GP1A53HRJ00F
1
Sheet No.: D3-A03801EN
Date Oct. 3. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
GP1A53HRJ00F Gap : 5mm, Slit : 0.5mm
*
OPIC Output
Case package Transmissive
Photointerrupter
■Description
GP1A53HRJ00F is a standard, OPIC output, trans-
missive photointerrupter with opposing emitter and de-
tector in a case, providing non-contact sensing. For this
family of devices, the emitter and detector are inserted in
a case, resulting in a through-hole design.
■Features
1. Transmissive with OPIC output
2. Highlights:
• Vertical Slit for alternate motion detection
• Output Low Level at intercepting optical path
3. Key Parameters:
• Gap Width : 5mm
• Slit Width (detector side) : 0.5mm
• Package : 13.7×10×5.2mm
4. Lead free and RoHS directive compliant
■Agency approvals/Compliance
1. Compliant with RoHS directive
■Applications
1. General purpose detection of object presence or mo-
tion.
2. Example : Printer, FAX, Optical storage unit
* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-
processing
2
Sheet No.: D3-A03801EN
GP1A53HRJ00F
■Internal Connection Diagram
■Outline Dimensions (Unit : mm)
Product mass : approx. 0.7g
1
2
1
2
3
3
4
4
5
5
Voltage regulator
Amp
Anode
Cathode
VCC
VO
GND
(15kΩ)
Top view
• Unspecified tolerance shall be as
follows ;
Dimensions(d)
Tolerance
d≤6
±0.1
6<d≤18
±0.2
• ( ) : Reference dimensions
10
7.5
5−0.4+0.3
−0.1
5+0.2
−0.1
13.7±0.3
A53
(1.5)
(10.3)
23
15
4
B
A
AʼBʼ
Sharp mark “S”
Model No.
5.2
2.5
(Detctor center)
(1.27)(1.27)
C1
5−0.45+0.3
−0.1
10MIN.
Date
code
B-Bʼ
section
3.5
0.5
1.5
A-Aʼ
section
0.5
Model
code
E
Top view
Dip soldering material : Sn−3Ag−0.5Cu
3
Sheet No.: D3-A03801EN
GP1A53HRJ00F
Date code
Month of production
Month Mark
11
22
33
44
55
66
77
88
99
10 X
11 Y
12 Z
Country of origin
Japan, Indonesia or Philippines
(Indicated on the packing case)
Model code Year of production
(Christian year)
E Even year
e Odd year
4
Sheet No.: D3-A03801EN
GP1A53HRJ00F
(Ta=25˚C )
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input Forward voltage VFIF=8mA −1.14 1.4 V
Reverse current IRVR=3V −−
10 μA
Output
Operating supply voltage VCC −4.5 −17 V
Low level output voltage VOL VCC=5V, IOL=16mA, IF=0−0.15 0.4 V
High level output voltage VOH VCC=5V, IF=8mA 4.9 −−V
Low level supply current ICCL VCC=5V, IF=0−1.7 3.8 mA
High level supply current ICCH VCC=5V, IF=8mA −0.7 2.2 mA
Transfer
charac-
teristics
∗4
"Low→High" threshold input current
IFLH VCC=5V −1.5 8 mA
∗5
Hysteresis
IFHL/IFLH VCC=5V 0.55 0.75 0.95 −
Responce time
6
∗
"Low→High" Propagation delay time
tPLH
VCC=5V, IF=8mA, RL=280Ω
−39
μs
"High→Low" Propagation delay time
tPHL −515
Rise time tr−0.1 0.5
Fall time tf−0.05 0.5
∗4 IFLH represents forward current when output goes from "Low" to "High".
∗5 IFHL represents forward current when output goes from "High" to "Low".
∗6 Test circuit for response time is shown in Fig.12.
■Absolute Maximum Ratings
■Electro-optical Characteristics
(Ta=25˚C)
Parameter Symbol Rating Unit
Input
∗1 Forward current IF50 mA
∗1, 2Peak forward current IFM 1A
Reverse voltage VR6V
Power dissipation P 75 mW
Output
Supply voltage VCC −0.5 to +17 V
Output current IO50 mA
Power dissipation PO250 mW
Operating temperature Topr −25 to +85 ˚C
Storage temperature Tstg −40 to +100 ˚C
∗3Soldering temperature Tsol 260 ˚C
∗1
The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1, 2, 3
∗2 Pulse width ≤ 100μs, Duty ratio=0.01
∗3 For 5s or less
5
Sheet No.: D3-A03801EN
GP1A53HRJ00F
Fig.4 Forward Current vs. Forward Voltage
Fig.5 Relative Threshold Input Current vs.
Supply Voltage
Fig.2 Output Power Dissipation vs.
Ambient Temperature
Fig.3 Low Level Output Current vs.
Ambient Temperature
Fig.1 Forward Current vs.
Ambient Temperature
Fig.6 Relative Threshold Input Current vs.
