ULQ2003A-Q1 ULQ2004A-Q1 www.ti.com SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 HIGH-VOLTAGE HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS Check for Samples: ULQ2003A-Q1, ULQ2004A-Q1 FEATURES 1 * * * * * * * D OR PW PACKAGE (TOP VIEW) Qualified for Automotive Applications ESD Protection Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) 500-mA-Rated Collector Current (Single Output) High-Voltage Outputs: 50 V Output Clamp Diodes Inputs Compatible With Various Types of Logic Relay-Driver Applications 1B 2B 3B 4B 5B 6B 7B E 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1C 2C 3C 4C 5C 6C 7C COM DESCRIPTION The ULQ2003A and ULQ2004A are high-voltage high-current Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers. The ULQ2003A has a 2.7-k series base resistor for each Darlington pair, for operation directly with TTL or 5-V CMOS devices. The ULQ2004A has a 10.5-k series base resistor to allow operation directly from CMOS devices that use supply voltages of 6 V to 15 V. The required input current of the ULQ2004A is below that of the ULQ2003A. ORDERING INFORMATION (1) PACKAGE (2) TA -40C to 105C -40C to 125C (1) (2) SOIC - D ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of 40 ULQ2003ATDQ1 Reel of 2500 ULQ2003ATDRQ1 Tube of 40 ULQ2004ATDQ1 Product Preview ULQ2003AT Reel of 2500 ULQ2004ATDRQ1 ULQ2004AT TSSOP - PW Reel of 2000 ULQ2003ATPWRQ1 U2003AT SOIC - D Reel of 2500 ULQ2003AQDRQ1 ULQ2003AQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2002-2010, Texas Instruments Incorporated ULQ2003A-Q1 ULQ2004A-Q1 SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 www.ti.com LOGIC DIAGRAM 9 COM 16 1 1C 1B 15 2 2C 2B 14 3 3C 3B 13 4 4C 4B 12 5 5C 5B 6 11 6C 6B 7 10 7C 7B SCHEMATICS (EACH DARLINGTON PAIR) RB ULQ2003A: RB = 2.7 kW ULQ2004A: RB = 10.5 kW 2 7.2 kW 3 kW A. All resistor values shown are nominal. B. The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go below ground an external Schottky diode should be added to clamp negative undershoots. Submit Documentation Feedback Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 ULQ2003A-Q1 ULQ2004A-Q1 www.ti.com SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 ABSOLUTE MAXIMUM RATINGS (1) at 25C free-air temperature (unless otherwise noted) MIN VCC VI V Clamp diode reverse voltage (2) 50 V Input voltage (2) 30 V 500 mA Output clamp current See Figure 14 500 mA Total emitter-terminal current -2.5 A PD Continuous total power dissipation TA Operating free-air temperature range qJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) (4) UNIT 50 Peak collector current IOK MAX Collector-emitter voltage See Dissipation Ratings Table ULQ200xAT -40 105 ULQ200xAQ -40 125 D package (4) 73 PW package 108 -65 150 C C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. DISSIPATION RATINGS PACKAGE TA = 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 85C POWER RATING TA = 105C POWER RATING TA = 125C POWER RATING D 950 mW 7.6 mW/C 494 mW 342 mW 190 mW Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 Submit Documentation Feedback 3 ULQ2003A-Q1 ULQ2004A-Q1 SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) TEST FIGURE PARAMETER TEST CONDITIONS ULQ2003AT MIN ULQ2003AQ TYP MAX MIN ULQ2004AT TYP MAX MIN TYP MAX IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V 5 IC = 200 mA 2.7 2.7 IC = 250 mA 2.9 2.9 6 IC = 275 mA 7 IC = 300 mA 3 Collector-emitter saturation voltage Figure 5 IC = 100 mA 0.9 1.2 1 1.3 0.9 1.1 II = 350 mA, IC = 200 mA 1 1.4 1 1.5 1 1.3 II = 500 mA, IC = 350 mA 1.2 1.7 1.2 1.8 1.2 1.6 Figure 1 Figure 2 VCE = 50 V VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, IC = 500 mA II Input current Figure 4 ICEX Collector cutoff current 8 II = 250 mA, VCE = 50 V, TA = 25C II = 0 TA = 105C 100 100 II = 0 100 VI = 1 V 500 1.7 30 2.2 1.7 65 0.93 30 1.35 2.2 65 0.93 1.7 50 65 Ci Input capacitance Figure 7 VR = 50 V VI = 0, f = 1 MHz 15 0.5 1 1.45 100 100 50 100 100 100 25 15 V mA 0.35 VI = 12 V Clamp reverse current 2.1 mA 1.35 VI = 5 V TA = 25C V 50 165 VI = 3.85 V IR V 3 IC = 350 mA VCE(sat) UNIT 25 15 25 mA mA pF SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS ULQ2003A, ULQ2004A MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 ms tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 ms VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 4 Submit Documentation Feedback VS - 500 mV Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 ULQ2003A-Q1 ULQ2004A-Q1 www.ti.com SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 PARAMETER MEASUREMENT INFORMATION Open Open VCE ICEX VCE ICEX Open VI Figure 1. ICEX Test Circuit Open Figure 2. ICEX Test Circuit Open VCE II(off) II(on) IC Open VI Figure 3. II(off) Test Circuit C. Figure 4. II Test Circuit II is fixed for measuring VCE(sat), variable for measuring hFE. Open hFE = IC II VCE II Open Figure 5. hFE, VCE(sat) Test Circuit VI(on) IC VCE IC Figure 6. VI(on) Test Circuit VR IR VF IF Open Open Figure 7. IR Test Circuit Figure 8. VF Test Circuit Figure 9. Propagation Delay-Time Waveforms Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 Submit Documentation Feedback 5 ULQ2003A-Q1 ULQ2004A-Q1 SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 200 W 10 ns 5 ns 90% 1.5 V Input VIH (see Note C) 90% 1.5 V 10% 10% 0V 40 s VOH Output VOL VOLTAGE WAVEFORMS A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 . B. CL includes probe and jig capacitance. C. For testing the ULQ2003A, VIH = 3 V; for the ULQ2004A, VIH = 8 V. Figure 10. Latch-Up Test Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 ULQ2003A-Q1 ULQ2004A-Q1 www.ti.com SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 TYPICAL CHARACTERISTICS VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V 2.5 TA = 25C 2 II = 250 A II = 350 A II = 500 A 1.5 1 0.5 0 0 100 200 300 400 500 600 700 800 VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V COLLECTOR-EMITTER SATURATION VOLTAGE vs TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN PARALLEL) COLLECTOR-EMITTER SATURATION VOLTAGE vs COLLECTOR CURRENT (ONE DARLINGTON) 2.5 TA = 25C II = 350 A 1.5 II = 500 A 1 0.5 0 0 100 200 300 400 500 600 700 800 IC(tot) - Total Collector Current - mA IC - Collector Current - mA Figure 11. Figure 12. COLLECTOR CURRENT vs INPUT CURRENT D PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE 600 500 IIC C - Maximum Collector Current - mA RL = 10 TA = 25C 450 IC IC - Collector Current - mA II = 250 A 2 400 VS = 10 V 350 VS = 8 V 300 250 200 150 100 50 0 500 N=1 400 N=4 N=3 300 N=2 N=6 200 N = 7 N=5 100 TA = 70C N = Number of Outputs Conducting Simultaneously 0 0 25 50 75 100 125 150 175 200 0 10 20 II - Input Current - A Figure 13. 30 40 50 60 70 80 90 100 Duty Cycle - % Figure 14. Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 Submit Documentation Feedback 7 ULQ2003A-Q1 ULQ2004A-Q1 SGLS148D - DECEMBER 2002 - REVISED APRIL 2010 www.ti.com APPLICATION INFORMATION ULQ2003A VCC VDD V V ULQ2004A 1 16 1 16 2 15 2 15 3 14 3 14 4 13 4 13 5 12 5 12 6 11 6 11 7 10 7 10 8 9 8 9 Lam Test TTL Output Figure 15. TTL to Load CMOS Output Figure 16. Buffer for Higher Current Loads VCC V ULQ2003A RP 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 TTL Output Figure 17. Use of Pullup Resistors to Increase Drive Current 8 Submit Documentation Feedback Copyright (c) 2002-2010, Texas Instruments Incorporated Product Folder Link(s): ULQ2003A-Q1 ULQ2004A-Q1 PACKAGE OPTION ADDENDUM www.ti.com 31-Dec-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ULQ2003AQDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ATDG4Q1 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ATDQ1 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ATDRG4Q1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ATDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ATPWRQ1 ACTIVE TSSOP PW 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004ATDRG4Q1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004ATDRQ1 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 31-Dec-2011 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF ULQ2003A-Q1, ULQ2004A-Q1 : * Catalog: ULQ2003A, ULQ2004A NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device ULQ2003ATPWRQ1 Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ULQ2003ATPWRQ1 TSSOP PW 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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