2015-11-23 High Power Infrared Emitter (850nm) in SMR(R) Package Version 1.4 SFH 4551 Features: * High Power Infrared LED * SMR(R) (Surface Mount Radial) package * Same package as photodiode SFH 2500 FA * Short switching times * UL version available ( ordering code & test conditions on request) Applications * Sensor technology * Discrete interrupters * Discrete optocouplers Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code Ie [mW/sr] IF= 100 mA, tp= 20 ms SFH 4551 Note: 270 ( 100) Q65111A0506 Measured at a solid angle of = 0.01 sr 2015-11-23 1 Version 1.4 SFH 4551 Maximum Ratings (TA = 25 C) Parameter Symbol Values Unit Operation and storage temperature range Top; Tstg -40 ... 85 C Reverse voltage VR 5 V Forward current IF 100 Surge current (tp 100 s, D = 0) IFSM 1 Power consumption Ptot 180 ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 Thermal resistance junction - ambient 1) page 12 RthJA 300 mA A mW kV K/W Characteristics (TA = 25 C) Parameter Symbol Values Unit Peak wavelength (IF = 100 mA, tp = 20 ms) (typ) peak 860 nm Centroid wavelength (IF = 100 mA, tp = 20 ms) (typ) centroid 850 nm Spectral bandwidth at 50% of Imax (IF = 100 mA, tp = 20 ms) (typ) 30 nm Half angle (typ) 10 Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 100 mA, RL = 50 ) (typ) tr, tf Forward voltage (IF = 100 mA, tp = 20 ms) Forward voltage (IF = 1 A, tp = 100 s) 0.3 x 0.3 mm x mm 12 ns (typ (max)) VF 1.5 ( 1.8) V (typ (max)) VF 2.4 ( 3) V Reverse current (VR = 5 V) IR not designed for reverse operation A Total radiant flux (IF=100 mA, tp=20 ms) (typ) e 70 mW Temperature coefficient of Ie or e (IF = 100 mA, tp = 20 ms) (typ) TCI -0.5 %/K Temperature coefficient of VF (IF = 100 mA, tp = 20 ms) (typ) TCV -0.7 mV / K Temperature coefficient of wavelength (IF = 100 mA, tp = 20 ms) (typ) TC 0.3 nm / K 2015-11-23 2 Version 1.4 SFH 4551 Grouping (TA = 25 C) Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF= 100 mA, tp= 20 ms IF= 100 mA, tp= 20 ms IF = 1 A, tp = 25 s Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH 4551-AW 100 200 1200 SFH 4551-BW 160 320 1900 SFH 4551-CW 250 500 3000 Note: measured at a solid angle of = 0.01 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 2) page 12 Irel = f(), TA = 25C Radiant Intensity 2) page 12 Ie / Ie(100 mA) = f(IF), single pulse, tp = 25 s, TA= 25C OHF04132 100 OHL01715 101 I rel % Ie I e (100 mA) 80 100 5 60 10-1 40 5 10-2 20 5 0 700 750 800 850 10-3 0 10 nm 950 2015-11-23 5 10 1 5 10 2 mA 10 3 IF 3 Version 1.4 SFH 4551 Forward Current 2) page 12 IF = f(VF), single pulse, tp = 100 s, TA= 25C Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W IF OHF03814 0.11 A IF OHL01713 100 A 10-1 0.08 5 0.07 0.06 10-2 0.05 5 0.04 0.03 10-3 0.02 5 0.01 0 10-4 0 10 20 30 40 50 60 70 80 C 100 0 0.5 1 1.5 2 2.5 V 3 VF T Permissible Pulse Handling Capability IF = f(tp), T A = 85 C, duty cycle D = parameter Permissible Pulse Handling Capability IF = f(tp), TA = 25 C, duty cycle D = parameter IF 1.2 A OHF05439 tP D= T 1.0 tP IF IF T D= 0.8 0.6 0.4 1.6 A 1.4 tP tP IF D= T T 1.2 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 1.0 0.8 0.6 0.4 