TLP708,TLP708F
2010-08-20 1
TOSHIBA 11-5J1
Weight: 0.26 g (typ.)
4.58±0.25
4.0
+0.25
−0.20
9.7±0.3
6.8±0.25
0.4±0.1
1.27±0.2 1.25±0.25
7.62±0.25
3.65 +0.15
−0.25
0.25±
1 2 3
6 5 4
11-5J1
−0.05
+0.10
Unit: mm
TLP708
TOSHIBA PHOTOCOUPLER GaAℓAs LED & PHOTO-IC
TLP708,TLP708F
Factory Automation (FA)
Home Electrical Appliances
Operates at high ambient temperatures up to 125°C
The Toshiba TLP708 consists of a GaAℓAs light emitting diode and an
integrated high-gain, high-speed photodetector. The TLP708 is housed in
the SDIP6 package.
Compared to the standard DIP8 package, TLP708 is smaller in size, yet
comes with international safety standards under a reinforced isolation
category. As such, it is possible to reduce the mounting footprint for
applications that require certifications for safety standards.
The photodetector has an open-collector output stage, and an internal
Faraday shield that provides a guaranteed common-mode transient
immunity of ±15 kV/μs. As TLP708 is also able to operate up to 125℃, it
is suitable for use in applications like industrial equipments where it is
necessary to operate under high ambient temperatures.
TLP708F is of a long creepage distance and clearance distance type.
z Input threshold current : IFHL = 5mA (Max)
z Switching time (tpHL/tpLH): 75ns (Max)
z Data transfer rate: 15 MBd (Typ.)
z Guaranteed Performance over temperature: -40 to 125℃
z Power supply voltage: 4.5 to 5.5V
z Common mode transient immunity: ±15 kV /μs (Min)
z Isolation voltage: 5000Vrms (Min)
z Construction mechanical rating
z UL recognized: UL1577, File No. E67349
z cUL recognized: CSA Component Acceptance Service No.5A,
File No. E67349
z Option (D4) Type
VDE EN60747-5-2: under application
(Note) When EN60747-5-2 approval type is needed,
please designate “Option (D4)”.
Pin Configuration (Top View)
7.62 mm Pitch
TLP708 Type
10.16 mm Pitch
TLP708F Type
Creepage distance
Clearance distance
Insulation thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
1:ANODE
2:N.C.
3:CATHODE
4:GND
5:VO(Output)
6:VCC
Weight: 0.26 g (typ.)
TOSHIBA 11-5J101
0.25± −0.05
+0.10
4.58±0.25
0.4±0.1
1 2 3
6.8±0.25
1.27±0.2
3.65
+0.15
−0.25
6 5 4
11.7±0.3
3.9
+0.25
−0.15
0.75±0.25
7.62±0.25
11-5J101
Unit: mm
TLP708F
VCC
GND
SHIELD
1
3 4
5
6
2
TLP708,TLP708F
2010-08-20
2
Schematic
Absolute Maximum Ratings (Ta = 25℃)
Characteristics Symbol Rating Unit
Forward Current (Ta < 110℃) IF 25 mA
Forward Current Derating (Ta ≥ 110℃) ΔIF/℃ -0.67 mA/℃
Pulse Forward Current (Note 1) (Ta < 110℃) IFP 50 mA
Pulse Forward Current Derating (Ta ≥ 110℃) ΔIFP/℃ -1.34 mA/℃
Reverse Voltage VR 5 V
Input Power Dissipation (Ta < 110℃) PD 40 mW
LED
Input Power Dissipation Derating (Ta ≥ 110℃) ΔPD/℃ -1.0 mW/℃
Output Current (Ta ≤ 125℃) IO 25 mA
Output Voltage VO 6 V
Supply Voltage VCC 6 V
Output Power Dissipation (Ta < 110℃) PO 80 mW
DETECTOR
Output Power Dissipation
Derating (Ta ≥ 110℃) ΔPO/℃ -2.0 mW/℃
Operating Temperature Range Topr −40 to 125 ℃
Storage Temperature Range Tstg −55 to 150 ℃
Lead solder Temperature (10s) Tsol 260 ℃
Isolation voltage (Note 2) BVS 5000 Vrms
Note: Using continuously under heavy loads (e.g. an application of high temperature/current/voltage and a significant
change in temperature, etc.) may cause this product to decrease in reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc)
Note 1: Pulse width ≤ 1ms, duty=50%
Note 2: R.H. ≤ 60%, Ta = 25℃, AC 1 min
This device is regarded as a two-terminal device: pins 1, 2 and 3 are shorted together,
and pins 4, 5 and 6 are shorted together.
