MAX6100EUR Application Note - Maxim Integrated Products, Inc.

MAX6100EUR

Rev. A

RELIABILITY REPORT

FOR

MAX6100EUR

PLASTIC ENCAPSULATED DEVICES

February 14, 2003

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Written by Reviewed by

Jim Pedicord Bryan J. Preeshl

Quality Assurance Quality Assurance

Reliability Lab Manager Executive Director

Conclusion

The MAX6100 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality

and reliability standards.

Table of Contents

I. ........Device Description V. ........Quality Assurance Information

II. ........Manufacturing Information VI. .......Reliability Evaluation

III. .......Packaging Information IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX6100 is a low-cost, low-dropout (LDO), micropower voltage references. This three-terminal reference has an

output voltage option of 1.8V. It features a proprietary curvature-correction circuit and laser-trimmed, thin-film

resistors that result in a low temperature coefficient of 75ppm/°C (max) and an initial accuracy of ±0.4% (max). This

device is specified over the extended temperature range (-40°C to +85°C).

This series-mode voltage reference draws only 90µA of supply current and can source 5mA and sink 2mA of load

current. Unlike conventional shunt-mode (two-terminal) references that waste supply current and require an external

resistor, this device offers a supply current that is virtually independent of the supply voltage (with only a 4µA/V

variation with supply voltage) and does not require an external resistor. Additionally, this internally compensated

device does not require an external compensation capacitor and is stable with load capacitance. Eliminating the

external compensation capacitor saves valuable board area in space-critical applications. Low dropout voltage and

supply-independent, ultra-low supply current makes this device ideal for battery-operated, high-performance, low-

voltage systems.

The MAX6100 is available in a tiny 3-pin SOT23 packages.

B. Absolute Maximum Ratings

Item Rating

(Voltages Referenced to GND)

IN -0.3V to +13.5V

OUT -0.3V to (VIN + 0.3V)

Output Short-Circuit to GND or IN (VIN < 6V) Continuous

Output Short-Circuit to GND or IN (VIN = 6V) 60s

Operating Temperature Range -40°C to +85°C

Storage Temperature Range -65°C to +150°C

Lead Temperature (soldering, 10s) +300°C

Continuous Power Dissipation (TA = +70°C)

3-Pin SOT23 320mW

Derates above +70°C

3-Pin SOT23 4.0mW/°C

II. Manufacturing Information

A. Description/Function: Low-Cost, Micropower, Low-Dropout, High-Output-Current, SOT23 Voltage References

B. Process: B12 (Standard 1.2 micron silicon gate CMOS)

C. Number of Device Transistors: 117

D. Fabrication Location: California or Oregon, USA

E. Assembly Location: Malaysia or Thailand

F. Date of Initial Production: March, 2001

III. Packaging Information

A. Package Type: 3-Pin SOT23

B. Lead Frame: Copper or Alloy 42

C. Lead Finish: Solder Plate

D. Die Attach: Silver-filled Epoxy

E. Bondwire: Gold (1.0 mil dia.)

F. Mold Material: Epoxy with silica filler

G. Assembly Diagram: # 05-0901-0179

H. Flammability Rating: Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-112: Level 1

IV. Die Information

A. Dimensions: 44 x 31mils

B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

C. Interconnect: Aluminum/Si (Si = 1%)

D. Backside Metallization: None

E. Minimum Metal Width: 1.2 microns (as drawn)

F. Minimum Metal Spacing: 1.2 microns (as drawn)

G. Bondpad Dimensions: 5 mil. Sq.

H. Isolation Dielectric: SiO2

I. Die Separation Method: Wafer Saw

V. Quality Assurance Information

A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations)

Bryan Preeshl (Executive Director)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (λ) is calculated as follows:

λ = 1 = 1.83 (Chi square value for MTTF upper limit)

MTTF 192 x 4389 x 160 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

λ = 6.79 x 10-9

λ = 6.79 F.I.T. (60% confidence level @ 25°C)

This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to

routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects

it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be

shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece

sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In

Schematic (Spec. # 06-5630) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test

monitors. This data is published in the Product Reliability Report (RR-1M).

B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard

85°C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing

The RF24-7 die type has been found to have all pins able to withstand a transient pulse of ±1500V, per Mil-

Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device

withstands a current of ±250mA.

Table 1

Reliability Evaluation Test Results

MAX6100EUR

TEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OF

IDENTIFICATION PACKAGE SIZE FAILURES

Static Life Test (Note 1)

Ta = 135°C DC Parameters 160 0

Biased & functionality

Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot Ta = 121°C DC Parameters SOT 77 0

P = 15 psi. & functionality

RH= 100%

Time = 168hrs.

85/85 Ta = 85°C DC Parameters 77 0

RH = 85% & functionality

Biased

Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature -65°C/150°C DC Parameters 77 0

Cycle 1000 Cycles & functionality

Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.

Note 2: Generic Package/Process data

Attachment #1

TABLE II. Pin combination to be tested. 1/ 2/

1/ Table II is restated in narrative form in 3.4 below.

2/ No connects are not to be tested.

3/ Repeat pin combination I for each named Power supply and for ground

(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).

3.4 Pin combinations to be tested.

a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected

to terminal B. All pins except the one being tested and the ground pin(s) shall be open.

b. Each pin individually connected to terminal A with respect to each different set of a combination

of all named power supply pins (e.g., V

SS1, or V

SS2 or V

SS3 or V

CC1, or VCC2) connected to

terminal B. All pins except the one being tested and the power supply pin or set of pins shall be

open.

c. Each input and each output individually connected to terminal A with respect to a combination of

all the other input and output pins connected to terminal B. All pins except the input or output pin

being tested and the combination of all the other input and output pins shall be open.

Terminal A

(Each pin individually

connected to terminal A

with the other floating)

Terminal B

(The common combination

of all like-named pins

connected to terminal B)

1. All pins except VPS1 3/

All VPS1 pins

2. All input and output pins All other input-output pins

Mil Std 883D

Method 3015.7

Notice 8

REGULATED

HIGH VOLTAGE

SUPPLY

TERMINAL D

DUT

SOCKET

TERMINAL C

TERMINAL B

TERMINAL A

CURRENT

PROBE

(NOTE 6)

R = 1.5kΩ

C = 100pf

SHORT

R2

S2

S1

R1

C1

DOCUMENT I.D. 06-5630 REVISION DMAXIM TITLE: BI Circuit

(MAX6012/6021/6025/6030/6041/6050/6018/6061/6062/6063/6064/6065/6066/6067/606

8/6035)

PAGE 2 OF 3

DEVICES: MAX 6012 / 6021 / 6025 / 6030 / 6041 / 6050/6018

6061/6062/6063/6064/6065/6066/6067/6068/6035

Max current = 35 uA /MAX6061-6068= 125uA /

MAX6035= 100uA.

1

2

3

Notes: +38 Volts for MAX6035 only. Apply jumper pin

to +20V pin. +5.5V for the MAX6018.

ONCE PER SOCKET ONCE PER BOARD

3 PIN

SOT

0.1 uF

5K OHMS + 10 VOLTS

35 uA