2N5060-D - ON Semiconductor

 Semiconductor Components Industries, LLC, 2000

May, 2000 – Rev. 4 1Publication Order Number:

2N5060/D

2N5060 Series

Preferred Device

Sensitive Gate

Silicon Controlled Rectifiers

Reverse Blocking Thyristors

Annular PNPN devices designed for high volume consumer

applications such as relay and lamp drivers, small motor controls, gate

drivers for larger thyristors, and sensing and detection circuits.

Supplied in an inexpensive plastic TO-226AA (TO-92) package

which is readily adaptable for use in automatic insertion equipment.

•Sensitive Gate Trigger Current — 200 µA Maximum

•Low Reverse and Forward Blocking Current — 50 µA Maximum,

TC = 110°C

•Low Holding Current — 5 mA Maximum

•Passivated Surface for Reliability and Uniformity

•Device Marking: Device Type, e.g., 2N5060, Date Code

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating Symbol Value Unit

Peak Repetitive Off–State Voltage(1)

(TJ =

40 to 110°C, Sine W ave,

50 to 60 Hz, Gate Open) 2N5060

2N5061

2N5062

2N5064

VDRM,

VRRM 30

100

200

Volts

On-State Current RMS

(180° Conduction Angles; TC = 80°C) IT(RMS) 0.8 Amp

*Average On-State Current

(180° Conduction Angles)

(TC = 67°C)

(TC = 102°C)

IT(AV)

0.51

0.255

Amp

*Peak Non-repetitive Surge Current,

TA = 25°C

(1/2 cycle, Sine W ave, 60 Hz)

ITSM 10 Amps

Circuit Fusing Considerations (t = 8.3 ms) I2t 0.4 A2s

*Forward Peak Gate Power

(Pulse Width

1.0 µsec; TA = 25°C) PGM 0.1 Watt

*Forward Average Gate Power

(TA = 25°C, t = 8.3 ms) PG(AV) 0.01 Watt

*Forward Peak Gate Current

(Pulse Width

1.0 µsec; TA = 25°C) IGM 1.0 Amp

*Reverse Peak Gate Voltage

(Pulse Width

1.0 µsec; TA = 25°C) VRGM 5.0 Volts

*Operating Junction Temperature Range TJ–40 to

+110 °C

*Storage Temperature Range Tstg –40 to

+150 °C

*Indicates JEDEC Registered Data.

(1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings

apply for zero or negative gate voltage; however, positive gate voltage shall

not be applied concurrent with negative potential on the anode. Blocking

voltages shall not be tested with a constant current source such that the

voltage ratings of the devices are exceeded.

SCRs

0.8 AMPERES RMS

30 thru 200 VOLTS

Preferred devices are recommended choices for future use

and best overall value.

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TO–92 (TO–226AA)

CASE 029

STYLE 10

PIN ASSIGNMENT

Gate

Anode

Cathode

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

2N5060 Series

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THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

*Thermal Resistance, Junction to Case(1) RθJC 75 °C/W

Thermal Resistance, Junction to Ambient RθJA 200 °C/W

*Lead Solder Temperature

(Lead Length

1/16″ from case, 10 s Max) — +230* °C

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

*Peak Repetitive Forward or Reverse Blocking Current(2)

(VAK = Rated VDRM or VRRM)T

C = 25°C

TC = 110°C

IDRM, IRRM —

——

—10

50 µA

µA

ON CHARACTERISTICS

*Peak Forward On–State Voltage(3)

(ITM = 1.2 A peak @ TA = 25°C) VTM — — 1.7 Volts

Gate Trigger Current (Continuous dc)(4)

