Approval sheet
High Q / Low ESR Series (HH)
Page 1 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
*Contents in this sheet are subject to change without prior notice.
MULTILAYER CERAMIC CAPACITORS
High Q / Low ESR Series (HH)
0402, 0603 & 0805 Sizes
NP0 Dielectric
RoHS Compliance
Approval sheet
High Q / Low ESR Series (HH)
Page 2 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
WTC HH series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,
typical within the ±30ppm/°C required for NP0 (C0G) classification and have excellent conductivity internal electrode.
Thus, WTC HH series MLCC will be with the feature of low ESR and high Q characteristics.
4. HOW TO ORDER
HH 15 N 100 G 500 C T
Series
HH=High Q/
Low ESR
Size
15=0402 (1005)
18=0603 (1608)
21=0805 (2012)
Dielectric
N=NP0
(C0G)
Capacitance
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
eg.:
R47=0.47pF
0R5=0.5pF
1R0=1.0pF
100=10x10
0
=10pF
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
Rated voltage
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
160=16 VDC
250=25 VDC
500=50 VDC
101=100 VDC
201=200 VDC
251=250 VDC
501=500 VDC
631=630 VDC
Termination
L=Ag/Ni/Sn
C=Cu/Ni/Sn
Packaging
T=7” reeled
G=13” reeled
2. FEATURES
a. High Q and low ESR performance at high frequency.
b. Quality improvement of telephone calls for low
power loss and better performance.
3. APPLICATIONS
a. Mobile telecommunication: Mobile phone, WLAN.
b. RF module: Power amplifier, VCO.
c. Tuners.
Approval sheet
High Q / Low ESR Series (HH)
Page 3 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Dielectric NP0
Size 0402, 0603, 0805
Capacitance* 0402: 0.5pF to 470pF**
0603: 0.5pF to 3300pF
0805: 0.5pF to 390pF
Capacitance tolerance Cap≤5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC) 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V
Q* Cap<30pF: Q≥400+20C
Cap≥30pF: Q≥1000
Insulation resistance at Ur ≥10GΩ or RxC≥100Ω-F whichever is smaller.
Operating temperature -55 to +125°C
Capacitance change ±30ppm
Termination Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temperature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
** 0402, Capacitance <0.5pF: On request.
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Size
Inch (mm)
L (mm) W (mm) T (mm)/Symbol
Remark
M
B
(mm)
0402 (1005)
1.00±0.05
0.50±0.05 0.50±0.05
N
# 0.25
+0.05/-0.10
1.60±0.10
0.80±0.10 0.80±0.07
S
0603 (1608)
1.60
+0.15/-0.10
0.80
+0.15/-0.10
0.80
+0.15/-0.10
X
0.40±0.15
0.60±0.10
A
0.80±0.10
B
0805 (2012)
