-
+1/2
LMP2022
0.1 PF
-
+
1/2
LMP2022
0.1 PF5.1 k:
0.1%
5.1 k:
0.1%
200:
200:
280:
VA
VA+
-
VA
LMP2021 ADC161S626
+
VR = 1/2 VA
-
1 k:
1 k:
R3
R4
R1
R2
VA
EMI
180:
470 pF
VA = 5V
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
LMP202x Zero-Drift, Low-Noise, EMI-Hardened Amplifiers
1
1 Features
1(Typical Values, TA= 25°C, VS= 5 V)
• Input Offset Voltage (Typical) −0.4 µV
• Input Offset Voltage (Max) ±5 µV
• Input Offset Voltage Drift (Typical) –0.004 µV/°C
• Input Offset Voltage Drift (Max) ±0.02 µV/°C
• Input Voltage Noise, AV= 1000 11 nV/√Hz
• Open Loop Gain 160 dB
• CMRR 139 dB
• PSRR 130 dB
• Supply Voltage Range 2.2 V to 5.5 V
• Supply Current (per Amplifier) 1.1 mA
• Input Bias Current ±25 pA
• GBW 5 MHz
• Slew Rate 2.6 V/µs
• Operating Temperature Range −40°C to 125°C
• 5-Pin SOT-23, 8-Pin VSSOP and 8-Pin SOIC
Packages
2 Applications
• Precision Instrumentation Amplifiers
• Battery Powered Instrumentation
• Thermocouple Amplifiers
• Bridge Amplifiers
3 Description
The LMP2021 and LMP2022 are single and dual
precision operational amplifiers offering ultra low input
offset voltage, near zero input offset voltage drift, very
low input voltage noise and very high open loop gain.
They are part of the LMP™ precision family and are
ideal for instrumentation and sensor interfaces.
The LMP202x has only 0.004 µV/°C of input offset
voltage drift, and 0.4 µV of input offset voltage. These
attributes provide great precision in high accuracy
applications.
The proprietary continuous auto zero correction
circuitry ensures impressive CMRR and PSRR,
removes the 1/f noise component, and eliminates the
need for calibration in many circuits.
With only 260 nVPP (0.1 Hz to 10 Hz) of input voltage
noise and no 1/f noise component, the LMP202x are
suitable for low frequency applications such as
industrial precision weigh scales. The extremely high
open loop gain of 160 dB drastically reduces gain
error in high gain applications. With ultra precision
DC specifications and very low noise, the LMP202x
are ideal for position sensors, bridge sensors,
pressure sensors, medical equipment and other high
accuracy applications with very low error budgets.
The LMP2021 is offered in 5-Pin SOT-23 and 8-Pin
SOIC packages. The LMP2022 is offered in 8-Pin
VSSOP and 8-Pin SOIC packages.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LMP2021 SOIC (8) 4.90 mm x 3.91 mm
SOT-23 (5) 2.90 mm x 1.60 mm
LMP2022 SOIC (8) 4.90 mm x 3.91 mm
VSSOP (8) 3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Bridge Amplifier
The LMP202x support systems with up to 24 bits of accuracy.
2
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LMP2021 LMP2022
Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions SC-70 and
VSSOP references from LMP2021 pinout
descriptions............................................................ 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics: 2.5 V................................ 5
6.6 Electrical Characteristics: 5 V................................... 7
6.7 Typical Characteristics.............................................. 9
7 Detailed Description............................................ 15
7.1 Overview................................................................. 15
7.2 Functional Block Diagram....................................... 15
7.3 Feature Description................................................. 15
7.4 Device Functional Modes........................................ 15
8 Application and Implementation ........................ 17
8.1 Application Information............................................ 17
8.2 Typical Application.................................................. 23
9 Power Supply Recommendations...................... 24
10 Layout................................................................... 24
10.1 Layout Guidelines ................................................. 24
10.2 Layout Example .................................................... 25
11 Device and Documentation Support................. 26
11.1 Device Support .................................................... 26
11.2 Documentation Support ........................................ 26
11.3 Related Links ........................................................ 26
11.4 Trademarks........................................................... 26
11.5 Electrostatic Discharge Caution............................ 26
11.6 Glossary................................................................ 26
12 Mechanical, Packaging, and Orderable
Information........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (December 2014) to Revision G Page
• Deleted SC-70 and VSSOP references from LMP2021 pinout descriptions ......................................................................... 3
• Deleted DCK and DGK packages and corrected SOT-23 pin function table for LMP2021 .................................................. 3
Changes from Revision E (March 2013) to Revision F Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 23
OUT
V-
+IN
V+
-IN
1
2
3
5
4
-
+
V+
1
2
3
4 5
6
7
8
N/C
-IN
+IN
V-
N/C
OUT
N/C
-
+
OUT B
1
2
3
45
6
7
8
OUT A
-IN A
+IN A
V-
V+
-IN B
+IN B
-
+
-
+
A
B
3
LMP2021
,
LMP2022
www.ti.com
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
Product Folder Links: LMP2021 LMP2022
Submit Documentation FeedbackCopyright © 2008–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
DVB Package: LMP2021
5 Pin SOT-23
TOP VIEW
D Package: LMP2021
8 Pin SOIC
TOP VIEW
D and DGK Packages: LMP2022
8 Pin VSSOP or SOIC
TOP VIEW
Pin Functions: LMP2021
PIN
I/O DESCRIPTION
NAME LMP2021
DBV D
OUT 1 6 I Output
+IN 3 3 I Non-Inverting Input
-IN 4 2 O Inverting Input
V- 2 4 P Negative Supply
V+ 5 7 P Positive Supply
N/C - 1 - No Internal Connection
N/C - 5 - No Internal Connection
N/C - 8 - No Internal Connection
Pin Functions: LMP2022
PIN
I/O DESCRIPTION
NAME LMP2022
D,
DGK
+IN A 3 I Non-Inverting input, channel A
+IN B 5 I Non-Inverting input, channel B
–IN A 2 I Inverting input, channel A
–IN B 6 I Inverting input, channel B
OUT A 1 O Output, channel A
OUT B 7 O Output, channel B
V+ 8 P Positive (highest) power supply
V– 4 P Negative (lowest) power supply
4
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LMP2021 LMP2022
Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the
test conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Package power dissipation should be observed.
