SGP30 - SENSIRION - Datasheet.Live

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Datasheet SGP30

Sensirion Gas Platform

 Multi-pixel gas sensor for indoor air quality applications

 Outstanding long-term stability

 I2C interface with TVOC and CO2eq output signals

 Very small 6-pin DFN package: 2.45 x 2.45 x 0.9 mm3

 Low power consumption: 48 mA at 1.8V

 Tape and reel packaged, reflow solderable

Block Diagram

Figure 1 Functional block diagram of the SGP30.

Product Summary

The SGP30 is a digital multi-pixel gas sensor designed for

easy integration into air purifier, demand-controlled

ventilation, and IoT applications. Sensirion’s CMOSens®

technology offers a complete sensor system on a single

chip featuring a digital I2C interface, a temperature

controlled micro hotplate, and two preprocessed indoor air

quality signals. As the first metal-oxide gas sensor

featuring multiple sensing elements on one chip, the

SGP30 provides more detailed information about the air

quality.

The sensing element features an unmatched robustness

against contaminating gases present in real-world

applications enabling a unique long-term stability and low

drift. The very small 2.45 x 2.45 x 0.9 mm3 DFN package

enables applications in limited spaces. Sensirion’s

state-of-the-art production process guarantees high

reproducibility and reliability. Tape and reel packaging,

together with suitability for standard SMD assembly

processes make the SGP30 predestined for high-volume

applications.

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1 Sensor Performance

1.1 Gas Sensing Performance

Parameter

Signal

Values

Comments

Measurement

range1

Ethanol signal

0 ppm to 1000 ppm

H2 signal

0 ppm to 1000 ppm

Specified

measurement

range

Ethanol signal

0.3 ppm to 30 ppm

The specifications below are defined for this measurement

range2. The specified measurement range covers the gas

concentrations expected in indoor air quality applications.

H2 signal

0.5 ppm to 10 ppm

Accuracy3

Ethanol signal

see Figure 2

typ.: 15% of meas. value

Accuracy of the concentration c

determined by

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a = 512

sout: EthOH/H2 signal output

at concentration c

sref: EthOH/H2 signal output

at 0.5 ppm H2

cref = 0.4 ppm

H2 signal

see Figure 3

typ.: 10% of meas. value

cref = 0.5 ppm

Long-term

drift3,4

Ethanol signal

see Figure 4

typ.: 1.3% of meas. value

Change of accuracy over time: Siloxane accelerated lifetime

test5

H2 signal

see Figure 5

typ.: 1.3% of meas. value

Resolution

Ethanol signal

0.2 % of meas. value

Resolution of Ethanol and H2 signal outputs in relative

change of the measured concentration

H2 signal

Sampling

frequency

Ethanol signal

Max. 40 Hz

Compare with minimum measurement duration in Table 10

H2 signal

Table 1 Gas sensing performance. Specifications are at 25°C, 50% RH and typical VDD.

Accuracy ethanol signal

Figure 2 Typical and maximum accuracy tolerance in % of

measured value at 25°C, 50% RH and typical VDD. The sensors

have been operated for at least 24h before the characterization.

Accuracy H2 signal

Figure 3 Typical and maximum accuracy tolerance in % of

measured value at 25°C, 50% RH and typical VDD. The sensors

have been operated for at least 60h before the characterization.

Exposure to ethanol and H2 concentrations up to 1000 ppm have been tested. For applications requiring the measurement of higher gas

concentrations please contact Sensirion.

ppm: parts per million. 1 ppm = 1000 ppb (parts per billion)

90% of the sensors will be within the typical accuracy tolerance, >99% are within the maximum tolerance.

The long-term drift is stated as change of accuracy per year of operation.

Test conditions: operation in 250 ppm Decamethylcyclopentasiloxane (D5) for 200h simulating 10 years of operation in an indoor

environment.

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Long-term drift Ethanol signal

Figure 4 Typical and maximum long-term drift in % of measured

value at 25°C, 50% RH and typical VDD. The sensors have been

operated for at least 24h before the first characterization.