Input Output
H L
L H
Note: A 0.1
μ
F b
yp
ass ca
p
acitor must be connected between
p
ins 6 and 4.
Truth Table
GND
6
4
SHIELD
3－
1＋
5
VCC
VO
ICC
IF IO
TLP708,TLP708F
2010-08-20
3
Recommended Operating Condition
Characteristics Symbol Min. Typ. Max. Unit
‘L’ level input voltage VFL 0 ― 0.8 V
‘H’ level input current IFH 7.5 ― 15 mA
Supply voltage* VCC 4.5 ― 5.5 V
Operating temperature range Topr -40 ― 125 ℃
* This item denotes operating ranges, not meaning of recommended operating conditions.
Electrical Characteristics
(Unless otherwise specified, Ta = -40 to 125℃, VCC = 4.5 to 5.5V)
Characteristic Symbol
Test
Circuit Test Conditions Min. Typ.* Max. Unit
Input forward current VF ― IF = 10 mA, Ta = 25℃ 1.40 1.57 1.80 V
Temperature coefficient of forward voltage ΔVF /ΔTa ― I
F = 10 mA ― −1.8 ― mV/℃
Input reverse current IR ― V
R = 5 V, Ta = 25℃ ― ― 10 μA
Input capacitance CT ― V
F = 0 V, f = 1 MHz, Ta = 25℃― 60 ― pF
VF = 0.8 V, VO = 5.5 V ― 250
“H” level output current IOH 1 VF = 0.8 V, VO = 5.5 V
Ta = 25℃
―
0.5 10
μA
“L” level output voltage VOL 2 IF = 10 mA
IOL = 13 mA (sink) ― 0.3 0.6 V
Input threshold current IFHL ― IOL = 13 mA (sink)
VO < 0.6 V
― 1.5 5.0 mA
“H” level supply current ICCH 3 IF = 0 mA ― 1.5 5.0 mA
“L” level supply current ICCL 4 IF = 10 mA ― 1.4 5.0 mA
*All typical values are at Ta=25°C, VCC=5V unless otherwise specified.
Isolation Characteristics (Ta = 25°C)
Characteristic Symbol Test Conditions Min. Typ. Max. Unit
Capacitance input to output CS V
S = 0V , f = 1MHz (Note 2) ― 0.8 ― pF
Isolation resistance RS
R.H. ≤ 60%,VS = 500V
(Note 2) 1×1012 1014 ― Ω
AC,1 minute 5000 ― ― V
rms
AC,1 second,in oil ― 10000 ―
Isolation voltage BVS
DC,1 minute,in oil ― 10000 ―
Vdc
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. In addition, each item is an independent guideline. In developing designs using this product, please
confirm the specified characteristics shown in this document.
TLP708,TLP708F
2010-08-20
4
Switching Characteristics
(Unless otherwise specified, Ta = -40 to 125°C, VCC = 4.5 to 5.5 V)
Characteristic Symbol
Test
Circuit Test Conditions Min. Typ.* Max. Unit
Propagation delay time to logic low
output tpHL IF=0→7.5mA — 35 75 ns
Propagation delay time to logic high
output tpLH IF=7.5→0mA
RL=350Ω
CL=15pF
(Note 4) — 35 75 ns
Switching time dispersion between
ON and OFF
|tpHL-
tpLH| — 12 35 ns
Propagation delay skew (Note 5) tpsk
IF=0↔7.5mA
RL=350Ω
CL=15pF
(Note 4) -50 — 50 ns
Output fall time（90-10%） t
f IF=0→7.5mA — 6 — ns
Output rise time（10－90%） t
r
5
IF=7.5→0mA
RL =350Ω
CL=15pF
(Note 4) — 18 — ns
Common mode transient immunity
at high level output CMH VCM=1000Vp-p , IF=0mA,
VCC=5V , Ta=25℃
+15 — — kV/μs
Common mode transient immunity
at low level output CML
6
VCM=1000Vp-p , IF=10mA,
VCC=5V , Ta=25℃
-15 — — kV/μs
*All typical values are at Ta=25℃
Note 3 : A ceramic capacitor (0.1μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the high gain
linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between the capacitor
and coupler should not exceed 1 cm.
Note 4 : f=5MHz, duty=50%, input current tr=tf=4.5ns,
CL is approximately 15pF which includes probe and ｊig/stray wiring capacitance.
Note 5: Propagation delay skew is defined as the difference between the largest and smallest propagation delay times (i.e. tpHL or
tpLH) of multiple samples. Evaluations of these samples are conducted under identical test conditions (supply voltage, input
current, temperature, etc).