(4) The maximum power dissipation is a function of TJ(MAX),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
MIN MAX UNIT
VIN Differential –VSVS
Supply Voltage (VS= V+– V−) 6.0 V
All Other Pins V++ 0.3 V−−0.3 V
Output Short-Circuit Duration to V+or V−(3) 5 seconds
Junction Temperature(4) 150 °C
Soldering
Information Infrared or Convection (20 sec) 235 °C
Wave Soldering Lead Temperature (10 sec) 260 °C
Tstg Storage temperature range −65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2) ±1000
Machine model ±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Temperature Range −40 125 °C
Supply Voltage (VS= V+– V–) 2.2 5.5 V
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
LMP2021,
LMP2022 LMP2021 LMP2022
UNIT
D DBV DGK
8 PINS 5 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 106 164 217 °C/W
5
LMP2021
,
LMP2022
www.ti.com
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
Product Folder Links: LMP2021 LMP2022
Submit Documentation FeedbackCopyright © 2008–2016, Texas Instruments Incorporated
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ> TA.
(2) All limits are specified by testing, statistical analysis or design.
(3) Typical values represent the most likely parametric norm at the time of characterization. Actual typical values may vary over time and
will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production
material.
(4) Offset voltage temperature drift is determined by dividing the change in VOS at the temperature extremes by the total temperature
change.
(5) The EMI Rejection Ratio is defined as EMIRR = 20Log ( VRF-PEAK/ΔVOS).
6.5 Electrical Characteristics: 2.5 V(1)
Unless otherwise specified, all limits are ensured for TA= 25°C, V+= 2.5 V, V−= 0 V, VCM = V+/2, RL>10 kΩto V+/2.
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
VOS Input Offset Voltage –5 –0.9 5 μV
–40°C ≤TJ≤125°C –10 10
TCVOS Input Offset Voltage Drift(4) –0.02 0.001 0.02 μV/°C
IBInput Bias Current –100 ±23 100 pA
–40°C ≤TJ≤125°C –300 300
IOS Input Offset Current –200 ±57 200 pA
–40°C ≤TJ≤125°C –250 250
CMRR Common Mode Rejection Ratio −0.2 V ≤VCM ≤1.7 V, 0 V ≤VCM ≤1.5 V 105 141 dB
−0.2 V ≤VCM ≤1.7 V, 0 V ≤VCM ≤1.5 V,
–40°C ≤TJ≤125°C 102
CMVR Input Common-Mode Voltage
Range Large Signal CMRR ≥105 dB −0.2 1.7 V
Large Signal CMRR ≥102 dB, –40°C ≤TJ≤
125°C 0 1.5
EMIRR Electro-Magnetic Interference
Rejection Ratio(5)
IN+
and
IN−
VRF-PEAK = 100 mVP(−20 dBVP)
f = 400 MHz 40
dB
VRF-PEAK = 100 mVP(−20 dBVP)
f = 900 MHz 48
VRF-PEAK = 100 mVP(−20 dBVP)
f = 1800 MHz 67
VRF-PEAK = 100 mVP(−20 dBVP)
f = 2400 MHz 79
PSRR Power Supply Rejection Ratio 2.5 V ≤V+≤5.5 V, VCM = 0 115 130
dB
2.5 V ≤V+≤5.5 V, VCM = 0 , –40°C ≤TJ≤
125°C 112
2.2 V ≤V+≤5.5 V, VCM = 0 110 130
AVOL Large Signal Voltage Gain RL= 10 kΩto V+/2, VOUT = 0.5 V to 2 V 124 150
dB
RL= 10 kΩto V+/2, VOUT = 0.5 V to 2 V,
–40°C ≤TJ≤125°C 119
RL= 2 kΩto V+/2, VOUT = 0.5 V to 2 V 120 150
RL= 2 kΩto V+/2, VOUT = 0.5 V to 2 V,
–40°C ≤TJ≤125°C 115
VOUT Output Swing High RL= 10 kΩto V+/2 38 50
mV
from either
rail
RL= 10 kΩto V+/2, –40°C ≤TJ≤125°C 70
RL= 2 kΩto V+/2 62 85
RL= 2 kΩto V+/2, –40°C ≤TJ≤125°C 115
Output Swing Low RL= 10 kΩto V+/2 30 45
RL= 10 kΩto V+/2, –40°C ≤TJ≤125°C 55
RL= 2 kΩto V+/2 58 75
RL= 2 kΩto V+/2, –40°C ≤TJ≤125°C 95
IOUT Linear Output Current Sourcing, VOUT = 2 V 30 50 mA
Sinking, VOUT = 0.5 V 30 50
6
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
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Product Folder Links: LMP2021 LMP2022
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Electrical Characteristics: 2.5 V(1) (continued)
Unless otherwise specified, all limits are ensured for TA= 25°C, V+= 2.5 V, V−= 0 V, VCM = V+/2, RL>10 kΩto V+/2.
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
(6) The number specified is the average of rising and falling slew rates and is measured at 90% to 10%.
ISSupply Current Per Amplifier 0.95 1.10 mA
Per Amplifier, –40°C ≤TJ≤125°C 1.37
SR Slew Rate(6) AV= +1, CL= 20 pF, RL= 10 kΩ
VO= 2 VPP 2.5 V/μs
GBW Gain Bandwidth Product CL= 20 pF, RL= 10 kΩ5 MHz
GMGain Margin CL= 20 pF, RL= 10 kΩ10 dB
ΦMPhase Margin CL= 20 pF, RL= 10 kΩ60 deg
CIN Input Capacitance Common Mode 12 pF
Differential Mode 12
enInput-Referred Voltage Noise
Density f = 0.1 kHz or 10 kHz, AV= 1000 11 nV/√Hz
f = 0.1 kHz or 10 kHz, AV= 100 15
Input-Referred Voltage Noise 0.1 Hz to 10 Hz 260 nVPP
0.01 Hz to 10 Hz 330
InInput-Referred Current Noise f = 1 kHz 350 fA/√Hz
trRecovery time to 0.1%, RL= 10 kΩ, AV=−50,
VOUT = 1.25 VPP Step, Duration = 50 μs50 µs
CT Cross Talk LMP2022, f = 1 kHz 150 dB
7
LMP2021
,
LMP2022
www.ti.com
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
Product Folder Links: LMP2021 LMP2022
Submit Documentation FeedbackCopyright © 2008–2016, Texas Instruments Incorporated
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ> TA.
(2) All limits are specified by testing, statistical analysis or design.
(3) Typical values represent the most likely parametric norm at the time of characterization. Actual typical values may vary over time and
will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production
material.
(4) Offset voltage temperature drift is determined by dividing the change in VOS at the temperature extremes by the total temperature
change.
(5) The EMI Rejection Ratio is defined as EMIRR = 20Log ( VRF-PEAK/ΔVOS).
