Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : July 13, 2019 (GMT)
C3216X7R2J103K115AA
TDK item description C3216X7R2J103KT****
Applications Commercial Grade
Please refer to Part No. CGA5H4X7R2J103K115AA for Automotive use.
Feature Mid Mid Voltage (100 to 630V)
Series C3216 [EIA 1206]
Status Production
Size
Length(L) 3.20mm ±0.20mm
Width(W) 1.60mm ±0.20mm
Thickness(T) 1.15mm ±0.15mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 1.00mm Min.
Recommended Land Pattern (PA) 2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PB) 1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PC) 1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance 10nF ±10%
Rated Voltage 630VDC
Temperature Characteristic X7R(±15%)
Dissipation Factor (Max.) 3%
Insulation Resistance (Min.) 10000MΩ
Other
Soldering Method Wave (Flow)
Reflow
AEC-Q200 No
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
2 of 3
Creation Date : July 13, 2019 (GMT)
C3216X7R2J103K115AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C3216X7R2J103K115AA
ESR
C3216X7R2J103K115AA
Capacitance
C3216X7R2J103K115AA
DC Bias Characteristic
C3216X7R2J103K115AA
Temperature Characteristic
C3216X7R2J103K115AA(No Bias) C3216X7R2J103K115AA(DC Bias =
315V )
Ripple Temperature Rising
C3216X7R2J103K115AA(100kHz) C3216X7R2J103K115AA(500kHz) C3216X7R2J103K115AA(1MHz)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
3 of 3
Creation Date : July 13, 2019 (GMT)
C3216X7R2J103K115AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
