© Semiconductor Components Industries, LLC, 2017
September, 2018 − Rev. 14 1Publication Order Number:
NCS20071/D
NCS20071, NCV20071,
NCS20072, NCV20072,
NCS20074, NCV20074
Operational Amplifier, Rail-
to-Rail Output, 3 MHz BW
The NCx2007x series operational amplifiers provide rail−to−rail
output operation, 3 MHz bandwidth, and are available in single, dual,
and quad configurations. Rail−to−rail operation enables the user to
make optimal use of the entire supply voltage range while taking
advantage of 3 MHz bandwidth. The NCx2007x can operate on supply
voltages as low as 2.7 V over the temperature range of −40°C to
125°C. At a 2.7 V supply, the high bandwidth provides a slew rate of
2.8 V/ms while only consuming 405 mA of quiescent current per
channel. The wide supply range allows the NCx2007x to run on
supply voltages as high as 36 V, making it ideal for a broad range of
applications. Since this is a CMOS device, high input impedance and
low bias currents make it ideal for interfacing to a wide variety of
signal sensors. The NCx2007x devices are available in a variety of
compact packages. Automotive qualified options are available under
the NCV prefix.
Features
•Rail−To−Rail Output
•Wide Supply Range: 2.7 V to 36 V
•Wide Bandwidth: 3 MHz typical at VS = 2.7 V
•High Slew Rate: 2.8 V/ms typical at VS = 2.7 V
•Low Supply Current: 405 mA per channel at VS = 2.7 V
•Low Input Bias Current: 5 pA typical
•Wide Temperature Range: −40°C to 125°C
•Available in a variety of packages
•NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
•Current Sensing
•Signal Conditioning
•Automotive
End Products
•Notebook Computers
•Portable Instruments
•Power Supplies
www.onsemi.com
See detailed ordering and shipping information on page 4 o
f
this data sheet.
ORDERING INFORMATION
1
14
SOIC−14 NB
CASE 751A
SOT−553
CASE 463B
1
5
TSOP−5
CASE 483
Micro8]
CASE 846A
1
8
SOIC−8
CASE 751
TSSOP−8
CASE 948S
1
14
TSSOP−14
CASE 948G
See general marking information in the device marking
section on page 2 of this data sheet.
DEVICE MARKING INFORMATION
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
2
SOIC−14 NB
CASE 751A
NCS20074G
AWLYWW
1
14
SOT−553
CASE 463B
ALMG
G
TSOP−5
CASE 483
1
5
AEAAYWG
G
Micro8]
CASE 846A SOIC−8
CASE 751
NCS20072
ALYW
G
1
8
TSSOP−8
CASE 948S
NCS2
0074
ALYWG
G
1
14
TSSOP−14
CASE 948G
Single Channel Configuration
NCS20071, NCV20071
Dual Channel Configuration
NCS20072, NCV20072
Quad Channel Configuration
NCS20074, NCV20074
XXXXX = Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G= Pb−Free Package
0072
AYWG
G
1
8
(Note: Microdot may be in either location)
MARKING DIAGRAMS
K72
YWW
AG
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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3