Long-term drift H2 signal

Figure 5 Typical and maximum long-term drift in % of measured

value at 25°C, 50% RH and typical VDD. The sensors have been

operated for at least 60h before the first characterization.

1.2 Air Quality Signals

Parameter

Signal

Values

Comments

Output range

TVOC signal

0 ppb to 60000 ppb

Maximum possible output range. The gas

sensing performance is specified for the

measurement range as defined in Table 1

CO2eq signal

400 ppm to 60000 ppm

Resolution

TVOC signal

0 ppb - 2008 ppb

1 ppb

2008 ppb – 11110 ppb

6 ppb

11110 ppb – 60000 ppb

32 ppb

CO2eq signal

400 ppm – 1479 ppm

1 ppm

1479 ppm – 5144 ppm

3 ppm

5144 ppm – 17597 ppm

9 ppm

17597 ppm – 60000 ppm

31 ppm

Sampling rate

TVOC signal

1 Hz

The on-chip baseline compensation algorithm

has been optimized for this sampling rate. The

sensor shows best performance when used

with this sampling rate.

CO2eq signal

1 Hz

Table 2 Air quality signal specifications.

Figure 6 Simplified version of the functional block diagram (compare Figure 1) showing the signal

paths of the SGP30.

1.3 Recommended Operating Conditions

The sensor shows best performance when operated within recommended normal temperature and humidity range of

5 – 55 °C and 4 –20 g/m3, respectively. Long-term exposure (operated and not operated) to conditions outside the

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recommended range, especially at high humidity, may affect the sensor performance. Prolonged exposure to extreme

conditions may accelerate aging. To ensure stable operation of the gas sensor, the conditions described in the document SGP

Handling and Assembly Instructions regarding exposure to exceptionally high concentrations of some organic or inorganic

compounds have to be met, particularly during operation. Please also refer to the Design-in Guide for optimal integration of the

SGP30.

2 Electrical Specifications

Parameter

Min.

Typ.

Max.

Unit

Comments

Supply voltage VDD

1.62

1.8

1.98

Minimal voltage must be guaranteed also for the

maximum supply current specified in this table.

Hotplate supply voltage VDDH

1.62

1.8

1.98

Supply current in measurement mode6

48.2

The measurement mode is activated by sending

an “Init_air_quality” or “Measure_raw_signal”

command. Specified at 25°C and typical VDD.

Sleep current

μA

The sleep mode is activated after power-up or

after a soft reset. Specified at 25°C and typical

VDD.

LOW-level input voltage

-0.5

0.3*VDD

HIGH-level input voltage

0.7*VDD

VDD+0.5

Vhys hysteresis of Schmitt trigger inputs

0.05*VDD

LOW-level output voltage

0.2*VDD

(open-drain) at 2mA sink current

Communication

Digital 2-wire interface, I2C fast mode.

Table 3 Electrical specifications.

3 Interface Specifications

The SGP30 comes in a 6-pin DFN package, see Table 4.

Name

Comments

VDD

Supply voltage

VSS

Ground

SDA

Serial data, bidirectional

Connect to ground (no electrical function)

VDDH

Supply voltage, hotplate

SCL

Serial clock, bidirectional

Table 4 Pin assignment (transparent top view). Dashed lines are only visible from the bottom.

A 20% higher current is drawn during 5ms on VDDH after entering the measurement mode.

A X0

8 9

SGP

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Figure 7 Typical application circuit (for better clarity in the image, the positioning of the pins does

not reflect the positions on the real sensor).

The electrical specifications of the SGP30 are shown in Table 3. The power supply pins must be decoupled with a 100 nF

capacitor that shall be placed as close as possible to pin VDD – see Figure 7. The required decoupling depends on the power

supply network connected to the sensor. We also recommend VDD and VDDH pins to be shorted

SCL is used to synchronize the communication between the microcontroller and the sensor. The SDA pin is used to transfer

data to and from the sensor. For safe communication, the timing specifications defined in the I2C manual

must be met. Both

SCL and SDA lines are open-drain I/Os with diodes to VDD and VSS. They should be connected to external pull-up resistors.

