Intel(R) Ethernet Converged Network Adapter X710-DA2 Specifications Essentials Networking Specifications Package Specifications Advanced Technologies Intel(R) Virtualization Technology for Connectivity Subm Feedba Send Print Twitte Faceb Linke Type Here to Search Products ARK Menu Specifications Compare + Related Products - Essentials Status Launched Launch Date Q4'14 Vertical Segment Server Cable Medium Copper Cabling Type SFP+ Direct Attached Twin Axial Cabling up to 10m Compatible Products Bracket Height Low Profile and Full Height Ordering / sSpecs / Steppings Recommended Customer Price $341.00 - $354.00 Ethernet Controller Intel(R) Ethernet Controller X710AM2 Product Brief Link Download Drivers Intel(R) 10 Gigabit Server Adapters Intel(R) Ethernet Converged Network Adapter X710 Series Products formerly Fortville Quick Links Export Full Specifications Support Overview Search Distributors PCN/MDDS Information - Networking Specifications # of Ports Dual System Interface Type PCIe v3.0 (8.0 GT/s) Intel(R) Virtualization Technology for Connectivity (VT-c) Yes Speed & Slot Width 8.0 GT/s, x 8 Lane Controller Intel(R) X710 933206: PCN | MDDS 933217: PCN | MDDS 933227: PCN | MDDS 944042: PCN | MDDS 945034: PCN - Package Specifications Low Halogen Options Available See MDDS - Advanced Technologies iWARP/RDMA No Intel(R) Ethernet Power Management Yes Intel(R) Data Direct I/O Technology Yes Intelligent Offloads Yes Storage Over Ethernet iSCSI NFS - Intel(R) Virtualization Technology for Connectivity On-chip QoS and Traffic Management Yes Flexible Port Partitioning Yes Virtual Machine Device Queues (VMDq) Yes PCI-SIG* SR-IOV Capable Yes All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. "Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export. Refer to Datasheet for formal definitions of product properties and features. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Send us your feedback!