1
4
3
2
14
11
12
13
OUT 1
IN− 1
IN+ 1
VDD
OUT 4
IN− 4
IN+ 4
VSS
7
6
5
8
9
10
IN+ 2
IN− 2
OUT 2
IN+ 3
IN− 3
OUT 3
+
−
+
−
−
++
−
Figure 1. Pin Connections
Single Channel Configuration
NCS20071, NCV20071
Dual Channel Configuration
NCS20072, NCV20072
Quadruple Channel Configuration
NCS20074, NCV20074
1
3
2
5
4OUT
IN−
IN+
VSS
VDD
+
−
SOT553−5
1
3
2
5
4
OUT
IN−
IN+
VSS
VDD
+
−
SOT23−5
(TSOP−5)
1
4
3
2
8
5
6
7
OUT 1
IN− 1
IN+ 1
VSS
VDD
OUT 2
IN− 2
IN+ 2
+
+−
−
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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4
ORDERING INFORMATION
Device Configuration Automotive Marking Package Shipping†
NCS20071SN2T1G
Single
No
AEA TSOP−5
(Pb−Free) 3000 / Tape and Reel
NCS20071XV53T2G AL SOT553−5
(Pb−Free) 4000 / Tape and Reel
NCV20071SN2T1G*
Yes
AEA TSOP−5
(Pb−Free) 3000 / Tape and Reel
NCV20071XV53T2G* AL SOT553−5
(Pb−Free) 4000 / Tape and Reel
NCS20072DMR2G
Dual
No
0072 Micro8 (MSOP8)
(Pb−Free) 4000 / Tape and Reel
NCS20072DR2G NCS20072 SOIC−8
(Pb−Free) 2500 / Tape and Reel
NCS20072DTBR2G K72 TSSOP−8
(Pb−Free) 2500 / Tape and Reel
NCV20072DMR2G*
Yes
0072 Micro8 (MSOP8)
(Pb−Free) 4000 / Tape and Reel
NCV20072DR2G* NCS20072 SOIC−8
(Pb−Free) 2500 / Tape and Reel
NCV20072DTBR2G* K72 TSSOP−8
(Pb−Free) 2500 / Tape and Reel
NCS20074DR2G
Quad
No
NCS20074 SOIC−14
(Pb−Free) 2500 / Tape and Reel
NCS20074DTBR2G NCS2
0074 TSSOP−14
(Pb−Free) 2500 / Tape and Reel
NCV20074DR2G*
Yes
NCS20074 SOIC−14
(Pb−Free) 2500 / Tape and Reel
NCV20074DTBR2G* NCS2
0074 TSSOP−14
(Pb−Free) 2500 / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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5
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating Symbol Limit Unit
Supply Voltage (VDD – VSS) (Note 4) VS40 V
Input Voltage VCM VSS − 0.2 to VDD + 0.2 V
Differential Input Voltage (Note 2) VID ±VsV
Maximum Input Current IIN ±10 mA
Maximum Output Current (Note 3) IO±100 mA
Continuous Total Power Dissipation (Note 4) PD200 mW
Maximum Junction Temperature TJ150 °C
Storage Temperature Range TSTG −65 to 150 °C
Mounting Temperature (Infrared or Convection – 20 sec) Tmount 260 °C
ESD Capability (Note 5) Human Body Model
Machine Model − NCx20071
Machine Model − NCx20072, NCx20074
Charged Device Model − NCx20071, NCx20072
Charged Device Model − NCx20074
HBM
MM
MM
CDM
CDM
2000
200
150
2000 (C6)
1000 (C6)
V
Latch−Up Current (Note 6) ILU 100 mA
Moisture Sensitivity Level (Note 7) MSL Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Maximum input current must be limited to ±10 mA. Series connected resistors of at least 500 W on both inputs may be used to limit the
maximum input current to ±10 mA.
3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150°C limit.