TEST CIRCUIT 1: IOH Test Circuit TEST CIRCUIT 2: VOL Test Circuit
TEST CIRCUIT 3: ICCL Test Circuit TEST CIRCUIT 4: ICCH Test Circuit
A
VCC
0.1 μF
ICCH
SHIELD
1
2
3
6
5
4
IF
A
VCC
0.1 μF
ICCL
SHIELD
1
2
3
6
5
4
0.1μF
VOL VCC
V
IO
↑
IF
SHIELD
1
2
3
6
5
4
0.1μF
SHIELD
VF VCC
IOH
A
VO
1
2
3
6
5
4
TLP708,TLP708F
2010-08-20
5
TEST CIRCUIT 5: tpHL, tpLH Test Circuit
TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit
VO
VOL
tpLH
tpHL
1.5 V
50%
tf tr
90%
10%
IF
0.1μF
RIN=100Ω
*CL=15pF *CL=15pF
RL=350Ω
IF=7.5mA(P.G.)
(f=5MHz , duty=50%, tr=tf=4.5ns)
IF monitor VO
P. G.
SHIELD
CL includes probe and stray capacitance.
P.G.: Pulse generator
VCC
1
2
3
6
5
4
VCM
10%
90% 1000 V
・SW B : IF=0 mA
・SW A : IF=10 mA
0.8 V
2V
VO
tr
tf
CML
CMH
＋ －
SW
B
VCC
VCM
VO
0.1 μF
IF
A
RL=350Ω
→
)(
)(800
s
t
r
V
H
CM
μ
=)(
)(800
s
tf
V
L
CM
μ
−=
1
2
3
6
5
4
TLP708,TLP708F
2010-08-20
6
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
z An example of a temperature profile when Sn-Pb eutectic solder is used:
z An example of a temperature profile when lead(Pb)-free solder is used:
z Reflow soldering should be performed no more than twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering flow (Applicable to both eutectic solder and lead (Pb)-free solder)
z Apply preheating of 150˚C for 60 to 120 seconds.
z Mounting condition of 260˚C or less within 10 seconds is recommended.
z Flow soldering should be performed no more than once.
3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Complete soldering within 10 seconds for lead temperature not exceeding 260˚C or within 3 seconds
not exceeding 350˚C.
z Heating by soldering iron should be performed no more than once per lead.
TLP708,TLP708F
2010-08-20
7
(2) Precautions for General Storage
1) Do not store devices in places where they will be exposed to moisture or direct sunlight.
2) During transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5˚C
to 35˚C, and the relative humidity should be maintained between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or under dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. The solderability of the leads will be
degraded as rapid temperature changes can cause condensation to form on the stored devices,
resulting in lead oxidation or corrosion.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices when they are in storage.
8) If devices have been stored for more than two years, it is recommended that their solderability be tested
before they are used even if the above precautions have been followed.
TLP708,TLP708F
2010-08-20
8
Specifications for Embossed-Tape Packing
(TP) for SDIP6 Type Photocoupler
1. Applicable Package
Package Name Product Type
SDIP6 Photocouplers
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example) TLP708 (TP, F)
[[G]]/RoHS COMPATIBLE (Note 6)
Tape type
Device name
3. Tape Dimensions
3.1 Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
3.2 Tape Packing Quantity: 1500 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Item Standard Remarks
Occurrences of 2 or more
successive empty device
recesses
0 Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses 6 devices (max) per reel Not including leader and trailer
3.4 Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes
and two empty turns as a cover tape.
Tape feed
TLP708,TLP708F
2010-08-20
9
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.
Figure 2 Tape Forms
Table 2 Tape Dimension
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 10.4 ⎯
B 5.1 ⎯
D 7.5 Center line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 12.0 Cumulative error (max) per 10 feed holes
G 4.0 Cumulative error (max) per 10 feed holes
K0 4.1 Internal space
+
0.1
−
0.3
+
0.1
−
0.3
φ1.6 ± 0.1
2.0 ± 0.1
A
D
B
E
FG
16.0 ± 0.3
φ1.5
+0.1
−0
0.4
±
0.05
4.55
±
0.2
K0
TLP708 / TLP708F
2010-08-20
10
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.
(Example) TLP708 (TP, F) 1500 pcs
Quantity (must be a multiple of 1500)
[[G]]/RoHS COMPATIBLE (Note 6)
Tape type
Device name
Note 6 :Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Symbol Dimension
A φ380 ± 2
B φ80 ± 1
C φ13 ± 0.5
E 2.0 ± 0.5
U 4.0 ± 0.5
W1 17.5 ± 0.5
W2 21.5 ± 1.0
E
W1
W2
A
B
C
4
Table 3 Reel Dimension
Unit: mm
TLP708 / TLP708F
2010-08-20
11
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
