1658437-2 - Tyco Electronics

Qualification Test

Report 501-616

23Jan06 Rev A

MICTOR SB (True SMT) Connector

Harrisburg, PA

All International Rights Reserved

* Trademark

| Indicates change 1 of 6

LOC B

1. INTRODUCTION

1.1. Purpose

Testing was performed on T y c o E lectroni c s MI CTOR S B c onnec tors to deter mine their c onfor manc e to

the requirement s of Pr oduc t Specification 108-2139, Revision A.

1.2. Scope

This report c overs the el ec trical , mechanical , and environment al perfor manc e of Tyco E lect r onics

MICTOR S B c onnec tors. Testing was perfor med at the Engineeri ng A ssurance Produc t Testing

Laborator y between 18Jul05 and 15O c t05. T he test file number for thi s testing i s CTLB 042234- 013.

This docum entation i s on file at and available from the Engi neer ing Assurance Produc t Testing

Laboratory.

1.3. Conclusion

The T y c o E lectroni c s MI CTOR S B c onnec tors listed i n par agr aph 1.5 conformed to the elect r ical,

m ec hanical, and envi r onment al performanc e r equirements of P r oduc t Specification 108-2168,

Revision A.

1.4. Product Descri ption

The MICTOR SB connec tors are mi c r ostr ip style connectors consisti ng of two rows of si gnal cont ac ts

divi ded by a c enter power ground plane. They ar e si mil ar to MI CTOR, but utilizing single beam si gnal

contac ts instead of dual beam cont ac ts. Unlike M ICTO R, MI CTOR SB has surface mount gr ound bus

leads i nstead of thru-hole l eads.

1.5. Test Spec imens

Test speci mens were representative of nor mal producti on lots. S pec imens ident ified with the fol lowing

part number s were used for test:

Test G r oup Quant it y Part Number Descripti on

17 1658012-5 MICTOR S B 200 posi tion r ec eptacle

7 1658013-5 MICTOR S B 200 posi tion 5.0 mm plug

23 1658012-5 MICTOR S B 200 posi tion r ec eptacle

3 1658013-5 MICTOR S B 200 posi tion 5.0 mm plug

3,4 5 each 1658012-5 MICTOR S B 200 posi tion r ec eptacle

5 each 1658013-5 MICTOR SB 200 posi tion 5.0 mm plug

All specim ens c ons is ted of 5 m odules , each containing 40 signal cont ac ts and 1 ground

NOTE

contact.

Figure 1

501-616

Rev A 2 of 6

1.6. Environment al Conditions

Unless otherwise stated, the fol lowing environmental c onditions prevailed duri ng testi ng:

Temperature: 15 to 35

Relati ve Hum idity: 25 to 75%

1.7. Quali ficati on Test Sequence

Test or E xamination

Test G r oup ( a)

1234

Test Sequenc e ( b)

Initial examination of produc t 1111

Low level cont ac t resistanc e 3,7 2,4

I nsulation r esistan ce 2,6

Wit hstanding volt age 3,7

Solderability, dip test 2

Vi br ati on, random 5

Mechanical shock, half-si ne 6

Durability 4

Mating f orce 2

Unm ati ng for c e 8

Thermal shock 4

Hum idity- temperat ur e c y c li ng 5

Temperature l ife 3(c)

Final examination of produc t 9583

(a) See paragraph 1.5.

NOTE

(b) Numbers indicat e s equenc e in which t es ts are per formed.

Figure 2

501-616

Rev A 3 of 6

2. SUMMARY OF TEST I NG

2.1. Initial E xamination of Pr oduc t - All Test Gr oups

Al l speci mens submitted for t esting were representat ive of nor mal production lot s. A Cer tificate of

Conformance was issued by Pr oduc t Assurance. Where specified, specimens were visually exami ned

and no evidence of phy si c al damage detr imental t o pr oduc t performance was observed.

2.2. Low Lev el Cont ac t Resistance - Test Gr oups 1 and 2

Low level cont ac t resistanc e measurements had a change in resistanc e (

)

R) of less than 15 milliohms

for signal cont ac ts and 5 milliohms for ground cont ac ts after t esting.