2.00±0.15
1.25±0.10
1.25±0.10
D
#
0.50±0.20
# Reflow soldering only is recommended.
Approval sheet
High Q / Low ESR Series (HH)
Page 4 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
7. CAPACITANCE RANGE
DIELECTRIC NP0
SIZE 0402 0603 0805
Rated Voltage 16 25 50 16 25 50 100
50 100
200
250
500
630
0.5pF (0R5)
N^
N^
N^
S^
S^ S^ S^ B B
0.6pF (0R6)
N^
N^
N^
S^
S^ S^ S^ B B
0.7pF (0R7)
N^
N^
N^
S^
S^ S^ S^ B B
0.8pF (0R8)
N^
N^
N^
S^
S^ S^ S^ B B
0.9pF (0R9)
N^
N^
N^
S^
S^ S^ S^ B B
1.0pF (1R0)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
1.2pF (1R2)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
1.5pF (1R5)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
1.8pF (1R8)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
2.2pF (2R2)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
2.7pF (2R7)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
3.3pF (3R3)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
3.9pF (3R9)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
4.7pF (4R7)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
5.6pF (5R6)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
6.8pF (6R8)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
8.2pF (8R2)
N^
N^
N^
S^
S^ S^ S^ B B B B B B
10pF (100)
N N N S S S S B B B B B B
12pF (120)
N N N S S S S B B B B B B
15pF (150)
N N N S S S S B B B B B B
18pF (180)
N N N S S S S B B B B B B
22pF (220)
N N N S S S S B B B B B B
27pF (270)
N N N S S S S B B B B B B
33pF (330)
N N N S S S S B B B B B B
39pF (390)
N N N S S S S B B B B B B
47pF (470)
N N N S S S S B B B B B B
56pF (560)
N N N S S S S B B B B B B
68pF (680)
N N N S S S S B B B B B B
82pF (820)
N N N S S S S B B B B B B
100pF (101)
N N N S S S S B B B B B B
120pF (121)
N N N S S S S D D D D D D
150pF (151)
N N N S S S S D D D D D D
180pF (181)
N N N S S S S D D D D
220pF (221)
N N N S S S S D D D D
270pF (271)
N N N S S S S D D D D
330pF (331)
N N N S S S S D D D D
390pF (391)
N N N S S S S D D D D
470pF (471)
N N N S S S S
560pF (561)
S S S S
680pF (681)
S S S S
820pF (821)
S S S S
1,000pF (102)
S S S S
1,200pF (122)
X X X
1,500pF (152)
X X X
1,800pF (182)
X X X
2,200pF (222)
X X X
2,700pF (272)
X X X
Capacitance
3,300pF (332)
X X X
1. The letter in cell is expressed the symbol of product thickness.
2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.
3. 0402, Capacitance <0.5pF: On request.
4. For more information about products with special capacitance or other data, please contact WTC local representative.
Approval sheet
High Q / Low ESR Series (HH)
Page 5 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
8. PACKAGING DIMENSION AND QUANTITY
Paper tape Plastic tape
Size Thickness (mm)/Symbol 7” reel 13” reel 7” reel 13” reel
0402 0.50±0.05 N 10K 50K
0.80±0.07 S
0603 0.80 +0.15/-0.10 X 4K 15K
0.60±0.10 A
0.80±0.10 B 4k 15k
0805
1.25±0.10 D 3k 10k
Unit: pieces
9. ELECTRICAL CHARACTERISTICS
◙ Q factor specification vs. Specific frequency
◙ Q factor specification vs. Specific frequency
Q value criteria vs. Specific frequency
HH series, 0402
1
10
100
1000
10000
0.1 1 10 100
Capacitance (pF)
Q
Minimum (Solid line)
Typical (Broken line)
1GHz
500MHz
100MHz
Fig. 2 Q factor specification vs. Specific frequency for 0402
Q value criteria vs. Specific frequency
HH series, 0603
1
10
100
1000
10000
0.1 1 10 100
Capacitance (pF)
Q
Minimum (Solid line)
Typical (Broken line)
1GHz 500MHz
100MHz
Fig. 3 Q factor specification vs. Specific frequency for 0603
Approval sheet
High Q / Low ESR Series (HH)
Page 6 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
◙ Typical ESR vs. Frequency
◙ Typical Impedance vs. Frequency
◙ SRF vs. Capacitance
0402 "HH" Series
0.01
0.1
1
10
100 1,000 10,000
Frequency (MHz)
ESR (ohm)
100pF
1.0pF
4.7pF
10pF
Fig. 4 ESR vs. Frequency 0402
0603 "HH" Series
0.01
0.1
1
10
100 1,000 10,000
Frequency (MHz)
ESR (ohm)
100pF
1.0pF
4.7pF
10pF
Fig. 5 ESR vs. Frequency 0603
0402 "HH" Series
0.1
1
10
100
1000
10000
100000
10 100 1,000 10,000
Frequency (MHz)
|Z| (ohm)
1.0pF
4.7pF
10pF
100pF
Fig. 6 Impedance vs. Frequency 0402
0603 "HH" Series
0.1
1
10
100
1000
10000
100000
10 100 1,000 10,000
Frequency (MHz)
|Z| (ohm)
1.0pF
4.7pF
10pF
100pF
Fig. 7 Impedance vs. Frequency 0603
100
1000
10000
1 10 100
Capacitance (pF)
Series Reasonant Frequency (MHz)
0603
0402
Fig. 8 SRF vs. Capacitance
Approval sheet
High Q / Low ESR Series (HH)
Page 7 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Conditions Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
At 25°C ambient temperature. * NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
* To apply voltage: ( ≤100V ) 250% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
4.
