DS20006021A-page 1 2018 Microchip Technology Inc.
MIC5219
Features
• 500 mA Output Current Capability
- SOT23-5 Package - 500 mA Peak
- 2 mm x 2 mm x 0.9 mm VDFN Package -
500 mA Continuous
- 2 mm x 2 mm x 0.6 mm Thin DFN Package -
500 mA Continuous
- MSOP-8 Package - 500 mA Continuous
• Low 500 mV Maximum Dropout Voltage at Full
Load
• Extremely Tight Load and Line Regulation
• Tiny SOT-23-5 and Power MSOP-8 Package
• Ultra-Low Noise Output
• Low Temperature Coefficient
• Current and Thermal Limiting
• Reversed-Battery Protection
• CMOS/TTL-Compatible Enable/Shutdown Control
• Near-Zero Shutdown Current
Applications
• Laptop, Notebook, and Palmtop Computers
• Cellular Telephones and Battery-Powered
Equipment
• Consumer and Personal Electronics
• PC Card VCC and VPP Regulation and Switching
• SMPS Post-Regulator/DC-to-DC Modules
• High-Efficiency Linear Power Supplies
General Description
The MIC5219 is an efficient linear voltage regulator
with high peak output current capability, very low
dropout voltage, and better than 1% output voltage
accuracy. Dropout is typically 10 mV at light loads and
less than 500 mV at full load.
The MIC5219 is designed to provide a peak output
current for start-up conditions where higher inrush
current is demanded. It features a 500 mA peak output
rating. Continuous output current is limited only by
package and layout.
The MIC5219 can be enabled or shut down by a
CMOS- or TTL-compatible signal. When disabled,
power consumption drops nearly to zero. Dropout
ground current is minimized to help prolong battery life.
Other key features include reversed-battery protection,
current limiting, overtemperature shutdown, and low
noise performance with an ultra-low noise option.
The MIC5219 is available in adjustable or fixed output
voltages in the space-saving 6-pin (2 mm × 2 mm)
VDFN, 6-pin (2 mm × 2 mm) Thin DFN, SOT23-5, and
8-pin power MSOP packages. For higher power
requirements see the MIC5209 or MIC5237.
500 mA Peak Output LDO Regulator
MIC5219
DS20006021A-page 2 2018 Microchip Technology Inc.
Package Types
MIC5219-x.xYMM
MSOP-8 (MM)
Fixed Voltages
(Top View)
MIC5219YMM
MSOP-8 (MM)
Adjustable Voltages
(Top View)
MIC5219-x.xYML
6-Pin VDFN (ML)
(Top View)
MIC5219YMT
6-Pin TDFN (MT)
(Top View)
MIC5219-x.xYM5
SOT23-5 (M5)
Fixed Voltages
(Top View)
MIC5219YM5
SOT23-5 (M5)
Adjustable Voltage
(Top View)
1
2
3
4
8
7
6
5
GND
GND
GND
GND
EN
IN
OUT
BYP
1
2
3
4
8
7
6
5
GND
GND
GND
GND
EN
IN
OUT
BYP
IN
OUTBYP
EN
LGxx
13
45
2
GND
Part
Identification
IN
OUTADJ
EN
LGAA
13
45
2
GND
1EN
GND
IN
6 BYP
NC
OU
T
5
4
2
3
1EN
GND
IN
6NC
ADJ
OU
T
5
4
2
3
2018 Microchip Technology Inc. DS20006021A-page 3
MIC5219
Typical Application Circuits
MIC5219
5V Ultra-Low Noise Regulator
MIC5219
3.3V Ultra-Low Noise Regulator
MIC5219
Ultra-Low Noise Regulator (Fixed)
MIC5219
Ultra-Low Noise Regulator (Adjustable)
1
2
3
4
8
7
6
5
MIC5219-5.0YMM
2.2μF
tantalum
VOUT
5V
VIN
6V
ENABLE
SHUTDOWN
470pF
15
2
34
2.2μF
tantalum
470pF
VOUT
3.3V
MIC5219-3.3YM5
VIN
4V
ENABLE
SHUTDOWN
ENABLE
SHUTDOWN
MIC5219YMT
1
EN 6
470pF
VIN VOUT
2.2μF
5
4
2
3
R1
R2
+
ENABLE
SHUTDOWN
MIC5219-x.xYML
1
EN 6CBYP
(optional)
VIN VOUT
COUT
5
4
2
3
MIC5219
DS20006021A-page 4 2018 Microchip Technology Inc.
