1
Data sheet acquired from Harris Semiconductor
SCHS174B
Features
• Common Clock and Asynchronous Master Reset
• Positive Edge Triggering
• Buffered Inputs
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating T emperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il≤1µA at VOL, VOH
Description
The ’HC273 and ’HCT273 high speed octal D-Type flip-flops
with a direct clear input are manufactured with silicon-gate
CMOS technology. They possess the low power consumption
of standard CMOS integrated circuits .
Information at the D inputis transferred to the Q outputs on
the positive-going edge of the clock pulse. All eight flip-flops
are controlled by a common clock (CP) and a common reset
(MR). Resetting is accomplished by a low voltage level
independent of the clock. All eight Q outputs are reset to a
logic 0.
Pinout
CD54HC273, CD54HCT273
(CERDIP)
CD74HC273, CD74HCT273
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER TEMP. RANGE (oC) PACKAGE
CD54HC273F3A -55 to 125 20 Ld CERDIP
CD74HC273E -55 to 125 20 Ld PDIP
CD74HC273M -55 to 125 20 Ld SOIC
CD74HC273M96 -55 to 125 20 Ld SOIC
CD54HCT273F3A -55 to 125 20 Ld CERDIP
CD74HCT273E -55 to 125 20 Ld PDIP
CD74HCT273M -55 to 125 20 Ld SOIC
CD74HCT273M96 -55 to 125 20 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel.
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
MR
Q0
D0
D1
Q1
Q2
D3
D2
Q3
GND
VCC
D7
D6
Q6
Q7
Q5
D5
D4
Q4
CP
February 1998 - Revised May 2003
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
CD54HC273, CD74HC273,
CD54HCT273, CD74HCT273
High-Speed CMOS Logic
Octal D-Type Flip-Flop with Reset
[ /Title
(CD74
HC273
,
CD74
HCT27
3)
/
Sub-
j
ect
(High
Speed
CMOS
Logic
Octal
D-
Type
Flip-
2
Functional Diagram
TRUTH TABLE
INPUTS OUTPUT
RESET (MR) CLOCK CP DATA DnQ
LXXL
H↑HH
H↑LL
HLXQ
0
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care, ↑= Transition from Low to
High Level, Q0= Lev el Bef ore the Indicated Steady-State Input Conditions Were Estab lished.
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
RESET MR
D0
D1
D2
D3
D4
D5
D6
D7
CLOCK
CP
DATA
INPUTS DATA
OUTPUTS
CD54/74HC273, CD54/74HCT273
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1) θJC (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS
VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or
VIL -0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or
VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC or
GND -6--±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 6 - - 8 - 80 - 160 µA
CD54/74HC273, CD54/74HCT273
4
HCT TYPES
High Level Input
Voltage VIH - - 4.5 to
5.5 2-- 2 - 2 - V
Low Level Input
Voltage VIL - - 4.5 to
5.5 - - 0.8 - 0.8 - 0.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or
VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V
High Level Output
Voltage
TTL Loads
-4 4.5 3.98 - - 3.84 - 3.7 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or
VIL 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
4 4.5 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC to
GND 0 5.5 - - ±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 5.5 - - 8 - 80 - 160 µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC
(Note 2) VCC
-2.1 - 4.5 to
5.5 - 100 360 - 450 - 490 µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS
VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
MR 1.5
Data 0.4
CP 1.5
NOTE: Unit Load is ∆ICC limit specified in DC Electrical
Specifications table, e.g., 360µA max at 25oC.
