin Configuration
Table 12.1 shows the A/D converter pin configuration.
Table 12.1 Pin Configuration
Name Abbrev. I/O Function
Analog power supply AVCC Input Power supply and reference voltage of analog part
Analog ground AVSS Input Ground and reference voltage of analog part
Analog input 0 AN0 Input Analog input channel 0
Analog input 1 AN1 Input Analog input channel 1
Analog input 2 AN2 Input Analog input channel 2
Analog input 3 AN3 Input Analog input channel 3
Analog input 4 AN4 Input Analog input channel 4
Analog input 5 AN5 Input Analog input channel 5
Analog input 6 AN6 Input Analog input channel 6
Analog input 7 AN7 Input Analog input channel 7
External trigger input ADTRG Input External trigger input for starting A/D conversion
12.1.4 Register Configuration
Table 12.2 shows the A/D converter register configuration.
Table 12.2 Register Configuration
Name Abbrev. R/W Initial Value Address
A/D mode register AMR R/W H'30 H'FFC4
A/D start register ADSR R/W H'7F H'FFC6
A/D result register ADRR R Undefined H'FFC5
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 348 of 526
REJ09B0326-0600
12.2 Register Descriptions
12.2.1 A/D Result Register (ADRR)
Bit 7 6 5 4 3 2 1 0
ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0
Initial value Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Read/Write R R R R R R R R
The A/D result register (ADRR) is an 8-bit read-only register for holding the results of analog-to-
digital conversion.
ADRR can be read by the CPU at any time, but the ADRR values during A/D conversion are
undefined.
After A/D conversion is complete, the conversion result is stored in ADRR as 8-bit data; this data
is held in ADRR until the next conversion operation starts.
ADRR is not cleared on reset.
12.2.2 A/D Mode Register (AMR)
Bit 7 6 5 4 3 2 1 0
CKS TRGE CH3 CH2 CH1 CH0
Initial value 0 0 1 1 0 0 0 0
Read/Write R/W R/W R/W R/W R/W R/W
AMR is an 8-bit read/write register for specifying the A/D conversion speed, external trigger
option, and the analog input pins.
Upon reset, AMR is initialized to H'30.
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 349 of 526
REJ09B0326-0600
Bit 7
Clock Select (CKS): Bit 7 sets the A/D conversion speed.
Conversion Time
Bit 7: CKS Conversion Period φ
φφ
φ = 2 MHz φ
φφ
φ = 5 MHz φ
φφ
φ = 8 MHz*1
0 62/φ (initial value) 31 µs 12.4 µs 7.75 µs
1 31/φ 15.5 µs *2
Notes: 1. Applies only to F-ZTAT, R of the ZTAT, and R of the mask ROM version.
2. Operation is not guaranteed if the conversion time is less than 12.4 µs. Set bit 7 for a
value of at least 12.4 µs.
Bit 6
External Trigger Select (TRGE): Bit 6 enables or disables the start of A/D conversion by
external trigger input.
Bit 6: TRGE Description
0 Disables start of A/D conversion by external trigger (initial value)
1 Enables start of A/D conversion by rising or falling edge of external trigger at
pin ADTRG*
Note: * The external trigger (ADTRG) edge is selected by bit INTEG5 of IEGR2. See section
3.3.2, Interrupt Edge Select Register 2 (IEGR2) for details.
Bits 5 and 4
Reserved Bits: Bits 5 and 4 are reserved; they are always read as 1, and cannot be
modified.
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 350 of 526
REJ09B0326-0600
Bits 3 to 0
Channel Select (CH3 to CH0): Bits 3 to 0 select the analog input channel.
The channel selection should be made while bit ADSF is cleared to 0.
Bit 3:
CH3
Bit 2:
CH2
Bit 1:
CH1
Bit 0:
CH0
Analog Input Channel
0 0 * * No channel selected (initial value)
1 0 0 AN0
1 AN
1
1 0 AN2
1 AN
3
1 0 0 0 AN4
1 AN
5
1 0 AN6
1 AN
7
1 0 0 Reserved
1 Reserved
1 0 Reserved
1 Reserved
Legend: * Don’t care
12.2.3 A/D Start Register (ADSR)
Bit 7 6 5 4 3 2 1 0
ADSF
Initial value 0 1 1 1 1 1 1 1
Read/Write R/W
The A/D start register (ADSR) is an 8-bit read/write register for starting and stopping A/D
conversion.
A/D conversion is started by writing 1 to the A/D start flag (ADSF) or by input of the designated
edge of the external trigger signal, which also sets ADSF to 1. When conversion is complete, the
converted data is set in the A/D result register (ADRR), and at the same time ADSF is cleared
to 0.
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 351 of 526
REJ09B0326-0600
Bit 7
A/D Start Flag (ADSF): Bit 7 controls and indicates the start and end of A/D conversion.
Bit 7: ADSF Description
0 Read: Indicates the completion of A/D conversion (initial value)
Write: Stops A/D conversion
1 Read: Indicates A/D conversion in progress
Write: Starts A/D conversion
Bits 6 to 0
Reserved Bits: Bits 6 to 0 are reserved; they are always read as 1, and cannot be
modified.
12.3 Operation
12.3.1 A/D Conversion Operation
The A/D converter operates by successive approximations, and yields its conversion result as 8-bit
data.
A/D conversion begins when software sets the A/D start flag (bit ADSF) to 1. Bit ADSF keeps a
value of 1 during A/D conversion, and is cleared to 0 automatically when conversion is complete.
The completion of conversion also sets bit IRRAD in interrupt request register 2 (IRR2) to 1. An
A/D conversion end interrupt is requested if bit IENAD in interrupt enable register 2 (IENR2) is
set to 1.
If the conversion time or input channel needs to be changed in the A/D mode register (AMR)
during A/D conversion, bit ADSF should first be cleared to 0, stopping the conversion operation,
in order to avoid malfunction.
12.3.2 Start of A/D Conversion by External Trigger Input
The A/D converter can be made to start A/D conversion by input of an external trigger signal.
External trigger input is enabled at pin ADTRG when bit TRGE in AMR is set to 1. Then when
the input signal edge designated in bit INTEG5 of interrupt edge select register 2 (IEGR2) is
detected at pin ADTRG, bit ADSF in ADSR will be set to 1, starting A/D conversion.
Figure 12.2 shows the timing.
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 352 of 526
REJ09B0326-0600
φ
Pin ADTRG
(when bit
INTEG5 = 0)
ADSF A/D conversion
Figure 12.2 External Trigger Input Timing
12.4 Interrupts
When A/D conversion ends (ADSF changes from 1 to 0), bit IRRAD in interrupt request
register 2 (IRR2) is set to 1.
A/D conversion end interrupts can be enabled or disabled by means of bit IENAD in interrupt
enable register 2 (IENR2).
For further details see section 3.3, Interrupts.
12.5 Typical Use
An example of how the A/D converter can be used is given below, using channel 1 (pin AN1) as
the analog input channel. Figure 12.3 shows the operation timing.
1. Bits CH3 to CH0 of the A/D mode register (AMR) are set to 0101, making pin AN1 the analog
input channel. A/D interrupts are enabled by setting bit IENAD to 1, and A/D conversion is
started by setting bit ADSF to 1.
2. When A/D conversion is complete, bit IRRAD is set to 1, and the A/D conversion result is
stored in the A/D result register (ADRR). At the same time ADSF is cleared to 0, and the A/D
converter goes to the idle state.
3. Bit IENAD = 1, so an A/D conversion end interrupt is requested.
4. The A/D interrupt handling routine starts.
5. The A/D conversion result is read and processed.
6. The A/D interrupt handling routine ends.
If ADSF is set to 1 again afterward, A/D conversion starts and steps 2 through 6 take place.
Figures 12.4 and 12.5 show flow charts of procedures for using the A/D converter.
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 353 of 526
REJ09B0326-0600
Idle A/D conversion (1) Idle A/D conversion (2) Idle
Interrupt
(IRRAD)
IENAD
ADSF
Channel 1 (AN )
operation state
ADRR
1
Set *
Set *Set *
Read conversion result Read conversion result
A/D conversion result (1) A/D conversion result (2)
A/D conversion starts
Note: ( ) indicates instruction execution by software.*Conversion result is reset when next conversion starts
Figure 12.3 Typical A/D Converter Operation Timing
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 354 of 526
REJ09B0326-0600
Start
Set A/D conversion speed
and input channel
Perform A/D
conversion?
End
Yes
No
Disable A/D conversion
end interrupt
Start A/D conversion
ADSF = 0?
No
Yes
Read ADSR
Read ADRR data
Figure 12.4 Flow Chart of Procedure for Using A/D Converter (1) (Polling by Software)
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 355 of 526
REJ09B0326-0600
Start
Set A/D conversion speed
and input channels
Enable A/D conversion
end interrupt
Start A/D conversion
A/D conversion
end interrupt? Yes
No
End
Yes
No
Clear bit IRRAD to
0 in IRR2
Read ADRR data
Perform A/D
conversion?
Figure 12.5 Flow Chart of Procedure for Using A/D Converter (2) (Interrupts Used)
12.6 Application Notes
• Data in the A/D result register (ADRR) should be read only when the A/D start flag (ADSF) in
the A/D start register (ADSR) is cleared to 0.
• Changing the digital input signal at an adjacent pin during A/D conversion may adversely
affect conversion accuracy.
Section 12 A/D Converter
Rev. 6.00 Sep 12, 2006 page 356 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 357 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
13.1 Absolute Maximum Ratings
Table 13.1 lists the absolute maximum ratings.
Table 13.1 Absolute Maximum Ratings*1
Item Symbol Value Unit Note
Power supply voltage VCC –0.3 to +7.0 V
Analog power supply voltage AVCC –0.3 to +7.0 V
Programming HD6473644 VPP –0.3 to +13.0 V
voltage HD64F3644, HD64F3643,
HD64F3642A
FVPP –0.3 to +13.0 V 2
Input voltage Ports other than Port B Vin –0.3 to VCC +0.3 V
Port B –0.3 to AVCC +0.3 V
TEST (HD64F3644,
HD64F3643,HD64F3642A)
–0.3 to +13.0 V 2
Operating temperature Topr –20 to +75 °C
Storage temperature Tstg –55 to +125 °C
Notes: 1. Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.
2. The voltage at the FVPP and TEST pins should not exceed 13 V, including peak
overshoot.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 358 of 526
REJ09B0326-0600
13.2 Electrical Characteristics (ZTAT™, Mask ROM Version)
13.2.1 Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures
below.
1. Power supply voltage vs. oscillator frequency range
10.0
2.7 4.0 5.5
V (V)
CC
f (MHz)
OSC
32.768
2.7 4.0 5.5
V (V)
CC
fw (kHz)
•
•Active mode (high speed)
Sleep mode (high speed) • All operating modes
5.0
2.0
*
1
*
1
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 359 of 526
REJ09B0326-0600
2. Power supply voltage vs. clock frequency range
625.00
2.7*
1
4.0 5.5
V (V)
CC
φ
(kHz)
5.0
2.7 4.0 5.5
V (V)
CC
φ
(MHz)
16.384
2.7 4.0 5.5
V (V)
CC
φ
(kHz)
SUB
•
•Active (high speed) mode
Sleep (high speed) mode (except CPU) •
•
•
Subactive mode
Subsleep mode (except CPU)
Watch mode (except CPU)
•
•
Active (medium speed) mode
Sleep (medium speed) mode (except CPU)
8.192
4.096
2.5
0.5
39.0625
7.8125
*
1
*
1
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 360 of 526
REJ09B0326-0600
3. Analog power supply voltage vs. A/D converter guaranteed accuracy range
2.7*24.0 4.5 5.5
AV (V)
CC
φ
(MHz)
•
•Active (high speed) mode
Sleep (high speed) mode
5.0
2.5
0.5
•
•Active (medium speed) mode
Sleep (medium speed) mode
Do not exceed the maximum
conversion time value.
Notes: 1. 2.5 V for the HD6433644, HD6433643, HD6433642, HD6433641 and HD6433640.
2. The voltage for guaranteed A/D conversion operation is 2.5 (V).
5.0
2.5
0.5
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 361 of 526
REJ09B0326-0600
13.2.2 DC Characteristics (HD6473644)
Table 13.2 lists the DC characteristics of the HD6473644.
Table 13.2 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input high
voltage
VIH 0.8 VCC
V
CC +0.3 V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.9 VCC V
CC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
0.7 VCC
V
CC +0.3 V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
0.8 VCC V
CC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
PB0 to PB7 0.7 VCC AVCC +0.3 V
0.8 VCC AVCC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
OSC1 V
CC –
0.5
V
CC +0.3 V
V
CC –
0.3
V
CC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 362 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input low
voltage
VIL –0.3
0.2 VCC V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
–0.3 0.1 VCC V
CC = 2.7 V to
5.5 V
including
subactive mode
–0.3
0.3 VCC V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57, P60
to P67,
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
–0.3 0.2 VCC V
CC = 2.7 V to
5.5 V
including
subactive mode
OSC1 –0.3 0.5 V
–0.3 0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
Output
high
voltage
VOH V
CC –
1.0
V –IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC –
0.5
V
CC = 2.7 V to
5.5 V
–IOH = 0.1 mA
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 363 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Output
low
voltage
VOL 0.6 V IOL = 1.6 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.4 VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
P60 to P67 1.0 V IOL = 10.0 mA
0.4 IOL = 1.6 mA
0.4 VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
Input/
output
leakage
current
| IIL | OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0 µA Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7 1.0 µA Vin = 0.5 V to
(AVCC –0.5 V)
Input
leakage
current
| IIL | RES, IRQ0 20 µA Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
–Ip P10, P14 to P17,
P30 to P32,
50 300 µA VCC = 5 V,
Vin = 0 V
current P50 to P57 25 V
CC = 2.7 V,
Vin = 0 V
Reference
value
Input
capaci-
Cin All input pins
except RES
15.0 pF f = 1 MHz,
Vin = 0 V,
tance RES 60.0 Ta = 25°C
IRQ0 30.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 364 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Active
mode
current
dissipation
IOPE1 V
CC 10 15 mA Active (high-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
5 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
I
OPE2 V
CC 2 3 mA Active
(medium-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
1 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep
mode
current
dissipation
ISLEEP1 V
CC 5 7 mA Sleep (high-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
2 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
I
SLEEP2 V
CC 2 3 mA Sleep (medium-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
1 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Subactive
mode
current
dissipation
ISUB V
CC 10 20 µA VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
10 V
CC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW/8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 365 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Subsleep
mode
current
dissipation
ISUBSP V
CC 5 10 µA VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
Watch
mode
current
dissipation
IWATCH V
CC 6 µA VCC = 2.7 V
32-kHz crystal
resonator
1, 2
Standby
mode
current
dissipation
ISTBY V
CC 5 µA 32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VRAM V
CC 2 V
Notes: 1. Pin states during current measurement are given below.
Mode RES
RESRES
RES Pin Internal State
Other
Pins Oscillator Pins
Active (high-speed)
mode
VCC Operates VCC System clock oscillator:
ceramic or crystal
Active (medium-
speed) mode
Operates
(φOSC/128)
Subclock oscillator:
Pin X1 = VCC
Sleep (high-speed)
mode
VCC Only timers operate VCC
Sleep (medium-
speed) mode
Only timers operate
(φOSC/128)
Subactive mode VCC Operates VCC System clock oscillator:
ceramic or crystal
Subsleep mode VCC Only timers operate,
CPU stops
VCC Subclock oscillator:
crystal
Watch mode VCC Only time base
operates, CPU stops
VCC
Standby mode VCC CPU and timers
both stop
VCC System clock oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 366 of 526
REJ09B0326-0600
Values
Item Symbol Min Typ Max Unit
Allowable output low
current (per pin)
Output pins except
port 6
IOL 2 mA
Port 6 10
Allowable output low
current (total)
Output pins except
port 6
∑IOL 40 mA
Port 6 80
Allowable output high
current (per pin)
All output pins –IOH 2 mA
Allowable output high
current (total)
All output pins ∑(–IOH) 30 mA
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 367 of 526
REJ09B0326-0600
13.2.3 AC Characteristics (HD6473644)
Table 13.3 lists the control signal timing, and tables 13.4 and 13.5 list the serial interface timing of
the HD6473644.
Table 13.3 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
System clock
oscillation frequency
fOSC OSC1, OSC22 10 MHz VCC = 2.7 V to 5.5 V
OSC clock (φOSC)
cycle time
tOSC OSC1, OSC2100 1000 ns VCC = 2.7 V to 5.5 V *1
Figure 13.1
System clock (φ) tcyc 2 128 tOSC V
CC = 2.7 V to 5.5 V *1
cycle time 25.6 µs
Subclock oscillation
frequency
fW X
1, X2 32.768 kHz VCC = 2.7 V to 5.5 V
Watch clock (φW)
cycle time
tW X
1, X2 30.5 µs VCC = 2.7 V to 5.5 V
Subclock (φSUB)
cycle time
tsubcyc 2 8 tW V
CC = 2.7 V to 5.5 V *2
Instruction cycle
time
2 t
cyc
tsubcyc
VCC = 2.7 V to 5.5 V
Oscillation trc OSC1, OSC2 40 ms
stabilization time
(crystal resonator)
60 VCC = 2.7 V to 5.5 V
Oscillation trc OSC1, OSC2 20 ms
stabilization time
(ceramic resonator)
40 VCC = 2.7 V to 5.5 V
Oscillation stabilization
time
trc X
1, X2 2 s VCC = 2.7 V to 5.5 V
External clock high
width
tCPH OSC1 40 ns VCC = 2.7 V to 5.5 V Figure 13.1
External clock low
width
tCPL OSC1 40 ns VCC = 2.7 V to 5.5 V
External clock rise
time
tCPr 15 ns VCC = 2.7 V to 5.5 V
External clock fall
time
tCPf 15 ns VCC = 2.7 V to 5.5 V
Pin RES low width tREL RES 10 t
cyc V
CC = 2.7 V to 5.5 V Figure 13.2
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 368 of 526
REJ09B0326-0600
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
Input pin high width tIH IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
Figure 13.3
Input pin low width tIL IRQ0 to IRQ3,
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.7 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 369 of 526
REJ09B0326-0600
Table 13.4 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc SCK1 2 t
cyc V
CC = 2.7 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH SCK1 0.4 t
Scyc V
CC = 2.7 V to
5.5 V
Input serial clock
low width
tSCKL SCK1 0.4 t
Scyc V
CC = 2.7 V to
5.5 V
Input serial clock tSCKr SCK1 60 ns
rise time 80 VCC = 2.7 V to
5.5 V
Input serial clock tSCKf SCK1 60 ns
fall time 80 VCC = 2.7 V to
5.5 V
Serial output data tSOD SO1 200 ns
delay time 350 VCC = 2.7 V to
5.5 V
Serial input data tSIS SI1 180 ns
setup time 360 V
CC = 2.7 V to
5.5 V
Serial input data tSIH SI1 180 ns
hold time 360 V
CC = 2.7 V to
5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 370 of 526
REJ09B0326-0600
Table 13.5 Serial Interface (SCI3) Timing
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values Reference
Item Symbol Min Typ Max Unit Test Condition Figure
Input clock Asynchronous tScyc 4 t
cyc
cycle Synchronous 6
Figure
13.5
Input clock pulse width tSCKW 0.4 0.6 tScyc
tTXD 1 tcyc V
CC = 4.0 V to
5.5 V
Figure
13.6
Transmit data delay time
(synchronous)
1
tRXS 200.0 ns VCC = 4.0 V to
5.5 V
Receive data setup time
(synchronous)
400.0
tRXH 200.0 ns VCC = 4.0 V to
5.5 V
Receive data hold time
(synchronous)
400.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 371 of 526
REJ09B0326-0600
13.2.4 DC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640)
Table 13.6 lists the DC characteristics of the HD6433644, the HD6433643, the HD6433642, the
HD6433641 and the HD6433640.