6.6 Electrical Characteristics: 5 V(1)
Unless otherwise specified, all limits are ensured for TA= 25°C, V+= 5 V, V−= 0 V, VCM = V+/2, RL> 10 kΩto V+/2.
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
VOS Input Offset Voltage –5 −0.4 5 μV
–40°C ≤TJ≤125°C –10 10
TCVOS Input Offset Voltage Drift(4) –0.02 −0.004 0.02 μV/°C
IBInput Bias Current –100 ±25 100 pA
–40°C ≤TJ≤125°C –300 300
IOS Input Offset Current –200 ±48 200 pA
–40°C ≤TJ≤125°C –250 250
CMRR Common Mode Rejection Ratio −0.2 V ≤VCM ≤4.2 V, 0 V ≤VCM ≤4.0 V 120 139 dB
−0.2 V ≤VCM ≤4.2 V, 0 V ≤VCM ≤4.0 V,
–40°C ≤TJ≤125°C 115
CMVR Input Common-Mode Voltage
Range Large Signal CMRR ≥120 dB –0.2 4.2 V
Large Signal CMRR ≥115 dB, –40°C ≤TJ
≤125°C 0 4.0
EMIRR Electro-Magnetic Interference
Rejection Ratio(5)
IN+
and
IN−
VRF-PEAK = 100 mVP(−20 dBVP)
f = 400 MHz 58
dB
VRF-PEAK = 100 mVP(−20 dBVP)
f = 900 MHz 64
VRF-PEAK = 100 mVP(−20 dBVP)
f = 1800 MHz 72
VRF-PEAK = 100 mVP(−20 dBVP)
f = 2400 MHz 82
PSRR Power Supply Rejection Ratio 2.5 V ≤V+≤5.5 V, VCM = 0 115 130
dB
2.5 V ≤V+≤5.5 V, VCM = 0, –40°C ≤TJ≤
125°C 112
2.2 V ≤V+≤5.5 V, VCM = 0 110 130
AVOL Large Signal Voltage Gain RL= 10 kΩto V+/2, VOUT = 0.5 V to 4.5 V 125 160
dB
RL= 10 kΩto V+/2, VOUT = 0.5 V to 4.5 V,
–40°C ≤TJ≤125°C 120
RL= 2 kΩto V+/2, VOUT = 0.5 V to 4.5 V 123 160
RL= 2 kΩto V+/2, VOUT = 0.5 V to 4.5 V,
–40°C ≤TJ≤125°C 118
VOUT Output Swing High RL= 10 kΩto V+/2 83 135
mV
from either
rail
RL= 10 kΩto V+/2, –40°C ≤TJ≤125°C 170
RL= 2 kΩto V+/2 120 160
RL= 2 kΩto V+/2, –40°C ≤TJ≤125°C 204
Output Swing Low RL= 10 kΩto V+/2 65 80
RL= 10 kΩto V+/2, –40°C ≤TJ≤125°C 105
RL= 2 kΩto V+/2 103 125
RL= 2 kΩto V+/2, –40°C ≤TJ≤125°C 158
IOUT Linear Output Current Sourcing, VOUT = 4.5 V 30 50 mA
Sinking, VOUT = 0.5 V 30 50
8
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LMP2021 LMP2022
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Electrical Characteristics: 5 V(1) (continued)
Unless otherwise specified, all limits are ensured for TA= 25°C, V+= 5 V, V−= 0 V, VCM = V+/2, RL> 10 kΩto V+/2.
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
(6) The number specified is the average of rising and falling slew rates and is measured at 90% to 10%.
ISSupply Current Per Amplifier 1.1 1.25 mA
Per Amplifier, –40°C ≤TJ≤125°C 1.57
SR Slew Rate(6) AV= +1, CL= 20 pF, RL= 10 kΩ
VO= 2 VPP 2.6 V/μs
GBW Gain Bandwidth Product CL= 20 pF, RL= 10 kΩ5 MHz
GMGain Margin CL= 20 pF, RL= 10 kΩ10 dB
ΦMPhase Margin CL= 20 pF, RL= 10 kΩ60 deg
CIN Input Capacitance Common Mode 12 pF
Differential Mode 12
enInput-Referred Voltage Noise
Density f = 0.1 kHz or 10 kHz, AV= 1000 11 nV/√Hz
f = 0.1 kHz or 10 kHz, AV= 100 15
Input-Referred Voltage Noise 0.1 Hz to 10 Hz Noise 260 nVPP
0.01 Hz to 10 Hz Noise 330
InInput-Referred Current Noise f = 1 kHz 350 fA/√Hz
trInput Overload Recovery time to 0.1%, RL= 10 kΩ, AV=−50,
VOUT = 2.5 VPP Step, Duration = 50 μs50 μs
CT Cross Talk LMP2022, f = 1 kHz 150 dB
23 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
-10
-5
0
5
10
OFFSET VOLTAGE (PV)
2.5
-40°C
25°C
85°C
125°C
10 1k 1M
FREQUENCY (Hz)
0
40
80
140
PSRR (dB)
100k
10k
100
120
60
20
100
+PSRR
-PSRR
VS = 2.5V, 5V
VCM = VS/2
-5 -4 -3 -2 -1 0 1 2 3 4 5
0
2
4
6
8
10
12
14
16
18
PERCENTAGE (%)
VOS (PV)
VS = 5V
TA = 25°C
VCM = VS/2
UNITS TESTED = 6200
-20 -10 0 10 20
0
2
4
6
8
10
12
14
16
PERCENTAGE (%)
TCVOS (nV/°C)
VS = 5V
VCM = VS/2
-40°C dTAd125°C
UNITS TESTED = 6200
-5 -4 -3 -2 -1 0 1 2 3 4 5
0
2
4
6
8
10
12
14
16
PERCENTAGE (%)
VOS (PV)
VS = 2.5V
TA = 25°C
VCM = VS/2
UNITS TESTED > 1700
-20 -10 0 10 20
0
2
4
6
8
10
12
14
PERCENTAGE (%)
TCVOS (nV/°C)
VS = 2.5V
VCM = VS/2
-40°C d TA d125°C
UNITS TESTED > 1700
9
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,
LMP2022
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SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
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6.7 Typical Characteristics
Unless otherwise noted: TA= 25°C, RL> 10 kΩ, VS= V+– V–, VS= 5 V, VCM = VS/2.