To avoid signal contention, the microcontroller must only drive SDA and SCL low. The external pull-up resistors

(e.g. Rp = 10 kΩ) are required to pull the signal high. For dimensioning resistor sizes please take bus capacity and

communication frequency into account (see for example Section 7.1 of NXPs I2C Manual for more details8). It should be noted

that pull-up resistors may be included in I/O circuits of microcontrollers.

The die pad or center pad is electrically connected to GND. Hence, electrical considerations do not impose constraints on the

wiring of the die pad. However, for mechanical stability it is recommended to solder the center pad to the PCB.

4 Absolute Minimum and Maximum Ratings

Stress levels beyond those listed in Table 5 may cause permanent damage to the device. These are stress ratings only and

functional operation of the device at these conditions cannot be guaranteed. Exposure to the absolute maximum rating

conditions for extended periods may affect the reliability of the device.

Parameter

Rating

Supply voltage VDD

-0.3 V to +2.16 V

Supply voltage VDDH

-0.3 V to +2.16 V

Storage temperature range

-40 to +125°C

Operating temperature range

-40 to +85°C

Humidity Range

10% - 95% (non-condensing)

ESD HBM

2 kV

ESD CDM

500 V

Latch up, JESD78 Class II, 125°C

100 mA

Table 5 Absolute minimum and maximum ratings.

Please contact Sensirion for storage, handling and assembly instructions.

If VDD and VDDH are not shorted, it is required that VDD is always powered when VDDH is powered. Otherwise, the sensor might be

damaged.

http://www.nxp.com/documents/user_manual/UM10204.pdf

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5 Timing Specifications

5.1 Sensor System Timings

The timings refer to the power up and reset of the ASIC part and do not reflect the usefulness of the readings.

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Comments

Power-up time

tPU

After hard reset, VDD ≥VPOR

0.4

0.6

Soft reset time

tSR

After soft reset

0.4

0.6

Table 6 System timing specifications.

5.2 Communication Timings

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Comments

SCL clock frequency

fSCL

400

kHz

Hold time (repeated) START

condition

tHD;STA

After this period, the

first clock pulse is

generated

0.6

µs

LOW period of the SCL clock

tLOW

1.3

µs

HIGH period of the SCL clock

tHIGH

0.6

µs

Set-up time for a repeated

START condition

tSU;STA

0.6

µs

SDA hold time

tHD;DAT

SDA set-up time

tSU;DAT

100

SCL/SDA rise time

300

SCL/SDA fall time

300

SDA valid time

tVD;DAT

0.9

µs

Set-up time for STOP condition

tSU;STO

0.6

µs

Capacitive load on bus line

400

Table 7 Communication timing specifications.

Figure 8 Timing diagram for digital input/output pads. SDA directions are seen from the sensor.

Bold SDA lines are controlled by the sensor; plain SDA lines are controlled by the micro-controller.

Note that SDA valid read time is triggered by falling edge of preceding toggle.

SCL

70%

30%

tLOW

1/fSCL

tHIGH

SDA

70%

30%

tSU;DAT

tHD;DAT

DATA IN

SDA

70%

30%

DATA OUT

tVD;DAT

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6 Operation and Communication

The SGP30 supports I2C fast mode. For detailed information on the I2C protocol, refer to NXP I2C-bus specification8. All

SGP30 commands and data are mapped to a 16-bit address space. Additionally, data and commands are protected with a

CRC checksum to increase the communication reliability. The 16-bit commands that are sent to the sensor already include a

3-bit CRC checksum. Data sent from and received by the sensor is always succeeded by an 8-bit CRC.

In write direction it is mandatory to transmit the checksum, since the SGP30 only accepts data if it is followed by the correct

checksum. In read direction it is up to the master to decide if it wants to read and process the checksum.

