INMP405 Omnidirectional Microphone with Bottom Port and Analog Output APPLICATIONS GENERAL DESCRIPTION * The INMP405 is a high-quality, high-performance, low-power, analog-output bottom-ported omnidirectional MEMS microphone. The INMP405 consists of a MEMS microphone element, an impedance converter, and an output amplifier. The INMP405 sensitivity specification makes it an excellent choice for near-field applications. The INMP405 has a wideband frequency response, resulting in natural sound with high intelligibility. The specially designed low frequency cutoff reduces wind noise. Its low current consumption enables long battery life for portable applications. The INMP405 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. The INMP405 is available in a miniature 3.35 x 2.50 x 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The INMP405 is halide free. * * * * * Mobile Devices Teleconferencing Systems Headsets Security Panels Intercom Devices FEATURES * * * * * * * * * 3.35 x 2.50 x 0.88 mm Surface-Mount Package SNR of 62 dBA Sensitivity of -38 dBV Flat Frequency Response from 200 Hz to 15 kHz Low Current Consumption: <250 A Single-Ended Analog Output High PSR of 70 dB Compatible with Sn/Pb and Pb-free Solder Processes RoHS/WEEE Compliant *Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending. ORDERING INFORMATION FUNCTIONAL BLOCK DIAGRAM PART OUTPUT AMPLIFIER OUTPUT INMP405ACEZ-R0* INMP405ACEZ-R7 EV_INMP405-FX * - 13" Tape and Reel TEMP RANGE -40C to +85C -40C to +85C -- - 7" Tape and reel to be discontinued. Contact sales@invensense.com for availability. INMP405 POWER VDD GND InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988-7339 www.invensense.com Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 INMP405 TABLE OF CONTENTS General Description ........................................................................................................................................................ 1 Applications .................................................................................................................................................................... 1 Features .......................................................................................................................................................................... 1 Functional Block Diagram ............................................................................................................................................... 1 Ordering Information ...................................................................................................................................................... 1 Table of Contents ............................................................................................................................................................ 2 Specifications .................................................................................................................................................................. 3 Table 1. Electrical Characteristics ................................................................................................................................... 3 Absolute Maximum Ratings ............................................................................................................................................ 4 Table 2. Absolute Maximum Ratings .............................................................................................................................. 4 ESD Caution..................................................................................................................................................................... 4 Soldering Profile .............................................................................................................................................................. 5 Table 3. Recommended Soldering Profile* ..................................................................................................................... 5 Pin Configurations And Function Descriptions ............................................................................................................... 6 Table 4. Pin Function Descriptions .................................................................................................................................. 6 Typical Performance Characteristics............................................................................................................................... 7 Applications Information ................................................................................................................................................ 8 Connecting To Audio Codecs .......................................................................................................................................... 