Preliminary W24256A 32K x 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W24256A is a high speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES * High speed access time: 15/35 nS (max.) * All inputs and outputs directly TTL compatible * * Three-state outputs * * Low power consumption: Active: 550 mW (max.) Single +5V power supply * Fully static operation Available packages: 28-pin 300 mil SOJ, 330 mil SOP, skinny DIP and standard type one TSOP (8 mm x 13.4 mm) - BLOCK DIAGRAM PIN CONFIGURATIONS V DD V SS A14 1 28 VDD A12 2 27 WE A7 3 26 A13 A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 OE A2 8 21 A10 A1 9 20 CS 28-pin DIP A0 10 19 I/O8 I/O1 11 18 I/O7 I/O2 12 17 I/O6 I/O3 13 16 I/O5 VSS 14 15 I/O4 A0 . . DECODER A14 CS OE CONTROL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-pin TSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 DATA I/O WE I/O1 . . I/O8 PIN DESCRIPTION SYMBOL OE A11 A9 A8 A13 WE VDD A14 A12 A7 A6 A5 A4 A3 CORE ARRAY Address Inputs A0-A14 A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2 I/O1-I/O8 -1- DESCRIPTION Data Inputs/Outputs CS Chip Select Input WE Write Enable Input OE VDD VSS Output Enable Input Power Supply Ground Publication Release Date: October 1999 Revision A1 Preliminary W24256A DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential RATING UNIT -0.5 to +7.0 V Input/Output to VSS Potential -0.5 to VDD +0.5 V Allowable Power Dissipation 1.0 W -65 to +150 C 0 to +70 C Storage Temperature Operating Temperature Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. TRUTH TABLE CS H OE X WE X L H L L MODE VDD CURRENT I/O1-I/O8 Not Selected High Z ISB, ISB1 H Output Disable High Z IDD L H Read Data Out IDD X L Write Data In IDD OPERATING CHARACTERISTICS (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C) PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT Input Low Voltage VIL - -0.5 - +0.8 V Input High Voltage VIH - +2.2 - VDD +0.5 V Input Leakage Current ILI VIN = VSS to VDD -5 - +5 A Output Leakage Current ILO VI/O = VSS to VDD, CS = VIH or OE = VIH or WE = VIL -5 - +5 A Output Low Voltage VOL IOL = +8.0 mA - - 0.4 V Output High Voltage VOH IOH = -4.0 mA 2.4 - - V Operating Power Supply Current IDD CS = VIL, I/O = 0 mA - - 110 mA Standby Power ISB CS = VIH Cycle = MIN., Duty = 100% - - 25 mA ISB1 CS VDD -0.2V - - 1 mA Cycle = min , Duty = 100% Supply Current Note: Typical characteristics are at VDD = 5V, TA = 25 C. -2- Preliminary W24256A CAPACITANCE (VDD = 5V, TA = 25 C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = 0V 8 pF Input/Output Capacitance CI/O VOUT = 0V 10 pF Note: These parameters are sampled but not 100% tested. AC TEST CONDITIONS PARAMETER CONDITIONS Input Pulse Levels 0V to 3V Input Rise and Fall Times 5 nS Input and Output Timing Reference Level 1.5V Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA AC TEST LOADS AND WAVEFORM R1 480 ohm 5V R1 480 ohm 5V OUTPUT OUTPUT 5 pF 30 pF Including Jig and Scope R2 255 ohm Including Jig and Scope R2 255 ohm (For TCLZ , TOLZ , TCHZ , TOHZ , TWHZ , TOW ) 3.0V 90% 10% 0V 90% 10% 5 nS 5 nS -3- Publication Release Date: October 1999 Revision A1 Preliminary W24256A AC CHARACTERISTICS (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C) Read Cycle PARAMETER SYM. W24256A-15 W24256A-35 MIN. MAX. MIN. MAX. UNIT Read Cycle Time TRC 15 - 35 - nS Address Access Time TAA - 15 - 35 nS Chip Select Access Time TACS - 15 - 35 nS Output Enable to Output Valid TAOE - 7 - 12 nS Chip Selection to Output in Low Z TCLZ 3 - 3 - nS Output Enable to Output in Low Z TOLZ 0 - 0 - nS Chip Deselection to Output in High Z TCHZ - 4 - 7 nS Output Disable to Output in High Z TOHZ - 4 - 7 nS Output Hold from Address Change TOH 3 - 3 - nS These parameters are sampled but not 100% tested. Write Cycle PARAMETER SYM. W24256A-15 W24256A-35 MIN. MAX. MIN. MAX. UNIT Write Cycle Time TWC 15 - 35 - nS Chip Selection to End of Write TCW 12 - 20 - nS Address Valid to End of Write TAW 12 - 20 - nS Address Setup Time TAS 0 - 0 - nS Write Pulse Width TWP 11 - 15 - nS TWR 1.5 - 1.5 - nS Data Valid to End of Write TDW 8 - 10 - nS Data Hold from End of Write TDH 0 - 0 - nS Write to Output in High Z TWHZ - 5 - 5 nS Output Disable to Output in High Z TOHZ - 5 - 5 nS Output Active from End of Write TOW 3 - 3 - nS Write Recovery Time CS , WE These parameters are sampled but not 100% tested. -4- Preliminary