Figure 1. Offset Voltage Distribution Figure 2. TCVOS Distribution
Figure 3. Offset Voltage Distribution Figure 4. TCVOS Distribution
Figure 5. Offset Voltage vs. Supply Voltage Figure 6. PSRR vs. Frequency
10 100 1k 10k 100k
FREQUENCY (Hz)
1
10
100
INPUT VOLTAGE NOISE DENSITY (nV/
Hz)
VS = 5V
VS = 2.5V
GAIN = 1000
23 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
0.75
1
1.25
1.5
SUPPLY CURRENT (mA)
2.5
125°C 85°C
25°C
-40°C
-0.2 0.2 0.6 1 1.4 1.8
-10
-5
0
5
10
OFFSET VOLTAGE (PV)
COMMON MODE VOLTAGE (V)
-40°C
25°C
85°C
125°C
VS = 2.5V
OFFSET VOLTAGE (PV)
-0.2 0.6 1.4 2.2 3 4.6
COMMON MODE VOLTAGE (V)
-10
-5
0
5
10
3.8
-40°C
25°C
85°C
125°C
10
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
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Typical Characteristics (continued)
Unless otherwise noted: TA= 25°C, RL> 10 kΩ, VS= V+– V–, VS= 5 V, VCM = VS/2.
Figure 7. Input Bias Current vs. VCM Figure 8. Input Bias Current vs. VCM
Figure 9. Offset Voltage vs. VCM Figure 10. Offset Voltage vs. VCM
Figure 11. Supply Current vs. Supply Voltage (Per Amplifier) Figure 12. Input Voltage Noise vs. Frequency
-40 -30 -20 -10 0 10 20
RF INPUT SIGNAL PEAK (dBm)
0
20
40
60
80
100
120
EMIRR (dB)
30
VS = 2.5V
fRF = 2400 MHz
fRF = 1800 MHz
fRF = 900 MHz
fRF = 400 MHz
-40 -30 -20 -10 0 10 20 30
RF INPUT SIGNAL PEAK (dBm)
0
20
40
60
80
100
120
140
EMIRR (dB)
fRF = 2400 MHz
VS = 5V
fRF = 1800 MHz
fRF = 400 MHz
fRF = 900 MHz
100 10k 10M
FREQUENCY (Hz)
-20
20
60
120
GAIN (dB)
1M
100k
1k
100
40
0
80
-30
30
90
180
150
60
0
120
PHASE (°)
VS = 5V
RL = 10 k:
CL = 20 pF
PHASE
GAIN
TA = -40°C, 25°C, 85°C, 125°C
10 100 1000 10000
FREQUENCY (MHz)
0
20
40
60
80
100
120
140
160
EMIRR (dB)
VS = 5V
VS = 2.5V
100 10k 10M
FREQUENCY (Hz)
-20
20
60
120
GAIN (dB)
1M
100k
1k
100
40
0
80
-30
30
90
180
150
60
0
120
GAIN
PHASE
VS = 2.5V
RL = 2 k:, 10 k:, 10 M:
CL = 20 pF, 50 pF, 100 pF
PHASE (°)
100 10k 10M
FREQUENCY (Hz)
-20
20
60
120
GAIN (dB)
1M
100k
1k
100
40
0
80
-30
30
90
180
150
60
0
120
GAIN
PHASE
VS = 5V
RL = 2 k:, 10 k:, 10 M:
CL = 20 pF, 50 pF, 100 pF
PHASE (°)
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Typical Characteristics (continued)
Unless otherwise noted: TA= 25°C, RL> 10 kΩ, VS= V+– V–, VS= 5 V, VCM = VS/2.
Figure 13. Open Loop Frequency Response Figure 14. Open Loop Frequency Response
Figure 15. Open Loop Frequency Response Over
Temperature Figure 16. EMIRR vs. Frequency
Figure 17. EMIRR vs. Input Power Figure 18. EMIRR vs. Input Power
23 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V)
0
40
80
120
160
VOUT from RAIL (mV)
2.5
-40°C
25°C 85°C
125°C
RL = 2 k:
22.5 3 3.5 4 4.5 5
SUPPLY VOLTAGE (V)
0
40
80
120
160
200
VOUT from RAIL (mV)
5.5
RL = 2 k:125°C
85°C
25°C
-40°C
10 100 1k 10k 100k
FREQUENCY (Hz)
40
60
80
100
120
140
160
CMRR (dB)
VS = 2.5V
VS = 5V
VS = 2.5V, 5V
VCM = VS/2
2 2.5 3 3.5 4 4.5 5 5.5
2
2.2
2.4
2.6
2.8
3
SLEW RATE (V/Ps)
SUPPLY VOLTAGE (V)
VIN = 1 VPP
AV = +1
f = 10 kHz
RL = 10 k:
CL = 20 pF
FALLING EDGE
RISING EDGE
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Typical Characteristics (continued)
Unless otherwise noted: TA= 25°C, RL> 10 kΩ, VS= V+– V–, VS= 5 V, VCM = VS/2.
Figure 19. Time Domain Input Voltage Noise Figure 20. Time Domain Input Voltage Noise
Figure 21. CMRR vs. Frequency Figure 22. Slew Rate vs. Supply Voltage
Figure 23. Output Swing High vs. Supply Voltage Figure 24. Output Swing Low vs. Supply Voltage
200 mV/DIV
10 Ps/DIV
VS = 2.5V
AV = +1
VIN = 1 VPP
f = 10 kHz
RL = 10 k:
CL = 20 pF
20 mV/DIV
10 Ps/DIV
VS = 2.5V
AV = +1
VIN = 100 mVPP
f = 10 kHz
RL = 10 k:
CL = 20 pF
50 mV/DIV
INPUT
2 Ps/DIV
1 V/DIV
OUTPUT
||
VS = 5V
AV = -50 V/V
RL = 10 k:
50 mV/DIV
INPUT
10 Ps/DIV
1 V/DIV
OUTPUT
||
VS = 5V
AV = -50 V/V
RL = 10 k:
22.5 3 3.5 4 4.5 5
SUPPLY VOLTAGE (V)
0
40
80
120
160
200
VOUT from RAIL (mV)
5.5
RL = 10 k:
125°C
85°C
25°C
-40°C
22.5 3 3.5 4 4.5 5
SUPPLY VOLTAGE (V)
0
20
40
60
80
100
120
VOUT from RAIL (mV)
5.5
RL = 10 k:
125°C
85°C
25°C
-40°C
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Typical Characteristics (continued)
Unless otherwise noted: TA= 25°C, RL> 10 kΩ, VS= V+– V–, VS= 5 V, VCM = VS/2.