Table 13.6 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input high
voltage
VIH 0.8 VCC
V
CC +0.3 V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.9 VCC V
CC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
0.7 VCC
V
CC +0.3 V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
0.8 VCC V
CC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
PB0 to PB7 0.7 VCC AVCC +0.3 V
0.8 VCC AVCC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
OSC1 V
CC –0.5 V
CC +0.3 V
V
CC –0.3 V
CC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 372 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input low
voltage
VIL –0.3
0.2 VCC V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID,
SCK1, SCK3,
TRGV
–0.3 0.1 VCC V
CC = 2.5 V to
5.5 V
including
subactive mode
–0.3
0.3 VCC V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
–0.3 0.2 VCC V
CC = 2.5 V to
5.5 V
including
subactive mode
OSC1 –0.3 0.5 V
–0.3 0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 373 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Output
high
voltage
VOH V
CC –1.0 V –IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC –0.5 V
CC = 2.5 V to
5.5 V
–IOH = 0.1 mA
Output
low
voltage
VOL 0.6 V IOL = 1.6 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.4 VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
P60 to P67 1.0 V IOL = 10.0 mA
0.4 IOL = 1.6 mA
0.4 VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
Input/
output
leakage
current
| IIL | OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0 µA Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7 1.0 µA Vin = 0.5 V to
(AVCC –0.5 V)
Input
leakage
current
| IIL | RES, IRQ0 1 µA Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
–Ip P10, P14 to P17,
P30 to P32,
50 300 µA VCC = 5 V,
Vin = 0 V
current P50 to P57 25 V
CC = 2.5 V,
Vin = 0 V
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 374 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input
capaci-
Cin All input pins
except RES
15.0 pF f = 1 MHz,
Vin = 0 V,
tance RES 15.0 Ta = 25°C
IRQ0 15.0
Active
mode
current
dissipation
IOPE1 V
CC 10 15 mA Active (high-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
5 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
I
OPE2 V
CC 2 3 mA Active (medium-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
1 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep
mode
current
dissipation
ISLEEP1 V
CC 5 7 mA Sleep (high-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
2 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
I
SLEEP2 V
CC 2 3 mA Sleep (medium-
speed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
1 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Subactive
mode
current
dissipation
ISUB V
CC 10 20 µA VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
10 V
CC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW/8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 375 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Subsleep
mode
current
dissipation
ISUBSP V
CC 5 10 µA VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
Watch
mode
current
dissipation
IWATCH V
CC 6 µA VCC = 2.5 V
32-kHz crystal
resonator
1, 2
Standby
mode
current
dissipation
ISTBY V
CC 5 µA 32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VRAM V
CC 2 V
Notes: 1. Pin states during current measurement are given below.
Mode RES
RESRES
RES Pin Internal State
Other
Pins Oscillator Pins
Active (high-speed)
mode
VCC Operates VCC
Active (medium-
speed) mode
Operates (φOSC/128)
Sleep (high-speed)
mode
VCC Only timers operate VCC
Sleep (medium-
speed) mode
Only timers operate
(φOSC/128)
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Subactive mode VCC Operates VCC
Subsleep mode VCC Only timers operate,
CPU stops
VCC
Watch mode VCC Only time base
operates, CPU stops
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
crystal
Standby mode VCC CPU and timers
both stop
VCC System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 376 of 526
REJ09B0326-0600
Values
Item Symbol Min Typ Max Unit
Allowable output low
current (per pin)
Output pins except
port 6
IOL 2 mA
Port 6 10
Allowable output low
current (total)
Output pins except
port 6
∑IOL 40 mA
Port 6 80
Allowable output high
current (per pin)
All output pins –IOH 2 mA
Allowable output high
current (total)
All output pins ∑(–IOH) 30 mA
13.2.5 AC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640)
Table 13.7 lists the control signal timing, and tables 13.8 and 13.9 list the serial interface timing of
the HD6433644, the HD6433643, the HD6433642, the HD6433641 and the HD6433640.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 377 of 526
REJ09B0326-0600
Table 13.7 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
System clock fOSC OSC1, OSC22 10 MHz
oscillation frequency 2 5 VCC = 2.5 V to 5.5 V
OSC clock (φOSC) tOSC OSC1, OSC2100 1000 ns *1
cycle time 200 1000 VCC = 2.5 V to 5.5 V Figure 13.1
System clock (φ) tcyc 2 128 tOSC V
CC = 2.5 V to 5.5 V *1
cycle time 25.6 µs
Subclock oscillation
frequency
fW X
1, X2 32.768 kHz VCC = 2.5 V to 5.5 V
Watch clock (φW)
cycle time
tW X
1, X2 30.5 µs VCC = 2.5 V to 5.5 V
Subclock (φSUB)
cycle time
tsubcyc 2 8 tW V
CC = 2.5 V to 5.5 V *2
Instruction cycle
time
2 t
cyc
tsubcyc
VCC = 2.5 V to 5.5 V
Oscillation trc OSC1, OSC2 40 ms
stabilization time
(crystal resonator)
60 VCC = 2.5 V to 5.5 V
Oscillation trc OSC1, OSC2 20 ms
stabilization time
(ceramic resonator)
40 VCC = 2.5 V to 5.5 V
Oscillation stabilization
time
trc X
1, X2 2 s VCC = 2.5 V to 5.5 V
External clock high tCPH OSC1 40 ns Figure 13.1
width 80 V
CC = 2.5 V to 5.5 V
External clock low tCPL OSC1 40 ns
width 80 V
CC = 2.5 V to 5.5 V
External clock rise tCPr 15 ns
time 20 VCC = 2.5 V to 5.5 V
External clock fall tCPf 15 ns
time 20 VCC = 2.5 V to 5.5 V
Pin RES low width tREL RES 10 t
cyc V
CC = 2.5 V to 5.5 V Figure 13.2
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 378 of 526
REJ09B0326-0600
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
Input pin high width tIH IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.5 V to 5.5 V Figure 13.3
Input pin low width tIL IRQ0 to IRQ3,
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.5 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 379 of 526
REJ09B0326-0600
Table 13.8 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition
Referenc
e Figure
Input serial clock
cycle time
tScyc SCK1 2 t
cyc V
CC = 2.5 V to
5.5 V
Figure
13.4
Input serial clock
high width
tSCKH SCK1 0.4 t
Scyc V
CC = 2.5 V to
5.5 V
Input serial clock
low width
tSCKL SCK1 0.4 t
Scyc V
CC = 2.5 V to
5.5 V
Input serial clock tSCKr SCK1 60 ns
rise time 80 VCC = 2.5 V to
5.5 V
Input serial clock tSCKf SCK1 60 ns
fall time 80 VCC = 2.5 V to
5.5 V
Serial output data tSOD SO1 200 ns
delay time 350 VCC = 2.5 V to
5.5 V
Serial input data tSIS SI1 180 ns
setup time 360 V
CC = 2.5 V to
5.5 V
Serial input data tSIH SI1 180 ns
hold time 360 V
CC = 2.5 V to
5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 380 of 526
REJ09B0326-0600
Table 13.9 Serial Interface (SCI3) Timing
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item Symbol Min Typ Max Unit Test Condition
Reference
Figure
Input clock Asynchronous tScyc 4 t
cyc Figure 13.5
cycle Synchronous 6
Input clock pulse width tSCKW 0.4 0.6 tScyc
Transmit data delay time
(synchronous)
tTXD 1 tcyc V
CC = 4.0 V to
5.5 V
Figure 13.6
1
Receive data setup time
(synchronous)
tRXS 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Receive data hold time
(synchronous)
tRXH 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 381 of 526
REJ09B0326-0600
13.2.6 A/D Converter Characteristics
Table 13.10 shows the A/D converter characteristics of the HD6473644, the HD6433644, the
HD6433643, the HD6433642, the HD6433641 and the HD6433640.
Table 13.10 A/D Converter Characteristics
VCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit
Test
Condition
Reference
Figure
Analog power
supply
voltage
AVCC AVCC 2.7 5.5 V *1
Analog input
voltage
AVin AN0 to AN7 AVSS
–0.3
AVCC
+0.3
V
Analog power AIOPE AVCC 1.5 mA AVCC = 5 V
supply
current
AISTOP1 AVCC 150.0 µA *2
Reference
value
AISTOP2 AVCC 5.0 µA *3
Analog input
capacitance
CAin AN0 to AN7 30.0 pF
Allowable
signal source
impedance
RAin 5.0 kΩ
Resolution 8 bit
Nonlinearity
error
±2.0 LSB
Quantization
error
±0.5 LSB
Absolute
accuracy
±2.5 LSB
Conversion
time
12.4 124 µs
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 382 of 526
REJ09B0326-0600
13.3 Electrical Characteristics (ZTAT and R of the Mask ROM Version)
13.3.1 Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures
below.
1. Power supply voltage vs. oscillator frequency range
16.0
2.7*
1
4.0 5.5
V (V)
CC
f (MHz)
OSC
32.768
2.7*
1
4.0 5.5
V (V)
CC
fw (kHz)
•
•Active mode (high speed)
Sleep mode (high speed) •All operating modes
10.0
2.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 383 of 526
REJ09B0326-0600
2. Power supply voltage vs. clock frequency range
1000.00
2.7*
1
4.0 5.5
V (V)
CC
φ (kHz)
8.0
2.7*
1
4.0 5.5
V (V)
CC
φ (MHz)
16.384
2.7*
1
4.0 5.5
V (V)
CC
φ (kHz)
SUB
•
•Active (high speed) mode
Sleep (high speed) mode (except CPU) •
•
•
Subactive mode
Subsleep mode (except CPU)
Watch mode (except CPU)
•
•
Active (medium speed) mode
Sleep (medium speed) mode (except CPU)
8.192
4.096
5.0
0.5
39.0625
625.00
7.8125
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 384 of 526
REJ09B0326-0600
3. Analog power supply voltage vs. A/D converter operating range
2.7*
2
4.0 5.5
AV (V)
CC
φ
(MHz)
•
•Active (high speed) mode
Sleep (high speed) mode
8.0
5.0
0.5
•
•Active (medium speed) mode
Sleep (medium speed) mode
Do not exceed the maximum
conversion time value.
Notes: 1. 2.5 V for HD6433644R, HD6433643R, HD6433642R, HD6433641R
and HD6433640R.
2. AD conversion is guaranteed with 2.5 V.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 385 of 526
REJ09B0326-0600
13.3.2 DC Characteristics (HD6473644R)
Table 13.11 lists the DC characteristics of the HD6473644R.
Table 13.11 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input high
voltage
VIH 0.8 VCC
V
CC +0.3 V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.9 VCC V
CC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
0.7 VCC
V
CC +0.3 V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
0.8 VCC V
CC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
PB0 to PB7 0.7 VCC AVCC +0.3 V
0.8 VCC AVCC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
OSC1 V
CC –0.5 V
CC +0.3 V
V
CC –0.3 V
CC +0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 386 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input low
voltage
VIL –0.3
0.2 VCC V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
–0.3 0.1 VCC V
CC = 2.7 V to
5.5 V
including
subactive mode
–0.3
0.3 VCC V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
–0.3 0.2 VCC V
CC = 2.7 V to
5.5 V
including
subactive mode
OSC1 –0.3 0.5 V
–0.3 0.3 VCC = 2.7 V to
5.5 V
including
subactive mode
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 387 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Output
high
voltage
VOH V
CC –1.0 V –IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC –0.5 V
CC = 2.7 V to
5.5 V
–IOH = 0.1 mA
Output
low
voltage
VOL 0.6 V IOL = 1.6 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.4 VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
P60 to P67 1.0 V IOL = 10.0 mA
0.4 IOL = 1.6 mA
0.4 VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
Input/
output
leakage
current
| IIL | OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0 µA Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7 1.0 µA Vin = 0.5 V to
(AVCC –0.5 V)
Input
leakage
current
| IIL | RES, IRQ0 20 µA Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
–Ip P10, P14 to P17,
P30 to P32,
50 300 µA VCC = 5 V,
Vin = 0 V
current P50 to P57 25 V
CC = 2.7 V,
Vin = 0 V
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 388 of 526
REJ09B0326-0600
Values
Item Symbol Applicable Pins Min Typ Max Unit Test Condition Notes
Input
capaci-
Cin All input pins
except RES
15.0 pF f = 1 MHz,
Vin = 0 V,
tance RES 60.0 Ta = 25°C
IRQ0 30.0
Active
mode
current
dissipation
IOPE1 V
CC 15 20 mA Active (high-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
5 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
I
OPE2 V
CC 3 5 mA Active (medium-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep
mode
current
dissipation
ISLEEP1 V
CC 6 10 mA Sleep (high-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
2 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
I
SLEEP2 V
CC 2 4 mA Sleep (medium-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1 V
CC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Subactive
mode
current
dissipation
ISUB V
CC 10 20 µA VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
10 V
CC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW/8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 389 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Subsleep
mode current
dissipation
ISUBSP V
CC 5 10 µA VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
Watch mode
current
dissipation
IWATCH V
CC 6 µA VCC = 2.7 V
32-kHz crystal
resonator
1, 2
Standby
mode current
dissipation
ISTBY V
CC 5 µA 32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VRAM V
CC 2 V
Notes: 1. Pin states during current measurement are given below.
Mode RES
RESRES
RES Pin Internal State Other Pins Oscillator Pins
Active (high-speed)
mode
VCC Operates VCC
Active (medium-
speed) mode
Operates
(φOSC/128)
Sleep (high-speed)
mode
VCC Only timers
operate
VCC
Sleep (medium-
speed) mode
Only timers
operate (φOSC/128)
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Subactive mode VCC Operates VCC
Subsleep mode VCC Only timers
operate,
CPU stops
VCC
Watch mode VCC Only time base
operates, CPU
stops
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
crystal
Standby mode VCC CPU and timers
both stop
VCC System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 390 of 526
REJ09B0326-0600
Values
Item Symbol Min Typ Max Unit
Allowable output low
current (per pin)
Output pins except
port 6
IOL 2 mA
Port 6 10
Allowable output low
current (total)
Output pins except
port 6
∑IOL 40 mA
Port 6 80
Allowable output high
current (per pin)
All output pins –IOH 2 mA
Allowable output high
current (total)
All output pins ∑(–IOH) 30 mA
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 391 of 526
REJ09B0326-0600
13.3.3 AC Characteristics (HD6473644R)
Table 13.12 lists the control signal timing, and tables 13.13 and 13.14 list the serial interface
timing of the HD6473644R.
Table 13.12 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
System clock fOSC OSC1, OSC22 16 MHz
oscillation frequency 2 10 VCC = 2.7 V to 5.5 V
OSC clock (φOSC) tOSC OSC1, OSC262.5 1000 ns
cycle time 100 1000 VCC = 2.7 V to 5.5 V
*1
Figure 13.1
System clock (φ) tcyc 2 128 tOSC V
CC = 2.7 V to 5.5 V *1
cycle time 25.6 µs
Subclock oscillation
frequency
fW X
1, X2 32.76
8
kHz VCC = 2.7 V to 5.5 V
Watch clock (φW)
cycle time
tW X
1, X2 30.5 µs VCC = 2.7 V to 5.5 V
Subclock (φSUB)
cycle time
tsubcyc 2 8 tW V
CC = 2.7 V to 5.5 V *2
Instruction cycle
time
2 t
cyc
tsubcyc
VCC = 2.7 V to 5.5 V
Oscillation trc OSC1, OSC2 40 ms
stabilization time
(crystal resonator)
60 VCC = 2.7 V to 5.5 V
Oscillation trc OSC1, OSC2 20 ms
stabilization time
(ceramic resonator)
40 VCC = 2.7 V to 5.5 V
Oscillation stabilization
time
trc X
1, X2 2 s VCC = 2.7 V to 5.5 V
External clock high tCPH OSC1 20 ns Figure 13.1
width 40 V
CC = 2.7 V to 5.5 V
External clock low tCPL OSC1 20 ns
width 40 V
CC = 2.7 V to 5.5 V
External clock rise
time
tCPr 15 ns VCC = 2.7 V to 5.5 V
External clock fall
time
tCPf 15 ns VCC = 2.7 V to 5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 392 of 526
REJ09B0326-0600
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
Pin RES low width tREL RES 10 t
cyc V
CC = 2.7 V to 5.5 V Figure 13.2
Input pin high level
width
tIH IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.7 V to 5.5 V Figure 13.3
Input pin low level
width
tIL IRQ0 to IRQ3,
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.7 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 393 of 526
REJ09B0326-0600
Table 13.13 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc SCK1 2 t
cyc V
CC = 2.7 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH SCK1 0.4 t
Scyc V
CC = 2.7 V to
5.5 V
Input serial clock
low width
tSCKL SCK1 0.4 t
Scyc V
CC = 2.7 V to
5.5 V
Input serial clock tSCKr SCK1 60 ns
rise time 80 VCC = 2.7 V to
5.5 V
Input serial clock tSCKf SCK1 60 ns
fall time 80 VCC = 2.7 V to
5.5 V
Serial output data tSOD SO1 200 ns
delay time 350 VCC = 2.7 V to
5.5 V
Serial input data tSIS SI1 180 ns
setup time 360 V
CC = 2.7 V to
5.5 V
Serial input data tSIH SI1 180 ns
hold time 360 V
CC = 2.7 V to
5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 394 of 526
REJ09B0326-0600
Table 13.14 Serial Interface (SCI3) Timing
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item Symbol Min Typ Max Unit Test Condition
Reference
Figure
Asynchronous tScyc 4 t
cyc Input clock
cycle Synchronous 6
Figure
13.5
Input clock pulse width tSCKW 0.4 0.6 tScyc
Transmit data delay time
(synchronous)
tTXD 1 tcyc V
CC = 4.0 V to
5.5 V
Figure
13.6
1
Receive data setup time
(synchronous)
tRXS 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Receive data hold time
(synchronous)
tRXH 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 395 of 526
REJ09B0326-0600
13.3.4 DC Characteristics (HD6433644R, HD6433643R, HD6433642R, HD6433641R,
HD6433640R)
Table 13.15 lists the DC characteristics of the HD6433644R, the HD6433643R, the HD6433642R,
the HD6433641R and the HD6433640R.
Table 13.15 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input high
voltage
VIH 0.8 VCC
V
CC +0.3 V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.9 VCC V
CC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
0.7 VCC
V
CC +0.3 V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
0.8 VCC V
CC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
PB0 to PB7 0.7 VCC AVCC +0.3 V
0.8 VCC AVCC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
OSC1 V
CC –0.5 V
CC +0.3 V
V
CC –0.3 V
CC +0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 396 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input low
voltage
VIL –0.3
0.2 VCC V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID,
SCK1, SCK3,
TRGV
–0.3 0.1 VCC V
CC = 2.5 V to
5.5 V
including
subactive mode
–0.3
0.3 VCC V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
–0.3 0.2 VCC V
CC = 2.5 V to
5.5 V
including
subactive mode
OSC1 –0.3 0.5 V
–0.3 0.3 VCC = 2.5 V to
5.5 V
including
subactive mode
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 397 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Output
high
voltage
VOH V
CC –1.0 V –IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC –0.5 V
CC = 2.5 V to
5.5 V
–IOH = 0.1 mA
Output
low
voltage
VOL 0.6 V IOL = 1.6 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.4 VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
P60 to P67 1.0 V IOL = 10.0 mA
0.4 IOL = 1.6 mA
0.4 VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
Input/
output
leakage
current
| IIL | OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0 µA Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7 1.0 µA Vin = 0.5 V to
(AVCC –0.5 V)
Input
leakage
current
| IIL | RES, IRQ0 1 µA Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
–Ip P10, P14 to P17,
P30 to P32,
50 300 µA VCC = 5 V,
Vin = 0 V
current P50 to P57 25 V
CC = 2.5 V,
Vin = 0 V
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 398 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input
capaci-
Cin All input pins
except RES
15.0 pF f = 1 MHz,
Vin = 0 V,
tance RES 15.0 Ta = 25°C
IRQ0 15.0
Active
mode
current
dissipation
IOPE1 V
CC 15 20 mA Active (high-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
5 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
I
OPE2 V
CC 3 5 mA Active (medium-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep
mode
current
dissipation
ISLEEP1 V
CC 6 10 mA Sleep (high-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
2 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
I
SLEEP2 V
CC 2 4 mA Sleep (medium-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1 V
CC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Subactive
mode
current
dissipation
ISUB V
CC 10 20 µA VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
10 V
CC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW/8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 399 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Subsleep
mode
current
dissipation
ISUBSP V
CC 5 10 µA VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
Watch
mode
current
dissipation
IWATCH V
CC 6 µA VCC = 2.5 V
32-kHz crystal
resonator
1, 2
Standby
mode
current
dissipation
ISTBY V
CC 5 µA 32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VRAM V
CC 2 V
Notes: 1. Pin states during current measurement are given below.