*(VAK = 7 Vdc, RL = 100 Ohms) TC = 25°C

TC = –40°C

IGT —

——

—200

350

µA

Gate Trigger Voltage (Continuous dc)(4) TC = 25°C

*(VAK = 7 Vdc, RL = 100 Ohms) TC = –40°CVGT —

——

—0.8

1.2 Volts

*Gate Non–Trigger Voltage

(VAK = Rated VDRM, RL = 100 Ohms) TC = 110°CVGD 0.1 — — Volts

Holding Current(4) TC = 25°C

*(VAK = 7 Vdc, initiating current = 20 mA) TC = –40°CIH—

——

—5.0

10 mA

Turn-On Time

Delay T ime

Rise T ime

(IGT = 1 mA, VD = Rated VDRM,

Forward Current = 1 A, di/dt = 6 A/µs

tr—

—3.0

0.2 —

—

µs

Turn-Off Time

(Forward Current = 1 A pulse,

Pulse Width = 50 µs,

0.1% Duty Cycle, di/dt = 6 A/µs,

dv/dt = 20 V/µs, IGT = 1 mA) 2N5060, 2N5061

2N5062, 2N5064

—

—10

30 —

—

µs

DYNAMIC CHARACTERISTICS

Critical Rate of Rise of Off–State Voltage

(Rated VDRM, Exponential) dv/dt — 30 — V/µs

*Indicates JEDEC Registered Data.

(1) This measurement is made with the case mounted “flat side down” on a heat sink and held in position by means of a metal clamp over the

curved surface.

(2) RGK = 1000 Ω is included in measurement.

(3) Forward current applied for 1 ms maximum duration, duty cycle

1%.

(4) RGK current is not included in measurement.

2N5060 Series

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+ Current

+ Voltage

VTM

IDRM at VDRM

Symbol Parameter

VDRM Peak Repetitive Off State Forward Voltage

IDRM Peak Forward Blocking Current

VRRM Peak Repetitive Off State Reverse Voltage

IRRM Peak Reverse Blocking Current

VTM Peak on State Voltage

IHHolding Current

Voltage Current Characteristic of SCR

Anode +

on state

Reverse Blocking Region

(off state)

Reverse Avalanche Region

Anode –

Forward Blocking Region

IRRM at VRRM

(off state)

120

100

110

0 0.1 0.2 0.3 0.4

130

0.5

IT(AV), A VERAGE ON-STATE CURRENT (AMP)

110

130

0 0.1 0.2 0.3 0.4

IT(AV), A VERAGE ON-STATE CURRENT (AMP)

TC, MAXIMUM ALLOW ABLE CASE TEMPERATURE ( C)

TA, MAXIMUM ALLOWABLE AMBIENT

TEMPERATURE ( C)

α = 30°

α = 30°60°90°

90°

120°

120°180°

CASE MEASUREMENT

POINT – CENTER OF

FLAT PORTION

60°

180°

TYPICAL PRINTED

CIRCUIT BOARD

MOUNTING

α = CONDUCTION ANGLE

Figure 1. Maximum Case Temperature Figure 2. Maximum Ambient Temperature

CURRENT DERATING

2N5060 Series

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P(AV), MAXIMUM AVERAGE POWER

DISSIPATION (WATTS)

5.0

0.05

0.01

0.02

0 0.5 1.0 1.5 2.0

3.0

2.5

vT, INST ANTANEOUS ON-STATE VOLTAGE (VOLTS)

0.07

0.03

0.1

0.2

0.3

0.5

0.7

1.0

2.0

5.0

25°C

TJ = 110°C

7.0

1.0

3.0

2.0

1.0 2.0 3.0 5.0 7.0 10 20 50 70 100

0.2

0.4

0.6 a

0.1 0.4

0.8

0 0.2 0.5

α = CONDUCTION ANGLE

0.3

NUMBER OF CYCLES

IT(AV), A VERAGE ON-STATE CURRENT (AMP)

iT, INSTANT ANEOUS ON-STA TE CURRENT (AMP)

ITSM, PEAK SURGE CURRENT (AMP)

α = 30°

60°90°120°180°

Figure 3. Typical Forward Voltage

Figure 4. Maximum Non–Repetitive Surge Current

Figure 5. Power Dissipation

0.02 0.2 20105.02.01.00.050.010.002 0.005 0.5

0.02

0.01

0.5

0.1

0.05

0.1

0.2

t, TIME (SECONDS)

1.0

r(t), TRANSIENT THERMAL RESISTANCE NORMALIZED

Figure 6. Thermal Response

CURRENT DERATING

2N5060 Series

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0.7

0.3

0.4

0.5

0.6

0.8 VAK = 7.0 V

RL = 100

RGK = 1.0 k

3.0

0.8

0.4

0.6

1.0

2.0

500–75 –50 –25

4.0

25 10075 110

TJ, JUNCTION TEMPERATURE (°C)