W24256A TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TAA TOH TOH DOUT Read Cycle 2 (Chip Select Controlled) CS TACS DOUT TCHZ TCLZ Read Cycle 3 (Output Enable Controlled) T RC Address TAA OE T OH T AOE T OLZ CS T ACS DOUT T CHZ T OHZ TCLZ -5- Publication Release Date: October 1999 Revision A1 Preliminary W24256A Timing Waveforms, continued Write Cycle 1 ( OE Clock) TWC Address T WR OE TCW CS T AW WE T WP T AS TOHZ (1, 4) D OUT T DW T DH D IN Write Cycle 2 (OE = VIL Fixed) T WC Address TWR CW CS AW WE TOH WP TAS TWHZ (1, 4) DOUT DW (2) (3) OW DH IN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- Preliminary W24256A ORDERING INFORMATION PART NO. ACCESS TIME (nS) OPERATING CURRENT MAX. (mA) STANDBY CURRENT MAX. (mA) PACKAGE W24256AK-15 15 110 1 300 mil skinny DIP W24256AK-35 35 110 1 300 mil skinny DIP W24256AJ-15 15 110 1 300 mil SOJ W24256AJ-35 35 110 1 300 mil SOJ W24256AS-15 15 110 1 330 mil SOP W24256AS-35 35 110 1 330 mil SOP W24256AQ-15 15 110 1 Standard type one TSOP W24256AQ-35 35 110 1 Standard type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -7- Publication Release Date: October 1999 Revision A1 Preliminary W24256A PACKAGE DIMENSIONS 28-pin P-DIP Skinny Dimension in Inches Symbol A A1 A2 B B1 c D E E1 e1 L D 28 15 E1 1 14 a eA S Notes: E S c Base Plane A A2 A1 L Mounting Plane B e1 eA a B1 Min. Nom. Max. Dimension in mm Min. Nom. 0.010 Max. 4.45 0.175 0.25 0.125 0.130 0.135 3.18 3.30 3.43 0.016 0.018 0.022 0.41 0.46 0.56 0.058 0.060 0.064 1.47 1.52 0.008 0.010 0.014 0.20 1.388 1.400 1.63 0.25 0.36 35.26 35.56 0.300 0.310 0.320 7.62 7.87 8.13 0.283 0.288 0.293 7.19 7.32 7.44 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 15 0 8.89 9.40 0 0.330 0.350 0.370 8.38 15 0.055 1.40 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. 28-pin Small Outline J Band Dimension in Inches Symbol A A1 A2 b1 b c D E e e1 HE L S y 15 28 E 1 HE 14 D c A2 s Seating Plane b b1 A L c e e1 A1 y -8- Dimension in mm Min. Nom. Max. Min. Nom. Max. 3.56 0.140 0.027 0.69 0.100 0.105 2.41 2.54 2.67 0.028 0.032 0.66 0.71 0.81 0.016 0.018 0.022 0.41 0.46 0.56 0.008 0.010 0.014 0.20 0.25 0.36 0.710 0.730 0.095 0.026 18.03 18.54 0.295 0.300 0.305 7.49 7.62 7.75 0.044 0.050 0.056 1.12 1.27 1.42 0.245 0.265 0.285 6.22 6.73 7.24 0.327 0.337 0.347 8.31 8.56 8.81 0.077 0.087 0.097 1.96 2.21 2.46 0.045 1.14 0.10 0.004 0 10 0 10 Notes: 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec. Preliminary W24256A Package Dimensions, continued 28-pin SO Wide Body Symbol 28 A A1 A2 b c D E e HE L LE S y Notes: 15 e1 E HE L Detail F 14 1 b c 2 A A S e 1 y LE A Min. Nom. Max. Min. Nom. Max. 2.85 0.112 0.004 0.10 0.093 0.098 0.103 2.36 2.49 0.014 0.016 0.020 0.36 0.41 0.51 0.008 0.010 0.014 0.20 0.25 0.36 0.713 0.733 18.11 18.62 0.331 0.336 0.326 8.28 8.41 2.62 8.53 0.044 0.050 0.056 1.12 1.27 1.42 0.453 0.465 0.477 11.51 11.81 12.12 0.028 0.036 0.044 0.71 0.91 1.12 0.059 0.067 0.075 1.50 1.70 1.91 0.047 1.19 0.004 0.10 10 0 10 0 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined .at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec. e1 D Dimension in mm Dimension in Inches See Detail F Seating Plane 28-pin Standard Type One TSOP HD Dimension in Inches Dimension in mm Symbol Min. D c e E b A A1 A2 b c D E HD e L L1 Y A1 2 A A L Y Nom. Max. Min. Nom. 0.002 0.035 0.040 Max. 1.20 0.047 0.006 0.05 0.041 0.95 0.15 1.00 1.05 0.007 0.008 0.011 0.17 0.20 0.27 0.004 0.006 0.008 0.10 0.15 0.21 11.90 0.461 0.465 0.469 11.70 11.80 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.028 0.50 0.022 0.020 0.024 0.55 0.010 0.000 0 3 0.60 0.70 0.25 0.004 0.00 5 0 0.10 3 5 Note: Controlling dimension: Millimeters L1 -9- Publication Release Date: October 1999 Revision A1 Preliminary W24256A VERSION HISTORY VERSION DATE A1 Oct. 1999 Headquarters PAGE DESCRIPTION Initial Issued Winbond Electronics (H.K.) Ltd. Rm. 803, World Trade Square, Tower II, No. 4, Creation Rd. III, 123 Hoi Bun Rd., Kwun Tong, Science-Based Industrial Park, Kowloon, Hong Kong Hsinchu, Taiwan TEL: 852-27513100 TEL: 886-3-5770066 FAX: 852-27552064 FAX: 886-3-5796096 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-27197006 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502 Note: All data and specifications are subject to change without notice. - 10 - Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-5441798