Mode RES
RESRES
RES Pin Internal State Other Pins Oscillator Pins
Active (high-speed)
mode
VCC Operates VCC
Active (medium-
speed) mode
Operates
(φOSC/128)
Sleep (high-speed)
mode
VCC Only timers operate VCC
Sleep (medium-
speed) mode
Only timers operate
(φOSC/128)
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Subactive mode VCC Operates VCC
Subsleep mode VCC Only timers operate,
CPU stops
VCC
Watch mode VCC Only time base
operates, CPU
stops
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
crystal
Standby mode VCC CPU and timers
both stop
VCC System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 400 of 526
REJ09B0326-0600
Values
Item Symbol Min Typ Max Unit
Allowable output low
current (per pin)
Output pins except
port 6
IOL 2 mA
Port 6 10
Allowable output low
current (total)
Output pins except
port 6
∑IOL 40 mA
Port 6 80
Allowable output high
current (per pin)
All output pins –IOH 2 mA
Allowable output high
current (total)
All output pins ∑(–IOH) 30 mA
13.3.5 AC Characteristics (HD6433644R, HD6433643R, HD6433642R, HD6433641R,
HD6433640R)
Table 13.16 lists the control signal timing, and tables 13.17 and 13.18 list the serial interface
timing of the HD6433644R, the HD6433643R, the HD6433642R, the HD6433641R and the
HD6433640R.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 401 of 526
REJ09B0326-0600
Table 13.16 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
System clock fOSC OSC1, OSC22 16 MHz
oscillation frequency 2 10 VCC = 2.5 V to 5.5 V
OSC clock (φOSC) tOSC OSC1, OSC262.5 1000 ns *1
cycle time 100 1000 VCC = 2.5 V to 5.5 V Figure 13.1
System clock (φ) tcyc 2 128 tOSC V
CC = 2.5 V to 5.5 V *1
cycle time 25.6 µs
Subclock oscillation
frequency
fW X
1, X2 32.768 kHz VCC = 2.5 V to 5.5 V
Watch clock (φW)
cycle time
tW X
1, X2 30.5 µs VCC = 2.5 V to 5.5 V
Subclock (φSUB)
cycle time
tsubcyc 2 8 tW V
CC = 2.5 V to 5.5 V *2
Instruction cycle
time
2 t
cyc
tsubcyc
VCC = 2.5 V to 5.5 V
Oscillation trc OSC1, OSC2 40 ms
stabilization time
(crystal resonator)
60 VCC = 2.5 V to 5.5 V
Oscillation trc OSC1, OSC2 20 ms
stabilization time
(ceramic resonator)
40 VCC = 2.5 V to 5.5 V
Oscillation stabilization
time
trc X
1, X2 2 s VCC = 2.5 V to 5.5 V
External clock high tCPH OSC1 20 ns Figure 13.1
width 40 V
CC = 2.5 V to 5.5 V
External clock low tCPL OSC1 20 ns
width 40 V
CC = 2.5 V to 5.5 V
External clock rise
time
tCPr 15 ns VCC = 2.5 V to 5.5 V
External clock fall
time
tCPf 15 ns VCC = 2.5 V to 5.5 V
Pin RES low width tREL RES 10 t
cyc V
CC = 2.5 V to 5.5 V Figure 13.2
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 402 of 526
REJ09B0326-0600
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
Input pin high width tIH IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.5 V to 5.5 V Figure 13.3
Input pin low width tIL IRQ0 to IRQ3,
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 2.5 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 403 of 526
REJ09B0326-0600
Table 13.17 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc SCK1 2 t
cyc V
CC = 2.5 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH SCK1 0.4 t
Scyc V
CC = 2.5 V to
5.5 V
Input serial clock
low width
tSCKL SCK1 0.4 t
Scyc V
CC = 2.5 V to
5.5 V
Input serial clock tSCKr SCK1 60 ns
rise time 80 VCC = 2.5 V to
5.5 V
Input serial clock tSCKf SCK1 60 ns
fall time 80 VCC = 2.5 V to
5.5 V
Serial output data tSOD SO1 200 ns
delay time 350 VCC = 2.5 V to
5.5 V
Serial input data tSIS SI1 180 ns
setup time 360 V
CC = 2.5 V to
5.5 V
Serial input data tSIH SI1 180 ns
hold time 360 V
CC = 2.5 V to
5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 404 of 526
REJ09B0326-0600
Table 13.18 Serial Interface (SCI3) Timing
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item Symbol Min Typ Max Unit Test Condition
Reference
Figure
Asynchronous tScyc 4 t
cyc Input clock
cycle Synchronous 6
Figure
13.5
Input clock pulse width tSCKW 0.4 0.6 tScyc
Transmit data delay time
(synchronous)
tTXD 1 tcyc V
CC = 4.0 V to
5.5 V
Figure
13.6
1
Receive data setup time
(synchronous)
tRXS 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Receive data hold time
(synchronous)
tRXH 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 405 of 526
REJ09B0326-0600
13.3.6 A/D Converter Characteristics
Table 13.19 shows the A/D converter characteristics of the HD6473644R, the HD6433644R, the
HD6433643R, the HD6433642R, the HD6433641R and the HD6433640R.
Table 13.19 A/D Converter Characteristics
VCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit
Test
Condition
Reference
Figure
Analog power
supply voltage
AVCC AVCC 2.7 5.5 V *1
Analog input
voltage
AVin AN0 to AN7 AVSS
–0.3
AVCC
+0.3
V
Analog power AIOPE AVCC 1.5 mA AVCC = 5 V
supply current AISTOP1 AVCC 150.0 µA *2
Reference
value
AISTOP2 AVCC 5.0 µA *3
Analog input
capacitance
CAin AN0 to AN7 30.0 pF
A
llowable signal
source
impedance
RAin 5.0 kΩ
Resolution 8 bit
Nonlinearity
error
±2.0 LSB
Quantization
error
±0.5 LSB
Absolute
accuracy
±2.5 LSB
Conversion time 7.75 124 µs
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 406 of 526
REJ09B0326-0600
13.4 Electrical Characteristics (F-ZTAT
version)
13.4.1 Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures
below.
1. Power supply voltage vs. oscillator frequency range
16.0
3.0 4.0 5.5
V (V)
CC
f (MHz)
OSC
32.768
3.0 4.0 5.5
V (V)
CC
fw (kHz)
•
•Active mode (high speed)
Sleep mode (high speed) •All operating modes
10.0
2.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 407 of 526
REJ09B0326-0600
2. Power supply voltage vs. clock frequency range
1000.00
3.0 4.0 5.5
V (V)
CC
φ (kHz)
8.0
3.0 4.0 5.5
V (V)
CC
φ (MHz)
16.384
3.0 4.0 5.5
V (V)
CC
φ (kHz)
SUB
•
•Active (high speed) mode
Sleep (high speed) mode (except CPU) •
•
•
Subactive mode
Subsleep mode (except CPU)
Watch mode (except CPU)
•
•
Active (medium speed) mode
Sleep (medium speed) mode (except CPU)
8.192
4.096
5.0
0.5
39.0625
625.00
7.8125
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 408 of 526
REJ09B0326-0600
3. Analog power supply voltage vs. A/D converter operating range
3.0 4.0 5.5
AV (V)
CC
φ
(MHz)
•
•Active (high speed) mode
Sleep (high speed) mode
8.0
5.0
0.5
•
•Active (medium speed) mode
Sleep (medium speed) mode
Do not exceed the maximum
conversion time value.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 409 of 526
REJ09B0326-0600
13.4.2 DC Characteristics (HD64F3644, HD64F3643, HD64F3642A)
Table 13.20 lists the DC characteristics of the HD64F3644, HD64F3643, and HD64F3642A.
Table 13.20 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input high
voltage
VIH 0.8 VCC
V
CC +0.3 V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.9 VCC V
CC +0.3 VCC = 3.0 V to
5.5 V
including
subactive mode
0.7 VCC
V
CC +0.3 V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94
0.8 VCC V
CC +0.3 VCC = 3.0 V to
5.5 V
including
subactive mode
PB0 to PB7 0.7 VCC AVCC +0.3 V
0.8 VCC AVCC +0.3 VCC = 3.0 V to
5.5 V
including
subactive mode
OSC1 V
CC –0.5 V
CC +0.3 V
V
CC –0.3 V
CC +0.3 VCC = 3.0 V to
5.5 V
including
subactive mode
Note: Except in boot mode, connect the TEST pin to VSS.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 410 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input low
voltage
VIL –0.3
0.2 VCC V
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
–0.3 0.1 VCC V
CC = 3.0 V to
5.5 V
including
subactive mode
–0.3
0.3 VCC V
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94,
PB0 to PB7
–0.3 0.2 VCC V
CC = 3.0 V to
5.5 V
including
subactive mode
OSC1 –0.3 0.5 V
–0.3 0.3 VCC = 3.0 V to
5.5 V
including
subactive mode
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 411 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Output
high
voltage
VOH V
CC –1.0 V –IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94
VCC –0.5 V
CC = 3.0 V to
5.5 V
–IOH = 0.1 mA
Output
low
voltage
VOL 0.6 V IOL = 1.6 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P91 to P94
0.4 VCC = 3.0 V to
5.5 V
IOL = 0.4 mA
P60 to P67 1.0 V IOL = 10.0 mA
0.4 IOL = 1.6 mA
0.4 VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
Input/
output
leakage
current
| IIL | OSC1, RES,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94
1.0 µA Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7 1.0 µA Vin = 0.5 V to
(AVCC –0.5 V)
Input
leakage
current
| IIL | IRQ0, TEST 20 µA Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
–Ip P10, P14 to P17,
P30 to P32,
50 300 µA VCC = 5 V,
Vin = 0 V
current P50 to P57 35 V
CC = 3.0 V,
Vin = 0 V
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 412 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Input
capaci-
Cin All input pins
except TEST
15.0 pF f = 1 MHz,
Vin = 0 V,
tance IRQ0, TEST 30.0 Ta = 25°C
Active
mode
current
dissipation
IOPE1 V
CC 15 25 mA Active (high-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
8.5 V
CC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
I
OPE2 V
CC 3 5 mA Active (medium-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
2 V
CC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep
mode
current
dissipation
ISLEEP1 V
CC 6 10 mA Sleep (high-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
3.5 V
CC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
I
SLEEP2 V
CC 2 4 mA Sleep (medium-
speed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1 V
CC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
Subactive
mode
current
dissipation
ISUB V
CC 1 2 mA VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
1 mA VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 413 of 526
REJ09B0326-0600
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition Notes
Subsleep
mode current
dissipation
ISUBSP V
CC 5 10 µA VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
1, 2
Watch mode
current
dissipation
IWATCH V
CC 8 µA VCC = 3.0 V
32-kHz crystal
resonator
1, 2
Standby
mode current
dissipation
ISTBY V
CC 5 µA 32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VRAM V
CC 2 V
Notes: 1. Pin states during current measurement are given below.
Mode RES
RESRES
RES Pin Internal State Other Pins Oscillator Pins
Active (high-speed)
mode
VCC Operates VCC
Active (medium-
speed) mode
Operates (φOSC/128)
Sleep (high-speed)
mode
VCC Only timers operate VCC
Sleep (medium-
speed)
mode
Only timers operate
(φOSC/128)
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Subactive mode VCC Operates VCC
Subsleep mode VCC Only timers operate,
CPU stops
VCC
Watch mode VCC Only time base
operates, CPU
stops
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
crystal
Standby mode VCC CPU and timers
both stop
VCC System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 414 of 526
REJ09B0326-0600
Values
Item Symbol Min Typ Max Unit
Allowable output low
current (per pin)
Output pins except
port 6
IOL 2 mA
Port 6 10
Allowable output low
current (total)
Output pins except
port 6
∑IOL 40 mA
Port 6 80
Allowable output high
current (per pin)
All output pins –IOH 2 mA
Allowable output high
current (total)
All output pins ∑(–IOH) 30 mA
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 415 of 526
REJ09B0326-0600
13.4.3 AC Characteristics (HD64F3644, HD64F3643, HD64F3642A)
Table 13.21 lists the control signal timing, and tables 13.22 and 13.23 list the serial interface
timing of the HD64F3644, HD64F3643, HD64F3642A.
Table 13.21 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
System clock fOSC OSC1, OSC22 16 MHz
oscillation frequency 2 10 VCC = 3.0 V to 5.5 V
OSC clock (φOSC) tOSC OSC1, OSC262.5 1000 ns
cycle time 100 1000 VCC = 3.0 V to 5.5 V
*1
Figure 13.1
System clock (φ) tcyc 2 128 tOSC V
CC = 3.0 V to 5.5 V *1
cycle time 25.6 µs
Subclock oscillation
frequency
fW X
1, X2 32.768 kHz VCC = 3.0 V to 5.5 V
Watch clock (φW)
cycle time
tW X
1, X2 30.5 µs VCC = 3.0 V to 5.5 V
Subclock (φSUB)
cycle time
tsubcyc 2 8 tW V
CC = 3.0 V to 5.5 V *2
Instruction cycle
time
2 t
cyc
tsubcyc
VCC = 3.0 V to 5.5 V
Oscillation trc OSC1, OSC2 40 ms
stabilization time
(crystal resonator)
60 VCC = 3.0 V to 5.5 V
Oscillation trc OSC1, OSC2 20 ms
stabilization time
(ceramic resonator)
40 VCC = 3.0 V to 5.5 V
Oscillation stabilization
time
trc X
1, X2 2 s VCC = 3.0 V to 5.5 V
External clock high tCPH OSC1 20 ns Figure 13.1
width 40 V
CC = 3.0 V to 5.5 V
External clock low tCPL OSC1 20 ns
width 40 V
CC = 3.0 V to 5.5 V
External clock rise
time
tCPr 15 ns VCC = 3.0 V to 5.5 V
External clock fall
time
tCPf 15 ns VCC = 3.0 V to 5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 416 of 526
REJ09B0326-0600
Applicable Values Reference
Item Symbol Pins Min Typ Max Unit Test Condition Figure
Pin RES low width tREL RES 10 t
cyc V
CC = 3.0 V to 5.5 V Figure 13.2
Input pin high level
width
tIH IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 3.0 V to 5.5 V Figure 13.3
Input pin low level
width
tIL IRQ0 to IRQ3,
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2 t
cyc
tsubcyc
VCC = 3.0 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 417 of 526
REJ09B0326-0600
Table 13.22 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc SCK1 2 t
cyc V
CC = 3.0 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH SCK1 0.4 t
Scyc V
CC = 3.0 V to
5.5 V
Input serial clock
low width
tSCKL SCK1 0.4 t
Scyc V
CC = 3.0 V to
5.5 V
Input serial clock tSCKr SCK1 60 ns
rise time 80 VCC = 3.0 V to
5.5 V
Input serial clock tSCKf SCK1 60 ns
fall time 80 VCC = 3.0 V to
5.5 V
Serial output data tSOD SO1 200 ns
delay time 350 VCC = 3.0 V to
5.5 V
Serial input data tSIS SI1 180 ns
setup time 360 V
CC = 3.0 V to
5.5 V
Serial input data tSIH SI1 180 ns
hold time 360 V
CC = 3.0 V to
5.5 V
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 418 of 526
REJ09B0326-0600
Table 13.23 Serial Interface (SCI3) Timing
VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values Reference
Item Symbol Min Typ Max Unit Test Condition Figure
Asynchronous tScyc 4 t
cyc Input clock
cycle Synchronous 6
Input clock pulse width tSCKW 0.4 0.6 tScyc
Figure
13.5
Transmit data delay time
(synchronous)
tTXD 1 tcyc V
CC = 4.0 V to
5.5 V
Figure
13.6
1
Receive data setup time
(synchronous)
tRXS 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Receive data hold time
(synchronous)
tRXH 200.0 ns VCC = 4.0 V to
5.5 V
400.0
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 419 of 526
REJ09B0326-0600
13.4.4 A/D Converter Characteristics
Table 13.24 shows the A/D converter characteristics of the HD64F3644, HD64F3643, and
HD64F3642A.
Table 13.24 A/D Converter Characteristics
VCC = 3.0 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item Symbol
Applicable
Pins Min Typ Max Unit
Test
Condition
Referenc
e Figure
Analog power
supply
voltage
AVCC AVCC 3.0 5.5 V *1
Analog input
voltage
AVin AN0 to AN7AVSS –0.3 AVSS +0.3 V
Analog power AIOPE AVCC 1.5 mA AVCC = 5.0 V
supply
current
AISTOP1 AVCC 150.0 µA *2
Reference
value
AISTOP2 AVCC 5.0 µA *3
Analog input
capacitance
CAin AN0 to AN7 30.0 pF
Allowable
signal source
impedance
RAin 5.0 kΩ
Resolution 8 bit
Nonlinearity
error
±2.0 LSB
Quantization
error
±0.5 LSB
Absolute
accuracy
±2.5 LSB
Conversion
time
7.75 124 µs
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 420 of 526
REJ09B0326-0600
13.5 Operation Timing
Figures 13.1 to 13.6 show timing diagrams.
t
OSC
V
IH
V
IL
t
CPH
t
CPL
t
CPr
OSC1
t
CPf
Figure 13.1 System Clock Input Timing
RES VIL
tREL
Figure 13.2 RES
RESRES
RES Low Width Timing
V
IH
V
IL
t
IL
IRQ
0
to IRQ
3
,
INT
0
to INT
7
,
ADTRG,
TMIB, FTIA,
FTIB,
TMCIV, FTIC,
FTID,
TMRIV,
FTCI, TRGV
t
IH
Figure 13.3 Input Timing
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 421 of 526
REJ09B0326-0600
t
Scyc
t
SCKf
t
SCKL
t
SCKH
t
SOD
V
V
OH
OL
*
*
t
SIS
t
SIH
SCK
SO
SI
1
1
1
t
SCKr
V or V
IH OH
*
V or V
IL OL
*
Note: *Output timing reference levels
Output high:
Output low:
Load conditions are shown in figure 13.7.
V = 2.0 V
V = 0.8 V
OH
OL
Figure 13.4 SCI1 Input/Output Timing
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 422 of 526
REJ09B0326-0600
t
Scyc
3
t
SCKW
SCK
Figure 13.5 SCK3 Input Clock Timing
3
t
Scyc
t
TXD
t
RXS
t
RXH
V
OH
V or V
IH OH
V or V
IL OL
*
*
*
V
OL*
SCK
TXD
(transmit data)
RXD
(receive data)
Note: *Output timing reference levels
Output high:
Output low:
Load conditions are shown in figure 13.7.
V = 2.0 V
V = 0.8 V
OH
OL
Figure 13.6 SCI3 Synchronous Mode Input/Output Timing
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 423 of 526
REJ09B0326-0600
13.6 Output Load Circuit
VCC
2.4 kΩ
12 kΩ30 pF
Output pin
Figure 13.7 Output Load Condition
Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 424 of 526
REJ09B0326-0600
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 425 of 526
REJ09B0326-0600
Appendix A CPU Instruction Set
A.1 Instructions
Operation Notation
Rd8/16 General register (destination) (8 or 16 bits)
Rs8/16 General register (source) (8 or 16 bits)
Rn8/16 General register (8 or 16 bits)
CCR Condition code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
PC Program counter
SP Stack pointer
#xx: 3/8/16 Immediate data (3, 8, or 16 bits)
d: 8/16 Displacement (8 or 16 bits)
@aa: 8/16 Absolute address (8 or 16 bits)
+ Addition
– Subtraction
× Multiplication
÷ Division
∧ Logical AND
∨ Logical OR
⊕ Exclusive logical OR
→ Move
— Logical complement
Condition Code Notation
Symbol
Modified according to the instruction result
* Undefined (value not guaranteed)
0 Always cleared to 0
— Not affected by the instruction execution result
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 426 of 526
REJ09B0326-0600
Table A.1 lists the H8/300L CPU instruction set.