Figure 25. Output Swing High vs. Supply Voltage Figure 26. Output Swing Low vs. Supply Voltage
Figure 27. Overload Recovery Time Figure 28. Overload Recovery Time
Figure 29. Large Signal Step Response Figure 30. Small Signal Step Response
05 10 15 20 25 30 35 40
OUTPUT CURRENT (mA)
0
0.2
0.4
(V+) -0.2
V+
VOUT from RAIL (V)
(V+) -0.4
(V+) -0.6
VS = 2.5V, 5V
||
125°C 85°C 25°C -40°C
10 1k 1M
FREQUENCY (Hz)
60
100
140
200
CROSSTALK REJECTION RATIO (dB)
100k
10k
100
180
120
80
160
VS = 2.5V
VS = 5V
Channel A to B
Channel B to A
500 mV/DIV
10 Ps/DIV
VS = 5V
AV = +1
VIN = 2 VPP
f = 10 kHz
RL = 10 k:
CL = 20 pF
20 mV/DIV
10 Ps/DIV
VS = 5V
AV = +1
VIN = 100 mVPP
f = 10 kHz
RL = 10 k:
CL = 20 pF
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Typical Characteristics (continued)
Unless otherwise noted: TA= 25°C, RL> 10 kΩ, VS= V+– V–, VS= 5 V, VCM = VS/2.
Figure 31. Large Signal Step Response Figure 32. Small Signal Step Response
Figure 33. Output Voltage vs. Output Current Figure 34. Cross Talk Rejection Ratio vs. Frequency
(LMP2022)
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7 Detailed Description
7.1 Overview
The LMP202x are single and dual precision operational amplifiers with ultra low offset voltage, ultra low offset
voltage drift, and very low input voltage noise with no 1/f and extended supply voltage range. The LMP202x offer
on chip EMI suppression circuitry which greatly enhances the performance of these precision amplifiers in the
presence of radio frequency signals and other high frequency disturbances.
The LMP202x utilize proprietary auto zero techniques to measure and continuously correct the input offset error
voltage. The LMP202x have a DC input offset voltage with a maximum value of ±5 μV and an input offset voltage
drift maximum value of 0.02 µV/°C. The input voltage noise of the LMP202x is less than 11 nV/√Hz at a voltage
gain of 1000 V/V and has no flicker noise component. This makes the LMP202x ideal for high accuracy, low
frequency applications where lots of amplification is needed and the input signal has a very small amplitude.
The proprietary input offset correction circuitry enables the LMP202x to have superior CMRR and PSRR
performances. The combination of an open loop voltage gain of 160 dB, CMRR of 142 dB, PSRR of 130 dB,
along with the ultra low input offset voltage of only −0.4 µV, input offset voltage drift of only −0.004 µV/°C, and
input voltage noise of only 260 nVPP at 0.1 Hz to 10 Hz make the LMP202x great choices for high gain
transducer amplifiers, ADC buffer amplifiers, DAC I-V conversion, and other applications requiring precision and
long-term stability. Other features are rail-to-rail output, low supply current of 1.1 mA per amplifier, and a gain-
bandwidth product of 5 MHz.
The LMP202x have an extended supply voltage range of 2.2 V to 5.5 V, making them ideal for battery operated
portable applications. The LMP2021 is offered in 5-pin SOT-23 and 8-pin SOIC packages. The LMP2022 is
offered in 8-pin VSSOP and 8-Pin SOIC packages.
7.2 Functional Block Diagram
7.3 Feature Description
The amplifier's differential inputs consist of a non-inverting input (+IN) and an inverting input (–IN). The amplifier
amplifies only the difference in voltage between the two inputs, which is called the differential input voltage. The
output voltage of the op-amp Vout is given by Equation 1:
VOUT = AOL (IN+- IN-) (1)
where AOL is the open-loop gain of the amplifier, typically around 100dB (100,000x, or 10uV per Volt).
7.4 Device Functional Modes
7.4.1 EMI Suppression
The near-ubiquity of cellular, Bluetooth, and Wi-Fi signals and the rapid rise of sensing systems incorporating
wireless radios make electromagnetic interference (EMI) an evermore important design consideration for
precision signal paths. Though RF signals lie outside the op amp band, RF carrier switching can modulate the
DC offset of the op amp. Also some common RF modulation schemes can induce down-converted components.
The added DC offset and the induced signals are amplified with the signal of interest and thus corrupt the
measurement. The LMP202x use on chip filters to reject these unwanted RF signals at the inputs and power
supply pins; thereby preserving the integrity of the precision signal path.
10 100 1k 10k
FREQUENCY (Hz)
1
10
100
INPUT VOLTAGE NOISE DENSITY (nV/
Hz)
GAIN = 1000
GAIN = 500
GAIN = 250
GAIN = 100
GAIN = 51
GAIN = 10
110 100 1000
CLOSED LOOP GAIN (V/V)
0
4
8
12
16
20
24
INPUT VOLTAGE NOISE DENSITY (nV/
Hz)
VS = 5V
f = 100 Hz
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Device Functional Modes (continued)
Twisted pair cabling and the active front-end’s common-mode rejection provide immunity against low frequency
noise (i.e. 60 Hz or 50 Hz mains) but are ineffective against RF interference. Figure 46 displays this. Even a few
centimeters of PCB trace and wiring for sensors located close to the amplifier can pick up significant 1 GHz RF.
The integrated EMI filters of LMP202x reduce or eliminate external shielding and filtering requirements, thereby
increasing system robustness. A larger EMIRR means more rejection of the RF interference. For more
information on EMIRR, please refer to AN-1698 (Literature Number SNOA497).
7.4.2 Input Voltage Noise
The input voltage noise density of the LMP202x has no 1/f corner, and its value depends on the feedback
network used. This feature of the LMP202x differentiates this family from other products currently available from
other vendors. In particular, the input voltage noise density decreases as the closed loop voltage gain of the
LMP202x increases. The input voltage noise of the LMP202x is less than 11 nV/√Hz when the closed loop
voltage gain of the op amp is 1000. Higher voltage gains are required for smaller input signals. When the input
signal is smaller, a lower input voltage noise is quite advantageous and increases the signal to noise ratio.
Figure 35 shows the input voltage noise of the LMP202x as the closed loop gain increases.
Figure 35. Input Voltage Noise Density decreases with Gain
Figure 36 shows the input voltage noise density does not have the 1/f component.
Figure 36. Input Voltage Noise Density with no 1/f
With smaller and smaller input signals and high precision applications with lower error budget, the reduced input
voltage noise and no 1/f noise allow more flexibility in circuit design.