8 Supporting Documents ................................................................................................................................................... 9 Evaluation Board User Guide .......................................................................................................................................... 9 Application Note (product specific) ................................................................................................................................ 9 Application Notes (general) ............................................................................................................................................ 9 PCB Design And Land Pattern Layout ........................................................................................................................... 10 Handling Instructions .................................................................................................................................................... 11 Pick And Place Equipment ............................................................................................................................................ 11 Reflow Solder ................................................................................................................................................................ 11 Board Wash ................................................................................................................................................................... 11 Outline Dimensions ....................................................................................................................................................... 12 Ordering Guide ............................................................................................................................................................. 12 Revision History ............................................................................................................................................................ 12 Compliance Declaration Disclaimer: ............................................................................................................................. 13 Environmental Declaration Disclaimer: ........................................................................................................................ 13 Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 2 of 13 INMP405 SPECIFICATIONS TABLE 1. ELECTRICAL CHARACTERISTICS (T A = -40 to 85C, V DD = 1.5 to 3.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across temperature and voltage, and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.) PARAMETER PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio (SNR) Equivalent Input Noise (EIN) Dynamic Range Frequency Response Total Harmonic Distortion (THD) Power-Supply Rejection (PSR) Maximum Acoustic Input POWER SUPPLY Supply Voltage (V DD ) Supply Current (I S ) CONDITIONS 1 kHz, 94 dB SPL MIN -41 Derived from EIN and maximum acoustic input Low frequency -3 dB point High frequency -3 dB point 105 dB SPL 217 Hz, 100 mVp-p square wave superimposed on VDD = 1.8 V Peak TYP Omni -38 62 32 MAX -35 UNITS dBV dBA dBA SPL 88 dB 200 15 Hz kHz % 3 -70 dBV 120 dB SPL 1.5 3.3 250 V A OUTPUT CHARACTERISTICS Output Impedance (Z OUT ) 200 Output DC Offset 0.8 V Output Current Limit 90 A Note 1: See Figures 3 and 5. Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 3 of 13 NOTES 1 INMP405 ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. TABLE 2. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage (VDD) Sound Pressure Level (SPL) Mechanical Shock Vibration Temperature Range RATING -0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B -40C to +85C ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 4 of 13 INMP405 SOLDERING PROFILE CRITICAL ZONE TL TO TP tP TP TEMPERATURE RAMP-UP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT t25C TO PEAK TIME Figure 1. Recommended Soldering Profile Limits TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Average Ramp Rate (T L to T P ) Preheat Minimum Temperature (T SMIN ) Minimum Temperature (T SMIN ) Time (T SMIN to T SMAX ), t S Ramp-Up Rate (T SMAX to T L ) Time Maintained Above Liquidous (t L ) Liquidous Temperature (T L ) Peak Temperature (T P ) Time Within +5C of Actual Peak Temperature (t P ) Ramp-Down Rate Time +25C (t 25C ) to Peak Temperature Sn63/Pb37 1.25C/sec max Pb-Free 1.25C/sec max 100C 100C 150C 200C 60 sec to 75 sec 60 sec to 75 sec 1.25C/sec 45 sec to 75 sec 183C 1.25C/sec ~50 sec 217C 215C +3C/-3C 245C +0C/-5C 20 sec to 30 sec 20 sec to 30 sec 3C/sec max 3C/sec max 5 min max 5 min max *The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020 profile. Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 5 of 13 INMP405 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS GND 1 2 OUTPUT 3 INMP405 VDD TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 2. Pin Configuration TABLE 4. PIN FUNCTION DESCRIPTIONS PIN NAME FUNCTION 1 OUTPUT Analog Output Signal 2 GND Ground 3 VDD Power Supply Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 6 of 13 INMP405 TYPICAL PERFORMANCE CHARACTERISTICS 10 10 8 6 0 2 (dB) SENSITIVITY (dB) 4 0 -2 -10 -4 -6 -8 -10 100 1k 10k -20 100 Figure 3. Frequency Response Mask -10 -20 PSR (dB) -30 -40 -50 -60 -70 1k 10k FREQUENCY (Hz) Figure 5. Typical Power Supply Rejection Ratio vs. Frequency Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 10k Figure 4. Typical Frequency Response (Measured) 0 -80 100 1k FREQUENCY (Hz) FREQUENCY (Hz) Page 7 of 13 INMP405 APPLICATIONS INFORMATION CONNECTING TO AUDIO CODECS The INMP405 output can be connected to a dedicated codec microphone input (see Figure 6) or to a high input impedance gain stage (see Figure 7.) A 0.1 F ceramic capacitor placed close to the INMP405 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at f C = 1/(2 x C x R) where R is the input impedance of the codec. A minimum value of 2.2 F is recommended in Figure 6 because the input impedance of codecs can be as low as 2 k at its highest PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. Figure 7 shows the INMP405 connected to an op amp configured as a non-inverting preamplifier. MI CBIAS 0.1 F ADC OR CODEC VDD 2.2 F M I NI M UM INM P405 INPUT O U T P UT G ND Figure 6. INMP405 Connected to a Codec 1.8-3.3 V GAIN = (R1 + R2)/R1 R1 R2 VREF 0.1F VDD INMP405 AMP 1F MINIMUM OUTPUT GND 10k VREF Figure 7. INMP405 Connected to an Op Amp Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 8 of 13 VOUT INMP405 SUPPORTING DOCUMENTS For additional information, see the following documents. EVALUATION BOARD USER GUIDE UG-325 Analog Output MEMS Microphone Flex Evaluation Board APPLICATION NOTE (PRODUCT SPECIFIC) AN-0207 High Performance Analog MEMS Microphone's Simple Interface to SigmaDSP Audio Codec AN-0262 Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating APPLICATION NOTES (GENERAL) AN-1003 Recommendations for Mounting and Connecting the Invensense Bottom-Ported MEMS Microphones AN-1068 Reflow Soldering of the MEMS Microphone AN-1112 Microphone Specifications Explained AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140 Microphone Array Beamforming AN-1165 Op Amps for MEMS Microphone Preamp Circuits AN-1181 Using a MEMS Microphone in a 2-Wire Microphone Circuit Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 9 of 13 INMP405 PCB DESIGN AND LAND PATTERN LAYOUT The recommended PCB land pattern for the INMP405 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. 1.52 0.68 1.22 0.61 O1.55 1.90 O0.95 0.61 0.90 Figure 8. PCB Land Pattern Layout Dimensions shown in millimeters 1.55/1.05 DIA. 0.225 CUT WIDTH (2x) 0.8 x 0.6 2x 1.22 0.2 x 45 TYP 1.52mm Figure 9. Suggested Solder Paste Stencil Pattern Layout Dimensions shown in millimeters Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 10 of 13 INMP405 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: * Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. * Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. * Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 1 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Document Number: DS-INMP405-00 Revision: 1.0. Rev Date: 02/06/2014 Page 11 of 13 INMP405 OUTLINE DIMENSIONS 3.425 3.350 3.275 0.75 REF REFERENCE CORNER 3.06 REF PIN 1 1.08 1.52 0.30 BSC 0.25 NOM DIA. 0.20 MIN THRU HOLE 0.90 x 0.68 (PINS 1, 3) 1.56 DIA. 1 2.575 2.500 2.425 0.95 DIA. 0.54 REF 2 1.22 BSC 2.21 REF 1.25 3 TOP VIEW 0.98 0.88 0.78 0.65 REF SIDE VIEW 0.64 REF 0.20 TYP x 45 BOTTOM VIEW 0.21 REF Figure 10. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV] 3.35 x 2.50 mm Body Dimensions shown in millimeters PART NUMBER PIN 1 INDIC ATION 4 05 YY XXX DATE CODE LOT TRACEABILITY CODE Figure 11. Package Marking Specification (Top View) ORDERING GUIDE PART 1 INMP405ACEZ-R0 * 1 INMP405ACEZ-R7 TEMP RANGE -40C to +85C PACKAGE 3-Terminal LGA_CAV QUANTITY 10,000 -40C to +85C 3-Terminal LGA_CAV 1,000 EV_INMP405-FX -- Flex Evaluation Board -- * - 13" Tape and Reel - 7" Tape and reel to be discontinued. Check with sales@invensense.com for availability. 1 Z = RoHS-Compliant Part REVISION HISTORY REVISION DATE REVISION DESCRIPTION 02/06/2014 1.0 Initial Release Document Number: DS-INMP405-00 Revision: 1.0 Rev Date: 02/06/2014 Page 12 of 13 (SOUND PORT) INMP405 Compliance Declaration Disclaimer: InvenSense believes this compliance information to be correct but cannot guarantee accuracy or completeness. Conformity documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. Environmental Declaration Disclaimer: InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. (c)2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. (c)2014 InvenSense, Inc. All rights reserved. Document Number: DS-INMP405-00 Revision: 1.0 Rev Date: 02/06/2014 Page 13 of 13