BYW81-200CFSY1 - STMicroelectronics, Inc.

November 2010 Doc ID 17735 Rev 1 1/9

BYW81HR

Aerospace 1 x 15 A and 2 x 15 A - 200 V fast recovery rectifier

Features

■Very small conduction losses

■Negligible switching losses

■High surge current capability

■High avalanche energy capability

■Hermetic packages

■Target radiation qualification:

– 150 krad (Si) low dose rate

– 1 Mrad high dose rate

■ESCC qualified

Description

Packaged in hermetic TO-254 or SMD.5, this

device is intended for use in medium voltage, high

frequency switching mode power supplies, high

frequency DC to DC converters, and other

aerospace applications.

The complete ESCC specification for this device

is available from the European Space Agency

web site. ST guarantees full compliance of

qualified parts with such ESCC detailed

specifications.

Figure 1. Device configurations

TO-254 SMD.5

Variant 03

BYW81-200CFSY1

Variant 05

BYW81-200SHRB

Terminal 1:

Terminal 2:

Terminal 3:

The case is not connected to any lead

Terminal 1:

Terminal 2:

Terminal 3:

The lid is not connected to any terminal

Anode a

Common cathode

Anode b

Anode

Cathode

Table 1. Device summary(1)

1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions.

Order code ESCC part

number Quality level EPPL Package IF(AV) V

RRM VF (max) T

j(max)

BYW81-200CFSY1 - Engineering

model - TO-254 2 x 15 A

200 V 1.15 V 150 °C

BYW81-200CFSYHRB 5103/029/03 ESCC flight - TO-254 2 x 15 A

BYW81-200SHRB 5103/029/05 ESCC flight Y SMD.5 15 A

www.st.com

Characteristics BYW81HR

2/9 Doc ID 17735 Rev 1

1 Characteristics

Table 2. Absolute maximum ratings

Symbol Characteristic Value Unit

IFSM

Forward surge current (1) (2)

Variant 05

Variant 03 (per diode)

Variant 03 (per device)

1. Sinusoidal pulse of 10 ms duration

2. For variant 03 the “per device” ratings apply only when both cathode terminals are tied together.

250

500

VRRM Repetitive peak reverse voltage(3)

3. Pulsed, duration 5 ms, F = 50 Hz

200 V

Average output rectified current (50% duty cycle)(2)(4)

Variant 05

Variant 03 (per diode)

Variant 03 (per device)

4. For Tcase ≥ +110°C, derate linearly to 0 A at +150°C.

IF(RMS)

Forward rms current (per diode)(2)

Variant 05

Variant 03 (per diode)

Variant 03 (per device)

TOP Operating case temperature range(5)

5. For devices with hot solder dip lead finish all testing performed at Tamb > +125 °C are carried out in a 100%

inert atmosphere.

-55 to +150 °C

TJJunction temperature +150 °C

TSTG Storage temperature range(5) -55 to +150 °C

TSOL

Soldering temperature

TO-254(6)

SMD.5(7)

6. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same

lead shall not be resoldered until 3 minutes have elapsed.

7. Duration 5 seconds maximum the same package shall not be resoldered until 3 minutes have elapsed.

+260

+245

°C

Table 3. Thermal resistance

Symbol Parameter Value Unit

Rth (j-c) (1)

1. Package mounted on infinite heatsink.

Junction to case

All variants (per diode)

Variant 03 (per device)(2)

2. For variant 03 the “per device” ratings apply only when both cathode terminals are tied together.

2.3

1.4

°C/W

BYW81HR Characteristics

Doc ID 17735 Rev 1 3/9

Table 4. Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C

Symbol Characteristic MIL-STD-750

test method Test conditions

Limits

Units

Min. Max.

