®
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Table 1: Main Product Characteristics
IF(AV) 1 A
VRRM 200 V
Tj (max) 150°C
VF(max) 0.74 V
trr (max) 35 ns
STPR120A
HIGH EFFICIENCY FAST RECOVERY DIODE
REV. 4
Table 3: Absolute Ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 200 V
IF(RMS) RMS forward current 8 A
IF(AV) Average forward current TL = 125°C δ = 0.5 1A
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 30 A
Tstg Storage temperature range -65 to + 150 °C
TjMaximum operating junction temperature 150 °C
SMA
(JEDEC DO-214AC)
STPR120A
August 2004
FEATURES AND BENEFITS
■Very low switching losses
■Low forward voltage drop
■Fast rectifier Epitaxial diode
■Surface mount package
DESCRIPTION
Single chip rectifier suited to Switched Mode
Power Supplies and high frequency DC/DC
converters.
Packaged in SMA, this surface mount device is
intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection
applications.
Table 2: Order Code
Part Number Marking
STPR120A R12
Obsolete Product(s) - Obsolete Product(s)
Obsolete Product(s) - Obsolete Product(s)
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Table 4: Thermal Resistance
Table 5: Static Electrical Characteristics
Pulse test: * tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.62 x IF(AV) + 0.12 IF2(RMS)
Table 6: Recovery Characteristics
Symbol Parameter Value Unit
Rth(j-l) Junction to lead 30 °C/W
Symbol Parameter Tests conditions Min. Typ Max. Unit
IR * Reverse leakage current Tj = 25°C VR = VRRM
3µA
Tj = 125°C 180 400
VF ** Forward voltage drop Tj = 25°C IF = 1A 0.94 V
Tj = 150°C IF = 1A 0.69 0.74
Symbol Parameter Test conditions Min. Typ Max. Unit
trr Reverse recovery
time Tj = 25°C
IF = 0.5A Irr = 0.25A IR =1A 25
ns
IF = 1A dIF/dt = 50 A/µs
VR = VRRM
25 35
tfr Forward recovery
time Tj = 25°C
IF = 1A dIF/dt = 100 A/µs
Measured at 1V 25 ns
VFP Forward recovery
voltage IF = 1A dIF/dt = 100 A/µs 5V
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Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Peak current versus form factor
Figure 3: Average forward current versus
ambient temperature (δ = 0.5)
Figure 4: Non repetitive surge peak forward
current versus overload duration
Figure 5: Variation of thermal impedance
junction to ambient versus pulse duration
(epoxy printed circuit board, e(Cu)=35µm,
recommended pad layout)
Figure 6: Forward voltage drop versus forward
current (maximum values)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
P(W)
I (A)
F(AV)
T
δ
=tp/T tp
δ= 0.05
δ= 0.1 δ= 0.2
δ= 1
δ= 0.5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0
1
2
3
4
5
6
7
8
9
10
I (A)
M
δ
P=1.5W
P=1.0W
P=0.25W
P=0.5W
0 25 50 75 100 125 150
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
I (A)
F(AV)
T
δ
=tp/T tp T (°C)
amb
R =120°C/W
th(j-a)
R=R
th(j-a) th(j-I)
1E-3 1E-2 1E-1 1E+0
0
1
2
3
4
5
6
I (A)
M
I
M
t
δ=0.5
t(s)
T =25°C
a
T =100°C
a
T =125°C
a
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1
10
100
200
Z/R
th(j-a) th(j-a)
t (s)
p
Single pulse
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0.01
0.10
1.00
10.00
50.00
I (A)
FM
V (V)
FM
T =150°C
j
T =25°C
(maximum values)
j
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Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
Figure 8: Recovery charges versus dIF/dt
Figure 9: Peak recovery current versus dIF/dt Figure 10: Dynamic parameters versus
junction temperature
1 10 100 200
1
2
5
10
20
C(pF)
V (V)
R
F=1MHz
T =25°C
j
10 20 50 100 200 500
10
20
50
100
200
Q (nC)
rr
I =2A
90% confidence
T =125°C
F
j
dI /dt(A/µs)
F
I (A)
RM
dI /dt(A/µs)
F
10 20 50 100 200 500
0.1
1.0
10.0
20.0
I =2A
90% confidence
T =125°C
F
j
0 25 50 75 100 125 150
0.25
0.50
0.75
1.00
1.25
Q ; I [T ] / =125°C]
rr RM j Q;I [T
rr RM j
I
RM
Q
RR
T (°C)
j
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Figure 11: SMA Package Mechanical Data
Figure 12: SMA Foot Print Dimensions
(in millimeters)
E
C
L
E1
D
A1
A2
b
2.40
1.65
1.45 1.45
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.03 0.075 0.080
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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www.st.com
Table 7: Ordering Information
■Band indicates cathode
■Epoxy meets UL94, V0
Ordering type Marking Package Weight Base qty Delivery mode
STPR120A R12 SMA 0.068 g 5000 Tape & reel
Table 8: Revision History
Date Revision Description of Changes
Jul-2003 3 Last update.
Aug-2004 4
SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).