LMP2021/
LMP2022
RIN/RF
IN +
-
RIN
RF
RFILT
LMV771
-
+
RFILT
OUT
CFILT
IN +
-
RIN//RF
RF
RIN
CF
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Achieving Lower Noise With Filtering
The low input voltage noise of the LMP202x, and no 1/f noise make these suitable for many applications with
noise sensitive designs. Simple filtering can be done on the LMP202x to remove high frequency noise. Figure 37
shows a simple circuit that achieves this.
In Figure 37 CFand the corner frequency of the filter resulting from CFand RFwill reduce the total noise.
Figure 37. Noise Reducing Filter for Lower Gains
In order to achieve lower noise floors for even more noise stringent applications, a simple filter can be added to
the op amp’s output after the amplification stage. Figure 38 shows the schematic of a simple circuit which
achieves this objective. Low noise amplifiers such as the LMV771 can be used to create a single pole low pass
filter on the output of the LMP202x. The noise performance of the filtering amplifier, LMV771 in this circuit, will
not be dominant as the input signal on LMP202x has already been significantly gained up and as a result the
effect of the input voltage noise of the LMV771 is effectively not noticeable.
Figure 38. Enhanced Filter to Further Reduce Noise at Higher Gains
10 100 1k 10k
3 dB FILTER BANDWIDTH (Hz)
0.01
0.1
1
10
RMS NOISE (PV)
AV = 60 dB
AV = 40 dB
2-Stage Filter
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Application Information (continued)
Using the circuit in Figure 38 has the advantage of removing the non-linear filter bandwidth dependency which is
seen when the circuit in Figure 37 is used. The difference in noise performance of the circuits in Figure 37 and
Figure 38 becomes apparent only at higher gains. At voltage gains of 10 V/V or less, there is no difference
between the noise performance of the two circuits.
Figure 39. RMS Input Referred Noise vs. Frequency
Figure 39 shows the total input referred noise vs. 3 dB corner of both filters of Figure 37 and Figure 38 at gains
of 100V/V and 1000V/V. For these measurements and using Figure 37's circuit, RF= 49.7 kΩand RIN = 497Ω.
Value of CFhas been changed to achieve the desired 3 dB filter corner frequency. In the case of Figure 38's
circuit, RF= 49.7 kΩand RIN = 497Ω, RFILT = 49.7 kΩ, and CFILT has been changed to achieve the desired 3 dB
filter corner frequency. Figure 39 compares the RMS noise of these two circuits. As Figure 39 shows, the RMS
noise measured the circuit in Figure 38 has lower values and also depicts a more linear shape.
8.1.2 Input Bias Current
The bias current of the LMP202x behaves differently than a conventional amplifier due to the dynamic transient
currents created on the input of an auto-zero circuit. The input bias current is affected by the charge and
discharge current of the input auto-zero circuit. This effectivly creates a repetitive impulse current noise of 100's
of pA. For this reason, the LMP202x is not recommeded for source impedances of 1 MΩor greater.
The amount of current sunk or sourced from that stage is dependent on the combination of input impedance
(resistance and capacitance), as well as the balance and matching of these impedances across the two inputs.
This current, integrated by the input capacitence, causes a shift in the apparent "bias current". Because of this,
there is an apparent "bias current vs. input impedance" interaction. In the LMP202x for an input resistive
impedance of 1 GΩ, the shift in input bias current can be up to 40 pA. This input bias shift is caused by varying
the input's capacitive impedance. Since the input bias current is dependent on the input impedance, it is difficult
to estimate what the actual bias current is without knowing the end circuit and associated capacitive strays.
Figure 40 shows the input bias current of the LMP202x and that of another commercially available amplifier from
a competitor. As it can be seen, the shift in LMP202x bias current is much lower than that of other chopper style
or auto zero amplifiers available from other vendors.
1INPUT CAPACITANCE (pF)
-30
-18
-6
6
18
30
POSITIVE BIAS CURRENT (pA)
10 100 1000
RG
CG
+
-
0 10 20 30 40 50 60 70 80 90 100
-75
-50
-25
0
25
50
75
100
125
150
175
IBIAS (pA)
TIME (s)
LMP2021/LMP2022
10 20 30 40 50 60 70 80 90 100
IBIAS (pA)
TIME (s)
-75
-50
-25
0
25
50
75
100
125
150
175
CG = 20 pF CG = 1000 pF
CG = 0 pF
Competitor A
CG = 0 pF
CG = 0, 1, 3, 5, 8, 10, 20, 50, 75, 100, 200, 500, 1000 pF
CG = 20 pF
CG = 1000 pF
VS = 5V, VCM = VS/2, RG = 1 G:
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Application Information (continued)
Figure 40. Input Bias Current of LMP202x is lower than Competitor A
8.1.3 Lowering the Input Bias Current
As mentioned in the Input Bias Current section, the input bias current of an auto zero amplifier such as the
LMP202x varies with input impedance and feedback impedance. Once the value of a certain input resistance, i.e.
sensor resistance, is known, it is possible to optimize the input bias current for this fixed input resistance by
choosing the capacitance value that minimizes that current. Figure 41 shows the input bias current vs. input
impedance of the LMP202x. The value of RGor input resistance in this test is 1 GΩ. When this value of input
resistance is used, and when a parallel capacitance of 22 pF is placed on the circuit, the resulting input bias
current is nearly 0 pA. Figure 41 can be used to extrapolate capacitor values for other sensor resistances. For
this purpose, the total impedance seen by the input of the LMP202x needs to be calculated based on Figure 41.
By knowing the value of RG, one can calculate the corresponding CGwhich minimizes the non-inverting input
bias current, positive bias current, value.
Figure 41. Input Bias Current vs. CGwith RG=1GΩ
In a typical I-V converter, the output voltage will be the sum of DC offset plus bias current and the applied signal
through the feedback resistor. In a conventional input stage, the inverting input's capacitance has very little effect
on the circuit. This effect is generally on settling time and the dielectric soakage time and can be ignored. In auto
zero amplifiers, the input capacitance effect will add another term to the output. This additional term means that
the baseline reading on the output will be dependent on the input capacitance. The term input capacitance for
this purpose includes circuit strays and any input cable capacitances. There is a slight variation in the capacitive
-
+
FEEDBACK
NETWORK
VIN_DIFF
VIN RIN
110 1000
FEEDBACK CAPACITANCE (pF)
0
26
52
78
104
130
156
NEGATIVE BIAS CURRENT (pA)
100
RF
CF
+
-
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Application Information (continued)
offset as the duty cycle and amplitude of the pulses vary from part to part, depending on the correction at the
time. The lowest input current will be obtained when the impedances, both resistive and capacitive, are matched
between the inputs. By balancing the input capacitances, the effect can be minimized. A simple way to balance
the input impedance is adding a capacitance in parallel to the feedback resistance. The addition of this feedback
capacitance reduces the bias current and increases the stability of the operational amplifier. Figure 42 shows the
input bias current of the LMP202x when RFis set to 1 GΩ. As it can be seen from Figure 42, choosing the
optimum value of CFwill help reducing the input bias current.