Block Diagrams
Ultra-Low Noise Fixed Regulator
Ultra-Low Noise Adjustable
Regulator
IN
EN
OUT
BYP
C
BYP
(optional)
GND
V
REF
Bandgap
Ref.
Current-Limit
Thermal Shutdown
C
OUT
V
OUT
V
IN
MIC5219-x.xYM5/YMM/YMT
IN
EN
OUT
C
BYP
(optional)
GND
V
REF
Bandgap
Ref.
Current-Limit
Thermal Shutdown
C
OUT
V
OUT
V
IN
R1
R2
MIC5219YM5/YMM/YMT
2018 Microchip Technology Inc. DS20006021A-page 5
MIC5219
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V
Power Dissipation (PD) .......................................................................................................................... Internally Limited
Operating Ratings ††
Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +12V
Enable Input Voltage (VEN) .................................................................................................................................0V to VIN
† Notice: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical
specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power
dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,
and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using: PD(MAX) = (TJ(MAX) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the regulator will go into thermal shutdown. See Ta ble 4- 1 and the Thermal Considerations section for
details.
†† Notice: The device is not guaranteed to function outside its operating rating.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = VOUT + 1.0V; COUT = 4.7 μF, IOUT = 100 μA;
TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Output Voltage VOUT
–1 — 1 % Variation from Nominal VOUT
–2 —2%
Output Voltage
Temperature Coefficient ∆VOUT/∆T— 40 —ppm/°CNote 1
Line Regulation ∆VOUT/VOUT
— 0.009 0.05 %/V VIN = VOUT + 1V to 12V
——0.1
Load Regulation ∆VOUT/VOUT
— 0.05 0.5 %IOUT = 100 µA to 500 mA,
Note 2
——0.7
Note 1: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 μA to 500 mA. Changes in output voltage due to
heating effects are covered by the thermal regulation specification.
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below
its nominal value measured at 1V differential.
4: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
5: VEN is the voltage externally applied to devices with the EN (enable) input pin.
6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-
tion is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at
VIN = 12V for t = 10 ms.
7: CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust)
pin.
MIC5219
DS20006021A-page 6 2018 Microchip Technology Inc.
Dropout Voltage (Note 3)V
IN – VOUT
—10 60 mV IOUT = 100 μA
—— 80
— 115 175 mV IOUT = 50 mA
——250
— 175 300 mV IOUT = 150 mA
——400
— 350 500 mV IOUT = 500 mA
——600
Ground Pin Current
(Note 4, 5)
IGND
—80130μAV
EN ≥ 3.0V, IOUT = 100 μA
——170
— 350 650 μAV
EN ≥ 3.0V, IOUT = 50 mA
——900
—1.82.5 mA VEN ≥ 3.0V, IOUT = 150 mA
——3.0
—12 20 mA VEN ≥ 3.0V, IOUT = 500 mA
—— 25
Ground Pin Quiescent
Current (Note 4)
—0.05 3 μAV
EN ≤ 0.4V
—0.10 8μAV
EN ≤ 0.18V
Ripple Rejection PSRR — 75 — dB f = 120 Hz
Current Limit ILIMIT — 700 1000 mA VOUT = 0V
Thermal Regulation
(Note 3)∆VOUT/∆PD—0.05 —%/WNote 6
Output Noise (Note 7)e
no
— 500 — nV/√ Hz IOUT = 50 mA,
COUT = 2.2 μF, C BYP = 0
— 300 — nV/√ Hz IOUT = 50 mA, COUT =
2.2 μF, C BYP = 470 pF
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = VOUT + 1.0V; COUT = 4.7 μF, IOUT = 100 μA;
TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 μA to 500 mA. Changes in output voltage due to
heating effects are covered by the thermal regulation specification.
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below
its nominal value measured at 1V differential.
4: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
5: VEN is the voltage externally applied to devices with the EN (enable) input pin.
6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-
tion is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at
VIN = 12V for t = 10 ms.
