Preliminary Information This document contains information on a new product. The parametric information, although not fully characterized, is the result of testing initial devices. CX77133 ina ry Power Amplifier Module for CDMA PCS (1850-1910 MHz) The CX77133 Power Amplifier Module (PAM) is a fully matched, 6-pin surface mount module developed for Personal Communications Service (PCS) and wireless local loop applications. This small and efficient Power Amplifier packs a full 1850-1910 MHz bandwidth coverage into a single compact package. The CX77133 meets the stringent spectral linearity requirements of Code Division Multiple Access (CDMA) PCS transmission with high power added efficiency for power output of up to 28 dBm. A single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all the active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 load. * * * * * * Low voltage positive bias supply (3 to 4 Volts) Good linearity High efficiency Large dynamic range 6-pin package (6 x 6 x 1.5 mm) Power down control Applications * * Personal communications services (PCS) Wireless local loop (WLL) m This device is manufactured with Conexant's GaAs Heterojunction Bipolar Transistor (HBT) process, which provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the CX77133 is supplied directly from a three-cell nickel cadmium, a single-cell lithium ion, or other suitable battery with an output in the 3-4 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery. Distinguishing Features Functional Block Diagram VREF (3) VCC2 (4) VCC1 (1) Power Stage Bias Pr eli Driver Stage Bias RF Input (2) Input Match Inter Stage Match DA PA Output Match RF Output (5) MMIC (6, 7) GND MODULE (6, 7) GND Data Sheet Preliminary Information (c) 2001, 2002 Conexant Systems, Inc., All Rights Reserved. 101537P6 March 27, 2002 CX77133 Electrical Specifications Power Amplifier Module for CDMA PCS (1850-1910 MHz) ina ry Electrical Specifications The following tables list the electrical characteristics of the CX77133 Power Amplifier. Table 1 lists the absolute maximum rating for continuous operation. Table 1. Absolute Maximum Ratings(1) Parameter RF Input Power Supply Voltage Reference Voltage Case Operating Temperature Storage Temperature NOTE(S): (1) Symbol Minimum Nominal Maximum Unit PIN -- 4.0 7.0 dBm VCC -- 3.4 6.0 Volts VREF -- 3.0 3.3 Volts TC -30 +25 +110 oC TSTG -55 -- +125 o C No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value. m Table 2 lists the recommended operating conditions and Table 3 lists the electrical performance of the CX77133 Power Amplifier for nominal operating conditions. Table 2. Recommended Operating Conditions Symbol Min Nominal Max Unit Supply Voltage VCC 3.2 3.4 4.2 Volts Reference Voltage VREF 2.95 3.0 3.2 Volts Operating Frequency FO 1850.0 1880.0 1910.0 MHz Case Operating Temperature TC -30 +25 +85 C Pr eli Parameter 2 Conexant Preliminary Information 101537P6 March 27, 2002 CX77133 Electrical Specifications Power Amplifier Module for CDMA PCS (1850-1910 MHz) Table 3. Electrical Specification for Nominal Operating Conditions (1) Quiescent Current Condition Symbol Minimum Typical Maximum Unit Nominal Iq 70.0 120.0 130.0 mA ina ry Characteristics VREF = 0 V VCC = 3.4 V Ilk -- -- 7.0 A Gain PO = 0 dBm PO = 28 dBm G Gp 25.5 27.0 26.5 28.5 28.0 30.0 dB dB Power Added Efficiency PO = 28 dBm PAEd 28 32.0 36.0 -- % ACP -- -50.0 -48.5 dBc PO 28 dBm PO 28 dBm DFO2 DFO3 -- -- -38.0 -44.0 -32.0 -37.5 dBc dBc PO 28 dBm RXBN -- -135.0 -133.0 dBm/Hz Noise Figure -- NF -- 4.0 5.5 dB Input Voltage Standing Wave Ratio -- VSWR -- 1.2 1.4 -- Stability (spurious output) 5:1 VSWR All Phases S -- -- -60.0 dBc Ruggedness - No damage PO 28 dBm Ru 10:1 -- -- VSWR Leakage Current PO 28 dBm Adjacent Channel Power Harmonic Suppression Second Third Noise Power in RX Band 1930-1990 MHz NOTE(S): VCC = +3.4 V, VREF = +3.0 V, Freq. = 1880 MHz, TC = 25 oC, unless otherwise specified. ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW Pr eli (2) m (1) (2) 101537P6 March 27, 2002 Conexant Preliminary Information 3 CX77133 Electrical Specifications Power Amplifier Module for CDMA PCS (1850-1910 MHz) Table 4. Electrical Specification Limits for Recommended Operating Conditions (1) Condition Symbol Minimum Maximum Unit Nominal Iq -- 180.0 mA Gain PO = 0 dBm PO = 28 dBm G Gp 24.0 23.0 29.5 32.5 dB dB Power Added Efficiency VCC = 3.4 V PO = 28 dBm PAEd 28 31.5 -- % Adjacent Channel Power(2) PO 28 dBm ACP -- -44.0 dBc PO 28 dBm PO 28 dBm DFO2 DFO3 -- -30.0 -35.0 dBc dBc PO 28 dBm RXBN -- -131.0 dBm/Hz Noise Figure -- NF -- 8.0 dB Input Voltage Standing Wave Ratio -- VSWR -- 2.0 -- Stability (spurious output) 5:1 VSWR All Phases S -- -60.0 dBc Ruggedness-No damage PO 28 dBm Ru 10:1 -- VSWR Quiescent Current Harmonic Suppression Second Third Noise Power in RX Band 1930-1990 MHz NOTE(S): (1) Per Table 2, unless otherwise specified. ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. Worst case ACPR is -43dBc at +85 C, Vcc = 3.2 V. Pr eli m (2) ina ry Characteristics 4 Conexant Preliminary Information 101537P6 March 27, 2002 CX77133 Evaluation Board Description Power Amplifier Module for CDMA PCS (1850-1910 MHz) ina ry Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the CX77133, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 1 shows the basic schematic of the board for the 1850 MHz to 1910 MHz range. Figure 2 illustrates the board layout. Figure 1. Evaluation Board Schematic 1 VCC1 C1 220 pF RFIN GND 6 RFOUT RFOUT 5 2 RFIN VCC2 4 3 VREF C2 4.7 F VREF C3 330 pF C4 1000 pF VCC m 101537_003 Figure 2. Evaluation Board Assembly Diagram Pr eli C1 C2 C3 101537P6 March 27, 2002 C4 RF OUT GND Vcc CONEXANT 6x6_ENG_EVAL_BD GND Vref RF IN Conexant Preliminary Information 101537_002 5 CX77133 Package Dimensions and Pin Descriptions Power Amplifier Module for CDMA PCS (1850-1910 MHz) ina ry Package Dimensions and Pin Descriptions The CX77133 is a multi-layer laminate base, overmold encapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. Figure 3 is a mechanical drawing of the pad layout for this package and Figure 4 illustrates typical case markings. The pin numbering convention starts with pin 1 in the upper left, as indicated in Figure 3, and increments counter-clockwise around the package. Table 5 describes each pin function. Figure 3. CX77133 Package Dimensions 0.09 0.05 (6x) 0.14 (6x) PIN 1 INDICATOR 1 0.14 0.50 6 2.62 6.04 0.05 2 5 Ground Pad 0.759 0.05 (6x) 5.50 2.50 2.50 3 4 m 1.258 6.04 0.05 2.88 1.50 0.10 0.48 0.07 TOP VIEWS Notes: Solder mask pattern pad layout as viewed from top looking through package. All dimensions are in millimeters. Pr eli FRONT VIEW 101537_007 Table 5. Pin Description Pin # 1 2 3 4 5 6 GND PAD Function VCC1(1) RF Input VREF VCC2(1) RF Output GND GND(2) NOTE(S): (1) (2) 6 All supply pins may be connected together at the supply. Package underside is GND. Conexant Preliminary Information 101537P6 March 27, 2002 CX77133 Package Handling Information Power Amplifier Module for CDMA PCS (1850-1910 MHz) ina ry Package Handling Information Because this device package is sensitive to moisture absorption, it is baked and vacuum packed prior to shipment. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 C per second. Maximum temperature should not exceed 225 C and the time spent at a temperature exceeding 210 C should be limited to less than 10 seconds. If the part is manually attached, precaution should be taken to insure that the part is not subjected to a temperature exceeding 300 C for more than 10 seconds. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. For additional details on both attachment techniques, precautions, and handling procedures recommended by Conexant, please refer to Application Note: Solder Reflow, Document Number 101536. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568. m Figure 4. Typical Case Markings CONEXANT Pr eli Mark Pin 1 Identifier CX77133-NN NXXXXX.XX YYWW MEX 101537P6 March 27, 2002 Manufacturing Part Number-Revision Number Lot Number YY = Manufacture Year WW = Week Package Sealed MEX = Country Code Conexant Preliminary Information 101537_006 7 CX77133 Package Handling Information Pr eli m ina ry Power Amplifier Module for CDMA PCS (1850-1910 MHz) 8 Conexant Preliminary Information 101537P6 March 27, 2002 Ordering Information Manufacturing Part Number Product Revision CX77133 CX77133-12 12 Revision History Revision Level P1 July 2001 P3 Operating Temperature 6x6LM-6 Date March 2001 P2 Package ina ry Model Number -30 C to +85 C Description Preliminary Information Revise: Table 1, Figures 1, 2, 4. Add: Table 4 Remove: Table 5, Figure 5 August 2001 Revise: Table 3 P4 October 2001 Revise: Figure 3 P5 March 8, 2002 Revise: Tables 3, 4, and 5; Figure 3. P6 March 27, 2002 Revise: Table 4 footnotes; Figure 3. References m Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel, Document Number 101568 (c) 2001, 2002 Conexant Systems, Inc. All Rights Reserved. Pr eli Information in this document is provided in connection with Conexant Systems, Inc. ("Conexant") products. These materials are provided by Conexant as a service to its customers and may be used for informational purposes only. Conexant assumes no responsibility for errors or omissions in these materials. Conexant may make changes to specifications and product descriptions at any time, without notice. Conexant makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. 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