4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per JEDEC standard JS-001 (AEC−Q100−002)
ESD Machine Model tested per JEDEC standard JESD22−A115 (AEC−Q100−003)
ESD Charged Device Model tested per JEDEC standard JESD22−C101 (AEC−Q100−011)
6. Latch−up Current tested per JEDEC standard JESD78 (AEC−Q100−004)
7. Moisture Sensitivity Level tested per IPC/JEDEC standard J−STD−020A
THERMAL INFORMATION
Parameter Symbol Package Single Layer
Board (Note 8) Multi−Layer
Board (Note 9) Unit
Junction−to−Ambient qJA
SOT23−5 / TSOP5 265 195
°C/W
SOT553−5 325 244
Micro8 / MSOP8 236 167
SOIC−8 190 131
TSSOP−8 253 194
SOIC−14 142 101
TSSOP−14 179 128
8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area
9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
OPERATING RANGES
Parameter Symbol Min Max Unit
Operating Supply Voltage (Single Supply) VS2.7 36 V
Operating Supply Voltage (Split Supply) VS±1.35 ±18 V
Differential Input Voltage (Note 10) VID VSV
Input Common Mode Voltage Range VCM VSS VDD − 1.35 V
Ambient Temperature TA−40 125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
10.Maximum input current must be limited to ±10 mA. See Absolute Maximum Ratings for more information.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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6
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 11, 12)
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Input Offset Voltage VOS
NCx20071 1.3 ±3.5
mV
+4.5
NCx20072, NCx20074 1.3 ±3
+4
Offset Voltage Drift DVOS/DTTA = 25°C to 125°C 2 mV/°C
Input Bias Current (Note 12) IIB 5 200 pA
1500
Input Offset Current (Note 12) IOS
NCx20071, NCx20072 2 75
pA
500
NCx20074 2 75
200
Channel Separation XTLK DC NCx20072 100 dB
NCx20074 115
Differential Input Resistance RID 5GW
Common Mode Input Resistance RIN 5GW
Differential Input Capacitance CID 1.5 pF
Common Mode Input Capacitance CCM 3.5 pF
Common Mode Rejection Ratio CMRR VCM = VSS + 0.2 V to VDD − 1.35 V 90 110 dB
69
OUTPUT CHARACTERISTICS
Open Loop Voltage Gain AVOL 96 118 dB
86
Output Current Capability (Note 13
)
IOOp amp sinking current 70 mA
Op amp sourcing current 50
Output Voltage High VOH Voltage output swing from positive rail 0.006 0.15 V
0.22
Output Voltage Low VOL Voltage output swing from negative rail 0.005 0.15 V
0.22
AC CHARACTERISTICS
Unity Gain Bandwidth UGBW CL = 25 pF 3 MHz
Slew Rate at Unity Gain SR CL = 20 pF, RL = 2 kW2.8 V/ms
Phase Margin ömCL = 25 pF 50 °
Gain Margin AmCL = 25 pF 14 dB
Settling Time tSVO = 1 Vpp,
Gain = 1, CL = 20 pF Settling time to 0.1% 0.6 ms
Settling time to 0.01% 1.2
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
12.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
13.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
7
ELECTRICAL CHARACTERISTICS AT VS = 2.7 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 11, 12)
Parameter UnitMaxTypMinConditionsSymbol
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise THD+N VIN = 0.5 Vpp, f = 1 kHz, Av = 1 0.05 %
Input Referred Voltage Noise enf = 1 kHz 30 nV/√H
z
f = 10 kHz 20
Input Referred Current Noise inf = 1 kHz 90 fA/√Hz
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR No Load 114 135 dB
100
Power Supply Quiescent Current IDD
NCx20071 No load 420 625
mA
765
NCx20072, NCx2007
4
Per channel, no load 405 525
625
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
12.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
13.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
ELECTRICAL CHARACTERISTICS AT VS = 5 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 14, 15)
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Input Offset Voltage VOS
NCx20071 1.3 ±3.5
mV
+4.5
NCx20072, NCx20074 1.3 ±3
+4
Offset Voltage Drift DVOS/DTTA = 25°C to 125 °C 2 mV/°C
Input Bias Current (Note 15) IIB 5 200 pA
1500
Input Offset Current (Note 15) IOS