7: CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust)
pin.
2018 Microchip Technology Inc. DS20006021A-page 7
MIC5219
ENABLE Input
Enable Input Logic-Low
Voltage VENL
——0.4 VVEN = logic low (regulator
shutdown)
——0.18
2.0 — — V VEN = logic high (regulator
enabled)
Enable Input Current
IENL
—0.01 –1 μAVENL ≤ 0.4V
—0.01 –2 VENL ≤ 0.18V
IENH
2520
μAV
ENH ≥ 2.0V
—— 25
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = VOUT + 1.0V; COUT = 4.7 μF, I OUT = 100 μA;
TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
2: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 μA to 500 mA. Changes in output voltage due to
heating effects are covered by the thermal regulation specification.
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below
its nominal value measured at 1V differential.
4: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
5: VEN is the voltage externally applied to devices with the EN (enable) input pin.
6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-
tion is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at
VIN = 12V for t = 10 ms.
7: CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust)
pin.
MIC5219
DS20006021A-page 8 2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Ambient Temperature Range TA–40 — +125 °C —
Maximum Junction Temperature Range TJ–40 — +125 °C —
Storage Temperature Range TS–65 — +150 °C —
Lead Temperature — — 260 — °C Soldering, 5 sec.
Package Thermal Resistances
Thermal Resistance, MSOP-8Ld JA — 160 — °C/W Minimum footprint area.
Thermal Resistance, SOT23-5Ld JA — 220 — °C/W Minimum footprint area.
Thermal Resistance, VDFN-6Ld JA — 90 — °C/W Minimum footprint area.
Thermal Resistance, TDFN-6Ld JA — 90 — °C/W Minimum footprint area.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc. DS20006021A-page 9
MIC5219
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Power Supply Rejection
Ratio.
FIGURE 2-2: Power Supply Rejection
Ratio.
FIGURE 2-3: Power Supply Rejection
Ratio.
FIGURE 2-4: Power Supply Rejection
Ratio.
FIGURE 2-5: Power Supply Rejection
Ratio.
FIGURE 2-6: Power Supply Ripple
Rejection vs. Voltage Drop.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MIC5219
DS20006021A-page 10 2018 Microchip Technology Inc.
FIGURE 2-7: Power Supply Ripple
Rejection vs. Voltage Drop.
FIGURE 2-8: Noise Performance.
FIGURE 2-9: Noise Performance.
.
FIGURE 2-10: Noise Performance.
FIGURE 2-11: Dropout Voltage vs. Output
Current.
FIGURE 2-12: Dropout Characteristics.
2018 Microchip Technology Inc. DS20006021A-page 11
MIC5219
FIGURE 2-13: Ground Current vs. Output
Current.
FIGURE 2-14: Ground Current vs. Supply
Voltage.
FIGURE 2-15: Ground Current vs. Supply
Voltage.
MIC5219
DS20006021A-page 12 2018 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number
VDFN-6
TDFN-6
Pin Number
MSOP-8
Pin Number
SOT23-5 Pin Name Description
3 2 1 IN Supply input.
2 5 - 8 2 GND Ground: MSOP-8 pins 5 through 8 are internally con-
nected.
4 3 5 OUT Regulator output.
1 1 3 EN Enable (input): CMOS-compatible control input.
Logic-high = enable; logic-low or open = shutdown.
6 4 (FIXED) 4 (FIXED) BYP Reference bypass: Connect an external 470 pF capacitor
to GND to reduce output noise. May be left open.
5 (NC) 4 (ADJ) 4 (ADJ) ADJ Adjust (input): Feedback input. Connect to resistive volt-
age-divider network.
EP — — GND Ground: Internally connected to the exposed pad. Con-
nect externally to GND pin.
2018 Microchip Technology Inc. DS20006021A-page 13
MIC5219
4.0 APPLICATION INFORMATION
The MIC5219 is designed for 150 mA to 200 mA output
current applications where a high-current spike
(500 mA) is needed for short, start-up conditions. Basic
application of the device will be discussed initially
followed by a more detailed discussion of higher
current applications.
4.1 Enable/Shutdown
Forcing EN (enable/shutdown) high (>2V) enables the
regulator. EN is compatible with CMOS logic. If the
enable/shutdown feature is not required, connect EN to
IN (supply input). See Figure 4-5.