Table A.1 Instruction Set
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
MOV.B #xx:8, Rd
MOV.B Rs, Rd
MOV.B @Rs, Rd
MOV.B @(d:16, Rs), Rd
MOV.B @Rs+, Rd
MOV.B @aa:8, Rd
MOV.B @aa:16, Rd
MOV.B Rs, @Rd
MOV.B Rs, @(d:16, Rd)
MOV.B Rs, @–Rd
MOV.B Rs, @aa:8
MOV.B Rs, @aa:16
MOV.W #xx:16, Rd
MOV.W Rs, Rd
MOV.W @Rs, Rd
MOV.W @(d:16, Rs), Rd
MOV.W @Rs+, Rd
MOV.W @aa:16, Rd
MOV.W Rs, @Rd
MOV.W Rs, @(d:16, Rd)
MOV.W Rs, @–Rd
MOV.W Rs, @aa:16
POP Rd
#xx:8 → Rd8
Rs8 → Rd8
@Rs16 → Rd8
@(d:16, Rs16) → Rd8
@Rs16 → Rd8
Rs16+1 → Rs16
@aa:8 → Rd8
@aa:16 → Rd8
Rs8 → @Rd16
Rs8 → @(d:16, Rd16)
Rd16–1 → Rd16
Rs8 → @Rd16
Rs8 → @aa:8
Rs8 → @aa:16
#xx:16 → Rd
Rs16 → Rd16
@Rs16 → Rd16
@(d:16, Rs16) → Rd16
@Rs16 → Rd16
Rs16+2 → Rs16
@aa:16 → Rd16
Rs16 → @Rd16
Rs16 → @(d:16, Rd16)
Rd16–2 → Rd16
Rs16 → @Rd16
Rs16 → @aa:16
@SP → Rd16
SP+2 → SP
B
B
B
B
B
B
B
B
B
B
B
B
W
W
W
W
W
W
W
W
W
W
W
2—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
2
4
6
6
4
6
4
6
6
4
6
4
2
4
6
6
6
4
6
6
6
6
2
2
4
2
2
4
2
4
2
2
4
4
2
2
4
2
4
2
4
2
4
2
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 427 of 526
REJ09B0326-0600
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
↔
PUSH Rs
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W Rs, Rd
ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
ADDS.W #1, Rd
ADDS.W #2, Rd
INC.B Rd
DAA.B Rd
SUB.B Rs, Rd
SUB.W Rs, Rd
SUBX.B #xx:8, Rd
SUBX.B Rs, Rd
SUBS.W #1, Rd
SUBS.W #2, Rd
DEC.B Rd
DAS.B Rd
NEG.B Rd
CMP.B #xx:8, Rd
CMP.B Rs, Rd
CMP.W Rs, Rd
MULXU.B Rs, Rd
SP–2 → SP
Rs16 → @SP
Rd8+#xx:8 → Rd8
Rd8+Rs8 → Rd8
Rd16+Rs16 → Rd16
Rd8+#xx:8 +C → Rd8
Rd8+Rs8 +C → Rd8
Rd16+1 → Rd16
Rd16+2 → Rd16
Rd8+1 → Rd8
Rd8 decimal adjust → Rd8
Rd8–Rs8 → Rd8
Rd16–Rs16 → Rd16
Rd8–#xx:8 –C → Rd8
Rd8–Rs8 –C → Rd8
Rd16–1 → Rd16
Rd16–2 → Rd16
Rd8–1 → Rd8
Rd8 decimal adjust → Rd8
0–Rd → Rd
Rd8–#xx:8
Rd8–Rs8
Rd16–Rs16
Rd8 × Rs8 → Rd16
W
B
B
W
B
B
W
W
B
B
B
W
B
B
W
W
B
B
B
B
B
W
B
2—— 0—6
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
14
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
(1)
↔
↔
↔
↔
(2)
↔
↔
↔
(2)
↔
↔
↔
—————
—————
——
↔
↔
↔
**(3)
↔
↔
↔
↔
↔
↔
↔
(1)
↔
↔
↔
↔
(2)
↔
↔
↔
↔
(2)
↔
↔
↔
↔
—————
—————
——
↔
↔
↔
**—
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
(1)
↔
↔
↔
↔
—————
↔↔
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 428 of 526
REJ09B0326-0600
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
↔
DIVXU.B Rs, Rd
AND.B #xx:8, Rd
AND.B Rs, Rd
OR.B #xx:8, Rd
OR.B Rs, Rd
XOR.B #xx:8, Rd
XOR.B Rs, Rd
NOT.B Rd
SHAL.B Rd
SHAR.B Rd
SHLL.B Rd
SHLR.B Rd
ROTXL.B Rd
ROTXR.B Rd
ROTL.B Rd
ROTR.B Rd
Rd16÷Rs8 → Rd16 (RdH:
remainder, RdL: quotient)
Rd8∧#xx:8 → Rd8
Rd8∧Rs8 → Rd8
Rd8∨#xx:8 → Rd8
Rd8∨Rs8 → Rd8
Rd8⊕#xx:8 → Rd8
Rd8⊕Rs8 → Rd8
Rd → Rd
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
(5) (6) —
0
0
0
0
0
0
0
0
0
0
0
0
0
0
—
—
—
—
—
—
—
—
14
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
↔
b7b0
0C
b7b0
0C
C
b7b0
b7b0
0C
C
b7b0
Cb7b0
C
b7b0
C
b7b0
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 429 of 526
REJ09B0326-0600
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
BSET #xx:3, Rd
BSET #xx:3, @Rd
BSET #xx:3, @aa:8
BSET Rn, Rd
BSET Rn, @Rd
BSET Rn, @aa:8
BCLR #xx:3, Rd
BCLR #xx:3, @Rd
BCLR #xx:3, @aa:8
BCLR Rn, Rd
BCLR Rn, @Rd
BCLR Rn, @aa:8
BNOT #xx:3, Rd
BNOT #xx:3, @Rd
BNOT #xx:3, @aa:8
BNOT Rn, Rd
BNOT Rn, @Rd
BNOT Rn, @aa:8
BTST #xx:3, Rd
BTST #xx:3, @Rd
BTST #xx:3, @aa:8
BTST Rn, Rd
BTST Rn, @Rd
BTST Rn, @aa:8
(#xx:3 of Rd8) ← 1
(#xx:3 of @Rd16) ← 1
(#xx:3 of @aa:8) ← 1
(Rn8 of Rd8) ← 1
(Rn8 of @Rd16) ← 1
(Rn8 of @aa:8) ← 1
(#xx:3 of Rd8) ← 0
(#xx:3 of @Rd16) ← 0
(#xx:3 of @aa:8) ← 0
(Rn8 of Rd8) ← 0
(Rn8 of @Rd16) ← 0
(Rn8 of @aa:8) ← 0
(#xx:3 of Rd8) ←
(#xx:3 of Rd8)
(#xx:3 of @Rd16) ←
(#xx:3 of @Rd16)
(#xx:3 of @aa:8) ←
(#xx:3 of @aa:8)
(Rn8 of Rd8) ←
(Rn8 of Rd8)
(Rn8 of @Rd16) ←
(Rn8 of @Rd16)
(Rn8 of @aa:8) ←
(Rn8 of @aa:8)
(#xx:3 of Rd8) → Z
(#xx:3 of @Rd16) → Z
(#xx:3 of @aa:8) → Z
(Rn8 of Rd8) → Z
(Rn8 of @Rd16) → Z
(Rn8 of @aa:8) → Z
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
2
2
2
2
2
2
2
2
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
8
8
2
8
8
2
8
8
2
8
8
2
8
8
2
8
8
2
6
6
2
6
6
↔↔↔↔↔
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 430 of 526
REJ09B0326-0600
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
BLD #xx:3, Rd
BLD #xx:3, @Rd
BLD #xx:3, @aa:8
BILD #xx:3, Rd
BILD #xx:3, @Rd
BILD #xx:3, @aa:8
BST #xx:3, Rd
BST #xx:3, @Rd
BST #xx:3, @aa:8
BIST #xx:3, Rd
BIST #xx:3, @Rd
BIST #xx:3, @aa:8
BAND #xx:3, Rd
BAND #xx:3, @Rd
BAND #xx:3, @aa:8
BIAND #xx:3, Rd
BIAND #xx:3, @Rd
BIAND #xx:3, @aa:8
BOR #xx:3, Rd
BOR #xx:3, @Rd
BOR #xx:3, @aa:8
BIOR #xx:3, Rd
BIOR #xx:3, @Rd
BIOR #xx:3, @aa:8
BXOR #xx:3, Rd
BXOR #xx:3, @Rd
BXOR #xx:3, @aa:8
BIXOR #xx:3, Rd
(#xx:3 of Rd8) → C
(#xx:3 of @Rd16) → C
(#xx:3 of @aa:8) → C
(#xx:3 of Rd8) → C
(#xx:3 of @Rd16) → C
(#xx:3 of @aa:8) → C
C → (#xx:3 of Rd8)
C → (#xx:3 of @Rd16)
C → (#xx:3 of @aa:8)
C → (#xx:3 of Rd8)
C → (#xx:3 of @Rd16)
C → (#xx:3 of @aa:8)
C∧(#xx:3 of Rd8) → C
C∧(#xx:3 of @Rd16) → C
C∧(#xx:3 of @aa:8) → C
C∧(#xx:3 of Rd8) → C
C∧(#xx:3 of @Rd16) → C
C∧(#xx:3 of @aa:8) → C
C∨(#xx:3 of Rd8) → C
C∨(#xx:3 of @Rd16) → C
C∨(#xx:3 of @aa:8) → C
C∨(#xx:3 of Rd8) → C
C∨(#xx:3 of @Rd16) → C
C∨(#xx:3 of @aa:8) → C
C⊕(#xx:3 of Rd8) → C
C⊕(#xx:3 of @Rd16) → C
C⊕(#xx:3 of @aa:8) → C
C⊕(#xx:3 of Rd8) → C
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
2
2
2
2
2
2
2
2
2
2
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
6
6
2
6
6
2
8
8
2
8
8
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 431 of 526
REJ09B0326-0600
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
↔
BIXOR #xx:3, @Rd
BIXOR #xx:3, @aa:8
BRA d:8 (BT d:8)
BRN d:8 (BF d:8)
BHI d:8
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
BVC d:8
BVS d:8
BPL d:8
BMI d:8
BGE d:8
BLT d:8
BGT d:8
BLE d:8
JMP @Rn
JMP @aa:16
JMP @@aa:8
BSR d:8
JSR @Rn
JSR @aa:16
C⊕(#xx:3 of @Rd16) → C
C⊕(#xx:3 of @aa:8) → C
PC ← PC+d:8
PC ← PC+2
If
condition
is true
then
PC ←
PC+d:8
else next;
B
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4
2
2
4
4
4
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6
6
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
6
8
6
6
8
C ∨ Z = 0
C ∨ Z = 1
C = 0
C = 1
Z = 0
Z = 1
V = 0
V = 1
N = 0
N = 1
N⊕V = 0
N⊕V = 1
Z ∨ (N⊕V) = 0
Z ∨ (N⊕V) = 1
PC ← Rn16
PC ← aa:16
PC ← @aa:8
SP–2 → SP
PC → @SP
PC ← PC+d:8
SP–2 → SP
PC → @SP
PC ← Rn16
SP–2 → SP
PC → @SP
PC ← aa:16
↔
Branching
Condition
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 432 of 526
REJ09B0326-0600
Mnemonic Operation
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx: 8/16
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
@@aa
Implied
No. of States
IHNZVC
Condition Code
JSR @@aa:8
RTS
RTE
SLEEP
LDC #xx:8, CCR
LDC Rs, CCR
STC CCR, Rd
ANDC #xx:8, CCR
ORC #xx:8, CCR
XORC #xx:8, CCR
NOP
EEPMOV
SP–2 → SP
PC → @SP
PC ← @aa:8
PC ← @SP
SP+2 → SP
CCR ← @SP
SP+2 → SP
PC ← @SP
SP+2 → SP
Transit to sleep mode.
#xx:8 → CCR
Rs8 → CCR
CCR → Rd8
CCR∧#xx:8 → CCR
CCR∨#xx:8 → CCR
CCR⊕#xx:8 → CCR
PC ← PC+2
if R4L≠0
Repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
Until R4L=0
else next;
—
—
—
—
B
B
B
B
B
B
—
—
2—————— 8
8
10
2
2
2
2
2
2
2
2
4
2
↔
↔
2
↔
↔
↔
↔
2——————
↔
↔
2
↔
↔
↔
↔
↔
↔
2
↔
↔
↔
↔
2——————
↔
↔
2
↔
↔
↔
↔
↔
↔
2
↔
↔
↔
↔
↔
↔
2
↔
↔
↔
↔
2——————
——————
4——————
Notes: (1) Set to 1 when there is a carry or borrow from bit 11; otherwise cleared to 0.
(2) If the result is zero, the previous value of the flag is retained; otherwise the flag is
cleared to 0.
(3) Set to 1 if decimal adjustment produces a carry; otherwise retains value prior to
arithmetic operation.
(4) The number of states required for execution is 4n + 9 (n = value of R4L).
(5) Set to 1 if the divisor is negative; otherwise cleared to 0.
(6) Set to 1 if the divisor is zero; otherwise cleared to 0.
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 433 of 526
REJ09B0326-0600
A.2 Operation Code Map
Table A.2 is an operation code map. It shows the operation codes contained in the first byte of the
instruction code (bits 15 to 8 of the first instruction word).
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 0.
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 1.
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 434 of 526
REJ09B0326-0600
Table A.2 Operation Code Map
High Low 0123456789ABCDEF
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
NOP
BRA
MULXU
BSET
SHLL
SHAL
SLEEP
BRN
DIVXU
BNOT
SHLR
SHAR
STC
BHI
BCLR
ROTXL
ROTL
LDC
BLS
BTST
ROTXR
ROTR
ORC
OR
BCC
RTS
XORC
XOR
BCS
BSR
BOR
BIOR
BXOR
BIXOR
BAND
BIAND
ANDC
AND
BNE
RTE
LDC
BEQ
NOT
NEG
BLD
BILD
BST
BIST
ADD
SUB
BVC BVS
MOV
INC
DEC
BPL
JMP
ADDS
SUBS
BMI
EEPMOV
MOV
CMP
BGE BLT
ADDX
SUBX
BGT
JSR
DAA
DAS
BLE
MOV
ADD
ADDX
CMP
SUBX
OR
XOR
AND
MOV
MOV*
Note:
Bit-manipulation instructions
The PUSH and POP instructions are identical in machine language to MOV instructions.*
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 435 of 526
REJ09B0326-0600
A.3 Number of Execution States
The tables here can be used to calculate the number of states required for instruction execution.
Table A.3 indicates the number of states required for each cycle (instruction fetch, branch address
read, stack operation, byte data access, word data access, internal operation).
Table A.4 indicates the number of cycles of each type occurring in each instruction. The total
number of states required for execution of an instruction can be calculated from these two tables as
follows:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1, L = M = N = 0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 436 of 526
REJ09B0326-0600
Table A.3 Number of Cycles in Each Instruction
Execution Status Access Location
(Instruction Cycle) On-Chip Memory On-Chip Peripheral Module
Instruction fetch SI 2 —
Branch address read SJ
Stack operation SK
Byte data access SL 2 or 3*
Word data access SM —
Internal operation SN 1
Note: * Depends on which on-chip module is accessed. See section 2.9.1, Notes on Data
Access for details.
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 437 of 526
REJ09B0326-0600
Table A.4 Number of Cycles in Each Instruction
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
ADD ADD.B #xx:8, Rd 1
ADD.B Rs, Rd 1
ADD.W Rs, Rd 1
ADDS ADDS.W #1, Rd 1
ADDS.W #2, Rd 1
ADDX ADDX.B #xx:8, Rd 1
ADDX.B Rs, Rd 1
AND AND.B #xx:8, Rd 1
AND.B Rs, Rd 1
ANDC ANDC #xx:8, CCR 1
BAND BAND #xx:3, Rd 1
BAND #xx:3, @Rd 2 1
BAND #xx:3, @aa:8 2 1
Bcc BRA d:8 (BT d:8) 2
BRN d:8 (BF d:8) 2
BHI d:8 2
BLS d:8 2
BCC d:8 (BHS d:8) 2
BCS d:8 (BLO d:8) 2
BNE d:8 2
BEQ d:8 2
BVC d:8 2
BVS d:8 2
BPL d:8 2
BMI d:8 2
BGE d:8 2
BLT d:8 2
BGT d:8 2
BLE d:8 2
BCLR BCLR #xx:3, Rd 1
BCLR #xx:3, @Rd 2 2
BCLR #xx:3, @aa:8 2 2
BCLR Rn, Rd 1
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 438 of 526
REJ09B0326-0600
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
BCLR BCLR Rn, @Rd 2 2
BCLR Rn, @aa:8 2 2
BIAND BIAND #xx:3, Rd 1
BIAND #xx:3, @Rd 2 1
BIAND #xx:3, @aa:8 2 1
BILD BILD #xx:3, Rd 1
BILD #xx:3, @Rd 2 1
BILD #xx:3, @aa:8 2 1
BIOR BIOR #xx:3, Rd 1
BIOR #xx:3, @Rd 2 1
BIOR #xx:3, @aa:8 2 1
BIST BIST #xx:3, Rd 1
BIST #xx:3, @Rd 2 2
BIST #xx:3, @aa:8 2 2
BIXOR BIXOR #xx:3, Rd 1
BIXOR #xx:3, @Rd 2 1
BIXOR #xx:3, @aa:8 2 1
BLD BLD #xx:3, Rd 1
BLD #xx:3, @Rd 2 1
BLD #xx:3, @aa:8 2 1
BNOT BNOT #xx:3, Rd 1
BNOT #xx:3, @Rd 2 2
BNOT #xx:3, @aa:8 2 2
BNOT Rn, Rd 1
BNOT Rn, @Rd 2 2
BNOT Rn, @aa:8 2 2
BOR BOR #xx:3, Rd 1
BOR #xx:3, @Rd 2 1
BOR #xx:3, @aa:8 2 1
BSET BSET #xx:3, Rd 1
BSET #xx:3, @Rd 2 2
BSET #xx:3, @aa:8 2 2
BSET Rn, Rd 1
BSET Rn, @Rd 2 2
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 439 of 526
REJ09B0326-0600
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
BSET BSET Rn, @aa:8 2 2
BSR BSR d:8 2 1
BST BST #xx:3, Rd 1
BST #xx:3, @Rd 2 2
BST #xx:3, @aa:8 2 2
BTST BTST #xx:3, Rd 1
BTST #xx:3, @Rd 2 1
BTST #xx:3, @aa:8 2 1
BTST Rn, Rd 1
BTST Rn, @Rd 2 1
BTST Rn, @aa:8 2 1
BXOR BXOR #xx:3, Rd 1
BXOR #xx:3, @Rd 2 1
BXOR #xx:3, @aa:8 2 1
CMP CMP. B #xx:8, Rd 1
CMP. B Rs, Rd 1
CMP.W Rs, Rd 1
DAA DAA.B Rd 1
DAS DAS.B Rd 1
DEC DEC.B Rd 1
DIVXU DIVXU.B Rs, Rd 1 12
EEPMOV EEPMOV 2 2n+2* 1
INC INC.B Rd 1
JMP JMP @Rn 2
JMP @aa:16 2 2
JMP @@aa:8 2 1 2
JSR JSR @Rn 2 1
JSR @aa:16 2 1 2
JSR @@aa:8 2 1 1
LDC LDC #xx:8, CCR 1
LDC Rs, CCR 1
MOV MOV.B #xx:8, Rd 1
MOV.B Rs, Rd 1
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 440 of 526
REJ09B0326-0600
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
MOV MOV.B @Rs, Rd 1 1
MOV.B @(d:16, Rs),
Rd
2 1
MOV.B @Rs+, Rd 1 1 2
MOV.B @aa:8, Rd 1 1
MOV.B @aa:16, Rd 2 1
MOV.B Rs, @Rd 1 1
MOV.B Rs, @(d:16,
Rd)
2 1
MOV.B Rs, @–Rd 1 1 2
MOV.B Rs, @aa:8 1 1
MOV.B Rs, @aa:16 2 1
MOV.W #xx:16, Rd 2
MOV.W Rs, Rd 1
MOV.W @Rs, Rd 1 1
MOV.W @(d:16, Rs),
Rd
2 1
MOV.W @Rs+, Rd 1 1 2
MOV.W @aa:16, Rd 2 1
MOV.W Rs, @Rd 1 1
MOV.W Rs, @(d:16d) 2 1
MOV.W Rs, @–Rd 1 1 2
MOV.W Rs, @aa:16 2 1
MULXU MULXU.B Rs, Rd 1 12
NEG NEG.B Rd 1
NOP NOP 1
NOT NOT.B Rd 1
OR OR.B #xx:8, Rd 1
OR.B Rs, Rd 1
ORC ORC #xx:8, CCR 1
ROTL ROTL.B Rd 1
ROTR ROTR.B Rd 1
ROTXL ROTXL.B Rd 1
ROTXR ROTXR.B Rd 1
Appendix A CPU Instruction Set
Rev. 6.00 Sep 12, 2006 page 441 of 526
REJ09B0326-0600
Instruction
Mnemonic
Instruction
Fetch
I
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
RTE RTE 2 2 2
RTS RTS 2 1 2
SHAL SHAL.B Rd 1
SHAR SHAR.B Rd 1
SHLL SHLL.B Rd 1
SHLR SHLR.B Rd 1
SLEEP SLEEP 1
STC STC CCR, Rd 1
SUB SUB.B Rs, Rd 1
SUB.W Rs, Rd 1
SUBS SUBS.W #1, Rd 1
SUBS.W #2, Rd 1
POP POP Rd 1 1 2
PUSH PUSH Rs 1 1 2
SUBX SUBX.B #xx:8, Rd 1
SUBX.B Rs, Rd 1
XOR XOR.B #xx:8, Rd 1
XOR.B Rs, Rd 1
XORC XORC #xx:8, CCR 1
Note: n: Initial value in R4L. The source and destination operands are accessed n + 1 times each.