SGP30

Hex. Code

I2C address

0x58

Table 8 I2C device address.

The typical communication sequence between the I2C master (e.g., a microcontroller in a host device) and the sensor is

described as follows:

1. The sensor is powered up, communication is initialized

2. The I2C master periodically requests measurement and reads data, in the following sequence:

a. I2C master sends a measurement command

b. I2C master waits until the measurement is finished, either by waiting for the maximum execution time or by

waiting for the expected duration and then poll data until the read header is acknowledged by the sensor

(expected durations are listed in Table 10)

c. I2C master reads out the measurement result

6.1 Power-Up and Communication Start

The sensor starts powering-up after reaching the power-up threshold voltage VPOR specified in Table 6. After reaching this

threshold voltage, the sensor needs the time tPU to enter the idle state. Once the idle state is entered it is ready to receive

commands from the master.

Each transmission sequence begins with a START condition (S) and ends with a STOP condition (P) as described in the I2C-

bus specification.

6.2 Measurement Communication Sequence

A measurement communication sequence consists of a START condition, the I2C write header (7-bit I2C device address plus 0

as the write bit) and a 16-bit measurement command. The proper reception of each byte is indicated by the sensor. It pulls the

SDA pin low (ACK bit) after the falling edge of the 8th SCL clock to indicate the reception. With the acknowledgement of the

measurement command, the SGP30 starts measuring.

When the measurement is in progress, no communication with the sensor is possible and the sensor aborts the

communication with a XCK condition.

After the sensor has completed the measurement, the master can read the measurement results by sending a START

condition followed by an I2C read header. The sensor will acknowledge the reception of the read header and responds with

data. The response data length is listed in Table 10 and is structured in data words, where one word consists of two bytes of

data followed by one byte CRC checksum. Each byte must be acknowledged by the microcontroller with an ACK condition for

the sensor to continue sending data. If the sensor does not receive an ACK from the master after any byte of data, it will not

continue sending data.

After receiving the checksum for the last word of data, an XCK and STOP condition have to be sent (see Figure 9).

The I2C master can abort the read transfer with a XCK followed by a STOP condition after any data byte if it is not interested in

subsequent data, e.g. the CRC byte or following data bytes, in order to save time. Note that the data cannot be read more

than once, and access to data beyond the specified amount will return a pattern of 1s.

6.3 Measurement Commands

The available measurement commands of the SGP30 are listed in Table 10.

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Air Quality Signals

The SGP30 uses a dynamic baseline compensation algorithm and on-chip calibration parameters to provide two

complementary air quality signals. Based on the sensor signals a total VOC signal (TVOC) and a CO2 equivalent signal

(CO2eq) are calculated. Sending an “Init_air_quality” command starts the air quality measurement. After the “Init_air_quality”

command, a “Measure_air_quality” command has to be sent in regular intervals of 1s to ensure proper operation of the

dynamic baseline compensation algorithm. The sensor responds with 2 data bytes (MSB first) and 1 CRC byte for each of the

two preprocessed air quality signals in the order CO2eq (ppm) and TVOC (ppb). For the first 15s after the “Init_air_quality”

command the sensor is in an initialization phase during which a “Measure_air_quality” command returns fixed values of

400 ppm CO2eq and 0 ppb TVOC.

The SGP30 also provides the possibility to read and write the baseline values of the baseline correction algorithm. This feature

is used to save the baseline in regular intervals on an external non-volatile memory and restore it after a new power-up or soft

reset of the sensor. The command “Get_baseline” returns the baseline values for the two air quality signals. The sensor

responds with 2 data bytes (MSB first) and 1 CRC byte for each of the two values in the order CO2eq and TVOC. These two

values should be stored on an external memory. After a power-up or soft reset, the baseline of the baseline correction

algorithm can be restored by sending first an “Init_air_quality” command followed by a “Set_baseline” command with the two

baseline values as parameters in the order as (TVOC, CO2eq). An example implementation of a generic driver for the baseline

algorithm can be found in the document SGP30_driver_integration_guide.

