
DE275X2-102N06A
RF Power MOSFET
Directed En ergy, Inc.
An
IXYS Company
Preliminary Data Sheet
VDSS = 1000 V
ID25 = 6 A
RDS(on) = 2.0 Ω
ΩΩ
Ω
PDHS = 750 W
Symbol Test Conditions Maximum Ratings
VDSS TJ = 25°C to 150°C 1000 V
VDGR TJ = 25°C to 150°C; RGS = 1 MΩ 1000 V
VGS Continuous ±20 V
VGSM Transient ±30 V
ID25 Tc = 25°C 6 A
IDM Tc = 25°C, pulse width limited by TJM 48 A
IAR Tc = 25°C 6 A
EAR Tc = 25°C 20 mJ
IS ≤ IDM, di/dt ≤ 100A/µs, VDD ≤ VDSS,
Tj ≤ 150°C, RG = 0.2Ω
5 V/ns
IS = 0 >200 V/ns
PDHS (1) Tc = 25°C, Derate 6.0W/°C above 25°C 750 W
PDAMB (1) Tc = 25°C 5.0 W
TJ -55…+150 °C
TJM 150 °C
Tstg -55…+150 °C
TL 1.6mm (0.063 in) from case for 10 s 300 °C
Weight 4 g
dv/dt
RthJHS (1) 0.17 K/W
Symbol Test Conditions Characteri stic Valu e s
TJ = 25°C unless otherwise specified
min. typ. max.
VDSS VGS = 0 V, ID = 3 ma 1000 V
VGS(th) VDS = VGS, ID = 4 ma 2.5 5.5 V
IGSS VGS = ±20 VDC, VDS = 0 ±100 nA
IDSS VDS = 0.8 VDSS TJ = 25°C
VGS = 0 TJ = 125°C
50
1 µA
mA
RDS(on) 2.5
Ω
gfs VDS = 15 V, ID = 0.5ID25, pulse test 2 6 S
VGS = 15 V, ID = 0.5ID25
Pulse test, t ≤ 300µS, duty cycle d ≤ 2%
Features
•Isolated Substrate
−high isolation voltage (>2500V)
−excellent thermal transfer
−Increased temperature and power
cycling capability
•IXYS advanced low Qg process
•Low gate charge and capacitances
−easier to drive
−faster switching
•Low RDS(on)
•Very low insertion inductance (<2nH)
•No beryllium oxide (BeO) or other
hazardous materials
A dvantages
•High Performance Push-Pull RF
Package
•Optimized for RF and high speed
switching at frequencies to >100MHz
•Easy to mount—no insulators needed
•High power density
♦Common Source Push-Pull Pair
♦N-Channel Enhancement Mode
♦Low Qg and Rg
♦High dv/dt
♦Nanosecond Switching
DRAIN 1
SG1 SD1
GATE 1
DRAIN 2
SG2SD2
GATE 2
The DE275X2-102N06A is a matched pair of RF power MOSFET devices in
a common source configuration. The device is optimized for push-pull or
parallel operation in RF generators and amplifiers at frequencies to >65
MHz.
Note: All specifications are per each tran-
sistor, unless otherwise noted.
(1) Thermal specifications are for the
package, not per transistor
Unless noted, specifications are for each output device