0.2 0.2 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp tp 2015-11-23 OHF03813 4 Version 1.4 SFH 4551 Radiation Characteristics 2) page 12 Irel = f(), TA= 25C 40 30 20 10 0 OHL03768 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 0.8 0.6 7.5 (0.295) 5.5 (0.217) 2.8 (0.110) 2.4 (0.094) 2.54 (0.100) spacing 3.7 (0.146) 3.3 (0.130) 0.4 0 Chip position 4.5 (0.177) 3.9 (0.154) 14.7 (0.579) 13.1 (0.516) Cathode 4.5 (0.177) 3.9 (0.154) 2.05 (0.081) R 1.95 (0.077) 7.7 (0.303) 7.1 (0.280) 40 60 80 100 ((3.2) (0.126)) ((R2.8 (0.110)) ((3.2) (0.126)) 6.0 (0.236) 5.4 (0.213) GEOY6960 Dimensions in mm (inch). Package SMR 2015-11-23 20 4.8 (0.189) 4.4 (0.173) 1.0 Package Outline -0.1...0.2 (-0.004...0.008) 100 2.7 (0.106) 2.4 (0.094) 90 5 120 Version 1.4 SFH 4551 Approximate Weight: 0.4 g 5.3 (0.209) 2.54 (0.100) 1.3 (0.051) Recommended Solder Pad Bauteil positioniert Component Location on Pad Padgeometrie fur verbesserte Warmeableitung Lotpad Paddesign for improved heat dissipation 3 (0.118) Lotstopplack Solder resist 7 (0.276) Dimensions in mm (inch). 2015-11-23 Cu-Flache > 20 mm 2 Cu-area > 20 mm 2 6 OHF02449 Version 1.4 SFH 4551 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01 OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 50 0 100 150 200 250 s 300 t OHA04612 Profile Feature Profil-Charakteristik Symbol Symbol Pb-Free (SnAgCu) Assembly Minimum ) Ramp-up rate to preheat* 25 C to 150 C Time tS TSmin to TSmax tS 60 Ramp-up rate to peak*) TSmax to TP Recommendation Maximum 2 3 100 120 2 3 Unit Einheit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 s 3 6 K/s 10 Ramp-down rate* TP to 100 C 480 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 2015-11-23 C 7 s Version 1.4 SFH 4551 Taping Dimensions in mm (inch). Tape and Reel 24 mm tape with 1000 pcs. on 330 mm reel W1 D0 P0 A N F W E 13.0 0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 2015-11-23 8 Version 1.4 SFH 4551 Tape dimensions [mm] Tape dim ensions in m m W P0 24 + 0.3 / - 0.1 4 0.1 P1 P2 D0 E F 8 0.1 or 12 0.1 2 0.1 1.5 0.1 1.75 0.1 11.5 0.05 Reel dimensions [mm] Reel dim ensions in m m A W Nmin W1 W 2max 330 24 60 / 100 24.4 + 2 30.4 Barcode-Product-Label (BPL) OSRAM Opto EX A RoHS Compliant (6P) BATCH NO: 1234567890 (1T) LOT NO: 1234567890 BIN1: XX-XX-X-XXX-X LX XXXX Semiconductors MP ML Temp ST X XXX C X (9D) D/C: 1234 Pack: RXX LE DEMY XXX X_X123_1234.1234 X (X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X OHA04563 Dry Packing Process and Materials Moisture-sensitive label or print L VE el LE . see lab e If ve ati nk, bla cod bar y H) (R . dit mi hu e ed ag RH % /60 Barcode label C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe TIO or d , cte itio U g coSEND an bje ing C nd 5 C su ss CO Ais baRE co ce y 40 be TU MI CThIS C < tor ll pro SE _ < urs ). urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ). 