A new “Init_air_quality” command has to be sent after every power-up or soft reset.

Sensor Raw Signals

The command “Measure_raw_signals” is intended for part verification and testing purposes. It returns the sensor raw signals

which are used as inputs for the on-chip calibration and baseline compensation algorithms as shown in Figure 6. The

command performs a measurement to which the sensor responds with 2 data bytes (MSB first) and 1 CRC byte (see Figure

9) for 2 sensor raw signals in the order H2_signal (sout_H2) and Ethanol_signal (sout_EthOH). Both signals can be used to calculate

gas concentrations c relative to a reference concentration cref by

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with a = 512, sref the H2_signal or Ethanol_signal output at the reference concentration, and sout = sout_H2 or sout = sout_EthOH.

Humidity Compensation

The SGP30 features an on-chip humidity compensation for the air quality signals (CO2eq and TVOC) and sensor raw signals

(H2-signal and Ethanol_signal). To use the on-chip humidity compensation an absolute humidity value from an external

humidity sensor like the SHTxx is required. Using the “Set_humidity” command, a new humidity value can be written to the

SGP30 by sending 2 data bytes (MSB first) and 1 CRC byte. The 2 data bytes represent humidity values as a fixed-point 8.8bit

number with a minimum value of 0x0001 (=1/256 g/m3) and a maximum value of 0xFFFF (255 g/m3 + 255/256 g/m3). For

instance, sending a value of 0x0F80 corresponds to a humidity value of 15.50 g/m3 (15 g/m3 + 128/256 g/m3).

After setting a new humidity value, this value will be used by the on-chip humidity compensation algorithm until a new humidity

value is set using the “Set_humidity” command. Restarting the sensor (power-on or soft reset) or sending a value of 0x0000

(= 0 g/m3) sets the humidity value used for compensation to its default value (0x0B92 = 11.57 g/m3) until a new humidity value

is sent. Sending a humidity value of 0x0000 can therefore be used to turn off the humidity compensation.

Feature Set

The SGP30 features a versioning system for the available set of measurement commands and on-chip algorithms. This so

called feature set version number can be read out by sending a “Get_feature_set_version” command. The sensor responds

with 2 data bytes (MSB first) and 1 CRC byte (see Table 9). This feature set version number is used to refer to a

corresponding set of available measurement commands as listed in Table 10.

Most significant byte (MSB)

Least significant byte (LSB)

Bit

Product type

SGP30: 0

Reserved for

future use

Product version

Table 9 Structure of the SGP feature set number. Please note that the last 5 bits of the product

version (bits 12-16 of the LSB) are subject to change. This is used to track new features added to

the SGP multi-pixel platform.

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Measure Test

The command “Measure_test” which is included for integration and production line testing runs an on-chip self-test. In case of

a successful self-test the sensor returns the fixed data pattern 0xD400 (with correct CRC).

Feature Set

0x0020

Command

Hex. Code

Parameter length

including CRC [bytes]

Response length

including CRC [bytes]

Measurement

duration [ms]

Typ.

Max.

Init_air_quality

0x2003

Measure_air_quality

0x2008

Get_baseline

0x2015

Set_baseline

0x201e

Set_humidity

0x2061

Measure_test9

0x2032

200

220

Get_feature_set_version

0x202f

Measure_raw_signals

0x2050

Table 10 Measurement commands.

6.4 Soft Reset

A sensor reset can be generated using the “General Call” mode according to I2C-bus specification. It is important to

understand that a reset generated in this way is not device specific. All devices on the same I2C bus that support the General

Call mode will perform a reset. The appropriate command consists of two bytes and is shown in Table 11.

The «Measure_Test» command is intended for production line testing and verification only. It should not be used after having issued an

“Init_air_quality” command. For the duration of the «Measure_Test» command, the sensor is operated in measurement mode with a supply

current as specified in Table 3. After the command, the sensor is in sleep mode.

