UBSC/ULSC – 60+GHz Ultra Broadband
Silicon Capacitors – Surface Mounted
Rev 2.0
Key Features Key Applications
UBSC/ULSC Capacitors target optical communi-
cation systems (ROSA/TOSA, SONET and all
optoelec tr onic s) as we ll as high speed data sys-
tems or products. The UBSC/ULSC are designed
for DC blocking, feedback, coupling and bypass
grounding applications. The unique technology of
integrated passive devices in silicon developed by
IPDiA, offers low insertion loss, low reflection
and high phase stability from 16 kHz up to 60
GHz for the UBSC and up to 20 GHz for the
ULSC. These deep trench silicon capacitors have
been developed with a semiconductor MOS pro-
cess.
The UBSC / ULSC capacitors provide very high
reliability and capacitance stability over tempera-
ture (±0.5%) and voltage. They have an extended
operating temperature range from -55 to 150°C.
Reliable and repeatable performances are ob-
tained thanks to a fully controlled production line
with high temperature curing (above 900°C) gene-
rating a highly pure oxide. The UBSC / ULSC se-
ries are compliant with standard JEDEC assembly
rules, making the product fully compatible with
high speed automated pick-and-place manufactu-
ring operations. Case sizes of 0201 and 0603 are
also available. These capacitors are RoHS-
compliant and are available with ENIG termina-
tions.
Ultra broadband performa nce up to 60+GHz
Resonance free
Phase stability
Ultra high stability of capacitance value
-
Temperature < ± 0.5% (-55°C to +150°C)
- Voltage < 0.1%/V
- Negligible aging < 0.001%/1000 hours
Low ESL
High reliability (FIT < 0.017 parts/billion hours)
Compatible with lead free reflow-soldering*
* Please refer to our Assembly Application Note for more details
Optoelectronics/high-speed data
Trans-Impedance Amplifiers (TIA)
Receive-and- Transmit Optical Sub-A s sembly
(ROSA/TOSA)
Synchronous Optical Networking (SONET)
High speed digital logic
Broadband test equipment
Broadband microwave/millimeter wave
Replacement of X7R and NP0
Low profile applications (400 or 100 µm )
Rev 2.0
IPDiA Capacitors – UBSC/ ULSC Series
Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner. The information
presented in this document does not form part of any quota-
tion or contract, is believed to be accurate and reliable and
may be changed without notice. No liability will be accepted
by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent-
For more information, please visit: http://www.ipdia.com
To cont act us, email t o: sales@ipdia.com
Date of release: 30th January 2015
Document identifier: CL
Electrical Specifications
Part number Product description Case Size Thickness
UBSC.xxx Surface Mount Ultra Broad Band Silicon Capacitor
from -55 to 150°C, 60+GHz with ENIG termination
935 151 423 510 Ultra Broadband Si Cap 10nF 60 GHz 400µm, BV>11V 0201 400µm
935 152 423 510 Ultra Broadband Si Cap 10nF 60 GHz 100µm, BV>11V 0201 100µm
935 151 424 610 Ultra Broadband Si Cap 100nF 60 GHz 400µm, BV>11V 0402 400µm
935 152 424 610 Ultra Broadband Si Cap 100nF 60 GHz 100µm, BV>11V 0402 100µm
935 151 425 610 Ultra Broadband Si Cap 100nF 60 GHz 400µm, BV>11V 0603 400µm
935 152 425 610 Ultra Broadband Si Cap 100nF 60 GHz 100µm, BV>11V 0603 100µm
(**) Other values on request.
(***) e.g. 100nF/0402/BV 11V
ULSC.xxx Surface Mount Ultra Broad Band Silicon Capacitor
from -55 to 150°C, 20 GHz with ENIG termination
935 155 424 610 Ultra Broadband Si Cap 100nF 20 GHz 400µm, BV>11V 0402 400µm
935 156 424 610 Ultra Broadband Si Cap 100nF 20 GHz 100µm, BV>11V 0402 100µm
Parameters Value
Capacitance range 10nF to 100 nF(**)
Capacitance tolerance ± 15 %(**)
Operating temperature range -55 °C to 150 °C
Storage temperature - 70 °C to 165 °C
Temperature coefficient <±0.5 %, from -55 °C to +150 °C
Breakdown voltage (BV) 11, 30 V(**)
Capacitance variation
versus RVDC 0.1 %/V (from 0 V to RVDC)
Equivalent Serial Inductance
(ESL) Max 100 pH(***)
Equivalent Serial Resistance
(ESR) Max 400 m(***)
Insulation resistance 100 G
min @ RVDC & +25°C
Aging Negligible, < 0.001 % / 1000h
Reliability FIT<0.017 parts / billion hours
Capacitor height Max 400 µm or 100 µm
Fig.1: Capacitance variation vs temperature
(for UBSC and MLCC technologies) Fig.2: Capacitance variation vs DC biasing
voltage (for UBSC and MLCC technologies) Fig.3: 100 nF/0402 UBSC measurement results
(S-parameters in transmission mode)
UBSC/ULSC Capacitance Range
Termination and Outline
( mm ) Pad dimensions Case size (typ. ±0.01mm)
a b c L W T
0201 0.15 0.40 0.30 0.80 0.60
0.40 (standard
profile) or 0.10
(low profile)
0402 0.30 0.50 0.40 1.20 0.70
0603 0.40 0.90 0.80 1.80 1.10
Termination
Lead-free nickel/solder coating compatible
with automatic soldering technolo gies:
reflow and manual.
Package Outline
For landing pad dimensions on your PCB layout, please ref er
to IPDiA assembly application note.
Packing
Tape and reel, waffle pack, film frame carrie r or raw wafer delivery.
25°C
Available parts – see table above
For other values, contact your IPDiA sales representative
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
IPDiA:
935156424610-T3N 935151425610-T1N 935155424610-T3N 935152424610-T3N 935152425610-T3N
935152425610-T1N 935151423510-T1N 935152424610-T1N 935152423510-T3N 935151424610-T3N
935151425610-T3N 935151424610-T1N 935152423510-T1N 935151423510-T3N 935155424610-T1N
935156424610-T1N