Figure 42. Input Bias Current vs. CFwith RF=1GΩ
The effect of bias current on a circuit can be estimated with the following:
AV*IBIAS+*ZS- IBIAS−*ZF(2)
Where AVis the closed loop gain of the system and IBIAS+ and IBIAS−denote the positive and negative bias
current, respectively. It is common to show the average of these bias currents in product datasheets. If IBIAS+ and
IBIAS−are not individually specified, use the IBIAS value provided in datasheet graphs or tables for this calculation.
For the application circuit shown in Figure 46, the LMP2022 amplifiers each have a gain of 18. With a sensor
impedance of 500Ωfor the bridge, and using the above equation, the total error due to the bias current on the
outputs of the LMP2022 amplifier will be less than 200 nV.
8.1.4 Sensor Impedance
The sensor resistance, or the resistance connected to the inputs of the LMP202x, contributes to the total
impedance seen by the auto correcting input stage.
-
+
FEEDBACK
NETWORK
VIN_DIFF
VIN RIN
CIN
INPUT
SWITCHES
VIN_DIFF
RIN RON_SWITCH
COUT
VOUT
+
-
CIN
VIN
-
+
FEEDBACK
NETWORK
VIN_DIFF
VIN RIN
CIN
INPUT
SWITCHES
VIN_DIFF
RIN RON_SWITCH
COUT
VOUT
+
-
VIN
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Application Information (continued)
Figure 43. Auto Correcting Input Stage Model
As shown in Figure 43, the sum of RIN and RON-SWITCH will form a low pass filter with COUT during correction
cycles. As RIN increases, the time constant of this filter increases, resulting in a slower output signal which could
have the effect of reducing the open loop gain, AVOL, of the LMP202x. In order to prevent this reduction in AVOL in
presence of high impedance sensors or other high resistances connected to the input of the LMP202x, a
capacitor can be placed in parallel to this input resistance. This is shown in Figure 44.
Figure 44. Sensor Impedance with Parallel Capacitance
CIN in Figure 44 adds a zero to the low pass filter and hence eliminating the reduction in AVOL of the LMP202x.
An alternative circuit to achieve this is shown in Figure 45.
Figure 45. Alternative Sensor Impedance Circuit
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Application Information (continued)
8.1.5 Transient Response to Fast Inputs
On chip continuous auto zero correction circuitry eliminates the 1/f noise and significantly reduces the offset
voltage and offset voltage drift; all of which are very low frequency events. For slow changing sensor signals this
correction is transparent. For excitations which may otherwise cause the output to swing faster than 40 mV/µs,
there are additional considerations which can be viewed two perspectives: for sine waves and for steps.
For sinusoidal inputs, when the output is swinging rail-to-rail on ±2.5-V supplies, the auto zero circuitry will
introduce distortions above 2.55 kHz. For smaller output swings, higher frequencies can be amplified without the
auto zero slew limitation as shown in table below. Signals above 20 kHz, are not affected, though normally,
closed loop bandwidth should be kept below 20 kHz so as to avoid aliasing from the auto zero circuit.
VOUT-PEAK (V) fMAX-SINE WAVE (kHz)
0.32 20
1 6.3
2.5 2.5
(1) No significant difference in Noise measurements at AV= 10V/V
For step-like inputs, such as those arising from disturbances to a sensing system, the auto zero slew rate
limitation manifests itself as an extended ramping and settling time, lasting ~100 µs.
8.1.6 Digital Acquisition Systems
High resolution ADC’s with 16-bits to 24-bits of resolution can be limited by the noise of the amplifier driving
them. The circuit configuration, the value of the resistors used and the source impedance seen by the amplifier
can affect the noise of the amplifier. The total noise at the output of the amplifier can be dominated by one of
several sources of noises such as: white noise or broad band noise, 1/f noise, thermal noise, and current noise.
In low frequency applications such as medical instrumentation, the source impedance is generally low enough
that the current noise coupled into it does not impact the total noise significantly. However, as the 1/f or flicker
noise is paramount to many application, the use of an auto correcting stabilized amplifier like the LMP202x
reduces the total noise.
Table 1 summarizes the input and output referred RMS noise values for the LMP202x compared to that of
Competitor A. As described in previous sections, the outstanding noise performance of the LMP202x can be
even further improved by adding a simple low pass filter following the amplification stage.
The use of an additional filter, as shown in Figure 38 benefits applications with higher gain. For this reason, at a
gain of 10, only the results of circuit in Figure 37 are shown. The RMS input noise of the LMP202x are compared
with Competitor A's input noise performance. Competitor A's RMS input noise behaves the same with or without
an additional filter.
Table 1. RMS Input Noise Performance
Amplifier
Gain
(V/V)
System Bandwidth Requirement
(Hz)
RMS Input Noise (nV)
LMP202x Competitor A
Figure 37 Circuit Figure 38 Circuit Figure 37,Figure 38 Circuit
10 100 229 See(1) 300
1000 763 See(1) 1030
100 100 229 196 300
1000 763 621 1030
1000 10 71 46 95
100 158 146 300
1000 608 462 1030
-
+1/2
LMP2022
0.1 PF
-
+
1/2
LMP2022
0.1 PF5.1 k:
0.1%
5.1 k:
0.1%
200:
200:
280:
VA
VA+
-
VA
LMP2021 ADC161S626
+
VR = 1/2 VA
-
1 k:
1 k:
R3
R4
R1
R2
VA
EMI
180:
470 pF
VA = 5V
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8.2 Typical Application
Figure 46 shows the Bridge Sensor Interface for these devices.
Figure 46. LMP202x Used With ADC161S626
8.2.1 Design Requirements
Bridge sensors are used in a variety of applications such as pressure sensors and weigh scales. Bridge sensors
typically have a very small differential output signal. This very small differential signal needs to be accurately
amplified before it can be fed into an ADC. As discussed in the previous sections, the accuracy of the op amp
used as the ADC driver is essential to maintaining total system accuracy.
The high DC performance of the LMP202x make these amplifiers ideal choices for use with a bridge sensor. The
LMP202x have very low input offset voltage and very low input offset voltage drift. The open loop gain of the
LMP202x is 160 dB.