NCx20071, NCx20072 2 75
pA
500
NCx20074 2 75
200
Channel Separation XTLK DC NCx20072 100 dB
NCx20074 115
Differential Input Resistance RID 5GW
Common Mode Input Resistance RIN 5GW
Differential Input Capacitance CID 1.5 pF
Common Mode Input Capacitance CCM 3.5 pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
14.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
15.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
16.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
8
ELECTRICAL CHARACTERISTICS AT VS = 5 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 14, 15)
Parameter UnitMaxTypMinConditionsSymbol
INPUT CHARACTERISTICS
Common Mode Rejection Ratio CMRR VCM = VSS + 0.2 V to VDD − 1.35 V 102 125 dB
80
OUTPUT CHARACTERISTICS
Open Loop Voltage Gain AVOL
96 120 dB
86
Output Current Capability (Note 16
)
IOOp amp sinking current 50 mA
Op amp sourcing current 60
Output Voltage High VOH Voltage output swing from positive rail 0.013 0.20 V
0.25
Output Voltage Low VOL Voltage output swing from negative rail 0.01 0.10 V
0.15
AC CHARACTERISTICS
Unity Gain Bandwidth UGBW CL = 25 pF 3 MHz
Slew Rate at Unity Gain SR CL = 20 pF, RL = 2 kW2.7 V/ms
Phase Margin ömCL = 25 pF 50 °
Gain Margin AmCL = 25 pF 14 dB
Settling Time tSVO = 3 Vpp,
Gain = 1, CL = 20 pF Settling time to 0.1% 1.2 ms
Settling time to 0.01% 5.6
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise THD+N VIN = 2.5 Vpp, f = 1 kHz, Av = 1 0.009 %
Input Referred Voltage Noise enf = 1 kHz 30 nV/√H
z
f = 10 kHz 20
Input Referred Current Noise inf = 1 kHz 90 fA/√Hz
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR No Load 114 135 dB
100
Power Supply Quiescent Current IDD
NCx20071 No load 430 635
mA
775
NCx20072, NCx2007
4
Per channel, no load 410 530
630
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
14.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
15.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
16.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
9
ELECTRICAL CHARACTERISTICS AT VS = 10 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 17, 18)
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Input Offset Voltage VOS NCx20071 1.3 ±3.5 mV
+4.5 mV
Input Offset Voltage VOS NCx20072, NCx20074 1.3 ±3 mV
+4 mV
Offset Voltage Drift DVOS/DTTA = 25°C to 125°C 2 mV/°C
Input Bias Current (Note 18) IIB 5 200 pA
1500
Input Offset Current (Note 18) IOS
NCx20071, NCx20072 2 75
pA
500
NCx20074 2 75
200
Channel Separation XTLK DC NCx20072 100 dB
NCx20074 115
Differential Input Resistance RID 5GW
Common Mode Input Resistance RIN 5GW
Differential Input Capacitance CID 1.5 pF
Common Mode Input Capacitance CCM 3.5 pF
Common Mode Rejection Ratio CMRR VCM = VSS + 0.2 V to VDD − 1.35 V 110 130 dB
87
OUTPUT CHARACTERISTICS
Open Loop Voltage Gain AVOL 98 120 dB
88
Output Current Capability (Note 19
)
IOOp amp sinking current 50 mA
Op amp sourcing current 65
Output Voltage High VOH Voltage output swing from positive rail 0.023 0.08 V
0.10
Output Voltage Low VOL Voltage output swing from negative rail 0.022 0.3 V
0.35
AC CHARACTERISTICS
Unity Gain Bandwidth UGBW CL = 25 pF 3 MHz
Slew Rate at Unity Gain SR CL = 20 pF, RL = 2 kW2.6 V/ms
Phase Margin ömCL = 25 pF 50 °
Gain Margin AmCL = 25 pF 14 dB
Settling Time tSVO = 8.5 Vpp,
Gain = 1, CL = 20 pF Settling time to 0.1% 3.4 ms
Settling time to 0.01% 6.8
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
17.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
18.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
19.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
10
ELECTRICAL CHARACTERISTICS AT VS = 10 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 17, 18)
Parameter UnitMaxTypMinConditionsSymbol
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise THD+N VIN = 7.5 Vpp, f = 1 kHz, Av = 1 0.004 %
Input Referred Voltage Noise enf = 1 kHz 30 nV/√H
z
f = 10 kHz 20
