3M Electronic Handling and Protection Division
6801 River Place Blvd.
Austin, TX 78726-9000
Test
& Burn-In SPGA Socket
9
Date Issued: June 20, 2001
TS-1361-04
Sheet
1 of 3
Physical
Package and Board Specifications
Body: Glass Reinforced PEI (UL 94V-0)
Contact: Beryllium Copper
Gold Plating 20 micro inch Min.
Cam Lever Part: Stainless steel
Screw: Stainless steel (No.0-80 UNF)
Plain Washer: Stainless steel
Nut: Stainless steel
Package
Lead Diameter: Ø0.20±0.05 mm
Diameter A: 1.4 mm - 1.8 mm
Lead count: 528 Max.
Matrix: Standard product; 37x37 Max., 11 rows
Plating: Gold plating
PC Board
Board Thickness: A type — 1.6 mm
B type — 3.2 mm
C type — 5.0 mm
Through Hole Diameter: Ø0.4 mm Min.
Dielectric Withstanding
Voltage: No appearance of arcing and break down
Leak current.; 1mA Max.
Insulation Resistance: 1000MW Max.
Contact Resistance: Initial; 50mW Max.
After tests; 500mW Max.
Electrical
• Package for 1.27 mm (.050") pitch PGA
• Zero insertion force
• Double mating contact
• Lever mechanism for opening and
shutting switch over
• Maximum grid 37x37 and lead count of 600
For
technical, sales or ordering information call
800-328-0411
or visit our website: http://www.3M.com/ehpd
lc device
Socket
Dim.A
Lead pin