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Command

Hex. Code

Address byte

0x00

Second byte

0x06

Reset Command using the General Call address

0x0006

Table 11 Reset through the General Call address (Clear blocks are controlled by the microcontroller, grey blocks by the sensor.).

6.5 Get Serial ID

The readout of the serial ID register can be used to identify the chip and verify the presence of the sensor. The appropriate

command structure is shown in Table 12. After issuing the measurement command and sending the ACK Bit the sensor

needs the time tIDLE = 0.5ms to respond to the I2C read header with an ACK Bit. Hence, it is recommended to wait tIDLE =0.5ms

before issuing the read header.

The get serial ID command returns 3 words, and every word is followed by an 8-bit CRC checksum. Together the 3 words

constitute a unique serial ID with a length of 48 bits.

The ID returned with this command are represented in the big endian (or MSB first) format.

Command

Hex. Code

Get Serial ID

0x3682

Table 12 Get serial ID command.

6.6 Checksum Calculation

The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm. Its properties are displayed in

Table 13. The CRC covers the contents of the two previously transmitted data bytes. To calculate the checksum only these

two previously transmitted data bytes are used.

Property

Value

Name

CRC-8

Width

8 bit

Protected Data

read and/or write data

Polynomial

0x31 (x8 + x5 + x4 + 1)

Initialization

0xFF

Reflect input

False

Reflect output

False

Final XOR

0x00

Examples

CRC (0xBEEF) = 0x92

Table 13 I2C CRC properties.

ACK

General Call Address

1 2 3 4 5 6 7 8 9

ACK

Reset Command

1 2 3 4 5 6 7 8 9

General Call 1st byte General Call 2nd byte

ACK

I2C Address

1 2 3 4 5 6 7 8 9

ACK

Command MSB

123456789

ACK

Command LSB

10 11 12 13 14 15 16 17 18

16-bit command

I2C write header

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6.7 Communication Data Sequences

Figure 9 Communication sequence for starting a measurement and reading measurement results.

7 Quality

7.1 Environmental Stability

The qualification of the SGP30 will be performed based on the JEDEC JESD47 qualification test method.

7.2 Material Contents

The device is fully RoHS and WEEE compliant, e.g., free of Pb, Cd, and Hg.

8 Device Package

SGP30 sensors are provided in a DFN (dual flat no leads) package with an outline of 2.45 × 2.45 × 0.9 mm3 and a terminal

pitch of 0.8 mm. The circular sensor opening of maximally 1.6 mm diameter is centered on the top side of the package. The

sensor chip is assembled on a Ni/Pd/Au plated copper lead frame. Sensor chip and lead frame are over-molded by a black,

epoxy-based mold compound. Please note that the side walls of the package are diced and therefore the lead frame sidewall

surfaces are not plated.

8.1 Moisture Sensitivity Level

The Moisture Sensitivity Level classification of the SGP30 is MSL1, according to IPC/JEDEC J-STD-020.

8.2 Traceability

All SGP30 sensors are laser marked for simple identification and traceability. The marking on the sensor consists of the

product name and a 4-digit, alphanumeric tracking code. This code is used by Sensirion for batch-level tracking throughout

production, calibration, and testing. Detailed tracking data can be provided upon justified request. The pin-1 location is

indicated by the keyhole pattern in the light-colored central area. See Figure 10 for illustration.

Figure 10 Laser marking on SGP30. The pin-1 location is indicated by the keyhole pattern in the

light-colored central area. The bottom line contains a 4-digit alphanumeric tracking code

8 9

A X

SGP

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8.3 Package Outline

Figure 11 Package outlines drawing of the SGP30 with nominal values. Dimensions are given in

millimeters. The die pad shows a small recess in the bottom left part. * These dimensions are not

well defined and given as a reference only.

8.4 Landing Pattern

Figure 12 shows the PCB landing pattern. The landing pattern is understood to be the metal layer on the PCB, onto which the

DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper

traces. It is recommended to design the solder mask as a Non-Solder Mask Defined (NSMD) type. For solder paste printing it

is recommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.125 to 0.150 mm

stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, the

position of the stencil apertures should have an offset of 0.1 mm away from the package center, as indicated in Figure 12. The

die pad aperture should cover 70 – 90 % of the die pad area, resulting in a size of about 1.05 mm x 1.5 mm.