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 442 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
B.1 Addresses
Register Bit Names Module
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name
H'F740
H'F741
H'F742
H'F743
H'F744
H'F770 TIER ICIAE ICIBE ICICE ICIDE OCIAE OCIBE OVIE — Timer X
H'F771 TCSRX ICFA ICFB ICFC ICFD OCFA OCFB OVF CCLRA
H'F772 FRCH FRCH7 FRCH6 FRCH5 FRCH4 FRCH3 FRCH2 FRCH1 FRCH0
H'F773 FRCL FRCL7 FRCL6 FRCL5 FRCL4 FRCL3 FRCL2 FRCL1 FRCL0
H'F774 OCRAH/
OCRBH
OCRAH7/
OCRBH7
OCRAH6/
OCRBH6
OCRAH5/
OCRBH5
OCRAH4/
OCRBH4
OCRAH3/
OCRBH3
OCRAH2/
OCRBH2
OCRAH1/
OCRBH1
OCRAH0/
OCRBH0
H'F775 OCRAL/
OCRBL
OCRAL7/
OCRBL7
OCRAL6/
OCRBL6
OCRAL5/
OCRBL5
OCRAL4/
OCRBL4
OCRAL3/
OCRBL3
OCRAL2/
OCRBL2
OCRAL1/
OCRBL1
OCRAL0/
OCRBL0
H'F776 TCRX IEDGA IEDGB IEDGC IEDGD BUFEA BUFEB CKS1 CKS0
H'F777 TOCR — — — OCRS OEA OEB OLVLA OLVLB
H'F778 ICRAH ICRAH7 ICRAH6 ICRAH5 ICRAH4 ICRAH3 ICRAH2 ICRAH1 ICRAH0
H'F779 ICRAL ICRAL7 ICRAL6 ICRAL5 ICRAL4 ICRAL3 ICRAL2 ICRAL1 ICRAL0
F'F77A ICRBH ICRBH7 ICRBH6 ICRBH5 ICRBH4 ICRBH3 ICRBH2 ICRBH1 ICRBH0
F'F77B ICRBL ICRBL7 ICRBL6 ICRBL5 ICRBL4 ICRBL3 ICRBL2 ICRBL1 ICRBL0
H'F77C ICRCH ICRCH7 ICRCH6 ICRCH5 ICRCH4 ICRCH3 ICRCH2 ICRCH1 ICRCH0
H'F77D ICRCL ICRCL7 ICRCL6 ICRCL5 ICRCL4 ICRCL3 ICRCL2 ICRCL1 ICRCL0
H'F77E ICRDH ICRDH7 ICRDH6 ICRDH5 ICRDH4 ICRDH3 ICRDH2 ICRDH1 ICRDH0
H'F77F ICRDL ICRDL7 ICRDL6 ICRDL5 ICRDL4 ICRDL3 ICRDL2 ICRDL1 ICRDL0
H'FF80 FLMCR VPP — — — EV PV E P Flash
memory
H'FF81 (flash
memory
H'FF82 EBR1 — — — — LB3 LB2 LB1 LB0
version
only)
H'FF83 EBR2 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 443 of 526
REJ09B0326-0600
Register Bit Names Module
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name
H'FFA0 SCR1 SNC1 SNC0 MRKON LTCH CKS3 CKS2 CKS1 CKS0 SCI1
H'FFA1 SCSR1 — SOL ORER — — — MTRF STF
H'FFA2 SDRU SDRU7 SDRU6 SDRU5 SDRU4 SDRU3 SDRU2 SDRU1 SDRU0
H'FFA3 SDRL SDRL7 SDRL6 SDRL5 SDRL4 SDRL3 SDRL2 SDRL1 SDRL0
H'FFA4
H'FFA5
H'FFA6
H'FFA7
H'FFA8 SMR COM CHR PE PM STOP MP CKS1 CKS0 SCI3
H'FFA9 BRR BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0
H'FFAA SCR3 TIE RIE TE RE MPIE TEIE CKE1 CKE0
H'FFAB TDR TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0
H'FFAC SSR TDRE RDRF OER FER PER TEND MPBR MPBT
H'FFAD RDR RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0
H'FFAE
H'FFAF
H'FFB0 TMA TMA7 TMA6 TMA5 — TMA3 TMA2 TMA1 TMA0 Timer A
H'FFB1 TCA TCA7 TCA6 TCA5 TCA4 TCA3 TCA2 TCA1 TCA0
H'FFB2 TMB1 TMB17 — — — — TMB12 TMB11 TMB10 Timer B1
H'FFB3 TCB1/
TLB1
TCB17/
TLB17
TCB16/
TLB16
TCB15/
TLB15
TCB14/
TLB14
TCB13/
TLB13
TCB12/
TLB12
TCB11/
TLB11
TCB10/
TLB10
H'FFB4
H'FFB5
H'FFB6
H'FFB7
H'FFB8 TCRV0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 Timer V
H'FFB9 TCSRV CMFB CMFA OVF — OS3 OS2 OS1 OS0
H'FFBA TCORA TCORA7 TCORA6 TCORA5 TCORA4 TCORA3 TCORA2 TCORA1 TCORA0
H'FFBB TCORB TCORB7 TCORB6 TCORB5 TCORB4 TCORB3 TCORB2 TCORB1 TCORB0
H'FFBC TCNTV TCNTV7 TCNTV6 TCNTV5 TCNTV4 TCNTV3 TCNTV2 TCNTV1 TCNTV0
H'FFBD TCRV1 — — — TVEG1 TVEG0 TRGE — ICKS0
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 444 of 526
REJ09B0326-0600
Register Bit Names Module
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name
H'FFBE TCSRW B6WI TCWE B4WI TCSRWE B2WI WDON B0WI WRST Watchdog
H'FFBF TCW TCW7 TCW6 TCW5 TCW4 TCW3 TCW2 TCW1 TCW0
timer
H'FFC0
H'FFC1
H'FFC2
H'FFC3
H'FFC4 AMR CKS TRGE — — CH3 CH2 CH1 CH0 A/D
H'FFC5 ADRR ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 converter
H'FFC6 ADSR ADSF — — — — — — —
H'FFC7
H'FFC8
H'FFC9
H'FFCA
H'FFCB
H'FFCC
H'FFCD
H'FFCE
H'FFCF
H'FFD0 PWCR — — — — — — — PWCR0 14-bit
H'FFD1 PWDRU — — PWDRU5PWDRU4PWDRU3PWDRU2PWDRU1PWDRU0 PWM
H'FFD2 PWDRL PWDRL7 PWDRL6PWDRL5PWDRL4PWDRL3PWDRL2PWDRL1PWDRL0
H'FFD3
H'FFD4 PDR1 P17 P16 P15 P14 — — — P10 I/O ports
H'FFD5 PDR2 — — — — — P22 P21 P20
H'FFD6 PDR3 — — — — — P32 P31 P30
H'FFD7
H'FFD8 PDR5 P57 P56 P55 P54 P53 P52 P51 P50
H'FFD9 PDR6 P67 P66 P65 P64 P63 P62 P61 P60
H'FFDA PDR7 P77 P76 P75 P74 P73 — — —
H'FFDB PDR8 P87 P86 P85 P84 P83 P82 P81 P80
H'FFDC PDR9 — — — P94 P93 P92 P91 P90
H'FFDD PDRB PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
H'FFDE
H'FFDF
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 445 of 526
REJ09B0326-0600
Register Bit Names Module
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name
H'FFE0 I/O ports
H'FFE1
H'FFE2
H'FFE3
H'FFE4 PCR1 PCR17 PCR16 PCR15 PCR14 — — — PCR10
H'FFE5 PCR2 — — — — — PCR22 PCR21 PCR20
H'FFE6 PCR3 — — — — — PCR32 PCR31 PCR30
H'FFE7
H'FFE8 PCR5 PCR57 PCR56 PCR55 PCR54 PCR53 PCR52 PCR51 PCR50
H'FFE9 PCR6 PCR67 PCR66 PCR65 PCR64 PCR63 PCR62 PCR61 PCR60
H'FFEA PCR7 PCR77 PCR76 PCR75 PCR74 PCR73 — — —
H'FFEB PCR8 PCR87 PCR86 PCR85 PCR84 PCR83 PCR82 PCR81 PCR80
H'FFEC PCR9 — — — PCR94 PCR93 PCR92 PCR91 PCR90
H'FFED PUCR1 PUCR17 PUCR16 PUCR15 PUCR14 — — — PUCR10
H'FFEE PUCR3 — — — — — PUCR32 PUCR31 PUCR30
H'FFEF PUCR5 PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
H'FFF0 SYSCR1 SSBY STS2 STS1 STS0 LSON — MA1 MA0 System
H'FFF1 SYSCR2 — — — NESEL DTON MSON SA1 SA0
control
H'FFF2 IEGR1 — — — — IEG3 IEG2 IEG1 IEG0
H'FFF3 IEGR2 INTEG7 INTEG6 INTEG5 INTEG4 INTEG3 INTEG2 INTEG1 INTEG0
H'FFF4 IENR1 IENTB1 IENTA — — IEN3 IEN2 IEN1 IEN0
H'FFF5 IENR2 IENDT IENAD — IENS1 — — — —
H'FFF6 IENR3 INTEN7 INTEN6 INTEN5 INTEN4 INTEN3 INTEN2 INTEN1 INTEN0
H'FFF7 IRR1 IRRTB1 IRRTA — — IRRI3 IRRI2 IRRI1 IRRI0
H'FFF8 IRR2 IRRDT IRRAD — IRRS1 — — — —
H'FFF9 IRR3 INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 INTF0
H'FFFA
H'FFFB
H'FFFC PMR1 IRQ3 IRQ2 IRQ1 PWM — — — TMOW I/O ports
H'FFFD PMR3 — — — — — SO1 SI1 SCK1
H'FFFE
H'FFFF PMR7 — — — — — TXD — POF1 I/O ports
Legend:
SCI1: Serial communication interface 1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 446 of 526
REJ09B0326-0600
B.2 Functions
TMC—Timer mode register C H'B4 Timer C
Register
name Address to which the
register is mapped Name of
on-chip
supporting
module
Register
acronym
Bit
numbers
Initial bit
values Names of the
bits. Dashes
(—) indicate
reserved bits.
Full name
of bit
Descriptions
of bit settings
Read only
Write only
Read and write
R
W
R/W
Possible types of access
Bit
Initial value
Read/Write
7
TMC7
0
R/W
6
TMC6
0
R/W
5
TMC5
0
R/W
3
—
1
—
0
TMC0
0
R/W
2
TMC2
0
R/W
1
TMC1
0
R/W
4
—
1
—
Clock select
0 Internal clock:
Internal clock:
00
1Internal clock:
Internal clock:
10
1
100
1
10
1
Internal clock:
Internal clock:
Internal clock:
External event (TMIC):
φ/8192
φ/2048
φ/512
φ/64
φ/16
φ/4
φ /4 Rising or falling edge
W
Counter up/down control
TCC is an up-counter
TCC is a down-counter
00
1TCC up/down control is determined by input at pin
UD. TCC is a down-counter if the UD input is high,
and an up-counter if the UD input is low.
1*
Auto-reload function select
Interval timer function selected
* Don't care
Auto-reload function selected
0
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 447 of 526
REJ09B0326-0600
TIER—Timer interrupt enable register H'F770 Timer X
Bit
Initial value
Read/Write
7
ICIAE
0
R/W
6
ICIBE
0
R/W
5
ICICE
0
R/W
4
ICIDE
0
R/W
3
OCIAE
0
R/W
0
—
1
—
2
OCIBE
0
R/W
1
OVIE
0
R/W
Timer overflow interrupt enable
0 Interrupt request (FOVI) by OVF is disabled
Interrupt request (FOVI) by OVF is enabled
1
Output compare interrupt B enable
0 Interrupt request (OCIB) by OCFB is disabled
Interrupt request (OCIB) by OCFB is enabled
1
Output compare interrupt A enable
0 Interrupt request (OCIA) by OCFA is disabled
Interrupt request (OCIA) by OCFA is enabled
1
Input capture interrupt D enable
0 Interrupt request (ICID) by ICFD is disabled
Interrupt request (ICID) by ICFD is enabled
1
Input capture interrupt C enable
0 Interrupt request (ICIC) by ICFC is disabled
Interrupt request (ICIC) by ICFC is enabled
1
Input capture interrupt B enable
0 Interrupt request (ICIB) by ICFB is disabled
Interrupt request (ICIB) by ICFB is enabled
1
Input capture interrupt A enable
0 Interrupt request (ICIA) by ICFA is disabled
Interrupt request (ICIA) by ICFA is enabled
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 448 of 526
REJ09B0326-0600
TCSRX—Timer control/status register X H'F771 Timer X
Bit
Initial value
Read/Write
7
ICFA
0
R/(W)
6
ICFB
0
R/(W)
5
ICFC
0
R/(W)
4
ICFD
0
R/(W)
3
OCFA
0
R/(W)
0
CCLRA
0
R/W
2
OCFB
0
R/(W)
1
OVF
0
R/(W)
*******
0 [Clearing condition]
After reading OVF = 1, cleared by writing 0 to OVF
Timer overflow
1 [Setting condition]
Set when the FRC value goes from H'FFFF to H'0000
0 FRC is not cleared by compare match A
Counter clear A
1 FRC is cleared by compare match A
0 [Clearing condition]
After reading OCFB = 1, cleared by writing 0 to OCFB
Output compare flag B
1 [Setting condition]
Set when FRC matches OCRB
0 [Clearing condition]
After reading OCFA = 1, cleared by writing 0 to OCFA
Output compare flag A
1 [Setting condition]
Set when FRC matches OCRA
0 [Clearing condition]
After reading ICFD = 1, cleared by writing 0 to ICFD
Input capture flag D
1 [Setting condition]
Set by input capture signal
0 [Clearing condition]
After reading ICFC = 1, cleared by writing 0 to ICFC
Input capture flag C
1 [Setting condition]
Set by input capture signal
0 [Clearing condition]
After reading ICFB = 1, cleared by writing 0 to ICFB
Input capture flag B
1 [Setting condition]
When the value of FRC is transferred to ICRB by the input
capture signal
0 [Clearing condition]
After reading ICFA = 1, cleared by writing 0 to ICFA
Input capture flag A
1 [Setting condition]
When the value of FRC is transferred to ICRA by the input
capture signal
Note: * Only a write of 0 for flag clearing is possible.
