© Semiconductor Components Industries, LLC, 1994
October, 2016 − Rev. 11 1Publication Order Number:
MMBT2222LT1/D
MMBT2222L, MMBT2222AL,
SMMBT2222AL
General Purpose Transistors
NPN Silicon
Features
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage MMBT2222L
MMBT2222AL, SMMBT2222AL
VCEO 30
40
Vdc
CollectorBase Voltage MMBT2222L
MMBT2222AL, SMMBT2222AL
VCBO 60
75
Vdc
EmitterBase Voltage MMBT2222L
MMBT2222AL, SMMBT2222AL
VEBO 5.0
6.0
Vdc
Collector Current − Continuous IC600 mAdc
Collector Current − Peak (Note 3) ICM 1100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board
(Note 1) TA = 25°C
Derate above 25°C
PD225
1.8 mW
mW/°C
Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W
Total Device Dissipation Alumina
Substrate (Note 2) TA = 25°C
Derate above 25°C
PD300
2.4 mW
mW/°C
Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W
Junction and Storage Temperature Range TJ, Tstg 55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be af fected.
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
3. Reference SOA curve.
SOT−23
CASE 318
STYLE 6
MARKING DIAGRAM
xxx = 1P or M1B
M = Date Code*
G= Pb−Free Package
COLLECTOR
3
1
BASE
2
EMITTER
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
1
2
1
3
xxx M G
G
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MMBT2222L, MMBT2222AL, SMMBT2222AL
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (IC = 10 mAdc, IB = 0) MMBT2222
MMBT2222A V(BR)CEO 30
40
Vdc
CollectorBase Breakdown Voltage (IC = 10 mAdc, IE = 0) MMBT2222
MMBT2222A V(BR)CBO 60
75
Vdc
EmitterBase Breakdown Voltage (IE = 10 mAdc, IC = 0) MMBT2222
MMBT2222A V(BR)EBO 5.0
6.0
Vdc
Collector Cutoff Current
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MMBT2222A, SMMBT2222A ICEX 10 nAdc
Collector Cutoff Current (VCB = 50 Vdc, IE = 0) MMBT2222
(VCB = 60 Vdc, IE = 0) MMBT2222A, SMMBT2222A
(VCB = 50 Vdc, IE = 0, TA = 125°C) MMBT2222
(VCB = 60 Vdc, IE = 0, TA = 125°C) MMBT2222A, SMMBT2222A
ICBO
0.01
0.01
10
10
mAdc
Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0) MMBT2222A, SMMBT2222A IEBO 100 nAdc
Base Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MMBT2222A, SMMBT2222A IBL 20 nAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = −55°C) MMBT2222A only
(IC = 150 mAdc, VCE = 10 Vdc) (Note 4)
(IC = 150 mAdc, VCE = 1.0 Vdc) (Note 4)
(IC = 500 mAdc, VCE = 10 Vdc) (Note 4) MMBT2222
MMBT2222A, SMMBT2222A
hFE 35
50
75
35
100
50
30
40
300
CollectorEmitter Saturation Voltage (Note 4)
(IC = 150 mAdc, IB = 15 mAdc) MMBT2222
MMBT2222A, SMMBT2222A
(IC = 500 mAdc, IB = 50 mAdc) MMBT2222
MMBT2222A, SMMBT2222A
VCE(sat)
0.4
0.3
1.6
1.0
Vdc
BaseEmitter Saturation Voltage (Note 4)
(IC = 150 mAdc, IB = 15 mAdc) MMBT2222
MMBT2222A, SMMBT2222A
(IC = 500 mAdc, IB = 50 mAdc) MMBT2222
MMBT2222A, SMMBT2222A
VBE(sat)
0.6
1.3
1.2
2.6
2.0
Vdc
SMALL−SIGNAL CHARACTERISTICS
CurrentGain − Bandwidth Product (Note 5)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz) MMBT2222
MMBT2222A, SMMBT2222A
fT250
300
MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cobo 8.0 pF
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) MMBT2222
MMBT2222A, SMMBT2222A
Cibo
30
25
pF
Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
hie 2.0
0.25 8.0
1.25
kW
Voltage Feedback Ratio
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
hre
8.0
4.0
X 10−4
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
hfe 50
75 300
375
MMBT2222L, MMBT2222AL, SMMBT2222AL
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3
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic UnitMaxMinSymbol
SMALL−SIGNAL CHARACTERISTICS
Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A, SMMBT2222A
hoe 5.0
25 35
200
mmhos
Collector Base Time Constant
(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz) MMBT2222A, SMMBT2222A rb, Cc 150 ps
Noise Figure (IC = 100 mAdc, VCE = 10 Vdc, RS = 1.0 kW, f = 1.0 kHz)
MMBT2222A, SMMBT2222A NF 4.0 dB
SWITCHING CHARACTERISTICS (MMBT2222A only)
Delay Time (VCC = 30 Vdc, VBE(off) = −0.5 Vdc,
IC = 150 mAdc, IB1 = 15 mAdc) td 10 ns
Rise Time tr 25
Storage Time (VCC = 30 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc) ts 225 ns
Fall Time tf 60
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
5. fT is defined as the frequency at which |hfe| extrapolates to unity.
Figure 1. Turn−On Time Figure 2. Turn−Off Time
SWITCHING TIME EQUIVALENT TEST CIRCUITS
Scope rise time < 4 ns
*Total shunt capacitance of test jig, connectors, and oscilloscope.
