UBSC/ULSC - 60+GHz Ultra Broadband Silicon Capacitors - Surface Mounted Rev 2.0 Key Features Key Applications Ultra broadband performance up to 60+GHz Resonance free Phase stability Ultra high stability of capacitance value - Temperature < 0.5% (-55C to +150C) Optoelectronics/high-speed data Trans-Impedance Amplifiers (TIA) Receive-and-Transmit Optical Sub-Assembly (ROSA/TOSA) Synchronous Optical Networking (SONET) High speed digital logic Broadband test equipment Broadband microwave/millimeter wave Replacement of X7R and NP0 Low profile applications (400 or 100 m) - Voltage < 0.1%/V - Negligible aging < 0.001%/1000 hours Low ESL High reliability (FIT < 0.017 parts/billion hours) Compatible with lead free reflow-soldering* * Please refer to our Assembly Application Note for more details UBSC/ULSC Capacitors target optical communication systems (ROSA/TOSA, SONET and all optoelectronics) as well as high speed data systems or products. The UBSC/ULSC are designed for DC blocking, feedback, coupling and bypass grounding applications. The unique technology of integrated passive devices in silicon developed by IPDiA, offers low insertion loss, low reflection and high phase stability from 16 kHz up to 60 GHz for the UBSC and up to 20 GHz for the ULSC. These deep trench silicon capacitors have been developed with a semiconductor MOS process. The UBSC / ULSC capacitors provide very high reliability and capacitance stability over temperature (0.5%) and voltage. They have an extended operating temperature range from -55 to 150C. Reliable and repeatable performances are obtained thanks to a fully controlled production line with high temperature curing (above 900C) generating a highly pure oxide. The UBSC / ULSC series are compliant with standard JEDEC assembly rules, making the product fully compatible with high speed automated pick-and-place manufacturing operations. Case sizes of 0201 and 0603 are also available. These capacitors are RoHScompliant and are available with ENIG terminations. IPDiA Capacitors - UBSC/ULSC Series Electrical Specifications Part number UBSC.xxx 935 151 423 510 935 152 423 510 935 151 424 610 935 152 424 610 935 151 425 610 935 152 425 610 ULSC.xxx Product description Parameters Capacitance range Capacitance tolerance Operating temperature range Storage temperature Temperature coefficient Breakdown voltage (BV) Capacitance variation versus RVDC Equivalent Serial Inductance (ESL) Equivalent Serial Resistance (ESR) Insulation resistance Aging Reliability Capacitor height Case Size Thickness Surface Mount Ultra Broad Band Silicon Capacitor from -55 to 150C, 60+GHz with ENIG termination Ultra Broadband Si Cap 10nF 60 GHz 400m, BV>11V Ultra Broadband Si Cap 10nF 60 GHz 100m, BV>11V Ultra Broadband Si Cap 100nF 60 GHz 400m, BV>11V Ultra Broadband Si Cap 100nF 60 GHz 100m, BV>11V Ultra Broadband Si Cap 100nF 60 GHz 400m, BV>11V Ultra Broadband Si Cap 100nF 60 GHz 100m, BV>11V 0201 0201 0402 0402 0603 0603 400m 100m 400m 100m 400m 100m Surface Mount Ultra Broad Band Silicon Capacitor from -55 to 150C, 20 GHz with ENIG termination 935 155 424 610 Ultra Broadband Si Cap 100nF 20 GHz 400m, BV>11V 0402 400m 935 156 424 610 Ultra Broadband Si Cap 100nF 20 GHz 100m, BV>11V 0402 100m Value 10nF to 100 nF(**) 15 %(**) -55 C to 150 C - 70 C to 165 C <0.5 %, from -55 C to +150 C 11, 30 V(**) 0.1 %/V (from 0 V to RVDC) Max 100 pH(***) Max 400 m(***) 100 G min @ RVDC & +25C Negligible, < 0.001 % / 1000h FIT<0.017 parts / billion hours Max 400 m or 100 m (**) Other values on request. (***) e.g. 100nF/0402/BV 11V 25C Fig.1: Capacitance variation vs temperature (for UBSC and MLCC technologies) Fig.2: Capacitance variation vs DC biasing voltage (for UBSC and MLCC technologies) Fig.3: 100 nF/0402 UBSC measurement results (S-parameters in transmission mode) UBSC/ULSC Capacitance Range Available parts - see table above For other values, contact your IPDiA sales representative Termination and Outline Termination Package Outline Lead-free nickel/solder coating compatible with automatic soldering technologies: reflow and manual. For landing pad dimensions on your PCB layout, please refer to IPDiA assembly application note. Pad dimensions ( mm ) Case size (typ. 0.01mm) a b c L W 0201 0.15 0.40 0.30 0.80 0.60 0402 0.30 0.50 0.40 1.20 0.70 0603 0.40 0.90 0.80 1.80 1.10 T 0.40 (standard profile) or 0.10 (low profile) Packing Tape and reel, waffle pack, film frame carrier or raw wafer delivery. For more information, please visit: http://www.ipdia.com To contact us, email to: sales@ipdia.com Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- Date of release: 30th January 2015 Document identifier: CL Rev 2.0 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IPDiA: 935156424610-T3N 935151425610-T1N 935155424610-T3N 935152424610-T3N 935152425610-T3N 935152425610-T1N 935151423510-T1N 935152424610-T1N 935152423510-T3N 935151424610-T3N 935151425610-T3N 935151424610-T1N 935152423510-T1N 935151423510-T3N 935155424610-T1N 935156424610-T1N