PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-8415301VRA ACTIVE CDIP J 20 20 TBD A42 N / A for Pkg Type 5962-8415301VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type 84151012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8415101RA ACTIVE CDIP J 20 1 TBD Call TI Call TI 8415101SA ACTIVE CFP W 20 1 TBD Call TI Call TI 84152012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8415201RA ACTIVE CDIP J 20 1 TBD Call TI Call TI 8415201SA ACTIVE CFP W 20 1 TBD Call TI Call TI 84153012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8415301RA ACTIVE CDIP J 20 1 TBD Call TI Call TI Call TI 8415301SA ACTIVE CFP W 20 1 TBD Call TI SN54LS682J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SN54LS684J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type SN54LS688J ACTIVE CDIP J 20 1 TBD SN74LS682DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type SN74LS682NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) SN74LS682NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS682NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Mar-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS684NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LS684NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS684NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS686DW OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74LS686NT OBSOLETE PDIP NT 24 TBD Call TI Call TI Call TI Call TI SN74LS687NT OBSOLETE PDIP NT 24 SN74LS688DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 Samples (Requires Login) SN74LS682NSRG4 TBD (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 23-Mar-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) SN74LS688DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) SN74LS688N ACTIVE PDIP N 20 20 Pb-Free (RoHS) TBD Lead/ Ball Finish MSL Peak Temp CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type SN74LS688N3 OBSOLETE PDIP N 20 ACTIVE PDIP N 20 20 Pb-Free (RoHS) SN74LS688NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS688NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54LS682FK ACTIVE LCCC FK 20 1 TBD SNJ54LS682J ACTIVE CDIP J 20 1 TBD SNJ54LS682W ACTIVE CFP W 20 1 TBD ACTIVE LCCC FK 20 1 TBD Samples (Requires Login) SN74LS688NE4 SNJ54LS684FK (3) Call TI Call TI CU NIPDAU N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type SNJ54LS684J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54LS684W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SNJ54LS688FK ACTIVE LCCC FK 20 1 TBD SNJ54LS688J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54LS688W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Mar-2012 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS682, SN54LS684, SN54LS688, SN54LS688-SP, SN74LS682, SN74LS684, SN74LS688 : * Catalog: SN74LS682, SN74LS684, SN74LS688, SN54LS688 * Military: SN54LS682, SN54LS684, SN54LS688 * Space: SN54LS688-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS682DWR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) DW 20 2000 330.0 24.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS682NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS684DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS684NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LS688DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LS688NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS682DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS682NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS684DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS684NSR SO NS 20 2000 367.0 367.0 45.0 SN74LS688DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74LS688NSR SO NS 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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