Semiconductor Components Industries, LLC, 2000
October, 2000 – Rev. 2 1Publication Order Number:
MBRF20200CT/D
MBRF20200CT
Preferred Device
SWITCHMODE
Schottky Power Rectifier
The SWITCHMODE Power Rectifier employs the Schottky Barrier
principle in a large area metal–to–silicon power diode.
State–of–the–art geometry features epitaxial construction with oxide
passivation and metal overlay contact. Ideally suited for use as
rectifiers in very low–voltage, high–frequency switching power
supplies, free wheeling diodes and polarity protection diodes.
•Highly Stable Oxide Passivated Junction
•Very Low Forward Voltage Drop
•Matched Dual Die Construction
•High Junction Temperature Capability
•High dv/dt Capability
•Excellent Ability to Withstand Reverse Avalanche Energy Transients
•Guardring for Stress Protection
•Epoxy Meets UL94, VO at 1/8″
•Electrically Isolated. No Isolation Hardware Required.
•UL Recognized File #E69369
Mechanical Characteristics
•Case: Epoxy, Molded
•Weight: 1.9 grams (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Shipped 50 units per plastic tube
•Marking: B20200
MAXIMUM RATINGS
Please See the Table on the Following Page
Device Package Shipping
ORDERING INFORMATION
MBRF20200CT TO–220
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ISOLATED TO–220
CASE 221D
STYLE 3
50 Units/Rail
3
1
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
200 VOLTS
2
Preferred devices are recommended choices for future use
and best overall value.
2
1
3
MARKING DIAGRAM
B20200
B20200= Device Code
MBRF20200CT
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2
MAXIMUM RATINGS (Per Leg)
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 Volts
Average Rectified Forward Current Per Leg
(Rated VR) TC = 125°C Per Package IF(AV) 10
20 Amps
Peak Repetitive Forward Current, Per Leg
(Rated VR, Square Wave, 20 kHz) TC = 90°CIFRM 20 Amps
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) IRRM 1.0 Amp
Operating Junction Temperature and Storage Temperature TJ, Tstg –65 to +150 °C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/µs
THERMAL CHARACTERISTICS (Per Leg)
Thermal Resistance — Junction to Case RθJC 3.5 °C/W
ELECTRICAL CHARACTERISTICS (Per Leg)
Rating Symbol Max Unit
Maximum Instantaneous Forward Voltage (Note 1.)
(iF = 10 Amp, TC = 25°C)
(iF = 10 Amp, TC = 125°C)
(iF = 20 Amp, TC = 25°C)
(iF = 20 Amp, TC = 125°C)
vF0.9
0.8
1.0
0.9
Volts
Maximum Instantaneous Reverse Current (Note 1.)
(Rated dc Voltage, TC = 25°C)
(Rated dc Voltage, TC = 125°C)
iR1.0
50
mA
DYNAMIC CHARACTERISTICS (Per Leg)
Capacitance (VR = –5.0 V, TC = 25°C, Freq. = 1.0 MHz) CT500 pF
1. Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%
Figure 1. Typical Forward Voltage (Per Leg)
100
70
50
20
10
7
5
2
10.2 0.4 0.6 0.8 1
TJ = 125°C
TJ = 100°C
TJ = 25°C
vF, INSTANTANEOUS VOLTAGE (VOLTS)
TJ = 150°C
I , INSTANEOUS FORWARD CURRENT (AMP)
F
I , REVERSE CURRENT ( A)
Rµ
VR, REVERSE CURRENT (VOLTS)
10,000
1,000
100
10
1
0.1
0.01 20 40 60 80 100 120 140 160 180 200
TJ = 125°C
TJ = 100°C
TJ = 150°C
TJ = 25°C
Figure 2. Typical Reverse Current (Per Leg)
0
MBRF20200CT
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3
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110″ MIN
Figure 3. Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together.
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP 0.107″ MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107″ MIN
Figure 4. Clip Mounting Position
for Isolation Test Number 2 Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4-40 SCREW
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
CLIP
HEATSINK
Figure 6. Typical Mounting Techniques
6a. Screw–Mounted 6b. Clip–Mounted
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting
technique, a screw torque of 6 to 8 in .lbs is sufficient to provide maximum power dissipation capability. The compression
washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20
in .lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 2 0 i n.lbs without adversely affecting
the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does
not recommend exceeding 10 in .lbs of mounting torque under any mounting conditions.
**For more information about mounting power semiconductors see Application Note AN1040.
MBRF20200CT
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4
PACKAGE DIMENSIONS
TO–220
FULLPAK
CASE 221D–02
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.621 0.629 15.78 15.97
INCHES
B0.394 0.402 10.01 10.21
C0.181 0.189 4.60 4.80
D0.026 0.034 0.67 0.86
F0.121 0.129 3.08 3.27
G0.100 BSC 2.54 BSC
H0.123 0.129 3.13 3.27
J0.018 0.025 0.46 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.14 1.52
N0.200 BSC 5.08 BSC
Q0.126 0.134 3.21 3.40
R0.107 0.111 2.72 2.81
S0.096 0.104 2.44 2.64
U0.259 0.267 6.58 6.78
–B–
–Y–
G
N
DL
KH
A
F
Q
3 PL
123
M
B
M
0.25 (0.010) Y
SEATING
PLANE
–T–
U
CS
JR
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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For additional information, please contact your local
Sales Representative.
MBRF20200CT/D
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
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