Test

Conditions Actual Resistanc e Change In Resistanc e

Mi n Max Mean Mi n

)

RMax

)

R Mean

)

Test G r oup 1, Signal Contact s (N = 600)

Initial 20.133 23.877 21.978 --- --- ---

Final 21.133 24.765 22.728 -0.649 2.888 0.822

Test G r oup 1, Gr ound Contacts (N = 15)

Initial 0.318 0.399 0.342 --- --- ---

Final 0.342 0.417 0.370 0.002 0.072 0.028

Test G r oup 2, Signal Contact s (N = 600)

Initial 20.258 25.527 22.187 --- --- ---

Final 20.263 29.547 22.216 -2.379 5.681 0.030

Test G r oup 2, Gr ound Contacts (N = 15)

Initial 0.284 0.316 0.299 --- --- ---

Final 0.305 0.351 0.321 0.000 0.052 0.022

All Values in m illiohm s .

NOTE

Figure 3

2.3. Insulati on Resi stanc e - Test Group 3

Al l insulation resi stanc e measurements were greater than 5000 megohm s (5. 0 x 109 ohms) initially and

1000 m egohms (1. 0 x 109 ohms) fi nall y .

Test

Conditions Insulat ion Resistanc e

Min Max Mean

Test G r oup 3, Adjacent S ignal Contac ts N = 5

Initial 3.2 X 1012 2.0 X 1014 1.1 X 1014

Final 2.0 X 1013 6.0 X 1013 3.6 X 1013

Test G r oup 3, Signal Contact s To Ground N = 5

Initial 2.0 X 1012 1.6 X 1014 6.3 X 1013

Final 2.0 x 1013 5.0 x 1013 3.4 X 1013

All values in ohm s .

NOTE

Figure 4

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Rev A 4 of 6

2.4. Wit hstanding Voltage - Test Group 3

No dielectri c br eak down, flashover or leakage gr eater than 0.5 milliampere occurred.

2.5. Solderability - Test Group 4

Al l contact leads had a m inim um of 95% sol der c overage.

2.6. Vi br ati on, Random - Test Gr oup 1

No discont inuities greater than 1 mic r osecond were detected during vibrat ion t esting. Fol lowing

vibrat ion t esting, no c r ac k s, br eak s, or loose parts on the speci mens were vi si ble.

2.7. Mechanical Shock, Hal f-Sine - Test Gr oup 1

No discont inuities greater than 1 mic r osecond were detected during m ec hanical shock testing.

Foll owing mechanical shock t esting, no c r ac k s, br eak s, or loose parts on the specim ens were visibl e.

2.8. Durability - Test Group 1

No physical damage occur r ed as a result of mating and unmating t he specim ens 100 times.

2.9. Mating F or c e - Test Group 1

Al l mating for c e measurements were less than 22.2 N [ 80 oz f] per modul e.

2.10. Unm ati ng Force - Test Gr oup 1

Al l unmating for c e measurements were greater than 5.6 N [ 20 oz f] per modul e.

2.11. Thermal Shock - Test Gr oup 4

No evidence of phy si c al damage was visible as a result of exposure t o thermal shock.

2.12. Hum idity- temperat ur e Cy c li ng - Test Gr oup 4

No evidence of physical dam age was visibl e as a result of exposure to humi dity-tem perature cycling.

2.13. Temperature Li fe - Test G r oup 2

No evidence of phy si c al damage was visible as a result of exposure t o tem per ature li fe.

2.14. Final E xamination of Pr oduc t - All Test Groups

Specimens wer e visual ly examined and no evidence of phy si c al damage detr imental t o pr oduc t

performance was observed.

3. T EST METHODS

3.1. Initial E xamination of Pr oduc t

A Cert ificat ion of Confor mance was issued certi fy ing t hat all T y c o E lectroni c s specimens i n this test

package have been produced, inspected, and ac c epted as conformi ng to product drawing

requi r ements, and were manufac tured using the same cor e manufac turing processes and technologies

as production part s.

501-616

Rev A 5 of 6

3.2. Low Lev el Cont ac t Resistance

Termination resi stanc e measurements at low level cur r ent were made usi ng a 4 termi nal measuring

technique. The test cur r ent was m aint ained at 100 milliamperes m aximum with a 20 millivolt

m aximum open circuit voltage. A total of 200 signal cont ac ts and 5 grounds cont ac ts were measured

on each specimen.

3.3. Insulati on Resi stanc e

Insulati on r esi stanc e was measured between 6 randomly sel ec ted adj ac ent signal contac ts on each

m ated but unmount ed specimen, and then between all previously tested signal contac ts and the

ground cont ac ts. A t est voltage of 500 volt s DC was applied for 2 minutes or meter stabilization before

the resi stanc e was recorded.