Input Referred Current Noise inf = 1 kHz 90 fA/√Hz
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR No Load 114 135 dB
100
Power Supply Quiescent Current IDD
NCx20071 No load 430 645
mA
785
NCx20072, NCx2007
4
Per channel, no load 416 540
640
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
17.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
18.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
19.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
ELECTRICAL CHARACTERISTICS AT VS = 36 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 20, 21)
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Input Offset Voltage VOS
NCx20071 1.3 ±3.5 mV
+4.5 mV
NCx20072, NCx20074 1.3 ±3 mV
+4 mV
Offset Voltage Drift DVOS/DTTA = 25°C to 125°C 2 mV/°C
Input Bias Current (Note 21) IIB
5 200
pA
NCx20071, NCx20072 2000
NCx20074 1500
Input Offset Current (Note 21) IOS
NCx20071, NCx20072 2 75
pA
1000
NCx20074 2 75
200
Channel Separation XTLK DC NCx20072 100 dB
NCx20074 115
Differential Input Resistance RID 5GW
Common Mode Input Resistance RIN 5GW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
20.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
21.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
22.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
11
ELECTRICAL CHARACTERISTICS AT VS = 36 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 20, 21)
Parameter UnitMaxTypMinConditionsSymbol
INPUT CHARACTERISTICS
Differential Input Capacitance CID 1.5 pF
Common Mode Input Capacitance CCM 3.5 pF
Common Mode Rejection Ratio CMRR
NCx20071 VCM = VSS + 0.2 V t
o
VDD − 1.35 V 118 135
dB
95
NCx20072 VCM = VSS + 0.2 V t
o
VDD − 1.35 V 120 145
95
NCx20074 VCM = VSS + 0.2 V t
o
VDD − 1.35 V 120 145
85
OUTPUT CHARACTERISTICS
Open Loop Voltage Gain AVOL 98 120 dB
88
Output Current Capability (Note 22
)
IOOp amp sinking current 50 mA
Op amp sourcing current 65
Output Voltage High VOH Voltage output swing
from positive rail
NCx20071 0.074 0.15
V
0.22
NCx20072 0.074 0.10
0.15
NCx20074 0.074 0.10
0.12
Output Voltage Low VOL Voltage output swing from negative rail 0.065 0.3 V
0.35
AC CHARACTERISTICS
Unity Gain Bandwidth UGBW CL = 25 pF 3 MHz
Slew Rate at Unity Gain SR CL = 20 pF, RL = 2 kW2.4 V/ms
Phase Margin ömCL = 25 pF 50 °
Gain Margin AmCL = 25 pF 14 dB
Settling Time tSVO = 10 Vpp,
Gain = 1, CL = 20 pF Settling time to 0.1% 3.2 ms
Settling time to 0.01% 7
NOISE CHARACTERISTICS
Total Harmonic Distortion plus Noise THD+N VIN = 28.5 Vpp, f = 1 kHz, Av = 1 0.001 %
Input Referred Voltage Noise enf = 1 kHz 30 nV/√H
z
f = 10 kHz 20
Input Referred Current Noise inf = 1 kHz 90 fA/√Hz
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
20.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
21.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
22.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
12
ELECTRICAL CHARACTERISTICS AT VS = 36 V
TA = 25°C; RL ≥ 10 kW; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C. (Notes 20, 21)
Parameter UnitMaxTypMinConditionsSymbol
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR No Load 114 135 dB
100
Power Supply Quiescent Current IDD
NCx20071 No load 480 700
mA
840
NCx20072 Per channel, no load 465 570
700
NCx20074 Per channel, no load 465 600
700
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
20.Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
21.Performance guaranteed over the indicated operating temperature range by design and/or characterization.
22.Power dissipation must be limited to prevent junction temperature from exceeding 150°C. See Absolute Maximum Ratings for more infor-
mation.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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13
0.7
0.6
0.5
0.4
0.3
0.2
SUPPLY VOLTAGE (V)
0 6 12 18 24 30 36
SUPPLY CURRENT (mA)
Figure 2. Quiescent Current Per Channel vs.
