1
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Diodes)
Revision: July 17, 2013
SP3006 Series
SP3006 Series
Low Capacitance ESD Protection - SP3006 Series
Description
Features
Applications
The SP3006 Series includes ultra low capacitance back to-
back zener diodes to protect high-speed ports of electronic
equipment that may experience destructive electrostatic
discharges (ESD). The robust diode can safely absorb
repetitive ESD strikes at the maximum level specified in
the IEC 61000-4-2 international standard (Level 4, ±8kV
contact discharge) without performance degradation. Its
very low loading capacitance makes it ideal for protecting
high-speed data lines such as USB2.0, USB3.0, HDMI, and
IEEE 1394.
• ESD protection of ±8kV
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• EFT protection,
IEC61000-4-4, 40A
(5/50ns)
• Lightning Protection,
IEC61000-4-5, 2.0A
(8/20µs)
• Low capacitance of 0.5pF
(@ VR=0V)
• Low leakage current of
0.5μA (MAX) at 5V
• Miniature SOT563
package (1.6x1.6x0.5mm)
saves board space
• Game Consoles
• LCD/ PDP TVs
• DVD Players
• Desktops
• MP3/ PMP
• Digital Cameras
• Set Top Boxes
• Smart Phones
• Notebooks
• Computer Peripherals
Pinout and Functional Block Diagram
654
123
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Example
USB Controller
USB Port
IC
NC
NC
GND
SP3006
D+
D-
SP3006 Series 0.5pF, 8kV Diode Array
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
2
TVS Diode Arrays (SPA® Diodes)
Revision: July 17, 2013
SP3006 Series
Low Capacitance ESD Protection - SP3006 Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 2.0 A
TOP Operating Temperature -40 to 125 °C
TSTOR Storage Temperature -55 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Breakdown Voltage VBR IR=5mA 9.0 V
Reverse Standoff Voltage VRWM IR ≤ 1µA 6 V
Reverse Leakage Current ILEAK VR=5V 0.5 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 12.5 V
IPP=2A, tp=8/20µs, Fwd 15.0 V
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±8 kV
IEC61000-4-2 (Air) ±15 kV
Diode Capacitance 1CI/O-I/O Reverse Bias=0V 0.5 pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Reverse Voltage
0.0
1.0
0.2
0.4
0.6
0.8
1.2
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC Bias (V)
Capacitance (pF)
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of IPP
3
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
TVS Diode Arrays (SPA® Diodes)
Revision: July 17, 2013
SP3006 Series
SP3006 Series
Low Capacitance ESD Protection - SP3006 Series
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute
Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Part Numbering System
SP3006 TG
Series
Number of Channels
02 = 2 channel
Package
X = SOT563
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
02 X
Part Marking System
1*
Product Series
1=SP3006 series
Assembly Site
(varies)
Number of Channels
(varies)
1 * 2
2
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3006-02XTG SOT563 1*23000
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
4
TVS Diode Arrays (SPA® Diodes)
Revision: July 17, 2013
SP3006 Series
Low Capacitance ESD Protection - SP3006 Series
Embossed Carrier Tape & Reel Specifications — SOT563
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.064 0.073
F3.45 3.55 0.135 0.139
P2 1.95 2.05 0.076 0.081
D1.40 1.60 0.055 0.063
D1 0.45 0.55 0.017 0.021
P0 3.90 4.10 0.154 0.161
10P0 40.0+/- 0.20 1.574+/-0.008
W7.70 8.10 0.303 0.318
P3.90 4.10 0.153 0.161
A0 1.73 1.83 0.068 0.072
B0 1.73 1.83 0.068 0.072
K0 0.64 0.74 0.025 0.029
t0.22 max 0.009 max
User Feeding Direction
Pin 1 Location
Package Dimensions — SOT563
Package SOT 563
Pins 6
Millimeters Inches
Min Max Min Max
A0.50 0.60 0.020 0.024
B0.17 0.27 0.007 0.011
c0.08 0.18 0.003 0.007
D1.50 1.70 0.059 0.067
E1. 10 1.30 0.043 0.051
e0.50 BSC 0.020 BSC
L0.10 0.30 0.004 0.012
HE 1.50 1.70 0.059 0.067
c
HE
L
A
D
E
e
B
Recommended
Solder Pad Layout