Ambient Temperature
Output power dissipation PO (mW)
0
150
300
100
50
200
250
−25 0 7525 50 85 100
Ambient temperature Ta (C)
0 25507585100
−20
60
50
40
30
20
10
0
Ambient temperature Ta (˚C)
Low level output current IOL (mA)
Forward current IF (mA)
Foward voltage VF (V)
100
10
1
3.532.521.510.50
25˚C
0˚C
−25˚C
50˚C
Ta=75˚C
Relative threshold input current IFHL,IFLH
Supply voltage VCC (V)
Ta=25˚C
IFLH=1
at VCC=5V
0.5
1.1
1
0.9
0.8
0.7
0.6
0 5 10 15 20 25
IFHL
IFLH
0.4
−25 1007550250
1.6
1.4
1.2
1
0.8
0.6
Relative threshold input current IFHL,IFLH
Ambient temperature Ta (˚C)
VCC=5V
IFLH=1
at Ta=25˚C
IFHL
IFLH
Forward current IF (mA)
Ambient temperature Ta (˚C)
−25 0 25 50 75 85 100
0
10
20
30
40
50
60
6
Sheet No.: D3-A03801EN
GP1A53HRJ00F
Fig.7 Low Level Output Voltage vs.
Low Level Output Current
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Fig.8 Low Level Output Voltage vs.
Ambient Temperature
Fig.9 Supply Current vs.
Ambient Temperature
Fig.10 Propagation Delay Time vs.
Forward Current
Fig.11 Rise Time,Fall Time vs.
Load Resistance
Fig.12 Test Circuit for Response Time
0.6
0.5
0.1
0
0.2
0.3
0.4
Ambient temperature Ta (˚C)
100755025
0
−25
16mA
5mA
Low level output voltage VOL (V)
VCC=5V
IOL=30mA
5V
10V
−25 025 50 75 100
2
1
0
3
10V 5V
Supply current ICC (mA)
Ambient temperature Ta (˚C)
VCC=17V
ICCL
ICCH
VCC=17V
0
50400302010
2
4
8
6
60
Forward current IF (mA)
Propagation delay time tPLH, tPHL (μs)
tPLH
tPHL
12
10
VCC=5V
RL=280Ω
Ta=25˚C
0.1
0.6
0.7
0.8
110
0.5
0.4
0.3
0
0.1
0.2
Ta=25˚C
VCC=5V
IF=5mA
Rise time, fall time tr, tf (μs)
Load resistance RL (kΩ)
tr
tf
10%
90%
50%
1.5V
Input
Output
Input
47Ω
Voltage regulator
Amp.
+5V
Output
0.01μF
280Ω
GND
tr=tf=0.01μs
tPLH
tr
tPHL
VOH
VOL
tf
(15kΩ)
ZO=50Ω
1 10 100
1
0.1
0.01
VCC=5V
Ta=25˚C
Low level output voltage VOL (V)
Low level output current IOL (mA)
7
Sheet No.: D3-A03801EN
GP1A53HRJ00F
■Design Considerations
●Recommended operating conditions
Parameter Symbol MIN. TYP. MAX. Unit
Output current IO−−
16 mA
Forward current IF10 −20 mA
Operating terperature Topr 0−70 ˚C
●Notes about static electricity
Transisiter of detector side in bipolar confi guration may be damaged by static electricity due to its minute
design.
When handing these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
●Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01μF between VCC and
GND near the device.
3) Position of opaque board
Opaque board shall be installed at place 4mm or more from the top of elements.
(Example)
4mm or more
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
8
Sheet No.: D3-A03801EN
GP1A53HRJ00F
●Parts
This product is assembled using the below parts.
• Photodetector (qty. : 1)
[Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit]
Category Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm) Response time (μs)
Photodiode 900 400 to 1 200 3
• Photo emitter (qty. : 1)
Category Material Maximum light emitting
wavelength (nm) I/O Frequency (MHz)
Infrared emitting diode
(non-coherent) Gallium arsenide (GaAs) 950 0.3
• Material
Case Lead frame plating
Black NORYL resin Solder dip. (Sn−3Ag−0.5Cu)
• Others
Laser generator is not used.
9
Sheet No.: D3-A03801EN
GP1A53HRJ00F
■Manufacturing Guidelines
●Soldering Method
Flow Soldering:
Soldering should be completed below 260˚C and within 5 s.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by refl ow.
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Flux
Some fl ux, which is used in soldering, may crack the package due to synergistic effect of alcohol in fl ux and
the rise in temperature by heat in soldering. Therefore, in using fl ux, please make sure that it does not have
any infl uence on appearance and reliability of the photointerrupter.
10
Sheet No.: D3-A03801EN
GP1A53HRJ00F
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning
time, PCB size or device mounting condition etc.
Please test it in actual using condition and confi rm that doesn't occur any defect before starting the ultrasonic
cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
11
Sheet No.: D3-A03801EN
GP1A53HRJ00F
■Package specifi cation
●Case package
Package materials
Anti-static plastic bag : Polyethtylene
Moltopren : Urethane
Partition : Corrugated fi berboard
Packing case : Corrugated fi berboard
Package method
100 pcs of products shall be packaged in a plastic bag, Ends shall be fi xed by stoppers. The bottom ot the
packing case is covered with moltopren, and the partition is set in the packing case. Each partition should
have 1 plastic bag.
The 10 plastic bags containing a product are put in the packing case.
Moltopren should be located after all product are settled (1 packing contains 1 000 pcs).
Packing composition
Moltopren
Partition
Anti-static
plastic bag
Packing case
12
Sheet No.: D3-A03801EN
GP1A53HRJ00F
■Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifi cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specifi ed in the relevant specifi cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Offi ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffi c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[H163]