2N5060,61

100

VAK = 7.0 V

RL = 100

RGK = 1.0 k

0.2

0.5

1.0

2.0

5.0

200 VAK = 7.0 V

RL = 100

2N5062-64

2N5060-61

TYPICAL CHARACTERISTICS

500–75 –50 –25 25 10075 110

TJ, JUNCTION TEMPERATURE (°C) 500–75 –50 –25 25 10075 110

TJ, JUNCTION TEMPERATURE (°C)

VG, GATE TRIGGER VOLTAGE (VOL TS)

IGT, GATE TRIGGER CURRENT (NORMALIZED)

IH, HOLDING CURRENT (NORMALIZED)

Figure 7. Typical Gate Trigger Voltage Figure 8. Typical Gate Trigger Current

Figure 9. Typical Holding Current

2N5062-64

2N5060 Series

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TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL

H2A H2A

F1 F2

P2 P2

P1 P

H2B H2B

H4 H5

Figure 10. Device Positioning on Tape

Specification

Inches Millimeter

Symbol Item Min Max Min Max

DTape Feedhole Diameter 0.1496 0.1653 3.8 4.2

D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51

F1, F2 Component Lead Pitch 0.0945 0.110 2.4 2.8

HBottom of Component to Seating Plane .059 .156 1.5 4.0

H1 Feedhole Location 0.3346 0.3741 8.5 9.5

H2A Deflection Left or Right 0 0.039 0 1.0

H2B Deflection Front or Rear 0 0.051 0 1.0

H4 Feedhole to Bottom of Component 0.7086 0.768 18 19.5

H5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5

LDefective Unit Clipped Dimension 0.3346 0.433 8.5 11

L1 Lead Wire Enclosure 0.09842 — 2.5 —

PFeedhole Pitch 0.4921 0.5079 12.5 12.9

P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75

P2 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95

TAdhesive Tape Thickness 0.06 0.08 0.15 0.20

T1 Overall Taped Package Thickness — 0.0567 — 1.44

T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65

WCarrier Strip Width 0.6889 0.7481 17.5 19

W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3

W2 Adhesive Tape Position .0059 0.01968 .15 0.5

NOTES:

1. Maximum alignment deviation between leads not to be greater than 0.2 mm.

2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 1 1 mm.

3. Component lead to tape adhesion must meet the pull test requirements.

4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.

5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.

6. No more than 1 consecutive missing component is permitted.

7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.

8. Splices will not interfere with the sprocket feed holes.

2N5060 Series

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ORDERING & SHIPPING INFORMATION: 2N5060 Series packaging options, Device Suffix

U.S. Europe

Equivalent Shipping Description of TO92 Tape Orientation

2N5060,61,62,64

2N5060,61,62,64RLRA

2N5060,64RLRM 2N5060RL1

Bulk in Box (5K/Box)

Radial Tape and Reel (2K/Reel)

Radial Tape and Fan Fold Box (2K/Box)

N/A, Bulk

Round side of TO92 and adhesive tape visible

Flat side of TO92 and adhesive tape visible

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SECTION X–X

SEATING

PLANE DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.175 0.205 4.45 5.20

B0.170 0.210 4.32 5.33

C0.125 0.165 3.18 4.19

D0.016 0.021 0.407 0.533

G0.045 0.055 1.15 1.39

H0.095 0.105 2.42 2.66

J0.015 0.020 0.39 0.50

K0.500 ––– 12.70 –––

L0.250 ––– 6.35 –––

N0.080 0.105 2.04 2.66

P––– 0.100 ––– 2.54

R0.115 ––– 2.93 –––

V0.135 ––– 3.43 –––

STYLE 10:

PIN 1. CATHODE

2. GATE

3. ANODE

TO–92 (TO–226AA)

CASE 029–11

ISSUE AJ

2N5060 Series

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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular

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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “T ypicals” must be

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For additional information, please contact your local

Sales Representative.

2N5060/D

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