23 wi nt tim e or l wi fac C Flo tim at or ca at re. Flo d tha ale el or nth nti Flo uiv du if: rea es l 4 5 Flo lab mo ide ce eq low g, l ve vic is be or de 24 tin en l 5a6 pro ve Le de , e te co , g: ve l un wh Le ke r se da ure ba ed low ba Le ve mo % ba e al d ure Le ist en ref e e 10 tim ure se for ist ale op se for > , Mo se 3 ist ure is or . , is ha se Mo nk be ist nk g rd -03 Mo in n Flo r-p RH g, bla Mo ba TD po If blathi % kin Ca life s (if ar t. wi 10 ba tor J-S thi, va p. elf Ye ar ks _ < e icat me , C 1 Ye ee urs Sh terlow tem ted at ed uir > 1 W no un DE Ho Af Ind 1. d e 4 8 uir ref dy reqy is 2. JE bo e Mo ore tim 16 req : C/ e es dit2b a) St tim or mi IP ed or g is tim e vic b) or e Hu Flo en tim or De 2a kin nc te Flo a) op or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a3 ve Le g an ve l Le Ba te ure Le ve ure Le ist Da ure ist Mo ist ure Mo ist Mo Mo MO TO OP s at t M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 AM OSR Desiccant OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. 2015-11-23 9 Version 1.4 SFH 4551 Transportation Packing and Materials Barcode label D/ 8 Y M DE R 18 -1 P -1 + Q C: 99 D/ 21 00 (9 D) 21 : 20 00 : 14 2 5 (Q )Q TY O H 12 34 S S em R ic AM on du O p ct to or H NO s TC 3G BA (6 P) NO : 12 11 00 LO T (1 T) NO : TY : 20 (Q )Q : NO M RA OS (X ) PR O D 5 14 2 110 0 Packing Sealing label Dimensions of transportation box in mm Width Length Height 349 5 349 5 38 5 2015-11-23 OD PR ) (X (G ) G RO UP : P -1 + Q -1 R 18 DE M Y Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: M u L lt S iT Y O T P 67 L 6 E Bi D Bi n1 00 C: 01 44 Muster O ct pto o rs u M (9 D) d A n o : 34 ic S R NO O BA TC H 3G H (1 T) LO T NO (6 P) S 8 12 2199 : 12 em 2100 01 44 el OU P: L GR E V LE see . lab e H) nk, cod (R bla r If ty ba . idi RH m hu 0% e /6 ive d C re ag lat ra ck re 30 _ < inf pa % k s of to 90 ea ur s d ). < ns (p or ur s d Ho de , cteg itio ur s Ho an bje co C 72 sin nd Ho ur 5 te 48 C su es e Ho co 24 6 da e 40 be oc ry tim C e r th < ll pr tim cto ). r OI oo 23 wi nt tim e at l wi fa r M TO Fl oo tim s at at ale C at e. ica Fl th oo r th ur el OP nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low l oc ve vic is en ing be or de 24 l 5a6 pr ve Le de nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo Le ve tu re m % ba e ba al d Le r en re tu re e re 10 ois tim se fo tu re ale op se fo > , M r se ois 3 is , is ha se M ois tu nk be oo . 03 nk rd g M ois in r-p bla in Fl RH g, DM ba po If blath % kin Ca life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e 4 8 ou re ed is re qu ty 2. JE bo e M or tim 16 re C/ : e es idi 2b r a) St tim mor is IP ed r oo tim e vic b) g e r Hu Fl en oo tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 2 Fl If al re tim ve l 4. se d l 2a3 ve Le g an ve l Le re Ba te Le ve tu re Le tu Da ois re tu re M ois M ois tu M ois M Nns IVEORS ai IT ntNS CT TIO DU U g EcoSE ON A ba IC UR M CThisSTSE (G ) M u L lt S iT Y O T67 P L 6 Muster E Bi D Bi n1 Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label 10 OHA02044 Version 1.4 SFH 4551 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2015-11-23 11 Version 1.4 SFH 4551 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 20 mm2 each 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2015-11-23 12 Version 1.4 SFH 4551 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 2015-11-23 13