(0,80 mm) .0315"
BTE, BSE SERIES
BTE–040–02–L–D–A BTE–060–02–F–D–A
BSE–020–01–F–D–A
WWW.SAMTEC.COM
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?BTE or
www.samtec.com?BSE
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
2A/Contact @ 80°C ambient
with 5 mm Stack Height
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC with
5 mm Stack Height
Max Cycles: 100
RoHS Compliant: Ye s
Processing:
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-080)
(0,15 mm) .006" max (100-120)
Board Stacking:
For applications requiring more
than two connectors per board
or 80 positions or higher,
contact ipg@samtec.com
Mates with:
BTE
BSE NO. OF POSITIONS
PER ROW D
PLATING
OPTION
–020, –040, –060,
–080, –100, –120
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal Pins in
contact area, 10µ" (0,25 µm) min Au over
50µ" (1,27 µm) Ni on Ground Plane in
contact area, Matte Tin over
50µ" (1,27 µm) min Ni on all solder tails
OTHER
OPTION
A
–K
= (7,00 mm)
.275" DIA
Polyimide
Film Pick
& Place Pad
–TR
= Tape & Reel
(60 positions
maximum)
01
Mates with:
BSE
MATED HEIGHT
APPLICATION
SPECIFIC
• 30µ" (0,76 µm) Gold
• Edge Mount Capability
• Friction Lock option
• 11 mm, 14 mm, 16,10 mm,
19,10 mm, 22 mm,
25 mm and 30 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifi cations.)
Call Samtec.
BTE NO. OF POSITIONS
PER ROW D
PLATING
OPTION
–020, –040, –060,
–080, –100, –120
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
A
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal Pins
in contact area, 10µ" (0,25 µm) min
Au over 50µ" (1,27 µm) Ni on
Ground Plane in contact area,
Matte Tin over 50µ" (1,27 µm) min
Ni on all solder tails
No. of positions x (0,80) .0315
+ (4,00) .1575
(0,20)
.008
(5,97)
.235
(0,80) .0315
A
(3,94)
.155
01
02
(0,89)
.035
DIA
(7,11)
.280
(0,76)
.030
LEAD
STYLE A
(4,27)
.168
(7,21)
.284
–01
–02
–TR
= Tape & Reel
(80 positions
maximum)
No. of positions x (0,80) .0315
+ (5,27) .2075
(6,22)
.245 (7,24)
.285
(3,81)
.150
(0,80) .0315
02
01
(0,15)
.006
(3,05)
.120
(0,76)
.030
(7,49)
.295
(1,78)
.070
(3,25)
.128
(0,89)
.035
DIA
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
SPECIFICATIONS
BASIC BLADE & BEAM HEADER & SOCKET
–01
–02
(5,00) .197
(8,00) .315
LEAD
STYLE MATED
HEIGHT*
*Processing conditions will
affect mated height.
• Passes
10 year MFG
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
TM
Call Samtec for maximum cycles
F-213