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 449 of 526
REJ09B0326-0600
FRCH—Free-running counter H H'F772 Timer X
Bit
Initial value
Read/Write
7
FRCH7
0
R/W
6
FRCH6
0
R/W
5
FRCH5
0
R/W
4
FRCH4
0
R/W
3
FRCH3
0
R/W
0
FRCH0
0
R/W
2
FRCH2
0
R/W
1
FRCH1
0
R/W
Count value
FRCL—Free-running counter L H'F773 Timer X
Bit
Initial value
Read/Write
7
FRCL7
0
R/W
6
FRCL6
0
R/W
5
FRCL5
0
R/W
4
FRCL4
0
R/W
3
FRCL3
0
R/W
0
FRCL0
0
R/W
2
FRCL2
0
R/W
1
FRCL1
0
R/W
Count value
OCRAH—Output compare register AH H'F774 Timer X
Bit
Initial value
Read/Write
7
OCRAH7
1
R/W
6
OCRAH6
1
R/W
5
OCRAH5
1
R/W
4
OCRAH4
1
R/W
3
OCRAH3
1
R/W
0
OCRAH0
1
R/W
2
OCRAH2
1
R/W
1
OCRAH1
1
R/W
OCRBH—Output compare register BH H'F774 Timer X
Bit
Initial value
Read/Write
7
OCRBH7
1
R/W
6
OCRBH6
1
R/W
5
OCRBH5
1
R/W
4
OCRBH4
1
R/W
3
OCRBH3
1
R/W
0
OCRBH0
1
R/W
2
OCRBH2
1
R/W
1
OCRBH1
1
R/W
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 450 of 526
REJ09B0326-0600
OCRAL—Output compare register AL H'F775 Timer X
Bit
Initial value
Read/Write
7
OCRAL7
1
R/W
6
OCRAL6
1
R/W
5
OCRAL5
1
R/W
4
OCRAL4
1
R/W
3
OCRAL3
1
R/W
0
OCRAL0
1
R/W
2
OCRAL2
1
R/W
1
OCRAL1
1
R/W
OCRBL—Output compare register BL H'F775 Timer X
Bit
Initial value
Read/Write
7
OCRBL7
1
R/W
6
OCRBL6
1
R/W
5
OCRBL5
1
R/W
4
OCRBL4
1
R/W
3
OCRBL3
1
R/W
0
OCRBL0
1
R/W
2
OCRBL2
1
R/W
1
OCRBL1
1
R/W
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 451 of 526
REJ09B0326-0600
TCRX—Timer control register X H'F776 Timer X
Bit
Initial value
Read/Write
7
IEDGA
0
R/W
6
IEDGB
0
R/W
5
IEDGC
0
R/W
4
IEDGD
0
R/W
3
BUFEA
0
R/W
0
CKS0
0
R/W
2
BUFEB
0
R/W
1
CKS1
0
R/W
Clock select
0
1
Internal clock: φ/2
Internal clock: φ/8
Internal clock: φ/32
Internal clock: rising edge
0
1
0
1
Buffer enable B
0 ICRD is not used as a buffer register for ICRB
ICRD is used as a buffer register for OCRB
1
Buffer enable A
0 ICRC is not used as a buffer register for ICRA
ICRC is used as a buffer register for OCRA
1
Input edge select D
0 Rising edge of input D is captured
Falling edge of input D is captured
1
Input edge select C
0 Rising edge of input C is captured
Falling edge of input C is captured
1
Input edge select B
0 Rising edge of input B is captured
Falling edge of input B is captured
1
Input edge select A
0 Rising edge of input A is captured
Falling edge of input A is captured
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 452 of 526
REJ09B0326-0600
TOCR—Timer Output compare control register H'F777 Timer X
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
1
—
4
OCRS
0
R/W
3
OEA
0
R/W
0
OLVLB
0
R/W
2
OEB
0
R/W
1
OLVLA
0
R/W
Output level B
0 Low level
High level
1
Output level A
0 Low level
High level
1
Output enable B
0 Output compare B output is disabled
Output compare B output is enabled
1
Output enable A
0 Output compare A output is disabled
Output compare A output is enabled
1
Output compare register select
0 OCRA is selected
OCRB is selected
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 453 of 526
REJ09B0326-0600
ICRAH—Input capture register AH H'F778 Timer X
Bit
Initial value
Read/Write
7
ICRAH7
0
R
6
ICRAH6
0
R
5
ICRAH5
0
R
4
ICRAH4
0
R
3
ICRAH3
0
R
0
ICRAH0
0
R
2
ICRAH2
0
R
1
ICRAH1
0
R
ICRAL—Input capture register AL H'F779 Timer X
Bit
Initial value
Read/Write
7
ICRAL7
0
R
6
ICRAL6
0
R
5
ICRAL5
0
R
4
ICRAL4
0
R
3
ICRAL3
0
R
0
ICRAL0
0
R
2
ICRAL2
0
R
1
ICRAL1
0
R
ICRBH—Input capture register BH H'F77A Timer X
Bit
Initial value
Read/Write
7
ICRBH7
0
R
6
ICRBH6
0
R
5
ICRBH5
0
R
4
ICRBH4
0
R
3
ICRBH3
0
R
0
ICRBH0
0
R
2
ICRBH2
0
R
1
ICRBH1
0
R
ICRBL—Input capture register BL H'F77B Timer X
Bit
Initial value
Read/Write
7
ICRBL7
0
R
6
ICRBL6
0
R
5
ICRBL5
0
R
4
ICRBL4
0
R
3
ICRBL3
0
R
0
ICRBL0
0
R
2
ICRBL2
0
R
1
ICRBL1
0
R
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 454 of 526
REJ09B0326-0600
FLMCR—Flash memory control register H'FF80 Flash memory
(Flash memory version only)
Bit
Initial value
Read/Write
7
V
PP
0
R
6
—
0
—
5
—
0
—
4
—
0
—
3
EV
0
R/W
0
P
0
R/W
2
PV
0
R/W
1
E
0
R/W
Programming power
0 12 V is not applied to the FV
PP
pin
1 12 V is applied to the FV
PP
pin
Erase-verify mode
0 Exit from erase-verify mode
1 Transition to erase-verify mode
Program-verify mode
0 Exit from program-verify mode
1 Transition to program-verify mode
Erase mode
0 Exit from erase mode
1 Transition to erase mode
Program mode
0 Exit from program mode
1 Transition to program mode
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 455 of 526
REJ09B0326-0600
EBR1—Erase block register 1 H'FF82 Flash memory
(Flash memory version only)
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
LB3
0
R/W
0
LB0
0
R/W
2
LB2
0
R/W
1
LB1
0
R/W
Large block 3 to 0
0 Not selected
1 Selected
EBR2—Erase block register 2 H'FF83 Flash memory
(Flash memory version only)
Bit
Initial value
Read/Write
7
SB7
0
R/W
6
SB6
0
R/W
5
SB5
0
R/W
4
SB4
0
R/W
3
SB3
0
R/W
0
SB0
0
R/W
2
SB2
0
R/W
1
SB1
0
R/W
Small block 7 to 0
0 Not selected
1 Selected
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 456 of 526
REJ09B0326-0600
ICRCH—Input capture register CH H'F77C Timer X
Bit
Initial value
Read/Write
7
ICRCH7
0
R
6
ICRCH6
0
R
5
ICRCH5
0
R
4
ICRCH4
0
R
3
ICRCH3
0
R
0
ICRCH0
0
R
2
ICRCH2
0
R
1
ICRCH1
0
R
ICRCL—Input capture register CL H'F77D Timer X
Bit
Initial value
Read/Write
7
ICRCL7
0
R
6
ICRCL6
0
R
5
ICRCL5
0
R
4
ICRCL4
0
R
3
ICRCL3
0
R
0
ICRCL0
0
R
2
ICRCL2
0
R
1
ICRCL1
0
R
ICRDH—Input capture register DH H'F77E Timer X
Bit
Initial value
Read/Write
7
ICRDH7
0
R
6
ICRDH6
0
R
5
ICRDH5
0
R
4
ICRDH4
0
R
3
ICRDH3
0
R
0
ICRDH0
0
R
2
ICRDH2
0
R
1
ICRDH1
0
R
ICRDL—Input capture register DL H'F77F Timer X
Bit
Initial value
Read/Write
7
ICRDL7
0
R
6
ICRDL6
0
R
5
ICRDL5
0
R
4
ICRDL4
0
R
3
ICRDL3
0
R
0
ICRDL0
0
R
2
ICRDL2
0
R
1
ICRDL1
0
R
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 457 of 526
REJ09B0326-0600
SCR1—Serial control register 1 H'FFA0 SCI1
Bit
Initial value
Read/Write
7
SNC1
0
R/W
6
SNC0
0
R/W
5
MRKON
0
R/W
4
LTCH
0
R/W
3
CKS3
0
R/W
0
CKS0
0
R/W
2
CKS2
0
R/W
1
CKS1
0
R/W
Operation mode select
Clock source select (CKS3)
0 Clock source is prescaler S, and pin SCK is output pin
1 Clock source is external clock, and pin SCK is input pin
LATCH TAIL select
0 HOLD TAIL is output
1 LATCH TAIL is output
TAIL MARK control
0 TAIL MARK is not output (synchronous mode)
1 TAIL MARK is output (SSB mode)
0 8-bit synchronous transfer mode
16-bit synchronous transfer mode
1
0
1
0
1Continuous clock output mode
Reserved
Clock select (CKS2 to CKS0)
Bit 2
CKS2 CKS1 CKS0
Bit 1 Bit 0
0φ/1024
φ/256
11
0φ/64
φ/321 φ/16100
1φ/8
00
φ/410
1φ/2
φ = 5 MHz
204.8 µs
51.2 µs
12.8 µs
6.4 µs
3.2 µs
1.6 µs
0.8 µs
—
φ = 2.5 MHz
409.6 µs
102.4 µs
25.6 µs
12.8 µs
6.4 µs
3.2 µs
1.6 µs
0.8 µs
Synchronous
Serial Clock Cycle
1
1
Prescaler
Division
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 458 of 526
REJ09B0326-0600
SCSR1—Serial control/status register H'FFA1 SCI1
Bit
Initial value
Read/Write
7
—
1
—
6
SOL
0
R/W
5
ORER
0
R/(W)
4
—
1
—
3
—
1
—
0
STF
0
R/W
2
—
1
—
1
MTRF
0
R
Extended data bit
Overrun error flag
*
Start flag
0 Indicates that transfer is stopped
Invalid
1
Read
Write
Read
Write Indicates transfer in progress
Starts a transfer operation
Note: Only a write of 0 for flag clearing is possible.*
0 [Clearing condition]
After reading 1, cleared by writing 0
1 [Setting condition]
Set if a clock pulse is input after transfer
is complete, when an external clock is used
0SO
1
pin output level is low
SO
1
pin output level changes to low
SO
1
pin output level is high
SO
1
pin output level changes to high
1
Read
Write
Read
Write
TAIL MARK transmit flag
0 Idle state and 8- or -16-bit data transfer in progress
1 TAIL MARK transmission in progress
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 459 of 526
REJ09B0326-0600
SDRU—Serial data register U H'FFA2 SCI1
Bit
Initial value
Read/Write
7
SDRU7
Undefined
R/W
6
SDRU6
Undefined
R/W
5
SDRU5
Undefined
R/W
4
SDRU4
Undefined
R/W
3
SDRU3
Undefined
R/W
0
SDRU0
Undefined
R/W
2
SDRU2
Undefined
R/W
1
SDRU1
Undefined
R/W
Stores transmit and receive data
8-bit transfer mode:
16-bit transfer mode: Not used
Upper 8 bits of data
SDRL—Serial data register L H'FFA3 SCI1
Bit
Initial value
Read/Write
7
SDRL7
Undefined
R/W
6
SDRL6
Undefined
R/W
5
SDRL5
Undefined
R/W
4
SDRL4
Undefined
R/W
3
SDRL3
Undefined
R/W
0
SDRL0
Undefined
R/W
2
SDRL2
Undefined
R/W
1
SDRL1
Undefined
R/W
Stores transmit and receive data
8-bit transfer mode:
16-bit transfer mode: 8-bit data
Lower 8 bits of data
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 460 of 526
REJ09B0326-0600
SMR—Serial mode register H'FFA8 SCI3
Bit
Initial value
Read/Write
7
COM
0
R/W
6
CHR
0
R/W
5
PE
0
R/W
0
CKS0
0
R/W
2
MP
0
R/W
1
CKS1
0
R/W
4
PM
0
R/W
Clock select
00
1
11
φ clock
φ/4 clock
0φ/16 clock
φ/64 clock
Multiprocessor mode
0Multiprocessor communication
function disabled
1 Multiprocessor communication
function enabled
Stop bit length
0 1 stop bit
1 2 stop bits
Parity mode
0Even parity
1 Odd parity
Parity enable
0Parity bit addition and checking disabled
1 Parity bit addition and checking enabled
Character length
08-bit data
1 7-bit data
Communication mode
0Asynchronous mode
1 Synchronous mode
3
STOP
0
R/W
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 461 of 526
REJ09B0326-0600
BRR—Bit rate register H'FFA9 SCI3
Bit
Initial value
Read/Write
7
BRR7
1
R/W
6
BRR6
1
R/W
5
BRR5
1
R/W
4
BRR4
1
R/W
3
BRR3
1
R/W
0
BRR0
1
R/W
2
BRR2
1
R/W
1
BRR1
1
R/W
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 462 of 526
REJ09B0326-0600
SCR3—Serial control register 3 H'FFAA SCI3
Bit
Initial value
Read/Write
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
4
RE
0
R/W
Receive interrupt enable
0Receive data full interrupt request (RXI) and receive error interrupt request (ERI) disabled
1 Receive data full interrupt request (RXI) and receive error interrupt request (ERI) enabled
Multiprocessor interrupt enable
0Multiprocessor interrupt request disabled (normal receive operation)
[Clearing condition]
When data is received in which the multiprocessor bit is set to 1
1 Multiprocessor interrupt request enabled
The receive interrupt request (RXI), receive error interrupt request (ERI), and setting of the
RDRF, FER, and OER flags in the serial status register (SSR), are disabled until data with
the multiprocessor bit set to 1 is received.
Transmit enable
0Transmit operation disabled (TXD pin is transmit data pin)*1
1 Transmit operation enabled (TXD pin is transmit data pin)*1
Receive enable
0 Receive operation disabled (RXD pin is I/O port)
1 Receive operation enabled (RXD pin is receive data pin)
Transmit end interrupt enable
Clock enable
0
Bit 1
CKE1
0
1
Bit 0
CKE0
0
1
0
1
Communication Mode
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Internal clock
Internal clock
Internal clock
Reserved (Do not specify this combination)
External clock
External clock
Reserved (Do not specify this combination)
Reserved (Do not specify this combination)
I/O port
Serial clock output
Clock output
Clock input
Serial clock input
Clock Source SCK Pin Function
Description
Transmit end interrupt request (TEI) disabled
1 Transmit end interrupt request (TEI) enabled
Transmit interrupt enable
0Transmit data empty interrupt request (TXI) disabled
1 Transmit data empty interrupt request (TXI) enabled
3
MPIE
0
R/W
3
Note: 1. When bit TXD is set to 1 in PMR7
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 463 of 526
REJ09B0326-0600
TDR—Transmit data register H'FFAB SCI3
Bit
Initial value
Read/Write
7
TDR7
1
R/W
6
TDR6
1
R/W
5
TDR5
1
R/W
4
TDR4
1
R/W
3
TDR3
1
R/W
0
TDR0
1
R/W
2
TDR2
1
R/W
1
TDR1
1
R/W
Data for transfer to TSR
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 464 of 526
REJ09B0326-0600
SSR—Serial status register H'FFAC SCI3
Bit
Initial value
Read/Write
Note: * Only a write of 0 for flag clearing is possible.
7
TDRE
1
R/(W)
6
RDRF
0
R/(W)
5
OER
0
R/(W)
0
MPBT
0
R/W
2
TEND
1
R
1
MPBR
0
R
4
FER
0
R/(W)
Receive data register full
0There is no receive data in RDR
[Clearing conditions] • After reading RDRF = 1, cleared by writing 0 to RDRF
• When RDR data is read by an instruction
1There is receive data in RDR
[Setting condition] When reception ends normally and receive data is transferred from RSR to RDR
Transmit data register empty
0Transmit data written in TDR has not been transferred to TSR
[Clearing conditions] • After reading TDRE = 1, cleared by writing 0 to TDRE
• When data is written to TDR by an instruction
1 Transmit data has not been written to TDR, or transmit data written in TDR has been transferred to TSR
[Setting conditions] • When bit TE in serial control register 3 (SCR3) is cleared to 0
• When data is transferred from TDR to TSR
Transmit end
0Transmission in progress
[Clearing conditions]
1Transmission ended
[Setting conditions]
Parity error
0Reception in progress or completed normally
[Clearing condition] After reading PER = 1, cleared by writing 0 to PER
1A parity error has occurred during reception
[Setting condition]
Framing error
0Reception in progress or completed normally
[Clearing condition] After reading FER = 1, cleared by writing 0 to FER
1A framing error has occurred during reception
[Setting condition] When the stop bit at the end of the receive data is checked for a value of 1 at completion of
reception, and the stop bit is 0
Overrun error
0Reception in progress or completed
[Clearing condition] After reading OER = 1, cleared by writing 0 to OER
1 An overrun error has occurred during reception
[Setting condition] When the next serial reception is completed with RDRF set to 1
Multiprocessor bit receive
Multiprocessor bit transfer
0Data in which the multiprocessor bit is 0 has been received
1 Data in which the multiprocessor bit is 1 has been received
0 A 0 multiprocessor bit is transmitted
1 A 1 multiprocessor bit is transmitted
3
PER
0
R/(W)
*****
• After reading TDRE = 1, cleared by writing 0 to TDRE
• When data is written to TDR by an instruction
• When bit TE in serial control register 3 (SCR3) is cleared to 0
• When bit TDRE is set to 1 when the last bit of a transmit character is sent
When the number of 1 bits in the receive data plus parity bit does not match the parity
designated by the parity mode bit (PM) in the serial mode register (SMR)
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 465 of 526
REJ09B0326-0600
RDR—Receive data register H'FFAD SCI3
Bit
Initial value
Read/Write
7
RDR7
0
R
6
RDR6
0
R
5
RDR5
0
R
4
RDR4
0
R
3
RDR3
0
R
0
RDR0
0
R
2
RDR2
0
R
1
RDR1
0
R
TMA—Timer mode register A H'FFB0 Timer A
Bit
Initial value
Read/Write
7
TMA7
0
R/W
6
TMA6
0
R/W
5
TMA5
0
R/W
0
TMA0
0
R/W
2
TMA2
0
R/W
1
TMA1
0
R/W
Internal clock select
TMA3 TMA2
0 PSS
PSS
PSS
PSS
0
4
—
1
—
Clock output select
0φ/32
φ/16 TMA1
0
1
TMA0
0
0
1
1
PSS
PSS
PSS
PSS
10
1
0
0
1
1
1 PSW
PSW
PSW
PSW
00
1
0
0
1
1
PSW and TCA are reset
10
1
0
0
1
1
Prescaler and Divider Ratio
or Overflow Period
φ/8192
φ/4096
φ/2048
φ/512
φ/256
φ/128
φ/32
φ/8
1 s
0.5 s
0.25 s
0.03125 s
Interval
timer
Time
base
Function
0 0
1φ/8
φ/4
10
1
100
1
10
1
φ /32
W
φ /16
W
φ /8
W
φ /4
W
3
TMA3
0
R/W
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 466 of 526
REJ09B0326-0600
TCA—Timer counter A H'FFB1 Timer A
Bit
Initial value
Read/Write
7
TCA7
0
R
6
TCA6
0
R
5
TCA5
0
R
4
TCA4
0
R
3
TCA3
0
R
0
TCA0
0
R
2
TCA2
0
R
1
TCA1
0
R
Count value
TMB1—Timer mode register B1 H'FFB2 Timer B1
Bit
Initial value
Read/Write
7
TMB17
0
R/W
6
—
1
—
5
—
1
—
3
—
1
—
0
TMB10
0
R/W
2
TMB12
0
R/W
1
TMB11
0
R/W
4
—
1
—
Auto-reload function select Clock select
0 Internal clock:
Internal clock:
00
1Internal clock:
Internal clock:
10
1
100
1
10
1
Internal clock:
Internal clock:
Internal clock:
External event (TMIB):
φ/8192
φ/2048
φ/512
φ/256
φ/64
φ/16
φ/4 Rising or falling edge
0 Interval timer function selected
1 Auto-reload function selected
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 467 of 526
REJ09B0326-0600
TCB1—Timer counter B1 H'FFB3 Timer B1
Bit
Initial value
Read/Write
7
TCB17
0
R
6
TCB16
0
R
5
TCB15
0
R
4
TCB14
0
R
3
TCB13
0
R
0
TCB10
0
R
2
TCB12
0
R
1
TCB11
0
R
Count value
TLB1—Timer load register B1 H'FFB3 Timer B1
Bit
Initial value
Read/Write
7
TLB17
0
W
6
TLB16
0
W
5
TLB15
0
W
4
TLB14
0
W
3
TLB13
0
W
0
TLB10
0
W
2
TLB12
0
W
1
TLB11
0
W
Reload value
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 468 of 526
REJ09B0326-0600
TCRV0—Timer control register V0 H'FFB8 Timer V
Bit
Initial value
Read/Write
7
CMIEB
0
R/W
6
CMIEA
0
R/W
5
OVIE
0
R/W
4
CCLR1
0
R/W
3
CCLR0
0
R/W
0
CKS0
0
R/W
2
CKS2
0
R/W
1
CKS1
0
R/W
TCRV0 Description
Clock select
Bit 2
CKS2
0
1
Clock input disabled
Internal clock: φ/4, falling edge
Internal clock: φ/8, falling edge
Internal clock: φ/16, falling edge
Internal clock: φ/32, falling edge
Internal clock: φ/64, falling edge
Internal clock: φ/128, falling edge
Clock input disabled
External clock: rising edge
External clock: falling edge
External clock: rising and falling edges
TCRV1
Bit 1
CKS1
0
1
0
1
Bit 0
CKS0
0
1
0
1
0
1
0
1
Bit 0
ICKS0
—
0
1
0
1
0
1
—
—
—
—
Counter clear 1 and 0
00
1
0
1
Clearing is disabled
Cleared by compare match A
Cleared by compare match B
Cleared by rising edge of external reset input
1
Timer overflow interrupt enable
0 Interrupt request (OVI) from OVF disabled
Interrupt request (OVI) from OVF enabled
1
Compare match interrupt enable A
0 Interrupt request (CMIA) from CMFA disabled
Interrupt request (CMIA) from CMFA enabled
1
Compare match interrupt enable B
0 Interrupt request (CMIB) from CMFB disabled
Interrupt request (CMIB) from CMFB enabled
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 469 of 526
REJ09B0326-0600
TCSRV—Timer control/status register V H'FFB9 Timer V
Bit
Initial value
Read/Write
7
CMFB
0
R/(W)
6
CMFA
0
R/(W)
5
OVF
0
R/(W)
4
—
1
—
3
OS3
0
R/W
0
OS0
0
R/W
2
OS2
0
R/W
1
OS1
0
R/W
Output select
0 No change at compare match A
0 output at compare match A
1 output at compare match A
Output toggles at compare match A
1
0
1
0
1
Output select
0 No change at compare match B
0 output at compare match B
1 output at compare match B
Output toggles at compare match B
1
0
1
0
1
Timer overflow flag
0 [Clearing condition]
After reading OVF = 1, cleared by writing 0 to OVF
1 [Setting condition]
Set when TCNTV overflows from H'FF to H'00
Compare match flag A
0 [Clearing condition]
After reading CMFA = 1, cleared by writing 0 to CMFA
1 [Setting condition]
Set when the TCNTV value matches the TCORA value
Compare match flag B
0 [Clearing condition]
After reading CMFB = 1, cleared by writing 0 to CMFB
1 [Setting condition]
Set when the TCNTV value matches the TCORB value
Note: * Only a write of 0 for flag clearing is possible.