Dielectric
Strength
* To apply voltage:
200V~300V ≥2 times VDC
500V~999V ≥1.5 times VDC
* Cut-off, set at 10mA
* TEST= 15 sec.
* RAMP=0
* No evidence of damage or flash over during test.
Rated voltage:<200V
To apply rated voltage for max. 120 sec.
≥10GΩ
5.
Insulation
Resistance
Rated voltage:200~630V
To apply rated voltage (500V max.) for 60 sec.
≥10GΩ or RxC≥100Ω-F whichever is smaller
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Capacitance change: within ±30ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force：
5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
Approval sheet
High Q / Low ESR Series (HH)
Page 8 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
No.
Item Test Condition Requirements
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3
30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change
：within ±2.5％ or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
13.
Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
*Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
* I.R.: ≥1GΩor RxC≥50Ω-F whichever is smaller.
14.
Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltage：rated voltage (Max. 500V)
* Before initial measurement (Class II only): To apply test
voltage for 1hr at 40°C and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥200; Cap<30pF, Q≥100+10/3C
* I.R.: ≥500MΩ or RxC≥25Ω-F whichever is smaller.
15.
High
Temperature
Load
(Endurance)
* Test temp.:
NP0: 125±3°C
* To apply voltage:
(1) <500V: 200% of rated voltage.
(2) 500V: 150% of rated voltage.
(3) ≥630V: 120% of rated voltage.
* Test time: 1000+24/-0 hrs.
*Before initial measurement (Class II only): To apply test
voltage for 1hr at test temp. and then set for 24±2 hrs at room
temp.
*Measurement to be made after keeping at room temp. for
24±2 hrs
* No remarkable damage.
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥350
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF, Q≥200+10C
* I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.
Approval sheet
High Q / Low ESR Series (HH)
Page 9 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
APPENDIXES
◙ Tape & reel dimensions
Size 0402 0603 0805
Thickness N S, X A B C, D, I
A
0
0.62±0.05 1.02±0.05 1.50±0.10 1.50±0.10 <1.57
B
0
1.12±0.05 1.80±0.05 2.30±0.10 2.30±0.10 <2.40
T 0.60±0.05 0.95±0.05 0.75±0.05 0.95±0.05 0.23±0.05
K
0
- - - - <2.50
W 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10
P
0
4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10
10xP
0
40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10 40.0±0.10
P
1
2.00±0.05 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10
P
2
2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05
D
0
1.55±0.05 1.55±0.05 1.55±0.05 1.55±0.05 1.50±0.05
D
1
- - - - 1.00±0.10
E 1.75±0.05 1.75±0.05 1.75±0.05 1.75±0.05 1.75±0.10
F 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05
Fig. 10 The dimension of plastic tape
Fig. 9 The dimension of paper tape
Fig. 11 The dimension of reel
Size 0402, 0603, 0805
Reel size
7” 10” 13”
C 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0
A 178.0±0.10 250.0±1.0 330.0±1.0
N 60.0+1.0/-0 100.0±1.0 100±1.0
Approval sheet
High Q / Low ESR Series (HH)
Page 10 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
◙ Description of customer label
◙ Constructions
◙ Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
.
Fig. 12 The construction of MLCC
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
No.
Name NP0* NP0
1
Ceramic material CaZrO
3
/ BaTiO
3
based
2
Inner electrode AgPd alloy Ni
3
Inner layer Ag Cu
4
Middle layer Ni
5
Termination
Outer layer Sn
* Partial NP0 items are with Ag/Ni/Sn(NME) terminations, please ref to product
range for detail.
Approval sheet
High Q / Low ESR Series (HH)
Page 11 of 11 ASC_ HQ_Low ESR_(HH)_006O_AS Oct. 2012
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N
2
within oven are recommended.
Fig. 13 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
Fig. 14 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