4.2 Input Capacitor
A 1 μF capacitor should be placed from IN to GND if
there is more than 10 inches of wire between the input
and the AC filter capacitor or if a battery is used as the
input.
4.3 Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output
capacitor is dependent upon whether a reference
bypass capacitor is used. 1 μF minimum is
recommended when CBYP is not used (see Figure 4-5).
2.2 μF minimum is recommended when CBYP is 470 pF
(see Figure 4-6). For applications <3V, the output
capacitor should be increased to 22 μF minimum to
reduce start-up overshoot. Larger values improve the
regulator’s transient response. The output capacitor
value may be increased without limit.
The output capacitor should have an ESR (equivalent
series resistance) of about 1Ω or less and a resonant
frequency above 1 MHz. Ultra-low ESR capacitors
could cause oscillation and/or under-damped transient
response. Most tantalum or aluminum electrolytic
capacitors are adequate; film types will work, but are
more expensive. Many aluminum electrolytics have
electrolytes that freeze at about –30°C, so solid
tantalums are recommended for operation below
–25°C.
At lower values of output current, less output
capacitance is needed for stability. The capacitor can
be reduced to 0.47 μF for current below 10 mA, or
0.33 μF for currents below 1 mA.
4.4 No-Load Stability
The MIC5219 will remain stable and in regulation with
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOS RAM keep-alive applications.
4.5 Reference Bypass Capacitor
BYP is connected to the internal voltage reference. A
470 pF capacitor (CBYP) connected from BYP to GND
quiets this reference, providing a significant reduction
in output noise (ultra-low noise performance). CBYP
reduces the regulator phase margin; when using CBYP,
output capacitors of 2.2 μF or greater are generally
required to maintain stability.
The start-up speed of the MIC5219 is inversely
proportional to the size of the reference bypass
capacitor. Applications requiring a slow ramp-up of
output voltage should consider larger values of CBYP.
Likewise, if rapid turn-on is necessary, consider
omitting CBYP.
4.6 Thermal Considerations
The MIC5219 is designed to provide 200 mA of
continuous current in two very small profile packages.
Maximum power dissipation can be calculated based
on the output current and the voltage drop across the
part. To determine the maximum power dissipation of
the package, use the thermal resistance,
junction-to-ambient, of the device and the following
basic equation.
EQUATION 4-1:
TJ(MAX) is the maximum junction temperature of the
die, +125°C, and TA is the ambient operating
temperature. θJA is layout-dependent; Tab le 4 -1 shows
examples of thermal resistance, junction-to-ambient,
for the MIC5219.
TABLE 4-1: MIC5219 THERMAL
RESISTANCE
Package
θJA
Rec. Min.
Footprint
θJA
1” Square
2 oz.
Copper
θJC
MSOP-8 160°C/W 70°C/W 30°C/W
SOT23-5 220°C/W 170°C/W 130°C/W
2x2 VDFN 90°C/W — —
2x2TDFN 90°C/W — —
PDMAX
TJMAX
TA
–
JA
--------------------------------
=
MIC5219
DS20006021A-page 14 2018 Microchip Technology Inc.
The actual power dissipation of the regulator circuit can
be determined using one simple equation.
EQUATION 4-2:
Substituting PD(MAX) for PD and solving for the
operating conditions that are critical to the application
will give the maximum operating conditions for the
regulator circuit. For example, if we are operating the
MIC5219-3.3YM5 at room temperature, with a
minimum footprint layout, we can determine the
maximum input voltage for a set output current.
EQUATION 4-3:
The thermal resistance, junction-to-ambient, for the
minimum footprint is 220°C/W, taken from Ta bl e 4- 1.
The maximum power dissipation number cannot be
exceeded for proper operation of the device. Using the
output voltage of 3.3V, and an output current of
150 mA, we can determine the maximum input voltage.
Ground current, maximum of 3 mA for 150 mA of
output current, can be taken from the Electrical
Characteristics section of the data sheet.
EQUATION 4-4:
Therefore, a 3.3V application at 150 mA of output
current can accept a maximum input voltage of 6.2V in
a SOT23-5 package. For a full discussion of heat
sinking and thermal effects on voltage regulators, refer
to the “Regulator Thermals” section of Microchip’s
Designing with Low-Dropout Voltage Regulators
handbook.