***
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 470 of 526
REJ09B0326-0600
TCORA—Time constant register A H'FFBA Timer V
Bit
Initial value
Read/Write
7
TCORA7
1
R/W
6
TCORA6
1
R/W
5
TCORA5
1
R/W
4
TCORA4
1
R/W
3
TCORA3
1
R/W
0
TCORA0
1
R/W
2
TCORA2
1
R/W
1
TCORA1
1
R/W
TCORB—Time constant register B H'FFBB Timer V
Bit
Initial value
Read/Write
7
TCORB7
1
R/W
6
TCORB6
1
R/W
5
TCORB5
1
R/W
4
TCORB4
1
R/W
3
TCORB3
1
R/W
0
TCORB0
1
R/W
2
TCORB2
1
R/W
1
TCORB1
1
R/W
TCNTV—Timer counter V H'FFBC Timer V
Bit
Initial value
Read/Write
7
TCNTV7
0
R/W
6
TCNTV6
0
R/W
5
TCNTV5
0
R/W
4
TCNTV4
0
R/W
3
TCNTV3
0
R/W
0
TCNTV0
0
R/W
2
TCNTV2
0
R/W
1
TCNTV1
0
R/W
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 471 of 526
REJ09B0326-0600
TCRV1—Timer control register V1 H'FFBD Timer V
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
1
—
4
TVEG1
0
R/W
3
TVEG0
0
R/W
0
ICKS0
0
R/W
2
TRGE
0
R/W
1
—
1
—
TRGV input enable
0 TCNTV counting is not triggered by input at the TRGV pin, and
does not stop when TCNTV is cleared by compare match
1TCNTV counting is triggered by input at the TRGV pin, and
stops when TCNTV is cleared by compare match
Internal clock select
Selects the TCNTV clock source, with bits
CKS2 to CKS0 in TCRV0
TRGV input edge select
0 TRGV trigger input is disabled
Rising edge is selected
Falling edge is selected
Rising and falling edges are both selected
1
0
1
0
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 472 of 526
REJ09B0326-0600
TCSRW—Timer control/status register W H'FFBE Watchdog timer
Bit
Initial value
Read/Write
7
B6WI
1
R
6
TCWE
0
R/(W)
5
B4WI
1
R
4
TCSRWE
0
R/(W)
3
B2WI
1
R
0
WRST
0
R/(W)
2
WDON
0
R/(W)
1
B0WI
1
R
****
Watchdog timer reset
0 [Clearing conditions]
1 [Setting condition]
When TCW overflows and a reset signal is generated
• Reset by RES pin
• When TCSRWE = 1, and 0 is written in both B0WI and WRST
Bit 0 write inhibit
0 Bit 0 is write-enabled
Bit 0 is write-protected
1
Watchdog timer on
0 Watchdog timer operation is disabled
Watchdog timer operation is enabled
1
Bit 2 write inhibit
0 Bit 2 is write-enabled
Bit 2 is write-protected
1
Timer control/status register W write enable
0 Data cannot be written to TCSRW bits 2 and 0
Data can be written to TCSRW bits 2 and 0
1
Bit 4 write inhibit
0 Bit 4 is write-enabled
Bit 4 is write-protected
1
Timer counter W write enable
0 Data cannot be written to TCW
Data can be written to TCW
1
Bit 6 write inhibit
0 Bit 6 is write-enabled
Bit 6 is write-protected
1
Note: * Write is permitted only under certain conditions.
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 473 of 526
REJ09B0326-0600
TCW—Timer counter W H'FFBF Watchdog timer
Bit
Initial value
Read/Write
7
TCW7
0
R/W
6
TCW6
0
R/W
5
TCW5
0
R/W
4
TCW4
0
R/W
3
TCW3
0
R/W
0
TCW0
0
R/W
2
TCW2
0
R/W
1
TCW1
0
R/W
Count value
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 474 of 526
REJ09B0326-0600
AMR—A/D mode register H'FFC4 A/D converter
Bit
Initial value
Read/Write
7
CKS
0
R/W
6
TRGE
0
R/W
4
—
1
—
3
CH3
0
R/W
0
CH0
0
R/W
2
CH2
0
R/W
1
CH1
0
R/W
Channel select
No channel selected
Bit 3
0
Bit 2 Analog Input ChannelCH3 CH2
0CH1 CH0
Bit 1 Bit 0
0AN
11
0
1
1
100
00 10 01 11
External trigger select
0 Disables start of A/D conversion by exter al trigger
1 Enables start of A/D conversion by rising or falling edge
of external trigger at pin ADTRG
5
—
1
—
4
AN5
AN6
AN7
Reserved
Reserved
Reserved
Reserved
**
100
1
10
1
AN0
AN1
AN2
AN3
Clock select
62/φ
Bit 7
0Conversion PeriodCKS
31/φ131 µs
φ = 2 MHz
15.5 µs 12.4 µs
φ = 5 MHz
—*
Conversion Time
Note: * Operation is not guaranteed if the conversion time is less than 12.4 µs.
Set bit 7 for a value of at least 12.4 µs.
* Don’t care
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 475 of 526
REJ09B0326-0600
ADRR—A/D result register H'FFC5 A/D converter
Bit
Initial value
Read/Write
7
ADR7
Undefined
R
6
ADR6
Undefined
R
5
ADR5
Undefined
R
4
ADR4
Undefined
R
3
ADR3
Undefined
R
0
ADR0
Undefined
R
2
ADR2
Undefined
R
1
ADR1
Undefined
R
A/D conversion result
ADSR—A/D start register H'FFC6 A/D converter
Bit
Initial value
Read/Write
7
ADSF
0
R/W
6
—
1
—
5
—
1
—
4
—
1
—
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
A/D status flag
0
1
Read
Write
Read
Write
Indicates completion of A/D conversion
Stops A/D conversion
Indicates A/D conversion in progress
Starts A/D conversion
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 476 of 526
REJ09B0326-0600
PWCR—PWM control register H'FFD0 14-bit PWM
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
—
1
—
0
PWCR0
0
W
2
—
1
—
1
—
1
—
Clock select
0 The input clock is φ/2 (tφ = 2/φ). The conversion period is 16,384/φ,
with a minimum modulation width of 1/φ.
1 The input clock is φ/4 (tφ = 4/φ). The conversion period is 32,768/φ,
with a minimum modulation width of 2/φ.
*
*
Note: * tφ: Period of PWM input clock
PWDRU—PWM data register U H'FFD1 14-bit PWM
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
0
W
4
0
W
3
0
W
0
0
W
2
0
W
1
0
W
Upper 6 bits of data for generating PWM waveform
PWDRU5PWDRU4PWDRU3 PWDRU0PWDRU2PWDRU1
PWDRL—PWM data register L H'FFD2 14-bit PWM
Bit
Initial value
Read/Write
7
0
W
6
0
W
5
0
W
4
0
W
3
0
W
0
0
W
2
0
W
1
0
W
Lower 8 bits of data for generating PWM waveform
PWDRL5
PWDRL4 PWDRL3 PWDRL0PWDRL2 PWDRL1
PWDRL6PWDRL7
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 477 of 526
REJ09B0326-0600
PDR1—Port data register 1 H'FFD4 I/O ports
Bit
Initial value
Read/Write
7
P1
0
R/W
6
P1
0
R/W
5
P1
0
R/W
4
P1
0
R/W
3
—
0
—
0
P1
0
R/W
2
—
0
—
1
—
0
—
7654 0
PDR2—Port data register 2 H'FFD5 I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
P2
0
R/W
2
P2
0
R/W
1
P2
0
R/W
021
PDR3—Port data register 3 H'FFD6 I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
P3
0
R/W
2
P3
0
R/W
1
P3
0
R/W
021
PDR5—Port data register 5 H'FFD8 I/O ports
Bit
Initial value
Read/Write
7
P5
0
R/W
6
P5
0
R/W
5
P5
0
R/W
4
P5
0
R/W
3
P5
0
R/W
0
P5
0
R/W
2
P5
0
R/W
1
P5
0
R/W
30214567
PDR6—Port data register 6 H'FFD9 I/O ports
Bit
Initial value
Read/Write
7
P6
0
R/W
6
P6
0
R/W
5
P6
0
R/W
4
P6
0
R/W
3
P6
0
R/W
0
P6
0
R/W
2
P6
0
R/W
1
P6
0
R/W
30214567
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 478 of 526
REJ09B0326-0600
PDR7—Port data register 7 H'FFDA I/O ports
Bit
Initial value
Read/Write
7
P7
0
R/W
6
P7
0
R/W
5
P7
0
R/W
4
P7
0
R/W
3
P7
0
R/W
0
—
0
—
2
—
0
—
1
—
0
—
34567
PDR8—Port data register 8 H'FFDB I/O ports
Bit
Initial value
Read/Write
7
P8
0
R/W
6
P8
0
R/W
5
P8
0
R/W
4
P8
0
R/W
3
P8
0
R/W
0
P8
0
R/W
2
P8
0
R/W
1
P8
0
R/W
30214567
PDR9—Port data register 9 H'FFDC I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
5
—
0
—
4
P94
0
R/W
3
P9
0
R/W
0
P90
0
R/W
2
P92
0
R/W
1
P91
0
R/W
3
PDRB—Port data register B H'FFDD I/O ports
Bit
Read/Write
7
PB
R
6
PB
R
5
PB
R
4
PB
R
3
PB
R
0
PB
R
2
PB
R
1
PB
R
30214567
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 479 of 526
REJ09B0326-0600
PCR1—Port control register 1 H'FFE4 I/O ports
Bit
Initial value
Read/Write
7
PCR1
0
W
6
PCR1
0
W
5
PCR1
0
W
4
PCR1
0
W
3
—
0
—
0
PCR1
0
W
2
—
0
—
1
—
0
—
Port 1 input/output select
0 Input pin
1 Output pin
7654 0
PCR2—Port control register 2 H'FFE5 I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
PCR2
0
W
2
PCR2
0
W
1
PCR2
0
W
Port 2 input/output select
0 Input pin
1 Output pin
021
PCR3—Port control register 3 H'FFE6 I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
PCR3
0
W
2
PCR3
0
W
1
PCR3
0
W
Port 3 input/output select
0 Input pin
1 Output pin
021
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 480 of 526
REJ09B0326-0600
PCR5—Port control register 5 H'FFE8 I/O ports
Bit
Initial value
Read/Write
7
PCR5
0
W
6
PCR5
0
W
5
PCR5
0
W
4
PCR5
0
W
3
PCR5
0
W
0
PCR5
0
W
2
PCR5
0
W
1
PCR5
0
W
Port 5 input/output select
0 Input pin
1 Output pin
76543 021
PCR6—Port control register 6 H'FFE9 I/O ports
Bit
Initial value
Read/Write
7
PCR6
0
W
6
PCR6
0
W
5
PCR6
0
W
4
PCR6
0
W
3
PCR6
0
W
0
PCR6
0
W
2
PCR6
0
W
1
PCR6
0
W
Port 6 input/output select
0 Input pin
1 Output pin
76543 021
PCR7—Port control register 7 H'FFEA I/O ports
Bit
Initial value
Read/Write
7
PCR7
0
W
6
PCR7
0
W
5
PCR7
0
W
4
PCR7
0
W
3
PCR7
0
W
0
—
0
—
2
—
0
—
1
—
0
—
Port 7 input/output select
0 Input pin
1 Output pin
76543
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 481 of 526
REJ09B0326-0600
PCR8—Port control register 8 H'FFEB I/O ports
Bit
Initial value
Read/Write
7
PCR8
0
W
6
PCR8
0
W
5
PCR8
0
W
4
PCR8
0
W
3
PCR8
0
W
0
PCR8
0
W
2
PCR8
0
W
1
PCR8
0
W
Port 8 input/output select
0 Input pin
1 Output pin
76543 021
PCR9—Port control register 9 H'FFEC I/O ports
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
0
—
4
PCR9
0
W
3
PCR9
0
W
0
PCR9
0
W
2
PCR9
0
W
1
PCR9
0
W
Port 9 input/output select
0 Input pin
1 Output pin
02341
PUCR1—Port pull-up control register 1 H'FFED I/O ports
Bit
Initial value
Read/Write
7
PUCR1
0
R/W
6
PUCR1
0
R/W
5
PUCR1
0
R/W
4
PUCR1
0
R/W
3
—
0
—
0
PUCR1
0
R/W
2
—
0
—
1
—
0
—
04567
PUCR3—Port pull-up control register 3 H'FFEE I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
PUCR3
0
R/W
2
PUCR3
0
R/W
1
PUCR3
0
R/W
021
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 482 of 526
REJ09B0326-0600
PUCR5—Port pull-up control register 5 H'FFEF I/O ports
Bit
Initial value
Read/Write
7
PUCR5
0
R/W
6
PUCR5
0
R/W
5
PUCR5
0
R/W
4
PUCR5
0
R/W
3
PUCR5
0
R/W
0
PUCR5
0
R/W
2
PUCR5
0
R/W
1
PUCR5
0
R/W
30214567
SYSCR1—System control register 1 H'FFF0 System control
Bit
Initial value
Read/Write
7
SSBY
0
R/W
6
STS2
0
R/W
5
STS1
0
R/W
3
LSON
0
R/W
0
MA0
1
R/W
2
—
1
—
1
MA1
1
R/W
4
STS0
0
R/W
Software standby
0 • When a SLEEP instruction is executed in active mode, a transition is
made to sleep mode
1
Standby timer select 2 to 0
0 Wait time = 8,192 states
Wait time = 16,384 states
00
1Wait time = 32,768 states
Wait time = 65,536 states
10
1
Active (medium-speed)
mode clock select
φ /16
φ /32
0
1
0
0
1
1φ /64
φ /128
1*Wait time = 131,072 states
Low speed on flag
0 The CPU operates on the system clock (φ)
1 The CPU operates on the subclock (φ )
SUB
*
• When a SLEEP instruction is executed in subactive mode, a transition
is made to subsleep mode
• When a SLEEP instruction is executed in active mode, a transition is
made to standby mode or watch mode
• When a SLEEP instruction is executed in subactive mode, a transition
is made to watch mode
Don’t care
*
osc
osc
osc
osc
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 483 of 526
REJ09B0326-0600
SYSCR2—System control register 2 H'FFF1 System control
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
1
—
3
DTON
0
R/W
0
SA0
0
R/W
2
MSON
0
R/W
1
SA1
0
R/W
4
NESEL
0
R/W
Subactive mode clock select
0φ /8
φ /4
0
1
1φ /2
*
W
W
W
Direct transfer on flag
0 • When a SLEEP instruction is executed in active mode, a transition is
made to standby mode, watch mode, or sleep mode
1
• When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode or subsleep mode
• When a SLEEP instruction is executed in active (high-speed) mode, a direct
transition is made to active (medium-speed) mode if SSBY = 0, MSON = 1, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
• When a SLEEP instruction is executed in active (medium-speed) mode, a direct
transition is made to active (high-speed) mode if SSBY = 0, MSON = 0, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
• When a SLEEP instruction is executed in subactive mode, a direct
transition is made to active (high-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0,
and MSON = 0, or to active (medium-speed) mode if SSBY = 1, TMA3 = 1,
LSON = 0, and MSON = 1
Medium speed on flag
0 • Operates in active (high-speed) mode after exit from standby, watch, or sleep
mode
• Operates in sleep (high-speed) mode if a SLEEP instruction is executed in
active mode
1 • Operates in active (medium-speed) mode after exit from standby, watch,
or sleep mode
• Operates in sleep (medium-speed) mode if a SLEEP instruction is executed
in active mode
Noise elimination sampling frequency select
0 Sampling rate is φ /16
1 Sampling rate is φ /4
OSC
OSC
Don’t care*
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 484 of 526
REJ09B0326-0600
IEGR1—Interrupt edge select register 1 H'FFF2 System control
Bit
Initial value
Read/Write
7
—
0
—
6
—
1
—
4
—
1
—
3
IEG3
0
R/W
0
IEG0
0
R/W
2
IEG2
0
R/W
1
IEG1
0
R/W
5
—
1
—
IRQ0 edge select
0 Falling edge of IRQ0 pin input is detected
Rising edge of IRQ0 pin input is detected
1
IRQ1 edge select
0 Falling edge of IRQ1 pin input is detected
Rising edge of IRQ1 pin input is detected
1
IRQ2 edge select
0 Falling edge of IRQ2 pin input is detected
Rising edge of IRQ2 pin input is detected
1
IRQ3 edge select
0 Falling edge of IRQ3 pin input is detected
Rising edge of IRQ3 pin input is detected
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 485 of 526
REJ09B0326-0600
IEGR2—Interrupt edge select register 2 H'FFF3 System control
Bit
Initial value
Read/Write
7
INTEG7
0
R/W
6
INTEG6
0
R/W
4
INTEG4
0
R/W
3
INTEG3
0
R/W
0
INTEG0
0
R/W
2
INTEG2
0
R/W
1
INTEG1
0
R/W
5
INTEG5
0
R/W
INT
4
to INT
0
edge select
0 Falling edge of INT
n
pin input is detected
Rising edge of INT
n
pin input is detected
1
INT
6
edge select
0 Falling edge of INT
6
and TMIB pin input is detected
Rising edge of INT
6
and TMIB pin input is detected
1
INT
5
edge select
0 Falling edge of INT
5
and ADTRG pin input is detected
Rising edge of INT
5
and ADTRG pin input is detected
1
INT
7
edge select
0 Falling edge of INT
7
pin input is detected
Rising edge of INT
7
pin input is detected
1
(n = 4 to 0)
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 486 of 526
REJ09B0326-0600
IENR1—Interrupt enable register 1 H'FFF4 System control
Bit
Initial value
Read/Write
7
IENTB1
0
R/W
6
IENTA
0
R/W
4
—
1
—
3
IEN3
0
R/W
0
IEN0
0
R/W
2
IEN2
0
R/W
1
IEN1
0
R/W
5
—
0
—
IRQ
3
to IRQ
0
interrupt enable
0 Disables IRQ3 to IRQ
0
interrupt requests
Enables IRQ3 to IRQ
0
interrupt requests
1
Timer A interrupt enable
0 Disables timer A interrupt requests
Enables timer A interrupt requests
1
Timer B1 interrupt enable
0 Disables timer B1 interrupt requests
Enables timer B1 interrupt requests
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 487 of 526
REJ09B0326-0600
IENR2—Interrupt enable register 2 H'FFF5 System control
Bit
Initial value
Read/Write
7
IENDT
0
R/W
6
IENAD
0
R/W
4
IENS1
0
R/W
3
—
0
—
0
—
0
—
2
—
0
—
1
—
0
—
5
—
0
—
SCI1 interrupt enable
0 Disables SCI1 interrupt requests
Enables SCI1 interrupt requests
1
A/D converter interrupt enable
0 Disables A/D converter interrupt requests
Enables A/D converter interrupt requests
1
Direct transfer interrupt enable
0 Disables direct transfer interrupt requests
Enables direct transfer interrupt requests
1
IENR3—Interrupt enable register 3 H'FFF6 System control
Bit
Initial value
Read/Write
7
INTEN7
0
R/W
6
INTEN6
0
R/W
5
INTEN5
0
R/W
4
INTEN4
0
R/W
3
INTEN3
0
R/W
0
INTEN0
0
R/W
2
INTEN2
0
R/W
1
INTEN1
0
R/W
INT
7
to INT
0
interrupt enable
0 Disables INT
7
to INT
0
interrupt requests
Enables INT
7
to INT
0
interrupt requests
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 488 of 526
REJ09B0326-0600
IRR1—Interrupt request register 1 H'FFF7 System control
Bit
Initial value
Read/Write
7
IRRTB1
0
R/W
6
IRRTA
0
R/W
4
—
1
—
3
IRRI3
0
R/W
0
IRRI0
0
R/W
2
IRRI2
0
R/W
1
IRRI1
0
R/W
5
—
0
—
** ****
IRQ
3
to IRQ
0
interrupt request flag
0 [Clearing condition]
1 [Setting condition]
When IRRIn = 1, it is cleared by writing 0
When pin IRQn is set for interrupt input and the designated signal
edge is input
Timer A interrupt request flag
0 [Clearing condition]
1 [Setting condition]
When IRRTA = 1, it is cleared by writing 0
When timer counter A overflows from H'FF to H'00
Timer B1 interrupt request flag
0 [Clearing condition]
1 [Setting condition]
When IRRTB1 = 1, it is cleared by writing 0
When timer counter B1 overflows from H'FF to H'00
Note: * Only a write of 0 for flag clearing is possible.
(n = 3 to 0)
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 489 of 526
REJ09B0326-0600
IRR2—Interrupt request register 2 H'FFF8 System control
Bit
Initial value
Read/Write
7
IRRDT
0
R/W
6
IRRAD
0
R/W
5
—
0
—
4
IRRS1
0
R/W
3
—
0
—
0
—
0
—
2
—
0
—
1
—
0
—
** *
0 [Clearing condition]
When IRRS1 = 1, it is cleared by writing 0
SCI1 interrupt request flag
1 [Setting condition]
When an SCI1 transfer is completed
0 [Clearing condition]
When IRRAD = 1, it is cleared by writing 0
A/D converter interrupt request flag
1 [Setting condition]
When A/D conversion is completed and ADSF is cleared to 0 in ADSR
0 [Clearing condition]
When IRRDT = 1, it is cleared by writing 0
Direct transfer interrupt request flag
1 [Setting condition]
A SLEEP instruction is executed when DTON = 1 and a direct transfer is made
Note: * Only a write of 0 for flag clearing is possible.