3.4. Dielectri c Withstanding Voltage

A test potential of 675 vol ts AC was applied between the sam e c ontacts used f or insulation r esi stanc e

testing. This potenti al was appl ied at a r ate of 500 volt s per second, held for 1 minute, and then

retur ned to zero. The leakage cur r ent was monitor ed for a m aximum of 0.5 milliampere.

3.5. Solderability

Prior t o testing, specimens were prepared by removing the loc ati ng studs to enable the specimens to

sit flush on the cer amic substrate. A solder paste with a composition of 63 Sn/37 Pb RM A , Vi sc. /KCPS

1000 10%, wit h a mesh of -325 +500 was then plac ed onto a stencil with pad geometr y , opening, and

thickness that was appropriate for t he specimens being tested. The stenc il was supplied wit h the

specimens. T he sol der paste was print ed onto a 4.5 X 4.5 X .0395 inch cer amic substrate. The screen

was r emoved and the speci mens were placed ont o the solder paste pr int usi ng appr opr iate

m agnificat ion. Car e was taken to ensure t hat the speci mens were not cont aminated in any way and

were tested in the "as received" condi ti on. The speci mens and ceramic substrates were placed on a

conveyor bel t through an infrar ed oven. The specimens were exposed for 60 seconds between

temperatures of 150 and 170

C and for 60 seconds between 215 and 230

C. T he temperatur e on the

ceramic substrate, at a poi nt close to the speci men, was monit or ed to enable temperatur e pr ofiling

shown in Figure 5.

Figure 5

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Rev A 6 of 6

3.6. Vi br ati on, Random

Paramet er s of this test condit ion are speci fied by a r andom vibr ation spect r um with ex c it ation

frequency bounds of 50 and 2000 Hz. The power spectral densit y (PSD) at 50 Hz is 0.01 G² / Hz. The

spectrum slopes up at 6 dB per oc tave to a PSD of 0.04 G² /Hz at 100 Hz . The spect r um is f lat at 0.04

G²/Hz from 100 Hz to 1000 Hz. The spectrum slopes down at 6 dB per octave to a PSD of 0.01 G²/Hz

at t he upper bound frequency of 2000 Hz. The r oot-mean square am plitude of the ex c it ation was 7.56

GRMS . The specim ens were subjected to this test for 1 hour in each of the 3 mutuall y per pendicular

ax es, for a tot al test ti me of 3 hour s. Test specimens were monitored for discont inui ti es of 1

m icr osecond or gr eater using an energizing cur r ent of 100 milliamperes.

3.7. Mechanical Shock, Hal f-Sine

Paramet er s of this test condit ion are a half-sine wavefor m with an accelerat ion ampl itude of 50 gravity

units (g's peak) and a durat ion of 11 milliseconds. Thr ee shocks i n eac h direc tion were appl ied along

the 3 mut uall y per pendicular axes for a t otal of 18 shocks. Test specimens were monitored for

discont inuities of 1 microsecond or gr eater using an ener gizing curr ent of 100 milliamperes.

3.8. Durability

Specimens were manually mated and unmat ed for 100 cycles at a rate not exceeding 500 cycles per

hour.

3.9. Mating F or c e

Specimens wer e mated at a maxi mum rate of 12.7 mm [ .5 i n] per mi nute. Peak mati ng for c e was

recorded.

3.10. Unm ati ng Force

Specimens wer e unmated at a maxi mum rate 12.7 mm [ 0.5 in] per mi nute. P eak unmat ing for c e was

recorded.

3.11. Thermal Shock

Specimens were pl aced in a thermal shock chamber and subjected t o 5 cycles between -65 and

125

C. Exposure t ime at eac h temperatur e extreme was 0.5 hour and t he transf er ti me was less than 1

minute.

3.12. Hum idity- temperat ur e Cy c li ng

Specimens were subjected to 10, 24 hour cycles of humidity-temperature cycli ng between 25 and 65

at 95% relat ive humidi ty.

3.13. Temperature Li fe

Specimens wer e pr ec ondit ioned with 3 dur ability cycles. Specimens were t hen exposed to a dry heat

temperature of 105

C for 300 hours.

3.14. Final E xamination of Pr oduc t

Specimens wer e visual ly examined and no evidence of phy si c al damage detr imental t o pr oduc t

performance was observed.