4.7 Peak Current Applications
The MIC5219 is designed for applications where high
start-up currents are demanded from space
constrained regulators. This device will deliver 500 mA
start-up current from a SOT23-5 or MSOP-8 package,
allowing high power from a very low profile device. The
MIC5219 can subsequently provide output current that
is only limited by the thermal characteristics of the
device. You can obtain higher continuous currents from
the device with the proper design. This is easily proved
with some thermal calculations.
If we look at a specific example, it may be easier to
follow. The MIC5219 can be used to provide up to
500 mA continuous output current. First, calculate the
maximum power dissipation of the device, as was done
in the Thermal Considerations section. Worst case
thermal resistance (θJA = 220°C/W for the
MIC5219-x.xYM5), will be used for this example.
EQUATION 4-5:
Assuming a 25°C room temperature, we have a
maximum power dissipation value calculated in
Equation 4-6.
EQUATION 4-6:
Then we can determine the maximum input voltage for
a 5 volt regulator operating at 500 mA, using worst
case ground current.
PDVIN VOUT
–IOUT
VIN
+IGND
=
PDMAX
125C25C–
220C/W
-----------------------------------455mW==
455mW VIN 3.3V–150mAVIN
+3mA=
455mW 150mA VIN
3mA+VIN
495mW–=
950mW 153mA VIN
=
VIN MAX
6.2VMAX
=
PDMAX
TJMAX
TA
–
JA
--------------------------------
=
PDMAX
125C25C–
220C/W
-----------------------------------455mW==
2018 Microchip Technology Inc. DS20006021A-page 15
MIC5219
EQUATION 4-7:
Therefore, to be able to obtain a constant 500 mA
output current from the MIC5219-5.0YM5 at room
temperature, you need extremely tight input-output
voltage differential, barely above the maximum dropout
voltage for that current rating.
You can run the part from larger supply voltages if the
proper precautions are taken. Varying the duty cycle
using the enable pin can increase the power dissipation
of the device by maintaining a lower average power
figure. This is ideal for applications where high current
is only needed in short bursts. Figure 4-1 shows the
safe operating regions for the MIC5219-x.xYM5 at
three different ambient temperatures and at different
output currents. The data used to determine this figure
assumed a minimum footprint PCB design for minimum
heat sinking. Figure 4-2 incorporates the same factors
as the first figure, but assumes a much better heat sink.
A 1" square copper trace on the PC board reduces the
thermal resistance of the device. This improved
thermal resistance improves power dissipation and
allows for a larger safe operating region.
Figure 4-3 and Figure 4-4 show safe operating regions
for the MIC5219-x.xYMM, the power MSOP package
part. These graphs show three typical operating
regions at different temperatures. The lower the
temperature, the larger the operating region. The
graphs were obtained in a similar way to the graphs for
the MIC5219-x.xYM5, taking all factors into
consideration and using two different board layouts,
minimum footprint and 1" square copper PC board heat
sink. For further discussion of PC board heat sink
characteristics, refer to Application Hint 17, Designing
PC Board Heat Sinks.
The information used to determine the safe operating
regions can be obtained in a similar manner such as
determining typical power dissipation, already
discussed. Determining the maximum power
dissipation based on the layout is the first step, this is
done in the same manner as in the previous two
sections. Then, a larger power dissipation number
multiplied by a set maximum duty cycle would give that
maximum power dissipation number for the layout. This
is best shown through an example. If the application
calls for 5V at 500 mA for short pulses, but the only
supply voltage available is 8V, then the duty cycle has
to be adjusted to determine an average power that
does not exceed the maximum power dissipation for
the layout.
EQUATION 4-8:
With an output current of 500 mA and a three volt drop
across the MIC5219-xxYMM, the maximum duty cycle
is 27.4%.
Applications also call for a set nominal current output
with a greater amount of current needed for short
durations. This is a tricky situation, but it is easily
remedied. Calculate the average power dissipation for
each current section, then add the two numbers giving
the total power dissipation for the regulator. For
example, if the regulator is operating normally at
50 mA, but for 12.5% of the time it operates at 500 mA
output, the total power dissipation of the part can be
easily determined. First, calculate the power
dissipation of the device at 50 mA. We will use the
MIC5219-3.3YM5 with 5V input voltage as our
example.