The circuit in Figure 46 shows a signal path solution for a typical bridge sensor using the LMP202x. Bridge
sensors are created by replacing at least one of the resistors in a typical bridge with a sensor whose resistance
varies in response to an external stimulus. For this example, the expected bridge output signal will be in the
range of ±12 mV. This signal must be accurately amplified by the amplifier to best match the dynamic input range
of the ADC. This is done by using one LMP2022 and one LMP2021 in front of the ADC161S626.
The on chip EMI rejection filters available on the LMP202x help remove the EMI interference introduced to the
signal and hence improve the overall system performance.
8.2.2 Detailed Design Procedure
The amplification of this ±12 mV signal is achieved in 2 stages and through a three op-amp instrumentation
amplifier. The dual LMP2022 in Figure 46 amplifies each side of the differential output of the bridge sensor by a
gain of 18.2. Using the LMP2022 with a gain of 18.2 reduces the input referred voltage noise of the op amps and
the system as a result. Also, this gain allows direct filtering of the signal on the LMP2022 without compromising
noise performance. The differential output of the two amplifiers in the LMP2022 are then fed into a LMP2021
configured as a difference amplifier. This stage has a gain of 5, with a total system having a gain of (18.2 * 2 +1 )
* 5 = 187. The LMP2021 has an outstanding CMRR value of 139. This impressive CMRR improves system
performance by removing the common mode signal introduced by the bridge. With an overall gain of 187, the
±12 mV differential input signal is gained up to ±2.24V (0.26 V to 4.74V single ended). This utilizes the amplifiers
output swing as well as the ADC's input dynamic range, and allows for some overload range.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
VOUT (V)
DIFFERENTIAL INPUT (mV)
C001
24
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LMP2021 LMP2022
Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated
Typical Application (continued)
Bridge sensor measurements are usually done up to 10s of Hz. Placing a 300 Hz filter on the LMP2022 helps
removing the higher frequency noise from this circuit. This filter is created by placing two capacitors in the
feedback path of the LMP2022 amplifiers.
This amplified signal is then fed into the ADC161S626. The ADC161S626 is a 16-bit, 50 kSPS to 250 kSPS 5V
ADC. In order to utilize the maximum number of bits of the ADC161S626 in this configuration, a 2.5V reference
voltage is used. This 2.5V reference is also used to power the bridge sensor and the inverting input of the ADC.
Using the same voltage source for these three points helps reducing the total system error by eliminating error
due to source variations.
With this system, the output signal of the bridge sensor which can be up to ±13.3 mV and is accurately scaled to
the full scale range of the ADC and then digitized for further processing. The LMP202x introduced minimal error
to the system and improved the signal quality by removing common mode signals and high frequency noise.
8.2.3 Application Curve
Figure 47. Single Ended Output Results for Bridge Circuit
9 Power Supply Recommendations
The LMP202x is specified for operation from 2.2 V to 5.5 V (±1.1 V to ±2.75 V) over a –40°C to +125°C
temperature range. Parameters that can exhibit significant variance with regard to operating voltage or
temperature are presented in the Typical Characteristics.
CAUTION
Supply voltages larger than 6 V can permanently damage the device.
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole and op amp itself.
Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to
the analog circuitry.
• Connect low-ESR, 0.1-μF ceramic bypass capacitors between each supply pin and ground, placed as close
to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply
applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
N/C
±IN
+IN
V±
V+
OUTPUT
N/C
N/C
VS+
GND
VS±
GND Ground (GND) plane on another layer
VOUT
VIN
GND
Run the input traces
as far away from
the supply lines
as possible
Use low-ESR, ceramic
bypass capacitor
RF
RG
Place components
close to device and to
each other to reduce
parasitic errors
+
VIN VOUT
RG
RF
(Schematic Representation)
Use low-ESR,
ceramic bypass
capacitor
25
LMP2021
,
LMP2022
www.ti.com
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
Product Folder Links: LMP2021 LMP2022
Submit Documentation FeedbackCopyright © 2008–2016, Texas Instruments Incorporated
Layout Guidelines (continued)
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes.
A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital
and analog grounds paying attention to the flow of the ground current. For more detailed information refer to
SLOA089,Circuit Board Layout Techniques.
• In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular
as opposed to in parallel with the noisy trace.
• Place the external components as close to the device as possible. As shown in Typical Characteristics,
keeping RF and RG close to the inverting input minimizes parasitic capacitance.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce
leakage currents from nearby traces that are at different potentials.
10.2 Layout Example
Figure 48. Operational Amplifier Board Layout for Noninverting Configuration
26
LMP2021
,
LMP2022
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: LMP2021 LMP2022
Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
LMP2021/22 PSPICE Model, SNOM100
TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti
TI Filterpro Software, http://www.ti.com/tool/filterpro
DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm
TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm
Manual for LMH730268 Evaluation board 551012922-001
11.2 Documentation Support
11.2.1 Related Documentation
SBOA015 (AB-028) — Feedback Plots Define Op Amp AC Performance.
SLOA089 — Circuit Board Layout Techniques.
SLOD006 — Op Amps for Everyone.
SNOA497 — AN-1698 A Specification for EMI Hardened Operational Amplifiers.
SBOA128 — EMI Rejection Ratio of Operational Amplifiers.
TIPD128 — Capacitive Load Drive Solution using an Isolation Resistor.
SBOA092 -— Handbook of Operational Amplifier Applications.
11.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LMP2021 Click here Click here Click here Click here Click here
LMP2022 Click here Click here Click here Click here Click here
11.4 Trademarks
LMP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
27
LMP2021
,
LMP2022
www.ti.com
SNOSAY9G –SEPTEMBER 2008–REVISED FEBRUARY 2016
Product Folder Links: LMP2021 LMP2022
Submit Documentation FeedbackCopyright © 2008–2016, Texas Instruments Incorporated
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMP2021MA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LMP20
21MA
LMP2021MAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LMP20
21MA
LMP2021MF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AF5A
LMP2021MFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AF5A
LMP2021MFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AF5A
LMP2022MA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LMP20
22MA
LMP2022MAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 LMP20
22MA
LMP2022MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AV5A
LMP2022MME/NOPB ACTIVE VSSOP DGK 8 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AV5A
LMP2022MMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 AV5A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMP2021MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMP2021MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMP2021MFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMP2021MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMP2022MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMP2022MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMP2022MME/NOPB VSSOP DGK 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMP2022MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Aug-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMP2021MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP2021MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMP2021MFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0
LMP2021MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMP2022MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP2022MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP2022MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP2022MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Aug-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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