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 490 of 526
REJ09B0326-0600
IRR3—Interrupt request register 3 H'FFF9 System control
Bit
Initial value
Read/Write
7
INTF7
0
R/W
6
INTF6
0
R/W
5
INTF5
0
R/W
4
INTF4
0
R/W
3
INTF3
0
R/W
0
INTF0
0
R/W
2
INTF2
0
R/W
1
INTF1
0
R/W
INT
7
to INT
0
interrupt request flag
0 [Clearing condition]
When INTF
n
= 1, it is cleared by writing 0
1 [Setting condition]
When the designated signal edge is input at pin INT
n
Note: * Only a write of 0 for flag clearing is possible.
*** ****
(n = 7 to 0)
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 491 of 526
REJ09B0326-0600
PMR1—Port mode register 1 H'FFFC I/O ports
Bit
Initial value
Read/Write
7
IRQ3
0
R/W
6
IRQ2
0
R/W
4
PWM
0
R/W
3
—
0
—
0
TMOW
0
R/W
2
—
1
—
1
—
0
—
5
IRQ1
0
R/W
P1
0
/TMOW pin function switch
0 Functions as P1
0
I/O pin
Functions as TMOW output pin
1
P1
4
/PWM pin function switch
0 Functions as P1
4
I/O pin
Functions as PWM output pin
1
P1
5
/IRQ
1
pin function switch
0 Functions as P1
5
I/O pin
Functions as IRQ
1
input pin
1
P1
6
/IRQ
2
pin function switch
0 Functions as P1
6
I/O pin
Functions as IRQ
2
input pin
1
P1
7
/IRQ
3
pin function switch
0 Functions as P1
7
I/O pin
Functions as IRQ
3
/TRGV input pin
1
Appendix B Internal I/O Registers
Rev. 6.00 Sep 12, 2006 page 492 of 526
REJ09B0326-0600
PMR3—Port mode register 3 H'FFFD I/O ports
Bit
Initial value
Read/Write
7
—
0
—
6
—
0
—
4
—
0
—
3
—
0
—
0
SCK1
0
R/W
2
SO1
0
R/W
1
SI1
0
R/W
5
—
0
—
P30/SCK1 pin function switch
0 Functions as P30 I/O pin
Functions as SCK1 I/O pin
1
P32/SO1 pin function switch
0 Functions as P32 I/O pin
Functions as SO1 output pin
1
P31/SI1 pin function switch
0 Functions as P31 I/O pin
Functions as SI1 input pin
1
PMR7—Port mode register 7 H'FFFF I/O ports
Bit
Initial value
Read/Write
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
—
1
—
0
POF1
0
R/W
2
TXD
0
R/W
1
—
0
—
P32/SO1 pin PMOS control
0 CMOS output
NMOS open-drain output
1
P22/TXD pin function switch (TXD)
0 Functions as P22 I/O pin
Functions as TXD output pin
1
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 493 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
C.1 Block Diagrams of Port 1
V
CC
V
CC
V
SS
PUCR1
n
PMR1
n
PDR1
n
PCR1
n
IRQ
n–4
RES
SBY
(low level
during reset
and in standby
mode)
Internal
data bus
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Note: n = 7 or 6
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
P1
n
Figure C.1 (a) Port 1 Block Diagram (Pins P17 and P16)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 494 of 526
REJ09B0326-0600
V
CC
V
CC
V
SS
PUCR1
5
PMR1
5
PDR1
5
PCR1
5
IRQ
1
RES
SBY
(low level during
reset and in
standby mode)
Internal
data bus
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
P1
5
Figure C.1 (b) Port 1 Block Diagram (Pin P15)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 495 of 526
REJ09B0326-0600
V
CC
V
CC
V
SS
PUCR1
4
PMR1
4
PDR1
4
PCR1
4
RES
SBY
(low level during
reset and in
standby mode)
Internal
data bus
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
PWM
PWM
module
P1
4
Figure C.1 (c) Port 1 Block Diagram (Pin P14)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 496 of 526
REJ09B0326-0600
VCC
VCC
VSS
PUCR10
PMR10
PDR10
PCR10
RES
SBY
Internal
data bus
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
TMOW
Timer A
module
P10
(low level during
reset and in
standby mode)
Figure C.1 (d) Port 1 Block Diagram (Pin P10)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 497 of 526
REJ09B0326-0600
C.2 Block Diagrams of Port 2
V
CC
V
SS
PMR7
2
PCR2
2
PDR2
2
SBY
Internal
data bus
Legend:
PDR2:
PCR2:
PMR7:
Port data register 2
Port control register 2
Port mode register 7
TXD
SCI3
module
P2
2
Figure C.2 (a) Port 2 Block Diagram (Pin P22)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 498 of 526
REJ09B0326-0600
VCC
VSS PCR21
PDR21
SBY
Internal
data bus
Legend:
PDR2:
PCR2: Port data register 2
Port control register 2
RE
RXD
SCI3
module
P21
Figure C.2 (b) Port 2 Block Diagram (Pin P21)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 499 of 526
REJ09B0326-0600
V
CC
V
SS
PCR2
0
PDR2
0
SBY
Internal
data bus
Legend:
PDR2:
PCR2: Port data register 2
Port control register 2
SCKIE
SCKOE
SCKO
SCKI
SCI3
module
P2
0
Figure C.2 (c) Port 2 Block Diagram (Pin P20)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 500 of 526
REJ09B0326-0600
C.3 Block Diagrams of Port 3
V
CC
V
CC
V
SS
PUCR3
2
PMR3
2
PDR3
2
PCR3
2
RES
SBY
(low level during
reset and in
standby mode)
Internal
data bus
Legend:
PDR3:
PCR3:
PMR3:
PMR7:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port mode register 7
Port pull-up control register 3
SO1
SCI1
module
P3
2
PMR7
0
Figure C.3 (a) Port 3 Block Diagram (Pin P32)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 501 of 526
REJ09B0326-0600
VCC
VCC
VSS
PUCR31
PDR31
PCR31
SI1
RES
SBY
Internal
data bus
Legend:
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
P31
(low level
during reset
and in standby
mode)
SCI1
module
PMR31
Figure C.3 (b) Port 3 Block Diagram (Pin P31)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 502 of 526
REJ09B0326-0600
VCC
VCC
VSS
PUCR30
PMR30
PDR30
PCR30
RES
SBY
Legend:
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
SCI1
module
P30
(low level during
reset and in
standby mode)
CKS3
SCK1
Internal data bus
SCK0
Figure C.3 (c) Port 3 Block Diagram (Pin P30)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 503 of 526
REJ09B0326-0600
C.4 Block Diagrams of Port 5
V
CC
V
CC
V
SS
INT
n
RES
SBY
Internal data bus
Legend:
PDR5:
PCR5:
PUCR5:
Note: n = 7, 4 to 0
Port data register 5
Port control register 5
Port pull-up control register 5
P5
n
(low level
during reset
and in standby
mode)
INT
module
PUCR5
n
PDR5
n
PCR5
n
Figure C.4 (a) Port 5 Block Diagram (Pins P57 and P54 to P50)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 504 of 526
REJ09B0326-0600
V
CC
V
CC
V
SS
INT
6
SBY
Internal data bus
Legend:
PDR5:
PCR5:
PUCR5:
Port data register 5
Port control register 5
Port pull-up control register 5
P5
6
(low level
during reset
and in standby
mode)
INT
module
PUCR5
6
PDR5
6
PCR5
6
TMIB
Timer B1
module
Figure C.4 (b) Port 5 Block Diagram (Pin P56)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 505 of 526
REJ09B0326-0600
V
CC
V
CC
V
SS
INT
5
RES
SBY
Internal data bus
Legend:
PDR5:
PCR5:
PUCR5:
Port data register 5
Port control register 5
Port pull-up control register 5
P5
5
(low level
during reset
and in standby
mode)
INT
module
PUCR5
5
PDR5
5
PCR5
5
ADTRG
A/D
module
Figure C.4 (c) Port 5 Block Diagram (Pin P55)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 506 of 526
REJ09B0326-0600
C.5 Block Diagram of Port 6
VCC
VSS PCR6n
PDR6n
SBY
Internal
data bus
Legend:
PDR6:
PCR6:
Note: n = 7 to 0
Port data register 6
Port control register 6
P6n
(low level during reset
and in standby mode)
Figure C.5 Port 6 Block Diagram (Pins P67 to P60)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 507 of 526
REJ09B0326-0600
C.6 Block Diagrams of Port 7
VCC
VSS
SBY
Internal
data bus
Legend:
PDR7:
PCR7:
Note: n = 7 or 3
Port data register 7
Port control register 7
P7n
(low level during reset
and in standby mode)
PDR7n
PCR7n
Figure C.6 (a) Port 7 Block Diagram (Pins P77 and P73)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 508 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR7:
PCR7: Port data register 7
Port control register 7
P76
(low level during reset
and in standby mode)
PDR76
PCR76
0S3
to
0S0
TMOV
Timer V
module
Figure C.6 (b) Port 7 Block Diagram (Pin P76)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 509 of 526
REJ09B0326-0600
V
CC
V
SS
SBY
Internal
data bus
Legend:
PDR7:
PCR7: Port data register 7
Port control register 7
P7
5
(low level during reset
and in standby mode)
PDR7
5
PCR7
5
TMCIV
Timer V
module
Figure C.6 (c) Port 7 Block Diagram (Pin P75)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 510 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR7:
PCR7: Port data register 7
Port control register 7
P74
(low level during reset
and in standby mode)
PDR74
PCR74
TMRIV
Timer V
module
Figure C.6 (d) Port 7 Block Diagram (Pin P74)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 511 of 526
REJ09B0326-0600
C.7 Block Diagrams of Port 8
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P87
(low level during reset
and in standby mode)
PDR87
PCR87
Figure C.7 (a) Port 8 Block Diagram (Pin P87)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 512 of 526
REJ09B0326-0600
V
CC
V
SS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P8
6
(low level during reset
and in standby mode)
PDR8
6
PCR8
6
FTID
Timer X
module
Figure C.7 (b) Port 8 Block Diagram (Pin P86)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 513 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P85
(low level during reset
and in standby mode)
PDR85
PCR85
FTIC
Timer X
module
Figure C.7 (c) Port 8 Block Diagram (Pin P85)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 514 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P84
(low level during reset
and in standby mode)
PDR84
PCR84
FTIB
Timer X
module
Figure C.7 (d) Port 8 Block Diagram (Pin P84)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 515 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P83
(low level during reset
and in standby mode)
PDR83
PCR83
FTIA
Timer X
module
Figure C.7 (e) Port 8 Block Diagram (Pin P83)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 516 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P82
(low level during reset
and in standby mode)
PDR82
PCR82
OEB
FTOB
Timer X
module
Figure C.7 (f) Port 8 Block Diagram (Pin P82)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 517 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P81
(low level during reset
and in standby mode)
PDR81
PCR81
OEA
FTOA
Timer X
module
Figure C.7 (g) Port 8 Block Diagram (Pin P81)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 518 of 526
REJ09B0326-0600
VCC
VSS
SBY
Internal
data bus
Legend:
PDR8:
PCR8: Port data register 8
Port control register 8
P80
(low level during reset
and in standby mode)
PDR80
PCR80
FTCI
Timer X
module
P80
Figure C.7 (h) Port 8 Block Diagram (Pin P80)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 519 of 526
REJ09B0326-0600
C.8 Block Diagram of Port 9
PDR9
n
PCR9
n
SBY
Internal
data bus
Legend:
PDR9:
PCR9:
Note: n = 4 to 0
Port data register 9
Port control register 9
P9
n
(low level during reset
and in standby mode)
V
CC
V
SS
Figure C.8 Port 9 Block Diagram (Pins P94 to P90)
Appendix C I/O Port Block Diagrams
Rev. 6.00 Sep 12, 2006 page 520 of 526
REJ09B0326-0600
C.9 Block Diagram of Port B
PB
n
Internal
data bus
AMR3 to AMR0
A/D module
V
IN
Note: n = 7 to 0
DEC
Figure C.9 Port B Block Diagram (Pins PB7 to PB0)
Appendix D Port States in the Different Processing States
Rev. 6.00 Sep 12, 2006 page 521 of 526
REJ09B0326-0600
Appendix D Port States in the Different Processing States
Table D.1 Port States Overview
Port Reset Sleep Subsleep Standby Watch Subactive Active
P17 to P14,
P10
High
impedance
Retained Retained High
impedance*
Retained Functions Functions
P22 to P20 High
impedance
Retained Retained High
impedance
Retained Functions Functions
P32 to P30 High
impedance
Retained Retained High
impedance*
Retained Functions Functions
P57 to P50 High
impedance
Retained Retained High
impedance*
Retained Functions Functions
P67 to P60 High
impedance
Retained Retained High
impedance
Retained Functions Functions
P77 to P73 High
impedance
Retained Retained High
impedance
Retained Functions Functions
P87 to P80 High
impedance
Retained Retained High
impedance
Retained Functions Functions
P94 to P90 High
impedance
Retained Retained High
impedance
Retained Functions Functions
PB7 to PB0 High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
Note: * High level output when MOS pull-up is in on state.
Appendix E Product Code Lineup
Rev. 6.00 Sep 12, 2006 page 522 of 526
REJ09B0326-0600
Appendix E Product Code Lineup
Table E.1 Product Lineup
Product Type
Product Code
Mark Code
Package
(Package Code)
H8/3644 ZTATTM
version
Standard
products
HD6473644H
HD6473644RH
HD6473644H 64-pin QFP (FP-64A)
HD6473644P
HD6473644RP
HD6473644P 64-pin SDIP (DP-64S)
HD6473644W
HD6473644RW
HD6473644W 80-pin TQFP (TFP-80C)
FLASH HD64F3644H HD64F3644H 64-pin QFP (FP-64A)
HD64F3644P HD64F3644P 64-pin SDIP (DP-64S)
HD64F3644W HD64F3644W 80-pin TQFP (TFP-80C)
Mask ROM
version
HD6433644H
HD6433644RH
HD6433644(***)H 64-pin QFP (FP-64A)
HD6433644P
HD6433644RP
HD6433644(***)P 64-pin SDIP (DP-64S)
HD6433644W
HD6433644RW
HD6433644(***)W 80-pin TQFP (TFP-80C)
H8/3643 FLASH Standard HD64F3643H HD64F3643H 64-pin QFP (FP-64A)
products HD64F3643P HD64F3643P 64-pin SDIP (DP-64S)
HD64F3643W HD64F3643W 80-pin TQFP (TFP-80C)
Mask ROM
version
HD6433643H
HD6433643RH
HD6433643(***)H 64-pin QFP (FP-64A)
HD6433643P
HD6433643RP
HD6433643(***)P 64-pin SDIP (DP-64S)
HD6433643W
HD6433643RW
HD6433643(***)W 80-pin TQFP (TFP-80C)
Appendix E Product Code Lineup
Rev. 6.00 Sep 12, 2006 page 523 of 526
REJ09B0326-0600
Product Type
Product Code
Mark Code
Package
(Package Code)
H8/3642 FLASH Standard HD64F3642AH HD64F3642AH 64-pin QFP (FP-64A)
products HD64F3642AP HD64F3642AP 64-pin SDIP (DP-64S)
HD64F3642AW HD64F3642AW 80-pin TQFP (TFP-80C)
Mask ROM
version
HD6433642H
HD6433642RH
HD6433642(***)H 64-pin QFP (FP-64A)
HD6433642P
HD6433642RP
HD6433642(***)P 64-pin SDIP (DP-64S)
HD6433642W
HD6433642RW
HD6433642(***)W 80-pin TQFP (TFP-80C)
H8/3641 Mask ROM
version
Standard
products
HD6433641H
HD6433641RH
HD6433641(***)H 64-pin QFP (FP-64A)
HD6433641P
HD6433641RP
HD6433641(***)P 64-pin SDIP (DP-64S)
HD6433641W
HD6433641RW
HD6433641(***)W 80-pin TQFP (TFP-80C)
H8/3640 Mask ROM
version
Standard
products
HD6433640H
HD6433640RH
HD6433640(***)H 64-pin QFP (FP-64A)
HD6433640P
HD6433640RP
HD6433640(***)P 64-pin SDIP (DP-64S)
HD6433640W
HD6433640RW
HD6433640(***)W 80-pin TQFP (TFP-80C)
Note: For mask ROM versions, (***) is the ROM code.
Appendix F Package Dimensions
Rev. 6.00 Sep 12, 2006 page 524 of 526
REJ09B0326-0600
Appendix F Package Dimensions
The package dimension that is shown in the Package Data Book has priority.
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
*1
*2
*3p
E
D
E
D
xMy
F
64
1
17
16
49
48
32
33
Z
Z
D
H
E
H
b
2
1
1
Detail F
c
AA
L
A
L
Terminal cross section
p
1
1
c
b
c
b
0.8
1.0
1.0
0.15
0.10
8˚0˚
0.250.10
0.15
0.35
0.00 0.450.370.29
0.220.170.12
3.05
16.9 17.2 17.5
D
L
1
Z
E
Z
D
y
x
c
b
1
b
p
A
H
D
A
2
E
A
1
c
1
e
e
L
H
E
1.10.80.5
MaxNomMin
Dimension in Millimeters
Symbol
Reference
14
2.70 17.517.216.9
1.6
14
θ
θ
P-QFP64-14x14-0.80 1.2g
MASS[Typ.]
FP-64A/FP-64AVPRQP0064GB-A
RENESAS CodeJEITA Package Code Previous Code
Figure F.1 FP-64A Package Dimensions
Appendix F Package Dimensions
Rev. 6.00 Sep 12, 2006 page 525 of 526
REJ09B0326-0600
1
p
1
3
132
64 33
ce
Z
A
b
b
E
D
e
L A
θ
2.54 1.46
0.480.38
18.6
58.5
15˚0˚2.031.781.53
0.360.250.20 1.0 0.58
0.51
e
1
L
e
θ
c
b
p
A
E
D
b
3
Z
A
1
5.08
17.0
57.6
Reference
Symbol
Dimension in Millimeters
Min Nom Max
19.05
P-SDIP64-17x57.6-1.78 8.8g
MASS[Typ.]
DP-64S/DP-64SVPRDP0064BB-A
RENESAS CodeJEITA Package Code Previous Code
Figure F.2 DP-64S Package Dimensions
Appendix F Package Dimensions
Rev. 6.00 Sep 12, 2006 page 526 of 526
REJ09B0326-0600
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
12
0.60.50.4
MaxNom
Min
Dimension in Millimeters
Symbol
Reference
12
1.00 14.214.013.8
1.0
H
1
L
e
e
c
1
A
1
E
A
2
H
D
A
b
p
b
1
c
x
y
Z
D
Z
E
L
1
D
13.8 14.0 14.2
1.20
0.00 0.10 0.20
0.17 0.22 0.27
0.20
0.12 0.17 0.22
0.15
0˚8˚
0.5 0.10
0.10
1.25
1.25
Index mark
*1
*2
*3
y
F
80
1
Mx
20
21
61
60 41
40
D
E
D
E
p
b
H
E
H
D
Z
Z
Detail F
1
12
c
L
A
A A
L
1
1
p
Terminal cross section
b
c
c
b
θ
θ
P-TQFP80-12x12-0.50 0.4g
MASS[Typ.]
TFP-80C/TFP-80CVPTQP0080KC-A
RENESAS CodeJEITA Package Code Previous Code
Figure F.3 TFP-80C Package Dimensions
Note: In case of inconsistencies arising within figures, dimensional drawings listed in the
Package Data Book take precedence and are considered correct.
Renesas 8-Bit Single-Chip Microcomputer
Hardware Manual
H8/3644 Group, H8/3644R Group,
H8/3644 F-ZTAT™, H8/3643 F-ZTAT™, H8/3642A F-ZTAT™
Publication Date: 1st Edition, September 1999
Rev.6.00, September 12, 2006
Published by: Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by: Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
©2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
Colophon 6.0
1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8668 Japan
H8/3644 Group, H8/3644R Group
H8/3644 F-ZTATTM, H8/3643 F-ZTATTM,
H8/3642A F-ZTATTM
REJ09B0326-0600
User’s Manual