For information on the soldering process and further recommendation on the assembly process please contact Sensirion.

Figure 12 Recommended landing pattern.

2.45

0.9

1.7

0.8

1.25

0.4

0.350.3x45o

0.2*

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9 Tape & Reel Package

Figure 13 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is

to the right and trailer tape to the left on this drawing. Dimensions are given in millimeters.

10 Ordering Information

Use the part names and product numbers shown in the following table when ordering the SGP30 multi-pixel gas sensor. For

the latest product information and local distributors, visit www.sensirion.com.

Part Name

Tape & Reel Size

Product Number

SGP30, TAPE ON REEL, 2500 PCS

2500

1-101646-01

SGP30, TAPE ON REEL, 10000 PCS

10000

1-101632-01

Table 14 SGP30 ordering options

TOLERANCES - UNLESS

NOTED 1PL ±.2 2PL ±.10

A = 2.75

B = 2.75

K = 1.20

NOTES:

1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2

2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED

AS TRUE POSITION OF POCKET, NOT POCKET HOLE

3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"

ABOVE THE BOTTOM OF THE POCKET

R 0.25 TYP.

SECTION A - A

0.30 ±.05

R 0.2 MAX.

0.30 ±.05

2.00 ±.05 SEE Note 2 4.00

4.00 SEE Note 1

Ø1.5 +.1 /-0.0

Ø1.00 MIN 1.75 ±.1

12.0 +0.3/-0.1

5.50 ±.05

SEE NOTE 2

DETAIL B

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11 Important Notices

11.1 Warning, Personal Injury

Do not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal

injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing this

product, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.

If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless

SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorney

fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION

shall be allegedly negligent with respect to the design or the manufacture of the product.

11.2 ESD Precautions

The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation,

take customary and statutory ESD precautions when handling this product.

See application note “ESD, Latchup and EMC” for more information.

11.3 Warranty

SENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product shall be

of the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective,

SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:

 notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;

 such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;

 the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; and

 the warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.

This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for the

intended and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO

WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES, INCLUDING WITHOUT

LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.

SENSIRION is only liable for defects of this product arising under the conditions of operation provided for in the data sheet and proper use of the goods.

SENSIRION explicitly disclaims all warranties, express or implied, for any period during which the goods are operated or stored not in accordance with the

technical specifications.

SENSIRION does not assume any liability arising out of any application or use of any product or circuit and specifically disclaims any and all liability,

including without limitation consequential or incidental damages. All operating parameters, including without limitation recommended parameters, must be

validated for each customer’s applications by customer’s technical experts. Recommended parameters can and do vary in different applications.

SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improve

reliability, functions and design of this product.

CMOSens® is a trademark of Sensirion.

www.sensirion.com Version 0.9 – August 2017 15/15

12 Headquarters and Subsidiaries

Sensirion AG

Laubisruetistr. 50

CH-8712 Staefa ZH

Switzerland

phone: +41 44 306 40 00

fax: +41 44 306 40 30

info@sensirion.com

www.sensirion.com

Sensirion Inc., USA

phone: +1 312 690 5858

info-us@sensirion.com

www.sensirion.com

Sensirion Korea Co. Ltd.

phone: +82 31 337 7700~3

info-kr@sensirion.com

www.sensirion.co.kr

Sensirion Japan Co. Ltd.

phone: +81 3 3444 4940

info-jp@sensirion.com

www.sensirion.co.jp

Sensirion China Co. Ltd.

phone: +86 755 8252 1501

info-cn@sensirion.com

www.sensirion.com.cn

Sensirion Taiwan Co. Ltd

phone: +886 3 5506701

info@sensirion.com

www.sensirion.com

To find your local representative, please visit www.sensirion.com/distributors