EQUATION 4-9:
PDMAX
455mW
VIN VOUT
–IOUT
VIN
+IGND
==
Where:
IOUT = 500 mA
VOUT = 5V
IGND = 20 mA
455mW VIN 5V–500mAVIN
+20mA=
2.995W520mA VIN
=
VIN MAX
2.995W
520mA
------------------ 5.683V==
Avg
·PD%DC
100
-------------
VIN VOUT
–IOUT
VIN
+IGND
=
455mW %DC
100
-------------
8V5V–500mA8V+20mA=
455mW %DC
100
-------------
1.66W=
0.274 %DC
100
-------------
=
%DC 27.4% Duty Cycle Max.=
PD50mA5V3.3V–50mA5V+ 650A=
PD50mA88.25mW=
MIC5219
DS20006021A-page 16 2018 Microchip Technology Inc.
However, this is continuous power dissipation, the actual on-time for the device at 50 mA is (100% – 12.5%) or 87.5%
of the time, or 87.5% duty cycle. Therefore, PD must be multiplied by the duty cycle to obtain the actual average power
dissipation at 50 mA.
FIGURE 4-1: MIC5219-x.xYM5 (SOT23-5 ) on Minimum Recommended Footprint.
FIGURE 4-2: MIC5219-x.xYM5 (SOT23-5) on 1-Inch2 Copper Cladding.
FIGURE 4-3: MIC5219-x.xYMM (MSOP-8) on Minimum Recommended Footprint.
FIGURE 4-4: MIC5219-x.xYMM (MSOP-8) on 1-Inch2 Copper Cladding.
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
25°C Ambient 50°C Ambient 85°C Ambient
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA 300mA
200mA
100mA
25°C Ambient 50°C Ambient 85°C Ambient
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
25°C Ambient 50°C Ambient 85°C Ambient
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
0
2
4
6
8
10
0 20406080100
DUTY CYCLE (%)
500mA
400mA
300mA
200mA
100mA
25°C Ambient 50°C Ambient 85°C Ambient
2018 Microchip Technology Inc. DS20006021A-page 17
MIC5219
EQUATION 4-10:
The power dissipation at 500 mA must also be
calculated.
EQUATION 4-11:
This number must be multiplied by the duty cycle at
which it would be operating: 12.5%.
EQUATION 4-12:
The total power dissipation of the device under these
conditions is the sum of the two power dissipation
figures.
EQUATION 4-13:
The total power dissipation of the regulator is less than
the maximum power dissipation of the SOT23-5
package at room temperature, on a minimum footprint
board and therefore would operate properly.
Multilayer boards with a ground plane, wide traces near
the pads, and large supply-bus lines will have better
thermal conductivity.
For additional heat sink characteristics, please refer to
Application Hint 17, Designing P.C. Board Heat Sinks.
For a full discussion of heat sinking and thermal effects
on voltage regulators, refer to “Regulator Thermals”
section of Microchip’s Designing with Low-Dropout
Voltage Regulators handbook.
4.8 Fixed Regulator Circuits
Figure 4-5 shows a basic MIC5219-x.xYMX
fixed-voltage regulator circuit. A 1μF minimum output
capacitor is required for basic fixed-voltage
applications.
FIGURE 4-5: Low-Noise Fixed Voltage
Regulator.
Figure 4-6 includes the optional 470 pF noise bypass
capacitor between BYP and GND to reduce output
noise. Note that the minimum value of COUT must be
increased when the bypass capacitor is used.
FIGURE 4-6: Ultra-Low Noise Fixed
Voltage Regulator.
4.9 Adjustable Regulator Circuits
Figure 4-7 shows the basic circuit for the MIC5219
adjustable regulator. The output voltage is configured
by selecting values for R1 and R2 using the following
formula.
EQUATION 4-14:
This equation is correct due to the configuration of the
bandgap reference. The bandgap voltage is relative to
the output, as seen in the block diagram. Traditional
regulators normally have the reference voltage relative
to ground and have a different VOUT equation.