Supply Voltage
T = −40°C
T = 25°C
T = 85°C
T = 125°C
0.7
0.6
0.5
0.4
0.3
0.2
TEMPERATURE (°C)
−40 −20 20 40 60 80 120
SUPPLY CURRENT (mA)
Figure 3. Quiescent Current vs. Temperature
0 100
VS = 10 V VS = 5 V
VS = 2.7 V
VS = 36 V
0
SUPPLY VOLTAGE (V)
0 6 12 18 24 30 36
OFFSET VOLTAGE (mV)
Figure 4. Offset Voltage vs. Supply Voltage
T = 125°C
T = 25°C
T = 85°C
T = −40°C
−0.2
−0.4
−0.6
−0.8
−1
−1.2
VCM = mid−supply 5
COMMON MODE VOLTAGE (V)
−18 −14 −10 −6 14 18
OFFSET VOLTAGE (mV)
Figure 5. Input Offset Voltage vs. Common
Mode Voltage
4
3
2
1
0
−1
−2
−3
−4
−5 −2 2 106
VS = ±18 V
10 units
5
COMMON MODE VOLTAGE (V)
15.5 16 16.5 17 17.5 18 18.5
OFFSET VOLTAGE (mV)
Figure 6. Input Offset Voltage vs. Common
Mode Voltage
2.5
0
−2.5
−5
−7.5
−10
−12.5
−15
VS = ±18 V
10 units
Normal
operation VS = 2.7 V, Gain
VS = 36 V, Gain
VS = 2.7 V, Phase
VS = 36 V, Phase
125
FREQUENCY (Hz)
10 10M
GAIN (dB)
Figure 7. Gain and Phase vs. Frequency
100
75
50
25
0
−25
−50
−75 100 1k 10k 100k 1M
180
135
90
45
0
−45
−90
−135
−180
PHASE (°)
RL = 10 kW
CL = 15 pF
GAIN
PHASE
100M
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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14
60
CAPACITIVE LOAD (pF)
0 100 200 300 400 500
PHASE MARGIN (°)
Figure 8. Phase Margin vs. Capacitive Load
50
40
30
20
10
0
1E+1
OUTPUT VOLTAGE (Vpp)
0 6 12 18 30 36
THD+N (%)
Figure 9. THD+N vs. Output Voltage
1E+0
1E−1
1E−2
1E−3
1E−4 24
FREQUENCY (Hz)
THD+N (%)
Figure 10. THD+N vs. Frequency
VS = 5 V
RL = 10 kW
TA = 25°C
VS = 36 V
fIN = 1 kHz
AV = 1
1E+1
1E+0
1E−1
1E−2
1E−3
1E−4
VS = 10 V
VS = 5 V
VS = 2.7 V
VS = 36 V
AV = 1 275
FREQUENCY (Hz)
VOLTAGE NOISE (nV/√Hz)
Figure 11. Input Voltage Noise vs. Frequency
250
225
200
175
150
125
100
75
50
25
0
FREQUENCY (Hz)
INPUT REFERRED CURRENT NOISE (fA/√Hz)
Figure 12. Input Current Noise vs. Frequency
10000
1000
100
10
1
0.1
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
140
FREQUENCY (Hz)
PSRR (dB)
Figure 13. PSRR vs. Frequency
120
100
80
60
40
20
0
VS = 2.7 V, VDD
VS = 2.7 V, VSS
VS = 36 V, VDD
VS = 36 V VSS
10 100 1k 10k
10 100 1k 10k 100k 1M
10 100 1k 10k 100k
10 100 1k 10k 100k
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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FREQUENCY (Hz)
CMRR (dB)
Figure 14. CMRR vs. Frequency
120
100
80
60
40
20
0
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
RL = 10 kW
TA = 25°C
OUTPUT CURRENT (mA)
02 46 18
OUTPUT VOLTAGE RELATIVE TO
VDD (V)
Figure 15. High Level Output vs. Output
Current
1.4
20
T = −40°C
T = 25°C
T = 85°C
T = 125°C
VS = 36 V
1.2
1
0.8
0.6
0.4
0.2
0161481012
T = −40°C
T = 25°C
T = 85°C
T = 125°C
VS = 36 V
OUTPUT CURRENT (mA)
OUTPUT VOLTAGE RELATIVE TO
VSS (V)
Figure 16. Low Level Output vs. Output
Current
1
0.8
0.6
0.4
0.2
00 2 4 6 18 20161481012
Input
Output
TIME (ms)
VOLTAGE (V)
Figure 17. Non−inverting Small Signal
Transient Response
18.1