IRReverse current 4016 DC method, VR = 200 V - 20 µA

VF1(1)

Forward voltage 4011 Pulse method, IF = 10 A - 1.0 V

VF2(1) Pulse method, IF = 20 A - 1.2 V

VBR Breakdown voltage 4021 IR = 100 µA 200 - V

CCapacitance 4001 VR = 10 V, F = 1 MHz - 220 pF

trr Reverse recovery time 4031 IF = 1 A, VR = 30 V,

dIF/dt = -50 A/µs -40ns

Zth(j-c)(2) Relative thermal impedance,

junction to case 3101 IH = 15 to 40 A, tH = 50 ms

IM = 50 mA, tmd = 100 µs Calculate ΔVF(3) °C/W

1. Pulse width ≤ 300µs, duty cycle ≤ 2%

2. Performed only during screening tests parameter drift values (initial measurements), go-no-go.

3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and

shall guarantee the Rth(j-c) limits specified in maximum ratings.

Table 5. Electrical measurements at high and low temperatures (per diode)

Symbol Characteristic MIL-STD-750

test method Test conditions(1) Limits

Units

Min. Max.

IRReverse current 4016 Tcase = +125 (+0, -5) °C

DC method, VR = 200 V -10mA

VF1(2) Forward voltage 4011

Tcase = +125 (+0, -5) °C

pulse method, IF = 10 A -0.85V

Tcase = +55 (+0, -5) °C

pulse method, IF = 10 A -1.15V

1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a

100% inspection may be performed.

2. Pulse width ≤ 300µs, duty cycle ≤ 2%

Package information BYW81HR

4/9 Doc ID 17735 Rev 1

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 2. Metal flange mount package (TO-254(a)) 3 lead, dimension definitions

a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections

ØF

ØI

ØM

123

BYW81HR Package information

Doc ID 17735 Rev 1 5/9

Table 6. Metal flange mount package (TO-254) 3-lead, dimension values

Reference

Dimension in millimetres Dimlension in inches

Min. Max. Min. Max.

A 13.59 13.84 0.535 0.545

B 13.59 13.84 0.535 0.545

C 20.07 20.32 0.790 0.800

D 6.3 6.7 0.248 0.264

E 1 3.9 0.039 0.154

ØF 3.5 3.9 0.138 0.154

G 16.89 17.4 0.665 0.685

H 6.86 BSC 0.270 BSC

ØI(1)

1. 3 locations

0.89 1.14 0.035 0.045

J 3.81 BSC 0.150 BSC

K 3.81 BSC 0.150 BSC

L 12.95 14.5 0.510 0.571

ØM 3.05 Typ. 0.120 Typ.

N - 0.71 - 0.028

R1(2)

2. Radius of heatsink flange corner - 4 locations

- 1 - 0.039

R2(3)

3. Radius of body corner - 4 locations

1.65 Typ. 0.065

Package information BYW81HR

6/9 Doc ID 17735 Rev 1

Figure 3. Surface mount package (SMD.5) 3-terminal, dimension definitions

Table 7. Surface mount package (SMD.5) 3-terminal, dimension values

Reference

Dimension in millimetres Dimlension in inches

Min. Max. Min. Max.

A 2.84 3.15 0.112 0.124

A1 0.25 0.51 0.010 0.20

b 7.13 7.39 0.281 0.291

b1 5.58 5.84 0.220 0.230

b2(1)

1. 2 locations

2.28 2.54 0.090 0.100

b3(1) 2.92 3.18 0.115 0.125

D 10.03 10.28 0.395 0.405

D1(1) 0.76 - 0.030 -

E 7.39 7.64 0.291 0.301

e(1) 1.91 BSC 0.075

AA1

b3 D1

BYW81HR Ordering information

Doc ID 17735 Rev 1 7/9

3 Ordering information

Table 8. Ordering information(1)

Order code ESCC part

number

Quality

level EPPL Package Lead

finish Marking Mass Packing

BYW81-200CFSY1 - Engineering

model - TO-254 Gold BYW81200CFSY1

+ BeO 10 g Strip

pack

BYW81-

200FSYHRB 5103/029/03 ESCC flight - TO-254 Solder

dip 510302901 + BeO

BYW81-200SHRB 5103/029/05 ESCC flight Y SMD.5 Gold 510302905 2.0 g

1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions.

Revision history BYW81HR

8/9 Doc ID 17735 Rev 1

4 Revision history

Table 9. Document revision history

Date Revision Changes

03-Nov-2010 1 First issue.

BYW81HR

Doc ID 17735 Rev 1 9/9

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