PD50mA0.875 88.25mW=
PD50mA77.22mW=
PD500mA5V3.3V–500mA5V+20mA=
PD500mA950mW=
PD0.125 950mW=
PD118.75mW=
PDTOTAL
PD50mAPD
+ 500mA=
PDTOTAL
77.22mW 118.75mW+=
PDTOTAL
196mW=
MIC5219-x.x
IN OUT
GND 1μF
VIN VOUT
EN BYP
MIC5219-x.x
IN OUT
GND
470pF
V
IN
EN BYP
2.2μF
V
OUT
VOUT 1.242VR2
R1
-------1+
=
MIC5219
DS20006021A-page 18 2018 Microchip Technology Inc.
FIGURE 4-7: Low-Noise Adjustable
Voltage Regulator.
Although ADJ is a high-impedance input, for best
performance, R2 should not exceed 470 kΩ.
FIGURE 4-8: Ultra-Low Noise Adjustable
Application.
Figure 4-8 includes the optional 470 pF bypass
capacitor from ADJ to GND to reduce output noise.
MIC5219
IN OUT
GND
V
IN
EN ADJ
1μF
V
OUT
R1
R2
MIC5219
IN OUT
GND
V
IN
EN ADJ
2.2μF
V
OUT
R1
R2
470pF
2018 Microchip Technology Inc. DS20006021A-page 19
MIC5219
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Example5-Lead SOT23*
XXXX LG31
Example6-Lead VDFN*
XXX
NNN
G30
943
Example6-Lead TDFN*
XXX
NNN
GAA
474
Example8-Lead MSOP*
XXXX
X.XXY
XXXX
X.XXY
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
3
e
3
e
MIC5219
DS20006021A-page 20 2018 Microchip Technology Inc.
5-Lead SOT23 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc. DS20006021A-page 21
MIC5219
6-Lead VDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
B
A
0.05 C
0.05 C
0.10 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
1
4N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
4
N
0.10 C A B
0.10 C A B
0.10 C
0.05 C
Microchip Technology Drawing C04-1016A Sheet 1 of 2
D
E
A
(A3)
6X b
e
2X
D2
E2
K
L
6X
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
6-Lead Very Thin Plastic Dual Flat, No Lead Package (JDA) - 2x2 mm Body [VDFN]
Micrel Legacy Package
3
NOTE 1
3
MIC5219
DS20006021A-page 22 2018 Microchip Technology Inc.
Microchip Technology Drawing C04-1016A Sheet 2 of 2
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.65 BSC
0.203 REF
0.75
0.30
0.20
0.80
0.00
0.25
0.35
0.80
0.85
0.02
2.00 BSC
MILLIMETERS
MIN NOM
6
0.85
0.40
0.30
0.90
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
6-Lead Very Thin Plastic Dual Flat, No Lead Package (JDA) - 2x2 mm Body [VDFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Micrel Legacy Package
Overall Length
Exposed Pad Length
D
D2 1.35
2.00 BSC
1.40 1.45
2018 Microchip Technology Inc. DS20006021A-page 23
MIC5219
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.45
0.85
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X6)
Contact Pad Width (X6)
Y1
X1
0.75
0.30
Microchip Technology Drawing C04-21016A
NOM
6-Lead Very Thin Plastic Dual Flat, No Lead Package (JDA) - 2x2 mm Body [VDFN]
SILK SCREEN
12
6
E
X1
Y1
G1
Y2
C1Contact Pad Spacing 2.00
Contact Pad to Center Pad (X6) G1 0.20
Thermal Via Diameter V 0.30
ØV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Micrel Legacy Package
C1
X2
0.330.27
MIC5219
DS20006021A-page 24 2018 Microchip Technology Inc.
6-Lead 2 mm x 2 mm TDFN Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc. DS20006021A-page 25
MIC5219
8-Lead MSOP Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC5219
DS20006021A-page 26 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006021A-page 27
MIC5219
APPENDIX A: REVISION HISTORY
Revision A (May 2018)
• Converted Micrel document MIC5219 to Micro-
chip data sheet DS20006021A.
• Minor text changes throughout.
MIC5219
DS20006021A-page 28 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006021A-page 29
MIC5219
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) 5-Lead SOT23, 500 mA Peak Output Current Capability,
Adjustable & Fixed Output Voltages, 3,000/Reel.