18.05
18
17.95
17.9
VS = 36 V
AV = +1
RL = 10 kW
Input
Output
VOLTAGE (V)
TIME (ms)
−20 0 20 40
Figure 18. Inverting Small Signal Transient
Response
18.075
60
18.05
18.025
18
17.975
17.95
17.925
VS = 36 V
AV = +1
RL = 10 kW
TIME (ms)
VOLTAGE (V)
Figure 19. Non−inverting Large Signal
Transient Response
25
−20 0 20 40 60
20
15
10
Input
Output
VS = 36 V
AV = +1
RL = 10 kW
10 100 1k 10k 100k 1M
−20 0 20 40 60
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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16
24
22
20
18
16
14
12
10
Input
Output
VOLTAGE (V)
TIME (ms)
−20 0 20 40
Figure 20. Inverting Large Signal Transient
Response
60
VS = 36 V
AV = −1
RL = 10 kW
1200
CURRENT (pA)
TEMPERATURE (°C)
−25 0 25 50
Figure 21. Input Bias and Offset Current vs.
Temperature
12510075
1000
800
600
400
200
0
−200
IIB+
IIB−
IOS
VS = 36 V
CURRENT (pA)
COMMON MODE VOLTAGE (V)
0 6 12 30
Figure 22. Input Bias Current vs. Common
Mode Voltage
36
IIB+
IIB−
IOS
VS = 36 V
30
25
20
15
10
5
0
−5 2418
2 mV/div
TIME (s)
012 5
Figure 23. 0.1 Hz to 10 Hz Noise
108734 6 9
0.1 Hz to 10 Hz noise
VS = ±18 V, VCM = VS/2
RL = 10 kW, CL = 100 pF
AV = −1, VIN = 0 V
VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
0
CHANNEL SEPARATION (dB)
FREQUENCY (Hz)
Figure 24. Channel Separation vs. Frequency
−20
−40
−60
−80
−100
−120
−140
−160
RL = 10 kW
CL = 25 pF VS = 2.7 V
VS = 5 V
VS = 10 V
VS = 36 V
500
IMPEDANCE (W)
FREQUENCY (Hz)
Figure 25. Open Loop Output Impedance
450
400
350
300
250
200
150
100
50
0
10 100 1k 10k 100k 1M 10 100 1k 10k 100k 1M
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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17
1000
OFFSET VOLTAGE (mV)
TEMPERATURE (°C)
−50 −25 0 75
Figure 26. Offset Voltage vs. Temperature
1005025
500
0
−500
−1000
−1500
−2000
−2500
VS = 36 V
5 Units
VCM = mid−supply
125
10
D FROM FINAL VALUE (mV)
TIME (ms)
0 5 10 15
Figure 27. Large Signal Settling Time
453025 50
8
6
4
2
0
−2
−4
−6
−8
−10 20 35 40
VS = 36 V
10 V step
AV = −1
12−bit Setting
±1/2LSB = ±0.024%
SR+
SR−
5
SLEW RATE (V/ms)
TEMPERATURE (°C)
−40 −20 0 60
Figure 28. Slew Rate vs. Temperature
1004020 120
4
3
2
1
080
VS = 36 V
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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18
APPLICATIONS INFORMATION
Input Circuit
The NCS2007x input stage has a PMOS input pair and
ESD protection diodes. The input pair is internally
connected by back−to−back Zener diodes with a reverse
voltage of 5.5 V. To protect the internal circuitry, the input
current must be limited to 10 mA. When operating the
NCS2007x at dif ferential voltages greater than VID = 26 V,
series resistors can be added externally to limit the input
current flowing between the input pins. Adding 500 W
resistors in series with the input prevents the current from
exceeding 1 0 m A over the entire operating range up to 36 V.