Prerequisite For Switching Specifications
PARAMETER SYMBOL TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Maximum Clock Frequency
(Figure 1) fMAX - 2 6 - - 5 - 4 - MHz
4.5 30 - - 25 - 20 - MHz
6 35 - - 29 - 23 - MHz
MR Pulse Width
(Figure 1) tW- 2 60 - - 75 - 90 - ns
4.5 12 - - 15 - 18 - ns
6 10 - - 13 - 15 - ns
CD54/74HC273, CD54/74HCT273
5
Clock Pulse Width (Figure 1) tW- 2 80 - - 100 - 120 - ns
4.5 16 - - 20 - 24 - ns
6 14 - - 17 - 20 - ns
Set-up Time Data to Clock
(Figure 5) tSU - 2 60 - - 75 - 70 - ns
4.5 12 - - 15 - 18 - ns
6 10 - - 13 - 15 - ns
Hold Time, Data to Clock
(Figure 5) tH-23--3-3-ns
4.5 3 - - 3 - 3 - ns
63--3-3-ns
Removal Time, MR to Clock tREM - 2 50 - - 65 - 75 - ns
4.5 10 - - 13 - 15 - ns
6 9 - - 11 - 13 - ns
HCT TYPES
Maximum Clock Frequency
(Figure 2) fMAX - 4.5 25 - - 20 - 16 - MHz
MR Pulse Width
(Figure 2) tw- 4.5 12 - - 15 - 18 - ns
Clock Pulse Width (Figure 2) tw- 4.5 20 - - 25 - 30 - ns
Set-up Time Data to Clock
(Figure 6) tSU - 4.5 12 - - 15 - 18 - ns
Hold Time, Data to Clock
(Figure 6) tH- 4.5 3 - - 3 - 3 - ns
Removal Time, MR to Clock tREM - 4.5 10 - - 13 - 15 - ns
Switching Specifications Input tr, tf = 6ns
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC -40oC TO 85oC-55oC TO
125oC
UNITSTYP MAX MAX MAX
HC TYPES
Propagation Delay,
Clock to Output
(Figure 3)
tPLH, tPHL CL= 50pF 2 - 150 190 225 ns
4.5 - 30 38 45 ns
6 - 26 30 38 ns
CL= 15pF 5 12 - - - ns
Propagation Delay,
MR to Output
(Figure 3)
tPHL CL= 50pF 2 - 150 190 225 ns
4.5 - 30 38 45 ns
6 - 26 30 38 ns
Output Transition Time
(Figure 3) tTLH, tTHL CL= 50pF 2 - 75 95 110 ns
4.5 - 15 19 22 ns
6 - 13 16 19 ns
Input Capacitance CI---1010 10pF
Maximum Clock Frequency fMAX CL= 15pF 5 60 - - - MHz
Prerequisite For Switching Specifications (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
CD54/74HC273, CD54/74HCT273
6
Power Dissipation
Capacitance
(Notes 3, 4)
CPD - 5 25 - - - pF
HCT TYPES
Propagation Delay,
Clock to Output (Figure 4) tPLH, tPHL CL= 50pF 4.5 - 30 38 45 ns
CL= 15pF 5 12 - - - ns
Propagation Delay,
MR to Output (Figure 4) tPHL CL= 50pF 4.5 - 32 40 48 ns
Output Transition Time tTLH, tTHL CL= 50pF 4.5 - 15 19 22 ns
Input Capacitance CIN ---1010 10pF
Maximum Clock Frequency fMAX CL= 15pF 5 50 - - - MHz
Power Dissipation
Capacitance
(Notes 3, 4)
CPD - 5 25 - - - pF
NOTES:
3. CPD is used to determine the dynamic power consumption, per flip-flop.
4. PD=C
PD VCC2fi+∑(CLVCC2+f
O) where fi= Input Frequency, fO= Output Frequency, CL= Output Load Capacitance, VCC = Supply
Voltage.
Switching Specifications Input tr, tf = 6ns (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC -40oC TO 85oC-55oC TO
125oC
UNITSTYP MAX MAX MAX
Test Circuits and Waveforms
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
CLOCK 90% 50%
10% GND
VCC
trCLtfCL
50% 50%
tWL tWH
10%
tWL + tWH =fCL
I
CLOCK 2.7V 1.3V
0.3V GND
3V
trCL= 6ns tfCL= 6ns
1.3V 1.3V
tWL tWH
0.3V
tWL + tWH =fCL
I
tPHL tPLH
tTHL tTLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
VCC
tr = 6ns tf = 6ns
90%
tPHL tPLH
tTHL tTLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
tr = 6ns tf = 6ns
90%
CD54/74HC273, CD54/74HCT273
7
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
Test Circuits and Waveforms (Continued)
trCLtfCL
GND
VCC
GND
VCC
50%
90%
10%
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
VCC 50%
50%
90%
10%
50%
90%
tREM
tPLH
tSU(H)
tTLH tTHL
tH(L)
tPHL
IC CL
50pF
tSU(L)
tH(H)
trCLtfCL
GND
3V
GND
3V
1.3V
2.7V
0.3V
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
3V 1.3V
1.3V
1.3V
90%
10%
1.3V
90%
tREM
tPLH
tSU(H)
tTLH tTHL
tH(L)
tPHL
IC CL
50pF
tSU(L)
1.3V
tH(H)
1.3V
CD54/74HC273, CD54/74HCT273
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-8772501RA ACTIVE CDIP J 20 1 TBD Call TI Call TI
CD54HC273F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD54HC273F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD54HCT273F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD54HCT273F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
CD74HC273E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD74HC273EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD74HC273M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HC273M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HC273M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HC273M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HC273ME4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HC273MG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HCT273E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD74HCT273EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD74HCT273M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HCT273M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HCT273M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HCT273M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HCT273ME4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD74HCT273MG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54HC273, CD54HCT273, CD74HC273, CD74HCT273 :
•Catalog: CD74HC273, CD74HCT273
•Military: CD54HC273, CD54HCT273
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
CD74HC273M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
CD74HCT273M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC273M96 SOIC DW 20 2000 346.0 346.0 41.0
CD74HCT273M96 SOIC DW 20 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
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