Catalog P/N Output Voltage Marking Code
MIC5219-2.5YM5-TR 2.5V LG25
MIC5219-2.6YM5-TR 2.6V LG26
MIC5219-2.7YM5-TR 2.7V LG27
MIC5219-2.8YM5-TR 2.8V LG28
MIC5219-2.85YM5-TR 2.85V LG2J
MIC5219-2.9YM5-TR 2.9V LG29
MIC5219-3.0YM5-TR 3.0V LG30
MIC5219-3.1YM5-TR 3.1V LG31
MIC5219-3.3YM5-TR 3.3V LG33
MIC5219-3.6YM5-TR 3.6V LG36
MIC5219-5.0YM5-TR 5.0V LG50
MIC5219YM5-TR Adjustable
b) 6-Lead VDFN, 500 mA Continuous Output Current
Capability, Adjustable & Fixed Output Voltages, 5,000/Reel
Catalog P/N Output Voltage Marking Code
MIC5219-2.8YML-TR 2.8V G28
MIC5219-3.0YML-TR 3.0V G30
MIC5219-3.3YML-TR 3.3V G33
MIC5219-3.6YML-TR 3.6V G36
c) 6-Lead TDFN, 500 mA Continuous Output Current
Capability, Adjustable & Fixed Output Voltages, 5,000/Reel
Catalog P/N Output Voltage Marking Code
MIC5219-5.0YMT-TR 5.0V G50
MIC5219YMT-TR Adjustable GAA
d) 8-Lead MSOP, 500 mA Continuous Output Current Capability,
Adjustable & Fixed Output Voltages, 100/Tube or 2,500/Reel
CPN Bulk Qty CPN T/R Qty
MIC5219-2.5YMM 100/Tube MIC5219-2.5YMM-TR 2,500/Reel
MIC5219-2.85YMM 100/Tube MIC5219-2.85YMM-TR2,500/Reel
MIC5219-3.0YMM 100/Tube MIC5219-3.0YMM-TR 2,500/Reel
MIC5219-3.3YMM 100/Tube MIC5219-3.3YMM-TR 2,500/Reel
MIC5219-3.6YMM 100/Tube MIC5219-3.6YMM-TR 2,500/Reel
MIC5219-5.0YMM 100/Tube MIC5219-5.0YMM-TR 2,500/Reel
MIC5219YMM 100/Tube MIC5219YMM-TR 2,500/Reel
Device: MIC5219: 500 mA Peak Output LDO Regulator
Voltage:
2.5 = 2.5V (SOT23, MSOP Packages)
2.6 = 2.6V (SOT23 Package)
2.7 = 2.7V (SOT23 Package)
2.8 = 2.8V (VDFN Package)
2.85 = 2.85V (SOT23, MSOP Packages)
2.9 = 2.9V (SOT23 Package)
3.0 = 3.0V (SOT23, MSOP, VDFN Packages)
3.1 = 3.1V (SOT23 Package)
3.3 = 3.3V (SOT23, MSOP, VDFN Packages)
3.6 = 3.6V (SOT23, MSOP Packages)
5.0 = 5.0V (SOT23, MSOP, TDFN Packages)
<blank> = ADJ (SOT23, MSOP, TDFN Packages)
Junction
Temperature
Range:
Y = –40°C to +125°C
Package:
M5 = 5-Lead SOT23
ML = 6-Lead 2 mm x 2 mm x 0.9 mm VDFN
MT = 6-Lead 2 mm x 2 mm x 0.6 mm TDFN
MM = 8-Lead MSOP
Media Type:
TR = 3,000/Reel (SOT23)
TX = 3,000/Reel (SOT23 Reverse Pin 1 orientation)
TR = 2,500/Reel (MSOP)
TR = 5,000/Reel (VDFN and TDFN)
<blank>= 100/Tube (MSOP)
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Device X.X XXX -XX
Part No. Voltage Junction
Tem p . R an g e
Package Media Type
Note: Other voltage options available. Contact your Microchip Sales Office.
MIC5219
DS20006021A-page 30 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006021A-page 31
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2998-2
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, micro perip hera ls, n onvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20006021A-page 32 2018 Microchip Technology Inc.
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10/25/17