1k 1k
VDD
VSS
VDD
VSS
IN+ IN−
Figure 29. Differential Input Pair
Output
The NCS2007x has a class AB output stage with
rail−to−rail output swing.
High output currents can cause the junction temperature
to exceed the 150°C absolute maximum rating. In the case
of a short circuit where the output is connected to either
supply rail, the amount of current the op amp can source and
sink is described by the output current capability parameter
listed in the Electrical Characteristics. The junction
temperature at a given power dissipation, P, can be
calculated using the following formula:
TJ = TA + P x qJA
The thermal resistance between junction and ambient,
qJA, is provided in the Thermal Information section of this
datasheet.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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19
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
eM
0.08 (0.003) X
b5 PL
A
c
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HEDIM
AMIN NOM MAX MIN
MILLIMETERS
0.50 0.55 0.60 0.020
INCHES
b0.17 0.22 0.27 0.007
c
D1.55 1.60 1.65 0.061
E1.15 1.20 1.25 0.045
e0.50 BSC
L0.10 0.20 0.30 0.004
0.022 0.024
0.009 0.011
0.063 0.065
0.047 0.049
0.008 0.012
NOM MAX
1.55 1.60 1.65 0.061 0.063 0.065
HE
0.08 0.13 0.18 0.003 0.005 0.007
0.020 BSC
RECOMMENDED
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
20
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A
B
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
AG
B
D
H
CJ
__
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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21
PACKAGE DIMENSIONS
Micro8
t
CASE 846A−02
ISSUE J
S
B
M
0.08 (0.003) A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
−T− SEATING
PLANE
A
A1 cL
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
AMIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b0.25 0.33 0.40 0.010
c0.13 0.18 0.23 0.005
D2.90 3.00 3.10 0.114
E2.90 3.00 3.10 0.114
e0.65 BSC
L0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
HE
HE
DD
E
8X 0.48
0.65
PITCH
5.25
8X
0.80
DIMENSION: MILLIMETERS
RECOMMENDED
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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22
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
AMIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024 1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
23
PACKAGE DIMENSIONS
TSSOP−8
CASE 948S
ISSUE C
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B4.30 4.50 0.169 0.177
C--- 1.10 --- 0.043
D0.05 0.15 0.002 0.006
F0.50 0.70 0.020 0.028
G0.65 BSC 0.026 BSC
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
____
SEATING
PLANE
PIN 1 14
85
DETAIL E
B
C
D
A
G
L
2X L/2
−U−
S
U0.20 (0.008) TS
U
M
0.10 (0.004) V S
T
0.076 (0.003)
−T−
−V−
−W−
8x REFK
IDENT
K0.19 0.30 0.007 0.012
S
U0.20 (0.008) T
DETAIL E
F
M
0.25 (0.010)
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇ
ÇÇÇ
ÇÇÇ
K1
K
JJ1
SECTION N−N
J0.09 0.20 0.004 0.008
K1 0.19 0.25 0.007 0.010
J1 0.09 0.16 0.004 0.006
N
N
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
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24
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE C
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L−U−
SEATING
PLANE
0.10 (0.004)
−T−
ÇÇÇ
ÇÇÇ
SECTION N−N
DETAIL E
JJ1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074
www.onsemi.com
25
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14 8
71
M
0.25 B M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B S
C
b
13X
B
A
E
D
e
DET AIL A
L
A3
DET AIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D8.55 8.75 0.337 0.344
E3.80 4.00 0.150 0.157
A1.35 1.75 0.054 0.068
b0.35 0.49 0.014 0.019
L0.40 1.25 0.016 0.049
e1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M0 7 0 7
H5.80 6.20 0.228 0.244
h0.25 0.50 0.010 0.019
__ __
0.10
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