+16 V
-2 V < 2 ns
0
1.0 to 100 ms,
DUTY CYCLE 2.0%
1 kW
+30 V
200
CS* < 10 pF
+16 V
-14 V
0
< 20 ns
1.0 to 100 ms,
DUTY CYCLE 2.0%
1 k
+30 V
200
CS* < 10 pF
-4 V
1N914
1000
10
20
30
50
70
100
200
300
500
700
1.0 k0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 700
IC, COLLECTOR CURRENT (mA)
Figure 3. DC Current Gain
hFE, DC CURRENT GAIN
TJ = 125°C
25°C
-55°C
VCE = 1.0 V
VCE = 10 V
MMBT2222L, MMBT2222AL, SMMBT2222AL
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VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
1.0
0.8
0.6
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50
IB, BASE CURRENT (mA)
Figure 4. Collector Saturation Region
TJ = 25°C
IC = 1.0 mA 10 mA 150 mA 500 mA
Figure 5. TurnOn Time
IC, COLLECTOR CURRENT (mA)
70
100
200
50
t, TIME (ns)
10 20 70
5.0
100
5.0 7.0 30 50 200
10
30
7.0
20
IC/IB = 10
TJ = 25°C
tr @ VCC = 30 V
td @ VEB(off) = 2.0 V
td @ VEB(off) = 0
3.0
2.0
300 500
500
t, TIME (ns)
5.0
7.0
10
20
30
50
70
100
200
300
Figure 6. TurnOff Time
IC, COLLECTOR CURRENT (mA)
10 20 70 1005.0 7.0 30 50 200 300 500
VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25°C
ts = ts - 1/8 tf
tf
Figure 7. Frequency Effects
f, FREQUENCY (kHz)
4.0
6.0
8.0
10
2.0
0.1
Figure 8. Source Resistance Effects
RS, SOURCE RESISTANCE (OHMS)
NF, NOISE FIGURE (dB)
1.0 2.0 5.0 10 20 50
0.2 0.5
0
100
NF, NOISE FIGURE (dB)
0.01 0.02 0.05
RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE
IC = 1.0 mA, RS = 150 W
500 mA, RS = 200 W
100 mA, RS = 2.0 kW
50 mA, RS = 4.0 kW
f = 1.0 kHz
IC = 50 mA
100 mA
500 mA
1.0 mA
4.0
6.0
8.0
10
2.0
0
50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
MMBT2222L, MMBT2222AL, SMMBT2222AL
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Figure 9. Capacitances
REVERSE VOLTAGE (VOLTS)
3.0
5.0
7.0
10
2.0
0.1
CAPACITANCE (pF)
1.0 2.0 3.0 5.0 7.0 10 20 30 50
0.2 0.3 0.5 0.7
Ccb
20
30
Ceb
Figure 10. Current−Gain Bandwidth Product
IC, COLLECTOR CURRENT (mA)
70
100
200
300
50
500
fT, CURRENT-GAIN BANDWIDTH PRODUCT (MHz)
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VCE = 20 V
TJ = 25°C
Figure 11. Collector Emitter Saturation Voltage
vs. Collector Current Figure 12. Base Emitter Saturation Voltage vs.
Collector Current
IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)
10.10.010.001
0.01
0.1
1
1
0.10.010.001
0.2
0.3
0.5
0.7
0.8
1.0
1.1
1.3
Figure 13. Base Emitter Voltage vs. Collector
Current
IC, COLLECTOR CURRENT (A)
10.10.010.001
0.2
0.3
0.5
0.6
0.7
0.9
1.1
1.2
V
CE(sat)
, COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
VBE(sat), BASE−EMITTER
SATURATION VOLTAGE (V)
V
BE(on)
, BASE−EMITTER VOLTAGE (V)
IC/IB = 10
150°C
−55°C
25°C0.4
0.6
0.9
1.2 IC/IB = 10
150°C
−55°C
25°C
0.4
0.8
1.0
VCE = 1 V
150°C
−55°C
25°C
Figure 14. Temperature Coefficients
IC, COLLECTOR CURRENT (mA)
-0.5
0
+0.5
COEFFICIENT (mV/ C)
-1.0
-1.5
-2.5
°
RqVC for VCE(sat)
RqVB for VBE
-2.0
0.1 1.0 2.0 5.0 10 20 500.2 0.5 100 200 50
0
MMBT2222L, MMBT2222AL, SMMBT2222AL
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6
Figure 15. Safe Operating Area
VCE (Vdc)
1001010.10.01
0.001
0.01
0.1
1
10
IC (A)
Single Pulse Test
@ TA = 25°C
Thermal Limit
100 ms
1 s
10 ms
1 ms
ORDERING INFORMATION
Device Specific Marking Code Package Shipping
MMBT2222LT1G M1B SOT−23
(Pb−Free) 3000 / Tape & Reel
MMBT2222ALT1G,
SMMBT2222ALT1G 1P SOT−23
(Pb−Free) 3000 / Tape & Reel
MMBT2222LT3G M1B SOT−23
(Pb−Free) 10,000 / Tape & Reel
MMBT2222ALT3G,
SMMBT2222ALT3G 1P SOT−23
(Pb−Free) 10,000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
MMBT2222L, MMBT2222AL, SMMBT2222AL
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7
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AR
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.000
b0.37 0.44 0.50 0.015
c0.08 0.14 0.20 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.30 0.43 0.55 0.012
0.039 0.044
0.002 0.004
0.017 0.020
0.006 0.008
0.114 0.120
0.051 0.055
0.075 0.080
0.017 0.022
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
HE0.35 0.54 0.69 0.014 0.021 0.027
c0 −−− 10 0 −−− 10
T°°°°
T
3X
TOP VIEW
SIDE VIEW END VIEW
2.90
0.80
DIMENSIONS: MILLIMETERS
0.90
PITCH
3X
3X 0.95
RECOMMENDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
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MMBT2222LT1/D
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