PLA192 Single Pole, Normally Open OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Ratings 600 Units VP 150 22 5 mArms / mADC Description IXYS Integrated Circuits' PLA192 is a single-pole, normally open (1-Form-A) solid state relay that provides 5000Vrms of input to output isolation. mA Features * PLA192E is 100% Tested for Partial Discharge: DIN EN 60747-5-5 * 5000Vrms Input/Output Isolation * Low Drive Power Requirements * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Small 6-Pin Package * Flammability Rating UL 94 V-0 In addition to all the features and benefits of the PLA192, the PLA192E meets the partial discharge demands of DIN EN 60747-5-5 (previously VDE 0884). All versions of the PLA192 can be used to replace mechanical relays, while offering the superior reliability associated with semiconductor devices. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. Because they have no moving parts, they offer bounce-free switching in more compact surface mount or thru-hole packages. Applications Approvals * * * * * * * * * * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * DIN EN 60747-5-5 Certified ("E" Suffix Only) VDE Certificate 40036603 * EN/IEC 60950-1 Certified Component: Certificate available on our website Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment: Patient/Equipment Isolation Aerospace Industrial Controls Pin Configuration AC/DC Configuration 1 + Control - Control Do Not Use 6 2 5 3 4 Ordering Information Part # PLA192E PLA192ES PLA192ESTR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) PLA192 6-Pin DIP (50/Tube) PLA192S 6-Pin Surface Mount (50/Tube) PLA192STR 6-Pin Surface Mount (1000/Reel) Load Switching Characteristics of Normally Open Devices Do Not Use Load Form-A DC Only Configuration + Control - Control Do Not Use 1 6 2 5 3 4 + Load IF - Load 90% 10% ILOAD ton DS-PLA192-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA192 Absolute Maximum Ratings @ 25C (Unless Otherwise Noted) Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Rating 600 5 50 1 150 800 Units VP V mA A mW mW 5000 Vrms 4 -40 to +85 -40 to +125 kV C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C (Unless Otherwise Noted) Parameters Output Characteristics Load Current Continuous, AC/DC Configuration Continuous, DC-Only Configuration Peak On-Resistance AC/DC Configuration DC-Only Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Min Typ Max Units - - 150 220 400 mArms / mADC mADC mAP 13.3 4.15 - 22 8 1 ILEAK - IF=0mA, VL=50V, f=1MHz ton toff COUT - 10 5 5 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.22 0.21 1.2 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF Min 7071 1000 7.6 7.6 Max 1875 5000 - Units VP VP VP Vrms mm mm t=10ms Symbol IL ILPK IL=150mA IL=220mA VL=600VP IF=5mA, VL=10V RON A ms pF PLA192E Safety and Insulation Ratings Parameters Pollution Degree 2 according to DIN VDE 0109 Highest Allowable Over-Voltage Maximum Working Insulation Voltage Partial Discharge Test Voltage Isolation Test Voltage Creepage Distance Clearance Distance 2 Conditions Transient Voltage Recurring Voltage DIN EN 60747-5-5 Method B - www.ixysic.com Symbol VIOTM VIORM VPR VISO - R08 INTEGRATED CIRCUITS DIVISION PLA192 PERFORMANCE DATA* 25 20 15 10 35 30 30 25 20 15 10 5 5 0 0 1.25 1.7 1.8 1.9 2.0 Turn-On Time (ms) Device Count (N) 10 5 30 25 20 15 10 0.21 0.22 0.23 0.24 LED Current (mA) 0.25 0.38 DC-Only On-Resistance Distribution (N=50, IF=5mA, IL=220mA) 20 15 10 5 0 0 0.20 0.26 0.29 0.32 0.35 Turn-Off Time (ms) 25 30 5 0 10 0.23 35 15 15 2.1 Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mA) 40 20 20 0 1.6 25 25 5 1.26 1.27 1.28 1.29 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mA) 30 Device Count (N) 35 Device Count (N) Device Count (N) Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC ) Device Count (N) 35 Typical Turn-On Time (N=50, IF=5mA, IL=100mADC ) Typical LED Forward Voltage Drop (N=50, IF=5mA) 13.1 0.26 13.2 13.3 13.4 13.5 On-Resistance (:) 13.6 4.05 4.10 4.15 4.20 4.25 On-Resistance (:) 4.30 Typical Blocking Voltage Distribution (N=50) 30 Device Count (N) 25 20 15 10 5 0 700 1.4 1.3 1.2 1.1 360 3500 Turn-Off Time (Ps) 1.5 3000 2500 2000 1500 1000 0 -40 -20 0 20 40 60 Temperature (C) 80 100 359 358 357 356 500 1.0 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 361 4000 Turn-On Time (Ps) LED Forward Voltage Drop (V) 4500 IF=50mA IF=20mA IF=10mA IF=5mA 750 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 1.6 710 720 730 740 Blocking Voltage (VP) 355 0 10 20 30 LED Current (mA) 40 50 0 10 20 30 40 Forward Current (mA) 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA192 0.30 Typical Turn-On Time vs. Temperature (IL=100mA) 4500 4000 0.28 0.26 0.24 0.22 0.20 0.18 IF=2mA 3500 3000 2500 IF=5mA 2000 1500 IF=10mA 1000 500 -40 0.16 -40 -20 0 20 40 60 Temperature (C) 80 100 Typical AC/DC On-Resistance vs. Temperature (IF=5mA, IL=150mA) 18 IF=10mA IF=5mA IF=2mA 450 400 350 300 250 200 -20 0 20 40 60 Temperature (C) 80 100 -40 Typical DC-Only On-Resistance vs. Temperature (IF=5mA, IL=220mA) 7 Typical Turn-Off Time vs. Temperature (IL=100mA) 500 Turn-Off Time (Ps) Typical IF for Switch Operation vs. Temperature (IL=100mA) Turn-On Time (Ps) LED Current to Operate (mA) PERFORMANCE DATA* -20 0 20 40 60 Temperature (C) 80 100 80 100 Maximum Load Current vs. Temperature (IF=5mA) 250 14 12 10 20 40 60 Temperature (C) 80 100 Typical Load Current vs. Load Voltage AC/DC Configuration (IF=5mA) Current (A) 0.05 0.00 -0.05 0 20 40 60 Temperature (C) 80 -0.15 0.00 -3 0.06 -2 -1 0 1 Voltage (V) 2 3 180 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 60 Temperature (C) 80 100 0.2 0.4 0.6 0.8 Voltage (V) 1.0 0 20 40 60 Temperature (C) 770 1.2 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 760 750 740 730 720 710 -40 1.2 160 -20 0 20 40 60 Temperature (C) 80 100 10s 100s Energy Rating Curve (IF=5mA) 1.0 140 120 100 80 60 40 0.8 0.6 0.4 0.2 20 0 0.1 -20 Typical Blocking Voltage vs. Temperature 700 0.0 Typical Leakage vs. Temperature Measured across Pins 4&6 (VL=600V) 0.05 100 -40 Typical Load Current vs. Load Voltage DC-Only Configuration (IF=5mA) 0.10 0.05 AC/DC Configuration 150 100 0.15 -0.10 200 50 -20 0.20 Output Capacitance (pF) Current (A) 2 0.25 0.10 Leakage (PA) 3 Blocking Voltage (VP) 0 4 Load Current (A) 0.15 -20 5 1 -40 8 -40 Load Current (mA) 16 On-Resistance (:) On-Resistance (:) DC-Only Configuration 6 1 10 100 Load Voltage (V) 1000 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA192 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA192, PLA192S, PLA192E, PLA192ES MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles PLA192, PLA192E PLA192S, PLA192ES 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA192 MECHANICAL DIMENSIONS PLA192 & PLA192E 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) PLA192S & PLA192ES 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) 6 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA192 PLA192STR & PLA192ESTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-PLA192-R08 (c)Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/28/2018